EP4211996A1 - Procédé et système de production de pièce coulée pour la production d'un carter de moteur électrique, et moteur électrique - Google Patents

Procédé et système de production de pièce coulée pour la production d'un carter de moteur électrique, et moteur électrique

Info

Publication number
EP4211996A1
EP4211996A1 EP21770242.2A EP21770242A EP4211996A1 EP 4211996 A1 EP4211996 A1 EP 4211996A1 EP 21770242 A EP21770242 A EP 21770242A EP 4211996 A1 EP4211996 A1 EP 4211996A1
Authority
EP
European Patent Office
Prior art keywords
electrically conductive
circuit board
insulating layer
printed circuit
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21770242.2A
Other languages
German (de)
English (en)
Inventor
Jochen Mahlein
Leobald Podbielski
Martin Filsinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEW Eurodrive GmbH and Co KG
Original Assignee
SEW Eurodrive GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEW Eurodrive GmbH and Co KG filed Critical SEW Eurodrive GmbH and Co KG
Publication of EP4211996A1 publication Critical patent/EP4211996A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Definitions

  • the invention relates to a printed circuit board, comprising an upper side for accommodating electrical components, an underside for accommodating a heat sink, a plurality of electrically conductive layers and a plurality of electrically insulating layers.
  • the invention also relates to a circuit arrangement that includes a printed circuit board.
  • Multilayer printed circuit boards are used to accommodate electrical components such as resistors, capacitors, transistors and power semiconductors.
  • Multilayer printed circuit boards which have a plurality of electrically conductive layers.
  • the electrically conductive layers have conductor tracks for interconnecting the electrical components.
  • Insulation layers are provided between the electrically conductive layers, which electrically insulate the electrically conductive layers from one another.
  • plated-through holes which are also referred to as vias, are known.
  • Cooling bodies are known for dissipating the heat.
  • Heat sinks are generally metallic, in particular made of aluminum, and are attached to the underside of a printed circuit board, for example by means of a double-sided adhesive film.
  • the adhesive foil has the task of electrically isolating the heat sink from the circuit board.
  • heat should be transported from the electrical components through the printed circuit board to the heat sink.
  • DE 102017223 523 A1 discloses a generic printed circuit board and a method for connecting the printed circuit board to a heat sink.
  • the printed circuit board is connected to a heat sink by means of a layer of resin or by means of several layers of resin.
  • Thermally conductive filler particles which are in particular ceramic particles, are provided in the resin layers.
  • the invention is based on the object of further developing a printed circuit board and a circuit arrangement.
  • the object is achieved according to the invention by a printed circuit board with the features specified in claim 1.
  • Advantageous refinements and developments are the subject of the dependent claims.
  • the object is also achieved by a circuit arrangement having the features specified in claim 10.
  • a printed circuit board comprises an upper side for accommodating electrical components, an underside for accommodating a heat sink, a plurality of electrically conductive layers and a plurality of electrically insulating layers.
  • a main insulation layer is arranged between the top and the bottom, with the main insulation layer electrically conductive layers that are arranged between the main insulation layer and the top being electrically conductive layers that are arranged between the main insulation layer and the bottom, electrically completely insulated.
  • a plurality of upper vias extend at least from an outer insulating layer adjacent to the upper side into an inner insulating layer adjacent to the main insulating layer.
  • a plurality of lower vias extend at least from the underside into a lower insulating layer adjacent to the main insulating layer.
  • the voltage isolation between the electrical components on the top and the heat sink on the bottom is ensured by the main insulating layer.
  • An adhesive film or adhesive layer for attaching the heat sink does not therefore have the task of isolating voltage, but serves exclusively to mechanically attach the heat sink to the printed circuit board.
  • the adhesive film or adhesive layer can therefore be made relatively thin, which in particular advantageously improves the thermal conductivity of the adhesive film or adhesive layer.
  • the adhesive film or adhesive layer is therefore also cheaper.
  • the conduction of heat from the electrical components on the top to the heatsink on the bottom is largely handled by the top vias and bottom vias.
  • the vias are made from a material with good thermal conductivity, in particular from a metallic material.
  • the introduction of vias in printed circuit boards is standard in terms of production technology and can therefore be carried out without any problems.
  • the main insulation layer has a relatively small thickness of 150 ⁇ m, for example. Thus, the main insulation layer allows heat conduction from the top vias to the bottom vias.
  • an electrically conductive layer lies directly on a surface of the main insulating layer facing the underside, and a plurality of lower vias extend from the underside through the lower insulating layer adjacent to the main insulating layer to said electrically conductive layer.
  • a plurality of lower vias which extend from the underside through the lower insulating layer adjacent to the main insulating layer and up to said electrically conductive layer, are connected to said electrically conductive layer.
  • an electrically conductive layer lies directly on the underside, and a plurality of lower vias are connected to said electrically conductive layer.
  • an electrically conductive layer lies directly on a surface of the main insulating layer facing the top, and a plurality of upper vias extend at least from the outer insulating layer adjacent to the top to said electrically conductive layer.
  • a plurality of upper vias which extend at least from the outer insulating layer adjacent to the upper side to said electrically conductive layer, are connected to said electrically conductive layer.
  • an electrically conductive layer lies directly on the upper side, and a plurality of upper vias extend at least from said electrically conductive layer into the inner insulating layer adjacent to the main insulating layer.
  • a plurality of upper vias which extend at least from said electrically conductive layer into the inner insulating layer adjacent to the main insulating layer, are connected to said electrically conductive layer.
  • the main insulation layer is pierced by at least one hole for receiving a connecting wire of an electrical component.
  • a circuit arrangement according to the invention comprises a circuit board according to the invention, a plurality of electrical components which are attached to the top of the circuit board and connected to the circuit board, and at least one heat sink which is attached to the underside of the circuit board and connected to the circuit board.
  • the printed circuit board in the circuit arrangement has a comparatively good thermal contact resistance while at the same time guaranteeing voltage insulation between the electrical components on the top and the heat sink on the bottom.
  • the circuit arrangement can be produced with simple means and at low cost.
