EP4463430A1 - Sonnenschutzverglasung und/oder verglasung mit geringer emissivität - Google Patents
Sonnenschutzverglasung und/oder verglasung mit geringer emissivitätInfo
- Publication number
- EP4463430A1 EP4463430A1 EP23703630.6A EP23703630A EP4463430A1 EP 4463430 A1 EP4463430 A1 EP 4463430A1 EP 23703630 A EP23703630 A EP 23703630A EP 4463430 A1 EP4463430 A1 EP 4463430A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- layers
- zinc
- functional
- titanium oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims abstract description 531
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 105
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 104
- 239000011701 zinc Substances 0.000 claims abstract description 97
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 93
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 88
- 238000000576 coating method Methods 0.000 claims abstract description 83
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 69
- 229910052709 silver Inorganic materials 0.000 claims abstract description 69
- 239000004332 silver Substances 0.000 claims abstract description 69
- 239000011248 coating agent Substances 0.000 claims abstract description 59
- 239000002346 layers by function Substances 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 125
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 65
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 65
- 239000011787 zinc oxide Substances 0.000 claims description 58
- 229910052718 tin Inorganic materials 0.000 claims description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 44
- 229910052726 zirconium Inorganic materials 0.000 claims description 41
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 39
- 229910052710 silicon Inorganic materials 0.000 claims description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 38
- 239000010703 silicon Substances 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 17
- 238000010791 quenching Methods 0.000 claims description 11
- 230000000171 quenching effect Effects 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 238000000137 annealing Methods 0.000 claims description 8
- 238000004151 rapid thermal annealing Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 61
- 229910052760 oxygen Inorganic materials 0.000 description 61
- 239000001301 oxygen Substances 0.000 description 61
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 44
- 239000011135 tin Substances 0.000 description 41
- 238000000151 deposition Methods 0.000 description 32
- 230000008021 deposition Effects 0.000 description 31
- 229910052757 nitrogen Inorganic materials 0.000 description 22
- 230000009102 absorption Effects 0.000 description 18
- 238000010521 absorption reaction Methods 0.000 description 18
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 13
- 239000010936 titanium Substances 0.000 description 13
- 230000001590 oxidative effect Effects 0.000 description 12
- 229910052719 titanium Inorganic materials 0.000 description 12
- 229910003087 TiOx Inorganic materials 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 9
- 229910001887 tin oxide Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 8
- 238000006731 degradation reaction Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 230000000087 stabilizing effect Effects 0.000 description 7
- -1 Al2O3 Chemical compound 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910001297 Zn alloy Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 229910052756 noble gas Inorganic materials 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000004571 lime Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 150000002835 noble gases Chemical class 0.000 description 2
- 229920009441 perflouroethylene propylene Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003751 zinc Chemical class 0.000 description 2
- CHJAYYWUZLWNSQ-UHFFFAOYSA-N 1-chloro-1,2,2-trifluoroethene;ethene Chemical group C=C.FC(F)=C(F)Cl CHJAYYWUZLWNSQ-UHFFFAOYSA-N 0.000 description 1
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 1
- 229910017105 AlOxNy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002578 polythiourethane polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3652—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the coating stack containing at least one sacrificial layer to protect the metal from oxidation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3657—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having optical properties
- C03C17/366—Low-emissivity or solar control coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3681—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating being used in glazing, e.g. windows or windscreens
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3694—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer one layer having a composition gradient through its thickness
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/90—Other aspects of coatings
- C03C2217/91—Coatings containing at least one layer having a composition gradient through its thickness
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/322—Oxidation
Definitions
- the invention relates to a material comprising a transparent substrate coated with a functional coating capable of acting on solar radiation and/or infrared radiation.
- the invention also relates to glazing comprising these materials as well as the use of such materials for manufacturing thermal insulation and/or solar protection glazing.
- functional qualifying “functional coating” means “capable of acting on solar radiation and/or infrared radiation”.
- glazings can be intended both to equip buildings and vehicles, in particular with a view to:
- the silver-based functional metal layers have advantageous properties of electrical conduction and reflection of infrared radiation (IR), hence their use in so-called “solar control” glazing aimed at reducing the amount of incoming solar energy and/or in so-called “low-emission” glazing aimed at reducing the amount of energy dissipated outwards from a building or vehicle.
- IR infrared radiation
- dielectric coatings are deposited between coatings based on dielectric materials generally comprising several dielectric layers (hereinafter “dielectric coatings”) making it possible to adjust the optical properties of the stack. These dielectric layers also make it possible to protect the silver layer from chemical or mechanical attack.
- the aim is to reduce the solar factor and increase light transmission and selectivity.
- we seek to develop low-emissivity glazing we seek to reduce emissivity and increase the solar factor. In all cases, the aim is to minimize heat loss.
- Emissivity and resistivity (or resistance) per square vary proportionately. Therefore, it is often possible to assess the emissivity of a material by evaluating its resistance per square.
- the solar factor of the glazing "FS or g" corresponds to the ratio in % between the total energy entering the room through the glazing and the incident solar energy.
- the solar factor therefore measures the contribution of glazing to warming the “room”.
- optical and electrical properties such as the emissivity depend directly on the quality of the silver layers such as their crystalline state, their homogeneity as well as their environment.
- the term "environment” means the nature of the layers close to the silver layer and the surface roughness of the interfaces with these layers. Another way to reduce the emissivity therefore consists in improving the quality of the silver layer by choosing a favorable environment.
