EP4116994A1 - Microcoil element, array type microcoil element, and device - Google Patents
Microcoil element, array type microcoil element, and device Download PDFInfo
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- EP4116994A1 EP4116994A1 EP20964734.6A EP20964734A EP4116994A1 EP 4116994 A1 EP4116994 A1 EP 4116994A1 EP 20964734 A EP20964734 A EP 20964734A EP 4116994 A1 EP4116994 A1 EP 4116994A1
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- 239000002184 metal Substances 0.000 claims abstract description 136
- 239000000126 substance Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
Definitions
- the present invention relates to the technical field of electronic parts and components, in particular to a micro-coil element, an array micro-coil element and a device.
- Common magnetic elements can produce a magnetic field, such as magnets or coils formed by winding metal wires, have a certain volume and weight, so they will make electronic devices heavier or require a certain space to accommodate such magnetic elements when applying to the electronic devices.
- such magnetic elements should be made of special materials or designed with special structures to be mounted on the devices, or the miniaturization is limited to meet the requirements for specified magnetic field intensity and related physical constraints, or the volume and weight of the magnetic elements have to be deliberately reduced for miniaturization, thus impairing the effect of the magnetic elements.
- the object of the present invention is to provide a micro-coil element, an array micro-coil element and a device that have a strong magnetic field and a small size.
- a micro-coil element comprising:
- the micro-coil element further includes at least one electrical connection layer, wherein a plurality of metal wires are disposed on the electrical connection layer to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area on the electrode layer and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area on the electrode layer.
- the first electrode terminal of each of the metal line segments on the wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- the said starting point defines the first electrode of the micro-coil element, and the plurality of metal line segments of continuous wiring coil around the starting point to form one concentric circle or one concentric polygon.
- the micro-coil element When the micro-coil element includes more than two wiring layers, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers.
- the said micro-coil element further includes at least one magnetic conductive layer, the said magnetic conductive layer is made from magnetic conductive substance, and an insulating layer is disposed between the said magnetic conductive layer and the wiring layer.
- An array micro-coil element comprising:
- the electrode layer is provided with a plurality of metal wires, which are used to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area.
- the said array micro-coil element further includes at least one electrical connection layer, a plurality of metal wires are disposed on the said electrical connection layer to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area on the electrode layer and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area on the electrode layer.
- the first electrode terminal of each of the metal line segments on the wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- Each wiring layer corresponds to one major negative electrode contact area and one major positive electrode contact area, wherein the plurality of micro-coil units on each wiring layer connect the at least one first electrode area and the at least one second electrode area on the electrode layer separately to the major negative electrode contact area and the major positive electrode contact area through the vias, thus connecting the plurality of micro-coil elements in a parallel manner.
- the array micro-coil element When the array micro-coil element includes more than two wiring layers, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers.
- the said micro-coil element further includes at least one magnetic conductive layer, the magnetic conductive layer is made from magnetic conductive substance, and an insulating layer is disposed between the magnetic conductive layer and the wiring layer.
- the said array micro-coil element is provided with the micro-coil units having the same or different shapes or sizes
- the wiring layer of the said array micro-coil element is further provided with one outer coil unit encircling the one or more micro-coil units.
- a micro-coil device comprising:
- the said magnetic element is a single micro-coil element or an array micro-coil element.
- the said wiring layer is provided with more than two micro-coil units, and the more than two micro-coil units have the same or different shapes or sizes.
- the said wiring layer is further provided with one outer coil unit encircling one or more micro-coil units.
- the said magnetic element further includes one wafer, the said magnetic element is disposed on the wafer, and the said wafer is a magnetic wafer.
- the present invention has the following beneficial effects:
- the negative electrodes of the plurality of line segments of the micro-coil elements may be connected to one negative electrode contact area
- the positive electrodes of the plurality of line segments of the plurality of micro-coil elements may be connected to one positive electrode contact area.
- the plurality of metal line segments are able to be connected in parallel with one another, and they also may be connected in parallel to the major negative electrode contact area and the major positive electrode contact area separately, thus realizing a wiring design that the plurality of micro-coil elements are connected in parallel with one another.
- the metal line segments of the micro-coil elements may be designed with various wiring parameters including impedance value, magnetic field or size for multiple purposes.
- the embodiment discloses a micro-coil element, an array micro-coil element formed by a plurality of micro-coil elements, and a device realizing a magnetic element by use of a single micro-coil element or an array micro-coil element.
- FIG. 1 which shows an embodiment of a basic structure of the micro-coil element.
- the micro-coil element may be printed, masked and etched on a substrate (such as an insulator) to form a continuous metal wire 10, and an electrical contact may be formed at each end of the metal wire 10.
- a first electrode 11 at one end may be used as a negative electrode of the micro-coil element, and a second electrode 12 at the other end may be used as a positive electrode of the micro-coil element.
- the standing current flowing through the micro-coil element may form a uniform magnetic field thereon, wherein parameters that define the impedance value of the overall micro-coil element include material, a wire width, a wire length and a number of circles of the metal wire 10. Therefore, to design the micro-coil element, it is necessary to know the impedance and the magnetic field conditions required.
- FIG. 2 is a schematic diagram of an embodiment of the wiring on the micro-coil element, according to main implementation of the micro-coil element of the embodiment, a plurality of breakpoints are formed on the metal wire on the micro-coil element according to requirements.
- the micro-coil element of the embodiment includes at least one wiring layer and one electrode layer. When more than two wiring layers are disposed, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers. Each of the wiring layers is provided with more than one micro-coil unit.
- FIG. 2 is a structural diagram of the wiring layer of the micro-coil element of the embodiment, which only includes one micro-coil unit.
- the micro-coil unit is provided with a plurality of metal line segments (201, 202, ..., 210) which start from one starting point and coil around the starting point to form a plurality of circles of continuous wiring.
- the starting point may be disposed at any position on the micro-coil element, preferably, but not limited to the vicinity of the central area of the micro-coil element.
- the starting point may be located according to actual requirements.
- the starting point forms a first electrode 21, such as the negative electrode of the micro-coil element; and the end of the metal line segments, namely, the end of the plurality of metal line segments of continuous wiring, forms a second electrode 22 of the micro-coil element, which may be used as the positive electrode of the micro-coil element.
- the plurality of metal line segments (201, 202, ..., 210) each have two endpoints, the one is a first electrode terminal, such as the end of the first electrode 21 formed proximal to the starting point; and the other is a second electrode terminal, which is the endpoint proximal to the end of the metal line segments.
- FIG. 3 which shows an electrode layer 30 of the micro-coil element, which is provided with contacts 31 corresponding to two ends of the plurality of metal line segments on the wiring layer, and electrodes corresponding to the first electrode 21 and the second electrode 22, such as a first electrode contact 21' and a second electrode contact 22'.
- the proposed design of the micro-coil element may define a total length, a wire width, a wire spacing between any two adjacent metal line segments, a segment length, a number of circles, a circle span and/or the material of the plurality of metal line segments according to actual requirements (such as impedance value, magnetic field or size).
