EP4283785A1 - Module d'antenne et dispositif électronique le comprenant - Google Patents

Module d'antenne et dispositif électronique le comprenant Download PDF

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Publication number
EP4283785A1
EP4283785A1 EP22771647.9A EP22771647A EP4283785A1 EP 4283785 A1 EP4283785 A1 EP 4283785A1 EP 22771647 A EP22771647 A EP 22771647A EP 4283785 A1 EP4283785 A1 EP 4283785A1
Authority
EP
European Patent Office
Prior art keywords
electronic device
antenna
circuit board
dielectric resonator
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22771647.9A
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German (de)
English (en)
Inventor
Junghwan YEOM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP4283785A1 publication Critical patent/EP4283785A1/fr
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0485—Dielectric resonator antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/40—Element having extended radiating surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • Various embodiments disclosed in the disclosure relate to an antenna module and an electronic device including the same.
  • An electronic device may transmit and/or receive a radio frequency (RF) signal including a voice signal or data (e.g., a message, photo, video, music file, or game) using an antenna.
  • RF radio frequency
  • the antenna is able to simultaneously transmit and receive signals belonging to different frequency bands using a plurality of frequency bands.
  • the electronic device may service a global communication band using signals belonging to different frequency bands. For example, the electronic device may perform communication using a signal belonging to a low frequency band (LB) (e.g., GPS, Legacy, or Wifi1) and/or communication using a signal belonging to a high frequency band (HB) (e.g., Wifi2).
  • LB low frequency band
  • HB high frequency band
  • the electronic device may transmit and receive signals using an antenna module including a plurality of components (e.g., a patch antenna and/or a dielectric resonator) inside a housing.
  • the dielectric resonator included in the antenna module may be attached to a ground portion formed on a printed circuit board, and the patch antenna (e.g., an inverted L monopole antenna) may be electrically connected to a point on the printed circuit board to be fed with electric power.
  • the dielectric resonator may be referred to as a resonant antenna element that radiates or receives an RF signal of a specified frequency band.
  • the dielectric resonator may be made of a material having a high permittivity.
  • the electronic device may transmit and/or receive signals belonging to various frequency bands using the antenna module.
  • An electronic device may include a plurality of antennas that transmit and/or receive signals of different frequency bands.
  • the electronic device may have a physical limit (e.g., Chu-Harrington limit) in securing a frequency band through which a plurality of antennas transmit and receive signals.
  • a physical limit e.g., Chu-Harrington limit
  • an antenna included in the electronic device has to be implemented with a specific size or larger, and thus has no choice but to have a Q (quality factor) value equal to or greater than a specified value.
  • the electronic device has a problem in that the electronic device supports only frequency signals corresponding to bandwidths at or below a certain level due to limitations in the performance of the antenna.
  • a mounting space of the electronic device it may be difficult to arrange a plurality of antennas based on a desirable separation distance. For example, mutual interference between a plurality of antenna radiators transmitting and/or receiving signals of different frequency bands may occur. In this case, it may be difficult for the electronic device to provide simultaneous services in a plurality of different frequency bands.
  • An aspect of the disclosure provides an electronic device including a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding a space between the first plate and the second plate, a support member disposed in the space between the first plate and the second plate, a first printed circuit board disposed on a first surface of the support member and including a wireless communication circuit, a second printed circuit board disposed on the first surface of the support member and electrically connected to the first printed circuit board, a dielectric resonator antenna disposed on the first circuit board, and a monopole antenna disposed on one surface of the dielectric resonator antenna facing the second direction when the back plate is viewed in the first direction.
  • one point of a bent portion included in the monopole antenna may be disposed to be included on a specified region of the one surface of the dielectric resonator antenna.
  • the wireless communication circuit may feed one end of the monopole antenna with electric power.
  • an antenna module including a plurality of components can be mounted inside a housing based on a specified arrangement structure, and thus it is possible to secure improved radiation efficiency and it is possible to achieve a greater mounting space by allowing the antenna module to be implemented in a relatively miniaturized size.
  • a specific type of antenna e.g., an inverted L antenna
  • another type of antenna e.g., a dielectric resonator
  • the antenna module can be mounted based on the above-described arrangement structure, and thus it is possible to extend an electrical path of one component included in the antenna module, and it is possible to expand a baseband, accordingly.
  • FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.
  • the electronic device 101 in the network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network).
  • the electronic device 101 may communicate with the electronic device 104 via the server 108.
  • the electronic device 101 may include a processor 120, memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connecting terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197.
  • at least one of the components e.g., the connecting terminal 178) may be omitted from the electronic device 101, or one or more other components may be added in the electronic device 101.
  • some of the components e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single component (e.g., the display module 160).
  • the processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134.
  • software e.g., a program 140
  • the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134.
  • the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121.
  • a main processor 121 e.g., a central processing unit (CPU) or an application processor (AP)
  • auxiliary processor 123 e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)
  • the main processor 121 may be adapted to consume less power than the main processor 121, or to be specific to a specified function.
