EP4335941A4 - LEAD-FREE SOLDER PASTE - Google Patents

LEAD-FREE SOLDER PASTE Download PDF

Info

Publication number
EP4335941A4
EP4335941A4 EP21939878.1A EP21939878A EP4335941A4 EP 4335941 A4 EP4335941 A4 EP 4335941A4 EP 21939878 A EP21939878 A EP 21939878A EP 4335941 A4 EP4335941 A4 EP 4335941A4
Authority
EP
European Patent Office
Prior art keywords
lead
solder paste
free solder
free
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21939878.1A
Other languages
German (de)
French (fr)
Other versions
EP4335941A1 (en
Inventor
Tetsuro Nishimura
Kenji Nakamura
Junya Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Publication of EP4335941A1 publication Critical patent/EP4335941A1/en
Publication of EP4335941A4 publication Critical patent/EP4335941A4/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP21939878.1A 2021-05-06 2021-12-28 LEAD-FREE SOLDER PASTE Pending EP4335941A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021078842 2021-05-06
PCT/JP2021/048954 WO2022234690A1 (en) 2021-05-06 2021-12-28 Lead-free solder paste

Publications (2)

Publication Number Publication Date
EP4335941A1 EP4335941A1 (en) 2024-03-13
EP4335941A4 true EP4335941A4 (en) 2024-10-30

Family

ID=83932082

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21939878.1A Pending EP4335941A4 (en) 2021-05-06 2021-12-28 LEAD-FREE SOLDER PASTE

Country Status (5)

Country Link
US (1) US20240238915A1 (en)
EP (1) EP4335941A4 (en)
JP (1) JPWO2022234690A1 (en)
CN (1) CN117279733A (en)
WO (1) WO2022234690A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7620254B1 (en) * 2024-07-11 2025-01-23 千住金属工業株式会社 Manufacturing method of flux and joint body
CN119501370B (en) * 2025-01-07 2025-12-26 云南锡业新材料有限公司 A zero-halogen, low-void SnBi-based solder paste and its preparation method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101695794A (en) * 2009-10-23 2010-04-21 东莞市特尔佳电子有限公司 Halogen-free tin-bismuth-copper soldering paste and preparation method thereof
CN104858571A (en) * 2015-06-10 2015-08-26 深圳市同方电子新材料有限公司 Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof
EP3573100A1 (en) * 2017-01-20 2019-11-27 Lenovo (Singapore) Pte. Ltd. Solder bonding method and solder joint
US20200047291A1 (en) * 2018-08-10 2020-02-13 Senju Metal Industry Co., Ltd. Flux and Solder Paste
CN111590241A (en) * 2020-06-11 2020-08-28 中山翰华锡业有限公司 Low-temperature environment-friendly multi-element alloy soldering paste and preparation method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
US20030221748A1 (en) * 2002-05-30 2003-12-04 Fry's Metals, Inc. Solder paste flux system
US6796482B2 (en) * 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
CN102581523B (en) * 2012-03-21 2015-06-17 北京鹏瑞中联科技有限公司 Halogen-free solder paste
JP6444953B2 (en) * 2015-09-30 2018-12-26 株式会社タムラ製作所 Flux composition and solder paste
JP6458894B1 (en) * 2018-04-26 2019-01-30 千住金属工業株式会社 Flux and solder paste
CN112638574A (en) * 2018-08-31 2021-04-09 铟泰公司 SnBi and Snin solder alloy
JP2022502265A (en) * 2018-10-24 2022-01-11 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. Low temperature soldering solution for polymer substrates, printed circuit boards and other bonding applications
TWI819210B (en) 2019-04-11 2023-10-21 日商日本斯倍利亞股份有限公司 Lead-free solder alloy and solder joint
JP7089491B2 (en) 2019-04-23 2022-06-22 株式会社タムラ製作所 Flux composition, solder paste and electronic circuit board
KR102371432B1 (en) * 2019-05-27 2022-03-07 센주긴조쿠고교 가부시키가이샤 Solder Alloys, Solder Pastes, Solder Balls, Solder Preforms, Solder Joints, and Boards
CN110303273A (en) * 2019-06-26 2019-10-08 浙江强力控股有限公司 Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof for heat radiation module
JP6751248B1 (en) * 2019-09-24 2020-09-02 千住金属工業株式会社 Flux and solder paste

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101695794A (en) * 2009-10-23 2010-04-21 东莞市特尔佳电子有限公司 Halogen-free tin-bismuth-copper soldering paste and preparation method thereof
CN104858571A (en) * 2015-06-10 2015-08-26 深圳市同方电子新材料有限公司 Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof
EP3573100A1 (en) * 2017-01-20 2019-11-27 Lenovo (Singapore) Pte. Ltd. Solder bonding method and solder joint
US20200047291A1 (en) * 2018-08-10 2020-02-13 Senju Metal Industry Co., Ltd. Flux and Solder Paste
CN111590241A (en) * 2020-06-11 2020-08-28 中山翰华锡业有限公司 Low-temperature environment-friendly multi-element alloy soldering paste and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2022234690A1 *

Also Published As

Publication number Publication date
WO2022234690A1 (en) 2022-11-10
US20240238915A1 (en) 2024-07-18
CN117279733A (en) 2023-12-22
JPWO2022234690A1 (en) 2022-11-10
EP4335941A1 (en) 2024-03-13

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Ipc: C22C 13/00 20060101ALI20240926BHEP

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