- dielectric coatings comprising dielectric layers with stabilizing function intended to promote wetting and nucleation of the silver layer.
- Dielectric layers based on crystallized zinc oxide are notably used for this purpose. Indeed, the zinc oxide deposited by the sputtering process crystallizes without requiring additional heat treatment. The layer based on zinc oxide can therefore serve as an epitaxial growth layer for the silver layer.
- Another way to prevent the degradation of the silver layers lies in the choice of the layer located above and in contact with the silver layer.
- the known proposals is the use of so-called blocking layers and/or dielectric layers based on crystallized zinc oxide.
- the objective is to protect the functional layers from possible degradation during the deposition of the upper dielectric coating and/or during a heat treatment.
- the blocking layers are generally based on a metal chosen from nickel, chromium, titanium, niobium, or an alloy of these various metals.
- the various metals or alloys mentioned can also be partially oxidized, in particular have an oxygen sub-stoichiometry (for example TiOx OR NiCrOx).
- blocking layers are very thin, normally less than 2 nm thick, and are susceptible at these thicknesses to being partially oxidized during heat treatment or during deposition of an overlying layer.
- these blocking layers are sacrificial layers, capable of capturing oxygen coming from the atmosphere or from the substrate, thus avoiding the oxidation of the silver layer.
- the stack is used as a low-emissivity stack on face 3 in double glazing, or
- the stack is used as a solar control stack on face 2 in a double glazing.
- the layer based on titanium oxide is advantageously deposited from a ceramic target, in particular substoichiometric, in a controlled atmosphere comprising oxygen.
- a first thin layer based on titanium oxide is deposited in contact with the silver layer, from a ceramic target, in a non-oxidizing or very weakly oxidizing atmosphere.
- a thicker thickness of layer based on titanium oxide is deposited from a ceramic target in an oxidizing atmosphere.
- the layer based on titanium oxide consists of these two parts. During deposition, the part of the titanium oxide-based layer in contact with the functional layer is less oxidized than the part farthest from the functional layer. By doing so, we get:
- This deposition in several stages makes it possible to obtain mainly in the stack a layer of titanium oxide with a large quantity of oxygen, while protecting the functional layer based on silver from a first layer of titanium oxide. weakly oxidized. The absorption of the stack is then greatly reduced both in the absence of a heat treatment and following a heat treatment.
- the Ag/TiOx sequence makes it possible to obtain excellent performance and good durability, provided that the deposition parameters are controlled. However, adjusting these parameters can be quite tricky. It is necessary to determine both the thicknesses and the optimum oxidation conditions for each part of the thick layer of titanium oxide.
- the applicant has surprisingly discovered that the combined use of a zinc-based layer deposited from a metallic zinc cathode associated with a thick titanium oxide-based layer in the dielectric coating located above of the functional layer makes it possible to obtain the advantageous properties without requiring tedious adjustment of the deposition conditions of the layers constituting the stack. Thanks to the presence of the zinc-based layer, the titanium oxide-based layer can be deposited in a single step with high proportions of oxygen while guaranteeing low absorption. Thus, the deposition conditions are simpler and easier to determine industrially than the solution using the Ag/TiOx sequence.
- the invention therefore relates to a material comprising a substrate coated with a stack of layers comprising at least one silver-based functional metal layer and at least two dielectric coatings, each dielectric coating comprising at least one dielectric layer, so that that each functional metallic layer is placed between two dielectric coatings, characterized in that the dielectric coating located above the functional metallic layer comprises:
- a zinc-based layer located in contact with the functional layer having a thickness between 0.3 and 3.0 nm, between 0.3 and 2 nm, between 0.3 and 1 nm or between 0.3 and 0 .8 nm and
- the material of the invention has the advantage that these advantageous properties are obtained even when the material coated with the stack or the stack alone has not undergone heat treatment at high temperature.
- the materials according to the invention can be used interchangeably:
- the substrate and the stack undergo heat treatment at high temperature.
- the applicant has surprisingly discovered that the combined use of the layer based on zinc, the thick layer based on titanium oxide and a layer based on zinc oxide and particular tin also contributes to obtaining the advantageous properties of the invention. It seems that this layer makes it possible to reduce the residual absorption in the event of incomplete oxidation of the layer based on titanium oxide.
- the solution of the invention is particularly suitable in the case of stacks with several functional layers based on silver, in particular stacks with two or three functional layers which are particularly fragile from the point of view of scratches.
- the present invention is also particularly suitable in the case of stacks with a single functional layer based on silver intended for applications where, for example, high levels of light transmission are sought.