  • the printed circuit board includes at least one electrical component with connecting wires, which is attached to the top of the printed circuit board.
  • the connecting wires of the electrical component protrude through holes in the printed circuit board and are connected to the at least one heat sink on the underside of the printed circuit board.
  • Figure 1 a schematic representation of a circuit arrangement.
  • FIG. 1 shows a schematic representation of a circuit arrangement 15.
  • the circuit arrangement 15 comprises a circuit board 10, a plurality of electrical components 55 and a heat sink 50.
  • the circuit board 10 has an upper side 11 for accommodating the electrical components 55 and an underside 12 for accommodating the heat sink 50 on.
  • the electrical components 55 are attached to the top 11 of the printed circuit board 10 and connected to the printed circuit board 10 .
  • the electrical components 55 are predominantly SMD components (Surface Mounted Devices) which are soldered onto the upper side 11 of the printed circuit board 10 , but also conventional components which have connecting wires 56 .
  • the heat sink 50 is attached to the underside 12 of the circuit board 10 and connected to the circuit board 10 .
  • the heat sink 50 is glued to the underside 12 of the printed circuit board 10 by means of a double-sided adhesive film 52 .
  • the heat sink 50 is made of a metallic material, in particular aluminum.
  • the heat sink 50 has recesses for accommodating the connection wires 56 of the electrical components 55 . Said recesses are dimensioned in such a way that the connection wires 56 have no electrical contact with the heat sink 50 .
  • the circuit board 10 includes a plurality of electrically conductive layers 40, which are made of copper, for example.
  • the electrically conductive layers 40 do not necessarily extend over the entire surface of the printed circuit board 10, but instead include, for example, only individual conductor tracks that are separated from one another.
  • the circuit board 10 also includes a plurality of electrically insulating insulation layers 31, 32, 33, 34, 35, which are arranged between the electrically conductive layers 40 and at least partially electrically insulate them from one another. This means that there are vias, not shown here, by means of which electrical connections from a conductor track to an electrically conductive layer 40 to another conductor track in another electrically conductive layer 40 can be produced.
  • an electrically conductive layer 40 is in direct contact with the underside 12 .
  • a lower insulating layer 32 adjoins said electrically conductive layer 40 .
  • a further electrically conductive layer 40 adjoins the lower insulating layer 32 .
  • a main insulation layer 31 adjoins said electrically conductive layer 40 .
  • the main insulation layer 31 is made of prepreg, for example, and has a thickness of 150 ⁇ m, for example.
  • Prepreg is a layer of fibers or fabric that is impregnated, in particular with a resin.
  • an electrically conductive layer 40 lies directly on the upper side 11 .
  • An outer insulating layer 33 adjoins said electrically conductive layer 40 .
  • a further electrically conductive layer 40 adjoins the outer insulating layer 33 .
  • a further insulating layer 35 adjoins said electrically conductive layer 40 .
  • a further electrically conductive layer 40 adjoins said further insulating layer 33 .
  • a further insulating layer 35 adjoins said electrically conductive layer 40 .
  • a further electrically conductive layer 40 adjoins said further insulating layer 33 .
  • An inner insulation layer 34 adjoins said electrically conductive layer 40 .
  • a further electrically conductive layer 40 adjoins said inner insulating layer 34 .
  • the main insulation layer 31 adjoins said electrically conductive layer 40 .
  • an electrically conductive layer 40 is in direct contact with a surface of the main insulation layer 31 facing the bottom 12 and an electrically conductive layer 40 is in direct contact with a surface of the main insulation layer 31 facing the top 11 .
  • the main insulation layer 31 is thus arranged between the top 11 and the bottom 12 of the printed circuit board 10 .
  • the main insulating layer 31 completely electrically insulates the electrically conductive layers 40 arranged between the main insulating layer 31 and the upper side 11 from the electrically conductive layers 40 arranged between the main insulating layer 31 and the lower side 12 .
  • the electrically conductive layers 40 that are arranged between the main insulation layer 31 and the top 11 therefore have no electrical connection to the electrically conductive layers 40 that are arranged between the main insulation layer 31 and the bottom 12 .
  • the printed circuit board 10 comprises a plurality of lower vias 22.
  • the lower vias 22 extend at least from the underside 12 into the lower insulating layer 32, which is adjacent to the main insulating layer 31, into it.
  • a plurality of lower vias 22 are connected, in particular soldered, to that electrically conductive layer 40 which is in direct contact with the underside 12 .
  • a plurality of lower vias 22 extend from the underside 12 through the lower insulating layer 32, which is adjacent to the main insulating layer 31, through to that electrically conductive layer 40 which is directly adjacent to the surface of the main insulating layer 31 which faces the underside 12 .
  • a plurality of lower vias 22 are connected to said electrically conductive layer 40, in particular soldered.
  • the circuit board 10 includes a plurality of top vias 21.
  • the top vias 21 extend at least from the outer insulating layer 33, which is adjacent to the top 11, into the inner insulating layer 34, which is adjacent to the main insulating layer 31, into it.
  • a plurality of upper vias 21 extend at least from that electrically conductive layer 40 which is in direct contact with the upper side 11 into the inner insulating layer 34 which is adjacent to the main insulating layer 31 .
  • a plurality of upper vias 21 are connected, in particular soldered, to that electrically conductive layer 40 which is in direct contact with the upper side 11 .
  • a plurality of top vias 21 extend at least from the outer insulating layer 33 adjacent the top 11 to that electrically conductive layer 40 which abuts immediately against the surface of the main insulating layer 31 which faces the top 11.
  • a plurality of upper vias 21 are connected to said electrically conductive layer 40, in particular soldered.
  • a plurality of upper vias 21 extend in particular through a number of further electrically conductive layers 40 and through a number of further insulating layers 35 . Said upper vias 21 are electrically insulated from said further electrically conductive layers 40 .
  • the upper vias 21 and the lower vias 22 are made of copper and are solid. It is also conceivable for the upper vias 21 and the lower vias 22 to be of hollow-cylindrical design.
  • the vias 21, 22 are preferably made of a metallic material, which enables good heat conduction.
  • the main insulating layer 31 of the printed circuit board 10 has a plurality of bores for receiving connecting wires 56 of the electrical components 55, which are designed as conventional components. Said bores are formed in such a way that the connection wires 56 accommodated therein are electrically insulated from the electrically conductive layers 40 which lie directly against the surfaces of the main insulating layer 31 . The connection wires 56 accommodated in the said bores are also electrically insulated from the electrically conductive layer 40 which is in direct contact with the underside 12 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

