EP4089323A1 - Dissipateur thermique pour dispositif d'éclairage - Google Patents

Dissipateur thermique pour dispositif d'éclairage Download PDF

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Publication number
EP4089323A1
EP4089323A1 EP21290030.2A EP21290030A EP4089323A1 EP 4089323 A1 EP4089323 A1 EP 4089323A1 EP 21290030 A EP21290030 A EP 21290030A EP 4089323 A1 EP4089323 A1 EP 4089323A1
Authority
EP
European Patent Office
Prior art keywords
pin fins
heat sink
light source
top surface
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP21290030.2A
Other languages
German (de)
English (en)
Inventor
Sébastien Touzard
Angelo Favarolo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
ZG Lighting France SAS
Original Assignee
Zumtobel Lighting GmbH Austria
ZG Lighting France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zumtobel Lighting GmbH Austria, ZG Lighting France SAS filed Critical Zumtobel Lighting GmbH Austria
Priority to EP21290030.2A priority Critical patent/EP4089323A1/fr
Priority to EP22290030.0A priority patent/EP4089324A1/fr
Publication of EP4089323A1 publication Critical patent/EP4089323A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F21V29/81—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires with pins or wires having different shapes, lengths or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • F21V21/30—Pivoted housings or frames
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities

Definitions

  • the present invention is directed to a heat sink for a lighting device, to the lighting device comprising said heat sink and a light source mounted thereto, and to a lighting arrangement comprising said lighting device and a support arrangement for supporting the lighting device.
  • Heat sinks for lighting arrangements are generally known in the prior art.
  • a light source like an LED (light emitting diode) module are directly mounted on such a heat sink to allow heat dissipation from the light source when in operation by thermal conduction.
  • heat sinks comprise protruding structures, which are designed to allow a fluid, like air or cooling liquid, to flow around these structures thus increasing the cooling effect.
  • protrusions are usually in the form of fins.
  • Particularly flat fins are widely used, which offer a reduced complexity and thus allow for a comparably simple production process. Flat fins provide a quite large surface area thus allowing for a good heat dissipation.
  • Flat fins usually extend along a defined direction and are arranged in parallel so that these cooling fins exhibit their cooling capabilities mainly in the direction of their extension. Due to the quite large surface area, flat fins are prone to high drag forces particularly in application areas where the flow direction of cooling fluid is not known or not constrained, e.g. when the heat sink is used in wind affected areas like floodlight applications.
  • pin-shaped protrusions with circular cross-section.
  • the pin-shaped protrusions have a reduced drag area but a less heat dissipation ability compared to flat fins due to their reduced surface area.
  • the present invention is directed to a heat sink for a lighting device.
  • the heat sink comprises a base panel having a top surface and a bottom surface.
  • the heat sink further comprises a plurality of pin fins each extending outwardly from the top surface in a protruding direction.
  • the bottom surface comprises a mounting section for mounting a light source so as to transfer heat from the light source via the base panel to the pin fins by thermal conduction.
  • the pin fins each have a cross-sectional configuration (i.e.
  • the heat sink according to the present invention provides a comparably high exchange area to volume ratio compared to the known pin protrusions. Also, as the pin fins still have a generally pin-like structure, they permit the flow of a cooling fluid around the pin fins from every direction without substantially being affected by increased drag forces. Moreover, the streamlined shaped of the pin fins due to the extension sections is able to reduce the pressure losses and to improve fluid flow even in cases of natural convection. Hence, the heat sink according to the present invention provides a good balance between high cooling abilities due to good heat dissipation on the one side and low impact of drag forces due to a low drag area (SCx) on the other side.
  • SCx low drag area
  • the central section may have a cyclically or rotationally symmetric shape. Hence, production of the heat sink may be facilitated. Also, the shape of the central section may be designed to allow for an improved fluid flow in combination with the tapering extension sections extending from the so formed central section.
  • the central section may have a circular, oval, polygonal, square, or rectangular shape.
  • the central section may also have any other shape.
  • a circular shape allows for a good balance of limited amount of material be used and thus reduction of weight on the one hand and a comparably large exchange area while still providing a reduced drag area on the other hand.
  • An oval shape may, for instance, allow for a quite smooth transition between the central section and the extension sections thus further reducing the pressure losses and improving the fluid flow.