- the zinc-based layer is deposited from a metallic zinc target
- the layer based on titanium oxide is deposited from a ceramic target, in particular under stoichiometric preferably in an oxidizing atmosphere whose percentage by volume flow rate of oxygen represents between 0 and 20%, preferably 2 to 15 %,
- the layer based on titanium oxide has a thickness of between 5 and 30 nm
- the layer based on titanium oxide comprises an oxidation gradient
- the part of the layer based on titanium oxide in contact with the layer based on zinc is more oxidized than the part the farthest
- the dielectric coating located above the functional layer comprises a layer based on zinc oxide and tin comprising at least 10% by mass of tin relative to the total mass of zinc and tin, located above and in contact with the layer based on titanium oxide,
- the layer based on zinc oxide and tin has a thickness:
- the dielectric coating located above the functional layer comprises a layer comprising silicon chosen from among the layers of silicon nitride or the layers of silicon nitride and zirconium,
- the dielectric coating located below the functional layer comprises a layer based on zinc oxide located in contact with the functional layer
- the dielectric coating located below the functional layer comprises a layer comprising silicon chosen from among the layers of silicon nitride or the layers of silicon nitride and zirconium,
- the dielectric coating located below the functional layer comprises a layer with a refractive index greater than 2.20
- the layer with a refractive index greater than 2.20 is chosen from layers based on titanium oxide and layers based on silicon nitride and zirconium,
- the thickness of all the layers with a refractive index greater than 2.20 in the dielectric coating located below the functional layer is greater than 10 nm, greater than 15 nm, greater than 20 nm,
- the stack comprises a single functional metallic layer based on silver
- the stack and the substrate have been subjected to a heat treatment at a high temperature above 500°C such as quenching, annealing or bending.
- the invention also relates to:
- - glazing comprising a material according to the invention mounted on a vehicle or on a building, and
- a glazing according to the invention as solar control and/or low-emission glazing for the building or vehicles
- the material comprising a substrate coated with a stack of layers comprising at least one metallic layer silver-based functional layer and at least two dielectric coatings, each dielectric coating comprising at least one dielectric layer, so that each functional metal layer is placed between two dielectric coatings, characterized in that the dielectric coating located above above the functional metal layer includes:
- the substrate according to the invention is considered laid horizontally.
- the stack of thin layers is deposited above the substrate.
- the meaning of the expressions “above” and “below” and “lower” and “higher” should be considered in relation to this orientation.
- the expressions “above” and “below” do not necessarily mean that two layers and/or coatings are arranged in contact with one another. When it is specified that a layer is deposited "in contact” with another layer or a coating, this means that there cannot be one (or more) interposed layer(s) between these two layers (or layer and coating).
- the luminous characteristics are measured according to the D65 illuminant at 2° perpendicular to the material mounted in a double glazing:
- Rint corresponds to the interior light reflection in the visible in %, observer on the interior space side
- the properties must be obtained even when the stack or the substrate carrying the stack has not undergone heat treatment at high temperature.
- the present invention therefore relates to the non-heat-treated coated substrate.
- the stack may not have undergone a heat treatment at a temperature above 500°C, preferably 300°C.
- the present invention also relates to the heat-treated material.
- the heat treatments are chosen from:
- the material that is to say the transparent substrate coated with the stack, may have undergone a heat treatment at high temperature.
- the stack and the substrate may have been subjected to a heat treatment at a high temperature such as quenching, annealing or bending.
- the stack only may have undergone heat treatment.
- the stack may have undergone a heat treatment at a temperature above 300°C, preferably 500°C.
- the heat treatment temperature (at the level of the stack) is greater than 300°C, preferably greater than 400°C, and better still greater than 500°C.
- Rapid Thermal annealing such as laser annealing or flash lamp annealing.
- Rapid thermal annealing is for example described in applications WO2008/096089 and WO2015/185848.
- each point of the stack is brought to a temperature of at least 300° C. while maintaining a temperature less than or equal to 150° C. at any point on the face of the substrate opposite to that on which locate the stack.
- This process has the advantage of only heating the stack, without significant heating of the entire substrate.
- the coated materials can be treated using a laser line formed from laser sources such as InGaAs diode lasers or Yb:YAG disc lasers. These continuous sources emit at a wavelength between 900 and 1100 nm.
- the laser line has a length of the order of 3.3 m, equal to the width 1 of the substrate, and an average FWHM half-width between 45 and 100 ⁇ m.
- the materials are arranged on a roller conveyor so as to scroll along an X direction, parallel to its length.
- the laser line is fixed and positioned above the coated surface of the substrate with its longitudinal direction Y extending perpendicularly to the running direction X of the substrate, i.e. along the width of the substrate, in extending across that width.
- the position of the focal plane of the laser line is adjusted to be within the thickness of the functional coating when the substrate is positioned on the conveyor.
- the power area of the laser line at the focal plane is less than 100kW/cm2.
- the substrate was moved under the laser line at a speed of about 8 m/min.
- the stack may therefore have been subjected to rapid thermal annealing in which each point of the stack is brought to a temperature of at least 300°C while maintaining a temperature less than or equal to 150°C at any point on the face. of the substrate opposite to that on which the stack is located.
- the stack and the substrate may have been subjected to a heat treatment at a high temperature above 500°C such as quenching, annealing or bending.
- the coated substrate of the stack can be bent or tempered glass.
- the stack is deposited by cathode sputtering assisted by a magnetic field (magnetron process). According to this advantageous embodiment, all the layers of the stack are deposited by cathode sputtering assisted by a magnetic field.
- the expressions “above” and “below” do not necessarily mean that two layers and/or coatings are arranged in contact with one another. When it is specified that a layer is deposited "in contact” with another layer or a coating, this means that there cannot be one (or more) interposed layer(s) between these two layers (or layer and coating).
- the thicknesses referred to in this document are physical thicknesses and the layers are thin layers.
- thin layer is meant a layer having a thickness of between 0.1 nm and 100 micrometers.
- the expression "based on”, used to qualify a material or a layer as to what it or it contains, means that the mass fraction of the constituent which it or it comprises is at least 50%, in particular at least 70%, preferably at least 90%.
