EP4216001A1 - Dispositif électronique pouvant être porté sur soi comprenant une antenne - Google Patents

Dispositif électronique pouvant être porté sur soi comprenant une antenne Download PDF

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Publication number
EP4216001A1
EP4216001A1 EP21886750.5A EP21886750A EP4216001A1 EP 4216001 A1 EP4216001 A1 EP 4216001A1 EP 21886750 A EP21886750 A EP 21886750A EP 4216001 A1 EP4216001 A1 EP 4216001A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
electronic device
electrically connected
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21886750.5A
Other languages
German (de)
English (en)
Other versions
EP4216001A4 (fr
Inventor
Jiwon Kim
Hyunwoo Kim
Seungsoo Nam
Youngho Park
Changrok LIM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP4216001A1 publication Critical patent/EP4216001A1/fr
Publication of EP4216001A4 publication Critical patent/EP4216001A4/fr
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G21/00—Input or output devices integrated in time-pieces
    • G04G21/04—Input or output devices integrated in time-pieces using radio waves
    • G—PHYSICS
    • G04—HOROLOGY
    • G04C—ELECTROMECHANICAL CLOCKS OR WATCHES
    • G04C10/00—Arrangements of electric power supplies in time pieces
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • G04G17/045—Mounting of the display
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/06—Electric connectors, e.g. conductive elastomers
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/08—Housings
    • G—PHYSICS
    • G04—HOROLOGY
    • G04R—RADIO-CONTROLLED TIME-PIECES
    • G04R60/00—Constructional details
    • G04R60/06—Antennas attached to or integrated in clock or watch bodies
    • G—PHYSICS
    • G04—HOROLOGY
    • G04R—RADIO-CONTROLLED TIME-PIECES
    • G04R60/00—Constructional details
    • G04R60/06—Antennas attached to or integrated in clock or watch bodies
    • G04R60/08—Antennas attached to or integrated in clock or watch bodies inside bezels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/273—Adaptation for carrying or wearing by persons or animals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/02—Connectors or connections adapted for particular applications for antennas

Definitions

  • Various embodiments of the disclosure relate to a technology for an antenna included in a wearable electronic device.
  • the electronic device may provide a call function such as a voice call and a video call, a message transmitting and receiving service such as a short message service (SMS)/a multimedia message service (MMS) and an e-mail, an electronic notebook function, a shooting function, a broadcasting playback function, a video playback function, a music playback function, an Internet function, a messenger function, a game function, or a social networking service (SNS) function.
  • SMS short message service
  • MMS multimedia message service
  • SNS social networking service
  • the electronic device is being designed in various forms.
  • One of electronic devices of various forms may be a wearable electronic device.
  • the wearable electronic device may be put on a part of a user's body.
  • a wearable electronic device may include a side bezel structure made of a conductive material and may include an antenna using the side bezel structure.
  • the side bezel structure that is utilized as a ground part contacts the human body, resulting in the reduction of performance of the antenna using the side bezel structure.
  • the area or volume of the side bezel structure decreases; in this case, it may be difficult to secure a sufficient ground part in the antenna using the side bezel structure.
  • Various embodiments of the disclosure may provide a wearable electronic device capable of using a side bezel structure as an antenna and capable of securing performance of the antenna by utilizing a conductive sheet included in a display module as a ground part of the antenna using the side bezel structure.
  • Various embodiments of the disclosure may provide a wearable electronic device capable of using a side bezel structure as an antenna and capable of securing performance of the antenna by utilizing a conductive sheet, which is disposed in a bezel structure antenna so as to be spaced from each other and at least a portion of which is surrounded by the bezel structure antenna, as a ground part of the antenna using the side bezel structure.
  • a wearable electronic device may include a display module, a first printed circuit board including a ground region, a side bezel structure formed of a conductive material and disposed to surround the first printed circuit board, and an antenna including a feeding part, the ground region, and at least a portion of the side bezel structure.
  • the display module may include a display panel, a second printed circuit board operatively connected with the display panel and electrically connected with the first printed circuit board through a connector, and a conductive sheet disposed between the display panel and the second printed circuit board.
  • the conductive sheet may be electrically connected with a ground terminal on the second printed circuit board through at least one connection member.
  • the ground terminal may be electrically connected with the ground region through the connector.
