EP4130694B1 - Temperatursensoranordnung - Google Patents

Temperatursensoranordnung

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Publication number
EP4130694B1
EP4130694B1 EP21189173.4A EP21189173A EP4130694B1 EP 4130694 B1 EP4130694 B1 EP 4130694B1 EP 21189173 A EP21189173 A EP 21189173A EP 4130694 B1 EP4130694 B1 EP 4130694B1
Authority
EP
European Patent Office
Prior art keywords
temperature sensor
thermal
conduction path
branched
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP21189173.4A
Other languages
English (en)
French (fr)
Other versions
EP4130694A1 (de
Inventor
Joerg Gebhardt
Patric ACKERMANN
Subhashish Dasgupta
Wilhelm Daake
Karsten Schroeder
Guruprasad Sosale
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Schweiz AG
Original Assignee
ABB Schweiz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Schweiz AG filed Critical ABB Schweiz AG
Priority to EP21189173.4A priority Critical patent/EP4130694B1/de
Priority to CN202210905055.1A priority patent/CN115701529A/zh
Priority to US17/878,143 priority patent/US12442693B2/en
Publication of EP4130694A1 publication Critical patent/EP4130694A1/de
Application granted granted Critical
Publication of EP4130694B1 publication Critical patent/EP4130694B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00—Thermometers giving results other than momentary value of temperature
    • G01K3/08—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values
    • G01K3/14—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values in respect of space
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/427—Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation

Definitions

  • the present invention relates generally to temperature measuring assemblies for use with industrial processes.
  • this invention relates to temperature measurement assemblies for non-intrusive process temperature measurements.
  • Determination of temperatures are vital for safe running of facilities, as being one of the main control parameters for process control. Ensuring that temperature measurements of process media are accurate and repeatable is critical.
  • For determination of a temperature of a medium within a vessel typically surface temperature sensors are placed at a surface of a wall of the vessel in order to measure the temperature of this surface, and respectively determine the temperature of the medium at the other side of the wall.
  • the problem to be solved here is related to an accurate, reliable and fast responding surface temperature measurement by contact thermometry.
  • Reference document WO 2015/099933 A1 relates to temperature measurement assemblies for non-intrusive process temperature measurement.
  • Such non-intrusive industrial process temperature measurement assemblies may be used to measure a temperature of a process fluid within a vessel without the need to penetrate a process vessel wall at the surface of the vessel wall.
  • Such an assembly may include a temperature sensor and a structure adapted to position a temperature sensing probe tip of the temperature sensor on an exterior surface of the vessel wall.
  • the vessel wall temperature will also change.
  • the vessel wall temperature will also change in response to ambient conditions, such as sunlight, wind, or rain. Insulation around the probe tip provides some shielding of the exterior surface from changes in ambient conditions. However, to the extent the insulation is less than ideal, the accuracy of non-intrusive process temperature measurements is impaired.
  • measurements assemblies including a temperature measurement sensor and a reference temperature sensor can be used, which are in an at least slightly different thermal contact to the surface.
  • the temperature measurement sensor is usually distinguished by the property that its thermal coupling to the surface is chosen to be stronger, that means with lower thermal resistance, than for the one or several reference temperature sensors.
  • the present invention is related to a temperature sensor assembly according to claim 1 configured to be coupled thermally to a vessel wall for determining a temperature of a surface of the vessel wall, a method according to claim 11 for determining a medium temperature, and a use of the temperature sensor assembly according to claim 13.
  • a temperature sensor assembly configured to be coupled thermally to a vessel wall for determining a temperature of a surface of the vessel wall, wherein the assembly includes a first single-branched thermal conduction path, between the surface of the vessel wall and an environment of the temperature sensor assembly, with a temperature measurement sensor, configured to be thermally coupled to a first site of the surface of the vessel wall resulting in a first thermal resistance, and a second single-branched thermal conduction path, between a second site of the surface of the vessel wall and an environment of the temperature sensor assembly, comprising a reference temperature sensor, configured to be thermally coupled to the surface of the vessel wall resulting in a second thermal resistance, and wherein the first single-branched thermal conduction path and/or the second single-branched thermal conduction path are insulated by a low thermal conducting material to reduce a thermal coupling between the first single-branched thermal conduction path and the second single-branched thermal con
  • the thermal resistance Ru and/or Ru_ref also include the conductive, convective and radiative resistance between the outer surface of the standard thermometer rod and/or neck tube and ambient air.