  • Polygonal shapes like a square or rectangular shape, may allow for an easy production process and good junction with the extension sections.
  • the two extension sections preferably each have an arcuate form or a parabolic form or a form of a polynomial curve. Hence, a comparably simple form with good flow properties can be provided.
  • At least one of the two extension sections or both of which may taper into a rounded tip preferably at a distal end of the respective extension section most distant from the central section.
  • This rounded tip allows for an optimized fluid flow, e.g., so as to allow fluid (e.g. air) to flow closely around the pin fin.
  • the two extension sections may be identical. Hence, production may be facilitated and fluid flow be improved; irrespective of the flowing direction of a cooling fluid.
  • the two extension sections may also be different, preferably at least different in shape and/or size. This may allow for an optimized layout of the pin fin in respect of fluid flow, drag area, heat dissipation ability, and other factors like weight etc.
  • the pin fins may be symmetric with respect to a symmetry plane, respectively. Hence, production can be further facilitated and fluid flow be improved.
  • the symmetry planes of at least some or all of the pin fins may preferably be parallel with respect to each other.
  • the cross-sectional configuration or cross section may be mirror-symmetric with respect to a symmetry line. This layout allows for an easy production of the heat sink while further allowing for the pin fins having good flowing abilities in all flowing directions.
  • the symmetry lines of at least some or all of the pin fins can preferably be parallel with respect to each other. Hence, fluid flow of the overall heat sink can be improved while keeping low the drag area irrespective of the flowing direction of the fluid.
  • the pin fins each may have a height along the protruding direction of 10 to 100 mm, preferably 12 to 60..
  • the pin fins can have a comparably large exchange surface for a sufficient transfer of heat, while still allowing for a quite rigid layout to sufficiently withstand drag forces from a fluid flowing around the pin fins, thus resulting in a good durability and sufficiently long product life.
  • the pin fins can thus also be optimized according to the required needs, e.g. dependent on different factors like place of operation (e.g. temperatures, wind, etc.), materials used, operation temperatures (e.g. operation point of lighting device, etc.).
  • the pin fins closer to a center of the top surface or base plate may be higher (i.e. extend further from the top surface in the protruding direction) than the pin fins closer to an edge of the top surface or base plate.
  • the pin fins can be optimized with respect to their operational load or requirements.
  • the pin fins at the edge of the heat sink are less engaged in the heat dissipation work than the pin fins in the center of the heat sink.
  • the overall weight of the heat sink can be reduced without affecting the cooling efficiency. This, in turn, results in a supporting arrangement for the supporting the heat sink be reduced in size which thus results in much reduced production, assembly and maintenance costs.
  • the pin fins preferably taper with increased distance to the top surface. Hence, production of the heat sink can be facilitated, e.g. for demoulding a moulded heat sink. Moreover, the drag area at a section most distanced from the base panel and thus from the support of the pin fin can be reduced so that durability of the heat sink can be increased.
  • Each of the pin fins may have a length (i.e. an overall length; L) measured in its cross-section along the extension direction.
  • the length preferably is at least 6mm, or at least 8mm, or at least 10mm, or at least 12mm, or at least 15mm, or at least 18mm, or at least 20mm.
  • the pin fins allow for a sufficient heat dissipation while having a reduced drag area, which results in overall improved cooling abilities.
  • Each of the pin fins may further have a width (W) measured in its cross-section orthogonal to the extension direction and preferably being the diameter of the central section.
  • W width measured in its cross-section orthogonal to the extension direction and preferably being the diameter of the central section.
  • a ratio of the length of the respective pin fin to its width i.e. L:W) is from 1,2:1 to 4:1, or from 1,5:1 to 3:1, or about 2:1
  • each of the pin fins is distanced to each of its neighboring pin fins by at least 6mm, or at least 8mm, or at least 10mm, or at least 12mm.
  • sufficient heat dissipation can be achieved while allowing for an improved fluid flow at a comparably low drag area.
  • any stationary fluid around the pin fins can be avoided as being entrained by the fluid consequently freely flowing around the pin fins thus increasing the heat dissipation ability.
  • the pin fins may preferably be distributed, more preferred evenly distributed, over the top surface. Hence, production is facilitated and fluid flow be improved.
