Classifications

• • A—HUMAN NECESSITIES
  • A63—SPORTS; GAMES; AMUSEMENTS
  • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
  • A63B41/00—Hollow inflatable balls
• • A—HUMAN NECESSITIES
  • A63—SPORTS; GAMES; AMUSEMENTS
  • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
  • A63B43/00—Balls with special arrangements
  • A63B43/004—Balls with special arrangements electrically conductive, e.g. for automatic arbitration
• • A—HUMAN NECESSITIES
  • A63—SPORTS; GAMES; AMUSEMENTS
  • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
  • A63B45/00—Apparatus or methods for manufacturing balls
• • A—HUMAN NECESSITIES
  • A63—SPORTS; GAMES; AMUSEMENTS
  • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
  • A63B2220/00—Measuring of physical parameters relating to sporting activity
  • A63B2220/80—Special sensors, transducers or devices therefor
  • A63B2220/83—Special sensors, transducers or devices therefor characterised by the position of the sensor
  • A63B2220/833—Sensors arranged on the exercise apparatus or sports implement
• • A—HUMAN NECESSITIES
  • A63—SPORTS; GAMES; AMUSEMENTS
  • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
  • A63B2225/00—Miscellaneous features of sport apparatus, devices or equipment
  • A63B2225/50—Wireless data transmission, e.g. by radio transmitters or telemetry
• • A—HUMAN NECESSITIES
  • A63—SPORTS; GAMES; AMUSEMENTS
  • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
  • A63B2225/00—Miscellaneous features of sport apparatus, devices or equipment
  • A63B2225/50—Wireless data transmission, e.g. by radio transmitters or telemetry
  • A63B2225/54—Transponders, e.g. RFID

