EP4288235A1 - Vorrichtung und verfahren zur laserbearbeitung eines werkstücks - Google Patents
Vorrichtung und verfahren zur laserbearbeitung eines werkstücksInfo
- Publication number
- EP4288235A1 EP4288235A1 EP22701614.4A EP22701614A EP4288235A1 EP 4288235 A1 EP4288235 A1 EP 4288235A1 EP 22701614 A EP22701614 A EP 22701614A EP 4288235 A1 EP4288235 A1 EP 4288235A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- focus
- shaping device
- workpiece
- zone
- shaping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/54—Glass
Definitions
- the invention relates to a device for laser processing of a workpiece, which has a material that is transparent for laser processing.
- the invention further relates to a method for laser processing a workpiece which has a material that is transparent for the laser processing.
- US 2020/0147729 A1 discloses a method for forming a beveled edge area on a glass substrate by means of a laser beam, the shape of the beveled edge area being adapted by adjusting an axial energy distribution of the laser beam.
- the invention is based on the object of providing a device mentioned at the outset and a method mentioned at the outset which can be used flexibly and in a variety of ways and by means of which, in particular, laser processing of the workpiece along different processing geometries can be carried out in a technically simple manner.
- the device comprises a first beam-shaping device with a beam splitting element for splitting a first input beam coupled into the first beam-shaping device into a plurality of partial beams, and one of the first
- the at least one focus zone can be formed with different geometries in a technically simple manner by splitting the first input beam by means of the beam splitting element based on phase imprinting and subsequent focusing of the formed partial beams.
- the at least one focal zone can be formed in particular with different sections, each of which has a different geometry and/or a different setting angle. In this way, laser processing of the workpiece with different processing geometries can be achieved in a technically simple manner.
- the at least one focus zone can be introduced into the material at the angle of incidence without it being necessary to position an optical system with respect to the workpiece.
- the beam splitting element is designed in particular as a diffractive beam splitting element and/or as a 3D beam splitting element.
- the beam splitting element is preferably used to impress a phase on a beam cross section of the first input beam.
- the first input beam is split by means of the beam splitting element by pure phase manipulation of the phase of the first input beam.
- the phase imprinting on the first input beam which is carried out by means of the beam splitting element, can be set and/or defined in a variable manner.
- the at least one focus zone has a plurality of focus distributions and/or is formed from a plurality of focus distributions.
- the focus distributions are arranged in the different partial areas of the focus zone.
- Respective focus distributions of the focus zone are arranged in particular at a distance from one another in the focus zone. However, it is possible for the respective focus distributions to spatially overlap at least in sections.
- the at least one focal zone extends in one plane.
- the focus distributions from which the at least one focus zone is formed are preferably arranged in one plane.
- this plane is oriented perpendicular to a feed direction in which the at least one focus zone for laser processing of the workpiece is moved relative to the workpiece.
- each focus distribution of the at least one focus zone is assigned a lens component and/or grating component of the phase distribution imposed by the beam splitting element.
- the imposed phase distribution comprises a plurality of superimposed lens components and/or grating components, with each focus distribution of the at least one focus zone being assigned a lens component and/or grating component.
- the first beam-shaping device is designed as a far-field beam-shaping element or includes one or more far-field beam-shaping elements.
- the at least one focal zone is formed, for example, by focusing partial beams decoupled from the first beam-shaping device by means of the focusing optics in the respective partial areas of the focal zone.
- the focusing optics are designed as a microscope objective or lens element.
- the first beam-shaping device can be rotated or is rotated about an axis parallel to a main propagation direction of the first input beam.
- the at least one focus zone can be rotated, for example, about an axis of rotation oriented perpendicularly to a feed direction in which the at least one focus zone is moved relative to the workpiece for laser processing of the workpiece.
- the material of the workpiece is made from a material that is transparent to a laser beam from which the at least one focal zone is formed.
- a transparent material is to be understood in particular as a material through which at least 70% and in particular at least 80% and in particular at least 90% of a laser energy of a laser beam from which the at least one focal zone is formed is transmitted.
- the first input beam is a first input beam coupled into the first beam shaping device and/or into the beam splitting element.
- the material modifications produced in the material by means of the at least one focal zone are type III modifications.
- cracks are produced in the material of the workpiece during the laser processing, by means of which a separation of the material is made possible in particular.
- the device comprises a second beam-shaping device for beam-shaping the first input beam coupled into the first beam-shaping device, with the second beam-shaping device providing the first input beam with a focus distribution with a defined geometric shape and/or with phase impingement on a second input beam incident on the second beam-shaping device is assigned to a defined intensity profile, so that focus distributions based on this geometric shape and/or based on this intensity profile are formed by focusing the partial beams coupled out of the first beam-shaping device using the focusing optics in different sub-areas of the focal zone.
- a geometry of focus distributions from which the at least one focus zone is formed can be adapted. This enables a flexible and versatile use of the device.
- the second beam-shaping device is arranged in front of the first beam-shaping device with respect to a main propagation direction of laser beams guided through the device.
- the first input beam is a beam coupled out of the second beam-shaping device and/or a beam provided by the second beam-shaping device.