  • the pin fins may preferably be arranged in staggered rows or in equally aligned rows. In staggered rows, there can be provided a high number of pin fins per square millimetre while heat dissipation is improved. In case of the pin fins being arranged in equally aligned rows, production can be facilitated and fluid flow be improved particularly in case of high or strong fluid flows.
  • the pitch between two neighboring pin fins of the same row preferably is at least 15mm, or at least 20mm, or at least 25mm, or at least 30mm.
  • the pitch may preferably be identical for each of the pin fins and/or in each of the rows; while it may also differ as desired.
  • a defined minimum pitch allows for an improved fluid flow and thus increased heat dissipation ability.
  • the protruding directions of at least some or all of the pin fins may preferably extend orthogonally to the top surface or the bottom surface, respectively. Hence, production of the heat sink can be facilitated and heat dissipation be improved.
  • the protruding directions of at least some or all of the pin fins may preferably be parallel with respect to each other. Hence, production can be facilitated, fluid flow be improved and drag forces be reduced; irrespective of the flowing direction of the cooling fluid.
  • the mounting section may preferably be designed for mounting the light source with a surface contact or flat contact. Hence, the heat transfer by thermal conduction can be maximised.
  • the bottom surface or the mounting section may extend in a plane. Hence, production of the heat sink can be facilitated. Also, the attachment of a light source can be facilitated and efficient heat dissipation can be obtained.
  • the top surface may extend in a plane.
  • the layout of the heat sink can be facilitated, thus making the production process less complex. Also, this layout allows for a smooth fluid flow to thus increase heat dissipation.
  • the top surface and the bottom surface are or extend preferably parallel to each other. Hence, the production of the base panel is facilitated and a uniform heat dissipation can be obtained.
  • the base panel and the pin fins may preferably be integrally formed. Hence, production of the heat sink can be facilitated and heat dissipation be improved.
  • the heat sink and preferably the base panel and/or the pin fins are preferably made of a material having a good thermal conductivity.
  • the heat sink and preferably the base panel and/or the pin fins may comprise a material selected from the group consisting of aluminium, magnesium, copper, gold, silver, and an alloy comprising one or more of the aforementioned materials. Hence, a good heat transfer, as desired, can be provided.
  • the present invention is directed to a lighting device - like a floodlight - comprising a heat sink according to the present invention as well as a light source being mounted to the mounting section such that heat from the light source when being operated is transferred via the base panel to the pin fins by thermal conduction.
  • the advantages as already described for the heat sink apply alike for its use in a lighting device. Therefore, even in an environment with unforeseeable cooling flow directions, sufficient cooling of the lighting device and particularly of the light source can be obtained, thus increasing life time of such a light source even in the mentioned environments. Due to the reduced drag area, the lighting arrangement is less affected by drag forces, which positively affects the durability and thus lifetime of the lighting device.
  • the light source preferably is in surface contact or flat contact with the mounting section. Hence, heat transfer can be maximised.
  • the light source preferably is an LED-module.
  • This type of light source usually requires a good heat dissipation because temperature severely affects its life span. Moreover, this type of light source can usually be efficiently operated so that operational costs can be minimized.
  • the LED-module may have at least one or a plurality of LEDs.
  • each of the LEDs can be associated to one of the pin fins. More preferred, each of the LEDs can be positioned opposite to one of the pin fins with respect to the base panel.
  • effective heat transfer from the light source to the heat sink and further into the pin fins for heat dissipation can be improved. This may further result in the base plate be made thinner as it does not need to contribute much for the heat transfer or dissipation, which in turn results in a reduction in weight of the lighting device.
  • the present invention is directed to lighting arrangement - like a floodlight arrangement - comprising at least one lighting device according to the present invention as well as a supporting arrangement for supporting (i.e. carrying, mounting, etc.) the lighting device.
  • lighting arrangement like a floodlight arrangement - comprising at least one lighting device according to the present invention as well as a supporting arrangement for supporting (i.e. carrying, mounting, etc.) the lighting device.
  • These types of lighting arrangement are usually highly affected by strong fluid flows (e.g. wind) so that the advantages as described herein above are likewise valid.