- the actual requirements mainly refer to the requirements of the micro-coil device, and it may also be decided based on the requirements to use the single micro-coil element, or a plurality of micro-coil units arranged in an array on each wiring layer of the embodiment, as shown in FIGS. 4A to 4D .
- an array micro-coil element 40 is composed of a plurality of micro-coil units 20 arranged in an array, wherein the shape of the array micro-coil element 40 and the number of micro-coil elements are not intended to limit its implementation scope.
- each micro-coil unit illustrated is also provided with a plurality of metal line segments which start from one starting point and coil around the starting point to form a plurality of circles of continuous wiring, and an electrode layer, in which at least one first electrode area and at least one second electrode area are separately disposed to assemble the first electrode terminal and the second electrode terminal of each of the metal line segments, and they may be designed as one or more first electrode areas and second electrode areas according to actual requirements. It is worth noting that the first electrode area and the second electrode area assembling the first electrode terminal and the second electrode terminal of each of the metal line segments may realize the function of assembling the electrode terminals by use of an electrical connection layer of another element.
- a plurality of metal wires may direct the first electrode terminal of each of the metal line segments on the wiring layer to the first electrode area on the electrode layer through vias or leads on the substrate, and also direct the second electrode terminal of each of the metal line segments to the second electrode area on the electrode layer.
- all coil elements in the array micro-coil element share the same shape and size.
- a plurality of micro-coil elements different in shapes or sizes are disposed in the array micro-coil element according to actual requirements (such as the requirement of magnetic field).
- FIG. 4B shows an embodiment of another array micro-coil element 41, which is composed of a plurality of micro-coil units 20 arranged in an array.
- a micro-coil unit 411 covering a relatively large (millimeter-sized) area may be designed to meet the requirement of a magnetic field.
- the position of the micro-coil unit 411 is not limited to that in FIG. 4B , and the micro-coil units 20 around or by the side of the micro-coil unit 411 may interact therewith (such as magnetic field amplification or offset), so that the overall array micro-coil element 41 meets the design requirement for specified magnetic field.
- FIG. 4C shows an embodiment of another array micro-coil element 42.
- a relatively large micro-coil unit 421 may be disposed among a plurality of micro-coil units 20 in an array, and the micro-coil unit 421 may be different from the micro-coil units 20 in shape.
- the micro-coil unit 421 may also interact with the nearby micro-coil units 20 to produce magnetic field amplification or offset effects to different extents, thus obtaining an equivalent magnetic field to meet the requirements.
- FIG. 4D which shows an embodiment of another array micro-coil element 43, in which an outer coil unit is disposed to encircle one or more micro-coil elements according to requirement of the equivalent magnetic field.
- An outer coil unit 431 is formed on an outer circle of a plurality of micro-coil units 20 arranged in an array, and the outer coil unit 431 encircles the plurality of micro-coil units 20 within an inner circle.
- the illustrated array micro-coil element 43 may be obtained depending on number, area, length and thickness of line segments of the micro-coil units 20 in combination with the design of the outer coil unit 431.
- each single micro-coil unit of FIGS. 2 , 4A to 4D allows to produce an electric current flowing through the plurality of metal line segments in a constant direction upon energization, thus producing an equivalent magnetic field by use of one multi-turn coil.
- the array micro-coil elements 40, 41, 42 and 43 composed of the plurality of micro-coil elements 20, one overall equivalent magnetic field may be produced to eliminate weak and inhomogeneous magnetic fields on the edge of individual micro-coil element.
- micro-coil units 20 or various array micro-coil elements may be used in combination and not limited to that in the Figures, and the starting point of the plurality of metal line segments in each micro-coil unit (such as the first electrode 21 in FIG. 2 ) may be the electrode terminal proximal to the central area, or located at any position off the center according to actual design.
- FIG. 5A is a schematic diagram of an embodiment of a micro-coil unit 50 formed by a single micro-coil element.
- the micro-coil unit 50 has a starting point (such as the electrode terminal proximal to the central area), which forms a first electrode of the single micro-coil element and may be a negative electrode of an overall element.
- a plurality of metal line segments start from the starting point. As shown in the figure, the plurality of metal line segments of continuous wiring coil around the starting point to form a concentric polygon, and the end of the metal line segments forms a second electrode as a positive electrode of the overall element.
- FIG. 5B is a schematic diagram of an embodiment of another micro-coil unit 52 formed by a single micro-coil element.
- a plurality of metal line segments coil around a starting point to form one concentric circle in the example, in which the starting point of the plurality of metal line segments forms a first electrode and the end forms a second electrode.
- FIG. 6 is a schematic diagram of an embodiment in which an electrode layer of a micro-coil element assembles an electrode terminal of each metal line segment, wherein a negative electrode assembling layer 60 assembles a first electrode terminal (such as the negative electrode) of each metal line segment on the above-mentioned wiring layer.
- a pad namely an electrode area 61, has an area sufficient to connect to a plurality of metal wires 63, and the metal wires 63 on the negative electrode assembling layer 60 are used to direct the wiring of the negative electrode of each metal line segment on the wiring layer.
- FIG. 7 is a schematic diagram of an embodiment in which the electrode layer of the micro-coil element assembles another electrode terminal (such as the positive electrode) of each metal line segment. It shows a positive electrode assembling layer 70 provided with an electrode area 71, which is designed to have an area sufficient to connect to a plurality of metal wires 73. Similarly, the metal wires 73 on the positive electrode assembling layer 70 are used to direct the wiring of the positive electrode of each metal line segment on the wiring layer.
- the electrode designs shown in FIGS. 6 and 7 may be two printed circuits disposed on the same electrode layer, or two printed circuits separately disposed on different electrode layers.
- FIG. 8 which is a schematic diagram of an embodiment of the electrode assembling layer of the micro-coil element, in which an electrode layer 80 is provided with a first electrode area 81 and a second electrode area 82, so that the positive electrode of each of the metal line segments on the wiring layer is directed to the first electrode area 81 and the negative electrode is directed to the second electrode area 82 through the vias or the leads.
- a plurality of metal wires are provided to direct the first electrode terminal of each of the metal line segments on the wiring layer to the first electrode area 81 and the second electrode terminal of each of the metal line segments to the second electrode area 82.
- the first electrode terminal of each of the metal line segments on the wiring layer is negative and the second electrode terminal is positive.
- the positive electrodes of the plurality of metal line segments are connected through the vias in a parallel manner, and the negative electrodes are connected through the vias in a parallel manner.
- the plurality of micro-coil elements each connect the first electrode area and the second electrode area on the electrode layer to the major negative electrode contact area (such as the electrode area 61 and the first electrode area 81) and the major positive electrode contact area (such as the electrode area 71 and the second electrode area 82) realized in FIG. 6, 7 or 8 through the vias, respectively, so as to connect the plurality of micro-coil elements on the array micro-coil element in a parallel manner.
- FIG. 9 shows another embodiment, which is a schematic diagram of a mixed layer provided with a contact unit (such as a contact unit 30 in FIG. 3 ) and an electrode unit (such as the first electrode area 81 and the second electrode area 82 in FIG. 8 ) corresponding to the single micro-coil element in the array micro-coil element.
