EP4251691A1 - Mixtures containing phosphorus compounds and use thereof - Google Patents
Mixtures containing phosphorus compounds and use thereofInfo
- Publication number
- EP4251691A1 EP4251691A1 EP21708964.8A EP21708964A EP4251691A1 EP 4251691 A1 EP4251691 A1 EP 4251691A1 EP 21708964 A EP21708964 A EP 21708964A EP 4251691 A1 EP4251691 A1 EP 4251691A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- mixtures
- optionally
- formula
- integer
- hydrocarbon radicals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 112
- 150000003018 phosphorus compounds Chemical class 0.000 title claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 150000003961 organosilicon compounds Chemical class 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 125000003110 organyloxy group Chemical group 0.000 claims abstract description 12
- 229920000570 polyether Polymers 0.000 claims abstract description 12
- -1 phosphorus compound Chemical class 0.000 claims description 102
- 229930195733 hydrocarbon Natural products 0.000 claims description 29
- 239000004215 Carbon black (E152) Substances 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 17
- 239000000654 additive Substances 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 15
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- 150000004756 silanes Chemical class 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000004014 plasticizer Substances 0.000 claims description 8
- 125000005372 silanol group Chemical group 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 150000007513 acids Chemical class 0.000 claims description 4
- 238000004132 cross linking Methods 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 40
- 238000002360 preparation method Methods 0.000 abstract description 4
- 239000000306 component Substances 0.000 description 50
- 150000003254 radicals Chemical class 0.000 description 31
- 239000003795 chemical substances by application Substances 0.000 description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 19
- 239000000243 solution Substances 0.000 description 16
- 229920004482 WACKER® Polymers 0.000 description 15
- 239000000047 product Substances 0.000 description 14
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 12
- NJGCRMAPOWGWMW-UHFFFAOYSA-N octylphosphonic acid Chemical compound CCCCCCCCP(O)(O)=O NJGCRMAPOWGWMW-UHFFFAOYSA-N 0.000 description 11
- 229920001451 polypropylene glycol Polymers 0.000 description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 9
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 9
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 7
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 6
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 6
- FVKFHMNJTHKMRX-UHFFFAOYSA-N 3,4,6,7,8,9-hexahydro-2H-pyrimido[1,2-a]pyrimidine Chemical compound C1CCN2CCCNC2=N1 FVKFHMNJTHKMRX-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- LQRUPWUPINJLMU-UHFFFAOYSA-N dioctyl(oxo)tin Chemical compound CCCCCCCC[Sn](=O)CCCCCCCC LQRUPWUPINJLMU-UHFFFAOYSA-N 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 229910021485 fumed silica Inorganic materials 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- CIUQDSCDWFSTQR-UHFFFAOYSA-N [C]1=CC=CC=C1 Chemical compound [C]1=CC=CC=C1 CIUQDSCDWFSTQR-UHFFFAOYSA-N 0.000 description 4
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- QUPDWYMUPZLYJZ-UHFFFAOYSA-N ethyl Chemical compound C[CH2] QUPDWYMUPZLYJZ-UHFFFAOYSA-N 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical compound [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 3
- CQQXCSFSYHAZOO-UHFFFAOYSA-L [acetyloxy(dioctyl)stannyl] acetate Chemical compound CCCCCCCC[Sn](OC(C)=O)(OC(C)=O)CCCCCCCC CQQXCSFSYHAZOO-UHFFFAOYSA-L 0.000 description 3
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- UOCZMUZYGLTGHO-UHFFFAOYSA-N triethoxy(morpholin-4-ylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)CN1CCOCC1 UOCZMUZYGLTGHO-UHFFFAOYSA-N 0.000 description 3
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- ORGHESHFQPYLAO-UHFFFAOYSA-N vinyl radical Chemical compound C=[CH] ORGHESHFQPYLAO-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical group [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- UURSXESKOOOTOV-UHFFFAOYSA-N dec-5-ene Chemical compound CCCCC=CCCCC UURSXESKOOOTOV-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 238000011067 equilibration Methods 0.000 description 2
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 2
- IVLBLTUZCAKUCG-UHFFFAOYSA-N ethyl 3-oxobutanoate 2-methylpropan-1-olate titanium(4+) Chemical compound [Ti+4].CC(C)C[O-].CC(C)C[O-].CCOC(=O)[CH-]C(C)=O.CCOC(=O)[CH-]C(C)=O IVLBLTUZCAKUCG-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 238000001542 size-exclusion chromatography Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- HXOGQBSDPSMHJK-UHFFFAOYSA-N triethoxy(6-methylheptyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCC(C)C HXOGQBSDPSMHJK-UHFFFAOYSA-N 0.000 description 2
- RQCNTLREGQQSNU-UHFFFAOYSA-N trimethoxy(2,2,4-trimethylpentyl)silane Chemical compound CO[Si](OC)(OC)CC(C)(C)CC(C)C RQCNTLREGQQSNU-UHFFFAOYSA-N 0.000 description 2
- LTMJJNPVAMLQGV-PWNYCUMCSA-N (-)-(2R,3R)-2,3-dihydroxybutanamide Chemical compound C[C@@H](O)[C@@H](O)C(N)=O LTMJJNPVAMLQGV-PWNYCUMCSA-N 0.000 description 1
- MASDFXZJIDNRTR-UHFFFAOYSA-N 1,3-bis(trimethylsilyl)urea Chemical compound C[Si](C)(C)NC(=O)N[Si](C)(C)C MASDFXZJIDNRTR-UHFFFAOYSA-N 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 description 1