  • Such mechanical bridges can be made of materials with low thermal conductivity, not too different from air: foams of several materials, e.g. polymers, glass etc. Part of the neck tube and adapter structures may be filled with such materials.
  • More than one temperature measurement sensor and/or more than one reference temperature sensor can be placed within each single-branched thermal conduction path for compensation, and more than two thermal paths can be built e.g. for redundancy.
  • f(T1,T2,T_amb) can be a freely definable, e.g. non-linear, function, which can be determined to be zero.
  • T1 is a temperature value determined by using the temperature measurement sensor and T2 is a temperature value determined by using the reference temperature sensor and T_amb is an ambient temperature value.
  • the medium can be any fluid including a liquid and/or gas and/or a bulk material or any mixture of these like aerosols and multi-phase flows.
  • the model-based calculation can be performed by a software tool that determines the medium temperature based on the outer surface temperature of the vessel wall determined by the non-invasive temperature sensor assembly.
  • the determination of the temperature can be done accordingly to the method as disclosed in the patent application WO2019063519 A1 .
  • this temperature sensor assembly for determining of process temperatures can cost-effectively enhance the confidence of temperature measurement readings as used in the process industry and may improve the process quality.
  • thermometry An accurate, reliable, stable and quickly responsive surface temperature measurement by contact thermometry is provided by the at least two thermally insulated single-branched thermal conduction paths respectively for the temperature measurement sensor and the at least one reference measurement sensor thermally coupled to the surface of the vessel differently using the temperature sensor assembly.
  • the measurement sensor and the reference sensor are not positioned within one single thermal path, but are accordingly positioned individually within two different thermal paths, which are thermally decoupled.
  • the first thermal path and the second thermal path are different.
  • a thermal coupling between the reference temperature sensor and the first single-branched thermal conduction path is smaller than a thermal coupling between the reference sensor and the measurement sensor, if the temperature sensor assembly is mechanically coupled to the wall of the vessel.
  • the temperature sensor assembly is configured such that the thermal coupling between the reference sensor and the measurement sensor is dominated by thermal conduction path between the tip of the first single-branched thermal conduction path and the tip of the second single-branched thermal conduction path, which are in physical contact to the surface of the vessel wall and/or that a thermal coupling between the reference sensor and the first single-branched thermal conduction path is so small, that in practice it can be neglected in respect to the thermal coupling via the surface of the vessel wall, if the temperature sensor assembly is mechanically coupled to the surface of the vessel wall for determining the temperature of the surface of the vessel wall.
  • the thermal coupling between the reference temperature sensor and the temperature measurement sensor is dominated by a series connection of the first thermal resistance and a part of the vessel wall, coupled to the first and second single-branched thermal conduction path, and the second thermal resistance, if the temperature sensor assembly is mechanically coupled to the wall of the vessel.
  • At least the first thermal path is insulated in such a way that the coupling of the reference temperature sensor to the first thermal path is smaller than the coupling of the reference temperature sensor to the measurement sensor via the surface of the vessel wall.
  • the shortest thermal path between the temperature measurement sensor and the reference temperature sensor can be defined by a serial thermal connection of the first thermal resistance and the second thermal resistance and the thermal resistance between the sides, where the tip of the first single-branched thermal conduction path and the tip of the second single-branched thermal conduction path contact the surface of the vessel wall.
  • the first temperature sensor and the second temperature sensor are mainly coupled by the first thermal resistance and the second thermal resistance, wherein the thermal coupling of the first thermal resistance with the second thermal resistance is provided by the surface of the vessel wall.
  • a thermal coupling between an example reference temperature sensor and an example temperature measurement sensor is performed for illustration of the related thermal coupling:
  • a thermal coupling between the two single-branched thermal conduction paths is calculated by an simplified example of the thermal coupling between two thermometer rods, which include the temperature measurement sensors:
  • the temperature of the wall of the pipe is assumed to be identical at the two close adjacent sites or somewhat distanced sites, where the first single-branched thermal conduction path is thermally coupled to the wall of the pipe and the second single-branched thermal conduction path is thermally coupled to the wall of the pipe.
  • a good thermal coupling of the fluid within the pipe with the pipe wall and the thermal conductivity of the pipe wall, which can be made by metal, and/or a turbulent advective state of the fluid inside of the pipe, in the sense that it provides almost a perfect thermal boundary condition on the inner side of the wall.
  • the thermal resistance of the related part of the pipe wall is, therefore, essentially independent from the lateral distance of the first and single-branched thermal conduction paths touching points at the vessel surface.