- a contact unit such as a contact unit 30 in FIG. 3
- an electrode unit such as the first electrode area 81 and the second electrode area 82 in FIG. 8
- the wiring design for directing the electrode of each single micro-coil element is not limited to certain embodiments, the additional design of wiring layer shown in FIG. 9 is also allowed, wherein the plurality of contact units 30 with electrode contacts are disposed within a portion of space, and direct the electrode terminal of each of the metal line segments on the wiring layer to electrode units 91, 92, 93, 94 and 95 in another portion of space through the vias or the leads.
- each micro-coil element may be customized in size and shape to fit the product, and flexibility is improved based on multi-segment miniaturization design, a total length, a wire width, a wire spacing between any two adjacent metal line segments, a segment length, a number of circles, a circle span and/or the material of the plurality of metal line segments may be defined according to actual requirements in terms of impedance value, magnetic field or product size and shape, and the spacing between two adjacent micro-coil units and/or the number of all micro-coil elements may also be considered.
- a multi-layer structure may also be designed according to the requirements.
- the multi-layer structure covers the wiring layer and the electrode layer, or the additional electrode (positive electrode and negative electrode) assembling layer for assembling all electrode lines, in which the micro-coil elements may be connected in parallel through the vias or the leads.
- the micro-coil elements take into account the above-mentioned design parameters as well as the shape of the continuous multi-segment metal winding, including the segment width, segment length, total number of circles, the circle span and the total length.
- an array micro-coil element may be designed as shown in FIG. 10 , which also shows a schematic diagram of a magnetic field distribution.
- FIGS. 2 , 5A and 5B will produce an equivalent magnetic field by use of one multi-turn coil after being energized, in which the magnetic field intensity may be controlled by the current flowing through.
- the magnetic field may change remarkably at the edge of the single micro-coil element.
- FIG. 10 is a schematic diagram of the magnetic field produced by use of the array micro-coil element composed of the plurality of micro-coil elements.
- the uniform magnetic field produced as a whole may eliminate the weak and inhomogeneous magnetic fields on the edge of individual micro-coil element. After being energized, the plurality of micro-coil elements are able to be homogenized as a whole to produce one wide-covered equivalent magnetic field.
- the micro-coil element in order to further improve the magnetic field intensity of the micro-coil, also includes at least one magnetic conductive layer, the magnetic conductive layer is made from magnetic conductive substance, and an insulating layer is disposed between the magnetic conductive layer and the wiring layer.
- micro-coil elements described in the above-mentioned embodiments are mainly applied as the magnetic elements in the electronic devices.
- the micro-coil element is small in dimensions (for example, a 65 nm-nanometre process is adopted in prior art, so that the wire diameter (wire width) and wire spacing are at micron level or nanometer level), in an earphone device shown in FIG. 11 , it requires less space and provides the advantage of covering multifrequency band by use of a plurality of units.
- FIG. 11 which shows a horn device 11, wherein its structure mainly includes an outer shell 111, a diaphragm 112, a washer 113, a magnetic element 114, a magnetizer 115 and a circuit board 116.
- the one or more micro-coil elements at least realize the magnetic element 114 in the horn device 11, and may supply power to the magnetic element 114 in the device after connecting the circuit board 116 to one power supply.
- the magnetic element 114 may be the single micro-coil element or the array micro-coil element proposed in the above-mentioned embodiments, and the magnetic element 114 may be designed with a plurality of layers of micro-coil elements or array micro-coil elements according to requirements for impedance value, magnetic field or size.
- the horn device 11 or the unit in the earphone is formed by a voice coil including the cone-shaped diaphragm 112, the magnetic element 114 and the magnetizer 115.
- a voice coil including the cone-shaped diaphragm 112, the magnetic element 114 and the magnetizer 115.
- the magnetic element 114 When the current flows through the magnetic element 114, a magnetic field is produced, which interacts with the magnetizer 115 to move the voice coil. If the direction of the current in the magnetic element 114 is continuously changed, a magnetic field with opposite polarity will be produced, thus changing the movement direction of the voice coil and driving the diaphragm 112.
- the magnetic element 114 may be realized by the single micro-coil element or the array micro-coil element. The micro-coil element produces a magnetic field after being energized, and drives the voice coil in a more nuanced manner to output better sound depending on improved impedance control.
- the coil element of the magnetic element is mostly disposed on a wafer.
- the wafer may be disposed as a magnetic wafer.
- the said magnetic wafer may be obtained by doping magnetic conductive substance into the wafer, or coating the back of the wafer with a layer of magnetic conductive substance before or after the fabrication of the magnetic element.
- the various implementation forms of the micro-coil elements described in the above-mentioned embodiments show that the magnetic element in the electronic device is able to be realized by a single micro-coil element or an array micro-coil element including a plurality of micro-coil elements.
- the micro-coil elements each include a plurality of metal line segments, compared with the coil design in the prior art, the concept of the micro-coil design disclosed is to stack the magnetic fields by arrangement of a plurality of unconnected lines in a coiling manner, thereby increasing the current density and reducing the total resistance in a parallel manner.
- the negative electrodes of the plurality of line segments of the micro-coil elements may be connected to one negative electrode contact area
- the positive electrodes of the plurality of line segments of the plurality of micro-coil elements may be connected to one positive electrode contact area.
- the plurality of metal line segments are able to be connected in parallel with one another, and they also may be connected in parallel to the major negative electrode contact area and the major positive electrode contact area separately, thus realizing a wiring design that the plurality of micro-coil elements are connected in parallel with one another.
- the metal line segments of the micro-coil elements may be designed with various wiring parameters including impedance value, magnetic field or size for multiple purposes.
Abstract
Description
- The present invention relates to the technical field of electronic parts and components, in particular to a micro-coil element, an array micro-coil element and a device.
- Common magnetic elements can produce a magnetic field, such as magnets or coils formed by winding metal wires, have a certain volume and weight, so they will make electronic devices heavier or require a certain space to accommodate such magnetic elements when applying to the electronic devices.
- If applied in miniaturized electronic devices, such as earphones, hearing aids or miniature loudspeaker, such magnetic elements should be made of special materials or designed with special structures to be mounted on the devices, or the miniaturization is limited to meet the requirements for specified magnetic field intensity and related physical constraints, or the volume and weight of the magnetic elements have to be deliberately reduced for miniaturization, thus impairing the effect of the magnetic elements.
- Although the materials of magnetic elements producing magnetic fields of the prior art have been significantly improved, the problems of physical limits and high costs still exist.
- The object of the present invention is to provide a micro-coil element, an array micro-coil element and a device that have a strong magnetic field and a small size.