  • a wearable electronic device may include a printed circuit board including a ground region, a conductive housing electrically connected with the ground region and disposed to surround the printed circuit board, a conductor disposed within the conductive housing and electrically connected with the ground region, and an antenna including a feeding part, the ground region, and at least a portion of the conductive housing.
  • a conductive sheet included in a display module may be utilized as a ground part of an antenna using the side bezel structure, and thus, the performance of the antenna may be secured.
  • a frequency characteristic of an antenna using a side bezel structure may be variable by electrically connecting a conductive sheet included in a display module and a ground part of the antenna using the side bezel structure through a matching circuit and controlling the matching circuit.
  • a frequency characteristic of an antenna using a side bezel structure may be variable by electrically connecting a conductive sheet, which is disposed in the side bezel structure so as to be spaced from each other and at least a portion of which is surrounded by the side bezel structure, and a ground part of the antenna using the side bezel structure through a matching circuit and controlling the matching circuit.
  • FIG. 1 is an exploded perspective view of an electronic device according to an embodiment.
  • FIG. 2 is a cross-sectional view of an electronic device taken along line A-A' of FIG. 1 .
  • a reference numeral 101 is a cross-sectional view of an electronic device 100 taken along line A-A'
  • a reference numeral 103 is an enlarged cross-sectional view of a display module 130 and a first printed circuit board 160 of 101.
  • the electronic device 100 may include a mobile electronic device or a wearable electronic device.
  • the electronic device 100 may include a housing that includes a first surface (or a front surface), a second surface (or a rear surface), and a side surface surrounding a space between the first surface and the second surface, and a binding member (180, 190) that is connected with at least a portion of the housing and is configured to bind the electronic device 100 to a part (e.g., a wrist or an ankle) of the user's body so as to be removable.
  • a binding member 180, 190
  • the electronic device 100 may include a side bezel structure 110, a wheel key 120, the display module 130, a support member 140 (e.g., a bracket), a battery 150, the first printed circuit board 160, a back plate 170, and the binding member (180, 190).
  • the support member 140 may be disposed within the electronic device 100 so as to be connected with the side bezel structure 110 or may be integrally formed with the side bezel structure 110.
  • the wheel key 120 may be disposed on the first surface (or front surface) of the housing and may be rotatable in at least one direction. A shape of the wheel key 120 may correspond to a shape of the display module 130.
  • the display module 130 may include a front plate 210 (or a first plate), a display panel 220, a second printed circuit board 230, a conductive sheet 240, and a shock absorbing member 250.
  • the front plate 210 may include a glass plate including various coating layers, or a polymer plate so as to be formed transparently.
  • One surface (or a front surface) of the display panel 220 may be visually exposed through a considerable portion of the front plate 210.
  • a shape of the display panel 220 may be a shape corresponding to a shape of the front plate 210, and the display panel 220 may be of various shapes such as a circle, an oval, or a polygon.
  • the display panel 220 may be coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (or pressure) of a touch, and/or a fingerprint sensor or may be disposed adjacent thereto.
  • the display panel 220 and the second printed circuit board 230 may be electrically connected through a connection member 221.
  • a portion of the second printed circuit board 230 and/or the connection member 221 may be implemented with a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the display panel 220, the connection member 221, and the second printed circuit board 230 may be integrally formed through one board. In this case, the connection member 221 may be bent, and the display panel 220 and the second printed circuit board 230 may be disposed to face each other.
  • the second printed circuit board 230 may include an extension portion 233 integrally formed therewith.
  • the conductive sheet 240 may be disposed between the display panel 220 and the second printed circuit board 230.
  • the conductive sheet 240 may be formed of a conductive material such as metal (e.g., copper).
  • the conductive sheet 240 may be attached to the display panel 220 and may play a role of supporting the display panel 220.
  • the shock absorbing member 250 may be disposed between the conductive sheet 240 and the second printed circuit board 230.
  • the shock absorbing member 250 may be formed of a material, which is capable of absorbing impacts, such as a sponge.
  • the shock absorbing member 250 may be formed of a material (e.g., a sound absorbing member or a soundproof member) reducing an electrical noise.
  • the display module 130 may be coupled to one surface of the support member 140, and the first printed circuit board 160 may be coupled to an opposite surface of the support member 140.
  • the support member 140 may be formed of a metal material and/or a nonmetal material (e.g., polymer).
  • the battery 150 may be disposed between the support member 140 and the first printed circuit board 160.