  • the auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
  • the auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application).
  • the auxiliary processor 123 e.g., an image signal processor or a communication processor
  • the auxiliary processor 123 may include a hardware structure specified for artificial intelligence model processing.
  • An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • the artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto.
  • the artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
  • the memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101.
  • the various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thererto.
  • the memory 130 may include the volatile memory 132 or the non-volatile memory 134.
  • the program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
  • OS operating system
  • middleware middleware
  • application application
  • the input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101.
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker may be used for general purposes, such as playing multimedia or playing record.
  • the receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
  • the display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101.
  • the display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector.
  • the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.
  • the audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
  • an external electronic device e.g., an electronic device 102
  • directly e.g., wiredly
  • wirelessly e.g., wirelessly
  • the sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly.
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD secure digital
  • a connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102).
  • the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
  • the camera module 180 may capture a still image or moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
  • the communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel.
  • the communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication.
  • AP application processor
  • the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module).
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., a local area network (LAN) communication module or a power line communication (PLC) module.
  • LAN local area network
  • PLC power line communication
  • a corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth TM , wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)).
  • first network 198 e.g., a short-range communication network, such as Bluetooth TM , wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)
  • the second network 199 e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)).
  • the wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
  • subscriber information e.g., international mobile subscriber identity (IMSI)
  • the wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology.
  • the NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module 192 may support a high-frequency band (e.g., the mmWave band) to achieve, e.g., a high data transmission rate.
  • the wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199).
  • the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or more) for implementing eMBB, loss coverage (e.g., 164dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1ms or less) for implementing URLLC.
  • a peak data rate e.g., 20Gbps or more
  • loss coverage e.g., 164dB or less
  • U-plane latency e.g., 0.5ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1ms or less
  • the antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101.
  • the antenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)).
  • the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas.
  • the signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna.
  • another component e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
  • a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band)
  • a plurality of antennas e.g., array antennas
  • At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
  • an inter-peripheral communication scheme e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199.
  • Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101.
  • all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service.
  • the one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101.
  • the electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request.
  • a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet-of-things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or a neural network.
  • the external electronic device 104 or the server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or loT-related technology.
  • the electronic device may be one of various types of electronic devices.
  • the electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
  • each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C, “ “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases.
  • such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order).
  • an element e.g., a first element
  • the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
  • module may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”.
  • a module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions.
  • the module may be implemented in a form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101).
  • a processor e.g., the processor 120
  • the machine e.g., the electronic device 101
  • the one or more instructions may include a code generated by a complier or a code executable by an interpreter.
  • the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
  • non-transitory simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
  • a method may be included and provided in a computer program product.
  • the computer program product may be traded as a product between a seller and a buyer.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore TM ), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
  • CD-ROM compact disc read only memory
  • an application store e.g., PlayStore TM
  • two user devices e.g., smart phones
  • each component e.g., a module or a program of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration.
  • operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.
  • FIG. 2 is a perspective view illustrating a front surface of an electronic device 200 (e.g., the electronic device 101 of FIG. 1 ) according to an embodiment.
  • FIG. 3 is a perspective view illustrating a rear surface of the electronic device 200 according to an embodiment.
  • the electronic device 200 may include a housing 210 including a first surface (or front surface) 210A, a second surface (or back surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B.
  • the housing may refer to a structure forming some of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 2 .
  • the first surface 210A may be formed by a front plate 202 (e.g., a glass plate or a polymer plate including various coating layers) that is at least partially substantially transparent.
  • the second surface 210B may be formed by a back plate 211 that is substantially opaque.
  • the back plate 211 may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 210C may be coupled with the front plate 202 and the back plate 211, and may be formed by a side bezel structure (or "side member") 218 that includes metal and/or polymer.
  • the back plate 211 and the side bezel structure 218 may be integrally formed and may include the same material (e.g., a metal material such as aluminum).
  • the front plate 202 may include two first regions 210D that are curved from the first surface 210A toward the back plate 211 and extend seamlessly at both long edges of the front plate 202.
  • the back plate 211 may include two second regions 210E that are curved from the second surface 210B toward the front plate 202 and extend seamlessly at the both long edges.
  • the front plate 202 (or the back plate 211) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, some of the first regions 210D or the second regions 210E may not be included.
  • the side bezel structure 218 when viewed from the side of the electronic device 200, may have a first thickness (or width) on the sides where the first regions 210D or the second regions 210E as described above are not included, and may have a second thickness thinner than the first thickness on the sides (e.g., long sides) where the first regions 210D or the second regions 210E are included.
  • the side member of the housing 210 of the electronic device 200 e.g., the side bezel structure 218 of FIG. 3
  • two first regions 210D that are curved from the first surface 210A of the front plate 302 toward the back plate 211 and extend seamlessly
  • two second regions 210E that are curved from the second surface 210B of the back plate 211 toward the front plate 202 and extend seamlessly
  • at least one antenna radiator e.g., a conductive pattern
  • the at least one antenna radiator may radiate a signal of a specified frequency band.
