CN108735439B - Film coil and electronic device - Google Patents
Film coil and electronic device Download PDFInfo
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- CN108735439B CN108735439B CN201810517534.XA CN201810517534A CN108735439B CN 108735439 B CN108735439 B CN 108735439B CN 201810517534 A CN201810517534 A CN 201810517534A CN 108735439 B CN108735439 B CN 108735439B
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- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000010409 thin film Substances 0.000 claims description 27
- 239000010408 film Substances 0.000 claims description 26
- 238000004146 energy storage Methods 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 230000005291 magnetic effect Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 238000010248 power generation Methods 0.000 description 12
- 230000005672 electromagnetic field Effects 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/006—Details of transformers or inductances, in general with special arrangement or spacing of turns of the winding(s), e.g. to produce desired self-resonance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2871—Pancake coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
Abstract
The invention discloses a film coil and an electronic device. Wherein, this film coil includes: a first substrate; the first outgoing line and the plurality of first opening coils which are sequentially arranged in a layer-by-layer surrounding mode are positioned on the first surface of the first substrate, and the first outgoing line penetrates through the openings of the plurality of first opening coils; the first continuous coil comprises a plurality of circles of first sub-coils which are spirally arranged on the second surface of the first substrate, a first series section positioned at the head end of the first sub-coil arranged at the innermost part is electrically connected with one end of the first outgoing line, which is close to the first opening coil arranged at the innermost part, through a via hole, the first series sections of the other first sub-coils are connected with first parallel sections of the first sub-coils arranged adjacent to the first series section, and two ends of the first parallel sections of the first sub-coils are respectively electrically connected with two ends of the corresponding first opening coil through via holes. The technical scheme of the embodiment of the invention can reduce the volume of the coil in the non-contact power transmission equipment.
Description
Technical Field
The present disclosure relates to wireless charging, and particularly to a thin film coil and an electronic device.
Background
Wireless charging, also known as inductive charging or non-contact inductive charging, uses near field induction, i.e. inductive coupling, to transfer energy from a power supply device to a powered device. The general technology is that a coil is arranged in a charger (i.e. a non-contact electric energy transmission device), an electromagnetic field in a certain direction can be generated after the charger is electrified, an alternating current electromagnetic field can be generated if alternating current is applied, and if another coil is arranged in an electric device (i.e. a non-contact electric energy receiving device) to receive the alternating current electromagnetic field, the alternating current electromagnetic field can be converted into electric energy, and the electric device can be supplied with power or a rechargeable battery in the electric device can be charged. Since the charger and the power utilization device transfer energy in inductive coupling, no wire connection is necessary.
In the related art, a coil in a charger, a charging device, or the like employs a general wire-type coil (wire-type coil). Therefore, the coils are wound in an overlapping, stacked manner. This causes a defect that the thickness of the non-contact power transmission device increases due to an increase in the thickness of the coil and the number of turns of the coil.
Disclosure of Invention
The embodiment of the invention provides a film coil and an electronic device, which are used for reducing the volume of the coil and further reducing the volume of non-contact power transmission equipment.
In a first aspect, an embodiment of the present invention provides a thin film coil, including:
a first substrate;
the first opening coils are positioned on the first surface of the first substrate and are sequentially arranged in a layer-by-layer surrounding mode;
the first outgoing line is positioned on the first surface of the first substrate and penetrates through the openings of the plurality of first opening coils;
the first continuous coil is positioned on a second surface opposite to the first surface of the first substrate, the first continuous coil comprises a plurality of circles of first sub-coils which are spirally arranged on the second surface, each first sub-coil comprises a first parallel section and a first serial section, the first serial section positioned at the head end of the first sub-coil arranged at the innermost part is electrically connected with one end of the first opening coil arranged at the innermost part, which is close to the first outgoing line, through a via hole, the first serial sections of the other first sub-coils are connected with the first parallel sections of the first sub-coils arranged adjacent to the first serial section, and two ends of the first opening coil are electrically connected with two ends of the corresponding first parallel section of the first sub-coil through via holes.