- CGERYHYIVJQVLJ-UHFFFAOYSA-N 2-methylbutane Chemical compound CC[C](C)C CGERYHYIVJQVLJ-UHFFFAOYSA-N 0.000 description 1
- BFDYSJCMAFSRDH-UHFFFAOYSA-N 2-phenylethylphosphonic acid Chemical compound OP(O)(=O)CCC1=CC=CC=C1 BFDYSJCMAFSRDH-UHFFFAOYSA-N 0.000 description 1
- SLRMQYXOBQWXCR-UHFFFAOYSA-N 2154-56-5 Chemical compound [CH2]C1=CC=CC=C1 SLRMQYXOBQWXCR-UHFFFAOYSA-N 0.000 description 1
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 1
- ZRWNRAJCPNLYAK-UHFFFAOYSA-N 4-bromobenzamide Chemical compound NC(=O)C1=CC=C(Br)C=C1 ZRWNRAJCPNLYAK-UHFFFAOYSA-N 0.000 description 1
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- OGBVRMYSNSKIEF-UHFFFAOYSA-N Benzylphosphonic acid Chemical compound OP(O)(=O)CC1=CC=CC=C1 OGBVRMYSNSKIEF-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- HNUALPPJLMYHDK-UHFFFAOYSA-N C[CH]C Chemical compound C[CH]C HNUALPPJLMYHDK-UHFFFAOYSA-N 0.000 description 1
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 1
- KKUKTXOBAWVSHC-UHFFFAOYSA-N Dimethylphosphate Chemical compound COP(O)(=O)OC KKUKTXOBAWVSHC-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- 229910007991 Si-N Inorganic materials 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910006294 Si—N Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FGPCETMNRYMFJR-UHFFFAOYSA-L [7,7-dimethyloctanoyloxy(dimethyl)stannyl] 7,7-dimethyloctanoate Chemical compound CC(C)(C)CCCCCC(=O)O[Sn](C)(C)OC(=O)CCCCCC(C)(C)C FGPCETMNRYMFJR-UHFFFAOYSA-L 0.000 description 1
- YUDRVAHLXDBKSR-UHFFFAOYSA-N [CH]1CCCCC1 Chemical compound [CH]1CCCCC1 YUDRVAHLXDBKSR-UHFFFAOYSA-N 0.000 description 1
- 230000000895 acaricidal effect Effects 0.000 description 1
- 239000000642 acaricide Substances 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000005840 aryl radicals Chemical class 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- 239000003899 bactericide agent Substances 0.000 description 1
- 239000003139 biocide Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- DLEPCXYNAPUMDZ-UHFFFAOYSA-N butan-2-ylphosphonic acid Chemical compound CCC(C)P(O)(O)=O DLEPCXYNAPUMDZ-UHFFFAOYSA-N 0.000 description 1
- BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical compound CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 1
- UOKRBSXOBUKDGE-UHFFFAOYSA-N butylphosphonic acid Chemical compound CCCCP(O)(O)=O UOKRBSXOBUKDGE-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- SCIGVHCNNXTQDB-UHFFFAOYSA-N decyl dihydrogen phosphate Chemical compound CCCCCCCCCCOP(O)(O)=O SCIGVHCNNXTQDB-UHFFFAOYSA-N 0.000 description 1
- DZQISOJKASMITI-UHFFFAOYSA-N decyl-dioxido-oxo-$l^{5}-phosphane;hydron Chemical compound CCCCCCCCCCP(O)(O)=O DZQISOJKASMITI-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- RNPXCFINMKSQPQ-UHFFFAOYSA-N dicetyl hydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCOP(O)(=O)OCCCCCCCCCCCCCCCC RNPXCFINMKSQPQ-UHFFFAOYSA-N 0.000 description 1
- QHAUASBJFFBWMY-UHFFFAOYSA-N didecyl hydrogen phosphate Chemical compound CCCCCCCCCCOP(O)(=O)OCCCCCCCCCC QHAUASBJFFBWMY-UHFFFAOYSA-N 0.000 description 1
- JTXUVYOABGUBMX-UHFFFAOYSA-N didodecyl hydrogen phosphate Chemical compound CCCCCCCCCCCCOP(O)(=O)OCCCCCCCCCCCC JTXUVYOABGUBMX-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- UCQFCFPECQILOL-UHFFFAOYSA-N diethyl hydrogen phosphate Chemical compound CCOP(O)(=O)OCC UCQFCFPECQILOL-UHFFFAOYSA-N 0.000 description 1
- HUDSKKNIXMSHSZ-UHFFFAOYSA-N dihexyl hydrogen phosphate Chemical compound CCCCCCOP(O)(=O)OCCCCCC HUDSKKNIXMSHSZ-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- PWEVMPIIOJUPRI-UHFFFAOYSA-N dimethyltin Chemical compound C[Sn]C PWEVMPIIOJUPRI-UHFFFAOYSA-N 0.000 description 1
- SDTDHTCWRNVNAJ-UHFFFAOYSA-L dimethyltin(2+);diacetate Chemical compound CC(=O)O[Sn](C)(C)OC(C)=O SDTDHTCWRNVNAJ-UHFFFAOYSA-L 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 1
- CYFHLEMYBPQRGN-UHFFFAOYSA-N ditetradecyl hydrogen phosphate Chemical compound CCCCCCCCCCCCCCOP(O)(=O)OCCCCCCCCCCCCCC CYFHLEMYBPQRGN-UHFFFAOYSA-N 0.000 description 1
- TVACALAUIQMRDF-UHFFFAOYSA-N dodecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCOP(O)(O)=O TVACALAUIQMRDF-UHFFFAOYSA-N 0.000 description 1
- SVMUEEINWGBIPD-UHFFFAOYSA-N dodecylphosphonic acid Chemical compound CCCCCCCCCCCCP(O)(O)=O SVMUEEINWGBIPD-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- GGKJPMAIXBETTD-UHFFFAOYSA-N heptyl dihydrogen phosphate Chemical compound CCCCCCCOP(O)(O)=O GGKJPMAIXBETTD-UHFFFAOYSA-N 0.000 description 1
- VAJFLSRDMGNZJY-UHFFFAOYSA-N heptylphosphonic acid Chemical compound CCCCCCCP(O)(O)=O VAJFLSRDMGNZJY-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- ZUVCYFMOHFTGDM-UHFFFAOYSA-N hexadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCOP(O)(O)=O ZUVCYFMOHFTGDM-UHFFFAOYSA-N 0.000 description 1
- JDPSFRXPDJVJMV-UHFFFAOYSA-N hexadecylphosphonic acid Chemical compound CCCCCCCCCCCCCCCCP(O)(O)=O JDPSFRXPDJVJMV-UHFFFAOYSA-N 0.000 description 1
- PHNWGDTYCJFUGZ-UHFFFAOYSA-N hexyl dihydrogen phosphate Chemical compound CCCCCCOP(O)(O)=O PHNWGDTYCJFUGZ-UHFFFAOYSA-N 0.000 description 1
- GJWAEWLHSDGBGG-UHFFFAOYSA-N hexylphosphonic acid Chemical compound CCCCCCP(O)(O)=O GJWAEWLHSDGBGG-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- WUFHQGLVNNOXMP-UHFFFAOYSA-N n-(triethoxysilylmethyl)cyclohexanamine Chemical compound CCO[Si](OCC)(OCC)CNC1CCCCC1 WUFHQGLVNNOXMP-UHFFFAOYSA-N 0.000 description 1