- the second beam-shaping device is used to modify and/or adapt a focus distribution associated with the second input beam coupled into the second beam-shaping device.
- a focus distribution modified and/or adapted by means of the second beam-shaping device is assigned to the first input beam provided by means of the second beam-shaping device.
- the second beam-shaping device can be rotated or is rotated about an axis parallel to a main propagation direction of the second input beam.
- the at least one focus zone can be rotated, for example, about an axis of rotation oriented perpendicularly to a feed direction in which the at least one focus zone is moved relative to the workpiece for laser processing of the workpiece.
- the second beam-shaping device is or includes, in particular, a beam-shaping element for carrying out the phase imprinting, e.g. a diffractive optical element and/or an axicon element.
- a beam-shaping element for carrying out the phase imprinting e.g. a diffractive optical element and/or an axicon element.
- the main extension direction of the focus distribution with an elongated shape is oriented transversely and in particular perpendicularly to a feed direction in which the at least one focus zone for laser processing of the workpiece is moved relative to the workpiece.
- phase imprint on the second input beam is such that the focus distribution has an intensity profile with respect to an assigned main extension direction, which, starting from a maximum intensity at an intensity maximum of the intensity profile, is approximately one factor of l/e 2 times the maximum intensity 3 falls faster than is the case with a Gaussian intensity profile, and/or when the phase imprint on the second input beam is such that the focus distribution has a shape and/or intensity profile of an abruptly self-focusing beam.
- the rapid drop in intensity of these focus distributions results in more precise material processing with reduced damage to the material to be processed. As a result, the material can be separated in particular with a particularly flat and/or smooth edge.
- the drop in intensity from the maximum intensity to 1/e 2 times the maximum intensity is faster by at least a factor of 2.5 and/or faster by a factor of at most 3.5 than is the case with a Gaussian intensity profile.
- the intensity profile has an intensity drop edge, on which the intensity drop is formed.
- the intensity of the intensity profile in the main extension direction following the intensity drop edge is below the value of l/e 2 times the maximum intensity.
- the intensity drop edge faces a workpiece segment during laser processing of the workpiece.
- a particularly smooth cutting edge can be achieved when cutting the material.
- the intensity maximum mentioned is in particular a main maximum and/or global maximum of the intensity profile.
- the intensity profile has one or more secondary maxima, which adjoin the intensity maximum counter to the main direction of extent.
- a respective maximum intensity of the secondary maxima decreases with increasing distance from the main maximum.
- the secondary maxima lie in a residual workpiece segment and/or waste segment during laser processing of the workpiece. It can be in the remaining workpiece segment and / or waste segment For example, form cracks and / or channels, which favor an etching attack for material separation.
- the second beam-shaping device is designed in particular as a near-field beam-shaping device, i.e. the focus distribution is imaged as an intermediate image in particular by means of the second beam-shaping device.
- the intermediate image formed by means of the second beam-shaping device is in particular an image of the focus distribution which is associated with the first input beam coupled into the first beam-shaping device.
- an output beam coupled out of the far-field optics corresponds to the first input beam to be coupled into the first beam-shaping device.
- the area of the focal plane is to be understood in particular as an area extending around the focal plane, which in particular has a maximum distance of 10% of a focal length of the far-field optics from the focal plane.
- far-field focusing of the intermediate image of the focus distribution formed by the second beam-shaping device takes place in the focal plane by means of the far-field optics.
- the far-field optics perform a Fourier transformation of the intermediate image generated by the second beam-shaping device and/or of the focus distribution generated by the second beam-shaping device.
- a transverse intensity distribution of the first input beam in the focal plane has a ring structure and/or a ring segment structure.
- the far-field optics and the focusing optics form a telescope device and/or that the far-field optics and the focusing optics have a common focal plane, with the first beam-shaping device in particular being arranged in a region of this common focal plane.
- a focal length of the far-field optics is greater than a focal length of the focusing optics.
- a defined geometric shape and/or a defined intensity profile is assigned to the first input beam, for example, by means of a laser source that provides the first input beam.
- the assignment takes place by means of the second beam-shaping device described above.
- the first input beam incident on the beam splitting element and/or on the first beam shaping device has a Gaussian intensity profile, e.g., when it originates directly from a laser source.
- the at least one focus zone is then built up and/or formed from a plurality of adjacent "focus points" with a Gaussian shape and/or Gaussian intensity profile.
- the first beam-shaping device has a beam-shaping element for modifying the focus distribution assigned to the first input beam, with the beam-shaping element being used to modify and/or align the geometric shape and/or the intensity profile of the focus distribution mapped into the at least one focus zone in a a feed direction in which the at least one focal zone for laser processing of the workpiece is moved relative to the workpiece, occurs in a vertically oriented cross-sectional plane, and/or wherein the beam-shaping element is used to modify and/or align the geometric shape and/or the intensity profile of the in the at least a focus zone mapped focus distribution in a to a feed direction, in which the at least one focus zone for laser processing of the workpiece is moved relative to the workpiece, takes place in a parallel-oriented cross-sectional plane.
- the cross-sectional plane oriented parallel to the feed direction is oriented perpendicular to a main propagation direction of rays from which the focus distribution is formed.