- the stack of thin layers comprises at least one functional layer and at least two dielectric coatings comprising at least one dielectric layer, so that each functional layer is placed between two dielectric coatings.
- the stack of thin layers can comprise at least two metallic functional layers based on silver and at least three dielectric coatings comprising at least one dielectric layer, so that each functional layer is placed between two dielectric coatings.
- the stack of thin layers can comprise at least three functional layers and at least four dielectric coatings comprising at least one layer dielectric, so that each functional layer is placed between two dielectric coatings.
- the silver-based metallic functional layers comprise at least 95.0%, preferably at least 96.5% and better still at least 98.0% by weight of silver relative to the weight of the functional layer.
- a silver-based functional metallic layer comprises less than 1.0% by mass of metals other than silver relative to the mass of the silver-based functional metallic layer.
- the silver-based metallic functional layers have a thickness:
- Dielectric coatings include dielectric layers.
- dielectric layer within the meaning of the present invention, it should be understood that from the point of view of its nature, the material is “non-metallic", that is to say is not a metal. In the context of the invention, this term designates a material having an n/k ratio over the entire visible wavelength range (from 380 nm to 780 nm) equal to or greater than 5.
- n designates the index of real refraction of the material at a given wavelength and k represents the imaginary part of the refractive index at a given wavelength; the ratio n/k being calculated at a given wavelength identical for n and for k.
- the thickness of a dielectric coating corresponds to the sum of the thicknesses of the layers constituting it.
- the dielectric coatings have a thickness greater than 10 nm, greater than 15 nm, between 15 and 200 nm, between 15 and 100 nm or between 15 and 70 nm.
- the dielectric layers in addition to their optical function, can have various other functions.
- the dielectric layers are conventionally chosen from layers based on oxide, based on nitride or based on oxynitride.
- Layers based on oxide of one or more elements essentially comprise oxygen and very little nitrogen.
- the oxide-based layers include in particular at least 90% in atomic percentage of oxygen with respect to the oxygen and the nitrogen in said layer.
- the nitride-based layers essentially comprise nitrogen and very little oxygen.
- Nitride-based layers comprise at least 90 atomic percent nitrogen relative to the oxygen and nitrogen in said layer.
- Oxynitride layers include a mixture of oxygen and nitrogen.
- the layers based on silicon oxynitride comprise 10 to 90% (limits excluded) in atomic percentage of nitrogen with respect to the oxygen and the nitrogen in said layer.
- the amounts of oxygen and nitrogen in a layer are determined in atomic percentages relative to the total amounts of oxygen and nitrogen in the layer under consideration.
- the dielectric layers are conventionally chosen from:
- a zinc-based layer is located in contact with the functional layer.
- the zinc-based layers are defined as they are obtained during deposition. Insofar as these layers are thin, it is not possible to determine with certainty, according to the thicknesses deposited, how this zinc-based layer is modified following the deposition of the titanium oxide layer.
- the zinc-based layer is deposited by sputtering from a metallic zinc target.
- the deposition atmosphere is oxygen-free or contains very little oxygen, preferably oxygen-free, i.e. non-oxidizing.
- This zinc-based layer is partly oxidized to zinc oxide during the deposition of the titanium oxide-based layer. Following the deposition of the titanium oxide layer, there is preferably no absorption due to the non-oxidation of the metallic zinc.
- the zinc-based layer is deposited in metallic form, the zinc seems to ally or associate with the silver in the form of an AgZn phase. It is possible to carry out analyzes proving the presence of this AgZn phase. When this phase is detected, there is a strong presumption that the zinc in contact with the silver was indeed deposited from a metallic target in the absence of oxygen or under weakly oxidizing conditions.
- the thickness of this layer can be as thin as that of a standard blocking layer ( ⁇ 1 nm), as long as the silver-based functional layer is not found to be degraded by the oxygen present during the deposition of the next layer based on titanium oxide, deposited with more oxygen. It has a thickness between 0.3 and 3.0 nm, between 0.3 and 2 nm, between 0.3 and 1 nm or between 0.3 and 0.8 nm.
- the zinc-based layers are deposited in metallic form.
- the zinc-based layers comprise, at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, at least 80%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% by mass of zinc relative to the total mass of the elements other than oxygen and nitrogen in the zinc-based layer.
- the zinc-based layers can be chosen from:
- the term “zinc layer” is understood to mean metallic layers of pure zinc which may nevertheless include some impurities.
- the total mass of zinc represents at least 99% by mass compared to the total mass of the elements other than oxygen and nitrogen in the zinc-based layer.
- the doped zinc layers comprise at least 90.0%, at least 95%, at least 96%, at least 97% or at least 98% by mass of zinc relative to the total mass of the elements other than oxygen and nitrogen in the zinc-based layer.
- the doped zinc layers can be chosen from layers based on zinc and at least one element chosen from titanium, nickel, aluminum, tin, niobium, chromium, magnesium, copper, silicon, silver or gold.
- the layers based on zinc alloy comprise at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, at least 80% or at least 90% by weight zinc based on the total weight of elements other than oxygen and nitrogen in the zinc-based layer.
- the layers based on a zinc alloy can be chosen from layers based on zinc and at least one element chosen from titanium, nickel, chromium, tin.
- elements chosen from titanium, nickel, chromium, tin By way of example, mention may be made of binary alloys of zinc and titanium such as Zn2II or ternary alloys based on zinc, nickel and chromium such as ZnNiCr.