- QRANWKHEGLJBQC-UHFFFAOYSA-N n-(trimethoxysilylmethyl)cyclohexanamine Chemical compound CO[Si](OC)(OC)CNC1CCCCC1 QRANWKHEGLJBQC-UHFFFAOYSA-N 0.000 description 1
- BWYLUCQZPVGWLL-UHFFFAOYSA-N n-butyl-n-(triethoxysilylmethyl)butan-1-amine Chemical compound CCCCN(CCCC)C[Si](OCC)(OCC)OCC BWYLUCQZPVGWLL-UHFFFAOYSA-N 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- YOOYVODKUBZAPO-UHFFFAOYSA-N naphthalen-1-ylphosphonic acid Chemical compound C1=CC=C2C(P(O)(=O)O)=CC=CC2=C1 YOOYVODKUBZAPO-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- OLGGYSFJQGDOFX-UHFFFAOYSA-N nonylphosphonic acid Chemical compound CCCCCCCCCP(O)(O)=O OLGGYSFJQGDOFX-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- WRKCIHRWQZQBOL-UHFFFAOYSA-N octyl dihydrogen phosphate Chemical compound CCCCCCCCOP(O)(O)=O WRKCIHRWQZQBOL-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- ULIMUQCIZMJOHK-UHFFFAOYSA-N pentadecylphosphonic acid Chemical compound CCCCCCCCCCCCCCCP(O)(O)=O ULIMUQCIZMJOHK-UHFFFAOYSA-N 0.000 description 1
- NVTPMUHPCAUGCB-UHFFFAOYSA-N pentyl dihydrogen phosphate Chemical compound CCCCCOP(O)(O)=O NVTPMUHPCAUGCB-UHFFFAOYSA-N 0.000 description 1
- CKVICYBZYGZLLP-UHFFFAOYSA-N pentylphosphonic acid Chemical compound CCCCCP(O)(O)=O CKVICYBZYGZLLP-UHFFFAOYSA-N 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 102220065927 rs794726936 Human genes 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000013535 sea water Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- HXLWJGIPGJFBEZ-UHFFFAOYSA-N tert-butyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C(C)(C)C HXLWJGIPGJFBEZ-UHFFFAOYSA-N 0.000 description 1
- OGDSVONAYZTTDA-UHFFFAOYSA-N tert-butylphosphonic acid Chemical compound CC(C)(C)P(O)(O)=O OGDSVONAYZTTDA-UHFFFAOYSA-N 0.000 description 1
- KRIXEEBVZRZHOS-UHFFFAOYSA-N tetradecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCOP(O)(O)=O KRIXEEBVZRZHOS-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- KREGXBHGJXTOKZ-UHFFFAOYSA-N tridecylphosphonic acid Chemical compound CCCCCCCCCCCCCP(O)(O)=O KREGXBHGJXTOKZ-UHFFFAOYSA-N 0.000 description 1
- DHEOLHWDNNLCNQ-UHFFFAOYSA-N triethoxy(2,2,4-trimethylpentyl)silane Chemical compound CCO[Si](OCC)(OCC)CC(C)(C)CC(C)C DHEOLHWDNNLCNQ-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UWSYCPWEBZRZNJ-UHFFFAOYSA-N trimethoxy(2,4,4-trimethylpentyl)silane Chemical compound CO[Si](OC)(OC)CC(C)CC(C)(C)C UWSYCPWEBZRZNJ-UHFFFAOYSA-N 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- GKIQHTGBORJXKZ-UHFFFAOYSA-N undecylphosphonic acid Chemical compound CCCCCCCCCCCP(O)(O)=O GKIQHTGBORJXKZ-UHFFFAOYSA-N 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/30—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen phosphorus-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
Definitions
- the invention relates to mixtures containing phosphorus compounds, processes for their production and their use, in particular in crosslinkable compositions based on organosilicon compounds and processes for the production of organosilicon compounds containing organyloxy groups.
- One-component sealing compounds which can be stored in the absence of water and harden when exposed to water at room temperature with elimination of alcohols to form elastomers are already known. These products are used in large quantities, e.g. in the construction industry. These mixtures are based on polymers terminated by silyl groups bearing reactive substituents such as OH groups or hydrolyzable groups such as alkoxy groups. Furthermore, these sealants can contain fillers, plasticizers, crosslinkers, catalysts and various additives. Alkoxysilanes are often used as crosslinkers. To accelerate curing, these sealants require catalysts based on tin or titanium.
- Tin catalysts frequently used are, for example, dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dioxide and their reaction products with alkoxysilanes.
- RTVI sealing compounds produced using alkoxysilanes have disadvantages. After just a few months, they no longer fully harden.
- Various organic phosphorus compounds are therefore proposed in EP 1397 428 B1 to significantly improve storage stability.
- the phosphorus compounds that are particularly suitable for stabilizing RTVI sealing compounds such as, for example, octlyphosphonic acid, are solids at room temperature. In operational use, however, liquids are strongly preferred, because these are just about continuously running processes are much better suited for dosing than solids.
- EP 2030 675 B1 an easy-to-handle, liquid solution of n-octylphosphonic acid in methyltrimethoxysilane is used.
- methyltrimethoxysilane has a particularly disadvantageous very low flash point. This undesirably complex safety measures are required when handling Me thyltrimethoxysilan. Furthermore, it is not always ensured that no undesired reaction products form in the case of mixtures of n-octylphosphonic acid and methyltrimethoxysilane.
- n-octylphosphonic acid is also known as a neutralizing agent in the production of polymers with hydrolyzable end groups.
- EP 3344 684 B1 describes the reaction of terminal silanol groups of linear polydimethylsiloxanes with alkoxysilanes. 1,5,7-Triazabicyclo[4.4.0]dec-5-ene is used as the catalyst.
- the catalyst is neutralized in a second step with n-octylphosphonic acid.
- the disadvantageous variant of a solution of n-octylphosphonic acid in methyltrimethoxysilane is also used here.
- the object of the invention was to overcome the disadvantages of the Stan of the art.