  • a pipe wall made from plastics, which is less thermally conductive than stainless steel can also be used for determining a temperature of a surface of the vessel wall using the described temperature sensor assembly.
  • a diameter of a 20cm length-thermometer rod is assumed to be 3 mm.
  • a resulting thermal coupling conductivity C_betweenPaths of the thermometer rods via a gap distance d filled with non-convective air can be calculated to be:
  • the first single-branched thermal conduction path and/or the second single-branched thermal conduction path are insulated by a low thermal conducting material to reduce a thermal coupling between the first single-branched thermal conduction path and the second single-branched thermal conduction path.
  • a low thermal conducting material includes thermal insulation material and/or gases.
  • the first single-branched thermal conduction path and/or the second single-branched thermal conduction path are/is mounted inside a neck tube to reduce the thermal coupling between the first single-branched thermal conduction path and the second single-branched thermal conduction path; and/or to reduce a thermal coupling of the first single-branched thermal conduction path and/or the second single-branched thermal conduction path to an environment of the temperature sensor assembly.
  • Thermal decoupling of the first single-branched thermal conduction path and the second single-branched thermal conduction path can improve the determination of the surface temperature of the vessel wall by use of the temperature sensor assembly.
  • the single-branched thermal conduction path or the second single-branched thermal conduction path is mounted inside a second tube, wherein the second tube is mounted essentially concentrically inside of the neck tube; and preferably the second tube is evacuated to reduce the thermal coupling between the first single-branched thermal conduction path and the second single-branched thermal conduction path.
  • the temperature sensor assembly can include an inner and an outer cylinder, i.e the second tube and the neck tube respectively, wherein preferably the measurement sensor is mounted in the annular space of the neck tube between the second tube and the neck tube.
  • the reference sensor can be mounted inside of the second tube, wherein either the annular space or the inner cylindrical space or both are evacuated or thermally insulated in a different form. Alternatively the reference sensor is mounted in the annular space of the neck tube and the measurement sensor is mounted inside of the second tube.
  • This can improve the thermal insulation between the first single-branched thermal conduction path and the second single-branched thermal conduction path.
  • the first single-branched thermal conduction path and/or the second single-branched thermal conduction path is configured to spring load a surface contact of the first single-branched thermal contact path and/or the second single-branched thermal conduction path with the surface of the vessel wall.
  • Spring loading the surface contact advantageously enable to adapt the thermal coupling of the respective single-branched thermal conduction path to specific needs, and particularly to improve the thermal coupling.
  • the temperature measurement sensor is thermally coupled to the surface of the wall of the vessel by a plug comprising a first means for thermal coupling the measurement sensor to the surface of the wall of the vessel comprising highly thermal conducting material for improving the thermal coupling between the measurement sensor and the surface of the wall of the vessel, and wherein the first means is placed between the measurement sensor and the surface of the wall of the vessel.
  • the reference temperature sensor is coupled to the surface of the wall of the vessel by a spatial gap and/or by a second means for thermal coupling the reference sensor to the surface of the wall of the vessel comprising a low thermal conductive material for thermal at least partially decoupling the reference sensor to the surface of the wall of the vessel, and wherein the second means is located between the reference temperature sensor and the surface of the wall of the vessel.
  • Such a spatial gap can couple the reference temperature sensor to the surface of the wall of the vessel without mechanical contact to define the thermal contact resistance R0_ref.
  • a second means for thermal coupling can be located at a tip at the second single-branched thermal conduction path, as e.g. a thermometer rod and/or a tube including the reference sensor, made from nickel (Ni) or stainless steel.
  • the second means can include various fillings/ pottings around the sensing element of the reference sensor inside of the thermometer rod and/or the tube, like e.g. aluminium oxide and/or air.
  • the temperature sensor assembly includes at least one further reference sensor. Using further reference sensors can improve the determination of the surface temperature of the wall of the vessel.
  • Signals from further reference sensors can be used for averaging or other statistical analysis and signal processing.
  • the temperature measurement sensor and/or the reference temperature sensor comprises a resistance thermometer and/or a thermocouple.
  • Such resistance thermometer can be a PTC-thermistor and/or a PTC-resistor.
  • the temperature measurement sensor and/or the reference temperature sensor can include any means to determine a temperature of the surface of the vessel.