  • the supporting arrangement may preferably comprise a support structure, like a mounting frame, and/or a pole for supporting the lighting device preferably in an adjustable or pivotable manner.
  • the lighting device can be securely mounted, while, preferably, a light emitting direction of the light sources can be adjusted as desired, thus increasing flexibility of the lighting arrangement.
  • FIG. 1 The figures show different views of embodiments of a heat sink 1 for a lighting device 100 of the present invention.
  • the heat sink 1 comprises a base panel 2 having a top surface 20 and a bottom surface 21.
  • the top surface 20 preferably extends in a plane as illustrated in FIGs 2 , 4 and 5 .
  • the bottom surface 21 may preferably also extend in a plane as illustrated in FIGs 2 and 4 .
  • the top surface 20 and the bottom surface 21 are preferably parallel with respect to each other.
  • the heat sink 1 further comprises a plurality of pin fins 3 each extending outwardly from the top surface 20 in a protruding direction 4.
  • the protruding directions 4 of at least some or all of the pin fins 3 preferably extend orthogonally to the top surface 20 or the bottom surface 21, respectively. This is exemplarily illustrated in FIG 4 .
  • the protruding directions 4 of at least some or all of the pin fins 3 are preferably parallel with respect to each other.
  • FIGs 1 , 4 and 5 show an embodiment in which the protruding directions 4 of all pin fins 3 are parallel to each other.
  • the pin fins 3 are preferably distributed over the top surface 20. As illustrated in FIG 3 , the pin fins 3 are even more preferred evenly distributed over the top surface 20.
  • the pin fins 3 are preferably arranged in staggered rows. However, it may also be possible that the pin fins 3 are arranged in equally aligned rows or in any other way arranged in a defined or undefined manner or even arbitrarily distributed over the top surface 20.
  • a pitch C between two neighboring pin fins 3 of the same row preferably is at least 15mm, or at least 20mm, or at least 25mm, or at least 30mm. As exemplarily illustrated in FIGs 1 , 3 and 5 , the pitch C can be about 25mm. As exemplarily illustrated in FIGs 1 and 3 , the pitch C may be identical for each of the pin fins 3 and/or in each of the rows. However, it may also differ, if need be.
  • Each of the pin fins 3 may have a defined minimum distance to each of its neighbouring pin fins 3.
  • each of the pin fins maybe distanced to each of its neighboring pin fins 3 by at least 6mm, or at least 8mm, or at least 10mm, or at least 12mm.
  • the minimum distance between the pin fins 3 can be about 9mm, respectively.
  • the pin fins 3 each may have a height H along the protruding direction 4 (see, e.g., FIGs 4 and 5 ) of 10 to 100 mm, preferably 12 to 60 mm. As exemplarily illustrated in FIGs 1 and 5 , the height H can be about 50mm.
  • the pin fins 3 all may have the same height H. However, it may also be possible that the pin fins 3 have different heights H. In a preferred embodiment, for instance, the pin fins 3 closer to a center of the top surface 20 or base plate 2 can be higher than the pin fins 3 closer to an edge of the top surface 20 or base plate 2 to allow for a reduction in weight of the heat sink 1 without affecting the heat dissipation ability.
  • the pin fins 3 may taper with increased distance to the top surface 20.
  • the bottom surface 21 comprises a mounting section 22 for mounting a light source 200 so as to transfer heat from the light source 200 via the base panel 2 to the pin fins 3 by thermal conduction (see, e.g., FIGs 2 and 4 in combination with FIGs 6 and 7 ).
  • the heat sink 1 and preferably the base panel 2 and/or the pin fins 3 may be made from a material having a good heat transfer ability.
  • the heat sink 1, more preferred the base panel 2 and/or the pin fins 3, may comprise a material selected from the group consisting of aluminium, magnesium, copper, gold, silver, and an alloy comprising one or more of the aforementioned materials.
  • the base panel 2 and the pin fins 3 are preferably integrally formed, as can be clearly derived from FIG 4 as well as the other figures.
  • the mounting section 22 preferably is designed for mounting the light source 200 with a surface contact or flat contact. This is preferably easily achieved by the mounting section 22 extending in a plane, as can be derived from FIGs 2 and 4 .
