EP4035513A1

EP4035513A1 - Electronic device and fixing module thereof for fixing element

Info

Publication number: EP4035513A1
Application number: EP20869639.3A
Authority: EP
Inventors: Shuisheng YU; Xing GUAN
Original assignee: Valeo Siemens eAutomotive Shenzhen Co Ltd
Current assignee: Valeo eAutomotive Shenzhen Co Ltd
Priority date: 2019-09-27
Filing date: 2020-09-27
Publication date: 2022-08-03
Also published as: CN111098725B; EP4035513A4; CN111098725A; WO2021057950A1

Abstract

A fixing module (200) is provided for fixing an element (12) onto a heat sink (20) of an electronic device (10); the fixing module (200) includes an element holder (40) for installing said element (12) thereon; a first fixing element (71), disposed on said element holder (40); and a second fixing element (72), disposed on a support plate (16) that is adjacent to said heat sink (20), wherein said second fixing element (72) is complementary to and cooperates with said first fixing element (71) to attach said element holder (40) to said support plate (16), so that said element (12) is fixed against said heat sink (20).

Description

ELECTRONIC DEVICE AND FIXING MODULE THEREOF FOR FIXING ELEMENT

CROSS-REFERENCE TO RELATED APPLICATIONS
This disclosure claims priority to Chinese Patent Application No. 201910926250.0, filed on September 27, 2019, the entirety of which is incorporated herein by reference as a part of this disclosure.

TECHNICAL FIELD

The present invention relates to a battery charger, in particular to an on-board charger (OBC) for an electric vehicle (EV) or a plug-in hybrid electric vehicle (PHEV) .
The present invention is more precisely dedicated to providing a battery charger that is capable of accommodating more internal elements and providing higher power.