The invention arranges a plurality of first opening coils which are orderly arranged in a layer-by-layer surrounding way on the first surface of the first substrate; the first outgoing line passes through the openings of the plurality of first opening coils; the first continuous coil is arranged on a second surface opposite to the first surface of the first substrate, the first continuous coil comprises a plurality of coils of first sub-coils which are spirally arranged on the second surface, a first series section positioned at the head end of the first sub-coil arranged at the innermost part is electrically connected with one end of a first lead-out wire which is close to the first opening coil arranged at the innermost part through a through hole, the first series sections of the other first sub-coils are connected with the first parallel sections of the first sub-coils which are adjacently arranged, two ends of the first opening coil are respectively electrically connected with two ends of the first parallel sections of the corresponding first sub-coils through the through holes, and the innermost end of the coil is led out through the first lead-out wire, so that the coil with required turns is formed on the first substrate.
Drawings
FIG. 1 is a schematic diagram of an explosion structure of a film coil according to an embodiment of the present invention;
fig. 2 is a schematic top view of a film coil along the AA' direction in fig. 1 according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a film coil according to an embodiment of the present invention along a direction opposite to the AA' direction in FIG. 1;
fig. 4 is a schematic top view of a thin film coil according to an embodiment of the present invention along a direction in which a first surface of a second substrate points to a second surface;
fig. 5 is a schematic top view of a thin film coil according to an embodiment of the present invention along a direction of a second surface of a second substrate pointing to a first surface;
FIG. 6 is a schematic cross-sectional view of a thin film coil along the BB' direction in FIG. 4 according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of another electronic device according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another electronic device according to an embodiment of the invention.
Description of the embodiments
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
The embodiment of the invention provides a film coil. Fig. 1 is an exploded view of a film coil according to an embodiment of the present invention. Fig. 2 is a schematic top view structure of a thin film coil in the AA' direction in fig. 1 (i.e., in a direction along which the first surface of the first substrate points to the second surface), that is, a schematic distribution diagram of coil patterns on the first surface of the first substrate according to an embodiment of the present invention. Fig. 3 is a schematic top view structure diagram of a thin film coil in a direction opposite to the AA' direction in fig. 1 (i.e., in a direction along which the second surface of the first substrate points to the first surface), that is, a schematic distribution diagram of coil patterns on the second surface of the first substrate according to an embodiment of the present invention. The film coil can be arranged in non-contact power transmission equipment, and can be a wireless charger, an electric device and the like. As shown in connection with fig. 1, 2 and 3, the thin film coil includes: the first substrate 100, the plurality of first opening coils 110, the first lead lines 120, and the first continuous coil 130.
The first opening coils 110 are located on the first surface 101 of the first substrate 100, and the first opening coils 110 are sequentially arranged in a layer-by-layer surrounding manner; the first lead wires 120 are located on the first surface 101 of the first substrate 100, and the first lead wires 120 pass through the openings 111 of the plurality of first opening coils 110; the first continuous coil 130 is located on the second surface 102 opposite to the first surface 101 of the first substrate 100, the first continuous coil 130 includes a plurality of first sub-coils 131 spirally arranged on the second surface 102, the first sub-coils 131 include a first parallel section 132 and a first serial section 133, the first serial section located at the head end of the first sub-coil 131 arranged at the innermost position (i.e. the innermost end of the first continuous coil 130) is electrically connected to one end of the first outgoing line 120 (i.e. the innermost end of the first outgoing line 120) near the first open coil 110 arranged at the innermost position through the via 140, the first serial sections 133 of the remaining first sub-coils 131 are connected to the first parallel sections 132 of the first sub-coils 131 arranged adjacent thereto, and both ends of the first open coil 110 are electrically connected to both ends of the corresponding first parallel sections 132 of the first sub-coils 131 through the via 140, respectively.