- the invention relates to mixtures (M) containing (X) polyethers of the general formula
- R 2 can be the same or different and is divalent, optionally substituted hydrocarbon radicals and p is an integer from 4 to 110,
- R 5 can be the same or different and is optionally substituted hydrocarbon radicals
- R 6 can be the same or different and is optionally substituted hydrocarbon radicals, m is 0 or 1, preferably 1, and n is 0, 1 or 2, with the proviso that m+n is 1 or 2, preferably 1, is, and if necessary
- radicals R 1 are alkyl radicals such as methyl,
- the radicals R 1 are preferably a hydrogen atom or alkyl radicals having 1 to 18 carbon atoms, particularly preferably a hydrogen atom.
- divalent radicals R 2 are alkylene radicals, such as ethane-1,2-diyl, propane-1,2-diyl, propane-1,3-diyl, butane-1,4-diyl, butane-1 ,3-diyl, 2-methylpropane-1,3-diyl, pentane-1,5-diyl, pentane-1,4-diyl, 2-methylbutane-1,4-diyl, 2,2- dimethylpropane-1,3-diyl, hexane-1,6-diyl, heptane-1,7-diyl, octane-1,8-diyl and 2-methylheptane-1,7-diyl and 2 ,2,4-trimethylpentane-1,5-diyl radical.
- alkylene radicals such as ethane-1,2-diyl, propane-1,2-diyl, propane-1,
- the radical R 2 is preferably a divalent hydrocarbon radical having 2 to 4 carbon atoms, particularly preferably the propane-1,2-diyl radical.
- Index p is preferably an integer from 4 to 65.
- polyethers (X) used according to the invention are preferably those of the formula
- R 1 has one of the meanings given above, q is 0 or an integer from 1 to 30, preferably 0 or an integer from 1 to 15, s is 0 or an integer from 1 to 30, preferably 0 or an integer from 1 to 15; and r is an integer from 4 to 50, preferably an integer from 4 to 35.
- Examples of the compounds (X) used according to the invention are H(OCH 2 CH 2 ) 5 (OCHCH 3 CH 2 )(OCH 2 CH 2 ) 10 OH,
- polyethers (X) used according to the invention are those of the formula
- the mixtures (M) according to the invention contain polyethers (X) in amounts of preferably 40 to 90 parts by weight, especially preferably from 50 to 70 parts by weight, based in each case on 100 parts by weight of the mixture (M).
- Polyethers (X) are commercially available products or can be prepared by methods customary in organic chemistry.
- radicals R 5 are the radicals given for R 1 .
- the radical R 5 is preferably linear or branched alkyl radicals having 4 to 16 carbon atoms, aryl radicals or the vinyl radical, particularly preferably linear or branched alkyl radicals having 4 to 16 carbon atoms, in particular the n-octyl radical.
- R 6 are the radicals given for R 1 and radicals interrupted by oxygen such as R 1 -(O-CH2CH2)3-,
- the R 6 radical is preferably a linear or branched alkyl radical having 1 to 18 carbon atoms or an oxygen-interrupted alkyl radical having 10 to 68 carbon atoms.
- Examples of phosphorus compounds (Y) used according to the invention are alkylphosphonic acids such as butylphosphonic acid, s-butylphosphonic acid, i-butylphosphonic acid, tert-butylphosphonic acid, n-pentylphosphonic acid, n-hexylphosphonic acid, n-heptylphosphonic acid, n-octylphosphonic acid, n-nonylphosphonic acid, n -Decylphosphonic acid, n-undecylphosphonic acid, n-dodecylphosphonic acid, n-tridecylphosphonic acid, n-tetratedylphosphonic acid, n-pentadecylphosphonic acid, n-hexadecylphosphonic acid, Benzylphosphonic acid, 2-phenylethylphosphonic acid, arylphosphonic acids such as phenylphosphonic acid, 1-naphthylphosphonic acid,
- the phosphorus compounds (Y) used according to the invention are preferably alkylphosphonic acids having 4 to 18 carbon atoms, particularly preferably n-octylphosphonic acid.
- Phosphorus compounds (Y) are commercial products.
- n-octylphosphonic acid is available as a pure substance or as a solution in ethanol and water, e.g. under the name "Hostaphat OPS 100" (pure product) or “Hostaphat OPS 75” (solution in ethanol and water) from Clariant.
- the mixtures (M) according to the invention contain phosphorus compounds (Y) in amounts of preferably 10 to 50 parts by weight, particularly preferably 25 to 35 parts by weight, based in each case on 100 parts by weight of the mixture (M).
- the mixtures (M) according to the invention preferably contain water (Z).
- the mixtures (M) according to the invention contain water (Z) in amounts of preferably 0.5 to 3.0 mol, particularly preferably 1.0 to 2.0 mol, in particular 1.0 to 1.5 mol, in each case based on 1 mol Phosphorus compound (Y), preferably n-octylphosphonic acid.
- the mixtures (M) according to the invention can contain other components, such as alcohols, in particular ethanol.
- the mixtures (M) according to the invention preferably consist of at least 98% by weight, particularly preferably at least 99.8% by weight, in particular 100% by weight, of the components (X),
- the mixtures (M) according to the invention are colorless to slightly yellowish liquids or low-melting solids and have a melting point of preferably ⁇ 35°C, particularly preferably ⁇ 0°C, in particular ⁇ -30°C.
- mixtures (M) can be mixed with one another in any order. This mixing can take place at room temperature or at an elevated temperature of 30° C. to 150° C. and the pressure of the surrounding atmosphere, ie about 900 to 1100 hPa, or reduced pressure of 1 to 900 hPa.
- Another subject of the invention is a process for preparing the mixtures (M) according to the invention by mixing the individual components.
- polyether (X) is preferably initially taken in a suitable vessel and then the phosphorus compound (Y) is metered in with stirring. This happens before preferably at the ambient temperature.
- the mixture is then heated to a temperature of from 80 to 150° C., with stirring and under a reduced pressure of up to 20 mbar, and impurities present, such as water and alcohols, are removed by distillation. The temperature and reduced pressure are preferably maintained until no more distillate comes over. It is then cooled to room temperature and, if desired, a defined amount of water (Z) is added.
- the process according to the invention can be carried out continuously, batchwise or semicontinuously according to known processes and using known apparatus.
- the mixtures (M) according to the invention have the advantage that they can be handled as a liquid with a low risk potential without the formation of undesirable by-products.
- mixtures (M) according to the invention have the advantage that they are easy to prepare without the formation of undesirable by-products.