  • the at least one antenna radiator may be an auxiliary radiator.
  • the at least one antenna radiator may radiate a signal belonging to a 5G Sub-6 frequency band of 3.5 GHz or more and about 6 GHz or less, such as n41, n78, and/or n79.
  • the at least one antenna radiator may radiate a frequency of a Wifi frequency band.
  • the Wifi frequency band may include a frequency band such as 802.11a and/or 802.11b.
  • the at least one antenna radiator may be a main radiator.
  • a frequency band radiated by the main radiator and a frequency band radiated by the auxiliary radiator may be partially the same and different in others.
  • the at least one antenna radiator may radiate a frequency in a mmWave frequency band.
  • the mmWave frequency band may include a frequency band such as about 24 to 34 GHz and/or about 37 to 44 GHz.
  • the at least one antenna radiator may radiate a frequency of a 11ay frequency band.
  • the electronic device 200 may include at least one of a display 201 (e.g., the display module 160 of FIG. 1 ), audio modules 303, 307, and 314 (e.g., the audio module 170 of FIG. 1 ), sensor modules 304, 316, and 319 (e.g., the sensor module 176 of FIG. 1 ), camera modules 205, 212, and 213 (e.g., the camera module 180 of FIG. 1 ), key input devices 217, a light emitting element 206, and connector holes 208 and 209.
  • the electronic device 200 may omit at least one of the components (e.g., the key input devices 217 or the light emitting element 206) or may additionally include other components.
  • the display 201 may be exposed through a significant portion of the front plate 202, for example. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first surface 210A and the first regions 210D of the side surface 210C. In some embodiments, an edge of the display 201 may be formed to be substantially the same as the outer edge of the front plate 202 adjacent to the edge. In another embodiment (not illustrated), in order to expand the area where the display 201 is exposed, a distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same as each other.
  • a recess or opening may be formed, and at least one of an audio module 214, a sensor module 204, a camera module 205, and the light emitting element 206, which are aligned with the recess or the opening may be included.
  • the display 201 may include, on the back of the screen display region of the display 201, at least one of the audio module 214, the sensor module 204, the camera module 205, a fingerprint sensor 216, and the light emitting element 206.
  • the display 201 may be coupled with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and/or a digitizer detecting a magnetic field type stylus pen.
  • a touch sensing circuit capable of measuring the intensity (pressure) of the touch
  • a digitizer capable of measuring the intensity (pressure) of the touch
  • a digitizer detecting a magnetic field type stylus pen.
  • at least some of the sensor modules 204 and 219, and/or at least some of the key input devices 217 may be disposed on the first regions 210D and/or the second regions 210E.
  • the audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214.
  • a microphone for acquiring external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to sense the direction of sound.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a call receiver hole 214.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker without the speaker holes 207 and 214 (e.g., a piezo speaker) may be included.
  • the sensor modules 204, 216, and 219 may generate an electrical signal or data value corresponding to an internal operational state or an external environmental state of the electronic device 200.
  • the sensor modules 204, 216, and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not illustrated)(e.g., the fingerprint sensor) disposed on the first surface 210A of the housing 210, and/or a third sensor module 219 (e.g., an HRM sensor) and/or a fourth sensor module 216 (e.g., the fingerprint sensor) disposed on the second surface 210B of the housing 210.
  • a first sensor module 204 e.g., a proximity sensor
  • a second sensor module not illustrated
  • a third sensor module 219 e.g., an HRM sensor
  • a fourth sensor module 216 e.g., the fingerprint sensor
  • the fingerprint sensor may be disposed on the second surface 210B as well as the first surface 210A (e.g., the display 201) of the housing 210.
  • the electronic device 200 may further include a sensor module, which is not illustrated, for example, a at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 204.
  • a sensor module which is not illustrated, for example, a at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 204.
  • the camera modules 205, 212, and 213 may include a first camera device 205 disposed on the first surface 210A of the electronic device 200, and a second camera device 212 and/or a flash 213 disposed on the second surface 210B.
  • the camera devices 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 200.
  • the key input devices 217 may be disposed on the side surface 210C of the housing 210.
  • the electronic device 200 may not include some or all of the key input devices 217 mentioned above, and the key input device(s) 217, which is (are) not included, may be implemented in other forms, such as a soft key, on the display 201.
  • the key input device may include the sensor module 216 disposed on the second surface 210B of the housing 210.
  • the light emitting element 206 may be disposed on the first surface 210A of the housing 210, for example.
  • the light emitting element 206 may provide, for example, state information about the electronic device 200 in the form of light.
  • the light emitting element 206 may provide, for example, a light source linked with the operation of the camera module 205.
  • the light emitting element 206 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 208 and 209 may include a first connector hole 208 capable of accommodating a connector (for example, a USB connector) for transmitting and receiving electric power and/or data to and from an external electronic device, and/or a second connector hole 209 (e.g., an earphone jack) capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.