BACKGROUND

A propulsion system of a conventional electric vehicle or gas-electric hybrid vehicle comprises a high voltage power supply battery used to provide a power supply voltage to the electric motor of the vehicle for propulsion of the vehicle, and a battery charger. The battery charger is, also known as an "on-board charger" , connected to an alternating current (AC) network (for example, a regional electric network or national electric network) and converts one or more AC currents received from the AC network into a direct current (DC) that is able to be directly input to the battery, thus charging the high-voltage battery.
The above-described on-board charger comprises a plurality of internal elements and components, such as one or more transformers, one or more inductors, a plurality of diodes, a plurality of transistors, etc. These internal elements and components are installed on a printed circuit board (PCB) that is mounted on a housing of the on-board charger, an AC input connector and a DC output connector being also provided in the housing. The on-board charger further comprises a heat sink for absorbing, eliminating and releasing the tremendous heat energy generated when these internal elements and components operate.
Currently, in industry, it is required an on-board charger that supplies higher power; in other words, the on-board charger may need to accommodate more elements generating heat, while having a bulk volume as small as possible. Thus, the design of a charger should take into account how to effectively release and eliminate heat generated by the elements in the charger so that the charger operates properly.
SUMMARY
An objective of the present invention is to, for solving the above-described technical problem, provide an electronic device that is capable of accommodating more internal components and supplying higher power, and provide an associated fixing module, thereby effectively releasing and eliminating heat generated by the internal components of the electronic device when operating.
In order to achieve the above-mentioned objective, the present invention adopts the following technical solution:
A fixing module is provided for fixing an element onto a heat sink of an electronic device, the fixing module comprising an element holder for installing the element thereon, a first fixing element disposed on the element holder, and a second fixing element disposed on a support plate that is adjacent to the heat sink, wherein the second fixing element is complementary to and cooperates with the first fixing element to attach the element holder to the support plate, so that the element is fixed against the heat sink.
Further, the first fixing element comprises a head portion for coming into contact with the second fixing element and a neck portion extending from the element holder and connected to the head portion, wherein a first inner angle is formed between the head portion and the neck portion and corresponds to a second inner angle formed in the second fixing element.
Further, the second fixing element comprises a hook arm, the hook arm extending from a support plate edge of the support plate and being used to come into contact with the first fixing element, wherein the second inner angle formed between the support plate and the hook arm corresponds to the first inner angle.
Further, the first inner angle and the second inner angle are smaller than or equal to 120 degrees.
Further, the head portion comprises a primary contact region for coming into contact with an inner surface of the hook arm when the element is installed on the element holder and the element holder is installed on the heat sink, wherein the second inner angle is formed between the inner surface of the hook arm and the support plate.
Further, the head portion comprises at least one secondary contact region for coming into contact with at least one pin of the element, thereby allowing the element to be installed more securely on the element holder.
Further, the at least one secondary contact region is adjacent to the primary contact region and formed on a same side of the head portion together with the primary contact region.
Further, the support plate comprises at least one edge opening disposed on the support plate edge; when the element is installed on the element holder and the element holder is installed on the heat sink, the at least one edge opening is used to be passed through by the at least one pin of the element.
Further, the second fixing element is adjacent to the at least one edge opening.
Further, the at least one edge opening is an opening in the form of a hole or a notched used to, when the element is fixed against the heat sink, assist in calibrating the position of the at least one pin of the element.
Further, the element holder comprises: a first holder edge for disposing the first fixing element thereon; a second holder edge opposite to the first holder edge; and at least one holder leg disposed on the second holder edge and used to cooperate with an engaging element disposed on the electronic device when the element is fixed against the heat sink.
Further, the fixing module further comprises an auxiliary fixing device used to fix the element holder against the heat sink.
Further, the auxiliary fixing device comprises a pressing element allowed to be tilted towards the element holder, so that a force is applied to press the element holder, the pressing element comprising a spring.
Further, the auxiliary fixing device further comprises a fixing element extending from the pressing element and fixed in the electronic device.
Further, the fixing element is fixed in the electronic device by at least one screw.
Further, the support plate is an insulating plate made of an insulating material.
Further, the first fixing element and the element holder are formed integrally.
Further, the second fixing element and the support plate are formed integrally.
An electronic device is provided, comprising a housing, an insulating plate, and a fixing module as described above. The housing comprises at least one inner chamber for accommodating a first element, particularly a magnetic element, a peripheral wall of the inner chamber forming a heat sink. The insulating plate is made of an insulating material and covers the inner chamber. The fixing module is used to fix a second element against the heat sink, wherein the element holder is used to accommodate the second element. The second fixing element is disposed on the insulating plate and, when the second element is fixed against the heat sink, cooperating with the first fixing element to fix the element holder.
Further, the electronic device further comprises an electronic plate located above the insulating plate.
Further, the insulating plate comprises at least one edge opening formed on a support plate edge of the insulating plate and used to be passed through by the at least one pin of the second element when the second element is fixed against the heat sink, wherein the at least one pin of the second element is connected to the electronic plate.
Further, the insulating plate comprises at least one through hole through which at least one pin of the first element may pass for connection to the electronic plate.
Further, when the electronic plate is located above the insulating plate, pins of the first and second elements are inserted into the corresponding pin holes disposed in the electronic plate to be electrically connected to the electronic plate, respectively.
Further, the element holder comprises: a first holder edge for disposing the first fixing element thereon; a second holder edge opposite to the first holder edge; and at least one holder leg disposed on the second holder edge and used to cooperating with an engagement element in the electronic device so as to fix the element against the heat sink.
Further, the engagement element comprises at least one hole located in the peripheral wall of the inner chamber or located in a bottom plate of the housing, the peripheral wall of the inner chamber extending from the bottom plate.
An assembly method is provided for assembling the above-described electronic device, the method comprising at least the following steps: installing the second element on the element holder of the fixing module; introducing the at least one holder leg disposed at the second holder edge into the engagement element of the electronic device; and joining the first fixing element to the second fixing element disposed on the insulating plate, so that a contact surface of the second element comes into contact with an insulating gasket that is affixed to the peripheral wall of the inner chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 is a longitudinal sectional view of an embodiment of an electronic device of the present invention;
Figure 2 is a schematic diagram of the elements in the embodiment shown in Figure 1 and the fixing module that are assembled;
Figure 3 shows the respective structures of the fixing module in Figure 2 and the second element;
Figure 4 is a schematic diagram for the element holder in Figure 2 fixed onto the heat sink and the support plate; and
Figure 5 is another view of the element holder in Figure 3.