L'invention concerne une carte de circuits imprimés (10) qui comprend un côté supérieur (11) pour recevoir des composants électriques (55), un côté inférieur (12) pour recevoir un dissipateur thermique (50), une pluralité de couches électroconductrices (40) et une pluralité de couches d'isolation électrique (31, 32, 33, 34, 35), une couche d'isolation principale (31) étant disposée entre le côté supérieur (11) et le côté inférieur (12), la couche d'isolation principale (31) assurant une isolation électrique complète des couches électroconductrices (40) qui sont disposées entre la couche d'isolation principale (31) et le côté supérieur (11) des couches électroconductrices (40) qui sont disposées entre la couche d'isolation principale (31) et le côté inférieur (12) ; une pluralité de trous traversants métallisés supérieurs (21) s'étendant au moins à partir d'une couche d'isolation extérieure (33) adjacente au côté supérieur (11) dans une couche d'isolation intérieure (34) adjacente à la couche d'isolation principale (31) ; une pluralité de trous traversants métallisés inférieurs (22) s'étendant au moins à partir du côté inférieur (12) dans une couche d'isolation inférieure (32) adjacente à la couche d'isolation principale (31). L'invention concerne également un ensemble circuit (15) qui comprend une carte de circuits imprimés selon l'invention, une pluralité de composants électriques (55) sui sont montés sur le côté supérieur (11) de la carte de circuit imprimé et qui sont connectés à la carte de circuits imprimés (10), et au moins un dissipateur thermique (50) qui est monté sur le côté inférieur (12) de la carte de circuits imprimés et qui est relié à la carte de circuits imprimés (10).
EP21770242.2A 2020-09-10 2021-09-02 Procédé et système de production de pièce coulée pour la production d'un carter de moteur électrique, et moteur électrique Pending EP4211996A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020005541 2020-09-10
PCT/EP2021/074302 WO2022053397A1 (fr) 2020-09-10 2021-09-02 Carte de circuits imprimés et ensemble circuit