- the beam-shaping element of the first beam-shaping device is used in particular to modify the input beam coupled into the first beam-shaping device within and/or by means of the first beam-shaping device.
- the beam-shaping element is or includes a diffractive or refractive beam-shaping element, and/or the beam-shaping element is or includes a diffractive field mapper.
- wavefront aberrations defined by the beam-shaping element can be impressed on an input beam coupled into the beam-shaping element.
- the beam-shaping element is set up in particular in such a way that the partial beams coupled out of the first beam-shaping device are assigned the focus distribution modified by means of the beam-shaping element, so that focus distributions with this modified geometric shape and /or be formed with this modified intensity profile.
- the main extension direction encloses a smallest angle of at least 1° and/or at most 90° with the local extension direction.
- the focus distribution lies, for example, at least in sections in a residual workpiece segment and/or waste segment that occurs during the laser processing of the workpiece.
- cracks and/or channels are formed in the remaining workpiece segment and/or waste segment, which promote an etching attack for material separation.
- the beam-shaping element to modify the focus distribution in the cross-sectional plane perpendicular to the feed direction in such a way that it has a main extension direction in this cross-sectional plane perpendicular to the feed direction.
- the focus distribution in the cross-sectional plane oriented perpendicularly to the feed direction is modified by means of the beam-shaping element in such a way that it has a curved longitudinal central axis. It can be favorable if the intensity profile of the focus distribution is modified in a cross-sectional plane oriented parallel to the feed direction by means of the beam-shaping element in such a way that the intensity profile has at least one preferred direction, with the at least one preferred direction being oriented parallel or transverse or perpendicular to the feed direction. In this way, in particular, crack formation in the material of the workpiece during laser processing can be controlled and/or optimized. This enables, for example, an improved introduction of etching liquid for material separation.
- the at least one preferred direction and the feed direction lie in a common plane.
- the preferred direction of a focus distribution designed as an ellipse is to be understood as meaning, for example, a major semi-axis of the ellipse.
- the preferred direction of the focus distribution designed as an ellipse is oriented parallel or approximately parallel to the feed direction.
- a focus distribution designed as a square or rectangle has, for example, two preferred directions which are each oriented parallel to a direction connecting two opposite points of the square. For example, one of the preferred directions is then oriented parallel to the feed direction and the other perpendicular to it.
- the at least one angle of incidence of the at least one focus zone is at least 1° and/or at most 90°.
- the at least one angle of attack is preferably at least 10°.
- the setting angle is to be understood in particular as a smallest angle between one of the local extension directions associated with the at least one focus zone and an outside of the workpiece.
- the at least one focus zone is coupled and/or introduced through this outside into the material of the workpiece.
- the polarization beam splitting element comprises a birefringent wedge element and/or a birefringent lens element.
- a directional offset and/or an angular offset of partial beams with different states of polarization can thus be generated, for example, before the focusing of the partial beams by means of the focusing optics.
- the partial beams with different states of polarization can be imaged in spatially different sub-areas of the at least one focal zone.
- a first input beam incident on the beam splitting element is divided into a plurality of partial beams by means of a beam splitting element of a first beam shaping device, and the partial beams coupled out of the first beam shaping device are divided into at least one focal zone by means of focusing optics assigned to the first beam shaping device be focused, whereby the splitting of the first input beam takes place by means of the beam splitting element by phase impingement on the first input beam, the partial beams are focused into different partial areas of the at least one focus zone to form the at least one focus zone, for laser processing of the workpiece the at least one focus zone using the focusing optics at least one angle of attack to an outside of the workpiece is introduced into the material and by acting on the M aterials are produced by means of the at least one focal zone material modifications in the material, which are associated with cracking of the material.
- the method according to the invention has in particular one or more features and/or advantages of the device according to the invention.
- the method according to the invention can be carried out using the device according to the invention.
- the device according to the invention carries out the method according to the invention.
- material modifications are formed in the material of the workpiece along a machining line and/or machining surface by moving the at least one focal zone relative to the workpiece. In particular, this allows the workpiece to be separated along the machining line and/or machining surface.
- the material of the workpiece can be separated or is separated along the processing line and/or processing surface by applying thermal stress and/or mechanical stress and/or by etching using at least one wet-chemical solution.
- the etching takes place in an ultrasonically assisted etching bath.
- the device according to the invention and/or the method according to the invention have one or more of the following features:
- the at least one focal zone extends between two different and/or opposite outer sides of the workpiece and in particular extends continuously.
- these outer sides are oriented parallel to one another or oriented transversely to one another. It can thereby separate the workpiece, for example, in two different segments or it can be Edge processing Separate a segment from the workpiece. This allows the edge area to be beveled or chamfered, for example.
- the at least one focus zone has focus distributions which are arranged in such a way that material modifications are formed in a residual workpiece segment and/or waste segment to be separated from the workpiece.
- material modifications form, for example, channels for improved introduction of etching liquid for material separation.
- the focus distributions of the at least one focus zone are arranged in such a way that they are arranged at least in sections in a residual workpiece segment and/or waste segment formed during the laser processing of the workpiece or at least partially protrude into a residual workpiece segment formed in the laser processing of the workpiece.