- the mixtures (M) according to the invention have the advantage that they are liquid, even at low temperatures, and have a low flash point.
- the mixtures (M) according to the invention have the advantage that they exhibit high storage stability and high resistance to low temperatures.
- mixtures (M) according to the invention can be used for all purposes for which phosphorus compounds can previously also be used, such as, for example, as stabilizers for compositions based on organosilicon compounds which can be crosslinked with elimination of alcohol.
- Mixtures (M) according to the invention are preferably used for the production of crosslinkable compositions based on organosilicon compounds.
- Another object of the invention are crosslinkable co compositions based on organosilicon compounds he obtainable by mixing
- R 4 may be the same or different and are monovalent, optionally substituted hydrocarbon radicals,
- R 7 can be the same or different and means monovalent, optionally substituted hydrocarbon radicals,
- R 3 can be the same or different and is monovalent, optionally substituted hydrocarbon radicals, a may be the same or different and is 0 or 1, preferably 1, and x is an integer from 30 to 2000, and
- radicals R 4 and R 7 are, independently of one another, the radicals specified for radical R 1 .
- the radicals R 4 are preferably, independently of one another, monovalent hydrocarbon radicals having 1 to 18 carbon atoms, particularly preferably a methyl, vinyl or phenyl radical, in particular the methyl radical.
- the radicals R 7 are preferably, independently of one another, alkyl radicals having 1 to 12 carbon atoms, particularly preferably methyl, ethyl, n-propyl or isopropyl radicals, in particular the methyl or ethyl radical.
- radicals R 3 are the monovalent hydrocarbon radicals specified for R 1 and hydrocarbon radicals substituted with amino groups.
- the R 3 radical is preferably a monovalent, optionally amino-substituted hydrocarbon radical having 1 to 12 carbon atoms, particularly preferably a methyl radical, ethyl radical, vinyl radical, phenyl radical, -CH2-NR 6 'R 5 ' radical or the -CH2NR 11 radical ', where R 5 ' are hydrocarbon radicals with 1 to 12 Carbon atoms, R 6 'hydrogen atom or radical R 5 ' means and R 11 'divalent hydrocarbon radicals which can be interrupted with He teroatomen means.
- the R 3 radical is particularly preferably a -CH 2 -NR 6 'R 5 ' radical or a -CH 2 NR 11 ' radical with R 5 ', R 6 ' and R 11 ' having the same meaning as mentioned above, in particular - CH 2 -N [(CH 2 ) 2 ] 2 O, -CH 2 -N(Bu) 2 or -CH 2 -NH (cHex), where Bu is n-butyl and cHex is cyclohexyl.
- radicals R 5 ' are the hydrocarbon radicals specified for R 1 .
- the radical R 5 ' is preferably the methyl, ethyl, isopropyl, n-propyl, n-butyl, cyclohexyl or phenyl radical, particularly preferably the n-butyl radical.
- hydrocarbon radicals R 6 ' are the hydrocarbon radicals specified for R 1 .
- the radical R 6 ' is preferably a hydrogen atom, the methyl, ethyl, isopropyl, n-propyl, n-butyl or cyclohexyl radical, particularly preferably the n-butyl radical.
- Examples of divalent radicals R 11 ' are the examples given for R 2 and radicals -CH 2 -CH 2 -O-CH 2 -CH 2 - and -CH 2 -CH 2 -NH-CH 2 -CH 2 -.
- the radical R 11 ' is preferably a divalent hydrocarbon radical having 4 to 6 carbon atoms which can be interrupted by heteroatoms, preferably oxygen -O- or nitrogen -NH-, particularly preferably -CH 2 -CH 2 - O- CH2 - CH2- .
- the organopolysiloxanes (A) used according to the invention are preferably (MeO) 2 Si(Ox)0(SiMe 2 0) 30-2000 S1(Ox)(OMe) 2 ,
- the organopolysiloxanes (A) used according to the invention have a viscosity of preferably from 6,000 to 350,000 mPas, particularly preferably from 20,000 to 120,000 mPas, in each case at 25.degree.
- the organopolysiloxanes (A) are commercially available products or they can be prepared by a method described below.
- the component (B) used according to the invention is preferably a mixture (M) which comprises water (Z).
- the compositions according to the invention contain component (B) in amounts of preferably 0.001 to 5 parts by weight, more preferably 0.01 to 5 parts by weight, in particular 0.1 to 1 part by weight, based in each case on 100 parts by weight of component (A).
- compositions according to the invention can contain a component (C) consisting of silanes of the formula
- R 8 can be the same or different and is monovalent, optionally substituted hydrocarbon radicals and R 9 is monovalent, optionally substituted hydrocarbon radicals.
- the radical R 8 is preferably an alkyl radical having 1 to 12 carbon atoms, particularly preferably a methyl, ethyl, n-propyl or isopropyl radical, in particular the methyl or ethyl radical.
- the radical R 9 is preferably a monovalent hydrocarbon radical having 1 to 18 carbon atoms which is optionally substituted by glycidoxy, ureido, methacryloxy or amino groups, particularly preferably alkyl radicals, the vinyl radical or the phenyl radical, in particular the methyl radical or the 2,2,4-trimethylpentyl radical.
- silanes and/or their partial hydrolyzates are used in whole or in part as component (C).
- functional groups are used, such as those with glycidoxypropyl, aminopropyl, aminoethylaminopropyl, ureidopropyl or methacryloxypropyl radicals, especially when adhesion-promoting properties are desired.
- the partial hydrolyzates (C) used if appropriate can be partial homohydrolysates, i.e. partial hydrolysates of one type of silanes of the formula (III), or partial cohydrolysates, i.e. partial hydrolysates of at least two different types of silanes of the formula (III) .
- partial hydrolyzates is understood to mean products which have arisen by hydrolysis and/or condensation.
- component (C) optionally used in the compositions according to the invention is a partial hydrolyzate of silanes of the formula (VI), those having up to 20 silicon atoms are preferred.