  • the battery 150 that is a device for supplying a power to at least one component of the electronic device 100 may include, for example, a primary battery incapable of being recharged, a secondary battery capable of being recharged, or a fuel cell.
  • the second printed circuit board 230 may be electrically connected with the second printed circuit board 230.
  • the extension portion 233 of the second printed circuit board 230 may be implemented with a flexible printed circuit board (FPCB) and may extend along one side surface of the battery 150.
  • the second printed circuit board 230 may include a first connector 260, and the first connector 260 may be disposed at one end of the extension portion 233.
  • the first connector 260 may engage with a second connector 270 included in the first printed circuit board 160 so as to be electrically connected.
  • a processor 280 (e.g., a processor 820 of FIG. 8 ), a memory (e.g., a memory 830 of FIG. 8 ), and/or an interface (e.g., an interface 877 of FIG. 8 ) may be installed on the first printed circuit board 160.
  • the processor 280 may include, for example, one or more of a central processing unit, an application processor, a graphic processing device (GPU), a sensor processor, or a communication processor.
  • the memory may include, for example, a volatile memory or a nonvolatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • the interface may electrically or physically connect, for example, the electronic device 100 with an external electronic device and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the back plate 170 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials.
  • the back plate 170 and the side bezel structure 110 may be integrally formed and may include the same material (e.g., a metal material such as aluminum).
  • a sensor module may be disposed in the back plate 170.
  • the sensor module may generate an electrical signal or a data value that corresponds to an internal operation state of the electronic device 100 or corresponds to an external environment state.
  • the sensor module may include a biometric sensor module (e.g., an HRM sensor) disposed on the second surface (or rear surface) of the housing.
  • the sensor module may include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.
  • a gesture sensor e.g., a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.
  • a gesture sensor e.g., a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.
  • IR infrared
  • the binding member (180, 190) may be bound to at least a partial region of the housing (or the side bezel structure 110) by using a locking member, so as to be removable.
  • the binding member (180, 190) may include at least one or more of a fixing member 182, one or more fixing member fastening holes 183, a band guide member 184, and a band fixing ring 185.
  • the binding member (180, 190) may be formed of various materials and may be of various shapes.
  • the binding member (180, 190) may be formed such that an integral type and a plurality of unit links are capable of being moved with respect to each other by woven fabric, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the materials.
  • the fixing member 182 may be configured to fix the housing and the binding member (180, 190) to a part (e.g., a wrist or an ankle) of the body's body.
  • the fixing member fastening hole 183 may fix the housing and the binding member (180, 190) to the part of the user's body through the fixing member 182.
  • the band guide member 184 may be configured to limit a movement range of the fixing member 182 when the fixing member 182 is fastened to the fixing member fastening hole 183, and thus, the binding member (180, 190) may be bound to the part of the user's body so as to be in close contact therewith.
  • the band fixing ring 185 may limit the movement range of the binding member (180, 190), with the fixing member 182 fastened to the fixing member fastening hole 183.
  • FIG. 3 is an exploded perspective view illustrating a display module of FIG. 1 in one direction.
  • FIG. 4 is an exploded perspective view illustrating a display module of FIG. 1 in another direction.
  • FIG. 5 is a view schematically illustrating a cross section of an electronic device taken along line B-B' of FIG. 3 .
  • FIG. 6 is a view illustrating a method for connecting a first printed circuit board and a second printed circuit board of FIG. 5 .
  • the electronic device 100 may include an antenna.
  • the antenna may include a feeding part 530, a ground part, and a portion of the side bezel structure 110.
  • the ground part may include a ground region 161 located in the first printed circuit board 160.
  • the feeding part 530 may be electrically connected with a first point 531 of the side bezel structure 110,
  • the ground region 161 may be electrically connected with a second point 162 of the side bezel structure 110, which is spaced from the first point 531 as much as a specified distance.
  • the processor 280 e.g., a communication module or a communication module 890 to be described later
  • the antenna may operate at a specified frequency (e.g., a low-band frequency).
  • a specified frequency e.g., a low-band frequency
  • the side bezel structure 110 that is utilized as a ground part contacts the human body, resulting in the reduction of performance of the antenna.
  • the area or volume of the side bezel structure 110 may decrease; in this case, it may be difficult to secure a sufficient ground part in the antenna.
  • the performance of the antenna may be improved.