  • a connector for example, a USB connector
  • a second connector hole 209 e.g., an earphone jack
  • FIG. 4 is an exploded perspective view 400 illustrating an electronic device (e.g., the electronic device 200 of FIG. 2 and/or FIG. 3 ) according to an embodiment.
  • the electronic device 200 may include a side bezel structure 410 (e.g., the side bezel structure 218 of FIG. 2 ), a first support member 411 (e.g., a bracket), a front plate 420, a display 430 (e.g., the display 201 of FIG.
  • the electronic device 200 may omit at least one of the components (e.g., the first support member 411 or the second support member 460) or may additionally include other components. At least one of the components of the electronic device 200 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2 or FIG. 3 , and the description thereof will not be repeated below.
  • PCB printed circuit board
  • the side bezel structure 410 may include at least one conductive member that surrounds a space between the front plate 420 and the back plate 480 of the electronic device 200 and is spaced apart by a slit.
  • the side bezel structure 410 may further include a plurality of slits (not illustrated).
  • the side bezel structure 410 may further include a plurality of conductive members spaced apart by the plurality of slits. Each of the conductive members may be fed with electric power from a printed circuit board mounted inside the electronic device 200 to transmit and/or receive signals of a specified frequency band.
  • the first support member 411 may be disposed in the space between the front plate 420 and the back plate 480.
  • the first support member 411 may be disposed inside the electronic device 200 to be connected to the side bezel structure 410 or may be integrally formed with the side bezel structure 410.
  • the first support member 411 may be formed of, for example, a metal material and/or a non-metal (e.g., polymer) material.
  • the display 430 may be disposed on a first surface (e.g., one surface facing a +z-axis direction) of the first support member 411, and the PCB 440 may be disposed on a second surface (e.g., one surface facing a -z-axis direction) facing the opposite direction to the first surface.
  • a processor e.g., the processor 120 of FIG. 1
  • a memory e.g., the memory 130 of FIG. 1
  • an interface e.g., the interface 177 of FIG. 1
  • a wireless communication circuit e.g., the wireless communication module 192 of FIG. 1
  • the processor 120 may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), an image signal processor (ISP), a sensor hub processor (SHP), or a communication processor (CP).
  • the memory may include, for example, a volatile memory or a non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and/or an audio interface.
  • the interface may electrically or physically connect the electronic device 200 with an external electronic device (e.g., the electronic devices 102 and 104 of FIG. 1 ), for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the wireless communication circuit may be a radio frequency integrated circuit (RFIC).
  • RFIC radio frequency integrated circuit
  • the wireless communication circuit may feed electric power to at least a portion of the side bezel structure 410 (e.g., a plurality of conductive members spaced apart by slits).
  • the wireless communication circuit may feed electric power to the antenna module (e.g., the monopole antenna) mounted inside the electronic device 200.
  • the battery 450 may be a device for supplying power to at least one of the components of the electronic device 200, and may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. At least a portion of the battery 450 may be disposed on substantially the same plane as the PCB 440, for example. The battery 450 may be integrally disposed inside the electronic device 200 or may be disposed to be detachable from the electronic device 200.
  • the short-range antenna 470 may be disposed between the back plate 480 and the battery 450.
  • the antenna 470 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 470 may, for example, perform short range communication with an external device, or may wirelessly transmit and receive electric power required for charging.
  • an antenna structure may be formed by the side bezel structure 410 and/or a portion of the first support member 411 or a combination thereof.
  • the wireless communication circuit may feed electric power to a portion of the side bezel structure 410 (e.g., a plurality of conductive members spaced apart by slits), so that the portion may operate as an antenna radiator.
  • a portion of the side bezel structure 410 e.g., a plurality of conductive members spaced apart by slits
  • FIG. 5 illustrates a mounting structural diagram of the inside of a housing of an electronic device according to various embodiments.
  • An electronic device may include a side member 510 (e.g., the side bezel structure 410 of FIG. 4 ).
  • a drawing shown at reference number 501 of FIG. 5 may be a cross-sectional view of a back plate of the electronic device viewed in a first direction (e.g., a +z-axis direction).
  • the electronic device may include various components inside a housing.
  • the electronic device may include a battery 550 inside the housing.
  • the electronic device may include various components shown in a region corresponding to reference numeral 520 inside the housing.
  • the electronic device may include various components inside the housing.
  • the electronic device may include the side member 510, a first printed circuit board 550 electrically connected to the side member 510, and an antenna module 560 disposed on one surface of the first printed circuit board 550, but the electronic device is not limited thereto and may further include a second printed circuit board (not illustrated).
  • the first printed circuit board 550 may be a flexible printed circuit board (FPCB).
  • the first printed circuit board 550 may include a bending region 553 that is bent at a specified angle (e.g., 90 degrees), and a first region 551 and a second region 552 which are divided from each other based on the bending region 553.
  • one point of the first region 501 of the first printed circuit board 550 may be electrically connected to the side member 510, and one point of the second region 552 thereof may be electrically connected to at least a portion of the antenna modules 560.