The first substrate 100 may be a substrate having a relatively thin thickness, and coil patterns may be formed on both opposite surfaces of the first substrate, for example, flexible printed circuit boards (Flexible Printed Circuit Board, FPCBs). The first split coil 110, the first outgoing line 120, and the first continuous coil 130 may be thin films made of a conductive material, for example, copper. The adjacent first opening coils 110 are maintained at a predetermined interval therebetween so that the electrical signals are not coupled or affected with each other. The adjacent first sub-coils 131 maintain a predetermined interval therebetween so that the electrical signals are not coupled to or affected by each other. The first lead wire 120 maintains a predetermined distance from the first opening coil 110 so that the electrical signals are not coupled to or affected by each other. The first opening coil 110 and the first sub-coil 131 may be circular or polygonal, and fig. 1 illustrates a case where the first opening coil 110 and the first sub-coil 131 are quadrangular, and fig. 2 and 3 illustrate a case where the first opening coil 110 and the first sub-coil 131 are circular. Fig. 2 and 3 are schematic diagrams of the coil patterns on the front and back sides of the same film coil, respectively. The first lead wire 120 may be a straight line, a diagonal line, or a curved line. The coil pattern of the thin film coil can be produced by sputtering, vapor deposition, electroplating, electroless plating, coating, gravure/relief printing, screen printing, yellow light process (exposure lithography), film pasting, transfer printing, etc.
As shown in fig. 2 and 3, the current may first flow from the outermost end of the first lead-out wire 120 to the innermost end, and flow into the second surface 102 of the first substrate 100 through the via hole 140, and then flow into the multi-turn first sub-coil 131 of the first continuous coil 130, and at the corresponding via hole 140, the current is split to the first open coil 110 parallel to the first parallel segment 132 of the first sub-coil 131, and is converged to the first continuous coil 130 through the other via hole 140 until the current flows out from the outermost end of the first continuous coil 130. Therefore, the current flowing mode flows to the second surface first and then is crossed, the current is not directly cut into the first surface, the influence of the outgoing line on the coil can be reduced, and the degree of freedom of the wireless charging system is improved.
It should be noted that, the two ends of the first opening coil 110 are electrically connected to the two ends of the first parallel section 132 of the corresponding first sub-coil 131 through the via hole 140, so that the first opening coil 110 is parallel to the first parallel section 132 of the corresponding first sub-coil 131.
According to the technical scheme, a plurality of first opening coils which are sequentially arranged in a layer-by-layer surrounding mode are arranged on the first surface of the first substrate; the first outgoing line passes through the openings of the plurality of first opening coils; the first continuous coil is arranged on the second surface opposite to the first surface of the first substrate, the first continuous coil comprises a plurality of coils of first sub-coils which are spirally arranged on the second surface, the innermost end of the first continuous coil is electrically connected with the innermost end of the first outgoing line through a via hole, the first serial sections of the other first sub-coils are connected with the first parallel sections of the first sub-coils which are adjacently arranged, the two ends of the first open coil are respectively electrically connected with the two ends of the first parallel sections of the corresponding first sub-coils through the via hole, and the innermost end of the coil is led out through the first outgoing line, so that the coil with the required turns is formed on the first substrate.
Optionally, with continued reference to fig. 2 based on the above embodiment, the film coil further includes two first contact pads (contact pads) 150 located on the first surface 101 of the first substrate 100, and the first contact pads 150 are electrically connected to ends of the first open coil 110 arranged at the outermost portion (the ends are electrically connected to the outermost ends of the first continuous coil 130 through vias) and the first lead wires 120 near one ends of the first open coil 110 arranged at the outermost portion (i.e., the outermost ends of the first lead wires 120), respectively.
Optionally, with continued reference to fig. 1, 2 and 3, the plurality of first split coils 110 and the plurality of first sub-coils 131 of the first continuous coil 130 are disposed in a one-to-one facing relationship in a direction perpendicular to the first surface 101 of the first substrate 100. The facing first split coil 110 has the same surrounding area as the first sub-coil 131, and the induced electromotive force generated by the external magnetic field (which may be in a direction perpendicular to the first surface of the first substrate) is equal.
The embodiment of the invention provides a thin film coil. Fig. 4 is a schematic top view of a thin film coil according to an embodiment of the present invention, that is, a schematic distribution of coil patterns on a first surface of a second substrate of the thin film coil. Fig. 5 is a schematic top view of a thin film coil according to an embodiment of the present invention, that is, a schematic distribution of coil patterns on a second surface of a second substrate of the thin film coil. Fig. 6 is a schematic cross-sectional view of a thin film coil along the direction BB' in fig. 4 according to an embodiment of the present invention. The film coil can be arranged in non-contact power transmission equipment, and can be a wireless charger, an electric device and the like. As shown in connection with fig. 4, 5 and 6, the thin film coil includes: the second substrate 200, at least one second open coil 210, at least one second continuous coil 220, at least one segment of second lead-out wire 230, at least one third open coil 240, at least one third continuous coil 250, and at least one segment of third lead-out wire 260.