- the thickness of the zinc-based layer can be:
- the stack comprises at least one titanium oxide-based layer located above and in contact with the zinc-based layer having a thickness greater than equal to 3 nm.
- the layer is a layer based on titanium oxide over this entire thickness.
- this layer based on titanium oxide is part of a dielectric coating located above the silver layer. This means that when determining the thickness of this dielectric coating, the thickness of this layer is taken into consideration.
- This layer based on thick titanium oxide close to the silver contributes to obtaining the advantageous properties of the invention.
- This oxide layer is not absorbent and this, a fortiori, when it is mainly deposited from a ceramic target in an oxidizing atmosphere.
- the layers based on titanium oxide comprise at least 50%, at least 60%, at least 70%, at least 80%, at least 95.0%, at least 96.5% and better still at least 98.0 % by mass of titanium relative to the mass of all the elements constituting the layer based on titanium oxide other than oxygen.
- the layers based on titanium oxide can have a thickness:
- nm less than or equal to 30 nm, less than or equal to 25 nm, less than or equal to 20 nm, less than or equal to 15 nm, less than or equal to 10 nm, less than or equal to 8 nm, less than or equal to 6 nm.
- the layers based on titanium oxide can have a thickness between 5 and 30 nm.
- the layers based on titanium oxide can include or consist of elements other than titanium and oxygen. These elements can be chosen from silicon, chromium and zirconium. Preferably, the elements are chosen from zirconium. Preferably, the layer based on titanium oxide comprises at most 35%, at most 20% or at most 10% by mass of elements other than titanium relative to the mass of all the elements constituting the layer based on titanium oxide other than oxygen.
- the layers based on titanium oxide can be obtained:
- the deposition atmosphere includes significant proportions of oxygen.
- the layers based on titanium oxide are preferably obtained from a ceramic target of titanium oxide, preferably sub-stoichiometric in oxygen, in an atmosphere comprising oxygen.
- the quantity of oxygen in the deposition atmosphere can be adapted according to the desired properties.
- the layer based on titanium oxide is preferably deposited from a ceramic target, in particular sub-stoichiometric in an oxidizing atmosphere, preferably of which the percentage by volume flow rate of oxygen represents between 0 and 20%, preferably 2 at 15%.
- a layer based on titanium oxide is deposited from a ceramic target, in particular substoichiometric.
- the layer based on titanium oxide can be deposited from a ceramic target of TiO x under stoichiometric, where x is a number different from the stoichiometry of the titanium oxide TiO2, that is to say different of 2 and preferably less than 2, in particular between 0.75 times and 0.99 times the normal stoichiometry of the oxide.
- TiOx may in particular be such that 1.5 ⁇ x ⁇ 1.98 or 1.5 ⁇ x ⁇ 1.7, or even 1.7 ⁇ x ⁇ 1.95.
- depositing is carried out in an atmosphere comprising an optimized quantity of oxygen to obtain the desired properties.
- the deposition atmosphere comprises a mixture of noble gases (He, Ne, Xe, Ar, Kr) and oxygen.
- the noble gas is preferably argon. The following parameters are used to define the conditions for sputtering deposition:
- the pressure in the deposition chamber is between 1 and 15 pbar, preferably 2 and 10 pbar or 2 and 8 pbar,
- the deposition atmosphere comprises a mixture of argon and oxygen.
- the maximum oxygen threshold may vary to some extent depending on, for example:
- the configuration of the cathode sputtering deposition chamber (geometry, places of gas inlets, etc.
- the volume flow quantities of oxygen that can be used during the deposition will be lower because the TiOx is deposited more slowly and is therefore more likely to oxidize.
- a person skilled in the art is able to define a satisfactory controlled atmosphere by varying these parameters to some extent.
- a person skilled in the art is in particular perfectly able to determine the power to be applied to the target and the volume flow rates of oxygen and noble gases.
- the layer based on titanium oxide is deposited from a ceramic target, in particular sub-stoichiometric, in an atmosphere comprising oxygen.
- a first thin thickness of titanium oxide-based layer is deposited in contact with the zinc-based layer, from a ceramic target, in a slightly oxidizing atmosphere. Then, a thicker thickness of layer based on titanium oxide is deposited from a ceramic target in a more oxidizing atmosphere.
- the thick titanium oxide-based layer according to the invention consists of these two thicknesses.
- the part of the titanium oxide-based layer in contact with the zinc-based layer is less oxidized than the furthest part.
- the layer based on oxide of titanium comprises an oxidation gradient, the part of the titanium oxide-based layer in contact with the zinc-based layer is more oxidized than the furthest part.
- the layer based on titanium oxide is below and in contact with a dielectric layer.
- the dielectric layer can be based on oxide, nitride or oxynitride of one or more elements chosen from silicon, zirconium, titanium, aluminium, tin and/or zinc.
- this dielectric layer has a thickness greater than 5 nm, 8 nm, 10 nm or 15 nm.
- the stack can comprise at least one layer comprising silicon or aluminum.
- the dielectric coating located above the functional layer may comprise a layer comprising silicon chosen in particular from silicon nitride layers or silicon nitride and zirconium layers. Each dielectric coating may also include at least one layer comprising silicon.
- Layers comprising silicon are extremely stable to heat treatments. For example, no migration of the constituent elements is observed. Therefore, these elements are not likely to alter the silver layer.
