EP4150679A4 - Light-emitting device with configurable spatial distribution of emission intensity - Google Patents

Light-emitting device with configurable spatial distribution of emission intensity

Info

Publication number
EP4150679A4
EP4150679A4 EP21803213.4A EP21803213A EP4150679A4 EP 4150679 A4 EP4150679 A4 EP 4150679A4 EP 21803213 A EP21803213 A EP 21803213A EP 4150679 A4 EP4150679 A4 EP 4150679A4
Authority
EP
European Patent Office
Prior art keywords
light
emitting device
emission intensity
spatial distribution
configurable spatial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21803213.4A
Other languages
German (de)
French (fr)
Other versions
EP4150679A1 (en
Inventor
Toni Lopez
Floris Crompvoets
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds LLC
Original Assignee
Lumileds LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/875,237 external-priority patent/US11462666B2/en
Priority claimed from US17/142,960 external-priority patent/US11563148B2/en
Application filed by Lumileds LLC filed Critical Lumileds LLC
Publication of EP4150679A1 publication Critical patent/EP4150679A1/en
Publication of EP4150679A4 publication Critical patent/EP4150679A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/155—Coordinated control of two or more light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
EP21803213.4A 2020-05-15 2021-05-13 Light-emitting device with configurable spatial distribution of emission intensity Pending EP4150679A4 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16/875,237 US11462666B2 (en) 2020-05-15 2020-05-15 Light-emitting device with configurable spatial distribution of emission intensity
EP20180007 2020-06-15
US17/142,960 US11563148B2 (en) 2020-05-15 2021-01-06 Light-emitting device with configurable spatial distribution of emission intensity
PCT/US2021/032312 WO2021231772A1 (en) 2020-05-15 2021-05-13 Light-emitting device with configurable spatial distribution of emission intensity

Publications (2)

Publication Number Publication Date
EP4150679A1 EP4150679A1 (en) 2023-03-22
EP4150679A4 true EP4150679A4 (en) 2024-03-06

Family

ID=78524952

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21803213.4A Pending EP4150679A4 (en) 2020-05-15 2021-05-13 Light-emitting device with configurable spatial distribution of emission intensity

Country Status (5)

Country Link
EP (1) EP4150679A4 (en)
JP (1) JP2023524892A (en)
KR (1) KR102581156B1 (en)
CN (1) CN115868034B (en)
WO (1) WO2021231772A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014105403A1 (en) * 2012-12-31 2014-07-03 Invensas Corporation High performance light emitting diode
WO2016079505A1 (en) * 2014-11-18 2016-05-26 Mled Limited Integrated colour led micro-display
US9412907B1 (en) * 2015-04-17 2016-08-09 Cree, Inc. Graded vias for LED chip P- and N- contacts
EP3182451A1 (en) * 2015-12-15 2017-06-21 Stanley Electric Co., Ltd. Semiconductor light-emitting element array and lighting device for vehicles
US20170210277A1 (en) * 2016-01-22 2017-07-27 Stanley Electric Co., Ltd. Semiconductor light-emitting device, lighting apparatus, and lighting unit for vehicles

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TW200917190A (en) * 2007-10-05 2009-04-16 Nat Univ Chung Cheng LED driver with color field sequential and area control method
US7671542B2 (en) * 2007-11-07 2010-03-02 Au Optronics Corporation Color control of multi-zone LED backlight
EP2332185A2 (en) * 2008-09-08 2011-06-15 3M Innovative Properties Company Electrically pixelated luminescent device
DE102008054218A1 (en) * 2008-10-31 2010-05-06 Osram Opto Semiconductors Gmbh LED chip
KR20110085726A (en) * 2010-01-21 2011-07-27 삼성엘이디 주식회사 Semiconductor light emitting device and manufacturing method of the same
DE102010014177A1 (en) * 2010-04-01 2011-10-06 Jenoptik Polymer Systems Gmbh Surface emitting semiconductor light emitting diode
JP5572038B2 (en) * 2010-08-27 2014-08-13 スタンレー電気株式会社 Semiconductor light emitting device and vehicular lamp using the same
US8664684B2 (en) * 2010-08-31 2014-03-04 Micron Technology, Inc. Solid state lighting devices with improved contacts and associated methods of manufacturing
EP2442374B1 (en) * 2010-10-12 2016-09-21 LG Innotek Co., Ltd. Light emitting device
DE102011056888A1 (en) * 2011-12-22 2013-06-27 Osram Opto Semiconductors Gmbh Display device and method for producing a display device
US9155146B2 (en) * 2012-09-07 2015-10-06 Samsung Electronics Co., Ltd. Light source apparatus and light emitting diode package
DE102013102667A1 (en) * 2013-03-15 2014-10-02 Osram Opto Semiconductors Gmbh display device
KR102222861B1 (en) * 2013-07-18 2021-03-04 루미리즈 홀딩 비.브이. Highly reflective flip chip led die
KR101494331B1 (en) * 2013-12-11 2015-02-23 한국광기술원 Flip chip type nitride semiconductor light emitting device
KR102199991B1 (en) * 2014-05-28 2021-01-11 엘지이노텍 주식회사 Light emitting device and light unit having the same
DE102014108300B4 (en) * 2014-06-12 2022-02-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor components
KR20160113892A (en) * 2015-03-23 2016-10-04 삼성전자주식회사 Method of light emitting diode(LED) package
KR102382886B1 (en) * 2015-05-26 2022-04-05 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device
KR102388284B1 (en) * 2015-05-26 2022-04-19 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device
DE102015108545A1 (en) * 2015-05-29 2016-12-01 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
WO2017119743A1 (en) * 2016-01-05 2017-07-13 주식회사 세미콘라이트 Semiconductor light-emitting element
JP6990529B2 (en) * 2017-05-25 2022-01-12 スタンレー電気株式会社 Semiconductor light emitting elements, semiconductor light emitting element arrays, semiconductor light emitting devices, and vehicle lamps
EP3659188B1 (en) * 2017-07-25 2022-10-19 Lumentum Operations LLC A single-chip series connected vcsel array
FR3087942B1 (en) * 2018-10-29 2021-09-17 Commissariat Energie Atomique MULTI-COLOR ELECTROLUMINESCENT DISPLAY DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE
US11626448B2 (en) * 2019-03-29 2023-04-11 Lumileds Llc Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014105403A1 (en) * 2012-12-31 2014-07-03 Invensas Corporation High performance light emitting diode
WO2016079505A1 (en) * 2014-11-18 2016-05-26 Mled Limited Integrated colour led micro-display
US9412907B1 (en) * 2015-04-17 2016-08-09 Cree, Inc. Graded vias for LED chip P- and N- contacts
EP3182451A1 (en) * 2015-12-15 2017-06-21 Stanley Electric Co., Ltd. Semiconductor light-emitting element array and lighting device for vehicles
US20170210277A1 (en) * 2016-01-22 2017-07-27 Stanley Electric Co., Ltd. Semiconductor light-emitting device, lighting apparatus, and lighting unit for vehicles

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021231772A1 *

Also Published As

Publication number Publication date
CN115868034A (en) 2023-03-28
KR20230003632A (en) 2023-01-06
JP2023524892A (en) 2023-06-13
CN115868034B (en) 2024-03-29
EP4150679A1 (en) 2023-03-22
WO2021231772A1 (en) 2021-11-18
KR102581156B1 (en) 2023-09-21

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