Wherein the at least one second open coil 210 and the at least one second continuous coil 220 are located on the first surface 201 of the second substrate 200, the at least one second continuous coil 220 includes a plurality of second sub-coils 221 arranged in a spiral shape, and the at least one second open coil 210 and the at least one second continuous coil 220 are arranged in a layer-by-layer surrounding manner; at least one section of second lead-out wire 230 located on the first surface 201 of the second substrate 200, the second lead-out wire 230 being located at the opening 211 of the second opening coil 210; at least one third open coil 240 and at least one third continuous coil 250 are located on the second surface 202 opposite to the first surface 201 of the second substrate 200, the at least one third continuous coil 250 comprising a plurality of turns of third sub-coils 251 arranged in a spiral, the at least one third open coil 240 and the at least one third continuous coil 250 being arranged in a layer-by-layer surrounding; the at least one second continuous coil 220 is connected in series with the at least one third continuous coil 250 through a via 270; at least one section of third lead-out wire 260 located at the second surface 202 opposite to the first surface 201 of the second substrate 200, the third lead-out wire 260 being located at the opening 241 of the third opening coil 240; the second lead wire 230 and the third lead wire 260 are connected in series through a via 270; the innermost end of the at least one section of second lead wire 230 and the at least one section of third lead wire 260 connected in series is connected to the head end of the coil arranged at the innermost end; the second sub-coil 221 includes a second parallel section 222 and a second series section 223, and both ends of the third open coil 240 are electrically connected to both ends of the second parallel section 222 of the corresponding second sub-coil 221 through vias 270, respectively, and the second series section 223 of the second sub-coil 221 is connected to the second parallel section 222 of the second sub-coil 221 arranged adjacent thereto; the third sub-coil 251 includes a third parallel section 252 and a third series section 253, and both ends of the second split coil 210 are electrically connected to both ends of the corresponding third parallel section 252 of the third sub-coil 251 through vias 270, respectively, and the third series section 253 of the third sub-coil 251 is connected to the third parallel section 252 of the third sub-coil 251 arranged adjacent thereto.
The second substrate 200 may be a substrate having a relatively thin thickness, and coil patterns may be formed on both opposite surfaces of the second substrate, for example, flexible printed circuit boards (Flexible Printed Circuit Board, FPCBs). The second split coil 210, the second continuous coil 220, the second outgoing line 230, the third split coil 240, the third continuous coil 250, and the third outgoing line 260 may be thin films made of a conductive material, for example, copper. The adjacent coils are kept at a preset interval so that the electric signals are not coupled or affected. The lead wires and the coils keep a preset distance so that electric signals are not coupled or influenced. The second open coil 210, the second sub-coil 221, the third open coil 240, and the third sub-coil 251 may be circular or polygonal, and fig. 4 and 5 exemplarily illustrate a case where the second open coil 210, the second sub-coil 221, the third open coil 240, and the third sub-coil 251 are circular. Fig. 4 and 5 are schematic diagrams of the coil patterns on the front and back sides of the same film coil, respectively. The second and third outlets 230, 260 may be straight or curved.
It should be noted that, the at least one second continuous coil 220 and the at least one third continuous coil 250 are connected in series through the via holes 270, two ends of the third open coil 240 are respectively connected with two ends of the second parallel section 222 of the corresponding second sub-coil 221 through the via holes 270, so that the two ends of the third open coil 240 are connected in parallel with the second parallel section 222 of the corresponding second sub-coil 221, two ends of the second open coil 210 are respectively connected with two ends of the third parallel section 252 of the corresponding third sub-coil 251 through the via holes 270, so that the second open coil 210 is connected in parallel with the third parallel section 252 of the corresponding third sub-coil 251. If the number of the second continuous coils 220 is greater than or equal to 2, the second continuous coils 220 are not adjacent to each other and are spaced apart by at least one second opening coil 210. If the number of the third continuous coils 250 is greater than or equal to 2, the third continuous coils 250 are not adjacent to each other and are spaced apart by the at least one third opening coil 240.