- cracks and/or channels can be formed in the remaining workpiece segment and/or waste segment, which promote a supply of etching liquid to material modifications formed during laser processing. This enables improved material separation along a machining surface on which the material modifications are arranged.
- the focus distributions of the at least one focus zone are arranged in such a way that a main maximum and/or a global maximum of the respective focus distribution faces a workpiece segment created during the laser processing of the workpiece and/or faces away from a residual workpiece segment.
- a good piece segment is to be understood, for example, as a useful segment (in contrast to a remaining workpiece segment and/or scrap segment) that occurs when the workpiece is separated.
- the device includes a workpiece holder for the workpiece, which preferably has a non-reflective and/or highly scattering surface.
- the at least one focal zone is formed from an ultracourse pulsed laser beam or is provided by means of an ultracourse pulsed laser beam.
- This ultra-short-pulse laser beam includes, in particular, ultra-short laser pulses.
- the laser beam from which the at least one focus zone can be formed or is formed has an average power of at least IW to 1 kW.
- the laser beam includes pulses with a pulse energy of at least 10 pJ and/or at most 50 mJ. It can be provided that the laser beam comprises individual pulses or bursts, the bursts having 2 to 20 sub-pulses and in particular a time interval of approximately 20 ns.
- the at least one focal zone can be rotatable about an axis of rotation oriented perpendicularly to a feed direction in which the at least one focal zone is moved relative to the workpiece for laser processing of the workpiece.
- the workpiece can be machined, for example, along a curved machining line and/or machining surface.
- the at least one focal zone forms a spatially coherent interaction area for laser processing of the workpiece, in which case localized material modifications can be formed in the interaction area, in particular by subjecting the material of the workpiece to this interaction area, by means of which a separation of the material is made possible in particular.
- cracking and/or a change in a refractive index of the material occurs between adjacent material modifications.
- Type I is an isotropic refractive index change
- Type II is a birefringent refractive index change
- Type III is a so-called void.
- the material modification produced depends on the laser parameters of the laser beam from which the focal zone is formed, such as the pulse duration, the wavelength, the pulse energy and the repetition frequency of the laser beam, and on the material properties, such as the electronic structure and the thermal expansion coefficient, as well as on the numerical aperture (NA) of focusing.
- NA numerical aperture
- the type I isotropic refractive index changes are attributed to localized melting caused by the laser pulses and rapid resolidification of the transparent material.
- the density and refractive index of the material is higher when the fused silica is rapidly cooled from a higher temperature. So if the material in the focus volume melts and then cools down quickly, the quartz glass has a higher refractive index in the areas of material modification than in the unmodified areas.
- the type II birefringent refractive index changes can arise, for example, as a result of interference between the ultrashort laser pulse and the electric field of the plasma generated by the laser pulses. This interference leads to periodic modulations in the electron plasma density, which, when solidifying, leads to a birefringent property, i.e. direction-dependent refractive indices, of the transparent material.
- a type II modification is also accompanied, for example, by the formation of so-called nanogratings.
- voids can also be associated with type I and type II modifications.
- Type I and Type II modifications can arise in the less stressed areas around the introduced laser pulses. Therefore, if a type III modification is introduced, then in any case a less dense or hollow core or a defect is present.
- a type III modification of sapphire the microexplosion does not create a cavity, but rather an area of lower density. Due to the material stresses that occur in a type III modification, such a modification is often accompanied by cracking or at least promotes it. The formation of type I and type II modifications cannot be completely prevented or avoided when introducing type III modifications. Finding "pure" type III modifications is therefore not likely.
- the material cannot cool down completely between the pulses, so that cumulative effects of the introduced heat from pulse to pulse have an influence on the material modification be able.
- the repetition frequency of the laser beam can be higher than the reciprocal of the thermal diffusion time of the material, so that heat accumulation can take place in the focal zone by successive absorption of laser energy until the melting temperature of the material is reached.
- a larger area than the focus zone can be melted due to the thermal transport of the heat energy into the areas surrounding the focus zone.
- the at least one focal zone comprises in particular a plurality of mutually spaced and/or adjacent focal distributions, wherein the focal zone can have interruptions and/or zero points between mutually adjacent focal distributions, at which in particular there is no or negligible interaction with the material.
- these interruptions in the focal zone have a spatial extent of at most 10% of a maximum extent and/or a maximum length of the focal zone.
- these interruptions have a spatial extent of at most 100 ⁇ m and in particular at most 50 ⁇ m. If there are larger interruptions in intensity distributions, this means different focal zones.
- the at least one focal zone has an overall length of between 50 ⁇ m and 5000 ⁇ m.
- the focal zone is viewed in a modified intensity distribution that only has intensity values that are above a specific intensity threshold.
- the intensity threshold is selected here, for example, in such a way that values lying below this intensity threshold have such a low intensity that they are no longer relevant for an interaction with the material for the formation of material modifications.
- the intensity threshold is 50% of a global intensity maximum actual intensity distribution.