DETAILED DESCRIPTION

Substantial characteristics and advantages of the present invention will be described below in detail with reference to drawings and embodiments however, it should be understood that the present invention is not limited to the described embodiments.
Figure 1 is a longitudinal sectional view of an embodiment of an electronic device 10 of the present invention. The electronic device 10 comprises a housing 50, an electronic plate 18, an insulating plate 16, at least one first element 32, at least one second element 12, a heat sink 20, and a fixing module 200. The housing 50 may comprise a plurality of lateral walls and a bottom plate 51. The bottom plate 51 and the lateral walls form a primary chamber and an opening, the opening being opposite to the bottom plate 51, the primary chamber being used to accommodate the elements and components comprised by the electronic device 10, including the insulating plate 16, the at least one first element 32, the at least one second element 12, and the heat sink 20.
The primary chamber comprises an inner chamber formed between the insulating plate 16 and the bottom plate 51, the insulating plate 16 being parallel to the electronic plate 18 and covering the inner chamber. The inner chamber is used to accommodate at least some of the elements of the at least one first element 32 and the at least one second element 12. In the present embodiment, the inner chamber is used to accommodate the at least one first element 32. The at least one first element 32 is provided with at least one pin 325. On the insulating plate 16, a plurality of through holes 167 are disposed, through which pins of each of at least some of the elements of the at least one first element 32 and the at least one second element 12 may pass. The insulating plate 16 is made of an electrical insulating material; however, in addition to an insulation function, the insulating plate 16 also has a function of supporting an element and therefore may also be considered a support plate 16; the support function and the structure of the support plate 16 will be described in detail below.
The electronic plate 18 is located over the insulating plate 16 and covers the opening of the above-described primary chamber. A plurality of pin holes are disposed in the electronic plate 18. When the electronic plate 18 is located above the insulating plate 16, the pins of at least some of the elements of the at least one first element 32 and the at least one second element 12, after passing through the corresponding through holes 167 on the insulating plate 16, are inserted into the corresponding pin holes in the electronic plate 18; thus, the at least one first element 32 and the at least one second element 12 are electrically connected to the electronic plate 18. Further, the electronic plate 18 may be a printed circuit board (PCB) .
In an embodiment, the at least one first element 32 may comprise one or more magnetic elements, such as inductors or transformers; the at least one second element 12 may comprise one or more diodes or field-effect transistors, such as Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) . The electronic device 10 may be an on-board charger (OBC) suitable for an electric vehicle or gas-electric hybrid vehicle.
During the electronic device 10 operates, the at least one first element 32 and the at least one second element 12 generate tremendous heat, and the heat sink 20 is used to absorb the heat. Following the general design principle, the at least one first element 32 and the at least one second element 12 are installed close to the heat sink 20 wherever possible, so that the heat dissipation effect provided by the heat sink 20 may be improved.
In the present embodiment, the above-described inner chamber is used to accommodate the at least one first element 32; in addition, a peripheral wall of the inner chamber extends upwards from the bottom plate 51 (that is, extending towards the insulating plate 16 and the electronic plate 18) , and therefore may be considered a part of the bottom plate 51; in other words, the peripheral wall comprises the lateral walls and bottom wall of the chamber; further, in the bottom plate 51 (including the peripheral wall of the inner chamber) , the heat sink 20 is disposed in a manner to be adjacent to the insulating plate 16 and to allow the at least one first element 32 to be surrounded by the heat sink 20. Thus, heat generated by the at least one first element 32 may be absorbed, released, and eliminated more effectively by the heat sink 20. In addition, a gap is left between the peripheral wall as well as the bottom wall in the inner chamber and the first element 32, and the gap needs to be filled with a heat-conducting potting glue which is a liquid substance curable under specific conditions and which has the functions of conducting heat and providing electrical insulation.