  • a method for determining a temperature of a medium via a temperature of a measuring point on a surface enclosing the medium which includes a temperature sensor assembly as described above, as well as an analysing device for determining the medium temperature of the vessel wall, which is electrically connected to the temperature sensor assembly, wherein at least one reference sensor of the temperature sensor assembly is used to determine a temperature gradient along a first thermal connection path between a surface enclosing the medium and an environment of the temperature sensor assembly and wherein by means of the temperature gradient along the first thermal connection path a correction value for correcting a measured value of at least one measuring sensor of the temperature sensor assembly is determined.
  • a measurement system for determining a temperature of the surface of the vessel wall including a temperature sensor assembly as described above and an analysing device for determining the surface temperature of the vessel wall, wherein the temperature sensor assembly is electrically connected to the analysing device.
  • a use of the temperature sensor assembly as described above is proposed for determining a surface temperature of a wall of a vessel.
  • Figure 1 sketches schematically the thermal resistance R0 102 between the temperature measurement sensor 103 and a first surface site of the vessel wall 101 as well as a thermal resistance Ru 104 between the temperature measurement sensor 103 and the ambient 105 of the first single-branched thermal conduction path 100.
  • Figure 1 also sketches schematically the thermal resistance R0_ref 112 between the reference temperature sensor 113 and a second surface site of the vessel wall 111 as well as the thermal resistance Ru_ref 114 between the reference temperature sensor 113 and the ambient 115 of the second single-branched thermal conduction path 110.
  • FIG. 2 sketches schematically a temperature sensor assembly 200 including a first single-branched thermal conduction path 100 and the second single-branched thermal conduction path 110.
  • the two conduction paths 100, 110 are arranged within a neck tube 250, which is filled with insulation material 240 for thermally decoupling the first and the second single-branched thermal conduction path 100 and 110 in respect to the other single-branched thermal conduction path 100, 110 respectively and each of the single-branched thermal conduction path in respect to an environment of the tube 250.
  • the temperature sensor assembly 200 can be thermally coupled to the wall of the vessel 210 by a mounting means 220.
  • a tip of the first single-branched conduction path 100 which is in close vicinity to the surface of the vessel wall 210, is mechanically coupled directly to the surface of the wall of the vessel 210 having the thermal resistance R0 between the temperature measurement sensor 103 and the surface of the vessel wall 210.
  • Electric leads 203 e.g. in form of sheathed cables, for the temperature measurement sensor 103 can preferably be located within a standard thermometer rod 205, which can preferably be made of a low thermal conductivity material such as stainless steel and the sheathed cable can be mineral-insulated inside of the standard thermometer rod 205.
  • Electric leads 213, e.g. in form of sheathed cables, for the reference temperature sensor 113 can preferably be located within a standard thermometer rod 215, which can preferably be made of a low thermal conductivity material such as stainless steel and the sheathed cable can be mineral-insulated inside of the thermometer rod 215.
  • Figure 4 sketches schematically a further temperature sensor assembly 200 according to the temperature sensor assembly 200 as shown in figure 3 , but the tip of the second single-branched thermal conduction path 110, which is in the vicinity of the surface of the wall of the vessel 210, including the reference temperature sensor 113 is directly thermally coupled to the surface of the wall of the vessel 210.
  • Figure 5 sketches schematically a further temperature sensor assembly 200 according to the temperature sensor assembly 200 as shown in figure 2 , but wherein the tube 250 is filled by insulation material only partially, mainly to fix the position of the first and second single-branched thermal conduction path 100 and 110.
  • Figure 6 sketches schematically another temperature sensor assembly 200 according to the temperature sensor assembly 200 as shown in figure 5 , but without the insulation material.
  • coupling elements 610 and 620 are provided, which are only weakly thermally conductive.
  • the first and the second single-branched thermal conduction path 100 and 110 which may be formed as standard thermometer rods, are coupled to the respective surface sides at the surface of the vessel wall 210 mechanically by a first spring 601 and a second spring 611 respectively to provide springloaded mechanical contacts.
  • Figure 7 sketches schematically another temperature sensor assembly 200, wherein the first single-branched thermal conduction path 100 is arranged within a neck tube 250 and the second single-branched thermal conduction path 110 is arranged within another neck tube 250.
  • the thermal coupling of the first single-branched thermal conduction path 100 is configured as shown in figure 6 and also the thermal coupling of the second single-branched thermal conduction path 110 is configured as shown in figure 6 .
  • Figure 8 a sketches schematically how the temperature sensor assembly 200 as shown in figure 7 can be arranged on the curved surface of the vessel wall 210.
  • Figure 9 depicts an assembly of concentric cylinders 250, 950, wherein the inner cylinder 950 is evacuated for thermal isolation, and thermally coupled to the surface of the wall of the pipe 220.