- the terms “at least approximately” or “approximately” generally mean a deviation of at most 10%. Unless otherwise stated, the terms “at least approximately” or “approximately” mean in particular that an actual value and/or distance and/or angle deviates by no more than 10% from an ideal value and/or distance and/or angle , and/or that an actual geometric shape deviates from an ideal geometric shape by no more than 10%.
- FIG. 1 shows a schematic representation of an exemplary embodiment of a device for laser machining a workpiece
- FIG. 2 shows a schematic representation of a further exemplary embodiment of a device for laser machining a workpiece
- 3a shows schematic cross-sectional representations of an exemplary embodiment of a focus distribution of a focus zone for laser processing of the workpiece
- 3b shows schematic cross-sectional representations of a further exemplary embodiment of a focus distribution of a focus zone for laser processing of the workpiece
- 3c shows schematic cross-sectional representations of a further exemplary embodiment of a focus distribution of a focus zone for laser processing of the workpiece
- FIG. 4a shows a schematic cross-sectional illustration of a portion of an example of a focal zone which is introduced into a material of the workpiece
- FIG. 4b shows a schematic cross-sectional illustration of a section of a further example of a focal zone which is introduced into a material of the workpiece
- FIG. 5 shows a schematic cross-sectional illustration of a focal zone which completely penetrates the workpiece from a first outer side to a second outer side;
- FIG. 7 shows a schematic cross-sectional illustration of material modifications in the material of the workpiece produced by means of a focal zone, these material modifications being produced by means of heat accumulation and/or being accompanied by a change in the refractive index of the material;
- FIG. 8 shows a cross-sectional illustration of a simulated intensity distribution of an example of a focal zone which has a plurality of spaced-apart elongated focal distributions
- FIG. 11 is a schematic representation of a phase distribution associated with abrupt self-focusing beams
- 13a shows a schematic perspective illustration of material modifications which are produced in the material of the workpiece along a machining line and/or machining surface
- 13b shows a schematic representation of two segments of the workpiece, which are formed by separating the workpiece at the machining line and/or machining surface.
- FIG. 1 An exemplary embodiment of a device for laser machining a workpiece is shown in FIG. 1 and is denoted by 100 there.
- the device 100 can be used in a material 102 of the workpiece 104 localized material modifications, such as defects in the submicrometer range or atomic level, which result in a weakening of the material.
- the workpiece can be separated into different segments, for example, in a subsequent step, or a segment can be separated from the workpiece 104, for example.
- the device 100 can be used to introduce material modifications into the material 102 at an angle of attack, so that an edge region of the workpiece 104 can be chamfered or beveled by separating a corresponding segment from the workpiece 104 .
- the device 100 comprises a first beam shaping device 106 into which a first input beam 108 is coupled.
- This first input beam 108 is a laser beam, for example, which is provided, for example, by means of a laser source 110 and/or is coupled out of a laser source 110.
- the first input beam 108 is to be understood, in particular, as a bundle of rays which comprises a plurality of beams running in particular in parallel.
- the laser beam provided by the laser source 110 is in particular a pulsed laser beam and/or an ultra-short pulse laser beam.
- the first beam shaping device 106 comprises a beam splitting element 112, by means of which the first input beam 108 is divided into a plurality of partial beams 114 and/or partial beam bundles. In the example shown in FIG. 1, two different partial beams 114a and 114b are indicated.
- the first beam-shaping device 106 and/or the beam-splitting element 112 are each embodied as a far-field beam-shaping element, for example.
- the partial beams 114 are focused by means of the focusing optics 116 in different partial areas 120 of a focus zone 122, which is introduced into the material 102 of the workpiece 104 for laser processing.
- a specific focus distribution is assigned to the first input beam 108 coupled into the first beam-shaping device 106 .
- This focus distribution is to be understood as meaning a geometric shape and/or an intensity profile which would be formed by focusing the first input beam 108 before it is coupled into the first beam-shaping device 106 .
- the first input beam 108 which is provided, for example, by means of the laser source 108, has a Gaussian beam profile.
- a focus distribution with a Gaussian shape and/or a Gaussian intensity profile would be formed by focusing the first input beam 108 before it is coupled into the first beam-shaping device 106 .
- the form of the focus distribution means a characteristic spatial form and/or spatial extent of the focus distribution.
- the first input beam 108 coupled into the first beam shaping device 106 is split by means of the beam splitting element 112 in such a way that the partial beams 114 are also assigned this focus distribution.
- Focus distributions 124 are formed, these focus distributions 124 being based on the focus distribution assigned to the first input beam 108 .
- the focus zone 122 is thereby built up and/or formed by arranging different focus distributions 124 in a row.
- different focus distributions 124 are to be understood as meaning focus distributions 124 at different spatial positions of the focus zone 122, these different focus distributions 124 having at least approximately the same geometric shape and/or the same geometric intensity profile.
- Different focus distributions 124 are arranged at a distance from one another in the focus zone 122 . In principle, it is possible for different focus distributions 124 that are adjacent to one another to spatially overlap.
- focus distributions are formed as identical copies by beam splitting by means of the beam splitting element 112 , which are imaged in different partial regions 120 of the focus zone 122 .
- the beam splitting element 112 is designed as a 3D beam splitting element.