  • At least a portion of the first region 551 of the first printed circuit board 550 may correspond to a power feeder that feeds electric power to a conductive member included in the side member 510, and at least a portion of the second region 552 thereof may correspond to a ground region for at least one component of the antenna module 560.
  • the first printed circuit board 550 may include a power feeding circuit for feeding electric power to the antenna module 560 and a planar ground portion.
  • the first printed circuit board 550 may be disposed formed on a first surface of a support member (e.g., the support member 411 or the second support member 460 of FIG. 4 ) (e.g., one surface facing a -z direction of the support member) inside the housing.
  • the first printed circuit board 550 may be electrically connected to the second printed circuit board (e.g., a main PCB). Descriptions of mounting structures of the first printed circuit board 550 and the second printed circuit board may be replaced with descriptions of FIGS. 6 and 7 to be described below.
  • the antenna module 560 may be referred to as one component including a plurality of antennas of different types.
  • the antenna module 560 may include a dielectric resonator antenna.
  • the dielectric resonator antenna included in the antenna module 560 may be substantially built in a rectangular parallelepiped shape.
  • the dielectric resonator antenna may be disposed on one surface of the first printed circuit board 550.
  • the antenna module 560 may further include a monopole antenna.
  • the monopole antenna may be disposed on a first surface of the dielectric resonator antenna facing a second direction (e.g., the -z direction).
  • a second direction e.g., the -z direction
  • one point of a bent portion included in the monopole antenna may be included on a specified region of the one surface of the dielectric resonator antenna.
  • a description of an arrangement structure of the dielectric resonator antenna and the monopole antenna may be referred to in more detail in the descriptions of FIGS. 6 and 7 to be described below.
  • FIG. 6 illustrates a mounting conceptual diagram of the inside of a housing of an electronic device according to various embodiments.
  • an electronic device may include various components mounted inside a housing.
  • the electronic device may include a side member 610 (e.g., the side bezel structure 410 of FIG. 4 ) , a first printed circuit board 650 (e.g., the first printed circuit board 550 of FIG. 5 ) electrically connected to the side member 610 and disposed on a first surface of a support member (e.g., the first support member 411 or the second support member 460 of FIG.
  • the side member 610 may include a plurality of members physically divided by at least one nonconductive material.
  • the plurality of members may be conductive members, and may be fed with electric power from a wireless communication circuit (e.g., the communication module 190 of FIG. 1 ) to transmit and/or receive signals of a specified frequency band.
  • a wireless communication circuit e.g., the communication module 190 of FIG. 1
  • the electronic device may include the side member 610, the second printed circuit board 640, and the first printed circuit board 650 electrically connected to the dielectric resonator antenna 661 and/or the monopole antenna 662, and including a wireless communication circuit (e.g., the communication module 190 of FIG. 1 ).
  • a wireless communication circuit e.g., the communication module 190 of FIG. 1
  • the first printed circuit board 650 may be an FPCB.
  • the first printed circuit board 650 may include a bending region 653 that is bent at a specified angle (e.g., 90 degrees), and a first region 651 and a second region 652 which are divided from each other based on the bending region.
  • the first region 651 of the first printed circuit board 650 may be electrically connected to the side member 610.
  • a power feeding circuit for feeding electric power to the conductive member included in the side member 610 may be included in the first region 651 of the first printed circuit board 650.
  • a power feeder for the conductive member included in the side member 610 may be formed in at least a portion of the first region 651.
  • One point 611 of the first region 651 may be electrically connected to the side member 610, and the side member 610 may be fed with electric power from the one point 611 of the first region 651.
  • the second region 652 of the first printed circuit board 650 may be electrically connected to the dielectric resonator antenna 661 and/or the monopole antenna 662.
  • the second region 652 of the first printed circuit board 650 may include a power feeding circuit for feeding electric power to the monopole antenna 662 and a ground region for providing a ground for the dielectric resonator antenna 661.
  • one point 663 of the second region 652 of the first printed circuit board 650 may be electrically connected to the monopole antenna 662 and feed electric power to one end of the monopole antenna 662.
  • at least a portion of the second region 652 of the first printed circuit board 650 may correspond to the ground region for the dielectric resonator antenna 661, and the ground region may include a planar ground portion.
  • the second printed circuit board 640 may be referred to as a main PCB electrically connected to the first printed circuit board 650.
  • at least a portion of the second printed circuit board 640 may include a ground region.
  • the dielectric resonator antenna 661 and the monopole antenna 662 are illustrated as being coupled on one surface of the first printed circuit board 650, but according to another embodiment, the dielectric resonator antenna 661 and the monopole antenna 662 may be coupled to at least a portion of a ground region included in the second printed circuit board 640 to be grounded.
  • the dielectric resonator antenna 661 may be coupled on one surface of the first printed circuit board 650.
  • the dielectric resonator antenna 661 may be substantially built in a rectangular parallelepiped shape.
  • a relative permittivity of the dielectric resonator antenna may be 10 to 50 F/m.
  • the dielectric resonator antenna 661 may be disposed in a form in which it is coupled to one surface included in the second region 652 of the first printed circuit board 650.