  • the shock absorbing member 250 may include at least one opening 311.
  • a conductive member 310 e.g., a conductive tape
  • the conductive member 310 may be electrically connected with a ground terminal 231 included in the second printed circuit board 230.
  • the first connector 260 may be connected with the extension portion 233 of the second printed circuit board 230 and may include a plurality of first connection pins.
  • the second connector 270 may be disposed in the first printed circuit board 160 and may include a plurality of second connection pins that engage with the plurality of first connection pins so as to be connected with each other.
  • the plurality of first connection pins may include a first ground pin 261.
  • the plurality of second connection pins may include a second ground pin 271.
  • the plurality of first connection pins and the plurality of second connection pins may engage with each other in one-to-one correspondence so as to be electrically connected.
  • the first ground pin 261 and the second ground pin 271 may be electrically connected.
  • the ground terminal 231 may be electrically connected with the first ground pin 261 of the first connector 260 through a first wire 610. At least a portion of the first wire 610 may be included in the extension portion 233 of the second printed circuit board 230.
  • the first ground pin 261 may be electrically connected with the second ground pin 271 of the second connector 270.
  • the second ground pin 271 may be electrically connected with a first switch 510 through a second wire 620.
  • the first switch 510 may be electrically connected with the ground region 161 of the first printed circuit board 160 through a third wire 630.
  • the processor 280 may control the connection between the second ground pin 271 and the ground region 161 through the first switch 510 and may form an electrical path including the conductive sheet 240 and the ground region 161.
  • the second ground pin 271 may be directly electrically connected with the ground region 161.
  • the ground terminal 231 may be electrically connected with an additional ground region (not illustrated) of the second printed circuit board 230.
  • the second printed circuit board 230 may include an additional ground region (not illustrated) that is electrically connected with the ground region 161 of the first printed circuit board 160 through the extension portion 233, the first connector 260, and/or the second connector 270.
  • the additional ground region (not illustrated) may be electrically connected with the first wire 610 through the ground terminal 231, and the first wire 610 may be electrically connected with the first connector 260.
  • the processor 280 may control the first switch 510 to form the electrical path including the ground region 161 and the conductive sheet 240.
  • the ground region 161 and the conductive sheet 240 are electrically connected, the area or volume of the ground part of the antenna may be expanded. As such, the performance of the antenna may be improved.
  • the first switch 510 may include a matching circuit (e.g., a capacitor or an inductor).
  • the processor 280 may control the matching circuit such that the impedance between the conductive sheet 240 and the ground region 161 is controlled; in this case, a frequency characteristic of the antenna may vary.
  • the ground region 161 may be electrically connected with the additional ground region (not illustrated) of the second printed circuit board 230 through a second switch 520.
  • the processor 280 may electrically connect the ground region 161 and the additional ground region of the second printed circuit board 230 through the second switch 520 such that the area or volume of the ground part of the antenna is further expanded.
  • the processor 280 may control the second switch 520 to form an electrical path including the additional ground region (not illustrated) and the ground region 161.
  • the ground region 161 may be directly electrically connected with the additional ground region of the second printed circuit board 230.
  • the ground region 161 may be electrically connected with the conductive sheet 240 and the additional ground region (not illustrated) of the second printed circuit board 230 through the first switch 510.
  • the conductive sheet 240 and the additional ground region (not illustrated) of the second printed circuit board 230 may be electrically connected; in this case, the processor 280 may electrically connect the conductive sheet 240 and the additional ground region of the second printed circuit board 230 through the first switch 510 such that the area or volume of the ground part of the antenna is further expanded.
  • the side bezel structure 110 of the electronic device 100 may be used as an antenna, and the conductive sheet 240 may be disposed inside the side bezel structure 110 so as to be spaced from each other, and at least a portion of the conductive sheet 240 may be surrounded by the side bezel structure 110.
  • the processor 280 may control the first switch 510 such that the ground region 161 of the antenna using the side bezel structure 110 is electrically connected with the conductive sheet 240, which is disposed inside the side bezel structure 110 so as to be spaced from each other and at least a portion of which is surrounded by the side bezel structure 110.
  • an operation frequency characteristic of the antenna using the side bezel structure 110 may be improved.