- In order to achieve the object, the present invention provides the following technical solution:
a micro-coil element, comprising: - at least one wiring layer, provided with a plurality of metal line segments, which start from one starting point and coil around the starting point to form a plurality of circles of continuous wiring, with each of the metal line segments ended with one first electrode terminal and one second electrode terminal, wherein the starting point is one first electrode of the micro-coil element, and the end of the plurality of metal line segments of continuous wiring is one second electrode of the micro-coil element; and
- one electrode layer, provided with at least one first electrode area and at least one second electrode area, wherein the at least one first electrode area is used for assembling the first electrode terminal of each of the plurality of metal line segments, and the at least one second electrode area is used for assembling the second electrode terminal of each of the plurality of metal line segments.
- the said electrode layer is provided with a plurality of metal wires, which are used to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area and direct the second electrode terminal of each of the metal line segments on the wiring layer to the at least one second electrode area.
- The micro-coil element further includes at least one electrical connection layer, wherein a plurality of metal wires are disposed on the electrical connection layer to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area on the electrode layer and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area on the electrode layer.
- The first electrode terminal of each of the metal line segments on the wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- The said starting point defines the first electrode of the micro-coil element, and the plurality of metal line segments of continuous wiring coil around the starting point to form one concentric circle or one concentric polygon.
- When the micro-coil element includes more than two wiring layers, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers.
- The said micro-coil element further includes at least one magnetic conductive layer, the said magnetic conductive layer is made from magnetic conductive substance, and an insulating layer is disposed between the said magnetic conductive layer and the wiring layer.
- An array micro-coil element, comprising:
- at least one wiring layer, provided with a plurality of micro-coil units, wherein the micro-coil units each comprise a plurality of metal line segments starting from one starting point and coiling around the starting point to form a plurality of circles of continuous wiring, the metal line segments each end with one first electrode terminal and one second electrode terminal, the starting point is one first electrode of the micro-coil units, and the end of the plurality of metal line segments of continuous wiring is one second electrode of the micro-coil units; and
- one electrode layer, provided with at least one first electrode area and at least one second electrode area, wherein the at least one first electrode area is used for assembling the first electrode terminal of each of the plurality of metal line segments, and the at least one second electrode area is used for assembling the second electrode terminal of each of the plurality of metal line segments.
- The electrode layer is provided with a plurality of metal wires, which are used to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area.
- The said array micro-coil element further includes at least one electrical connection layer, a plurality of metal wires are disposed on the said electrical connection layer to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area on the electrode layer and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area on the electrode layer.
- The first electrode terminal of each of the metal line segments on the wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- Each wiring layer corresponds to one major negative electrode contact area and one major positive electrode contact area, wherein the plurality of micro-coil units on each wiring layer connect the at least one first electrode area and the at least one second electrode area on the electrode layer separately to the major negative electrode contact area and the major positive electrode contact area through the vias, thus connecting the plurality of micro-coil elements in a parallel manner.
- When the array micro-coil element includes more than two wiring layers, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers.
- The said micro-coil element further includes at least one magnetic conductive layer, the magnetic conductive layer is made from magnetic conductive substance, and an insulating layer is disposed between the magnetic conductive layer and the wiring layer.
- The said array micro-coil element is provided with the micro-coil units having the same or different shapes or sizes
- The wiring layer of the said array micro-coil element is further provided with one outer coil unit encircling the one or more micro-coil units.
- A micro-coil device, comprising:
- at least one magnetic element, comprising a micro-coil element; and
- one circuit board, connected to one power supply and used for supplying power to the at least one magnetic element;
- wherein, the micro-coil element comprises:
- at least one wiring layer, comprising one or more than two coil units, wherein the coil unit is provided with a plurality of metal line segments starting from one starting point and coiling around the starting point to form a plurality of circles of continuous wiring, each of the metal line segments ends with one first electrode terminal and one second electrode terminal, the starting point is one first electrode of the micro-coil element, and the end of the plurality of metal line segments of continuous wiring is one second electrode of the micro-coil element; and
- one electrode layer, provided with at least one first electrode area and at least one second electrode area, wherein the at least one first electrode area is used for assembling the first electrode terminal of each of the plurality of metal line segments, and the at least one second electrode area is used for assembling the second electrode terminal of each of the plurality of metal line segments.
- The said magnetic element is a single micro-coil element or an array micro-coil element.
- The said wiring layer is provided with more than two micro-coil units, and the more than two micro-coil units have the same or different shapes or sizes.
- The said wiring layer is further provided with one outer coil unit encircling one or more micro-coil units.
- The said magnetic element further includes one wafer, the said magnetic element is disposed on the wafer, and the said wafer is a magnetic wafer.
- With the above-said solution, the present invention has the following beneficial effects:
The mode that realizes the magnetic element in the electronic device by use of the single micro-coil element or the mode that realizes the magnetic element by use of the array micro-coil element formed by the plurality of micro-coil elements, in particular, as each micro-coil element includes the plurality of metal line segments, compared with the coil design of the prior art, the concept of the micro-coil design proposed by the present invention is to stack the magnetic fields by arrangement of a plurality of unconnected lines in a coiling manner. In this case, the current density is increased and the total resistance is reduced in a parallel manner, thus improving the magnetic field of small micro-coil element. In this way, for electrical design, the negative electrodes of the plurality of line segments of the micro-coil elements may be connected to one negative electrode contact area, and the positive electrodes of the plurality of line segments of the plurality of micro-coil elements may be connected to one positive electrode contact area. The plurality of metal line segments are able to be connected in parallel with one another, and they also may be connected in parallel to the major negative electrode contact area and the major positive electrode contact area separately, thus realizing a wiring design that the plurality of micro-coil elements are connected in parallel with one another. According to actual situation, the metal line segments of the micro-coil elements may be designed with various wiring parameters including impedance value, magnetic field or size for multiple purposes. - To further acknowledge features and technologies adopted by the present invention, please refer to the following detailed descriptions and drawings. It should be understood that the drawings are used for reference and description only, and should not be construed as limiting the present invention.
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FIG. 1 is a schematic diagram of an embodiment of a micro-coil element; -
FIG. 2 is a schematic diagram of a wiring layer of the micro-coil element; -
FIG. 3 is a schematic diagram of an embodiment of another contact surface on the micro-coil element; -
FIGS. 4A to 4D are schematic diagrams of embodiments of array micro-coil elements formed by the micro-coil elements; -
FIGS. 5A and 5B are schematic diagrams of embodiments of wiring on the micro-coil element; -
FIG. 6 is a No. 1 schematic diagram of an embodiment of an electrode area assembling electrode terminals of all metal line segments on an electrode layer of the micro-coil element; -
FIG. 7 is No. 2 schematic diagram of an embodiment of the electrode area assembling the electrode terminals of all the metal line segments on the electrode layer of the micro-coil element; -
FIG. 8 is No. 3 schematic diagram of an embodiment of the electrode assembling layer of the micro-coil element; -
FIG. 9 is a schematic diagram of an embodiment of a mixed layer of contact units and electrode units in the micro-coil element; -
FIG. 10 is a schematic diagram of magnetic fields produced by the array micro-coil element; and -
FIG. 11 is a schematic diagram of an earphone structure using the micro-coil element. - Label explanation:
- 10: metal wire;
- 11: first electrode;
- 12: second electrode;
- 20: micro-coil unit;
- 21: first electrode;
- 22: second electrode;
- 201, 202, 203, 204, 205, 206, 207, 208, 209, 210: metal line segment;
- 30: contact unit;
- 21': first electrode contact;
- 22': second electrode contact;
- 31: contact;
- 40, 41, 42, 43: array micro-coil element;
- 411, 421: micro-coil unit;
- 431: outer coil unit;
- 50, 52: micro-coil unit;
- 60: negative electrode assembling layer;
- 61: electrode area;
- 63: metal wire;
- 70: positive electrode assembling layer;
- 71: electrode area;
- 73: metal wire;
- 80: electrode layer;
- 81: first electrode area;
- 82: second electrode area;
- 90: electrode layer;
- 91, 92, 93, 94, 95: electrode unit;
- 100: schematic diagram of magnetic field of the array micro-coil;
- 11: horn device;
- 111: outer shell;
- 112: diaphragm;
- 113: washer;
- 114: magnetic element;
- 115: magnetizer;
- 116: circuit board.