- component (C) optionally used according to the invention are methyltrimethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, 2,2,4-trimethylpentyltrimethoxysilane, methyltriethoxysilane, vinyltriethoxysilane, phenyltriethoxysilane, tetraethoxysilane, 2,2,4-trimethylpentyltriethoxysilane, (2,3,5, 6-Tetrahydro-1,4-oxazin-4-yl)methyltriethoxysilane, N,N-di-n-butylaminomethyltriethoxysilane, N-cyclohexylaminomethyltriethoxysilane, (2,3,5,6-Tetrahydro-1,4-oxazine-4 -yl)methyltrimethoxysilane N,N-di-n-butylaminomethyltrimethoxysilane, N,
- compositions according to the invention contain component (C), the amounts involved are preferably from 0.01 to 5 parts by weight, particularly preferably from 0.01 to 2 parts by weight, in particular from 0.05 to 2 parts by weight, in each case based on 100 parts by weight component (A).
- component (C) which preferably contains at least some silanes and/or their partial hydrolyzates with functional groups.
- compositions according to the invention can now contain all substances which have also previously been used in compositions which can be crosslinked by a condensation reaction, such as, for example, curing accelerators (D), plasticizers (E) , fillers (F) and additives (G).
- Curing accelerators (D) which can be used are all curing accelerators which have hitherto been used in compositions which can be crosslinked by a condensation reaction.
- curing accelerators (D) are titanium compounds, such as tetrabutyl or tetraisopropyl titanate, or titanium chelates, such as bis(ethylacetoacetato)diisobutoxytitanium, or organic tin compounds, such as di-n-butyltin dilaurate and di-n-butyltin diacetate, di-n -butyltin oxide, dimethyltin diacetate, dimethyltin dilaurate, dimethyltin dineodecanoate, dimethyltin noxide, di-n-octyltin diacetate, di-n-octyltin dilaurate, di-n-octyltin oxide and reaction products of these compounds with Alkoxysilanes, such as the
- compositions according to the invention contain curing accelerators (D), the amounts involved are preferably 0.001 to 20 parts by weight, particularly preferably 0.001 to 1 part by weight, based in each case on 100 parts by weight of component (A).
- plasticizers (E) which may be used are dimethylpolysiloxanes which are liquid at room temperature and end-capped by trimethylsiloxy groups, in particular with viscosities at 25° C. in the range between 5 and 1000 mPas, and high-boiling hydrocarbons, such as paraffin oils or mineral oils consisting of naphthenic and paraffinic units.
- compositions according to the invention contain component (E), the amounts involved are preferably 5 to 30 parts by weight, more preferably 5 to 25 parts by weight, based in each case on 100 parts by weight of siloxanes (A).
- the compositions according to the invention preferably contain no plasticizer (E).
- the fillers (F) optionally used in the compositions according to the invention can be any previously known fillers.
- fillers (F) are non-reinforcing fillers (F), ie fillers with a BET surface area of up to 20 m 2 /g, such as quartz, diatomaceous earth, calcium silicate, zirconium silicate, zeolites, metal oxide powders such as aluminum, titanium -, Iron or zinc oxides or their mixed oxides, barium sulfate, calcium carbonate, gypsum, silicon nitride, silicon carbide, boron nitride, glass and plastic powders such as polyacrylonitrile powder; reinforcing fillers, ie fillers with a BET surface area of more than 20 m 2 /g, such as precipitated chalk and carbon black, such as furnace and acetylene black; Silicic acid, such as pyrogenically produced silicic acid and precipitated silicic acid; fibrous fillers such as plastic fibers.
- BET surface area such as quartz, diatomaceous earth, calcium silicate, zirconium silicate,
- the optionally used fillers (F) are preferably calcium carbonate or silicic acid, particularly preferably silicic acid or a mixture of silicic acid and calcium carbonate.
- Preferred types of calcium carbonate (F) are ground or precipitated and optionally surface-treated with fatty acids such as stearic acid or salts thereof.
- the preferred silica is preferably fumed silica.
- compositions according to the invention contain fillers (F), the amounts involved are preferably 10 to 150 parts by weight, particularly preferably 10 to 130 parts by weight, in particular 10 to 100 parts by weight, based in each case on 100 parts by weight of organopolysiloxanes (A).
- the compositions according to the invention preferably contain filler (F).
- additives (G) are pigments, dyes, fragrances, oxidation inhibitors, agents for influencing the electrical properties, such as conductive carbon black, flame retardants, light stabilizers, biocides such as fungicides, bactericides and acaricides, cell-generating agents, for example azodicarbonamide , Heat stabilizers, scavengers, such as Si-N-containing silazanes or silylamides, for example N,N'-bis-trimethylsilylurea or hexamethyldisilazane, cocatalysts, thixotropic agents, such as polyethylene glycol end-terminated on one or both sides or hydrogenated castor oil , Agents to further regulate the modulus such as polydimethylsiloxanes with an OH end group, as well as any siloxanes that are different from components (A), (B) and (C).
- additives (G) are pigments, dyes, fragrances, oxidation inhibitors, agents for influencing
- thixotropic agents (G) can be dispensed with.
- compositions according to the invention can each be one type of such a component or a mixture of at least two different types of such components.
- compositions according to the invention are preferably those which
- compositions according to the invention are particularly preferably those which
- silanes of the formula (VI) and/or their partial hydrolyzates optionally (D) curing accelerators, optionally (E) plasticizers, optionally (F) fillers and optionally (G) additives.
- compositions according to the invention are those that are identical to each other.
- compositions according to the invention preferably contain no further constituents.
- compositions according to the invention are preferably viscous to pasty masses.
- compositions according to the invention can be mixed together in any order. This mixing can take place at room temperature and the pressure of the surrounding atmosphere, ie about 900 to 1100 hPa.
- this mixing can also be carried out at higher temperatures, e.g., at temperatures in the range of from 35 to 135°C.
- this mixing can also be carried out at higher temperatures, e.g., at temperatures in the range of from 35 to 135°C.
- the mixing according to the invention preferably takes place with the greatest possible exclusion of water from the atmosphere.
- All raw materials with the exception of (M) have a water content of preferably less than 10000 mg/kg, preferably less than 5000 mg/kg, in particular less than 1000 mg/kg.
- Dry air or protective gas such as nitrogen is preferably used as a blanket during the mixing process, with the respective gas having a moisture content of preferably less than 10,000 pg/kg, preferably less than 1000 pg/kg, in particular less than 500 pg/kg.
- the pastes are filled into commercially available moisture-proof containers, such as cartridges, tubular bags, buckets and barrels.
- the components (A), optionally (C) and (E) are first mixed together, then optionally fillers (F) are added and finally (B) and optionally further components (D) and (G) are added, the temperature during mixing preferably not exceeding 60°C.
- Another object of the invention is a process for preparing the compositions according to the invention by mixing the individual components.
