EP4107778A4 - Vorrichtung, system und verfahren zur bereitstellung von selbstausziehgriffen für einen endeffektor - Google Patents

Vorrichtung, system und verfahren zur bereitstellung von selbstausziehgriffen für einen endeffektor Download PDF

Info

Publication number
EP4107778A4
EP4107778A4 EP20920138.3A EP20920138A EP4107778A4 EP 4107778 A4 EP4107778 A4 EP 4107778A4 EP 20920138 A EP20920138 A EP 20920138A EP 4107778 A4 EP4107778 A4 EP 4107778A4
Authority
EP
European Patent Office
Prior art keywords
grips
end effector
providing self
self extracting
extracting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20920138.3A
Other languages
English (en)
French (fr)
Other versions
EP4107778A1 (de
Inventor
Jeroen Bosboom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jabil Inc
Original Assignee
Jabil Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jabil Inc filed Critical Jabil Inc
Publication of EP4107778A1 publication Critical patent/EP4107778A1/de
Publication of EP4107778A4 publication Critical patent/EP4107778A4/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B25J15/0206—Gripping heads and other end effectors servo-actuated comprising articulated grippers
    • B25J15/0226—Gripping heads and other end effectors servo-actuated comprising articulated grippers actuated by cams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B25J15/0253—Gripping heads and other end effectors servo-actuated comprising parallel grippers

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP20920138.3A 2020-02-17 2020-02-17 Vorrichtung, system und verfahren zur bereitstellung von selbstausziehgriffen für einen endeffektor Pending EP4107778A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2020/018507 WO2021167584A1 (en) 2020-02-17 2020-02-17 Apparatus, system and method for providing self extracting grips for an end effector

Publications (2)

Publication Number Publication Date
EP4107778A1 EP4107778A1 (de) 2022-12-28
EP4107778A4 true EP4107778A4 (de) 2023-04-19

Family

ID=77391549

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20920138.3A Pending EP4107778A4 (de) 2020-02-17 2020-02-17 Vorrichtung, system und verfahren zur bereitstellung von selbstausziehgriffen für einen endeffektor

Country Status (4)

Country Link
US (1) US20230139939A1 (de)
EP (1) EP4107778A4 (de)
CN (1) CN115136295A (de)
WO (1) WO2021167584A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024091914A1 (en) * 2022-10-24 2024-05-02 Jabil Inc. Apparatus, system and method for providing an edge grip substrate flipper
CN117260792B (zh) * 2023-11-17 2024-02-27 上海普达特半导体设备有限公司 具有夹块的机械手及设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163113A (ja) * 1997-11-26 1999-06-18 Nec Corp 多品種基板チャック機構
US20110211936A1 (en) * 2008-10-17 2011-09-01 Ulvac, Inc. Conveying device and vacuum apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116848A (en) * 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
KR100798483B1 (ko) * 2006-08-31 2008-01-28 로체 시스템즈(주) 사이드 에지형 웨이퍼 클램핑 핸드
JP5491834B2 (ja) * 2009-12-01 2014-05-14 川崎重工業株式会社 エッジグリップ装置、及びそれを備えるロボット。
US9919430B1 (en) * 2016-12-06 2018-03-20 Jabil Inc. Apparatus, system and method for providing an end effector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163113A (ja) * 1997-11-26 1999-06-18 Nec Corp 多品種基板チャック機構
US20110211936A1 (en) * 2008-10-17 2011-09-01 Ulvac, Inc. Conveying device and vacuum apparatus

Also Published As

Publication number Publication date
EP4107778A1 (de) 2022-12-28
CN115136295A (zh) 2022-09-30
US20230139939A1 (en) 2023-05-04
WO2021167584A1 (en) 2021-08-26

Similar Documents

Publication Publication Date Title
EP4087193A4 (de) Datenanalyseverfahren, -vorrichtung und -system
EP4102879A4 (de) Testverfahren, -vorrichtung und -system
EP4106271A4 (de) Anwendungsentdeckungsverfahren, -vorrichtung und -system
EP4135219A4 (de) Verfahren, vorrichtung und system zur fehlerortung
EP4166374A4 (de) Ladeverfahren, -vorrichtung und -system
EP4169664A4 (de) System, verfahren und vorrichtung zur montage einer vorrichtung
EP4107778A4 (de) Vorrichtung, system und verfahren zur bereitstellung von selbstausziehgriffen für einen endeffektor
EP4181475A4 (de) Verfahren, vorrichtung und system zur fehlerverarbeitung
EP4027433A4 (de) Stromverbrauchsvorrichtung, verfahren zur herstellung einer stromverbrauchsvorrichtung und vorrichtung zur herstellung der stromverbrauchsvorrichtung
EP3968294B8 (de) Vorrichtung, system, verfahren und programm
EP4239459A4 (de) Rückkopplungsverfahren, -vorrichtung und -system
EP4181755A4 (de) System, vorrichtung und verfahren zur lagerung von ausrüstung
EP4242880A4 (de) Verfahren und vorrichtung, vorrichtung und system zur bedienerberechnung
EP4089550A4 (de) Verfahren zur extraktion von gleichstrukturierten daten und gerät damit
EP4258604A4 (de) Ladeverfahren, -vorrichtung und -system
EP4130706A4 (de) Verdünner, analysesystem und analyseverfahren
EP4167107A4 (de) Bildwiederauffindungssystem, -verfahren und -vorrichtung
EP4170547A4 (de) Verfahren zur extraktion von datenmerkmalen und zugehörige vorrichtung
EP4220117A4 (de) Testverfahren, vorrichtung und system für ein autonomes fahrzeug
EP4101365A4 (de) Bildverarbeitungsvorrichtung, endoskopisches system und bildverarbeitungsverfahren
EP4105340A4 (de) Analyseverfahren, analysesystem und oberfläche für analyse
EP4111562A4 (de) Vorrichtung, system und verfahren zum heben und manipulieren von leitern
EP4247113A4 (de) Routingverfahren, -vorrichtung und -system
EP4274282A4 (de) Verfahren, vorrichtung und system zur gewinnung von sicherheitsparametern
EP4283939A4 (de) Verfahren zur erfassung von daten und vorrichtung

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20220823

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

A4 Supplementary search report drawn up and despatched

Effective date: 20230316

RIC1 Information provided on ipc code assigned before grant

Ipc: B25J 11/00 20060101ALI20230310BHEP

Ipc: B25J 15/02 20060101ALI20230310BHEP

Ipc: B25J 15/00 20060101ALI20230310BHEP

Ipc: H01L 21/677 20060101ALI20230310BHEP

Ipc: H01L 21/687 20060101AFI20230310BHEP

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)