  • the antenna using the side bezel structure 110 included in the electronic device 100 may utilize the conductive sheet 240 of the display module 130, and thus, the area or volume of the ground part may be expanded. Also, the conductive sheet 240 and the ground region 161 may be electrically connected through the extension portion 233 of the second printed circuit board 230, the first connector 260, and/or the second connector 270. Accordingly, the antenna may expand the area or volume of the ground part without an additional coupling pattern or an additional conductive structure.
  • a wearable electronic device may include a display module (e.g., the display module 130 or a display module 860), a first printed circuit board (e.g., the first printed circuit board 160) that includes a ground region (e.g., the ground region 161), a side bezel structure (e.g., the side bezel structure 110) that is formed of a conductive material and is disposed to surround the first printed circuit board, and an antenna that includes a feeding part (e.g., the feeding part 530), the ground region, and at least a portion of the side bezel structure.
  • a display module e.g., the display module 130 or a display module 860
  • a first printed circuit board e.g., the first printed circuit board 160
  • a side bezel structure e.g., the side bezel structure 110
  • an antenna that includes a feeding part (e.g., the feeding part 530), the ground region, and at least a portion of the side bezel structure.
  • the display module may include a display panel, a second printed circuit board (e.g., the second printed circuit board 230) that is operatively connected with the display panel and is electrically connected with the first printed circuit board through a connector (e.g., the first connector 260), and a conductive sheet (e.g., the conductive sheet 240) that is disposed between the display panel and the second printed circuit board.
  • the conductive sheet may be electrically connected with a ground terminal (e.g., the ground terminal 231) on the second printed circuit board through at least one connection member (e.g., the conductive member 310).
  • the ground terminal may be electrically connected with the ground region through the connector.
  • the wearable electronic device may further include a shock absorbing member (e.g., the shock absorbing member 250) that is disposed between the conductive sheet and the second printed circuit board and includes at least one opening.
  • the conductive sheet may electrically contact the ground terminal through a conductive member disposed in the at least one opening.
  • the wearable electronic device may further include a first connector (e.g., the first connector 260) that is connected with an extension portion (e.g., the extension portion 233) of the second printed circuit board and includes a plurality of first connection pins and a second connector (e.g., the second connector 270) that is disposed in the first printed circuit board and includes a plurality of second connection pins engaging with the plurality of first connection pins so as to be connected with each other.
  • the ground terminal may be electrically connected with a first ground pin (e.g., the first ground pin 261) of the first connector through a first wire (e.g., the first wire 610) disposed in the extension portion.
  • the first ground pin may be electrically connected with a second ground pin (e.g., the second ground pin 271) of the second connector.
  • the second ground pin may be electrically connected with the ground region.
  • the wearable electronic device may further include a processor (e.g., the processor 280 or the processor 820) that is operatively connected with the first printed circuit board and a switch (e.g., the first switch 510) that is electrically connected between the second ground pin and the ground region.
  • the processor may control a connection between the second ground pin and the ground region through the switch to form an electrical path including the conductive sheet and the ground region.
  • the wearable electronic device may further include a processor (e.g., the processor 280 or the processor 820) that is operatively located in the first printed circuit board and a matching circuit (e.g., a capacitor or an inductor) that is electrically connected between the second ground pin and the ground region.
  • the processor may control the matching circuit such that an impedance between the conductive sheet and the ground region is controlled.
  • the wearable electronic device may further include a battery (e.g., the battery 150 or a battery 889) that is disposed between the first printed circuit board and the second printed circuit board.
  • a battery e.g., the battery 150 or a battery 889
  • a portion of the extension portion may be disposed to extend along one side surface of the battery.
  • the conductive member may include a conductive tape.
  • the feeding part may be electrically connected with a first point of the side bezel structure.
  • the ground region may be electrically connected with a second point of the side bezel structure, which is spaced from the first point as much as a specified distance.
  • the ground region may be electrically connected with an additional ground region included in the second printed circuit board.
  • the wearable electronic device may further include a processor (e.g., the processor 280 or the processor 820) that is operatively located in the first printed circuit board and a switch (e.g., the first switch 510 or the second switch 520) that is electrically connected between the ground region and an additional ground region included in the second printed circuit board.
  • the processor may control the switch to form an electrical path including the ground region and the additional ground region.