It should be noted that, the innermost end of at least one section of the second lead wire 230 and at least one section of the third lead wire 260 after being connected in series through the via 270 may be connected to the head end of the second open coil 210 arranged innermost on the same surface, and may also be electrically connected to the head end (i.e., innermost end) of the third continuous coil 250 arranged innermost on the opposite surface through the via. The at least one second continuous coil 220 may be wound in the same direction as the at least one third continuous coil 250, either clockwise or counterclockwise, as viewed in the direction in which the first surface of the second substrate points toward the second surface. And the winding direction of the at least one second continuous coil 220 is opposite to that of the at least one third continuous coil 250 from the schematic top view structure of the two surfaces of the second substrate, respectively.
As shown in fig. 4, 5 and 6, the current may first flow into the second lead-out wire 230 located at the outermost end of the coil pattern and flow into the third lead-out wire 260 of the second surface of the second substrate through the via 270, and then flow into the second lead-out wire 230 of the first surface of the second substrate through the other via 270, so as to flow into the second lead-out wire 230 or the third lead-out wire 260 located at the innermost end of the coil pattern, and then flow into the coils connected in series therewith, such as sequentially flow into at least one second continuous coil 220 and at least one third continuous coil 250 connected in series, and at the corresponding via 270, the current is split to the second open coil 210 connected in parallel with the second parallel section 222 of the second sub-coil 221, and is converged to the second continuous coil 220 through the other via 270, and at the corresponding via 270, the current is split to the third open coil 240 connected in parallel with the second parallel section 222 of the third sub-coil 251, and is converged to the third continuous coil 250 through the other via 270, until the current flows from the coil located at the outermost end of the coil pattern. Therefore, the outgoing lines are mutually connected on the first surface and the second surface of the second substrate in a cross mode, current can be cut into the same surface, influence of the outgoing lines on the coil can be reduced, and the degree of freedom of the wireless charging system is improved.
In the technical solution of the present embodiment, at least one second continuous coil 220 is disposed on a first surface of the second substrate, at least one third continuous coil 250 is disposed on a second surface opposite to the first surface 201 of the second substrate 200, the at least one second continuous coil 220 and the at least one third continuous coil 250 are connected in series through a via 270, two ends of the third open coil 240 are respectively electrically connected with two ends of a second parallel section 222 of a corresponding second sub-coil 221 through the via 270, two ends of the second open coil 210 are respectively electrically connected with two ends of a third parallel section 252 of a corresponding third sub-coil 251 through the via 270, and the innermost end of the coil is led out through at least one section of a third lead-out wire 260 disposed at an opening 241 of the third open coil 240 and at least one section of a second lead-out wire 230 disposed at an opening 211 of the second open coil 210, so that compared with the mode of winding on a framework to form a coil, the volume of the coil can be greatly reduced compared with the mode of winding on the framework to form a coil.
Optionally, with continued reference to fig. 4 and 5, the film coil further includes two second contact pads 280 disposed on the same surface of the second substrate 200, where one second contact pad 280 is electrically connected to an end of the coil disposed at the outermost portion (corresponding to an outermost end of the coil) on the same surface, and the other second contact pad 280 is electrically connected to an outermost end (corresponding to an innermost end of the coil) of the at least one section of the second lead-out wire 230 connected in series with the at least one section of the third lead-out wire 260. The two second contact pads 280 may be simultaneously located on the first surface or the second surface of the second substrate. Fig. 4 illustrates a case where two second contact pads 280 are both located on the first surface of the second substrate.
Alternatively, with continued reference to fig. 4 and 5, the second split coil 210 and the third sub-coil 251 are disposed in a one-to-one opposite relationship in a direction perpendicular to the first surface 201 of the second substrate 200; the third opening coils 240 are disposed opposite to the second sub-coils 221 one by one in a direction perpendicular to the first surface 201 of the second substrate 200. The second opening coil 210 facing each other has the same surrounding area as the third sub-coil 251, and the induced electromotive force generated by the external magnetic field (which may be in a direction perpendicular to the first surface of the second substrate) is equal. The opposite third split coil 240 has the same surrounding area as the second sub-coil 221, and the induced electromotive force generated by the external magnetic field (which may be in a direction perpendicular to the first surface of the second substrate) is equal.
