EP4359842A1

EP4359842A1 - Lissajous microscanner having central mirror mount and method for production thereof

Info

Publication number: EP4359842A1
Application number: EP22734307.6A
Authority: EP
Inventors: Ulrich Hofmann; Thomas VON WANTOCH; Stephan Marauska; Oleg PETRAK; Marcel Metschulat; Leon POHL
Original assignee: Oqmented GmbH
Current assignee: Oqmented GmbH
Priority date: 2021-06-22
Filing date: 2022-06-21
Publication date: 2024-05-01
Also published as: DE102021116165B3; WO2022268778A1; CN117940823A

Abstract

A microscanner comprises: a deflecting element for deflecting an incident electromagnetic beam, a support structure, and a spring device having one or more springs, by means of which the deflecting element is mounted so as to be capable of swinging on the support structure such that it can simultaneously carry out a first rotational oscillation about a first swing axis and a second rotational oscillation about a second swing axis orthogonal to the first swing axis relative to the support structure, in order during the simultaneous oscillation to cause a Lissajous projection by deflecting an electromagnetic beam incident on the deflecting element. The support structure has a spring support structure and the spring device has a number N of first springs, where N ≥ 1, and each of the N first springs contacts at least one associated contact point on the spring support, is coupled to at least one associated coupling point on the deflecting element and extends between this contact point and this coupling point. There are three points on the deflecting element which, in the rest position of said element, define a Euclidian auxiliary plane and therein span a surface portion or straight line portion which is enclosed by the connecting straight lines between the points and on which each of the contact points or the vertical projection thereof lies on the auxiliary plane.

Description

LISSAJOUS MICROSCANNER WITH MIRROR CENTRAL SUSPENSION AND METHOD FOR ITS MANUFACTURE

The present invention is in the field of beam deflection systems produced using microtechnology and relates to a microscanner for generating a Lissajous projection in an observation field and a method for producing such a microscanner.

In the case of micro scanners, which are also referred to in technical jargon as “MEMS scanners”, “MEMS mirrors” or “micro mirrors” or in English as “micro scanners” or “micro-scanning mirrors” or “MEMS mirrors”. are micro-electro-mechanical systems (MEMS) or, more precisely, micro-opto-electro-mechanical systems (MOEMS) from the class of micro-mirror actuators for the dynamic modulation of electromagnetic radiation, in particular visible light. Depending on the design, the modulating movement of an individual mirror can be translational or rotational about at least one axis. In the first case, a phase-shifting effect is achieved, in the second case, the deflection of the incident electromagnetic radiation. In the following, microscanners are considered, in which the modulating movement of a single mirror is rotational. In the case of microscanners, the modulation is generated via a single mirror, in contrast to mirror arrays, in which the modulation of incident light takes place via the interaction of several mirrors.

Microscanners can be used in particular for the deflection of electromagnetic radiation in order to use a deflection element (“mirror”) to modulate an electromagnetic beam incident on it with respect to its deflection direction. This can be used in particular to bring about a Lissajous projection of the beam in an observation field or projection field. For example, imaging sensory tasks can be solved or display functionalities can be implemented. In addition, such microscanners can also be used to advantageously irradiate and thus also process materials. Other possible applications are in the area of lighting or illuminating certain open or closed spaces or areas of space with electromagnetic radiation, for example in the context of spotlight applications.

In many cases, microscanners consist of a mirror plate (deflection plate) that is suspended laterally on elastically expandable springs. A distinction is made between uniaxial Mirrors that should preferably only be suspended so that they can move around a single axis, from two-axis and multi-axis mirrors.

Both in the case of imaging sensors and in the case of a display function, a microscanner is used to deflect electromagnetic radiation such as a laser beam or a shaped beam from any other source of electromagnetic radiation at least two-dimensionally, e.g. horizontally and vertically, in order to scan an object surface within scan or illuminate an observation field. In particular, this can be done in such a way that the scanned laser beam sweeps over a rectangular area on a projection area in the projection field. Microscanners with at least a two-axis mirror or single-axis mirrors connected in series in the optical path are therefore used in these applications. The wavelength range of the radiation to be deflected can in principle be selected from the entire spectrum from short-wave UV radiation, via the VIS range, NIR range, IR range, FIR range to long-wave Terraherz and radar radiation.

Microscanners are often manufactured using silicon technology methods. Based on silicon wafer substrates, layer deposition, photolithography and etching techniques are used to form microstructures in silicon and thus to realize microscanners with movable MEMS mirrors. Electrostatic, electromagnetic, piezoelectric, thermal and other actuator principles are typically used as drives. The mirror movement can in particular take place in a quasi-static (=non-resonant) or resonant manner, the latter in particular in order to achieve larger oscillation amplitudes, larger deflections and higher optical resolutions. In addition, in principle, the energy consumption can also be minimized in resonant operation or advantages can be achieved, in particular with regard to stability, robustness, production yield, etc. Scanning frequencies from 0 Hz (quasi-static) to over 100 kHz (in resonance) are typical.

Although the microscanners according to the invention described herein can in principle be used sensibly and successfully in many different areas, their application in the area of laser projection displays will be discussed in particular below. In many known cases, microscanner-based laser projection displays are so-called raster scan displays in which a first beam deflection axis is operated at high frequency (typically 15 kHz to 30 kHz) in resonance (fast axis) around the horizontal deflection and a second axis is operated quasi-statically at a low frequency (typically 30 Hz to 60 Hz) in order to generate the vertical deflection. A fixed grid-like line pattern (trajectory) is typically reproduced 30 to 60 times per second.

Another approach is used in the so-called Lissajous microscanners, in particular also in Lissajous scan displays. There, both axes are usually operated in resonance and a scan path is generated in the form of a Lissajous figure. In this way, large amplitudes can be achieved in both axes. The vertical deflection in particular can therefore be much larger than with a raster scanner. Accordingly, a significantly higher optical resolution can usually be achieved with a Lissajous microscanner, in particular a Lissajous scan display, than with a raster scan display, in particular in the vertical direction.

Various architectures known from the prior art for Lissajous microscanners, in particular for their micromirrors including its suspension, are known in particular from the publications DE 102009058762 A1 and EP 2 514 211 B1 and US 8,711,456 B2 and are described below with reference to Figures 1 to 4 described. What these architectures have in common is that the mirror suspension is always formed exclusively by means of a plurality of springs, each of which runs between an outer edge of the plate-shaped mirror and a closed, fixed frame surrounding the mirror.

One or more of the following requirements are typically placed on a microscanner-based Lissajous laser beam deflection system: high scanning frequencies, for example between a minimum of 10 kHz and a maximum of 80 kHz, in particular in order to be able to project as many lines per second as possible and to be able to realize high frame rates; preferably, both beam deflection axes (oscillation axes) should not differ too much in terms of their scan frequencies and thus represent two fast axes in order to achieve particularly favorable trajectories, good and very fast coverage of the projection area and, in the case of displays, as few or only slightly pronounced flickering produce artifacts in the viewer. The terms “fast” and “slow” in relation to a respective (oscillation) axis refer here to the oscillation frequency at which the deflection element (mirror) of the microscanner oscillates about an associated axis during its operation. In particular, the terms are used relatively to distinguish a "faster" axle from a "slower" axle. large mirror diameters, in particular to be able to realize small spot sizes and high optical pixel resolution. Especially in combination with optical waveguides, large mirror diameters are of great advantage in order to be able to achieve a large so-called "eye box" and low diffractive losses and as few artefacts as possible; large beam deflection angles, in particular to enable the highest possible pixel resolution and a large projection or observation field (field-of-view, FoV); The smallest possible installation space or small chip size, in particular to enable the microscanner-based laser projector of electronic devices, such as smart glasses (e.g. augmented reality (AR) glasses, smartphones or tablet computers, to be almost invisible in the eyeglass temples or in the housing of the smartphone or tablet, but at the same time to be able to enable low production costs; minimum power consumption, in particular to enable low heat development of the end device and the longest possible battery life.

However, these are often conflicting requirements, as the following examples show:

A microscanner whose design is reduced in order to be able to better meet compactness requirements usually loses actuator surface area, and thus driving force or torque and thus (pixel) resolution and performance (e.g. image field size, achievable frame rate).

A microscanner that is reduced in its design usually loses the area available for accommodating spring suspensions. This increases the stress in the suspensions and reduces the mechanical deflection and thus the optical resolution and performance at the same time.

A microscanner whose power consumption benefits a longer service life of a mobile device or an application running on it is reduced, usually loses driving force or torque, and thus resolution and performance.

A mirror plate that is enlarged for the sake of smaller spots and thus higher optical resolution usually increases in mass and moment of inertia and therefore reduces the achievable dynamics and speed.

A mirror plate that is enlarged for reasons of higher optical resolution usually shows larger dynamic deformations, which increases the beam divergence and the spot size and sometimes reduces the resolution.

A spring suspension that is stiffened in favor of higher scanning speeds and higher frame rates usually achieves lower deflections and thus reduces the achievable optical resolution.

All in all, the design of microscanners usually results in challenging optimization problems, the solution of which often requires not only one or more of the parameters mentioned above, but also many other properties and boundary conditions. Such additional properties and boundary conditions can relate in particular to manufacturability, manufacturing costs, yield, electronic controllability, reproducibility, available modulation bandwidth of laser sources and drivers and much more.

The present invention is based on the object of providing an improved, at least two-axis, in particular resonantly operable, microscanner for Lissajous figure-shaped scanning of an observation field or (equivalently) projection field, which enables an improvement with regard to at least one of the aforementioned problems. In addition, a manufacturing method suitable for manufacturing such a microscanner is to be specified.

The solution to this problem is achieved according to the teaching of the independent claims. Various embodiments and developments of the invention are the subject matter of the dependent claims.

A first aspect of the invention relates to a microscanner for projecting electromagnetic radiation onto an observation field (projection field), the microscanner having: (i) a deflection element, in particular a mirror, for deflecting an incident electromagnetic beam; (ii) a support structure; and (iii) a spring device with one or more springs, by means of which the deflection element is oscillatingly suspended on the support structure in such a way that, relative to the support structure, it can simultaneously perform a first rotary oscillation about a first axis of oscillation and a second rotary oscillation about a second axis of oscillation orthogonal thereto to cause a Lissajous projection in an observation field by deflecting an electromagnetic beam incident on the deflection element during the simultaneous oscillations.