- The implementation of the present invention will be described in detail in combination with specific embodiments. Those skilled in the art may understand the advantages and effects of the present invention according to the disclosure of the specification. The present invention can be implemented or applied in other different embodiments. Without departing from the concept of the present invention, various replacements or changes can be made on details in the specification according to different opinions and applications. In addition, it is declared in advance that the drawings of the present invention are only considered to be schematic illustrations, and are not prepared according to actual dimensions. Related technical contents of the present invention will be further described in detail in combination with the following implementations, but the disclosures shall not be construed as restriction to the scope of the present invention.
- It should be understood that terms such as first, second, third and the like may be used herein solely to describe various elements or signals without restriction to these elements or signals. These terms are mainly used to distinguish one element or one signal from another. Further, the term "or" used herein should possibly include any and all combinations of one or more listed elements associated by the conjunctive term.
- The embodiment discloses a micro-coil element, an array micro-coil element formed by a plurality of micro-coil elements, and a device realizing a magnetic element by use of a single micro-coil element or an array micro-coil element.
- Referring to
FIG. 1 , which shows an embodiment of a basic structure of the micro-coil element. The micro-coil element may be printed, masked and etched on a substrate (such as an insulator) to form acontinuous metal wire 10, and an electrical contact may be formed at each end of themetal wire 10. Afirst electrode 11 at one end may be used as a negative electrode of the micro-coil element, and asecond electrode 12 at the other end may be used as a positive electrode of the micro-coil element. - After the micro-coil element is energized by connecting a power supply, the standing current flowing through the micro-coil element may form a uniform magnetic field thereon, wherein parameters that define the impedance value of the overall micro-coil element include material, a wire width, a wire length and a number of circles of the
metal wire 10. Therefore, to design the micro-coil element, it is necessary to know the impedance and the magnetic field conditions required. - Referring to
FIG. 2 , which is a schematic diagram of an embodiment of the wiring on the micro-coil element, according to main implementation of the micro-coil element of the embodiment, a plurality of breakpoints are formed on the metal wire on the micro-coil element according to requirements. - The micro-coil element of the embodiment includes at least one wiring layer and one electrode layer. When more than two wiring layers are disposed, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers. Each of the wiring layers is provided with more than one micro-coil unit.
-
FIG. 2 is a structural diagram of the wiring layer of the micro-coil element of the embodiment, which only includes one micro-coil unit. The micro-coil unit is provided with a plurality of metal line segments (201, 202, ..., 210) which start from one starting point and coil around the starting point to form a plurality of circles of continuous wiring. The starting point may be disposed at any position on the micro-coil element, preferably, but not limited to the vicinity of the central area of the micro-coil element. The starting point may be located according to actual requirements. The starting point forms afirst electrode 21, such as the negative electrode of the micro-coil element; and the end of the metal line segments, namely, the end of the plurality of metal line segments of continuous wiring, forms asecond electrode 22 of the micro-coil element, which may be used as the positive electrode of the micro-coil element. - The plurality of metal line segments (201, 202, ..., 210) each have two endpoints, the one is a first electrode terminal, such as the end of the
first electrode 21 formed proximal to the starting point; and the other is a second electrode terminal, which is the endpoint proximal to the end of the metal line segments. - Then referring to
FIG. 3 , which shows anelectrode layer 30 of the micro-coil element, which is provided withcontacts 31 corresponding to two ends of the plurality of metal line segments on the wiring layer, and electrodes corresponding to thefirst electrode 21 and thesecond electrode 22, such as a first electrode contact 21' and asecond electrode contact 22'. - According to the structural features of the wiring layer of the micro-coil element in
FIGS. 2 and3 , the proposed design of the micro-coil element may define a total length, a wire width, a wire spacing between any two adjacent metal line segments, a segment length, a number of circles, a circle span and/or the material of the plurality of metal line segments according to actual requirements (such as impedance value, magnetic field or size). The actual requirements mainly refer to the requirements of the micro-coil device, and it may also be decided based on the requirements to use the single micro-coil element, or a plurality of micro-coil units arranged in an array on each wiring layer of the embodiment, as shown inFIGS. 4A to 4D . - Referring to
FIG. 4A , an arraymicro-coil element 40 is composed of a plurality ofmicro-coil units 20 arranged in an array, wherein the shape of the arraymicro-coil element 40 and the number of micro-coil elements are not intended to limit its implementation scope. - Similarly, each micro-coil unit illustrated is also provided with a plurality of metal line segments which start from one starting point and coil around the starting point to form a plurality of circles of continuous wiring, and an electrode layer, in which at least one first electrode area and at least one second electrode area are separately disposed to assemble the first electrode terminal and the second electrode terminal of each of the metal line segments, and they may be designed as one or more first electrode areas and second electrode areas according to actual requirements. It is worth noting that the first electrode area and the second electrode area assembling the first electrode terminal and the second electrode terminal of each of the metal line segments may realize the function of assembling the electrode terminals by use of an electrical connection layer of another element. For example, in the electrical connection layer, a plurality of metal wires may direct the first electrode terminal of each of the metal line segments on the wiring layer to the first electrode area on the electrode layer through vias or leads on the substrate, and also direct the second electrode terminal of each of the metal line segments to the second electrode area on the electrode layer.