  • the one surface included in the second region 652 may correspond to one surface of the first printed circuit board 650 facing a third direction (e.g., a - x direction) that is one direction substantially orthogonal to a first direction (e.g., the +z direction) and a second direction (e.g., the -z direction) and oriented when the side member 610 is viewed toward the outside of the housing.
  • a third direction e.g., a - x direction
  • the dielectric resonator antenna 661 may be disposed on and grounded on the planar ground portion.
  • the dielectric resonator antenna 661 may be disposed to be spaced apart from the side member 610 by a specified distance. As illustrated in FIG.
  • the dielectric resonator antenna 661 may be coupled to one surface of the first printed circuit board 650 and disposed to be spaced apart from the side member 610 by a specified distance in the + x direction.
  • Various types of antennas may be disposed on one surface of the dielectric resonator antenna 661.
  • the monopole antenna 662 may be disposed on one surface of the dielectric resonator antenna 661.
  • the monopole antenna 662 may correspond to an inverted L antenna.
  • the monopole antenna 662 may be disposed on one surface of the dielectric resonator antenna 661 facing the second direction.
  • the monopole antenna 662 may be attached to the one surface or may be disposed to be spaced apart from the one surface by a specified distance in the second direction.
  • a dielectric may be formed in the separation space between the monopole antenna and the dielectric resonator antenna.
  • the monopole antenna 662 may be disposed to be spaced apart from the dielectric resonator antenna 661 by the specified distance by the dielectric.
  • One end of the monopole antenna 662 may be electrically connected to at least one point of the second region 652 of the first printed circuit board 650 and fed with electric power.
  • the monopole antenna 662 may be disposed so that one point of the bent portion included in the monopole antenna 662 is included on a specified region of one surface of the dielectric resonator antenna facing the second direction.
  • the specified region of the dielectric resonator 661 may be a central region on the one surface of the dielectric resonator antenna 661 facing the second direction.
  • the one point of the bent portion may correspond to a point adjacent to the first printed circuit board 650 in the bent portion of the monopole antenna 662.
  • a description of the specified region of the dielectric resonator antenna 661 may be referred to in more detail in FIG. 7 to be described below.
  • FIG. 7 illustrates a mounting conceptual diagram 700 of the inside of a housing of an electronic device according to various embodiments.
  • an electronic device may include a plurality of components mounted inside a housing.
  • the electronic device may include a side member 710, a first printed circuit board 750, a dielectric resonator antenna 761, and/or a monopole antenna 762.
  • a side member 710 e.g., the electronic device 101 of FIG. 1
  • the electronic device may include a side member 710, a first printed circuit board 750, a dielectric resonator antenna 761, and/or a monopole antenna 762.
  • an arrangement structure between components may be described below in more detail.
  • the dielectric resonator antenna 761 may be disposed on one surface 750-1 of the first printed circuit board 750.
  • a relative permittivity of the dielectric resonator antenna 761 included in the electronic device may be 10 to 50 F/m.
  • the dielectric resonator antenna 761 may substantially correspond to a rectangular parallelepiped shape, and the dielectric resonator antenna 761 may be disposed so that one surface thereof is coupled to one surface 750-1 of the first printed circuit board 750.
  • the one surface 750-1 may be at least a portion of a second region (e.g., the second region 652 of FIG. 6 ) of the first printed circuit board 750 and include a planar ground portion.
  • the one surface 750-1 may be one surface included in the second region and facing the third direction (e.g., the -x direction) and referred to as one surface of the first printed circuit board 750 facing the outside of the housing when the side member 710 is viewed.
  • the dielectric resonator antenna 761 may be grounded by being coupled to the planar ground portion.
  • a plurality of conductive members (not illustrated) included in the side member 710 and divided by slits (or openings) may be grounded by the planar ground portion.
  • the dielectric resonator antenna 761 may be disposed to be coupled to the one surface 750-1 and spaced apart from the side member 10 by a specified distance.
  • the monopole antenna 762 may be disposed so that at least a portion thereof overlaps the dielectric resonator antenna 761 when the back plate (e.g., the back plate 480 of FIG. 4 ) is viewed in the first direction (e.g., the + z direction).
  • the monopole antenna 762 may be disposed on one surface of the dielectric resonator antenna 761 facing the second direction (e.g., the - z direction).
  • the monopole antenna 762 may be disposed to be included on a specified region 770 of the dielectric resonator antenna 761.
  • one point 762-1 of a bent portion included in the monopole antenna 762 may be disposed to be included on the specified region 770 of one surface of the dielectric resonator antenna 761 facing the second direction.
  • the one point 762-1 may be referred to as a point of the bent portion included in the monopole antenna 762 that is adjacent to the first printed circuit board 750.
  • the specified region 770 may be referred to as a central region on the one surface of the dielectric resonator antenna 761.
  • One end of the monopole antenna 762 may be electrically connected to one point 750-2 of the second region included in the first printed circuit board 750 and fed with electric power.
