EP4152377A3 - A method of fitting a cooling device to a circuit boardand a circuit board cooling device - Google Patents

A method of fitting a cooling device to a circuit boardand a circuit board cooling device Download PDF

Info

Publication number
EP4152377A3
EP4152377A3 EP22196124.6A EP22196124A EP4152377A3 EP 4152377 A3 EP4152377 A3 EP 4152377A3 EP 22196124 A EP22196124 A EP 22196124A EP 4152377 A3 EP4152377 A3 EP 4152377A3
Authority
EP
European Patent Office
Prior art keywords
cooling device
circuit board
cooling
fitting
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22196124.6A
Other languages
German (de)
French (fr)
Other versions
EP4152377A2 (en
Inventor
Frank Adam
Falk Rademacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aptiv Technologies AG
Original Assignee
Aptiv Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aptiv Technologies Ltd filed Critical Aptiv Technologies Ltd
Publication of EP4152377A2 publication Critical patent/EP4152377A2/en
Publication of EP4152377A3 publication Critical patent/EP4152377A3/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A method of fitting a cooling device 2 to a circuit board 3 is described for cooling a high-power electronic component 4 mounted on the circuit board. A cooling arrangement is also described.
The method provides the cooling device with a cooling surface 17D having a cooling area for thermally connecting to a to be cooled surface 7 of the electronic component. Fixing elements 20 are provided for moving the cooling surface towards the circuit board. A distance position d of the to be cooled surface from the circuit board is determined and on this basis spacer elements 22 are selected to be interposed between the cooling device and the circuit board to limit the movement by the fixing elements to a position where the cooling area is in close proximity to the to be cooled surface 7.
EP22196124.6A 2021-09-17 2022-09-16 A method of fitting a cooling device to a circuit boardand a circuit board cooling device Pending EP4152377A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2113332.7A GB2611028A (en) 2021-09-17 2021-09-17 A method of fitting a cooling device to a circuit board and a circuit board cooling device

Publications (2)

Publication Number Publication Date
EP4152377A2 EP4152377A2 (en) 2023-03-22
EP4152377A3 true EP4152377A3 (en) 2023-04-05

Family

ID=78333022

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22196124.6A Pending EP4152377A3 (en) 2021-09-17 2022-09-16 A method of fitting a cooling device to a circuit boardand a circuit board cooling device

Country Status (4)

Country Link
US (1) US12069795B2 (en)
EP (1) EP4152377A3 (en)
CN (1) CN115835494A (en)
GB (1) GB2611028A (en)

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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5548482A (en) * 1994-08-26 1996-08-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit apparatus including clamped heat sink
US6035524A (en) * 1995-02-21 2000-03-14 Thomson-Csf Method for fabricating an electronics board with thermal-conduction cooling
US20090021918A1 (en) * 2006-08-31 2009-01-22 Adlink Technology Inc. Stacked heat-transfer interface structure
EP2361005A1 (en) * 2008-12-12 2011-08-24 Murata Manufacturing Co. Ltd. Circuit module
US20110149537A1 (en) * 2009-12-22 2011-06-23 Shinko Electric Industries Co., Ltd. Heat-radiating component and electronic component device
EP2884530A2 (en) * 2013-12-13 2015-06-17 Huawei Technologies Co., Ltd. Heat sink and heat dissipation system
US20160233141A1 (en) * 2015-02-09 2016-08-11 J-Devices Corporation Semiconductor device

Also Published As

Publication number Publication date
CN115835494A (en) 2023-03-21
US12069795B2 (en) 2024-08-20
GB2611028A (en) 2023-03-29
EP4152377A2 (en) 2023-03-22
US20230090833A1 (en) 2023-03-23

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