EP4152377A3 - A method of fitting a cooling device to a circuit boardand a circuit board cooling device - Google Patents
A method of fitting a cooling device to a circuit boardand a circuit board cooling device Download PDFInfo
- Publication number
- EP4152377A3 EP4152377A3 EP22196124.6A EP22196124A EP4152377A3 EP 4152377 A3 EP4152377 A3 EP 4152377A3 EP 22196124 A EP22196124 A EP 22196124A EP 4152377 A3 EP4152377 A3 EP 4152377A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- cooling device
- circuit board
- cooling
- fitting
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title abstract 11
- 238000000034 method Methods 0.000 title abstract 3
- 125000006850 spacer group Chemical group 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2113332.7A GB2611028A (en) | 2021-09-17 | 2021-09-17 | A method of fitting a cooling device to a circuit board and a circuit board cooling device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4152377A2 EP4152377A2 (en) | 2023-03-22 |
EP4152377A3 true EP4152377A3 (en) | 2023-04-05 |
Family
ID=78333022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP22196124.6A Pending EP4152377A3 (en) | 2021-09-17 | 2022-09-16 | A method of fitting a cooling device to a circuit boardand a circuit board cooling device |
Country Status (4)
Country | Link |
---|---|
US (1) | US12069795B2 (en) |
EP (1) | EP4152377A3 (en) |
CN (1) | CN115835494A (en) |
GB (1) | GB2611028A (en) |
Citations (7)
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US5548482A (en) * | 1994-08-26 | 1996-08-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit apparatus including clamped heat sink |
US6035524A (en) * | 1995-02-21 | 2000-03-14 | Thomson-Csf | Method for fabricating an electronics board with thermal-conduction cooling |
US20090021918A1 (en) * | 2006-08-31 | 2009-01-22 | Adlink Technology Inc. | Stacked heat-transfer interface structure |
US20110149537A1 (en) * | 2009-12-22 | 2011-06-23 | Shinko Electric Industries Co., Ltd. | Heat-radiating component and electronic component device |
EP2361005A1 (en) * | 2008-12-12 | 2011-08-24 | Murata Manufacturing Co. Ltd. | Circuit module |
EP2884530A2 (en) * | 2013-12-13 | 2015-06-17 | Huawei Technologies Co., Ltd. | Heat sink and heat dissipation system |
US20160233141A1 (en) * | 2015-02-09 | 2016-08-11 | J-Devices Corporation | Semiconductor device |
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US4029999A (en) | 1975-04-10 | 1977-06-14 | Ibm Corporation | Thermally conducting elastomeric device |
US4920574A (en) | 1985-10-04 | 1990-04-24 | Fujitsu Limited | Cooling system for an electronic circuit device |
US4879629A (en) | 1988-10-31 | 1989-11-07 | Unisys Corporation | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation |
US5001548A (en) | 1989-03-13 | 1991-03-19 | Coriolis Corporation | Multi-chip module cooling |
DE4326207A1 (en) | 1992-10-06 | 1994-04-07 | Hewlett Packard Co | Mechanically floating multi-chip substrate |
AT404532B (en) | 1996-02-13 | 1998-12-28 | Electrovac | HEAT SINK FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
US6111749A (en) | 1996-09-25 | 2000-08-29 | International Business Machines Corporation | Flexible cold plate having a one-piece coolant conduit and method employing same |
US5926371A (en) * | 1997-04-25 | 1999-07-20 | Advanced Micro Devices, Inc. | Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device |
US6043981A (en) | 1997-11-13 | 2000-03-28 | Chrysler Corporation | Heat sink assembly for electrical components |
GB2358243B (en) | 1999-11-24 | 2004-03-31 | 3Com Corp | Thermally conductive moulded heat sink |
US6215667B1 (en) * | 1999-12-13 | 2001-04-10 | Motorola Inc. | Mounting system and method |
US6212074B1 (en) * | 2000-01-31 | 2001-04-03 | Sun Microsystems, Inc. | Apparatus for dissipating heat from a circuit board having a multilevel surface |
US6853554B2 (en) | 2001-02-22 | 2005-02-08 | Hewlett-Packard Development Company, L.P. | Thermal connection layer |