  • a wearable electronic device may include a printed circuit board (e.g., the first printed circuit board 160) that includes a ground region (e.g., the ground region 161), a conductive housing (e.g., the side bezel structure 110) that is electrically connected with the ground region and disposed to surround the printed circuit board, a conductor (e.g., the conductive sheet 240) that is disposed within the conductive housing and is electrically connected with the ground region, and an antenna that includes a feeding part (e.g., the feeding part 530), the ground region, and at least a portion of the conductive housing.
  • a printed circuit board e.g., the first printed circuit board 160
  • a conductive housing e.g., the side bezel structure 110
  • a conductor e.g., the conductive sheet 240
  • an antenna that includes a feeding part (e.g., the feeding part 530), the ground region, and at least a portion of the conductive housing.
  • the wearable electronic device may further include a display panel.
  • the conductor may be disposed between the display panel and the printed circuit board.
  • the wearable electronic device may further include a flexible printed circuit board (e.g., the second printed circuit board 230) that is operatively connected with the display panel.
  • the conductor may be disposed between the display panel and the flexible printed circuit board.
  • the wearable electronic device may further include a shock absorbing member (e.g., the shock absorbing member 250) that is disposed between the conductor and the flexible printed circuit board.
  • the flexible printed circuit board and the printed circuit board may be electrically connected through a connector (e.g., the first connector 260 and the second connector 270).
  • the conductor may pass through a portion of the shock absorbing member and may be electrically connected with a ground terminal included in the flexible printed circuit board.
  • the ground terminal may be electrically connected with the ground region through the connector.
  • the shock absorbing member may include at least one opening.
  • the conductor may electrically contact the ground terminal through a conductive member disposed in the at least one opening.
  • the wearable electronic device may further include a first connector (e.g., the first connector 260) that is connected with an extension portion (e.g., the extension portion 233) of the flexible printed circuit board and includes a plurality of first connection pins, and a second connector (e.g., the second connector 270) that is disposed in the printed circuit board and includes a plurality of second connection pins engaging with the plurality of first connection pins so as to be connected with each other.
  • the ground terminal may be electrically connected with a first ground pin (e.g., the first ground pin 261) of the first connector through a first wire disposed in the extension portion.
  • the first ground pin may be electrically connected with a second ground pin (e.g., the second ground pin 271) of the second connector.
  • the second ground pin may be electrically connected with the ground region.
  • the wearable electronic device may further include a processor (e.g., the processor 280 or the processor 820) that is located in the printed circuit board, and a switch (e.g., the first switch 510) that is electrically connected between the second ground pin and the ground region.
  • the processor may control a connection between the second ground pin and the ground region through the switch to form an electrical path including the conductor and the ground region.
  • the wearable electronic device may further include a processor (e.g., the processor 280 or the processor 820) that is located in the printed circuit board, and a matching circuit (e.g., a capacitor or an inductor) that is electrically connected between the second ground pin and the ground region.
  • the processor may control the matching circuit such that an impedance between the conductor and the ground region is controlled.
  • the wearable electronic device may further include a processor (e.g., the processor 280 or the processor 820) that is located in the printed circuit board, and a switch (e.g., the first switch 510 or the second switch 520) that is electrically connected between the ground region and an additional ground region included in the flexible printed circuit board.
  • the processor may control the switch to form an electrical path including the ground region and the additional ground region.
  • the feeding part may be electrically connected with a first point of the conductive housing.
  • the ground region may be electrically connected with a second point (e.g., the second point 162) of the conductive housing, which is spaced from the first point (e.g., the first point 531) as much as a specified distance.
  • FIG. 7 is a graph illustrating an antenna characteristic switch effect of an electronic device according to an embodiment.
  • a frequency characteristic of the antenna including the side bezel structure 110 may be variable.
  • the first switch 510 that is electrically connected between the conductive sheet 240 of the display module 130 and the ground region 161 of the first printed circuit board 160 may include a matching circuit (e.g., a capacitor or an inductor).
  • the processor 280 may control the matching circuit to change the frequency characteristic of the antenna.
  • a low-band (e.g., a band of 1GHz or lower) frequency characteristic of the antenna may be changed like a first graph 710, a second graph 720, a third graph 730, or a fourth graph 730.
  • FIG. 8 is a block diagram illustrating an electronic device 801 in a network environment 800 according to various embodiments.
  • the electronic device 801 in the network environment 800 may communicate with an electronic device 802 via a first network 898 (e.g., a short-range wireless communication network), or an electronic device 804 or a server 808 via a second network 899 (e.g., a long-range wireless communication network).