- the process according to the invention can be carried out continuously, batchwise or semicontinuously according to known processes and using known apparatus.
- compositions according to the invention or those produced according to the invention can be stored in the absence of moisture and can be crosslinked if moisture is present.
- compositions according to the invention are preferably crosslinked at room temperature. If desired, it can also be carried out at temperatures higher or lower than room temperature, e.g. at -5° to 15°C or at 30°C to 50°C and/or using concentrations of water that exceed the normal water content of air will.
- the crosslinking is preferably carried out at a pressure of 100 to 1100 hPa, in particular at the pressure of the surrounding atmosphere, ie about 900 to 1100 hPa.
- a further subject of the present invention are moldings produced by crosslinking the compositions according to the invention.
- compositions according to the invention can be used for all purposes for which compositions which can be stored in the absence of water and which crosslink to form elastomers at room temperature when exposed to water can be used.
- compositions of the invention are therefore excellent, for example, as a sealing compound for joints, including vertical joints, and similar voids of z 10 to 40 mm clear width, e.g. of buildings, land vehicles, watercraft and aircraft, or as adhesives or cementing compounds, e.g. in window construction or in the manufacture of showcases, and for example for the production of protective coatings, including those for the constant exposure to Surfaces exposed to freshwater or seawater or coatings that prevent sliding or rubber-elastic molded bodies.
- the masses according to the invention have the advantage that they are easy to produce and are characterized by a very high storage stability.
- the mixtures (M) according to the invention can furthermore preferably be used as neutralizing agents in processes for preparing polymers with hydrolyzable end groups.
- Another subject of the invention is a process for preparing organyloxy-containing organosilicon compounds, characterized in that in a 1st step at least one silanol group-containing organosilicon compound (a) with at least two organyloxy-containing compound (b) in the presence of strongly basic Catalysts (c) are reacted and, in a 2nd step, after reaction of the hydroxyl groups of component (a) with the compounds (b) containing organyloxy groups, the mixture (M) according to the invention is added.
- the strongly basic catalysts (c) can be lithium compounds, such as lithium alkoxylates or lithium hydroxide, and also amidines or guanidines, cyclic guanidines being preferred as component (c), particularly preferably 1,5 ,7-Triazabicyclo[4.4.0]dec-5-ene.
- organosilicon compound (a) containing at least one silanol group is reacted with compound (b) containing at least two organyloxy groups in the presence of 1,5,7-triazabicyclo[4.4.0]dec- 5-ene (c) and, in a 2nd step, mixture (M) according to the invention was added.
- Component (a) used according to the invention can be any previously known organosilicon compound having at least one silanol group.
- the organosilicon compound (a) is preferably an organosilicon compound having at least two silanol groups.
- the organosilicon compound (a) is preferably an essentially linear organopolysiloxane.
- the organosilicon compounds (a) used according to the invention have a viscosity of preferably 10 2 to 10 8 mPas, particularly preferably 1,000 to 350,000 mPas, in each case at 25.degree.
- organosilicon compound (a) used according to the invention are organosilicon compound (a) used according to the invention.
- Component (a) are commercially available products or can be produced by methods customary in chemistry.
- Component (b) used according to the invention can be any previously known compound having at least two organyloxy groups, preferably siloxanes or silanes.
- Component (b) is particularly preferably a silane of the formula (VI) and/or its partial hydrolyzates.
- Examples of compound (b) used according to the invention are methyltrimethoxysilane, dimethyldimethoxysilane, tetramethoxysilane, vinyltrimethoxysilane, methylvinyldimethoxysilane, methyltriethoxysilane, tetraethoxysilane, phenyltrimethoxysilane, n-butyltrimethoxysilane, isobutyltrimethoxysilane and tert-butyltrimethoxysilane, and their partial hydrolyzates, where Methyltrimethoxysilane, tetramethoxysilane, vinyltrimethoxysilane, methylvinyldimethoxysilane, methyltriethoxysilane, tetraethoxysilane and n-butyltrimethoxysilane are preferred, and methyltrimethoxysilane, tetramethoxysilane, vinyl
- Component (b) are commercially available products or can be produced by methods customary in chemistry. In the process according to the invention, component (b) is preferably used in a 1-fold to 100-fold excess, particularly preferably in a 2-fold to 50-fold molar excess, based in each case on the molar amount of Si—OH groups in the compound (a). .
- catalyst (c) is used in amounts of preferably 5 to 10,000 ppm by weight, particularly preferably 100 to 3000 ppm by weight, based in each case on the total amount of component (a) and (b).
- the individual compo nents can be mixed with one another in any order and in a previously known manner. Premixes can also be made from some components, such as a mixture of components (b) and (c), which are then mixed with the other components. Individual components can also be present or added right at the beginning or during the mixing process. For example, part of component (b) or preparation (c) can also be added 1 to 60 minutes after the other components have been mixed.
- the components used in the process according to the invention can each be one type of such a component or a mixture of at least two types of a respective component.
- the process according to the invention is preferably carried out without additional heating at ambient temperatures or at the temperatures which result when the individual components are mixed.
- the temperatures involved are preferably from 10 to 60.degree. C., particularly preferably from 15 to 40.degree.
- the process according to the invention is preferably carried out at the pressure of the surrounding atmosphere, ie from 900 to 1100 hPa; However, it is also possible to work at overpressure, such as at pressures between 1100 and 3000 hPa absolute pressure, in particular with continuous operation, if, for example, these pressures in closed systems are due to the pressure during pumping and the vapor pressure of the materials used at elevated temperatures result.
- the process according to the invention is preferably carried out in the absence of moisture, such as in dried air or nitrogen.
- the process according to the invention can be carried out under an inert gas such as nitrogen.
- the reaction mixture can be devolatilized, the devolatilization being carried out by means of a vacuum in the same apparatus or in a downstream apparatus, with or without inert gas being fed in, at room temperatures or elevated temperatures.
- the volatile components are preferably alcohols, such as methanol or ethanol.
- the process according to the invention can be carried out continuously or batchwise.
- a large number of organosilicon compounds containing organyloxy groups can advantageously be prepared by the process according to the invention.
- the process according to the invention has the advantage that organosilicon compounds containing organyloxy groups can be prepared in a simple manner.