- the technical implementation and properties of the beam splitting element 112 reference is made to the scientific publication "Structured light for ultrafast laser micro- and nanoprocessing" by D. Flamm et al., arXiv:2012.10119vl [physics. optics], December 18, 2020.
- a distance dl and/or a spatial offset between adjacent focus distributions 124 can be set by means of the beam splitting element 112 .
- a distance dx and/or a spatial offset in an x-direction and a distance dz and/or a spatial offset in a z-direction oriented perpendicularly to the x-direction can be set between mutually adjacent focus distributions 124 .
- partial beams 114 that differ from one another are formed, for example by means of the beam splitting element 112, in such a way that they impinge on the focusing optics 116 with a specific spatial offset and/or with a specific convergence and/or divergence.
- the mutually different partial beams 114 are then imaged by means of the focusing optics 116 with a resulting spatial offset in the x-direction and/or z-direction.
- a defined transverse phase distribution is impressed on a transverse beam cross section of the first input beam 108 in order to carry out the beam splitting by means of the beam splitting element 112 .
- Examples of transverse phase distributions of beams coupled out of the beam splitting element 112 and associated focus zones 112 are shown, for example, in FIGS. 12a, b and 12c, d and 12e, f.
- the phase is impressed by means of the beam splitting element 112, for example in such a way that the assigned phase distribution for each focus distribution 124 has a specific optical grating component and/or optical lens component. Due to the optical grating portion, there is an angular deflection of partial beams 114 in front of the focusing optics 116, which results in a spatial offset in the x-direction after focusing has taken place. Due to the optical lens component, partial beams 116 with different convergence and/or divergence impinge on the focusing optics 116, which results in a spatial offset in the z-direction after focusing has taken place.
- a polarization beam splitting of the first input beam 108 and/or a beam coupled out of the beam splitting element 112 is carried out by means of the polarization beam splitting element 126 into beams which each have one of at least two different polarization states.
- Partial beams 114 each have one of at least two different polarization states. These partial beams 114 with different states of polarization are focused into the different partial regions 120 of the focal zone 122 by means of the focusing optics 116 .
- the polarization beam splitting element 126 is arranged in front of or behind the beam splitting element 116 with respect to a main propagation direction 128 of the first input beam 108 coupled into the first beam shaping device 106 .
- the polarization states of the partial beams 114 are linear polarization states, with two different polarization states being provided, for example, and/or with the respective polarization directions of partial beams that are different from one another being aligned at an angle of 90° to one another.
- the partial beams 114 are polarized in such a way that an electric field is oriented in a plane perpendicular to their direction of propagation (transversally electric).
- the polarization beam splitting element 126 has, for example, a birefringent lens element and/or a birefringent wedge element.
- the birefringent lens element and/or the birefringent wedge element are made of, for example, a quartz crystal or comprise a quartz crystal.
- the birefringent lens element is used, for example, to form partial beams 114 with different polarization states in such a way that they are imaged with a spatial offset in the z-direction and/or x-direction by focusing using the focusing optics 116 .
- focus distributions 124 formed from partial beams 114 with different polarization states can be arranged in the focus zone 122 with a spatial offset in the z-direction and/or x-direction.
- polarization beam splitting element 126 By means of the polarization beam splitting element 126, for example, a series of focus distributions 124 can be implemented in the focus zone 122, wherein mutually adjacent focus distributions 124 are each formed from partial beams 114 with different polarization states.
- the first beam-shaping device 106 has a beam-shaping element 130, by means of which the focus distribution assigned to the first input beam 108 can be modified after it has been coupled into the first beam-shaping device 106.
- the beam-shaping element 130 is defined, for example, as a diffractive or refractive phase element for impressing
- the beam-shaping element 130 is designed as a diffractive field mapper.
- the beam-shaping element 130 is arranged in front of or behind the beam-splitting element 112 with respect to the main propagation direction 128 of the first input beam 108 .
- the beam shaping element 130 is arranged between the beam splitting element 112 and the polarization beam splitting element 126 .
- the input beam 108 is first processed with the beam splitting element 112 and then with the beam shaping element 130 and/or with the polarization beam splitting element 126.
- a geometric shape and/or an intensity profile of the focus distributions 124 imaged in the focus zone 122 can be modified by means of the beam-shaping element 130 .
- a modification of the focus distributions 124 of the focus zone 122 by means of the beam-shaping element 130 can take place in a cross-sectional plane parallel to the feed direction 129, with this cross-sectional plane being oriented in particular perpendicular to the main propagation direction 128 and/or perpendicular to the z-direction (Fig. 3a, 3b and 3c ).
- the focus distribution 124 in the plane parallel to the feed direction 129 is elliptical and/or embodied as an ellipse.
- the preferred direction 132 is oriented parallel to a major semi-axis of this ellipse.
- the focus distribution 124 it is also possible for the focus distribution 124 to have a plurality of preferred directions 132 .
- the focus distribution 124 in the plane parallel to the feed direction 129 is rectangular and/or rectangular and in particular square.