  • the pin fins 3 each have a cross-sectional configuration, when viewed along (i.e. in or opposite to) the extension direction 4, with a central section 30 and two extension sections 31.
  • the extension sections 31 each extend along an extension direction 5 from opposite sides of the central section 30.
  • the extension sections 31 each extend such that they taper with increased distance from the central section 30. This is exemplarily illustrated in FIG 5 and also derivable from FIGs 1 and 3 .
  • the extension sections 31 each may have an arcuate form or a parabolic form or a form of a polynomial curve, each exemplarily illustrated in FIG 5 .
  • both extension sections 31 may taper into a rounded tip 32 preferably at a distal end of the respective extension section 31 most distant from the central section 30.
  • the two extension sections 31 can be identical, while they may also be different, e.g., in shape and/or size.
  • the central section 30 may have a rotationally symmetric shape. However, the central section 30 may also have another shape, like a cyclically symmetric shape or even a non-symmetric shape.
  • the central section 30 according to the shown embodiment of FIG 5 here has a circular shape, while the central section 30 may also have another shape, like oval, polygonal, square, or rectangular or even any other symmetrical or non-symmetrical shape.
  • the pin fins 3 are preferably symmetric with respect to a symmetric plane P, as exemplarily illustrated in FIG 5 .
  • the symmetric planes P of at least some or - as illustrated in the shown embodiment - all of the pin fins 3 are preferably parallel with respect to each other and thus are all oriented in the same direction, as can also be gathered from FIGs 1 and 3 .
  • the cross-sectional configuration or cross section preferably is mirror-symmetric with respect to a symmetry line Y.
  • the symmetry lines Y of at least some or - as exemplarily shown in FIG 5 - all of the pin fins 3 are preferably parallel with respect to each other and thus symmetric on both sides to thus allow for a smooth and regular fluid flow irrespective of the flowing direction of a fluid flowing around the pin fins 3.
  • each of the pin fins 3 may have a length L measured in its cross-section along the extension direction 5.
  • the length L may be, for instance, at least 6mm, or at least 8mm, or at least 10mm, or at least 12mm, or at least 15mm, or at least 18mm, or at least 20mm.
  • the length L can be about 12mm.
  • each of the pin fins 3 may further have a width W measured in its cross-section orthogonal to the extension direction 5.
  • the width W may be identical to the diameter D of the central section 30.
  • a ratio of the length L of the respective pin fin 3 to its width W - i.e. L:W - preferably is from 1,2:1 to 4:1, or from 1,5:1 to 3:1, or - as exemplarily illustrated in Fig. 5 - about 2:1.
  • the heat sink 1 has a quite high exchange area to volume ratio while permitting a good fluid flow from every direction.
  • the streamlined shape of the pin fins 3 allows for a reduction in the pressure losses while improving the fluid flow.
  • the well balanced shape of the pin fins 3 allows for a fluid flow in every flowing direction with a low drag area and thus limited drag forces to be applied while having good cooling abilities.
  • the present invention is also directed to a lighting device 100 comprising the heat sink 1 according to the present invention as well as a light source 200 being mounted to the mounting section 22 such that heat from the light source 200 when being operated is transferred via the base panel 2 to the pin fins 3 by thermal conduction. This is exemplarily illustrated in FIGs 6 and 7 .
  • the light source 200 may be in surface contact or flat contact with the mounting section 22. Therefore, the mounting section 22 preferably extends in a plane.
  • the light source 200 can, for instance, be an LED-module having at least one or a plurality of LEDs, e.g., provided on a printed circuit board.
  • each of the LEDs can be associated to one of the pin fins 3, e.g. by each of the LEDs being positioned opposite to one of the pin fins 3 with respect to the base panel 2.
  • the printed circuit board preferably extends in a plane and can thus be easily attached in a flat contact to the plane mounting section 22 of the shown embodiment of FIG 2 and 4 .
  • the light source 200 can thus be mounted to the mounting surface 22 by being directly mounted thereon.
  • the light source 200 is not directly mounted on or attached onto the mounting section 22.
  • the light source 200 may also be mounted to the mounting surface 22 via a mounting element allowing for heat transfer by thermal conduction from the light source 200 to the base panel 2 and thus further to the pin fins 3, around which then a fluid (like air) can flow for effectively dissipating the heat.
