EP4789518A2 - Verfahren zum kontrollierten abplatzen von materialien mit hoher bruchzähigkeit - Google Patents

Verfahren zum kontrollierten abplatzen von materialien mit hoher bruchzähigkeit

Info

Publication number
EP4789518A2
EP4789518A2 EP24954582.3A EP24954582A EP4789518A2 EP 4789518 A2 EP4789518 A2 EP 4789518A2 EP 24954582 A EP24954582 A EP 24954582A EP 4789518 A2 EP4789518 A2 EP 4789518A2
Authority
EP
European Patent Office
Prior art keywords
substrate
seed layer
spalled
spalling
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP24954582.3A
Other languages
English (en)
French (fr)
Inventor
Connor P. HORN
Supratik Guha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Chicago
Original Assignee
University of Chicago
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Chicago filed Critical University of Chicago
Publication of EP4789518A2 publication Critical patent/EP4789518A2/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/06—Joining of crystals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP24954582.3A 2023-10-04 2024-10-04 Verfahren zum kontrollierten abplatzen von materialien mit hoher bruchzähigkeit Pending EP4789518A2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202363587886P 2023-10-04 2023-10-04
US202463556965P 2024-02-23 2024-02-23
PCT/US2024/050097 WO2026080057A2 (en) 2023-10-04 2024-10-04 Method for controlled spalling of high fracture toughness materials

Publications (1)

Publication Number Publication Date
EP4789518A2 true EP4789518A2 (de) 2026-08-12

Family

ID=99439965

Family Applications (1)

Application Number Title Priority Date Filing Date
EP24954582.3A Pending EP4789518A2 (de) 2023-10-04 2024-10-04 Verfahren zum kontrollierten abplatzen von materialien mit hoher bruchzähigkeit

Country Status (2)

Country Link
EP (1) EP4789518A2 (de)
WO (1) WO2026080057A2 (de)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009524523A (ja) * 2006-01-25 2009-07-02 フラオンホファー−ゲゼルシャフト・ツア・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファオ 基板を精密加工するための方法および装置ならびにその使用
US20100302218A1 (en) * 2009-05-29 2010-12-02 Qualcomm Mems Technologies, Inc. Illumination devices and methods of fabrication thereof
US20130316538A1 (en) * 2012-05-23 2013-11-28 International Business Machines Corporation Surface morphology generation and transfer by spalling
US8709957B2 (en) * 2012-05-25 2014-04-29 International Business Machines Corporation Spalling utilizing stressor layer portions
US8916450B2 (en) * 2012-08-02 2014-12-23 International Business Machines Corporation Method for improving quality of spalled material layers
US9502278B2 (en) * 2013-04-22 2016-11-22 International Business Machines Corporation Substrate holder assembly for controlled layer transfer
US9406564B2 (en) * 2013-11-21 2016-08-02 Infineon Technologies Ag Singulation through a masking structure surrounding expitaxial regions
US9653554B2 (en) * 2014-07-21 2017-05-16 Soraa, Inc. Reusable nitride wafer, method of making, and use thereof
WO2016205722A1 (en) * 2015-06-17 2016-12-22 Stc.Unm Metal matrix composites for contacts on solar cells
US9455179B1 (en) * 2015-07-09 2016-09-27 International Business Machines Corporation Methods to reduce debonding forces on flexible semiconductor films disposed on vapor-releasing adhesives

Also Published As

Publication number Publication date
WO2026080057A2 (en) 2026-04-16
WO2026080057A3 (en) 2026-05-21

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