  • the specified region 770 may be referred to as one region divided based on a plurality of axes on one surface of the dielectric resonator antenna 761 facing the second direction.
  • the specified region 770 may correspond to a region between a first axis 771 on the one surface of the dielectric resonator antenna 761, a second axis 772 substantially parallel to the first axis 771, and a third axis 773 substantially orthogonal to the first axis 771 and the second axis 772, and at least a portion of the first printed circuit board 750 (e.g., the one surface 750-1).
  • the first axis 771 and the second axis 772 may correspond to one axis horizontally crossing the dielectric resonator antenna 761 when the back plate (or the dielectric resonator antenna 761) is viewed in the first direction.
  • the third axis 773 may correspond to one axis substantially orthogonal to the first axis 771 and the second axis 772 when the back plate (or the dielectric resonator antenna 761) is viewed in the first direction, and vertically crossing the dielectric resonator antenna 761.
  • a vertical length d10 of one surface of the dielectric resonator antenna 761 may be 8 mm.
  • a distance d11 between the first axis 771 and one end of the dielectric resonator antenna 761 and a distance d13 between the second axis 772 and one end opposite to the one end of the dielectric resonator antenna 761 may be 2 mm, and a distance d12 between the first axis 771 and the second axis 772 may be 4 mm. Accordingly, the vertical length d12 of the specified region 770 may be 4 mm.
  • a horizontal length d20 of the one surface of the dielectric resonator antenna 761 may be 4 mm.
  • a distance d22 between the third axis 773 and one end of the dielectric resonator antenna 761 may be 1 mm, and a distance d21 between the third axis 773 and one end opposite to the one end of the dielectric resonator antenna 761 may be 3 mm. Accordingly, the horizontal length d21 of the specified region 770 may be 3 mm.
  • the monopole antenna 762 may be disposed so that one point 761-1 of the bent portion is included in the specified region 770 on the dielectric resonator antenna 761 defined by the foregoing when the back plate (or the dielectric resonator antenna 761) is viewed in the first direction.
  • the monopole antenna 762 is illustrated as being disposed on one surface of the dielectric resonator antenna 761 facing the second direction, but the embodiments of the disclosure are not limited thereto.
  • the monopole antenna 762 may be disposed to be spaced apart from the one surface of the dielectric resonator antenna 761 by a specified distance in the second direction.
  • a dielectric may be formed in the separation space between the monopole antenna 762 and the dielectric resonator antenna 761.
  • the dielectric resonator 761 and the monopole antenna 762 may be disposed in a form spaced apart by a specified distance by the dielectric.
  • FIG. 8 illustrates a flow of current induced in an antenna module according to various embodiments.
  • a monopole antenna 862 may be disposed so that one point 862-1 of a bent portion is included in a specified region (e.g., the specified region 770 of FIG. 7 ) of a dielectric resonator antenna 862 (e.g., the dielectric resonator antenna 562 of FIG. 5 ) when the back plate (or the dielectric resonator antenna 861) is viewed in the first direction.
  • a specified region e.g., the specified region 770 of FIG. 7
  • a dielectric resonator antenna 862 e.g., the dielectric resonator antenna 562 of FIG. 5
  • the monopole antenna 861 may be disposed in a form in which it is attached to one surface of the dielectric resonator antenna 862 facing the second direction (e.g., the -z direction), and disposed to be spaced apart from the dielectric resonator 862 by a specified distance with a dielectric interposed therebetween.
  • the monopole antenna 861 and the dielectric resonator antenna 862 may be disposed on one surface 850-1 of a first printed circuit board 850.
  • One end of the monopole antenna 862 may be electrically connected to one point 850-2 of a second region included in the first printed circuit board 850 and fed with electric power.
  • At least a portion of one surface 850-1 of the first printed circuit board 850 may include a planar ground portion, and the dielectric resonator antenna 862 may be grounded by the ground portion.
  • the one surface 850-1 may be one surface of the second region (e.g., the second region 652 of FIG. 6 ) of the first printed circuit board 850 facing the third direction (e.g., the -x direction), and referred to as one surface facing the outside of the housing when a side member 820 is viewed.
  • the dielectric resonator antenna 861 may be disposed to be spaced apart from the side member 810 by a specified distance d30.
  • current may be induced in at least a portion of the monopole antenna 862 and the first printed circuit board 850 due to the arrangement structure of the above-described components.
  • the current induced in the monopole antenna 862 may have different intensities for each section.
  • the monopole antenna 862 may be divided into three sections based on the intensity of the current. For example, in a first section 820 and a second section 821, the intensity of the current induced in the monopole antenna 862 may gradually increase. For example, the intensity of current may gradually increase from one end of the monopole antenna 862 to the one point 850-2 of the first printed circuit board 850, and the intensity of the current measured at the one point 850-2 may have a maximum value.
  • the intensity of the current induced in the first printed circuit board 850 may gradually decrease.
  • the intensity of the current induced from the one point 850-2 of the first printed circuit board 850 in the +y direction may gradually decrease.