The support structure has a spring support structure and the spring device has a number N of first springs, where N > 1 applies and each of the N first springs attaches to at least one associated attachment point on the spring support structure, is coupled to at least one associated coupling point on the deflection element and extends between this attachment point and this coupling point. There are three points on the deflection element, which define a Euclidean, in particular virtual, auxiliary plane in its rest position and span a surface or straight line section enclosed by the connecting line between the three points in the auxiliary plane, on which each of these starting points or its respective vertical Projection onto the auxiliary plane (the connecting straight lines themselves count here as part of the surface or straight line section. In addition, there does not necessarily have to be exactly three points that fulfill the above-mentioned condition. Rather, there can be any, in particular even an infinite number of triplets of points give such points).

A "spring" within the meaning of the invention is understood to mean, in particular, an elastic body, in particular a machine element, for absorbing and storing mechanical (potential) energy, which deforms in a targeted manner under load in the load range below an elasticity limit and regains its shape when relieved takes on its original shape. The loading can take place in particular by means of torsion or bending. Accordingly, a spring can in particular be a bending spring or a torsion spring.

A "deflection element" within the meaning of the invention is to be understood in particular as a body that has a reflecting surface (mirror surface) that is smooth enough that reflected electromagnetic radiation, e.g. visible light, retains its parallelism according to the law of reflection and thus creates an image can. The roughness of the mirror surface must be less than about half the wavelength of the electromagnetic radiation. The deflection element can in particular be designed as a mirror plate with at least one mirror surface or such exhibit. In particular, the mirror surface itself can consist of a different material, for example a metal, in particular a deposited metal, than the rest of the body of the deflection element.

For the purposes of the invention, a “point of attachment” of a spring is to be understood in particular as a point on or in the spring support structure at which the spring is attached to the spring support structure or, if it is formed in one piece with the support structure or a part thereof, in this or this passes, and which forms a fixed point of the occurring spring movement during the oscillations of the deflection element. In particular, the spring can also attach to a plurality of connected or separate attachment points on the spring support structure.

In the context of the invention, a “coupling point” of a spring is to be understood in particular as a point on or in the spring from which it is attached directly, or indirectly via one or more intermediate bodies, to the deflection element or, if it is integral with Is formed deflection element or part thereof, merges into this. In particular, the spring can also be coupled to the deflection element from a plurality of connected or separate coupling points. The terms “coupling”, “coupling”, “coupled” and modifications thereof refer accordingly to a direct or indirect, in particular mechanical, force coupling between at least two bodies, such as the deflection element or the support structure on the one hand and a spring on the other.

A “vibration axis” or equivalently “axis” within the meaning of the invention is to be understood in particular as an axis of rotation (rotational axis) of a rotational movement. It is a straight line that defines or describes a rotation or rotation.

A "Lissajous projection" within the meaning of the invention is to be understood in particular as a scanning of an observation field with the aid of electromagnetic radiation, which is deflected by at least two mutually orthogonal and at least essentially sinusoidal oscillations (oscillations) of the radiation into the observation field Deflection element is effected.

A Euclidean "auxiliary level" is, following the usual usage in mathematics, to be understood in particular as a Euclidean level in three-dimensional space that is not, at least not necessarily, material (e.g. by corresponding flat surfaces of a real body) must be realized, but is usually only defined as an abstract (virtual) mathematical tool, in particular for solving or describing a geometric problem or state.

As used herein, the terms "comprises," "includes," "includes," "has," "has," "having," or any other variant thereof, as appropriate, are intended to cover non-exclusive inclusion. For example, a method or apparatus that includes or has a list of elements is not necessarily limited to those elements, but may include other elements that are not expressly listed or that are inherent in such method or apparatus.

Further, unless expressly stated to the contrary, "or" refers to an inclusive or and not to an exclusive "or". For example, a condition A or B is satisfied by one of the following conditions: A is true (or present) and B is false (or absent), A is false (or absent) and B is true (or present), and both A and B are true (or present).

As used herein, the terms "a" or "an" are defined to mean "one or more". The terms "another" and "another" and any other variant thereof shall be construed to mean "at least one other".

The term "plurality" as used herein means "two or more".

In the context of the invention, "configured" or "configuration" or modifications of these terms is to be understood as meaning that the corresponding device is already set up or can be set - i.e. can be configured - to fulfill a specific function. The configuration can take place, for example, via a corresponding setting of parameters of a process flow or of hardware or software-implemented switches or the like for activating or deactivating functionalities or settings. In particular, the device can have a plurality of predetermined configurations or operating modes, so that the configuration can be carried out by selecting one of these configurations or operating modes.

In the case of the microscanner according to the first aspect, the (first) springs on which the deflection element, which is designed in particular as a mirror plate or can have one, are suspended, consequently extend differently than in the case of the FIG solutions known from the prior art are not directed outwards from the deflection element towards a chip frame. Instead, they extend inwardly towards their respective, correspondingly positioned attachment point on the spring carrier element, which thus provides a central, but not necessarily central, suspension of the first springs and thus indirectly also of the deflection element.

In particular, this enables a lower mass moment of inertia of the oscillating parts, i.e. the deflection element in combination with the springs, and as a result large scan angles and/or high scan frequencies for both axes, a compact design and, as a result, usually lower manufacturing costs and/or lower spring stress lower hubs. In addition, the inwardly directed (first) springs make it possible to reduce or even avoid oscillating movements, which lead to nonlinear spring operating ranges with regard to spring bending or torsion, due to the lower maximum deflections required, which is advantageous for the component performance. Areas of application for such microscanners can be in particular: augmented and virtual reality glasses displays, head-up displays, pico projectors, cinema projectors, laser TV, 3D cameras, LIDAR sensors, gesture recognition systems, hyperspectral cameras , photoresist imagesetters, laser material processing systems, radar scanners, OCT scanners (OCT = optical coherence tomography).

Preferred embodiments of the microscanner according to the first aspect are described below, which can be combined with one another as desired, unless this is expressly excluded or they are mutually exclusive. In some embodiments, the deflection element has rotational symmetry in its rest position with respect to a (first) axis of symmetry and is arranged such that the (first) axis of symmetry runs through the spatial area spanned by the spring support structure. The rotational symmetry can in particular be n-fold (n=2, 3, 4, . . . ) or even circular symmetry. In particular, the spring support structure as a whole, a section of the spring support structure containing the starting points of the first springs or the arrangement of the starting points of the first springs can also have rotational symmetry with respect to a second axis of symmetry and be arranged such that the first and second axes of symmetry coincide. What all of these embodiments have in common is that they have, at least essentially, a central suspension of the deflection element on a centrally arranged spring support structure, which in particular promotes a correspondingly rotationally symmetrical mirror movement. In particular, it is possible to select the first springs of the same length or even in total or in pairs of the same type and thus to enable a suspension that is approximately symmetrical at least with respect to one direction and thus a symmetrical movement. This can also result in advantages with regard to a particularly simple structure due to the symmetry and a correspondingly simplified adjustment. The term "spanned spatial area" (or linguistic modifications thereof) is to be understood in such a way that the "spatial area spanned" by the spring support structure includes all spatial points that lie on any stretch spanned by any two points as an intermediate rectilinear connection, with these spanning points are each on the surface or inside the spring support structure itself. All of these points that “spann” the spatial area as a whole also belong to the spanned spatial area. For example, the spatial area spanned by a cylindrical tube contains, in addition to the spatial area occupied by the material tube itself, also the cavity enclosed by the tubular cylinder wall inside the tube.

In some embodiments, the N first springs each attach to the support structure solely at the spring support structure and the deflection element is suspended solely from these first springs. In this way, particularly small designs can be achieved. Since only the first springs are provided here for the suspension of the deflection element, a particularly low mass moment of inertia and/or high scanning speeds and large scanning angles resulting therefrom can also be achieved. The previously mentioned advantage that the vibrations of the deflection element are less strongly influenced by potential non-linearities of the springs, which typically occur in particular in the case of large deflections, can be used to advantage here.

In some embodiments, the deflection element comprises a deflection plate (micromirror, mirror plate) with a recess formed therein. Due to the recess, the mass moment of inertia of the deflection plate can be further reduced in this way. Accordingly, the springs can be designed to be lighter or slimmer, which also results in advantages in terms of weight, Design size and scanning speed can be achieved. In this regard, designs for the deflection plate with a rotational symmetry (eg n-fold or circularly symmetrical) are particularly advantageous. In particular, the deflection plate can have a rotationally symmetrical ring shape, such as a circular ring shape, in which the interior of the ring lying outside of the deflection element body forms the recess.

In some of these embodiments, at least one, or in particular all, of the first springs runs at least in sections within the cutout. This allows particularly space-saving implementations of the microscanner. In particular, particularly flat implementations can also be achieved in this way, especially when all the springs run within the recess and the deflection plate and the springs lie essentially in a common plane (more precisely: in a “plate-shaped” spatial area of low thickness).

In some of the embodiments with a recess in the deflection plate, the microscanner also has optics for converting incident electromagnetic radiation into an emerging electromagnetic beam directed at the deflection element, the radial intensity profile of which occurs when it strikes the deflection element in such a way that a radial intensity maximum of the beam surrounds the recess on two opposite sides of the recess, in particular annularly.

In particular, the optics can have an axicon. Axicons are conical lenses that produce an annular radial beam profile. Ring mirrors in particular can be used particularly advantageously for laser projection tasks if an incident laser beam with a round, in particular circular, beam profile is first converted into a ring-shaped beam with the aid of a refracting, diffracting or reflecting axicon mirror plate falls and is also deflected biaxially as a ring-shaped beam. If you choose focusing optics in combination with the axicon and the ring mirror in such a way that the ring-shaped beams meet each other in a focus, then the beams can even interfere, which in the case of Bessel beams has the advantage of small focus diameters and a very high achievable optical Allow resolution of the projecting system.

In some embodiments, at least one of the N first springs is shaped in such a way, in particular in the form of an arc, that in its rest position its effective spring length between the deflection element and the spring support structure is greater than the minimum occurring distance between one, in particular each, of their coupling points on the deflection element on the one hand and one, in particular each, of their attachment points on the spring support structure on the other hand. In particular, multi-leg suspensions with a large spring deflection (stroke) and thus large deflections and thus in turn large observation fields can be achieved. In particular, the arrangement of the first springs can have a spiral shape (in particular similar to the spiral shape of a spiral galaxy).