  • a reference sensor 215 is arranged within the inner cylindrical space of the inner cylinder 950 and thermally coupled to the wall of the pipe 220 via a non-conducting or low conductivity material 230.
  • the measurement sensor 205 is mounted in an annular space between the inner 950 and the outer cylinder 250 and strong mechanically and directly, or via a high conductivity material, thermally coupled to the wall of the pipe 220.
  • the reference sensor 215 can be mounted in the annular space and the measurement sensor 205 can be mounted in the inner cylindrical space of the inner cylinder 950.
  • the outer annular space can be evacuated or both the inner cylinder 950 and annular space can be evacuated.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Claims (13)

  1. Eine Temperatursensoranordnung (200), die so eingerichtet ist, dass sie thermisch mit einer Behälterwand (210) gekoppelt wird, um eine Temperatur einer Oberfläche der Behälterwand zu bestimmen, wobei die Anordnung umfasst:
    einen ersten einfach verzweigten Wärmeleitweg (100) zwischen der Oberfläche der Behälterwand und einer Umgebung der Temperatursensoranordnung (200), umfassend einen Temperaturmesssensor (103), der so eingerichtet ist, dass er thermisch mit einer ersten Stelle der Oberfläche der Behälterwand (210) gekoppelt ist, was zu einem ersten thermischen Widerstand (102) führt; und einen zweiten einfach verzweigten Wärmeleitweg (110) zwischen einer zweiten Stelle der Oberfläche der Behälterwand (210) und einer Umgebung der Temperatursensoranordnung, umfassend einen Referenztemperatursensor (113), der so eingerichtet ist, dass er thermisch mit der Oberfläche der Behälterwand (210) gekoppelt ist, was zu einem zweiten thermischen Widerstand (112) führt,
    dadurch gekennzeichnet, dass der erste einfach verzweigte Wärmeleitweg (100) und/oder der zweite einfach verzweigte Wärmeleitweg (110) durch ein Material mit geringer Wärmeleitfähigkeit isoliert sind, um eine thermische Kopplung zwischen dem ersten einfach verzweigten Wärmeleitweg (100) und dem zweiten einfach verzweigten Wärmeleitweg (110) zu verringern.
  2. Temperatursensoranordnung (200) gemäß Anspruch 1, wobei eine thermische Kopplung zwischen dem Referenztemperatursensor (113) und dem ersten einfach verzweigten Wärmeleitweg (100) kleiner ist als eine thermische Kopplung zwischen dem Referenztemperatursensor (113) und dem Temperaturmesssensor (103), wenn die Temperatursensoranordnung (200) mechanisch mit der Wand des Behälters (210) gekoppelt ist.
  3. Temperatursensoranordnung (200) gemäß einem der vorangehenden Ansprüche, wobei die thermische Kopplung zwischen dem Referenztemperatursensor (113) und dem Temperaturmesssensor (103) durch eine Reihenschaltung des ersten thermischen Widerstands (102) und eines Teils der Behälterwand (210) dominiert wird, die mit dem ersten einfach verzweigten Wärmeleitweg (100) und dem zweiten einfach verzweigten Wärmeleitweg (110) gekoppelt sind, und dem zweiten thermischen Widerstand (112) dominiert wird, wenn die Temperatursensoranordnung (200) mechanisch mit der Wand des Behälters (210) gekoppelt ist.
  4. Temperatursensoranordnung (200) gemäß einem der vorangehenden Ansprüche, wobei der erste einfach verzweigte Wärmeleitweg (100) und/oder der zweite einfach verzweigte Wärmeleitweg (110) innerhalb eines Halsrohrs (250) angebracht sind, um die thermische Kopplung zwischen dem ersten einfach verzweigten Wärmeleitweg (100) und dem zweiten einfach verzweigten Wärmeleitweg (110) zu verringern; und/oder um eine thermische Kopplung des ersten einfach verzweigten Wärmeleitwegs (100) und/oder des zweiten einfach verzweigten Wärmeleitwegs (110) mit einer Umgebung der Temperatursensoranordnung (200) zu verringern.
  5. Temperatursensoranordnung (200) gemäß Anspruch 4, wobei der einfach verzweigte Wärmeleitweg (100) oder der zweite einfach verzweigte Wärmeleitweg (110) innerhalb eines zweiten Rohrs angebracht ist, wobei das zweite Rohr konzentrisch innerhalb des Halsrohrs (250) angebracht ist; und wobei vorzugsweise das zweite Rohr evakuiert ist, um die thermische Kopplung zwischen dem ersten einfach verzweigten Wärmeleitweg (100) und dem zweiten einfach verzweigten Wärmeleitweg (110) zu verringern.