- the layers comprising silicon therefore also contribute to the non-alteration of the silver layers and therefore to obtaining a low emissivity after heat treatment.
- the layers comprising silicon comprise at least 50% by mass of silicon relative to the mass of all the elements constituting the layer comprising silicon other than nitrogen and oxygen.
- the layers comprising silicon can be chosen from layers based on oxide, based on nitride or based on oxynitride such as layers based on silicon oxide, layers based on silicon nitride and layers based on silicon oxynitride.
- Silicon oxide based layers include at least 90% atomic percent oxygen relative to the oxygen and nitrogen in the silicon oxide based layer.
- the silicon nitride based layers include at least 90% atomic percent nitrogen relative to the oxygen and nitrogen in the silicon nitride based layer.
- the layers based on silicon oxynitride include 10 to 90% (limits excluded) in atomic percentage of nitrogen relative to the oxygen and nitrogen in the layer based on silicon oxide.
- the layers based on silicon oxide are characterized by a refractive index at 550 nm, less than or equal to 1.55.
- the layers based on silicon nitride are characterized by a refractive index at 550 nm, greater than or equal to 1.95.
- the layers comprising silicon can comprise or consist of elements other than silicon, oxygen and nitrogen. These elements can be chosen from aluminum, boron, titanium, and zirconium. Layers comprising silicon can comprise at least 2%, at least 5% or at least 8% by mass of aluminum relative to the mass of all the elements constituting the layer comprising silicon other than oxygen and nitrogen.
- the layers comprising aluminum can be chosen from layers based on oxide, based on nitride or based on oxynitride such as layers based on aluminum oxide such as Al2O3, layers based on of aluminum nitride such as AIN and layers based on aluminum oxynitride such as AlOxNy.
- the layers based on silicon nitride and on zirconium Si x Zr y N z form part of the layers comprising silicon, in particular layers based on silicon nitride.
- the refractive index of layers based on silicon nitride and zirconium increases with the increase in the proportions of zirconium in said layer.
- the layers based on silicon nitride can comprise aluminum and/or zirconium. Such layers may include, in atomic proportion to the atomic proportion of Si, Zr and Al:
- the dielectric coating located above the silver layer comprises a layer comprising silicon.
- These layers comprising silicon have, in increasing order of preference, a thickness:
- At least one dielectric coating comprises a layer comprising silicon chosen from layers based on silicon nitride.
- the dielectric coating located above the silver-based functional layer comprises a layer comprising silicon chosen from among the layers based on silicon nitride.
- Each dielectric coating may comprise a layer comprising silicon chosen from layers based on silicon nitride.
- the sum of the thicknesses of all the layers comprising silicon in the dielectric coating located above the first silver-based functional metal layer can be greater than 35%, greater than 50%, of the total thickness dielectric coating.
- the sum of the thicknesses of all the layers comprising silicon based on silicon nitride in each dielectric coating located above the first functional metal layer based on silver can be greater than 35%, greater than 50% , the total thickness of the dielectric coating.
- the dielectric coating located above the functional layer may comprise a layer based on zinc oxide and tin comprising at least 10% by mass of tin relative to the total mass of zinc and tin, located above and in contact with the layer based on titanium oxide.
- the layer based on zinc oxide and tin comprises by mass of tin relative to the total mass of zinc and tin:
- the layer based on zinc oxide and tin located in the dielectric coating above the functional layer based on silver has a thickness:
- the dielectric coating above the silver layer may include:
- the dielectric coating above the silver layer may include:
- a layer based on zinc oxide and tin comprising at least 10% by mass of tin relative to the total mass of zinc and tin, located above and in contact with the layer based on titanium oxide,
- a layer comprising silicon located above and in contact with the layer based on zinc oxide and tin, preferably a layer based on silicon nitride or a layer based on silicon nitride and zirconium or a combination of these two layers.
- the dielectric coating located below the functional layer may comprise a so-called stabilizing layer which reinforces the adhesion of the functional layer to the layers which surround it.
- the stabilizing layers are preferably layers based on zinc oxide optionally doped, for example, with aluminum.
- the zinc oxide is crystallized.
- the zinc oxide-based layer comprises, in increasing order of preference, at least 90.0%, at least 92%, at least 95%, at least 98.0% by weight of zinc relative to the weight of elements other than oxygen in the layer based on zinc oxide.
- the dielectric coating located below the functional layer may comprise a layer based on zinc oxide located directly at the functional layer contact.
- a stabilizing layer below and in contact with a functional layer, because it facilitates the adhesion and the crystallization of the silver-based functional layer and increases its quality and its stability.
- the metallic functional layer is deposited above and in contact with a layer based on zinc oxide.
- the layer based on zinc oxide can be deposited from a ceramic target, with or without oxygen or from a metal target.
- the zinc oxide layers have a thickness:
- the dielectric coating located below the silver layer may also comprise a layer based on zinc oxide and tin comprising at least 10% by mass of tin relative to the total mass of zinc and tin , located below and in contact with the layer based on zinc oxide.
- the stack can therefore comprise one or more layers based on zinc oxide and tin comprising at least 10% by mass of tin relative to the total mass of zinc and tin, located above and contact with the layer based on titanium oxide.