  • the electronic device 801 may communicate with the electronic device 804 via the server 808.
  • the electronic device 801 may include a processor 820, memory 830, an input module 850, a sound output module 855, a display module 860, an audio module 870, a sensor module 876, an interface 877, a connecting terminal 878, a haptic module 879, a camera module 880, a power management module 888, a battery 889, a communication module 890, a subscriber identification module (SIM) 196, or an antenna module 897.
  • the components e.g., the connecting terminal 878, may be omitted from the electronic device 801, or one or more other components may be added in the electronic device 801.
  • some of the components e.g., the sensor module 876, the camera module 880, or the antenna module 897) may be implemented as a single component (e.g., the display module 860).
  • the processor 820 may execute, for example, software (e.g., a program 840) to control at least one other component (e.g., a hardware or software component) of the electronic device 801 coupled with the processor 820, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 820 may store a command or data received from another component (e.g., the sensor module 876 or the communication module 890) in volatile memory 832, process the command or the data stored in the volatile memory 832, and store resulting data in non-volatile memory 834.
  • software e.g., a program 840
  • the processor 820 may store a command or data received from another component (e.g., the sensor module 876 or the communication module 890) in volatile memory 832, process the command or the data stored in the volatile memory 832, and store resulting data in non-volatile memory 834.
  • the processor 820 may include a main processor 821 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 823 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 821.
  • a main processor 821 e.g., a central processing unit (CPU) or an application processor (AP)
  • auxiliary processor 823 e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)
  • the main processor 821 may be adapted to consume less power than the main processor 821, or to be specific to a specified function.
  • the auxiliary processor 823 may be implemented as separate from, or as part of the main processor 821.
  • the auxiliary processor 823 may control at least some of functions or states related to at least one component (e.g., the display module 860, the sensor module 876, or the communication module 890) among the components of the electronic device 801, instead of the main processor 821 while the main processor 821 is in an inactive (e.g., sleep) state, or together with the main processor 821 while the main processor 821 is in an active state (e.g., executing an application).
  • the auxiliary processor 823 e.g., an image signal processor or a communication processor
  • the auxiliary processor 823 may include a hardware structure specified for artificial intelligence model processing.
  • An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 801 where the artificial intelligence is performed or via a separate server (e.g., the server 808). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • the artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto.
  • the artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
  • the memory 830 may store various data used by at least one component (e.g., the processor 820 or the sensor module 876) of the electronic device 801.
  • the various data may include, for example, software (e.g., the program 840) and input data or output data for a command related thereto.
  • the memory 830 may include the volatile memory 832 or the non-volatile memory 834.
  • the program 840 may be stored in the memory 830 as software, and may include, for example, an operating system (OS) 842, middleware 844, or an application 846.
  • OS operating system
  • middleware middleware
  • application 846 application
  • the input module 850 may receive a command or data to be used by another component (e.g., the processor 820) of the electronic device 801, from the outside (e.g., a user) of the electronic device 801.
  • the input module 850 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
  • the sound output module 855 may output sound signals to the outside of the electronic device 801.
  • the sound output module 855 may include, for example, a speaker or a receiver.
  • the speaker may be used for general purposes, such as playing multimedia or playing record.
  • the receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
  • the display module 860 may visually provide information to the outside (e.g., a user) of the electronic device 801.
  • the display module 860 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector.
  • the display module 860 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.
  • the audio module 870 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 870 may obtain the sound via the input module 850, or output the sound via the sound output module 855 or a headphone of an external electronic device (e.g., an electronic device 802) directly (e.g., wiredly) or wirelessly coupled with the electronic device 801.
  • an external electronic device e.g., an electronic device 802 directly (e.g., wiredly) or wirelessly coupled with the electronic device 801.
  • the sensor module 876 may detect an operational state (e.g., power or temperature) of the electronic device 801 or an environmental state (e.g., a state of a user) external to the electronic device 801, and then generate an electrical signal or data value corresponding to the detected state.
  • the sensor module 876 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 877 may support one or more specified protocols to be used for the electronic device 801 to be coupled with the external electronic device (e.g., the electronic device 802) directly (e.g., wiredly) or wirelessly.
  • the interface 877 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD secure digital
  • a connecting terminal 878 may include a connector via which the electronic device 801 may be physically connected with the external electronic device (e.g., the electronic device 802).