In some embodiments, the spring device has exactly N=2 first springs, which together form a bipod suspension of the deflection element on the

Form spring support structure. In particular, the arrangement of the two springs can again have a rotational symmetry. In addition to the particularly simple structure, the use of exactly two springs has the advantage that the precise positions and scanning frequencies (vibration frequencies) of the first and second vibration axes can be predetermined in a particularly simple and precise manner. In addition, right-angled observation fields can be realized particularly well with symmetrical bipod mounts, in particular with symmetrical bipod mounts.

In some alternative embodiments, however, the spring device has N=4 first springs, these four first springs together forming a cross-shaped, in particular orthogonal, suspension of the deflection element on the spring support structure. Here, too, a relatively simple structure and an easy and precise determinability of the positions and scanning frequencies of the first and second

Vibration axes an advantage.

In some variants of these embodiments, any two of the (first) springs arranged in the shape of a cross, which can in particular be two of the four first springs located opposite one another within the framework of the cross-shaped suspension, form a respective spring pair of springs of the same spring stiffness, while the respective Distinguish spring stiffness for the first springs of the two pairs of springs. In this way, different scanning frequencies for the first axis of vibration on the one hand and the second axis of vibration on the other hand can be implemented particularly easily, in particular in the case of a rotationally symmetrical suspension.

In some embodiments, the support structure also has a support structure surrounding the deflection element at least on two sides and with respect to the first and second rotational oscillations of the deflection element, on which the deflection element is additionally suspended by means of a number M of second springs, where M>1 applies. The deflection element is thus suspended on the one hand by means of the N first springs on the spring support structure and on the other hand by means of the M second springs on the frame structure. In particular, M can be equal to N (M=N).

In particular, these embodiments can facilitate a further differentiation of the different effective spring stiffnesses for the first and second axis of vibration and thus of their respective scanning frequency and their maintenance during the scanning process. The combination of the first and second springs makes it possible in particular to increase the effective overall stiffness of the spring suspension with respect to the affected axis of vibration while maintaining operation in the linear range and thus in particular to achieve even higher scanning frequencies on this axis of vibration. It is also advantageously possible, in particular, to choose the stiffness of the second springs to be lower than that of the first springs. In particular, it is necessary to maintain a certain frequency spacing between the scanning frequencies of the two vibration axes in order to achieve rectangular illumination, i.e. H. to be able to realize an, in particular approximately homogeneous, illumination of projection fields which are rectangular when viewed in cross-section relative to the optical axis. Despite the additional frame structure and the second springs, particularly small designs can be realized because the second springs can be shorter and/or less stiff than in the known solutions from the prior art.

In some of these embodiments, the suspension of the deflection element on the spring support structure by means of the N first springs defines the first axis of oscillation and the suspension of the deflection element by means of the M second springs on the frame structure defines the second axis of oscillation, at least predominantly in each case. The spring rigidities and thus the scanning frequencies for each of the two axes can be set or defined particularly easily by appropriate selection of the respective spring properties of the first springs on the one hand and the second springs on the other hand. In addition, it is particularly easy to implement axis-specific drives with one or more separate, assigned actuators per axis. The same applies to sensors for determining the position of the deflection element. In some embodiments, N > 2 and the deflection element extends between the respective coupling points of the N first springs such that it at least partially bridges the spring support structure. The coupling points can in particular also be end points of the respective springs. In this way, particularly compact designs of the microscanner and a particularly favorable (ie large) ratio of the available mirror area (for reflecting electromagnetic radiation) to the total area (in particular chip area) of the microscanner can be achieved. In particular, the deflection element can also be designed without a recess, since it is not necessary to accommodate the springs in the recess in order to achieve a compact design.

In some of these embodiments, the deflection element has a substrate designed as a deflection plate for deflecting the incident electromagnetic beam, which is connected by means of at least one bonded connection to one or more of the first springs or to an intermediate body arranged between one or more of the first springs on the one hand and the deflection plate on the other hand is. This has the advantage that during manufacture the deflection plate is manufactured separately from the substrate used to manufacture the first springs and, if applicable, the intermediate body, and can only subsequently be coupled to the spring suspension by means of the bonded connection. In particular, the bond connection can be: (i) an anodically produced bond connection, which is particularly suitable if glass and silicon can be connected to one another; (ii) a eutectic bond (e.g. Au-Au); (iii) a thermocompression bond; (iv) an immediate (direct) bond connection, in particular a laser-assisted direct bond connection; or (v) a glass frit bond, especially for large mirror diameters.

In some of the aforementioned embodiments with a frame structure and a deflection element bridging the spring support structure, the spring device also has a number K of third springs, where K>1 applies. In this case, every third spring is coupled on the one hand to the respective coupling point of an associated first spring or optionally to the intermediate body and on the other hand to the frame structure. In particular, the cases K=M and/or K=N are possible. The suspension of the deflection element on the frame structure is thus achieved on the one hand by the second springs and on the other hand by the third springs. In this way, in particular, an even further increase in the effective spring stiffness for the first and second vibration axis can be achieved, in particular for operation in Hook's (linear) range. Also, these embodiments expand the available design freedom and Configuration options when designing the microscanner due to the additional degrees of freedom (e.g. number, type and position of the additional third springs) even further. In addition, variants are possible in which the second springs are omitted and in particular those in which only the first and the third springs form the spring device.

In some embodiments, the microscanner also has an encapsulation, by means of which at least the deflection element and the springs of the spring device are encapsulated in a hermetically sealed manner such that the deflection element in the encapsulation is capable of performing the oscillations and is oscillatingly suspended on the spring device. The encapsulation has an encapsulation section bridging the deflection element, through which the radiation to be deflected can be radiated into the spatial region encapsulated by the encapsulation and can be emitted again therefrom after it has been deflected at the deflection element. The encapsulation or the capsule section can in particular consist of a glass material or contain such a material which is relevant for the use of the microscanner

Spectral range for electromagnetic radiation is at least predominantly, preferably largely, transparent.

The use of such an encapsulation makes it possible in particular to reduce the pressure in the hermetically sealed, encapsulated spatial area, in particular to evacuate this spatial area in order to reduce or even largely eliminate gas friction losses, in particular air friction losses, or other disturbances in the oscillations of the deflection element. This is particularly advantageous when using the microscanner for Lissajous display applications when the deflection element and its spring suspension are not operated in ambient air but at reduced pressure, especially in a vacuum, because this reduces the friction losses due to the air damping in a very efficient manner can be circumvented and as a result the microscanner can, for example, achieve vibration amplitudes that are up to 100 times greater than in air at atmospheric pressure. Accordingly, the achievable optical resolution can also be correspondingly increased, for example by a factor of up to 100, in one or each of the first and second vibration axes.

In some of these embodiments, the capsule portion has a dome (dome) shape, a planar shape, or a right-angle U-shaped cross-section. The dome-shaped shape has the particular advantage that incident and emerging electromagnetic radiation, especially laser beams, through the Wiring hardly be distracted. Insofar as incident beams are reflected on the dome-shaped capsule section, this usually takes place in a different direction than the direction of the emerging beam reflected on the deflection element, so that unwanted interactions or superimposition of the beams can be effectively avoided here. The planar shape and the cross-sectionally U-shaped shape, on the other hand, are distinguished in each case by their particularly simple manufacturability and handling during production of the microscanner. The rectangular U-shaped cross-section can also offer the advantage that any intermediate layers (spacer layers) that would otherwise be required in the substructure of the encapsulation for the formation of a spatial area enclosed by the encapsulation that is large enough for the movement of the deflection element are avoided or in number or Thickness can be reduced.

In some of these embodiments with encapsulation, the capsule section is mounted on a first layer stack that contains a first layer sequence that corresponds to a second layer sequence of a second layer stack in terms of the order, the material and/or the thickness of the individual layers of the first layer sequence which the combination of the deflection element, the spring means (at least the first springs) and the spring support structure is manufactured. This allows a particularly efficient manufacturing process, since the first layer stack and the second layer stack can be manufactured as sections of a single common layer stack and can only receive their respective form and associated functionality as part of the structuring of the common layer stack.

In some embodiments, the quality factor, ie Q-factor, of the microscanner with regard to at least one of the two oscillations is at least 1000. This can be done in particular in connection with embodiments with an encapsulation, in particular with a gas pressure or vacuum within the encapsulated by the encapsulation that is reduced compared to the atmospheric pressure can be achieved indoors. In this way, in particular, a further improvement in performance can be achieved. In some embodiments, the microscanner further includes: (i) a support substrate supporting the cantilever structure; and (ii) an actuator for driving the first oscillation and/or the second oscillation of the deflection element. In this case, the actuator is mechanically coupled to the carrier substrate in order to mechanically act on it during operation of the microscanner and thereby indirectly drive the deflection element at least via the spring carrier structure and the first springs for driving its first and/or second oscillations. In particular, these embodiments make it possible to dispense with actuators specific to the oscillation axis for driving the oscillations of the microscanner and thus to design the oscillatable components or sections of the microscanner (deflection element, springs) as purely passive components, which then in particular do not require any power or signal supply.

In some of these embodiments, the actuator is arranged so adjacent to a cavity in the carrier substrate or another substrate connected to the actuator, in particular a carrier or base substrate of the microscanner, that during its operation it at least partially moves into the cavity can execute. In this way, particularly space-saving, compact designs can be implemented while maintaining a high effective drive power of the actuator with respect to the deflection element and large possible deflections. In some of the aforementioned embodiments with an actuator, the latter is also designed as a sensor device for detecting the instantaneous position of the deflection element using sensors, or as part of such a sensor device. In particular, the actuator can have a piezoelectric actuator, which also serves as an electrode of a sensor arrangement based on electrical capacitance measurement.

In some embodiments, one or more actuators or sensors are provided on the spring support structure or the spring device, which are connected to one or more signal or power supply lines, which run at least in sections through one or more openings (channels) provided in the spring support structure.

In some embodiments, the microscanner is configured such that the frequency ratio of the resonant frequency T with respect to the faster of the two vibration axes to the resonant frequency f2 with respect to the slower of the two vibration axes is: fi/f2 = F + v, where F is a natural number (F = 1,2,3,...) and for the detuning v the following applies: v = (T-f2)/f2 with (f 1 -f2) < 200 Hz, where v is not an integer. In some embodiments, the microscanner has an actuator system with one or more actuators for driving the first and second oscillations, the actuator system being configured such that it can set the deflection element into a double-resonant oscillation with respect to the first and second oscillation axis. The actuator system can in particular have or consist of one or more of the actuators described in the previous embodiments.