- the layers based on zinc oxide and tin preferably comprise by mass of tin relative to the total mass of zinc and tin:
- the layers based on zinc and tin oxide have a thickness:
- the dielectric coating located below the functional layer may comprise a layer comprising silicon chosen from among the layers of silicon nitride or the layers of silicon nitride and zirconium.
- the dielectric coating located below the functional layer may include a layer with a refractive index greater than 2.20.
- the presence of high index layers above and below the silver-based functional layer contributes to obtaining high light transmission.
- the layers with a low refractive index have a refractive index of less than 1.70.
- Refractive index layers intermediate have a refractive index of between 1.70 and 2.2.
- High refractive index layers have a refractive index greater than 2.2.
- the high refractive index layers can be chosen from:
- n550 2.30
- the layer with a high refractive index is chosen from layers based on titanium oxide and the layer based on silicon nitride and zirconium.
- the stack does not include a metallic blocking layer or one based on titanium oxide below and in contact with the functional metallic layer based on silver.
- the silver-based functional metallic layer is located above and in contact with a dielectric layer of the dielectric coating.
- this dielectric layer is a stabilizing layer.
- the dielectric coating located below the functional layer may comprise a sequence of layers, defined starting from the substrate, chosen from:
- the stack includes a layer of silicon nitride and a layer of silicon nitride and zirconium, these layers are different, i.e. they are not composed of the same elements in the same proportions.
- the dielectric coating located above the functional layer may comprise a sequence of layers, defined starting from the substrate, chosen from:
- the zinc-based layer // the titanium oxide-based layer // the silicon nitride-based layer
- the zinc-based layer // the titanium oxide-based layer // the zinc and tin oxide-based layer // the silicon nitride-based layer
- the zinc-based layer // the titanium oxide-based layer // the zinc and tin oxide-based layer // the silicon oxide-based layer
- the layer based on zinc // the layer based on titanium oxide // layer based on zinc oxide and tin // layer based on silicon nitride // layer based on oxide of zinc and tin
- the zinc-based layer // the titanium oxide-based layer // silicon nitride-based layer // silicon oxide-based layer
- the layer based on zinc // the layer based on titanium oxide // layer based on silicon nitride and zirconium // layer based on silicon nitride // layer based on silicon oxide.
- the stack of thin layers can optionally include a protective layer.
- the protective layer is preferably the last layer of the stack, that is to say the layer farthest from the coated substrate of the stack (before heat treatment). These layers generally have a thickness of between 0.5 and 10 nm, between 1 and 5 nm, between 1 and 3 nm or between 1 and 2.5 nm.
- This protective layer can be chosen from a layer of titanium, zirconium, hafnium, silicon, zinc and/or tin, this or these metals being in metallic, oxidized or nitrided form.
- the protective layer is based on zirconium oxide and/or titanium, preferably based on zirconium oxide, titanium oxide or titanium oxide and zirconium.
- the thickness of the protective layer is taken into account.
- the transparent substrates according to the invention are preferably made of a rigid mineral material, such as glass, or organic based on polymers (or polymer).
- the organic transparent substrates according to the invention can also be made of polymer, rigid or flexible.
- polymers suitable according to the invention include, in particular:
- PET polyethylene terephthalate
- PBT polybutylene terephthalate
- PEN polyethylene naphthalate
- PMMA polymethyl methacrylate
- fluorinated polymers such as fluoroesters such as ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluorethylene (PCTFE), ethylene chlorotrifluorethylene (ECTFE), fluorinated ethylene-propylene copolymers (FEP);
- fluoroesters such as ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluorethylene (PCTFE), ethylene chlorotrifluorethylene (ECTFE), fluorinated ethylene-propylene copolymers (FEP);
- photocrosslinkable and/or photopolymerizable resins such as thiolene, polyurethane, urethane-acrylate, polyester-acrylate and
- the substrate is preferably a glass or glass-ceramic sheet.
- the substrate is preferably transparent, colorless (it is then a clear or extra-clear glass) or colored, for example blue, gray or bronze.
- the glass is preferably of the silico-sodo-lime type, but it can also be of borosilicate or alumino-borosilicate type glass.
- the substrate is made of glass, in particular silico-sodo-lime or of polymeric organic material.
- the substrate advantageously has at least one dimension greater than or equal to 1 m, or even 2 m and even 3 m.
- the thickness of the substrate generally varies between 0.5 mm and 19 mm, preferably between 0.7 and 9 mm, in particular between 2 and 8 mm, or even between 4 and 6 mm.
- the substrate can be flat or curved, even flexible.
- the invention also relates to a glazing comprising at least one material according to the invention.
- the invention relates to glazing which may be in the form of monolithic, laminated and/or multiple glazing, in particular double glazing or triple glazing.
- Double glazing has 4 faces, face 1 is outside the building and therefore constitutes the outer wall of the glazing, face 4 is inside the building and therefore constitutes the inner wall of the glazing, faces 2 and 3 being inside the double glazing.
- the stack according to the invention is on face 2 or face 3.
- Triple glazing has 6 faces, face 1 is outside the building and therefore constitutes the outer wall of the glazing, face 6 is inside the building and therefore constitutes the inner wall of the glazing, faces 2 and 3 and 4 and 5 being inside the double glazing.
- the stack according to the invention can be on face 2, face 3 and/or face 5.
- a laminated glazing comprises at least one structure of the first substrate/sheet(s)/second substrate type.