- Referring to
FIG. 4A , all coil elements in the array micro-coil element share the same shape and size. Referring toFIGS. 4B and4C , in addition to the above-mentioned embodiments, a plurality of micro-coil elements different in shapes or sizes are disposed in the array micro-coil element according to actual requirements (such as the requirement of magnetic field). -
FIG. 4B shows an embodiment of another arraymicro-coil element 41, which is composed of a plurality ofmicro-coil units 20 arranged in an array. In a circuit layout covering the plurality ofmicro-coil units 20, amicro-coil unit 411 covering a relatively large (millimeter-sized) area may be designed to meet the requirement of a magnetic field. The position of themicro-coil unit 411 is not limited to that inFIG. 4B , and themicro-coil units 20 around or by the side of themicro-coil unit 411 may interact therewith (such as magnetic field amplification or offset), so that the overall arraymicro-coil element 41 meets the design requirement for specified magnetic field. -
FIG. 4C shows an embodiment of another arraymicro-coil element 42. The example shows that in the magnetic field design of one magnetic element, a relatively largemicro-coil unit 421 may be disposed among a plurality ofmicro-coil units 20 in an array, and themicro-coil unit 421 may be different from themicro-coil units 20 in shape. Similarly, themicro-coil unit 421 may also interact with the nearbymicro-coil units 20 to produce magnetic field amplification or offset effects to different extents, thus obtaining an equivalent magnetic field to meet the requirements. - Referring to
FIG. 4D , which shows an embodiment of another arraymicro-coil element 43, in which an outer coil unit is disposed to encircle one or more micro-coil elements according to requirement of the equivalent magnetic field. Anouter coil unit 431 is formed on an outer circle of a plurality ofmicro-coil units 20 arranged in an array, and theouter coil unit 431 encircles the plurality ofmicro-coil units 20 within an inner circle. Similarly, according to the requirement of specified magnetic element, the illustrated arraymicro-coil element 43 may be obtained depending on number, area, length and thickness of line segments of themicro-coil units 20 in combination with the design of theouter coil unit 431. - It is worth noting that, in addition to the design that is specially considered for specific purpose, according to the main embodiments, each single micro-coil unit of
FIGS. 2 ,4A to 4D allows to produce an electric current flowing through the plurality of metal line segments in a constant direction upon energization, thus producing an equivalent magnetic field by use of one multi-turn coil. Further, with the arraymicro-coil elements micro-coil elements 20, one overall equivalent magnetic field may be produced to eliminate weak and inhomogeneous magnetic fields on the edge of individual micro-coil element. - It is worth noting that different designs of the illustrated
micro-coil units 20 or various array micro-coil elements (40, 41, 42 and 43) may be used in combination and not limited to that in the Figures, and the starting point of the plurality of metal line segments in each micro-coil unit (such as thefirst electrode 21 inFIG. 2 ) may be the electrode terminal proximal to the central area, or located at any position off the center according to actual design. - In addition to the micro-coil elements shown in
FIGS. 2 ,3 or4A to 4D , referring toFIG. 5A , which is a schematic diagram of an embodiment of amicro-coil unit 50 formed by a single micro-coil element. Themicro-coil unit 50 has a starting point (such as the electrode terminal proximal to the central area), which forms a first electrode of the single micro-coil element and may be a negative electrode of an overall element. A plurality of metal line segments start from the starting point. As shown in the figure, the plurality of metal line segments of continuous wiring coil around the starting point to form a concentric polygon, and the end of the metal line segments forms a second electrode as a positive electrode of the overall element. - Referring to
FIG. 5B , which is a schematic diagram of an embodiment of anothermicro-coil unit 52 formed by a single micro-coil element. In themicro-coil unit 52, a plurality of metal line segments coil around a starting point to form one concentric circle in the example, in which the starting point of the plurality of metal line segments forms a first electrode and the end forms a second electrode. - Then referring to
FIG. 6 , which is a schematic diagram of an embodiment in which an electrode layer of a micro-coil element assembles an electrode terminal of each metal line segment, wherein a negativeelectrode assembling layer 60 assembles a first electrode terminal (such as the negative electrode) of each metal line segment on the above-mentioned wiring layer. It shows that, for example, a pad, namely anelectrode area 61, has an area sufficient to connect to a plurality ofmetal wires 63, and themetal wires 63 on the negativeelectrode assembling layer 60 are used to direct the wiring of the negative electrode of each metal line segment on the wiring layer. -
FIG. 7 is a schematic diagram of an embodiment in which the electrode layer of the micro-coil element assembles another electrode terminal (such as the positive electrode) of each metal line segment. It shows a positiveelectrode assembling layer 70 provided with anelectrode area 71, which is designed to have an area sufficient to connect to a plurality ofmetal wires 73. Similarly, themetal wires 73 on the positiveelectrode assembling layer 70 are used to direct the wiring of the positive electrode of each metal line segment on the wiring layer. - According to the embodiment, the electrode designs shown in
FIGS. 6 and 7 may be two printed circuits disposed on the same electrode layer, or two printed circuits separately disposed on different electrode layers. Alternatively, referring toFIG. 8 , which is a schematic diagram of an embodiment of the electrode assembling layer of the micro-coil element, in which anelectrode layer 80 is provided with afirst electrode area 81 and asecond electrode area 82, so that the positive electrode of each of the metal line segments on the wiring layer is directed to thefirst electrode area 81 and the negative electrode is directed to thesecond electrode area 82 through the vias or the leads. - On the whole, on one electrode layer of each micro-coil element or one additional electrical connection layer, a plurality of metal wires are provided to direct the first electrode terminal of each of the metal line segments on the wiring layer to the
first electrode area 81 and the second electrode terminal of each of the metal line segments to thesecond electrode area 82. - For electrical design, the first electrode terminal of each of the metal line segments on the wiring layer is negative and the second electrode terminal is positive. The positive electrodes of the plurality of metal line segments are connected through the vias in a parallel manner, and the negative electrodes are connected through the vias in a parallel manner. Alternatively, referring to
FIGS. 4A to 4D , which show various array micro-coil elements, the plurality of micro-coil elements each connect the first electrode area and the second electrode area on the electrode layer to the major negative electrode contact area (such as theelectrode area 61 and the first electrode area 81) and the major positive electrode contact area (such as theelectrode area 71 and the second electrode area 82) realized inFIG. 6, 7 or8 through the vias, respectively, so as to connect the plurality of micro-coil elements on the array micro-coil element in a parallel manner. -
FIG. 9 shows another embodiment, which is a schematic diagram of a mixed layer provided with a contact unit (such as acontact unit 30 inFIG. 3 ) and an electrode unit (such as thefirst electrode area 81 and thesecond electrode area 82 inFIG. 8 ) corresponding to the single micro-coil element in the array micro-coil element. - According to the design of array micro-coil element, the wiring design for directing the electrode of each single micro-coil element is not limited to certain embodiments, the additional design of wiring layer shown in
FIG. 9 is also allowed, wherein the plurality ofcontact units 30 with electrode contacts are disposed within a portion of space, and direct the electrode terminal of each of the metal line segments on the wiring layer toelectrode units - When the micro-coil element or the array micro-coil element is designed, as each micro-coil element may be customized in size and shape to fit the product, and flexibility is improved based on multi-segment miniaturization design, a total length, a wire width, a wire spacing between any two adjacent metal line segments, a segment length, a number of circles, a circle span and/or the material of the plurality of metal line segments may be defined according to actual requirements in terms of impedance value, magnetic field or product size and shape, and the spacing between two adjacent micro-coil units and/or the number of all micro-coil elements may also be considered.
- In another embodiment, a multi-layer structure may also be designed according to the requirements. The multi-layer structure covers the wiring layer and the electrode layer, or the additional electrode (positive electrode and negative electrode) assembling layer for assembling all electrode lines, in which the micro-coil elements may be connected in parallel through the vias or the leads. In addition, the micro-coil elements take into account the above-mentioned design parameters as well as the shape of the continuous multi-segment metal winding, including the segment width, segment length, total number of circles, the circle span and the total length.