In some of these embodiments, the actuator system is configured in such a way that it can cause the deflection element to oscillate simultaneously with respect to the first and second axis of oscillation in such a way that the frequency ratio of the oscillation frequency fi with respect to the faster of the two axes of oscillation to the oscillation frequency f2 with respect to the slower of the two axes of oscillation applies : fi/f2 = F + v, where F is a natural number (F = 1,2,3,...) and for the detuning v applies: v = (fi-f2)/f2 with (f 1 -f2 ) < 200 Hz, where v is not an integer. The result here is a frequency ratio fi/f2 close to 1, 2, 3 or 4, etc. In the above cases, the detuning v can be achieved with detuning v in particular in such a way that only one of the two oscillation frequencies or both each of the respective resonant frequency to the associated vibration axis differs or differ. The detuning v compared to an integer frequency ratio plays a major role, because this detuning of the frequency determines how fast the Lissajous trajectory moves spatially. With an integer ratio, the detuning is equal to zero and the trajectory is stationary and reproduces itself in this form constantly. In the case of a non-integer detuning v > 0, on the other hand, the trajectory begins to wander, and within a certain interval the faster the larger the detuning v is compared to the integer ratio. The speed at which the trajectory moves can advantageously be chosen so that a certain trajectory repetition rate (complete phase cycles/time), for example from the frequency range from 30 Hz to 100 Hz, is set with which the trajectory is reproduced or under ideal undisturbed conditions conditions reproduced. (As an explanation: Exact reproduction is often not possible, especially when using phase-locked loops or other control loops. Nevertheless, the advantages of a favorably selected detuning and an associated favorable rate of advance of the trajectory remain). On the basis of a detuning v selected in this way, it is also possible in particular to achieve an improved line density, ie an increased line density at least on average over time. A second aspect of the invention relates to a method for producing a microscanner according to the first aspect. The method has the following steps or processes: (i) providing a plate-shaped substrate, in particular a semiconductor substrate, with two opposite main surfaces; (ii) structuring the substrate from a first of the main surfaces to at least partially form the deflection element, the support structure and the spring device; (iii) Selective, at least partial exposure of the deflection element formed by means of the structuring and the spring device from the other main surface; and (iv) fastening the microscanner arrangement resulting from the exposure to a carrier substrate.

In particular in the case of a semiconductor substrate, the structuring and exposure can take place using known MEMS production technologies, in particular semiconductor chip production technologies, using (photo)lithography in conjunction with a suitable etching process.

In some embodiments, the method can also have at least one of the following steps or processes: (v) applying a reflective layer to a surface section provided for forming the deflection element on a main side of the substrate, in particular on the first main side; (vi) hermetically encapsulating the microscanner assembly mounted on the carrier substrate by means of an encapsulation; (vii) bonding of at least two adjacent substrates within a layer stack used to build up the microscanner by means of an anodic, eutectic or direct bonding method or a thermocompression method; (viii) Creation of one or more actuators or sensors on the spring support structure or the spring device and creation of one or more signal or power supply lines, which run at least in sections through one or more openings provided in the spring support structure and to which the actuators or sensors are connected. The sequence of processes (v) to (viii) specified here is not to be understood as a mandatory actual process sequence. Rather, the individual processes, if any, can be implemented in a different order. For example, it is appropriate to run process (v) before process (i) and process (viii) before process (vi). Further advantages, features and application possibilities of the present invention result from the following detailed description in connection with the figures.

1 shows a schematic plan view of a two-axis, gimballed (i.e. with a gimbal) suspended micromirror with comb drives according to a microscanner architecture known from EP 2 514211 B1;

2 shows a schematic top view of a two-axis micromirror suspended without gimballs according to a first microscanner architecture known from US Pat. No. 8,711,456 B2;

3 shows a schematic top view of a further two-axis micromirror suspended without gimballs according to a second microscanner architecture known from US Pat. No. 8,711,456 B2;

4 shows a schematic top view of yet another two-axis micromirror suspended without gimballs according to a third microscanner architecture known from US Pat. No. 8,711,456 B2;

5 schematically shows a microscanner according to a first embodiment of the invention;

FIG. 5A shows a schematic of a variant of the microscanner from FIG. 5, in which, in particular, the first springs do not run along the auxiliary plane;

6 shows a microscanner according to a further embodiment of the invention, in which in particular a single first spring is provided;

7 shows a microscanner according to a further embodiment of the invention, in which, in particular, a plurality of first springs with an increased spring length and applied actuator are provided;

8 shows a microscanner according to a further embodiment of the invention, in which, in particular, a tripod suspension made of first springs in a spiral form is provided; 9 shows a microscanner according to a further embodiment of the invention, in which in particular a bipod suspension made of first springs in spiral form is provided;

10 shows a microscanner according to a further embodiment of the invention, in which in particular two crossed pairs of springs made up of first springs are provided, with the spring stiffnesses of the two pairs of springs differing;

11 shows a microscanner according to a further embodiment of the invention, in which in particular an outer frame and second springs running between the frame and the deflection element are additionally provided; 12 shows a microscanner according to a further embodiment of the invention, in which in particular the first springs at least predominantly define the spring stiffness for a first axis of vibration and the second springs at least predominantly define the spring stiffness for a second, orthogonal axis of vibration;

13 shows a microscanner according to a further embodiment of the invention, in which the deflection element is designed as a separate substrate bridging the first springs;

FIG. 13A shows the microscanner of FIG. 13 at a point in time during its operation;

14 shows a microscanner according to a further embodiment of the invention, in which in particular a further outer frame and third springs running between this further frame and the deflection element bridging the first springs are additionally provided;

FIG. 14A shows the microscanner of FIG. 14 at a point in time during its operation;

15 shows a microscanner according to a further embodiment of the invention, in which in particular an encapsulation formed by means of a dome-shaped capsule section is provided;

16 shows a microscanner according to a further embodiment of the invention, in which one or more cavities are provided in particular in the carrier substrate to enlarge the spatial area available for the oscillations of the deflection element; 17 shows a microscanner according to a further embodiment of the invention, in which an additional support structure is provided as a spacer in the layer structure carrying the capsule section, in particular to further increase the spatial area available for the oscillations of the deflection element; 18 shows a microscanner according to a further embodiment of the invention, in which in particular an encapsulation formed by means of a planar capsule section is provided;

19 to 23 each show a microscanner according to further embodiments of the invention, in which in particular an encapsulation designed by means of a capsule section with a U-shaped cross section and a planar cover plate is provided;

24 shows a microscanner according to a further embodiment of the invention, in which, in particular, on the main side of the

carrier substrate, an actuator mounted on a further substrate for driving the microscanner and a cavity adjacent to the actuator are provided in the further substrate;

25 shows a microscanner according to a further embodiment of the invention, in which, in particular, on the main side of the

carrier substrate, an actuator fastened on a further substrate for driving the microscanner and a cavity adjacent to the actuator are provided in the carrier substrate;

26 shows a microscanner according to a further embodiment of the invention, in which, in particular, on the main side of the

carrier substrate, an actuator mounted on a further substrate for driving the microscanner and a cavity adjacent to the actuator are provided in the carrier substrate, the cavity extending in sections beyond the end of the actuator;

Fig. 27 shows a microscanner according to a further embodiment of the invention, in which in particular one or more actuators within the by a

Capsule section encapsulated space area are provided; 28 shows a microscanner according to a further embodiment of the invention, in which the spring support structure also represents a drive device of the microscanner;

29 shows a microscanner according to a further embodiment of the invention, in which, in particular, optics are provided for beam splitting into a beam with a ring-shaped intensity profile;

30 shows a first embodiment of a method according to the invention for producing a microscanner; and

31 shows a second embodiment of a method according to the invention for producing a microscanner with electrical connections for electrical components, in particular actuators or sensors.

First of all, various microscanner architectures known from the prior art are briefly described below with reference to FIGS.

1 shows a schematic top view of a microscanner architecture 100 known from EP 2 514211 B1 with a two-axis (orthogonal vibration axes Ai and A2), cardanically suspended micromirror 105 (mirror plate). Electrostatic off-axis comb drives 110 and on-axis comb drives 115 are also shown, which can also be used as sensor electrodes. The mirror plate 105 is suspended in a movable frame 125 by internal torsion springs 120 , which is suspended in a fixed chip frame 135 by external torsion springs 130 . The frame 125 can be made to resonate by electrostatic comb drives 140, the representation of comb electrodes that are also present close to the axis for driving or sensor purposes of the movable frame 125 being omitted for the sake of clarity. The vibration axes A1 and A2 shown were added to the figure taken from EP 2 514 211 B1 (cf. FIG. 3 there) for better illustration, and the reference numbers were adapted. A further microscanner architecture 200 known from US Pat. No. 8,711,456 B2 is illustrated in a schematic plan view in FIG. 2, which represents a variant of the so-called “MiniFaros” type for a micromirror. The suspension is the Mirror plate 205 realized in the form of a tripod suspension by three arc springs 210, which are each connected at one of their respective ends 215 to the mirror plate 205 and at their respective other end 220 to the torsion-resistant, solid chip frame 225. In addition, each of the springs 210 is attached to a position rotated 120° from a corresponding position of the adjacent springs about the center of the mirror plate 205. Comb drives 230 are provided to drive mirror movement and act on the springs 210 to deflect them. Between the springs and the chip frame 225 and the mirror plate 205 there are clearances 235 which allow the springs 210 to oscillate. For better illustration of the figure taken from US Pat. No. 8,711,456 B2 (cf. FIG. 2 there), the reference numbers in FIG. 2 have been adapted and supplemented.

3 shows a schematic top view of another microscanner architecture 300 known from US Pat. No. 8,711,456 B2, which represents another variant of the “MiniFaros” type for a micromirror. The suspension of the mirror plate 305 is implemented in the form of a bipod suspension by two arc springs 310, which are each connected to the mirror plate 305 at one of their respective ends 315 and to the torsion-resistant, solid chip frame 325 at their respective other end 320. In addition, each of the springs 310 is attached to a position rotated 180° from the corresponding position of the other spring 310 about the center of the mirror plate 305 . Comb drives 330 are provided to drive mirror movement and act on the springs 210 to deflect them. Between the springs 310 and the chip frame 325 and the mirror plate 305 there are clearances 335 which allow the springs 310 to oscillate. For better illustration of the figure taken from US Pat. No. 8,711,456 B2 (cf. FIG. 3 there), the reference numbers have been adapted and supplemented.