- the polymer sheet may in particular be based on polyvinyl butyral PVB, ethylene vinyl acetate EVA, polyethylene terephthalate PET, polyvinyl chloride PVC.
- the stack of thin layers is positioned on at least one of the faces of one of the substrates.
- the invention therefore relates to:
- glazings can be mounted on a building or a vehicle.
- the following examples illustrate the invention.
- Stacks of thin layers defined below are deposited on clear soda-lime glass substrates with a thickness of 4 mm.
- Stacks of thin layers defined below are deposited on clear soda-lime glass substrates with a thickness of 4 mm.
- the functional layers are layers of silver (Ag),
- the dielectric layers are based on silicon nitride doped with aluminum (SisN4: Al), based on silicon nitride and zirconium doped with aluminum (SiZrN: Al), based on zinc oxide and tin (SnZnO), based on zinc oxide doped with aluminum (ZnO: Al).
- TiOx titanium oxide layers are deposited from a TiOx ceramic target with or without oxygen in the deposition atmosphere.
- the zinc-based layers are deposited from an aluminum-doped zinc metal target.
- %wt % by weight; at%: atomic.
- laser in this case, only the stack undergoes heat treatment at high temperature
- Naber® - treated in the Naber® oven at 650°C for 10 min
- Laser radiation processing involves processing coated substrates with a laser line formed from a disc laser. The following conditions were used:
- the square resistance Rsq corresponding to the resistance referred to the surface, is measured by induction with a Nagy SMR-12.
- the square resistance and the absorption are both degraded in the case of the use of a layer of titanium oxide deposited in an oxidizing atmosphere in contact with silver (comparison Ref.lc and Ref.l a). This is due to the excessive amounts of oxygen during the deposition of the titanium oxide based layer and the consequent degradation of the silver.
- the stacks of the invention have both low absorption and low resistance per square and satisfactory mechanical properties.
- the square resistance and the absorption are both degraded in the case of the use of a layer of titanium oxide deposited in an oxidizing atmosphere in contact with silver (comparison Ref.2c and Ref.2a). This is due to the excessive amounts of oxygen during the deposition of the titanium oxide based layer and the consequent degradation of the silver.
- the introduction of the metallic zinc layer prevents degradation of the silver layer even at such thin thicknesses (0.5 nm) and leads to the lowest absorption values (6.4% for the example of the L2a invention compared to the references) and the lowest square resistance values (4.3Q/n).
- the EBT of the stack according to the invention is satisfactory whereas this is not the case of the Ref.2b references comprising in contact with the silver a layer of TiOx deposited without oxygen.
- the stack of the invention leads to the lowest values of absorption and resistance per square (4.2% and 3.0Q/n).
- the introduction of the layer of zinc and tin oxide leads to a notable improvement in the resistance per sheet and the absorption (Lia compared to L2a).
- the stack of the invention leads to the lowest absorption and resistance values per square (4.5% and 3.1 Q/n).
- the presence of the layer based on zinc oxide and tin in contact with the layer of titanium oxide causes an oxidation-reduction reaction between the TiOx and the SnZnO leading to a degradation of square resistance and absorption.
- All the stacks comprising the TiOx/SnZnO sequence have degraded performance after quenching.
- the stack of the invention has a lower level of degradation.
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2200151A FR3131743B1 (fr) | 2022-01-10 | 2022-01-10 | Vitrage contrôle solaire et/ou bas émissif |
| PCT/FR2023/050031 WO2023131767A1 (fr) | 2022-01-10 | 2023-01-10 | Vitrage contrôle solaire et/ou bas émissif |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4463430A1 true EP4463430A1 (de) | 2024-11-20 |
Family
ID=81346177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP23703630.6A Pending EP4463430A1 (de) | 2022-01-10 | 2023-01-10 | Sonnenschutzverglasung und/oder verglasung mit geringer emissivität |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4463430A1 (de) |
| FR (1) | FR3131743B1 (de) |
| WO (1) | WO2023131767A1 (de) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0597391B1 (de) * | 1992-11-09 | 1998-09-09 | Central Glass Company, Limited | Glasplatte mit einem ultraviolett absorbierenden mehrschichtigen Überzug |
| US5763064A (en) * | 1995-06-26 | 1998-06-09 | Asahi Glass Company Ltd. | Laminate |
| FR2911130B1 (fr) | 2007-01-05 | 2009-11-27 | Saint Gobain | Procede de depot de couche mince et produit obtenu |
| FR3021312A1 (fr) * | 2014-05-23 | 2015-11-27 | Saint Gobain | Substrat muni d'un empilement a couches metalliques partielles, vitrage et procede. |
| FR3021310B1 (fr) * | 2014-05-23 | 2022-11-18 | Saint Gobain | Substrat muni d'un empilement a couche metallique partielle, vitrage et procede. |
| FR3021967B1 (fr) | 2014-06-06 | 2021-04-23 | Saint Gobain | Procede d'obtention d'un substrat revetu d'une couche fonctionnelle |
-
2022
- 2022-01-10 FR FR2200151A patent/FR3131743B1/fr active Active
-
2023
- 2023-01-10 WO PCT/FR2023/050031 patent/WO2023131767A1/fr not_active Ceased
- 2023-01-10 EP EP23703630.6A patent/EP4463430A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR3131743B1 (fr) | 2025-02-21 |
| WO2023131767A1 (fr) | 2023-07-13 |
| FR3131743A1 (fr) | 2023-07-14 |
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