US6665184B2 (en) | 2001-07-13 | 2003-12-16 | Lytron, Inc. | Tapered cold plate |
US7385821B1 (en) | 2001-12-06 | 2008-06-10 | Apple Inc. | Cooling method for ICS |
US6972958B2 (en) | 2003-03-10 | 2005-12-06 | Hewlett-Packard Development Company, L.P. | Multiple integrated circuit package module |
US6850411B1 (en) | 2003-10-07 | 2005-02-01 | International Business Machines Corporation | Method and structure to support heat sink arrangement on chip carrier packages |
US6979899B2 (en) * | 2003-12-31 | 2005-12-27 | Texas Instruments Incorported | System and method for high performance heat sink for multiple chip devices |
US7325588B2 (en) | 2004-04-29 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | High serviceability liquid cooling loop using flexible bellows |
US7283364B2 (en) | 2004-11-29 | 2007-10-16 | Ati Technologies Inc. | Thermal management apparatus |
US7286371B2 (en) * | 2005-03-24 | 2007-10-23 | Intel Corporation | Attaching heat sinks to printed circuit boards using preloaded spring assemblies |
US7298617B2 (en) | 2005-10-25 | 2007-11-20 | International Business Machines Corporation | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled |
EP1949438A4 (en) * | 2005-11-11 | 2010-02-17 | Ericsson Telefon Ab L M | Cooling assembly |
US7212409B1 (en) | 2005-12-05 | 2007-05-01 | Hewlett-Packard Development Company, L.P. | Cam actuated cold plate |
US20070177356A1 (en) * | 2006-02-01 | 2007-08-02 | Jeffrey Panek | Three-dimensional cold plate and method of manufacturing same |
US7995344B2 (en) * | 2007-01-09 | 2011-08-09 | Lockheed Martin Corporation | High performance large tolerance heat sink |
US20090213541A1 (en) | 2008-02-27 | 2009-08-27 | Matthew Allen Butterbaugh | Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same |
DE112008004257T5 (en) | 2008-12-29 | 2013-05-29 | Hewlett-Packard Development Company, L.P. | SYSTEMS AND METHOD OF CARRIER DEVICE FOR PLACING THERMAL INTERFACE MATERIALS |
US8202765B2 (en) * | 2009-01-22 | 2012-06-19 | International Business Machines Corporation | Achieving mechanical and thermal stability in a multi-chip package |
JP2010176909A (en) * | 2009-01-27 | 2010-08-12 | Panasonic Electric Works Co Ltd | Discharge lamp lighting device, and illumination fixture |
GB0922077D0 (en) | 2009-12-17 | 2010-02-03 | Quixant Ltd | Electronic assembly and casing thereof |
US8451600B1 (en) | 2010-03-04 | 2013-05-28 | Amazon Technologies, Inc. | Heat spreading chassis for rack-mounted computer system |
US8363413B2 (en) | 2010-09-13 | 2013-01-29 | Raytheon Company | Assembly to provide thermal cooling |
US8432691B2 (en) | 2010-10-28 | 2013-04-30 | Asetek A/S | Liquid cooling system for an electronic system |
US8966747B2 (en) | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
US9036353B2 (en) | 2012-11-26 | 2015-05-19 | Northrop Grumman Systems Corporation | Flexible thermal interface for electronics |
FR3002410B1 (en) | 2013-02-20 | 2016-06-03 | Bull Sas | ELECTRONIC CARD COMPRISING A LIQUID COOLING SYSTEM |
US9310859B2 (en) | 2013-11-12 | 2016-04-12 | International Business Machines Corporation | Liquid cooling of multiple components on a circuit board |
ITVI20130273A1 (en) | 2013-11-14 | 2015-05-15 | Eurotech S P A | ELECTRONIC BOARD FOR REFRIGERATED SUPERCALCOLO AND PROCEDURE FOR PRODURLA |
US9331058B2 (en) | 2013-12-05 | 2016-05-03 | Apple Inc. | Package with SoC and integrated memory |
CN107112292B (en) * | 2015-01-28 | 2021-04-27 | 惠普发展公司,有限责任合伙企业 | Inserter device |
WO2016144007A1 (en) | 2015-03-10 | 2016-09-15 | 한온시스템 주식회사 | Heat exchanger for cooling electrical element |
US10215504B2 (en) | 2015-04-06 | 2019-02-26 | International Business Machines Corporation | Flexible cold plate with enhanced flexibility |
US10061363B2 (en) * | 2015-09-04 | 2018-08-28 | Apple Inc. | Combination parallel path heatsink and EMI shield |
US10293372B2 (en) | 2015-09-18 | 2019-05-21 | International Business Machines Corporation | Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor |
US10631438B2 (en) | 2017-12-23 | 2020-04-21 | International Business Machines Corporation | Mechanically flexible cold plates for low power components |
US10712102B2 (en) | 2017-12-29 | 2020-07-14 | International Business Machines Corporation | Injection-molded flexible cold plate |
US10978313B2 (en) | 2018-02-20 | 2021-04-13 | International Business Machines Corporation | Fixture facilitating heat sink fabrication |
US10342119B1 (en) | 2018-03-27 | 2019-07-02 | Nio Usa, Inc. | Thermal spring frame and shield for sealed processing systems |
US20200024763A1 (en) | 2018-07-23 | 2020-01-23 | Microsoft Technology Licensing, Llc | Electroform vapor chamber integrated thermal module into pcb layout design |
DE102018120118A1 (en) | 2018-08-17 | 2020-02-20 | Carl Freudenberg Kg | contraption |
EP3684154B1 (en) | 2019-01-21 | 2024-03-06 | Aptiv Technologies Limited | Thermally conductive insert element for electronic unit |
EP3686536B1 (en) | 2019-01-22 | 2021-05-26 | ABB Power Grids Switzerland AG | Evaporator and manufacturing method |
US11058030B2 (en) | 2019-04-22 | 2021-07-06 | International Business Machines Corporation | Cold plate with flex regions between fin areas |
GB2584991B (en) | 2019-05-21 | 2022-01-26 | Iceotope Group Ltd | Cold plate |
JP2022533426A (en) | 2019-05-21 | 2022-07-22 | アイスオトープ・グループ・リミテッド | electronic module cooling system |
JP2021174847A (en) * | 2020-04-23 | 2021-11-01 | 株式会社デンソー | Electronic device |
EP3923689B1 (en) | 2020-06-12 | 2024-04-24 | Aptiv Technologies AG | Cooling device and its manufacturing method |
EP3955716B1 (en) | 2020-08-13 | 2024-07-31 | Aptiv Technologies AG | Cooling device and method of manufacturing the same |
EP4025024A1 (en) | 2021-01-04 | 2022-07-06 | Aptiv Technologies Limited | Cooling device and method of manufacturing the same |
JP2022178926A (en) * | 2021-05-21 | 2022-12-02 | 株式会社デンソーテン | Heat sink structure for acoustic equipment |
-
2021
- 2021-09-17 GB GB2113332.7A patent/GB2611028A/en not_active Withdrawn
-
2022
- 2022-09-15 US US17/932,564 patent/US12069795B2/en active Active
- 2022-09-16 CN CN202211126068.5A patent/CN115835494A/en active Pending
- 2022-09-16 EP EP22196124.6A patent/EP4152377A3/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5548482A (en) * | 1994-08-26 | 1996-08-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit apparatus including clamped heat sink |
US6035524A (en) * | 1995-02-21 | 2000-03-14 | Thomson-Csf | Method for fabricating an electronics board with thermal-conduction cooling |
US20090021918A1 (en) * | 2006-08-31 | 2009-01-22 | Adlink Technology Inc. | Stacked heat-transfer interface structure |
EP2361005A1 (en) * | 2008-12-12 | 2011-08-24 | Murata Manufacturing Co. Ltd. | Circuit module |
US20110149537A1 (en) * | 2009-12-22 | 2011-06-23 | Shinko Electric Industries Co., Ltd. | Heat-radiating component and electronic component device |
EP2884530A2 (en) * | 2013-12-13 | 2015-06-17 | Huawei Technologies Co., Ltd. | Heat sink and heat dissipation system |
US20160233141A1 (en) * | 2015-02-09 | 2016-08-11 | J-Devices Corporation | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN115835494A (en) | 2023-03-21 |
US12069795B2 (en) | 2024-08-20 |
GB2611028A (en) | 2023-03-29 |
EP4152377A2 (en) | 2023-03-22 |
US20230090833A1 (en) | 2023-03-23 |
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Legal Events
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Ipc: H01L 23/40 20060101ALI20230228BHEP Ipc: H01L 23/367 20060101AFI20230228BHEP |
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17P | Request for examination filed |
Effective date: 20230825 |
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RBV | Designated contracting states (corrected) |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: APTIV TECHNOLOGIES AG |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: APTIV TECHNOLOGIES AG |