Definitions

• the invention concerns in general the technical field of sport equipment. More particularly, the invention concerns a ball and its manufacturing.
• the tracking may e.g. refer to a generation of additional information indicating the position of the object during a performance, such as during the game, or other parameters, such as information relating to the motion of the object, such as speed, acceleration, or anything similar.
• the electronics may refer to one or more sensors, such as a sensor suitable to generate data representing a position of the object, but also to electronics suitable e.g. to communicate in a wireless manner with one or more base stations.
• the electronics shall be integrated to the object in a reliable manner.
• the object is a ball specific to the game there is need to guarantee that the electronics is integrated in such a manner that it withstands shocks the ball experiences during the game.
• One may consider e.g. a soccer ball, a ball for American football, a volleyball, or a basketball to understand the environment the electronics integrated in the respective ball shall withstand.
• the integration of the electronics in the ball shall be performed so that it does not influence mechanical properties of the ball, and, hence, to a trajectory of the ball.
• An object of the invention is to present a ball and a manufacturing method of a ball for including electronics in the ball.
• an inflatable ball such as a soccer ball
• the inflatable ball comprising: a cover; a bladder inside the cover; an electronic module consisting of a first sub-module and at least one second sub-module electrically connected to each other with a transmission unit; wherein the electronic module is associated to the bladder at least with chemical compound.
• the chemical compound may be an epoxy based compound.
• an association of the electronic module to the bladder may be arranged by mounting the electronic module with the bladder between the bladder and the cover.
• an association of the electronic module to the bladder may be arranged with a bladder comprising a cavity for the electronic module, the cavity filled with the chemical compound at least in part.
• the electronic module may comprise a protective layer.
• the protective layer may be made of epoxy based compound.
• a manufacturing method of a ball such as a soccer ball, the ball comprising at least a cover and a bladder inside the cover, and the manufacturing method comprising: preparing an electronic module; preparing the ball for receiving the electronic module; associating the electronic module to the ball; and assembling the ball.
• a preparation of the electronic module may comprise at least: treating at least a portion of the electronic module with chemical compound forming a protective layer for the electronic module.
• a treatment of at least the portion of the electronic module may comprise applying an epoxy based compound to the electronic module.
• a preparation of the ball for receiving the electronic module may comprise at least one of: a creation of a cut to the cover for accessing a space between the cover and the bladder; or an establishment of a cavity to the bladder for creating a space for the electronic module.
• An association of the electronic module to the ball may be performed by one of: (i) inserting the electronic module to the respective space and applying fixing compound to the respective space; or (ii) applying a first portion of fixing compound to the respective space, inserting the electronic module in the respective space, and applying a second portion of the fixing compound to the respective space; or (iii) applying fixing compound to the respective space and inserting the electronic module to the respective space.
• a number of refers herein to any positive integer starting from one, e.g. to one, two, or three.
• a plurality of refers herein to any positive integer starting from two, e.g. to two, three, or four.
• Figure 1 illustrates schematically a ball, such as a soccer ball, according to an example.
• Figure 2 illustrates schematically an electronic module according to an example.
• FIGS 3A and 3B illustrate schematically further aspects of the electronic module according to some examples.
• Figure 4 illustrates schematically the ball according to another example.
• Figure 5 illustrates schematically a manufacturing method according to an example.
• FIGS 6A and 6B illustrate schematically further aspects of the manufacturing method according to some examples.
• a ball such as a soccer ball
• an electronic modular structure comprising e.g. a transmitter is associated to the ball e.g. for use in a tracking system.
• the present invention may also be used for other balls such as handballs, volley balls, rugby balls, American footballs, or basket balls.
• a different electronic device may be arranged in the ball instead of the transmitter, for example a sensor, or any other device which uses electric current for measurement purposes or for providing a signal. Since the electronics require power supply to be operative, a power source, such as a small accumulator, may be included in the electronic modular structure.
• the accumulator may be such that it may be charged in a wireless manner.
• the ball 100 may comprise an outer shell called as a cover 110 and an inner shell called as a bladder 120.
• the cover 110 may consist of a plurality of panels stitched together to cover the bladder 120.
• the material of the cover 110 may e.g. be synthetic leather, usually polyurethane or polyvinyl chloride, or genuine leather.
• the bladder 120 may be made of elastic material, such as from either natural or synthetic rubber.
• the ball 100 may be inflatable and comprise a valve 130 allowing an input of air in the ball 100.