- the focus distribution 124 has a first preferred direction 132'a, which is oriented, for example, parallel to the x-direction, and a second preferred direction 132'b, which is oriented, for example, transverse and in particular perpendicular to the x-direction, i.e. in the shown Example parallel to the y-direction.
- first preferred direction 132'a and the second preferred direction 132'b are each parallel to connecting lines between opposite corners of the rectangle.
- an alignment 136 and/or orientation of the focus distribution 124 in the cross-sectional plane oriented perpendicularly to the feed direction 129 can be adjusted by means of the beam-shaping element 130, with the alignment 136 of the respective main extension direction 134 of the focus distribution 124 being adjustable, for example.
- the respective alignment 136 of the focus distributions 124 is adjusted by means of the beam-shaping element 130, for example, in such a way that the alignment 136 is oriented parallel or approximately parallel to a local direction of extension 138 of the focus zone 122 associated with the respective focus distribution 124 .
- the local extension direction 138 of the focus zone 122 is to be understood, for example, as a local distance direction from adjacent focus distributions 124, for example from two or three adjacent focus distributions 124.
- the focus distributions 124 of the focus zone 122 can be arranged, for example, in different sections of the focus zone 122 with different local directions of extension 138 .
- the focus distribution 124 has a longitudinal central axis 140 along which it extends.
- This longitudinal central axis 140 is, for example, formed in a straight line (FIG. 4a).
- the longitudinal center axis 140 has a curved shape or a shape that is curved in sections (FIG. 4b).
- the focus distributions 124 assigned to the focus zone 122 are arranged by means of the first beam shaping device 106 along a longitudinal axis 142 of the focus zone 122, which is, for example, rectilinear (FIGS. 4a and 4b).
- the longitudinal axis 142 is not necessarily formed in a straight line and/or continuously.
- the longitudinal axis 142 can be curved at least in sections. It is also possible for the longitudinal axis 142 to have changes of direction and, in particular, discontinuous changes of direction.
- the first outside 144 and the second outside 146 of the workpiece 104 are oriented parallel or approximately parallel to one another, for example.
- first section 150 and the third section 154 have an angle of attack ⁇ of 45° and the second section 152 has an angle of attack ⁇ of 90°.
- the second input beam 160 coupled into the second beam-shaping device 158 has, for example, a Gaussian beam profile, i.e. the second input beam 160 has a Gaussian shape and/or a Gaussian intensity profile.
- the second beam-shaping device 158 is set up and configured such that the second beam-shaping device 158 is used to assign a quasi-non-diffracting and/or Bessel-like beam profile to the first input beam 108 coupled into the first beam-shaping device 106 .
- the first input beam 108 can be imaged in particular in a focus distribution with a quasi-non-diffracting and/or Bessel-like beam profile.
- the focus distribution 124 mapped into the focal zone 122 has an elongated shape and/or an elongated intensity profile (FIGS. 2 and 8).
- the focus distribution 124 in this embodiment has a main extension direction 162 along which it extends.
- the first input beam 108 provided by the second beam-shaping device 158 in this specific embodiment is coupled into the first beam-shaping device 106 .
- this first input beam 108 is divided into mutually different partial beams 114 by means of the beam splitting element 112 of the first beam shaping device 106 , which are imaged in the different partial regions 120 of the focal zone 122 by means of the focusing optics 116 .
- Focus distributions 124 imaged in focus zone 122 by means of focusing optics 116 represent, in terms of their shape and/or their intensity profile, copies of the focus distribution assigned to first input beam 108, with focusing by means of focusing optics 116 in particular resulting in reduced imaging of focus distributions 124.
- FIG. 8 An example of focus distributions 124 with an elongated shape and/or elongated intensity profile that are imaged into the focal zone 122 by means of the focusing optics 116 is shown in FIG. 8 as a gray scale distribution, with lighter gray scale values standing for greater intensities.
- the focus distributions 124 are oriented transversely to the longitudinal axis 142 and/or to the local direction of extension 138 . It can be provided that in the first beam shaping device 106, as described above, beam shaping is carried out by means of the beam shaping element 130 and/or beam splitting by means of the polarization beam splitting element 126.
- the shape and/or intensity profile of the focus distributions 124 imaged by the focusing optics 116 are based on the focus distribution assigned to the first input beam 108, but due to the processing by the beam-shaping element 130 and/or the polarization beam-splitting element 126 they point in comparison to that of the first Input beam 108 associated focus distribution has a modified shape and / or modified polarization properties.
- the second beam-shaping device 158 is set up and configured such that the second beam-shaping device 158 is used to assign a beam profile to the first input beam 108 coupled into the first beam-shaping device 106, the intensity profile of which is based on an intensity maximum 164 with respect to a main extension direction 166 and/or main extension axis exhibits an abrupt drop in intensity ( Figures 9a and 9b). Such beams are referred to, for example, as abrupt self-focusing beams.
- the focus zone 122 can be formed from a plurality of focus distributions 124 with such an intensity profile by imaging the partial beams 114 coupled out of the first beam-shaping device 106 (FIG. 10).
- the intensity profile of each of the focus distributions 124 of the focus zone 122 then has the abrupt drop in intensity.
- phase distribution is radially symmetrical with respect to an associated center axis 167 and/or beam center axis and/or rotationally symmetrical.