  • an electronic device may include a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member surrounding a space between the first plate and the second plate, a support member disposed in the space between the first plate and the second plate, a first printed circuit board disposed on a first surface of the support member and including a wireless communication circuit, a second printed circuit board disposed on the first surface of the support member and electrically connected to the first printed circuit board, a dielectric resonator antenna disposed on the first circuit board, and a monopole antenna disposed on one surface of the dielectric resonator antenna facing the second direction when the back plate is viewed in the first direction.
  • one point of a bent portion included in the monopole antenna may be disposed to be included on a specified region of the one surface of the dielectric resonator antenna, and the wireless communication circuit may feed electric power to one end of the monopole antenna.
  • the dielectric resonator antenna may have a rectangular parallelepiped shape.
  • the monopole antenna may correspond to an inverted L antenna, and the one point may be a point of the bent portion adjacent to the first printed circuit board.
  • the specified region of the dielectric resonator antenna may be a central region on the one surface of the dielectric resonator.
  • the specified region of the dielectric resonator antenna may be a region between a first axis on the one surface of the dielectric resonator antenna, a second axis substantially parallel to the first axis, and a third axis substantially orthogonal to the first axis and the second axis, and at least a portion of the first printed circuit board.
  • the first axis and the second axis may correspond to one axis horizontally crossing the dielectric resonator antenna.
  • the first printed circuit board when the back plate is viewed in the first direction, may include a bent region curved at a specified angle, and a first region and a second region which are divided from each other based on the bent region.
  • one point of the first region may be electrically connected to the side member, and one point of the second region may be electrically connected to the monopole antenna.
  • At least a portion of the first region may correspond to a power feeder for a conductive member included in the side member, and at least a portion of the second region may correspond to a ground region for the dielectric resonator antenna.
  • the dielectric resonator antenna may be disposed on at least a portion of one surface of the first printed circuit board facing a third direction in the second region, and the third direction may correspond to one direction substantially orthogonal to the first direction and the second direction and oriented when the side member is viewed toward the outside of the housing.
  • the first region of the first printed circuit board may include a power feeding circuit for feeding electric power to a conductive member included in the side member.
  • the second region of the first printed circuit board may include a power feeding circuit for feeding electric power to the monopole antenna.
  • At least a portion of the one surface of the first printed circuit board may include a planar ground portion.
  • the dielectric resonator antenna may be grounded by the planar ground portion.
  • the conductive member included in the side member may be grounded by the planar ground portion.
  • the dielectric resonator antenna when the back plate is viewed in the first direction, may be disposed on one surface of the first printed circuit board to be spaced apart from the side member by a specified distance.
  • a relative permittivity of the dielectric resonator antenna may be 10 to 50 F/m.
  • the dielectric resonator antenna when the back plate is viewed in the first direction, the dielectric resonator antenna may be disposed on one surface of the first printed circuit board, and the one surface of the first printed circuit board may be a surface of the first printed circuit board facing a third direction substantially orthogonal to the first direction and the second direction and oriented when the side member is viewed toward the outside of the housing.
  • the monopole antenna may be disposed to be spaced apart from the one surface of the dielectric resonator antenna by a specified distance in the second direction.
  • a dielectric may be included in a separation space between the monopole antenna and the dielectric resonator antenna.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Telephone Set Structure (AREA)
  • Transceivers (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Burglar Alarm Systems (AREA)
EP22771647.9A 2021-03-16 2022-03-03 Module d'antenne et dispositif électronique le comprenant Pending EP4283785A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210034051A KR20220129320A (ko) 2021-03-16 2021-03-16 안테나 모듈 및 이를 포함하는 전자 장치
PCT/KR2022/002967 WO2022196981A1 (fr) 2021-03-16 2022-03-03 Module d'antenne et dispositif électronique le comprenant

Publications (1)

Publication Number Publication Date
EP4283785A1 true EP4283785A1 (fr) 2023-11-29

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EP22771647.9A Pending EP4283785A1 (fr) 2021-03-16 2022-03-03 Module d'antenne et dispositif électronique le comprenant

Country Status (4)

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EP (1) EP4283785A1 (fr)
KR (1) KR20220129320A (fr)
CN (1) CN116998064A (fr)
WO (1) WO2022196981A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4284252B2 (ja) * 2004-08-26 2009-06-24 京セラ株式会社 表面実装型アンテナおよびそれを用いたアンテナ装置ならびに無線通信装置
KR101043994B1 (ko) * 2009-02-27 2011-06-24 한양대학교 산학협력단 유전체 공진기 안테나
FI20096134A0 (fi) * 2009-11-03 2009-11-03 Pulse Finland Oy Säädettävä antenni
KR102057863B1 (ko) * 2013-07-05 2019-12-20 엘지전자 주식회사 이동 단말기
US10862216B1 (en) * 2019-06-28 2020-12-08 Apple Inc. Electronic devices having indirectly-fed slot antenna elements

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KR20220129320A (ko) 2022-09-23
CN116998064A (zh) 2023-11-03
WO2022196981A1 (fr) 2022-09-22

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