A further microscanner architecture 400 known from US Pat. No. 8,711,456 B2, which represents a variant of the “KOLA” type for a micromirror, is illustrated in a schematic plan view in FIG. The suspension of the mirror plate 405 is implemented in the form of a two-leg suspension by a plurality of arc springs 410, in the example four, which are each connected at one of their respective ends 415 to the mirror plate 405 and at their respective other end 420 to the torsion-resistant, solid chip frame 425 . In addition, each of the springs 410 is mounted in a position rotated 90° about the center of the mirror plate 405 from a corresponding position of the neighboring springs. For better illustration of the figure taken from US Pat. No. 8,711,456 B2 (cf. FIG. 4 there), the reference numbers have been adapted and supplemented. All of these previously known microscanner architectures 100 to 400 have in common that the respective micromirror plate 105, 205, 305 or 405 is suspended exclusively from the outside by between an external torsion-resistant chip frame 125, 225, 325 or 425 and the micromirror plate 105, 205 , 305 and 405 running springs 110, 210, 310 and 410 takes place. Therefore, in none of these previously known microscanner architectures are there three points on the deflection element 105, 205, 305 or 405 that define a Euclidean auxiliary plane in its rest position and span a surface or straight line section enclosed by the connecting straight line between the three points in the auxiliary plane , on which each of the attachment points (e.g. 215, 315 or 415) of the springs, or its respective perpendicular projection onto the auxiliary plane, lies.

Consequently, the space or surface requirement of the microscanner 100, 200, 300 or 400 in the mirror plane is significantly higher than the space or surface requirement for the respective micromirror plate 105, 205, 305 or 405 itself medium and larger mirror diameters on the outside of the mirror plate carry out very large amplitudes from the chip level, which in order to achieve the performance goals mentioned require high stress values in the suspension and can therefore easily lead to overstressing of the material, especially the spring material. Various exemplary embodiments of microscanner architectures according to the invention are now explained below with reference to FIGS. Some of these figures each contain two sub-figures (A) and (B), with the respective sub-figure (A) being a top view and the respective associated sub-figure (B) (except for Figure 28) being a cross-sectional view perpendicular to the plane of the image and along the axis Ai of the represent the embodiment shown in the respective figure. The actuators 545, which are regularly used to drive the respective microscanner, are only shown in some of the figures, in particular when their position or shape is particularly relevant for the design of the respective microscanner.

5 shows a first exemplary embodiment 500 of a microscanner. Microscanner 500 has an annular mirror plate as deflection element 505, which is suspended via N=4 (first) springs 510—chosen here as an example—on a centrally arranged post that serves as spring support structure 515 and is supported by a support substrate 530, which in particular is a higher Has torsional and bending stiffness than the springs 510. The spring support structure 515 can already represent a complete support structure for the deflection element 505 here. Of the Post 515 has two different layers 515a and 515b, with layer 515a being fabricated from the same substrate as first springs 510 and mirror plate 505. Each of the (first) springs 510 extends between an associated attachment point 520 (each marked by a diamond). shown) on the spring support structure 515 on the one hand and an associated coupling point 525 (each marked by a small annulus) on the inner edge of the annular deflection element 505 ” in the deflection element 505. It can in particular be designed as a continuous opening or just as a depression.

Two of the faults 510 lying opposite one another with respect to the spring support structure 515 form a pair of springs, which in particular defines the direction and the oscillation frequency and thus the scanning frequency of an associated oscillation axis Ai or A2 of the deflection element 505 . In the example shown in Fig. 5, the two pairs of springs are arranged orthogonally to one another, so that when deflection element 505 is in the rest position, in which no significant other forces act on the deflection element apart from gravity and the spring forces of springs 510 and the latter is at rest, between an angle of, at least essentially, 90° occurs for every two adjacent springs. However, other arrangements of the springs 510 are also possible, in which instead other angles occur between respectively adjacent springs.

For a better explanation of the microscanner 500, three exemplary points 535a to 535c, each located on the deflection element 505, are also marked in subfigure (A) of FIG. 5 by means of felt black circles. The points 535a to 535c span an auxiliary plane H (cf. FIG. 5A for further explanation), which can in particular coincide with a surface of the deflection element 505 or in FIG. 5 with the plane of the drawing. In this auxiliary plane H, the points 535a to 535c also span a triangular surface D as a surface section on the auxiliary plane H by means of their respective straight connecting lines 540, which in each case connect two of the points. All attachment points 520 (or their perpendicular projections onto the auxiliary plane H) lie within this surface section D, so that the previously described central suspension of the deflection element 505 on the spring support structure 515 results. A different choice of three points 535a to 535c on the deflection element 505, which fulfill the aforementioned condition, is also possible. In particular, in the microscanner 500 the springs 510 (or their perpendicular projection onto the auxiliary plane H) extend here within the circular recess 505c in the deflection element 505, which defines its annular shape on the inside (or within its perpendicular projection onto the auxiliary plane H). While in Fig. 5 both the deflection element 505 and the post-shaped spring support structure 515 each have rotational symmetry, here even circular symmetry, and the spring support structure 515 is also arranged centrally relative to the deflection element 505, so that the respective symmetry axes of at least the deflection element 505 and the spring support structure 515 coincide, other variants are also possible without or with a different, in particular smaller, number of such symmetries.

The further embodiments of a microscanner described below are derived from the microscanner 500 from FIG. 5 by addition or modification, so that in the following only such differences will be discussed in detail, while otherwise reference is largely made to the previous description of FIG. In the figures from FIG. 5, the same reference numbers are used throughout for the same or corresponding elements of the various embodiments illustrated in these figures, so that repeated descriptions of identical or corresponding elements are usually unnecessary. Insofar as they are not mutually exclusive, two or more of the embodiments described below or their respective differentiating technical aspects (e.g. encapsulation, actuator arrangement, imaging optics, etc.) can also be combined.

Fig. 5A illustrates a schematic cross-sectional view of an embodiment related to the microscanner 500, in which the first springs 510, in particular their attachment points 520 on the spring support structure 515, are not in the auxiliary plane spanned by the three points 535a, b, c on the deflection element 505 H lie. In the present example, a Y-shaped arrangement of the combination of spring support structure 515 and the first springs 510 results in cross section instead Auxiliary plane H spanned surface section D, as shown in Fig. 5, sub-figure (A).

6 illustrates a further embodiment 600 of a microscanner, in which, in contrast to microscanner 500 from FIG. The single spring 510 in turn extends between an attachment point 520 on the spring support structure 515, which has two stacked layers 515a and 515b, and a coupling point 525 on the inside of the circular ring-shaped deflection element 505. The deflection element 505 has at least one of its ring surfaces on an additional mirror layer 505a as a reflection surface, which in particular as a deposited metal layer, for example aluminum or chromium. The spring 510 acts primarily as a bending spring with respect to the axis of oscillation Ai and primarily as a torsion spring with respect to the second axis of oscillation A2. An auxiliary plane H is in turn spanned by three points 535a to 535c and a triangular surface section D is spanned therein by the straight connecting lines 540 between the points 535a to 535c, in which the starting point 520 or its projection onto the auxiliary surface H (cf. Fig. 5A) located.

While no actuators for driving the oscillations of the deflection element were shown in FIG. 5 , two strip-shaped piezo actuators 545 placed on the spring 510 are shown in FIG. You can cause the spring 510 to oscillate two-dimensionally when the piezo actuators are activated accordingly, in order to cause simultaneous oscillations of the deflection element 505 around the first axis of oscillation Ai on the one hand and around the second axis of oscillation A2 on the other with assigned individual oscillation or scanning frequencies. This enables a Lissajous projection of an electromagnetic beam, in particular a light beam, falling on the deflection element 505, more precisely on its mirror surface 505a, into an observation field.

7 shows a further embodiment 700 of a microscanner that has a mirror suspension in which the deflection element 505 that has a ring mirror 505 is oriented inward and suspended from the spring support structure 515 with two spring legs that are initially separate in sections. Immediately before the two spring legs merge into the central post of the spring support structure 515, they combine to form a single (first) spring 510. The example particularly illustrates the possibility of using the central area (recess) in the center of the deflection element 505 efficiently for the spring suspensions can.

The possibility of being able to guide the springs around the central post 515 makes it possible, in particular, to realize relatively long and wide springs 510, which advantageously allow both high spring stiffness and thus high resonance frequencies, as well as large deflections at the same time, what for many display solutions is very beneficial. In this example, the two separate spring legs are each fitted with a piezo bending actuator 545, so that the springs 510 and thus also the deflection element 505 can be excited to oscillate. Each piezo bending actuator 545 has a layer stack made up of a piezoceramic layer 560 located between two electrodes 555 and 565 and is attached to the associated spring 510 by means of a suitable bonding material 550 .

In Figures 8 and 9, two further embodiments 800 and 900 of a microscanner are illustrated, in which, in contrast to microscanner 500 from Fig. 5, a plurality of spirally arranged (first) springs 510 for suspending the deflection element 505 on the spring support structure 515 carried by the support substrate 530 are provided. Microscanner 800 has a tripod suspension made up of three rotationally symmetrically arranged and similar (first) springs 510 , while microscanner 900 has a two-leg suspension made up of only two rotationally symmetrically arranged similar (first) springs 510 . Both embodiments 800 and 900 are characterized by spring lengths that are significantly longer than the respective straight-line distance between the respective attachment points 520 and coupling points 525 of the springs 510. This makes it particularly easier to move the springs in their linear (hook' schen) operating range when the microscanner 800 or 900 is in operation. The microscanner 900 also has the advantage that the exact positions of the vibration axes A1 and A2 can be easily determined in advance and they are essentially independent of the vibration frequencies used.

FIG. 10 shows a further embodiment 1000 of a microscanner, which largely corresponds to the microscanner 500 from FIG. 5, but differs therefrom in that one of the two spring pairs, here for example the spring pair 510b, has a different spring stiffness than the other spring pair 510a. The two springs of each pair of springs 510a and 510b, on the other hand, are preferably the same with regard to their spring stiffness, in particular overall. In this embodiment, different oscillation or scanning frequencies for the two axes A1 and A2 can be defined particularly easily by means of targeted selection of the different spring stiffnesses, without the design of the scanner beyond the springs 510a and 510b necessarily having to be modified.