- This central axis 167 is oriented, for example, parallel or approximately parallel to a main propagation direction 267 of the second input beam 160 incident on the second beam-shaping device 158 .
- a phase frequency associated with the phase distribution increases in the radial direction 367 starting from the central axis 167 with an increasing radial distance from the central axis 167 .
- the first input beam 108 coupled into the first beam-shaping device 106 is assigned a shape and/or an intensity profile of an abruptly self-focusing beam.
- the second beam-shaping device 158 can be in the form of a near-field beam-shaping device.
- the far-field optics 170 are used to focus the intermediate image 168 far-field into the focal plane 174.
- An intensity distribution in the form of a ring structure and/or ring segment structure is formed in this focal plane 174 by the far-field focusing of the output beam 172 and/or output beam bundle, which is arranged in particular around an optical axis 176 of the far-field optics 170 .
- a telescope device 178 of the device 100 is formed by means of the far-field optics 170 and the focusing optics 116 .
- the far-field optics 170 have, in particular, a greater focal length than the focusing optics 116.
- the region of focal plane 174 mentioned is to be understood in particular as a far-field region of telescope device 178 in which, in particular, there is a far-field focusing of output beam 172 coupled out of second beam-shaping device 158 and/or of first input beam 108 to be coupled into first beam-shaping device 106.
- the focal zone 122 in the first section 180 and in the second section 182 has the same angle of incidence ⁇ at which the focal zone 122 is angled with respect to the first outer side 144 and/or the second outer side 146 .
- a smallest angle between the respective local direction of extent 138 of the first section 180 and the second section 182 is then twice as large as the angle of attack o.
- the focal zone 122 is moved through the material 102 of the workpiece 104 along a predefined processing line 184 and/or processing surface, for example.
- the processing line 184 can have straight and/or curved sections, for example.
- modification lines 186 are formed in the material, on which the material modifications 156 are arranged, these modification lines 186 in particular having a shape corresponding to the longitudinal axis 142 of the focal zone 122 .
- the modification lines 186 extend from the first outer side 144 to the second outer side 146.
- a distance between modification lines 186 that are adjacent in feed direction 129 can be defined, for example, by suitably selecting a pulse duration of a laser beam from which focal zone 122 is formed and/or a feed rate oriented in feed direction 129 .
- segment 188b is a good item segment with a desired edge shape.
- segment 188a is a residual workpiece segment and/or waste segment.
- Telescopic device first section second section processing line modification line a segment b segment edge area
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Abstract
Description
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| Application Number | Priority Date | Filing Date | Title |
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| DE102021102390 | 2021-02-02 | ||
| DE102021108505.5A DE102021108505A1 (de) | 2021-02-02 | 2021-04-06 | Vorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks |
| PCT/EP2022/051534 WO2022167254A1 (de) | 2021-02-02 | 2022-01-25 | Vorrichtung und verfahren zur laserbearbeitung eines werkstücks |
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| DE102021123962A1 (de) * | 2021-09-16 | 2023-03-16 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks |
| DE102022130022A1 (de) | 2022-11-14 | 2024-05-16 | Trumpf Laser Gmbh | Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks |
| DE102022131536A1 (de) | 2022-11-29 | 2024-05-29 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Lasersystem zum Trennen eines Werkstücks |
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| WO2014079478A1 (en) * | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| KR20170028943A (ko) * | 2014-07-14 | 2017-03-14 | 코닝 인코포레이티드 | 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템 |
| EP3221727B1 (de) * | 2014-11-19 | 2021-03-17 | Trumpf Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
| DE102014116958B9 (de) * | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
| DE102015110422A1 (de) * | 2015-06-29 | 2016-12-29 | Schott Ag | Laserbearbeitung eines mehrphasigen transparenten Materials, sowie mehrphasiger Kompositwerkstoff |
| LT6428B (lt) * | 2015-10-02 | 2017-07-25 | Uab "Altechna R&D" | Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys |
| JP2019176079A (ja) * | 2018-03-29 | 2019-10-10 | 株式会社東京精密 | ウェーハ加工方法及びウェーハ加工装置 |
| JP2020004889A (ja) * | 2018-06-29 | 2020-01-09 | 三星ダイヤモンド工業株式会社 | 基板の分断方法及び分断装置 |
| TWI678342B (zh) | 2018-11-09 | 2019-12-01 | 財團法人工業技術研究院 | 形成導角的切割方法 |
| DE102019217577A1 (de) | 2019-11-14 | 2021-05-20 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zur Laserbearbeitung eines Werkstücks, Bearbeitungsoptik und Laserbearbeitungsvorrichtung |
| DE102020207715A1 (de) | 2020-06-22 | 2021-12-23 | Trumpf Laser- Und Systemtechnik Gmbh | Bearbeitungsoptik, Laserbearbeitungsvorrichtung und Verfahren zur Laserbearbeitung |
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| US20240017357A1 (en) | 2024-01-18 |
| KR20230130163A (ko) | 2023-09-11 |
| JP2025186461A (ja) | 2025-12-23 |
| JP2024504842A (ja) | 2024-02-01 |
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