Publications (1)

Publication Number Publication Date
EP4211996A1 true EP4211996A1 (fr) 2023-07-19

Family

ID=77774922

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21770242.2A Pending EP4211996A1 (fr) 2020-09-10 2021-09-02 Procédé et système de production de pièce coulée pour la production d'un carter de moteur électrique, et moteur électrique

Country Status (5)

Country Link
US (1) US20230337352A1 (fr)
EP (1) EP4211996A1 (fr)
CN (1) CN116250379A (fr)
DE (1) DE102021004458A1 (fr)
WO (1) WO2022053397A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4241756B2 (ja) * 2005-05-13 2009-03-18 オムロン株式会社 部品実装基板構造
KR102155740B1 (ko) * 2014-02-21 2020-09-14 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
DE102014216194B3 (de) * 2014-08-14 2015-12-10 Robert Bosch Gmbh Schaltungsträger mit einem Wärmeleitelement, Verbindungsanordnung mit einem Schaltungsträger und Verfahren zum Abführen von Verlustwärme
DE102017223523A1 (de) 2017-12-21 2019-06-27 Robert Bosch Gmbh Schaltungsträger mit einer harzverbundenen Wärmesenke

Also Published As

Publication number Publication date
DE102021004458A1 (de) 2022-03-10
CN116250379A (zh) 2023-06-09
US20230337352A1 (en) 2023-10-19
WO2022053397A1 (fr) 2022-03-17

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