The embodiment of the invention provides an electronic device. Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. The electronic device 20 includes a thin film coil provided in any of the embodiments of the present invention.
The electronic device provided by the embodiment of the present invention includes the thin film coil in the foregoing embodiment, so the electronic device provided by the embodiment of the present invention also has the beneficial effects described in the foregoing embodiment, and will not be described herein again. Optionally, the electronic device 20 includes at least one of: fill electric pile, cell-phone, panel computer, intelligent wearable equipment and electric automobile.
The embodiment of the invention provides another electronic device. Fig. 8 is a schematic structural diagram of another electronic device according to an embodiment of the invention. On the basis of the above embodiment, the electronic device further includes a voltage conversion unit 21, where an output end of the voltage conversion unit 21 is electrically connected to the film coil 10, and the voltage conversion unit 21 is configured to convert a voltage at an input end into an ac voltage with a preset frequency and output the ac voltage to the film coil 10, so that the film coil 10 generates a magnetic field with a magnetic field strength that changes regularly in a preset manner, and the magnetic field can act on the film coil of the non-contact power receiving apparatus. The output terminal of the voltage converting unit 21 may be electrically connected to two contact pads of the thin film coil 10 (i.e., two first contact pads of the first substrate or two second contact pads of the second substrate). The input voltage at the input terminal of the voltage converting unit 21 may be a dc voltage, or may be an ac voltage having a frequency different from a predetermined frequency, for example, may be a mains supply. The electronic device can be used as a non-contact power transmission device, and can be a charger, a charging pile and the like.
Optionally, on the basis of the above embodiment, the electronic device further includes a power generation unit, an input end of the voltage conversion unit is electrically connected to an output end of the power generation unit, and the power generation assembly is configured to supply power to the voltage conversion unit in a power generation state. The power generation unit may be a photovoltaic power generation unit or a wind power generation unit, which may include a power generation assembly and an energy storage element including a battery or a super capacitor. The output end of the power generation assembly can be connected with the input ends of the energy storage element and the voltage conversion unit, and the power generation assembly can be used for charging the energy storage element in a power generation state; the energy storage element is used for supplying power to the voltage conversion unit when the power generation assembly does not generate power. The electronic device may be a charging peg.
The embodiment of the invention provides another electronic device. Fig. 9 is a schematic structural diagram of another electronic device according to an embodiment of the invention. On the basis of the above embodiment, the electronic device further includes an energy storage unit 22, the film coil 10 is electrically connected to the energy storage unit 22, and the film coil 10 is used for charging the energy storage unit 22. The two contact pads of the thin film coil 10 (i.e., the two first contact pads of the first substrate or the two second contact pads of the second substrate) may be electrically connected with the energy storage unit 22. The film coil 10 can induce induced electromotive force under the action of a magnetic field with the intensity of the magnetic field generated by the non-contact power transmission device changing in a preset rule, so as to generate charging current and output the charging current to the energy storage unit 22. The electronic device can be used as non-contact electric energy receiving equipment, and can be an electric device such as a mobile phone, a tablet personal computer, intelligent wearable equipment, an electric automobile and the like. The energy storage unit may comprise a battery or a super capacitor.