FIG. 11 shows a further embodiment 1100 of a microscanner, which has emerged from the microscanner 1000 from FIG. 10 in that, as an additional Element of the support structure, a frame structure is provided with a (first) rigid outer frame 575, on which the deflection element 505 is additionally, in particular - suspended along a vibration axis A1, with second springs 570 - as shown here. The (first) outer frame 575 can in particular be carried by a support structure 580 which is made from the same substrate as the layer 515b of the spring support structure 515. This embodiment 1100 in particular allows a further differentiation of the available spring rigidities and thus scanning frequencies. This is relevant in particular with regard to a right-angled illumination of the observation field, where it is particularly important that a set frequency spacing between the scanning frequencies of the two vibration axes A1 and A2 is maintained during operation of the microscanner.

Compared to the microscanners known from the prior art with mirror suspensions exclusively on an outer frame, smaller designs can be implemented for the microscanner 1100 despite the (first) outer frame 575 also being present here, since the linearity requirements and requirements for high spring stiffness are already largely met can be realized by the internal first springs 510. The second springs 570 can thus be selected to be shorter and do not always have to be operated in the linear range themselves in order to still enable reliable and high-frequency operation of the microscanner. Rather, the spring effects of the first springs 510a and the second springs 570 complement each other to form a combined spring effect, in particular when the springs 510a and 570, as shown here, run essentially along the same direction, in particular the axis of oscillation, so that the resulting effective spring properties continue to be predominantly determined by the inner first springs 510a, but are also influenced by the spring properties of the outer second springs 570. This allows in particular an increase in design freedom compared to a solution with only first springs 510a, b. Fig. 12 shows a further embodiment 1200 of a microscanner, which has emerged from the microscanner 1100 from Fig. 11 in that, on the one hand, instead of the first springs 510a and 510b of the microscanner 1100 arranged in the form of a cross, N=4 first springs 510 are now provided , which are arranged in two pairs of springs running side by side, the pairs of springs running essentially along a first of the two axes of vibration, here the axis A2. Similarly, the second springs 570 of the micro scanner 1100 are at micro scanner 1200 replaced by two pairs of springs, which run side by side at least substantially along the other of the two axes of vibration, here the axis Ai. The pairs of springs from the first springs 510 thus run, at least approximately, orthogonally to the pairs of springs from the second springs 570. Instead of the arrangement of the pairs of springs shown here, non-parallel arrangements of the pairs of springs of the first springs 510 or the pairs of springs of the second springs 570 are also conceivable , The respective arrangement is preferably designed in such a way that the respective assigned axis of vibration represents an axis of symmetry for the arrangement of the first springs 510 and the second springs 570. With microscanner 1200, it is particularly possible, as illustrated, to provide separate actuators or actuator groups 545a and 545b for driving the two vibration axes Ai and A2, so that each vibration axis can be controlled individually in a particularly simple manner.

Fig. 13 shows a further embodiment 1300 of a microscanner, which has emerged from the microscanner 1100 from Fig. 11 in that instead of a ring-shaped deflection element 505, which is arranged in the microscanner 1100 in the same layer as the first springs 510 and the second springs 570 , a separate mirror plate is provided as a deflection element 515 in a further layer parallel thereto. The mirror plate 515 can in particular have the shape of a circular area or another shape without cutouts. It is preferably separated from the first springs 510 by at least one intermediate layer 505b, so that the first springs 510 have sufficient space available for their oscillations without hitting the mirror plate 505 in the process. The intermediate layer 505b can in particular be regarded as a component of the deflection element 515 and can rest on a fastening section 585 provided between the first springs 510 and the second springs 570 .

The microscanner 1300 is characterized in particular by a further compact form factor, in which the size ratio of its reflection surface to the overall surface of the microscanner can be designed particularly favourably. The various layers of this microscanner architecture can in particular each be provided by a semiconductor wafer or another substrate, in which case the various structured substrates can then be connected in particular by means of one or more bond connections to form the microscanner architecture. FIG. 13A shows the same embodiment 1300 of a microscanner again, however, in particular in partial figure (B), during its operation, so that the different spring designs that occur can be seen. In particular, it can be seen that, according to preferred variants, the spring stiffness of the first springs 510 can be higher than that of the second springs 570.

Fig. 14 shows a further embodiment 1400 of a micro-scanner, which has emerged from the micro-scanner 1300 of FIG further (second) outer frame 595 of the frame structure, which can be fastened in particular via an intermediate element 590 in an intermediate layer on the (first) outer frame 575. The third springs 605 preferably run parallel to the second springs 570, at least when the microscanner 1400 is in the rest position, although this does not necessarily have to be the case. In particular, the addition of the third springs 605 enables an even further increase in the overall spring stiffness of the suspension of the deflection element 505 caused by the combination of the first, second and third springs, in particular in the linear spring range, and also enables even greater design freedom when designing the microscanner. This can be used in particular to generate a wide variety of effective total spring stiffnesses through the combination of the different springs 510, 570 and 605 and thus in particular the high scanning frequencies above, as a rule, at least 20 kHz, often up to 100 kHz and above, which are desired for many applications. for the microscanner 1400 to achieve. In some variants—not shown here—the second springs 570 can also be omitted in favor of the third springs 605 (cf. FIG. 19).

FIG. 14A shows the same embodiment 1400 of a microscanner again, however, in particular in sub-figure (B), during its operation, so that the different spring designs that occur can be seen. In particular, it can be seen that, according to preferred variants, the spring stiffness of the first springs 510 can be higher than that of the second springs 570 and the third springs 605.

Fig. 15 shows a further embodiment 1500 of a microscanner, which has emerged from the microscanner 1400 from Fig. 14 in that a dome or dome-shaped capsule component 610 (“capsule section”) is additionally placed on the second outer frame 595 and a hermetically sealed encapsulation was generated. The encapsulation encloses an evacuated spatial area 615 in which the deflection element 505 suspended resiliently on the support structure is located and can carry out its oscillations almost without air friction due to the evacuation. The capsule section 610 is largely transparent, at least in sections, to incident electromagnetic radiation in a wavelength range corresponding to the desired working range of the microscanner 1500 and can in particular have a glass material or be formed entirely from it. In this way, incident electromagnetic rays Li can reach the deflection element 505 essentially undisturbed and, due to the dome shape of the capsule section 610, also with only slight deflections, through the capsule section 610 and can be converted there in terms of optical imaging by reflection at the deflection element 505 into corresponding emerging rays l_2 , which in turn can leave the microscanner 1500 through the capsule section 610 in the direction of the desired field of view. FIG. 16 shows a further embodiment 1600 of a microscanner, which has emerged from the microscanner 500 from FIG , without hitting the carrier substrate 530 to perform particularly large oscillation amplitudes (deflections) within the scope of the oscillations. For this purpose, the capsule section 610 can be placed in particular on a base that is formed from the same layers as a stack of layers as the stack of layers consisting of layer 515b of the spring support structure 515 on the one hand and the layer on the other hand which comprises the layer section 515a of the spring support structure 515, the deflection element 505 and the first springs 510 includes.

Fig. 17 shows a further embodiment 1700 of a microscanner, which emerged from the microscanner 1600 from Fig. 16 in that - in particular with the purpose of further increasing the free space available for the oscillations of the deflection element in the spatial region 615 below the capsule section 610 - another intermediate layer 625 was produced. The intermediate layer 625 can in particular be arranged between the carrier substrate 530 and the layer 515b of the spring carrier element 515 or the support structure 580 .

Instead of a dome-shaped encapsulation, other capsule shapes are also possible, in particular planar lids. Various embodiments 1800 to 2300 of a microscanner with a planar cover as a capsule section 610 are shown in FIGS 23 in combination with various of the embodiments 500 to 1400 already explained above.

In the embodiment 1800 of Figure 18, the planar lid 610 consists solely of a planar plate, such as a glass plate. In order to create sufficient freedom of movement for the oscillating part of the deflection element 505, a further spacer layer 630 is provided between the cover 610 and the further outer frame 595.

Further embodiments 1900 to 2300 from Figures 19 to 23 with different suspensions differ from embodiment 1800 in particular in that instead of the spacer layer 630, which can thus be omitted, the capsule section 610 itself has a corresponding support ring 610a in addition to a planar cover plate, in particular in integral formation with the planar top panel. In the case of a circular cover plate, the support ring 610a can in particular have the shape of a circular ring. A “U” shape of the capsule section 610 including its support ring 610a thus results in cross section. Further embodiments 2400 to 2600 from Figures 24 to 26 differ from the embodiment 2300 in particular in that on the main side of the carrier substrate 530 facing away from the deflection element 505 (in the figures: lower side) there is an actuator (e.g. piezo actuator) 545, in particular a plate-shaped one Driving the oscillations of the deflection element 505 is arranged, which in turn is preferably attached at least in places to an additional base substrate 625. The actuator 545 can in particular be controlled simultaneously with the respective resonant frequencies of the two vibration axes Ai and A2 in order to operate the microscanner as a Lissajous scanner. This arrangement has the particular advantage that the actuator can be arranged separately from the oscillating parts, in particular the springs and the spring suspension, and in the case of encapsulated microscanners even outside of the encapsulated spatial area 615, which in particular facilitates its electrical contacting for signal and power supply . The oscillating parts, in particular the deflection element 505 and the springs of the microscanner and their supporting structure, can thus be designed to be purely passive.

On at least one main side of the actuator 545, it is surrounded at least in sections by a cavity 630, which offers it free space to carry out its movements, in particular vibrations or oscillations. In the case of the embodiment 2400 from FIG. 24, this cavity 630 is a recess in the Socket substrate 625 is formed and lies between the carrier substrate 530 and the actuator 545. In the embodiment 2500 from FIG. In both embodiments 2400 and 2500, the actuator 545 is fixed on both sides of the cavity 630 by the layer stack between the substrates 530 and 625. In the embodiment 2600 from FIG. 26, which is derived from the embodiment 2500, an end area of the actuator 545 is not enclosed by the substrates 530 and 625, so that during its operation vibrations in the form of tilting movements affect the overlying microscanner structure with the can be transmitted to vibrating parts.

The embodiments 2400 to 2600, which are illustrated here as an example with the microscanner architecture according to the embodiment 2300, can also be easily combined in particular with other embodiments, such as those that have no further actuators for driving the deflection element 505, and those that have an outer frame 575 or 595 or a dome-shaped or other shaped encapsulation.