- To determine the parameters, the equivalent magnetic field produced by use of all micro-coil elements should be one of the main considerations. Further, an array micro-coil element may be designed as shown in
FIG. 10 , which also shows a schematic diagram of a magnetic field distribution. - As each single micro-coil element shown in (but not limited to)
FIGS. 2 ,5A and 5B will produce an equivalent magnetic field by use of one multi-turn coil after being energized, in which the magnetic field intensity may be controlled by the current flowing through. However, the magnetic field may change remarkably at the edge of the single micro-coil element. Generally, it is shown that the magnetic field intensity decreases from the central area to the edge of the single micro-coil element. A large and uniform magnetic field may be produced with reference toFIG. 10 , which is a schematic diagram of the magnetic field produced by use of the array micro-coil element composed of the plurality of micro-coil elements. Due to the plurality of micro-coil elements, the uniform magnetic field produced as a whole may eliminate the weak and inhomogeneous magnetic fields on the edge of individual micro-coil element. After being energized, the plurality of micro-coil elements are able to be homogenized as a whole to produce one wide-covered equivalent magnetic field. - In another embodiment, in order to further improve the magnetic field intensity of the micro-coil, the micro-coil element also includes at least one magnetic conductive layer, the magnetic conductive layer is made from magnetic conductive substance, and an insulating layer is disposed between the magnetic conductive layer and the wiring layer.
- The micro-coil elements described in the above-mentioned embodiments are mainly applied as the magnetic elements in the electronic devices. As the micro-coil element is small in dimensions (for example, a 65 nm-nanometre process is adopted in prior art, so that the wire diameter (wire width) and wire spacing are at micron level or nanometer level), in an earphone device shown in
FIG. 11 , it requires less space and provides the advantage of covering multifrequency band by use of a plurality of units. - For example, referring to
FIG. 11 , which shows ahorn device 11, wherein its structure mainly includes anouter shell 111, adiaphragm 112, awasher 113, amagnetic element 114, amagnetizer 115 and acircuit board 116. The one or more micro-coil elements at least realize themagnetic element 114 in thehorn device 11, and may supply power to themagnetic element 114 in the device after connecting thecircuit board 116 to one power supply. Further, themagnetic element 114 may be the single micro-coil element or the array micro-coil element proposed in the above-mentioned embodiments, and themagnetic element 114 may be designed with a plurality of layers of micro-coil elements or array micro-coil elements according to requirements for impedance value, magnetic field or size. - Generally, the
horn device 11 or the unit in the earphone is formed by a voice coil including the cone-shapeddiaphragm 112, themagnetic element 114 and themagnetizer 115. When the current flows through themagnetic element 114, a magnetic field is produced, which interacts with themagnetizer 115 to move the voice coil. If the direction of the current in themagnetic element 114 is continuously changed, a magnetic field with opposite polarity will be produced, thus changing the movement direction of the voice coil and driving thediaphragm 112. According to the embodiment, themagnetic element 114 may be realized by the single micro-coil element or the array micro-coil element. The micro-coil element produces a magnetic field after being energized, and drives the voice coil in a more nuanced manner to output better sound depending on improved impedance control. - The coil element of the magnetic element is mostly disposed on a wafer. In order to further improve the magnetic field intensity of the magnetic element, the wafer may be disposed as a magnetic wafer. The said magnetic wafer may be obtained by doping magnetic conductive substance into the wafer, or coating the back of the wafer with a layer of magnetic conductive substance before or after the fabrication of the magnetic element.
- To sum up, the various implementation forms of the micro-coil elements described in the above-mentioned embodiments show that the magnetic element in the electronic device is able to be realized by a single micro-coil element or an array micro-coil element including a plurality of micro-coil elements. In particular, since the micro-coil elements each include a plurality of metal line segments, compared with the coil design in the prior art, the concept of the micro-coil design disclosed is to stack the magnetic fields by arrangement of a plurality of unconnected lines in a coiling manner, thereby increasing the current density and reducing the total resistance in a parallel manner. In this way, for electrical design, the negative electrodes of the plurality of line segments of the micro-coil elements may be connected to one negative electrode contact area, and the positive electrodes of the plurality of line segments of the plurality of micro-coil elements may be connected to one positive electrode contact area. The plurality of metal line segments are able to be connected in parallel with one another, and they also may be connected in parallel to the major negative electrode contact area and the major positive electrode contact area separately, thus realizing a wiring design that the plurality of micro-coil elements are connected in parallel with one another. According to actual situation, the metal line segments of the micro-coil elements may be designed with various wiring parameters including impedance value, magnetic field or size for multiple purposes.
- The disclosures above are only preferred and feasible embodiments of the present invention and should not be construed as limiting the application scope. Therefore, any equivalent technical changes made according to the specification and drawings of the present invention shall fall within the patent scope claimed by the invention.
Claims (26)
- A micro-coil element, characterized by comprising:at least one wiring layer, provided with a plurality of metal line segments, which start from one starting point and coil around the starting point to form a plurality of circles of continuous wiring, with each of the metal line segments ended with one first electrode terminal and one second electrode terminal, wherein the starting point is one first electrode of the micro-coil element, and the end of the plurality of metal line segments of continuous wiring is one second electrode of the micro-coil element; andone electrode layer, provided with at least one first electrode area and at least one second electrode area, wherein the at least one first electrode area is used for assembling the first electrode terminal of each of the plurality of metal line segments, and the at least one second electrode area is used for assembling the second electrode terminal of each of the plurality of metal line segments.
- The micro-coil element according to claim 1, characterized in that the electrode layer is provided with a plurality of metal wires, which are used to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area and direct the second electrode terminal of each of the metal line segments on the wiring layer to the said at least one second electrode area.
- The micro-coil element according to claim 1, characterized by further comprising at least one electrical connection layer, wherein a plurality of metal wires are disposed on the said electrical connection layer to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area on the electrode layer and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area on the electrode layer.
- The micro-coil element according to claim 2, characterized in that the first electrode terminal of each of the metal line segments on the said wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- The micro-coil element according to claim 3, characterized in that the first electrode terminal of each of the metal line segments on the said wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- The micro-coil element according to any of claim 1, characterized in that the starting point defines the first electrode of the micro-coil element, and the plurality of metal line segments of continuous wiring coil around the starting point to form one concentric circle or one concentric polygon.
- The micro-coil element according to any of claim 2, characterized in that the starting point defines the first electrode of the micro-coil element, and the plurality of metal line segments of continuous wiring coil around the starting point to form one concentric circle or one concentric polygon.
- The micro-coil element according to any of claim 3, characterized in that the starting point defines the first electrode of the micro-coil element, and the plurality of metal line segments of continuous wiring coil around the starting point to form one concentric circle or one concentric polygon.
- The micro-coil element according to claim 1, characterized in that when the micro-coil element comprises more than two wiring layers, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers.