• the electronic module 140 is associated with the bladder 120 so as to mount the electronic module 140 at least with the bladder 120 as is described in the forthcoming description.
• Figure 2 illustrates schematically an example of the electronic module 140 associate to the ball 100.
• the electronic module 140 may be implemented with two sub-modules 210, 230 coupled to each other at least with an electrical connection, but possibly also mechanically.
• the electrical connection herein refers to an implementation by means of which it is possible to transfer necessary signals and/or power between the sub-modules 210, 230.
• the electronic module 140 may be implemented so that the first submodule 210 is a printed circuit board (PCB) comprising a processing unit 212, a memory unit, one or more sensors 216, and a communication unit 218.
• the processing unit 212 may comprise a number of processors for processing data.
• the memory unit 214 may comprise a number of memories suitable to store data, such as computer program code and any other data, and wherein the stored data is accessible by the processing unit 212.
• the at least one or more sensors 216 may be selected so that they are suitable to provide information required in an analysis.
• the at least one sensor 216 may provide data suitable for determining a position of the ball during the game.
• the communication unit 210 may comprise necessary hardware and software for communicating with an external entity, such as with at least one base station, to deliver data from the ball 100 to an entity performing an analysis.
• the communication may be bidirectional e.g. for configuring the electronic module in a course of game or similar.
• the entities residing in the first sub-module 210 may be arranged to communicate e.g. over a data bus connecting the entities either directly or indirectly.
• the second sub-module 230 may comprise, according to an embodiment, at least a power supply 232 for providing power for the first sub-module 210.
• the power supply 232 may refer to an accumulator or similar. As already mentioned, in an advantageous embodiment the power supply is selected so that it is re-chargeable in a wireless manner.
• the first sub-module 210 and the second submodule 230 may be electrically connected with a transmission unit 240, such as a number of electric wires or a cable, such as a flat cable, configured to transfer e.g.
• the components may be divided between the first sub-module 210 and the second submodule 230 in a different way as depicted in Figure 2.
• the transmission unit 240 may be configured to transfer data between the first sub-module 210 and the second sub-module 230 with applicable data transmission means, such as with wires or cable or both.
• the sub-modules are communicatively connected with a data transfer unit in order to transfer data between the entities residing in the different sub-modules 210, 230.
• the modular structure implemented e.g.
• the two sub-modules 210, 230 is advantageous in a sense that it allows a thin structure of the electronic module 140 since there is no need to set the components on top of each other, but also since it allows the electronic module to follow a curved shape of the ball 100. This makes the electronic module 140 indistinguishable to the user outside the ball 100 and increases a durability of the electronic module 140 to withstand shocks experienced by the ball in use.
• the electronic module may be considered to consist of a tag and its power supply, wherein the tag may be implemented as the first sub-module described above.
• the thickness of the electronic module 140 may e.g. be few millimetres, such as 3 mm, and the area of the electronic module may e.g. be few square centimetres.
• Figures 3A and 3B illustrate schematically further aspects of the invention.
• the electronic module 140 may be covered at least in part with a protective layer 310.
• a treating of the electronic module 140 is advantageously performed prior to positioning the electronic module 140 in the ball 100.
• An applicable material for generating the protective layer 310 may e.g. be epoxy based compound.
• epoxy resin may be used for overcasting the electronic module.
• Figure 3A depicts schematically an embodiment in which both the first sub-module 210 and the second sub-module are separately treated with the compound, such as the epoxy based compound, and, hence, the protective layer 310 is separately formed to both sub-modules.
• the sub-modules 210, 230 are electrically coupled to each other with the transmission unit 240.
• Figure 3B depicts schematically another embodiment in which the electronic module 140 as a whole is treated with the compound forming the protective layer 310 to the module 140.
• a protective layer 310 covers also the transmission unit 240 which even better positions the sub-modules 210, 230 with respect to each other and also protects the transmission unit 240, and its connections to the sub-modules 210, 230 in an improved manner.
• the treating in accordance with Figure 3B may be performed so that a thickness of the transmission unit 240 with the protective layer 310 is such that it maintains a flexibility of the electronic module 140 at least at the area of the transmission unit 240 along the shape of the ball 100.
• a further embodiment may be such that only one of the sub-modules 210, 230, preferable the first sub-module 210 in the described implementation, is covered at least in part with the protective layer 310.
• the treating may be selected so that at least those areas of the sub-modules 210, 230 are treated where vulnerable components, such as the processing unit 212, reside.
• the electronic module 140 as described in the foregoing description may be integrated to the ball 100 in various methods.
• the electronic module 140 may be positioned between the cover 110 and the bladder 120.