  • the connecting terminal 878 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).
  • the haptic module 879 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation.
  • the haptic module 879 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
  • the camera module 880 may capture a still image or moving images.
  • the camera module 880 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 888 may manage power supplied to the electronic device 801. According to one embodiment, the power management module 888 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 889 may supply power to at least one component of the electronic device 801.
  • the battery 889 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
  • the communication module 890 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 801 and the external electronic device (e.g., the electronic device 802, the electronic device 804, or the server 808) and performing communication via the established communication channel.
  • the communication module 890 may include one or more communication processors that are operable independently from the processor 820 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication.
  • AP application processor
  • the communication module 890 may include a wireless communication module 892 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 894 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module).
  • a wireless communication module 892 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 894 e.g., a local area network (LAN) communication module or a power line communication (PLC) module.
  • LAN local area network
  • PLC power line communication
  • a corresponding one of these communication modules may communicate with the external electronic device via the first network 898 (e.g., a short-range communication network, such as Bluetooth TM , wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 899 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)).
  • first network 898 e.g., a short-range communication network, such as Bluetooth TM , wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)
  • the second network 899 e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)).
  • the wireless communication module 892 may identify and authenticate the electronic device 801 in a communication network, such as the first network 898 or the second network 899, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 896.
  • subscriber information e.g., international mobile subscriber identity (IMSI)
  • the wireless communication module 892 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology.
  • the NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module 892 may support a high-frequency band (e.g., the mmWave band) to achieve, e.g., a high data transmission rate.
  • the wireless communication module 892 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 892 may support various requirements specified in the electronic device 801, an external electronic device (e.g., the electronic device 804 ), or a network system (e.g., the second network 899).
  • the wireless communication module 892 may support a peak data rate (e.g., 20Gbps or more) for implementing eMBB, loss coverage (e.g., 164dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1ms or less) for implementing URLLC.
  • a peak data rate e.g., 20Gbps or more
  • loss coverage e.g., 164dB or less
  • U-plane latency e.g., 0.5ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1ms or less
  • the antenna module 897 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 801.
  • the antenna module 897 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)).
  • the antenna module 897 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 898 or the second network 899, may be selected, for example, by the communication module 890 (e.g., the wireless communication module 892) from the plurality of antennas.
  • the communication module 890 e.g., the wireless communication module 892
  • the signal or the power may then be transmitted or received between the communication module 890 and the external electronic device via the selected at least one antenna.
  • another component e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 897 may form a mmWave antenna module.
  • the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
  • a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band)
  • a plurality of antennas e.g., array antennas
  • At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
  • an inter-peripheral communication scheme e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • commands or data may be transmitted or received between the electronic device 801 and the external electronic device 804 via the server 808 coupled with the second network 899.
  • Each of the electronic devices 802 or 804 may be a device of a same type as, or a different type, from the electronic device 801.
  • all or some of operations to be executed at the electronic device 801 may be executed at one or more of the external electronic devices 802, 804, or 808.
  • the electronic device 801 instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service.
  • the one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 801.
  • the electronic device 801 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request.
  • a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the electronic device 801 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing.
  • the external electronic device 804 may include an internet-of things (IoT) device.
  • the server 808 may be an intelligent server using machine learning and/or a neural network.
  • the external electronic device 804 or the server 808 may be included in the second network 899.
  • the electronic device 801 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.
  • the electronic device may be one of various types of electronic devices.
  • the electronic devices may include, for example, a mobile communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.
  • each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases.
  • such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order).
  • an element e.g., a first element
  • the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
  • module may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”.
  • a module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions.
  • the module may be implemented in a form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments as set forth herein may be implemented as software (e.g., the program 840) including one or more instructions that are stored in a storage medium (e.g., internal memory 836 or external memory 838) that is readable by a machine (e.g., the electronic device 801).
  • a processor e.g., the processor 820
  • the machine e.g., the electronic device 801
  • the one or more instructions may include a code generated by a complier or a code executable by an interpreter.
  • the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
  • non-transitory simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.
  • a method may be included and provided in a computer program product.
  • the computer program product may be traded as a product between a seller and a buyer.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore TM ), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.
  • CD-ROM compact disc read only memory
  • an application store e.g., PlayStore TM
  • two user devices e.g., smart phones
  • each component e.g., a module or a program of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration.
  • operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.

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