Optionally, on the basis of the above embodiment, the electronic device further includes a magnetic unit located at one side of the film coil, where the magnetic unit may provide a magnetic circuit for a magnetic field generated by the film coil, and the magnetic unit may be made of a ferromagnetic material, for example, ferrite.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (7)
1. A thin film coil, comprising:
a second substrate;
the at least one second open coil and the at least one second continuous coil are positioned on the first surface of the second substrate, the at least one second continuous coil comprises a plurality of circles of second sub-coils which are spirally arranged, and the at least one second open coil and the at least one second continuous coil are arranged in a layer-by-layer surrounding mode;
at least one section of second outgoing line is positioned on the first surface of the second substrate, and the second outgoing line is positioned at the opening of the second opening coil;
the at least one third open coil and the at least one third continuous coil are positioned on a second surface opposite to the first surface of the second substrate, the at least one third continuous coil comprises a plurality of circles of third sub-coils which are spirally arranged, and the at least one third open coil and the at least one third continuous coil are arranged in a layer-by-layer surrounding manner;
the at least one second continuous coil and the at least one third continuous coil are connected in series through a via;
at least one section of third lead-out wire is positioned on a second surface opposite to the first surface of the second substrate, and the third lead-out wire is positioned at the opening of the third opening coil;
the second outgoing line and the third outgoing line are connected in series through a via hole;
the innermost end of the at least one section of second outgoing line and the at least one section of third outgoing line which are connected in series is connected with the head end of the coil arranged at the innermost part;
the second sub-coil comprises a second parallel section and a second series section, two ends of the third open coil are respectively and electrically connected with two ends of the second parallel section of the corresponding second sub-coil through a via hole, and the second series section of the second sub-coil is connected with the second parallel section of the second sub-coil adjacently arranged with the second series section;
the third sub-coil comprises a third parallel section and a third series section, two ends of the second opening coil are respectively and electrically connected with two ends of the third parallel section of the corresponding third sub-coil through a via hole, and the third series section of the third sub-coil is connected with the third parallel section of the third sub-coil adjacently arranged with the third series section of the third sub-coil.
2. The thin film coil of claim 1, further comprising two second contact pads on the same surface of the second substrate, wherein one second contact pad is electrically connected to an end of an outermost coil arranged on the same surface thereof, and the other second contact pad is electrically connected to an outermost end of the at least one segment of second lead wire connected in series with the at least one segment of third lead wire.
3. The thin film coil of claim 1, wherein the second opening coil and the third sub-coil are disposed in one-to-one opposition in a direction perpendicular to the first surface of the second substrate; the third opening coils and the second sub-coils are arranged in a one-to-one opposite mode along the direction perpendicular to the first surface of the second substrate.
4. An electronic device comprising the film coil of any one of claims 1-3.
5. The electronic device according to claim 4, further comprising a voltage conversion unit, wherein an output terminal is electrically connected to the thin film coil, and the voltage conversion unit is configured to convert a voltage at an input terminal into an ac voltage with a preset frequency and output the ac voltage to the thin film coil.
6. The electronic device of claim 4, further comprising an energy storage unit, wherein the film coil is electrically connected to the energy storage unit, and wherein the film coil is configured to charge the energy storage unit.
7. The electronic device of claim 4, wherein the electronic device comprises at least one of: fill electric pile, cell-phone, panel computer, intelligent wearable equipment and electric automobile.
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| CN201810517534.XA CN108735439B (en) | 2018-05-25 | 2018-05-25 | Film coil and electronic device |
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| CN201810517534.XA CN108735439B (en) | 2018-05-25 | 2018-05-25 | Film coil and electronic device |
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| CN108735439B true CN108735439B (en) | 2023-11-17 |
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| CN112185659B (en) * | 2020-09-11 | 2022-05-06 | 瑞声新能源发展(常州)有限公司科教城分公司 | Coil and wireless charging device |
| EP4116994A4 (en) * | 2020-12-11 | 2023-12-13 | Xiamen Sound's Great Electronics and Technology Co., Ltd. | Microcoil element, array type microcoil element, and device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103366931A (en) * | 2012-03-29 | 2013-10-23 | 三星电机株式会社 | Thin film coil and electronic device having the same |
| CN208208466U (en) * | 2018-05-25 | 2018-12-07 | 昆山联滔电子有限公司 | film coil and electronic device |
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| KR101649258B1 (en) * | 2014-12-24 | 2016-08-19 | 주식회사 아이엠텍 | Flexible printed circuit board for wireless communications |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103366931A (en) * | 2012-03-29 | 2013-10-23 | 三星电机株式会社 | Thin film coil and electronic device having the same |
| CN208208466U (en) * | 2018-05-25 | 2018-12-07 | 昆山联滔电子有限公司 | film coil and electronic device |
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