  • the lighting device 100 is a floodlight, which is usually mounted at a raised position. Due to the layout of the pin fins 3, low drag forces act on the lighting device 100 irrespective of the flow direction while still allowing for a good heat dissipation due to the high exchange area to volume ratio compared to known pin protrusions.
  • the present invention may further be directed to a lighting arrangement 10 comprising at least one lighting device 100 according to the invention as well as a supporting arrangement 300 for supporting or carrying the lighting device 100.
  • the lighting arrangement 10 is a floodlight arrangement, as exemplarily illustrated in FIGs 6 and 7 .
  • the supporting arrangement 300 may comprise a support structure 310, like a frame.
  • the frame may comprise a plurality of elements or may be integral.
  • a device frame 311 of the frame comprises two lateral carriers between which there are supported (i.e. mounted) three lighting devices 100.
  • the lighting devices 100 are each preferably supported or mounted in an adjustable or pivotable manner to thus allow for adjustment of a light emitting direction of each of the lighting devices 100.
  • the lighting devices 100 are each rotatable or pivotable about a rotational axis X. This is exemplarily illustrated by the three double-arrows in FIG 7 .
  • the rotational axes X preferably extend parallel to each other.
  • the frame 310 may further comprise a mounting frame 312 for mounting the lighting device(s) 100 to a mounting surface, like a wall or a pole.
  • the pole may also be part of the supporting arrangement 300.
  • the mounting frame 312 may carry the two lateral carriers 311 preferably in a pivotable manner about a further rotational axis Y, which is exemplarily illustrated by the double-arrow in FIG 6 .
EP21290030.2A 2021-05-12 2021-05-12 Dissipateur thermique pour dispositif d'éclairage Withdrawn EP4089323A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP21290030.2A EP4089323A1 (fr) 2021-05-12 2021-05-12 Dissipateur thermique pour dispositif d'éclairage
EP22290030.0A EP4089324A1 (fr) 2021-05-12 2022-05-11 Dissipateur thermique pour dispositifs d'éclairage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP21290030.2A EP4089323A1 (fr) 2021-05-12 2021-05-12 Dissipateur thermique pour dispositif d'éclairage

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EP4089323A1 true EP4089323A1 (fr) 2022-11-16

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EP21290030.2A Withdrawn EP4089323A1 (fr) 2021-05-12 2021-05-12 Dissipateur thermique pour dispositif d'éclairage
EP22290030.0A Pending EP4089324A1 (fr) 2021-05-12 2022-05-11 Dissipateur thermique pour dispositifs d'éclairage

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7712926B2 (en) * 2006-08-17 2010-05-11 Koninklijke Philips Electronics N.V. Luminaire comprising adjustable light modules
US20120199336A1 (en) * 2011-02-08 2012-08-09 Hsu Takeho Heat sink with columnar heat dissipating structure
US10302371B2 (en) * 2014-10-20 2019-05-28 Signify Holding B.V. Low weight tube fin heat sink
WO2021180706A1 (fr) * 2020-03-09 2021-09-16 Schreder S.A. Tête de luminaire à dissipateur thermique amélioré

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080066888A1 (en) * 2006-09-08 2008-03-20 Danaher Motion Stockholm Ab Heat sink
JP3170440U (ja) * 2011-07-05 2011-09-15 タイワ工業株式会社 鍛造品
DE102013212469A1 (de) * 2013-06-27 2014-12-31 Siemens Aktiengesellschaft Kühlvorrichtung mit einem Kühlkörper
FR3055402B1 (fr) * 2016-08-31 2021-04-30 Valeo Vision Dissipateur thermique pour dispositif lumineux pour vehicule automobile

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7712926B2 (en) * 2006-08-17 2010-05-11 Koninklijke Philips Electronics N.V. Luminaire comprising adjustable light modules
US20120199336A1 (en) * 2011-02-08 2012-08-09 Hsu Takeho Heat sink with columnar heat dissipating structure
US10302371B2 (en) * 2014-10-20 2019-05-28 Signify Holding B.V. Low weight tube fin heat sink
WO2021180706A1 (fr) * 2020-03-09 2021-09-16 Schreder S.A. Tête de luminaire à dissipateur thermique amélioré

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