  6. Temperatursensoranordnung (200) gemäß einem der vorangehenden Ansprüche, wobei der erste einfach verzweigte Wärmeleitweg (100) und/oder der zweite einfach verzweigte Wärmeleitweg (110) einen federbelasteten Mechanismus umfasst und eingerichtet ist, einen Oberflächenkontakt des ersten einfach verzweigten Wärmeleitwegs (100) und/oder des zweiten einfach verzweigten Wärmeleitweges (110) mit der Oberfläche der Behälterwand (210) federnd zu belasten.
  7. Temperatursensoranordnung (200) gemäß einem der vorangehenden Ansprüche, wobei der Messsensor (103) thermisch mit der Oberfläche der Wand des Behälters (210) durch einen Stopfen (310) gekoppelt ist, der ein erstes Mittel zum thermischen Koppeln des Messsensors (103) mit der Oberfläche der Wand des Behälters umfasst (210) umfasst, das ein Material mit hoher Wärmeleitfähigkeit umfasst, um die thermische Kopplung zwischen dem Temperaturmesssensor (103) und der Oberfläche der Wand des Behälters (210) zu verbessern, und wobei das erste Mittel zwischen dem Temperaturmesssensor (103) und der Oberfläche der Wand des Behälters (210) angeordnet ist.
  8. Temperatursensoranordnung (200) gemäß einem der vorangehenden Ansprüche, wobei der Referenztemperatursensor (113) mit der Oberfläche der Wand des Behälters (210) durch einen räumlichen Spalt (230) und/oder durch ein zweites Mittel zum thermischen Koppeln des Referenztemperatursensors (113) mit der Oberfläche der Wand des Behälters gekoppelt ist (210), das ein Material mit geringer Wärmeleitfähigkeit umfasst, um den Referenztemperatursensor (113) zumindest teilweise thermisch von der Oberfläche der Wand des Behälters (210) zu entkoppeln, und wobei das zweite Mittel zwischen dem Referenztemperatursensor (113) und der Oberfläche der Wand des Behälters (210) angeordnet ist.
  9. Temperatursensoranordnung (200) gemäß einem der vorangehenden Ansprüche, umfassend mindestens einen weiteren Referenzsensor.
  10. Temperatursensoranordnung (200) gemäß einem der vorangehenden Ansprüche, wobei der Temperaturmesssensor (103) und/oder der Referenztemperatursensor (113) ein Widerstandsthermometer und/oder ein Thermoelement umfasst.
  11. Ein Verfahren zur Bestimmung einer Temperatur eines Mediums über eine Temperatur eines Messpunktes an einer das Medium umschließenden Oberfläche, umfassend eine Temperatursensoranordnung (200) gemäß einem der Ansprüche 1 bis 10 sowie eine mit der Temperatursensoranordnung elektrisch verbundene Analysevorrichtung zur Bestimmung der Temperatur der Behälterwand (200) verbunden ist, wobei mindestens ein Referenztemperatursensor (113) der Temperatursensoranordnung (200) verwendet wird, um einen Temperaturgradienten entlang eines ersten Wärmeleitweges (100) zwischen einer das Medium umgebenden Oberfläche und einer Umgebung der Temperatursensoranordnung (200) zu bestimmen; und wobei mittels des Temperaturgradienten entlang des ersten Wärmeleitweges (100) ein Korrekturwert zum Korrigieren eines Messwertes mindestens eines Temperaturmesssensors (103) der Temperatursensoranordnung (200) bestimmt wird.
  12. Ein Messsystem zum Bestimmen einer Temperatur der Oberfläche der Behälterwand, umfassend:
    eine Temperatursensoranordnung (200) gemäß einem der Ansprüche 1 bis 10; und
    eine Analysevorrichtung zum Bestimmen der Oberflächentemperatur der Behälterwand (210), wobei die Temperatursensoranordnung (200) elektrisch mit der Analysevorrichtung verbunden ist.
  13. Eine Verwendung der Temperatursensoranordnung (200) gemäß einem der Ansprüche 1 bis 10 zur Bestimmung einer Oberflächentemperatur einer Wand eines Behälters (210).
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US17/878,143 US12442693B2 (en) 2021-08-02 2022-08-01 Temperature sensor assembly

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