• the installation requires an opening of the cover 110, e.g. from a seam of two panels forming the cover 110 or by performing a cut therein, and inserting the electronic module between the cover 110 and the bladder 120.
• a compound such as an epoxy based compound e.g.
• the electronic module 140 may be mounted on its position, i.e. associated at least with the bladder 120.
• the electronic module is inserted in the ball 100 during a manufacturing phase of the ball 100, there is no need to create an opening to the cover 110.
• Figure 4 illustrates schematically another way to associate the electronic module 140 with the ball 100 in accordance with the present invention
• the electronic module 140 may be inserted inside the bladder 120 to a cavity 410 arranged therein.
• the cavity 410 may be manufactured in the bladder 120 with an applicable machining method, such as performing a cut to the bladder 120, or forming the cavity 410 during a moulding phase of the bladder 120.
• the electronic module 140 consisting of at least two sub-modules 210, 230 as described in the foregoing description may be inserted in the cavity 410 of the bladder 120.
• the cavity may be filled with a compound fixing the position of the electronic module 140 in the cavity 410 as well as filling the cavity 410 in order to maintain a durability of the bladder 120 in an optimal manner.
• the compound used for the filling may be inserted either prior to inserting the electronic module 140 therein, or after the electronic module 140 is inserted therein.
• a first amount of the compound is input in the cavity 140 prior an insertion of the electronic module 140 therein and a second amount of the compound is input after the electronic module is inserted in the cavity.
• the compound corresponds to the protective layer of the electronic module 140 being e.g. epoxy based compound.
• the embodiment in which the electronic module 140 is arranged inside the bladder 120 is advantageous since the bladder material also protects the electronic module 140 but also because the bladder 120 with the electronic module 140 inside smooths the shape of the electronic module 140 when seen outside the ball 100.
• both the electronic module 140 comprising at least two sub-modules 210, 230 is prepared.
• the preparation may e.g. comprise assembling the first sub-module 210 and at least one second sub-module 230 with the transmission unit 240.
• the preparation may comprise a treatment of at least part of the electronic module 140 with a compound for establishing a protective layer 310 on it.
• the treatment may refer to a provision of an epoxy based compound over one or more predefined areas of the electronic module 140.
• the ball 100 is prepared for the next steps of the manufacturing process.
• the preparation of the ball 100 may refer to a machining of the ball 100 in a manner that allows an association of the electronic module 140 with the ball 100.
• the preparation 520 of the ball 100 may comprise a creation of an opening to a cover 110 of the ball 100 for accessing a space between the cover 110 and the bladder 120.
• the opening may e.g. be established by making a cut to the cover 110, such as to a panel forming the cover part at least in part or to a seam of two panels, in order to establish a path to a space between the cover 110 and the bladder 120 of the ball.
• the cut may be made with an applicable tool, such as with a knife tool.
• the preparation of the ball 100 may be performed during the manufacturing of the ball 100, the preparation of the ball 100 may refer to an establishment of a cavity 410 to the bladder 120 as discussed in the context of Figure 4.
• the preparation 510 of the electronic module 140 and the preparation 520 of the ball 100 may be performed consecutively to each other or concurrently at least in part.
• the electronic module 140 is associated 530 with the ball 100.
• the association of the electronic module 140 to the ball 100 may refer to an insertion of the electronic module 140 to the ball in a predefined manner.
• Figures 6A and 6B illustrate schematically at least some non-limiting examples of the association 530.
• Figure 6A it is schematically illustrated an embodiment in which the electronic module 140 is first inserted to the ball 100 i.e. between the cover 110 and the bladder 120 or inside a cavity 410 established in the bladder 120, and then fixing compound is applied to the respective space in order to fix the electronic module 140 at least with the bladder 120.
• the association 530 may be performed so that a first portion of the fixing compound is applied 630 to the respective space, i.e. in between the cover 110 and the bladder 120 or to the cavity 410.
• the electronic module 140 may be inserted 640 in the space in question, and finally a second portion of the fixing compound is applied 650 to the space in question.
• the fixing compound first in the space and then insert the electronic module 140 in the space.
• the electronic module 140 in response to the association of the electronic module 140 with the ball 100 it may be assembled 540 in a required manner.
• the cover 110 is recovered with an applicable manner, such as re-stitching the seam or gluing the opening with an applicable glue compound.
• the assembly 540 may comprise of covering the bladder 120 with the electronic module 140 with the cover 110 of the ball 100.
• a ball 100 such as a soccer ball, which is suitable to be used in tracking systems and which is suitable for the environment of use i.e. tolerating external shocks to the ball 100 during the use.

Applications Claiming Priority (2)

Publications (1)

Family

ID=77774939

Family Applications (1)

Country Status (2)

Family Cites Families (4)

• 2021
  • 2021-09-07 WO PCT/FI2021/050596 patent/WO2022053741A1/en unknown
  • 2021-09-07 EP EP21770289.3A patent/EP4210841A1/de active Pending

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