A further embodiment 2700 from Fig. 27 differs from the embodiment 2300 in particular in that one or more actuators 545 for driving the microscanner 2700 on the side of the carrier substrate 530 facing the deflection element 605 and thus, if an encapsulation is present, within the encapsulated Space area 615 are arranged. This arrangement can be used in particular to use the actuator(s) 545 at the same time as a sensor or part thereof (in particular as an electrode for a capacitive measurement), in which case the sensor can be provided in particular for determining a current position of the deflection element 505 .

FIG. 28 shows a further embodiment 2800 of a microscanner, which emerged from the microscanner 500 from FIG. For this purpose, the spring carrier structure 515, which is in particular in the form of a post, is also designed as an actuator, in particular as a piezoelectric actuator. The spring support structure 515 can in particular have four piezo actuators which form four quadrant-shaped piezo segments 515c to 525f when viewed in cross section relative to the longitudinal axis of the spring support structure or the post. By suitably controlling these four piezo actuators, the deflection of the deflection element 505 can be controlled with respect to its two vibration axes Ai and A2, and in particular one in each case resonant, or overall a double-resonant oscillation of the deflection element 505 can be achieved. Due to this "dual-use" function of the spring carrier structure, the provision of further actuators can be dispensed with and in particular the attachment of actuators to the springs can be dispensed with, so that particularly compact and robust designs can be implemented in this way.

A microscanner according to one of these embodiments can be produced in particular by placing the spring carrier structure 515 on the carrier substrate 530, in particular a semiconductor substrate such as an Si substrate, and fixing it there. This can be done in particular by gluing or soldering. The deflection element can then be attached to the fixed spring support structure 515, which in turn can be done in particular by means of gluing or soldering.

In its partial figure (A), Fig. 29 shows an embodiment 2900 of a microscanner, which can be advantageously used in particular in connection with ring-shaped deflection units 505, in particular ring mirrors, and special optics for forming a ring-shaped beam cross-section for the electromagnetic radiation incident on the deflection element 505 Li has. Partial figure (B), on the other hand, shows for comparison a further embodiment 2901 without such an optical system, which is particularly suitable in combination with full-area (recess-free) deflection units 505, for example those according to embodiments 1800 to 2200. In the embodiment 2901 according to sub-figure (B), the incident electromagnetic radiation Li falls on the deflection element 505, where it is reflected and projected as an emerging beam l_2 into an observation field, which in the present example is a projection surface 645, such as a screen, a house wall or contains a road surface. When it strikes the projection surface, the beam L2 preferably has a cross-section that is essentially punctiform or corresponds to a small circular area (e.g. as a laser beam) and thus generates an essentially punctiform maximum intensity (light point) 650 (in Fig. 29 shown oversized as a black circle). Due to the first and second oscillations of the deflection element 505 when it is operated as a Lissajous scanner, a Lissajous figure 655 is created on the projection surface 645 through the corresponding movement of the point of light, which, with a suitable choice of the scanning frequencies of the two oscillation axes Ai and A2, shows a selected section of the Observation or projection field and thus the projection surface 645 illuminated. In contrast, in the embodiment 2900 according to subfigure (A), the aforementioned special optics, which in particular have an axicon 635 and a converging lens 640, are arranged in the beam path. During the operation of this arrangement, incident electromagnetic radiation L_3, for example a laser beam with a circular cross section, is first directed onto the axicon 635, which splits the beam into a beam L4 with an annular, in particular circular, beam cross section. A splitting into several concentric rings (in the beam cross-section) is also possible (similar to or like Bessel rays). The beam L4 is imaged onto the converging lens 640, which in turn images it as a light beam Li with an annular radiation cross section onto the deflection element 505 of the respective microscanner, which in the present example has an annular deflection or mirror plate. The deflection element 505 in turn forms the incident light beam Li by reflection using an emerging light beam L2 as a Lissajous projection into the observation field or onto the projection surface 645 . Two exemplary embodiments 3000 and 3100, respectively, of a method according to the invention for producing a microscanner, in particular a microscanner with encapsulation, are now explained below with reference to FIGS.

In the embodiment 3000 of the method shown in Fig. 30, a plate-shaped substrate 660, in particular a semiconductor substrate such as a silicon substrate, is provided in a first process, as illustrated in sub-figure 30(a), and on a main side of the substrate on the at least one surface section , on which a reflection surface of the deflection element 505 is to be formed, a reflection layer (mirror layer) 505a is applied. The latter can take place in particular by means of deposition (for example by sputtering with subsequent polishing) of a suitable material, in particular metal such as aluminum.

Then, in a further process, as illustrated in partial figure 30(b), the substrate 660 is structured from one of its main sides, preferably from the main side on which the reflection layer was previously formed. As a result, the deflection element 505, the support structure, in particular the spring support structure 515, and the

Spring device, in particular the first springs 510 formed at least in sections. This can be done in particular by means of one or more etching processes in combination with lithography, with the formation of a plurality of trenches in the substrate 660 for separating the individual microscanner components from one another in sections. In a further process, starting from the opposite main side, as illustrated in partial figure 30 (c), the elements of the microscanner that have already been partially formed by means of the structuring, in particular the deflection element 505, the first springs 510 and the spring carrier structure 515, are selectively attached to the substrate 660 exposed or completely structured. "Selective" here means that the substrate 660 is not removed or thinned over the entire surface as part of the exposure, but rather that the exposure takes place in a targeted (and thus selective) manner on those sections of the substrate 660 that have to be removed in order to protect the deflection element 505 and its Completely expose the spring suspension. A further process follows in which, as illustrated in partial figure 30 (d), the previously created structure is applied to a carrier substrate 530 and fixed there, in particular by means of one or more suitable connection processes. In principle, anodic, eutectic or direct bonding processes or thermocompression processes are particularly suitable as connection processes for this. Now, in yet another process, as illustrated in sub-figure 30(e), a capsule section 610 is added to produce a hermetic encapsulation. This is preferably done in such a way that a gas pressure lower than atmospheric pressure (e.g. air pressure) or even a vacuum forms in the encapsulated interior 615, so that gas friction effects (e.g. air friction effects) during subsequent operation of the microscanner are at least reduced or even eliminated

essentially can be avoided.

The embodiment 3100 of the method shown in FIG. 31 represents a further development of the method 3000 from FIG. 30, in which additional electrical connections for electrical

Components, in particular actuators 545 or sensors, are formed. For this purpose, as additionally illustrated in sub-figure 31 (a), an electrical connection 660a extending through the substrate 635 is formed at suitable points between the two opposite main sides of the substrate 660, for example by means of suitable etching processes and subsequent filling of the resulting cavities with electrically conductive material .

In the case of a semiconductor substrate, in particular made of silicon, methods for producing so-called “through-silicon vias” (TSV) known in particular from semiconductor process technology can be used here. The electrical connections 660a run preferably by a portion of the substrate 635 formed as part of the method 3000 to form the spring support structure 515. The processes according to sub-figures 31 (b) and 31 (c) correspond to those from sub-figures 30 (b) and 30 (c) of the method 2900. Furthermore, in the method 3000, as in sub-figure 31 (d) are additionally illustrated , electrically conductive channels 530a corresponding to the electrical connections 660a are formed in the carrier substrate 530 in order to route the electrical connection of the actuators 545 or sensors to the outside of the microscanner architecture, in particular to the outside of the carrier substrate 530, and to provide a connection option there. When substrate 530 is of the same type of material as substrate 660, the same or related processes can typically be used to fabricate electrical channels 530a. Otherwise, for example if the substrate 530 is in the form of a printed circuit board (PCB), other correspondingly suitable, known processes for producing the electrical channels 530a running through the substrate 530 can be used.

While at least one exemplary embodiment has been described above, it should be appreciated that a large number of variations thereon exist. It should also be noted that the example embodiments described are intended to be non-limiting examples only, and are not intended to limit the scope, applicability, or configuration of the devices and methods described herein. Rather, the foregoing description will provide those skilled in the art with guidance for implementing at least one example embodiment, while understanding that various changes in the operation and arrangement of elements described in an example embodiment may be made without departing from the scope of the appended claims the specified object and its legal equivalents are deviated from.

REFERENCE LIST

100 known microscanner architecture with cardanic suspension 105 deflection element, in particular mirror plate 110 axis-distant comb drive for oscillation axis Ai

115 near-axis comb drive for vibration axis Ai 120 internal torsion spring 125 movable frame 130 external torsion spring 135 chip frame

140 outer comb drive for vibration axis A2 200 known microscanner architecture of the three-legged "MiniFaros" type 205 deflection element, in particular mirror plate 210 arc spring 215 inner end of the arc springs, coupling point on the deflection element

220 outer end of the arc springs, starting point on the chip frame 225 chip frame 230 comb drive 235 slot-shaped free spaces 300 known microscanner architecture of the two-legged "MiniFaros" type

305 deflection element, in particular mirror plate 310 arc spring 315 inner end of the arc springs, coupling point on the deflection element 320 outer end of the arc springs, starting point on the chip frame 325 chip frame

330 comb drive 335 slot-shaped free space 400 known microscanner architecture of the two-legged "MiniFaros" type 405 deflection element, in particular mirror plate 410 arc spring

415 inner end of the arc spring, coupling point on the deflection element 420 outer end of the arc spring, attachment point on the chip frame 425 chip frame 500 embodiment of a microscanner 501 variant of the embodiment 500

505 Deflection element, in particular mirror plate 505a Reflection or mirror layer on the deflection element 505 505b Intermediate layer of the deflection element 505c recess of the deflection element

510 first spring

510a first spring with lower spring stiffness

510b first spring with higher spring stiffness

515 spring support structure, especially post

515a first layer of spring support structure 515

515b second layer of spring support structure 515

515c-f piezo segments

520 inner end of a first spring, attachment point to the spring support structure

525 outer end of a first spring, coupling point on the deflection element 505

530 carrier substrate

530a electrical channel

535a, b, c points on the deflection element 505, which span a surface section on an auxiliary plane

540 straight connecting lines/straight lines between each two points 535a-c

545 actuator, in particular piezo actuator, for driving the microscanner

550 bonding material or bonding layer

555 first electrode of the piezo actuator 545

560 Piezo ceramic layer of the piezo actuator 545

565 second electrode of the piezo actuator 545

570 second spring

575 (first) outer frame of the frame structure

580 support structure

585 attachment section, intermediate body

590 intermediate element

595 further outer frame of the frame structure

605 third spring

610 capsule section, or encapsulation

610a support ring

615 encapsulated space or interior

620 cavity in the carrier substrate 530

625 intermediate layer

630 (further) spacer layer

635 Axicon

640 converging lens

645 projection surface

650 maximum intensity (point of light)