- The micro-coil element according to claim 9, characterized in that the said micro-coil element further comprises at least one magnetic conductive layer, the said magnetic conductive layer is made from a magnetic conductive substance, and an insulating layer is disposed between the said magnetic conductive layer and the wiring layer.
- An array micro-coil element, characterized by comprising:at least one wiring layer, provided with a plurality of micro-coil units, wherein the said micro-coil units each comprise a plurality of metal line segments starting from one starting point and coiling around the starting point to form a plurality of circles of continuous wiring, the metal line segments each end with one first electrode terminal and one second electrode terminal, the starting point is one first electrode of the micro-coil units, and the end of the plurality of metal line segments of continuous wiring is one second electrode of the micro-coil units; andone electrode layer, provided with at least one first electrode area and at least one second electrode area, wherein the at least one first electrode area is used for assembling the first electrode terminal of each of the plurality of metal line segments, and the at least one second electrode area is used for assembling the second electrode terminal of each of the plurality of metal line segments.
- The array micro-coil element according to claim 11, characterized in that the electrode layer is provided with a plurality of metal wires, which are used to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area.
- The array micro-coil element according to claim 11, characterized in that the said array micro-coil element further comprises at least one electrical connection layer, a plurality of metal wires are disposed on the said electrical connection layer to direct the first electrode terminal of each of the metal line segments on the wiring layer to the at least one first electrode area on the electrode layer and direct the second electrode terminal of each of the metal line segments to the at least one second electrode area on the electrode layer.
- The array micro-coil element according to claim 12, characterized in that the first electrode terminal of each of the metal line segments on the wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- The array micro-coil element according to claim 13, characterized in that the first electrode terminal of each of the metal line segments on the wiring layer is negative, the second electrode terminal is positive, and the positive electrodes of the plurality of metal line segments are connected through vias in a parallel manner, and the negative electrodes of the plurality of metal line segments are connected through vias in a parallel manner.
- The array micro-coil element according to claim 12, characterized in that each wiring layer corresponds to one major negative electrode contact area and one major positive electrode contact area, wherein the plurality of micro-coil units on each wiring layer connect the at least one first electrode area and the at least one second electrode area on the electrode layer separately to the major negative electrode contact area and the major positive electrode contact area through the vias, thus connecting the plurality of micro-coil elements in a parallel manner.
- The array micro-coil element according to claim 13, characterized in that each wiring layer corresponds to one major negative electrode contact area and one major positive electrode contact area, wherein the plurality of micro-coil units on each wiring layer connect the at least one first electrode area and the at least one second electrode area on the electrode layer separately to the major negative electrode contact area and the major positive electrode contact area through the vias, thus connecting the plurality of micro-coil elements in a parallel manner.
- The array micro-coil element according to claim 11, characterized in that when the array micro-coil element comprises more than two wiring layers, they are arranged in a stacked manner, with one insulating layer disposed between any two adjacent wiring layers.
- The array micro-coil element according to claim 18, characterized in that the said micro-coil element further comprises at least one magnetic conductive layer, the said magnetic conductive layer is made from the magnetic conductive substance, and an insulating layer is disposed between the said magnetic conductive layer and the wiring layer.
- The array micro-coil element according to claim 11, characterized in that the said array micro-coil element is provided with the micro-coil units having the same or different shapes or sizes.
- The array micro-coil element according to claim 20, characterized in that the wiring layer of the said array micro-coil element is further provided with one outer coil unit encircling the one or more micro-coil units.
- A micro-coil device, characterized by comprising:at least one magnetic element, comprising a micro-coil element; andone circuit board, connected to one power supply and used for supplying power to the at least one magnetic element;wherein, the micro-coil element comprises:at least one wiring layer, comprising one or more than two coil units, wherein the coil unit is provided with a plurality of metal line segments starting from one starting point and coiling around the starting point to form a plurality of circles of continuous wiring, each of the metal line segments ends with one first electrode terminal and one second electrode terminal, the starting point is one first electrode of the micro-coil element, and the end of the plurality of metal line segments of continuous wiring is one second electrode of the micro-coil element; andone electrode layer, provided with at least one first electrode area and at least one second electrode area, wherein the at least one first electrode area is used for assembling the first electrode terminal of each of the plurality of metal line segments, and the at least one second electrode area is used for assembling the second electrode terminal of each of the plurality of metal line segments.
- The micro-coil device according to claim 22, characterized in that the said magnetic element is a single micro-coil element or an array micro-coil element.
- The micro-coil device according to claim 22, characterized in that the said wiring layer is provided with more than two micro-coil units, and the said more than two micro-coil units have the same or different shapes or sizes.
- The micro-coil device according to claim 24, characterized in that the said wiring layer is further provided with one outer coil unit encircling one or more micro-coil units.
- The micro-coil device according to claim 22, characterized in that the said magnetic element further comprises one wafer, the said magnetic element is disposed on the wafer, and the said wafer is a magnetic wafer.
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PCT/CN2020/135698 WO2022120798A1 (en) | 2020-12-11 | 2020-12-11 | Microcoil element, array type microcoil element, and device |
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EP4116994A1 true EP4116994A1 (en) | 2023-01-11 |
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EP20964734.6A Pending EP4116994A4 (en) | 2020-12-11 | 2020-12-11 | Microcoil element, array type microcoil element, and device |
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WO (1) | WO2022120798A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE4117878C2 (en) * | 1990-05-31 | 1996-09-26 | Toshiba Kawasaki Kk | Planar magnetic element |
US20010011948A1 (en) * | 2000-02-07 | 2001-08-09 | Rasband Paul B. | Method of manufacturing resonant circuit devices |
US7791440B2 (en) * | 2004-06-09 | 2010-09-07 | Agency For Science, Technology And Research | Microfabricated system for magnetic field generation and focusing |
CN101345466B (en) * | 2008-08-28 | 2010-12-08 | 上海交通大学 | Moving coil type micro-mechanical electromagnetic vibration energy acquisition device based on upconversion |
CN102936754B (en) * | 2012-11-22 | 2014-06-04 | 清华大学 | Cellular array chip based on adjustable micromagnetic field |
TWI466003B (en) * | 2012-12-26 | 2014-12-21 | Hannstouch Solution Inc | Touch panel |
CN106531410B (en) * | 2015-09-15 | 2019-08-27 | 臻绚电子科技(上海)有限公司 | Coil, inductance element and application and preparation are in the method for the coil of inductance element |
DE102016110425B4 (en) * | 2016-06-06 | 2023-07-20 | X-Fab Semiconductor Foundries Gmbh | SEMICONDUCTOR TRANSFORMER |
CN108735439B (en) * | 2018-05-25 | 2023-11-17 | 昆山联滔电子有限公司 | Film coil and electronic device |
US11011303B2 (en) * | 2018-08-21 | 2021-05-18 | Globalfoundries U.S. Inc. | Dummy fill with eddy current self-canceling element for inductor component |
CN109524216A (en) * | 2019-01-10 | 2019-03-26 | 广西芯百特微电子有限公司 | A kind of distribution wire-wound inductor device and device |
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WO2022120798A1 (en) | 2022-06-16 |
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