- all viscosity data relate to a temperature of 25°C. Unless otherwise stated, the examples below are carried out at a pressure of the surrounding atmosphere, i.e. around 1000 hPa, and at room temperature, i.e. around 23° C., or at a temperature which arises when the reactants are combined at room temperature without additional heating or cooling is set and the relative humidity is about 50%. Furthermore, unless otherwise stated, all parts and percentages are by weight.
- the dynamic viscosity of the organosilicon compounds is measured according to DIN 53019.
- the procedure was preferably as follows: unless otherwise stated, the viscosity is measured at 25° C. using a “Physica MCR 300” rotational rheometer from Anton Paar.
- a coaxial cylinder measuring system (CC 27) with an annular measuring gap of 1.13 mm is used for viscosities from 1 to 200 mPa -s and a cone-plate measuring system (Searle System with measuring cone CP 50-1) used.
- the shear rate is adjusted to the polymer viscosity (1 to 99 mPa -s at 100 s 1 ; 100 to 999 mPa -s at 200 s 1 ; 1000 to 2999 mPa -s at 120 s 1 ; 3000 to
- the number-average molar mass M n is determined by means of size exclusion chromatography (SEC) against a polystyrene standard, in THF, at 60° C., flow rate 1.2 ml/min and detection with RI (refractive index detector) on a Styragel HR3-HR4-HR5-HR5 column set from Waters Corp. USA determined with an injection volume of 100 m ⁇ .
- SEC size exclusion chromatography
- PPG 425 Polypropylene glycol with an average molecular weight M n of 425 g/mol;
- PPG 1000 polypropylene glycol with an average molecular weight M n of 1000 g/mol;
- PPG 400 polypropylene glycol with an average molecular weight M n of 400 g/mol;
- OPS 75 n-octylphosphonic acid, 75% by weight in water and ethanol (commercially available, for example, under the name "Hostaphat OPS 75" from Clariant).
- Example 1 The procedure described in Example 1 was repeated using the amounts of starting materials given in Table 1.
- Example 7 The procedure described in Example 7 was repeated with the modification that PPG 425 was used instead of PPG 400. No differences were found. In particular, the melting point was also less than -30°C.
- a pyrogenic silica with a BET specific surface area of 150 m 2 /g (commercially available under the name HDK® V15 from Wacker Chemie AG, D-Munich) were mixed in and completely homogenized at a pressure of 50 hPa .
- 1 g of the mixture produced in Example 1 and 2 g of a reaction product of dibutyltin diacetate and tetraethoxysilane (commercially available under the name "Katalysator 41" from Wacker Chemie AG, D-Munich) was added and the mixture was homogenized again for 5 minutes at a pressure of about 50 hPa (absolute).
- the RTVI mass obtained in this way was filled into moisture-proof commercially available polyethylene cartridges and stored at room temperature for 24 h and another sample at 70° C. for 7 days. Thereafter, 2 mm thick plates were spread out from each of the samples stored in this way and stored for 7 days at 23° C. and 50% relative atmospheric humidity. Test specimens in accordance with DIN 53504 of form S2 were punched out of the materials cured in the process and the mechanical parameters were measured. The results can be found in Table 2.
- Example 9 was repeated with the modification that instead of 1 g of the mixture according to example 11.57 g of a mixture according to example 7 were added.
- 300 g of the product produced according to Example 11 were mixed with 130 g of an a,w-bis(trimethylsiloxy)polydimethylsiloxane with a viscosity of 1000 mPa -s (commercially available under the name "Softener 1000" from Wacker Chemie AG, D-Munich ), 5 g N-(2-aminoethyl)-3-aminopropyltrimethoxysilane (commercially available under the name GENIOSIL® GF 91 from Wacker Chemie AG, D-Munich), 2 g vinyltrimethoxysilane (commercially available under the name GENIOSIL® XL 10 at Wacker Chemie AG, D-Munich) in a planetary mixer and mixed for a period of 30 minutes.
- Softener 1000 commercially available under the name "Softener 1000" from Wacker Chemie AG, D-Munich
- the RTVI mass obtained in this way was filled into moisture-proof commercially available polyethylene cartridges and stored at room temperature for 24 h and another sample at 70° C. for 7 days. Thereafter, 2 mm thick plates were spread out from each of the samples stored in this way and stored for 7 days at 23° C. and 50% relative atmospheric humidity. Test specimens in accordance with DIN 53504 of form S2 were punched out of the materials cured in the process and the mechanical parameters were measured.
- This mixture was devolatilized at a reduced pressure of 50 mbar at 120° C. on a rotary evaporator.
- the composition of the mixture was determined by means of 29-Si NMR spectroscopy.
- the mixture contained 1.4% by weight of iOctSi(OMe)3, 0.4% by weight of Me2Si(OMe)2 and 98.2% by weight of an oligomer mixture with the average composition of [iOctSi(OMe)2O1 / 2 ]o,os[iO ⁇ ctSi(OMe)O2 / 2]0.15[iOctSiO3 / 2]0.05 [Me2S1O2 / 2]0.43[Me2Si(OMe)O1 / 2]0.29
- the molecular weights determined by means of gel permeation chromatography were 929 g/mol (Mw—weight average) and 635 (Mn—number average).
- the polydispersity (Mw/Mn) was 1.46.
- a mixture of 660 g of a,w-dihydroxypolydimethylsiloxane with a viscosity of 80,000 mPas and 220 g of a,w-dihydroxypolydimethylsiloxane with a viscosity of 20,000 mPas were mixed with 30.44 g of a solution of 0.04 g 1, 5,7-Triazabicyclo[4.4.0]dec-5-ene in 30.4 g (2,3,5,6-Tetrahydro-1,4-oxazin-4-yl)methyltriethoxysilane for 5 minutes at 200 rpm /min stirred.
- the mixture is then filled into commercially available cartridges and stored away from moisture. 24 hours after the preparation of the mixtures, 2 mm thick plates were drawn out of these mixtures and, after curing for 7 days at 23°C and 50% relative humidity, dumbbell-shaped test specimens of type 2 according to ISO 37, 6th edition 2017-11, were produced .
- the skin formation times were in the usual range between 15 and 25 minutes.
- Viscosity after 2 hours 190.0 Pa.
- Viscosity after 22 hours 162.5 Pa.s
- Example 17 (not according to the invention)
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US20230399513A1 (en) | 2023-12-14 |
CN116897185A (en) | 2023-10-17 |
WO2022179691A1 (en) | 2022-09-01 |
KR20230129508A (en) | 2023-09-08 |
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