655 Lissajous figure 660 (initial) substrate, in particular semiconductor substrate

660a electrical connection, in particular Through-Silicon-Via (TSV)

600,...,2900 further embodiments of a microscanner 3000, 3100 embodiments of a method for producing a microscanner

Ai, A ₂ axes of vibration

D (triangular) surface section on the auxiliary plane H

Li . L ₄ electromagnetic rays, in particular laser beams H auxiliary plane P perpendicular projection

Claims

EXPECTATIONS

A microscanner (500; 600; ...; 2800) for projecting electromagnetic radiation onto a field of view (645), the microscanner comprising: a deflection element (505) for deflecting an incident electromagnetic beam (12); a support structure (515; 575; 595); and a spring device (510, 570, 605) with one or more springs (510, 570, 605) by means of which the deflection element (505) is suspended on the support structure (515; 575; 595) so that it can swing relative to the support structure (515; 575; 595) can simultaneously perform a first rotary oscillation about a first axis of oscillation (Ai) and a second rotary oscillation about a second axis of oscillation orthogonal thereto (A2), in order to deflect one during the simultaneous oscillations onto the deflection element (505) causing an incident electromagnetic beam (12) to have a Lissajous projection (655) into a field of view (645); wherein the support structure (515; 575; 595) has a spring support structure (515) and the spring device has a number N of first springs (510), where N > 1 applies and each of the N first springs (510) is attached to at least one associated attachment point (520 ) attaches to the spring support structure (515), is coupled to the deflection element (505) at at least one associated coupling point (525) and extends between this coupling point (520) and this coupling point (525); and wherein there are three points (535a,b,c) on the deflection element (505) which in its rest position define a Euclidean auxiliary plane (H) and in the auxiliary plane (H) a connecting line (540) between the three points ( 535a, b, c) enclosed area or straight line section on which each of these starting points (520) or its respective vertical projection (P) on the auxiliary plane (H) lies.

Microscanner (500) according to claim 1, wherein the deflection element (505) has rotational symmetry in its rest position with respect to an axis of symmetry and is arranged such that the axis of symmetry runs through the spatial area spanned by the spring support structure (515).

3. Microscanner (500) according to one of the preceding claims, wherein the N first springs (510) each attach exclusively to the spring support structure (515) on the support structure and the deflection element (505) is suspended exclusively from these first springs (510). 4. Microscanner (500) according to any one of the preceding claims, wherein the

Baffle member (505) comprises a baffle plate having a recess formed therein.

5. Microscanner (500) according to claim 4, wherein at least one of the first springs (510) runs at least in sections within the recess. 6. Microscanner (500, 2800) according to claim 4 or 5, further comprising an optics (635, 640) for converting incident electromagnetic radiation into a falling, on the deflection element (505) directed electromagnetic beam () whose radial intensity profile at its impingement on the deflection element (505) in such a way that a radial intensity maximum of the beam (12) surrounds the recess on two opposite sides of the recess.

7. Microscanner (500, 700, 800, 900) according to one of the preceding claims, wherein at least one of the N first springs (510) is shaped such that in its rest position its effective spring length is between the deflection element (505) and the spring support structure (515 ) is greater than the minimum occurring distance between one of its coupling points (525) on the deflection element (505) on the one hand and one of its attachment points (520) on the spring support structure (515) on the other.

8. microscanner (700; 900) according to any one of the preceding claims, wherein the spring means exactly N = 2 first springs (510) having together a

Form bipod suspension of the deflection element (505) on the spring support structure (515).

9. Microscanner (500; 1000; 1200) according to one of claims 1 to 7, wherein the spring device has N=4 first springs (510), these four first springs (510) together forming a cross-shaped suspension of the deflection element

(505) on the spring support structure (515).

10. Microscanner (1000) according to claim 9, wherein two of the four first springs (510) form a respective spring pair of springs of the same spring stiffness, while the respective spring stiffnesses for the first springs (510) of the two spring pairs differ. 11. Microscanner (1100) according to any one of the preceding claims, wherein the

Support structure also has a frame structure (575) surrounding the deflection element (505) at least on two sides and stationary with respect to the first and second rotational oscillations of the deflection element (505), on which the deflection element (505) is additionally suspended by means of a number M of second springs (570). where M > 1.

12. Microscanner (1100) according to claim 11, wherein the suspension of the deflection element (505) on the spring support structure (515) by means of the N first springs (510) defines the first oscillation axis and the suspension of the deflection element (505) by means of the M second springs the frame structure (575) defines the second vibration axis.

13. Microscanner (1300) according to any one of the preceding claims, wherein N > 2 and the deflection element (505) extends between the respective coupling points (525) of the N first springs (510) in such a way that the spring support structure (515) is at least partially bridged. 14. Microscanner (1300; 1400) according to claim 13, wherein the deflection element (505) has a substrate designed as a deflection plate for deflecting the incident electromagnetic beam, which is connected by means of at least one bond connection to one or more of the first springs (510) or to an intermediate one or more of the first springs (510) on the one hand and the deflection plate on the other hand arranged intermediate body (585).

15. Microscanner (1400) according to claim 13 or 14, in each case dependent on claim 11 or 12, wherein the spring means further comprises a number K of third springs (605), where K > 1 applies; each third spring (605) being coupled on the one hand to the respective coupling point (525) of an associated first spring (510) or optionally to the intermediate body (585) and on the other hand to the frame structure (575, 595).

16. Microscanner (1500; 1800; 1900) according to one of the preceding claims, further comprising an encapsulation, by means of which at least the deflection element (505) and the springs (510, 570, 605) of the spring device are encapsulated in a hermetically sealed manner such that the Deflection element (505) in the encapsulation for performing the oscillations enabled at the

Spring device is suspended so that it can swing; wherein the encapsulation has a encapsulation section (610) bridging the deflection element (505), through which the radiation to be deflected can be radiated into the spatial region (615) encapsulated by the encapsulation and, after being deflected at the deflection element (505), emitted again therefrom.

17. The microscanner (1500; 1800; 1900) of claim 16, wherein the capsule portion (610) has a dome-shaped, a planar, or a rectangular U-shaped cross-section shape. 18. Microscanner (1500; 1800; 1900) according to claim 16 or 17, wherein the

Capsule section (610) is mounted on a first layer stack, which contains a first layer sequence (580, 575,590,595) which, with regard to the order, the material and/or the thickness of the individual layers of the first layer sequence, is a second layer sequence of a second layer stack (515b , 515a, 505b, 505), from which the combination of the deflection element (505, 505b), the

Spring device (510, 570, 605) and the spring support structure (515) is manufactured.

19. Beam deflection system according to one of the preceding claims, wherein the quality factor of the microscanner is at least 1000 with respect to at least one of the two oscillations. The microscanner (2400) of any preceding claim, further comprising: a support substrate (530) supporting the spring support structure (515); and an actuator (545) for driving the first oscillation and/or the second

oscillation of the deflection element (505); wherein the actuator (545) is mechanically coupled to the carrier substrate (530) in order to act on it mechanically during operation of the microscanner (500) and thereby indirectly drive the deflection element at least via the spring carrier structure (515) and the first springs (510). (505) for driving its first and/or second oscillations.

21. Microscanner (2400; 2500) according to claim 20, wherein the actuator (545) is arranged adjacent to a cavity (620) in the carrier substrate (530) or another substrate (625) connected to the actuator (545) that during its operation, it can execute a movement extending into the cavity (620) at least in sections.

22. Microscanner (2400; 2500) according to claim 20 or 21, wherein the actuator (545) is also designed as a sensor device for sensory detection of the current position of the deflection element (505) or as part of such a sensor device. 23. Microscanner (800; 1200) according to one of the preceding claims, wherein one or more actuators (545) or sensors are provided on the spring support structure (515) or the spring device (510), which are connected to one or more signal or power supply lines (660a , 530a) which run at least in sections through one or more openings provided in the spring support structure (515).

24. Microscanner (800; 1200) according to one of the preceding claims, wherein the microscanner (800; 1200) is configured such that the frequency ratio of the resonant frequency T with regard to the faster of the two vibration axes to the resonant frequency f2 with regard to the slower of the two vibration axes applies: T/f2 = F + v, where F is a natural number (F

= 1,2,3,...) and for the detuning v applies: v = (f 1 -f2)/f2 with (fi-f2) < 200 Hz, where v is not an integer.

25. Microscanner (800; 1200) according to any one of the preceding claims, having an actuator with one or more actuators (545) for driving the first and second oscillations, wherein the actuator is configured so that it converts the deflection element into a double-resonant oscillation with respect to the first and second vibration axis can move.

26. Microscanner (800; 1200) according to claim 25, wherein the actuator system is configured such that it can set the deflection element into simultaneous oscillations with respect to the first and second oscillation axes in such a way that for the

Frequency ratio of the vibration frequency T with regard to the faster of the two vibration axes to the vibration frequency f2 with regard to the slower of the two vibration axes applies: T/f2 = F + v, where F is a is a natural number (F=1,2,3,...) and the detuning v applies: v=(f 1 -f2)/f2 with (f 1 -f2) <200 Hz, where v is not an integer .

27. A method for manufacturing a microscanner (500) according to any one of the preceding claims, the method comprising: providing a disc-shaped substrate (660) having two opposing main surfaces;

Structuring of the substrate (660) from a first of the main surfaces to at least partially form the deflection element (505), the support structure (515) and the spring device (510); Selective, at least partial exposure of the deflection element (505) formed by means of the structuring and the spring device (510) from the other main surface; and

Fastening the microscanner arrangement (505, 510, 515) resulting from the exposure on a carrier substrate (530). 28. The method of claim 27, further comprising at least one of the following processes:

depositing a reflection layer (505a) on a surface portion provided for forming the deflection element (505) on a main side of the substrate (660); - Hermetic encapsulation of those fixed on the supporting substrate (530).

micro scanner arrangement by means of an encapsulation (610);

Bonding of at least two adjacent substrates (530, 545, 575, 580, 590, 595, 610, 625) within a layer stack used to build up the microscanner (500) by means of an anodic, eutectic or direct bonding method or a thermocompression method;

Creation of one or more actuators (545) or sensors on the spring support structure (515) or the spring device (510) and creation of one or more signal or power supply lines (660a) which, overall, are at least partially connected by one or more in the spring support structure (515) provided openings pass through and to which the actuators (545) or sensors are connected.