Regarding heat dissipation for the at least one second element 12, by means of the fixing module 200, the at least one second element 12 is fixed against the heat sink 20, that is, against the peripheral wall of the inner chamber, as shown in Figure 2. As described above, the heat sink 20 is also adjacent to the support plate 16 (i.e. in the present embodiment, the above-described insulating plate 16) . In addition, the electronic device 10 may further comprise an insulating gasket 56 that is used to separate the heat sink 20 and the at least one second element 12. Further, the insulating gasket 56 is flatly affixed onto the peripheral wall of the inner chamber, as shown in Figure 2. The insulating gasket 56 is made of an insulation material which may preferably be an electrical insulating material having high heat conductivity, such as a heat-conducting silica-gel gasket.
The fixing module 200 comprises an element holder 40, at least one first fixing element 71, and at least one second fixing element 72; the support plate 16, in addition to the above-described through holes 167, further comprises at least one edge opening 165 that may be an opening in the form of a hole or a notch. Figure 3 shows the structures of the insulating plate 16, the at least one second element 12, and the element holder 40, respectively. Figure 5 is another view of the element holder 40 in Figure 3.
As shown in Figures 2 and 3, the element holder 40 is used to accommodate one or more second elements 12, and the support plate 16 comprises at least one support plate edge 161 on which one or more edge openings 165 are disposed; when the second elements 12 are installed on the element holder 40 and the element holder 40 is installed on the heat sink 20, the edge openings 165 are used to be passed through by the pins 125 of the second elements 12; in addition, when the second elements 12 are fixed against the heat sink 20, the openings are used to assist in calibrating positions of the pins 125 of the second elements 12. When the electronic plate 18 is disposed above the support plate 16 (the insulating plate 16) , the edge openings 165 are used to allow the pins 125 of the second elements 12 to be aligned with and inserted into corresponding pin holes disposed in the electronic plate 18, so that it becomes more convenient to assemble the electronic device 10.
In the present embodiment, as shown in Figures 3 and 5, the element holder 40 comprises a holder body 408 that may have the shape of a flat plate and comprise a first holder edge 401 and a second holder edge 402 that opposite to each other. On the holder body 408, at least one fixing post 407 and at least one support panel 408 are disposed; taking the installation of one second element 12 as example, the fixing post 407 is used to cooperate with a fixing hole 133 of an element body 122 of the second element 12 by inserting into the fixing hole 133 of the second element 12; thus, the second element 12 is installed on the support panel 408 of the element holder 40. The support panel 408 comes into contact with the bottom 130c of the element body 122 to assist in fixing the second element 12. The element body 122 of the second element 12 has a thickness 126 and two contact surfaces 130a, 130b, one 130b of which comes into contact with the holder body 408 when the second element 12 is installed on the element holder 40; the contact surface 130a, opposite to the contact surface 130b, comes into contact with the insulating gasket 56 when the element holder 40 is attached to the support plate 16 and fixed onto the heat sink 20, as shown in Figure 2.
In the example shown in Figures 2 and 3, the fixing module 200 comprises a plurality of first fixing elements 71 disposed on the element holder 40 and a plurality of second fixing element 72 disposed on the support plate 16; the second fixing element 72 and the first fixing elements 71 are complementary to and cooperating with each other and are all used to attach the element holder 40 that has carried the second elements 12 to the support plate 16 while fixing the element holder 40 onto the heat sink 20; in other words, by means of the fixing module 200, the element holder 40 that has carried the second elements 12 is fixed against the heat sink 20 and thus the second elements 12 are fixed against the heat sink 20, thereby enhancing the efficiency of the heat sink 20 in dissipating heat given off by the second elements 12.
In the present embodiment, the first fixing elements 71 are disposed on the first holder edge 401 of the element holder 40 and preferably in an equidistant distribution. Further, each of the first fixing elements 71 comprises a head portion 711 and a neck portion 712. The neck portion 712 extends from`the first holder edge 401 of the element holder 40 and is connected to the head portion 711; the head portion 711 is used to come into contact with the second fixing elements 72 disposed on the support plate 16. A fifth inner angle a5 is formed between the neck portion 712 and the holder body 408 that may be equal to or slightly larger than 90 degrees. In addition, in an embodiment, the neck portion 712 has a length that is equal to or slightly smaller than the thickness 126 of the element body 122 of the second element 12.
Further, the head portion 711 comprises a primary contact region 713 for coming into contact with an inner surface of a hook arm 723 of the second fixing element 72 when the second element 12 is installed on the element holder 40 and the element holder 40 is installed on the heat sink 2A a first inner angle a1 is formed between the head portion 711 and the neck portion 712, and corresponds to a second inner angle a2 formed in the second fixing element 72.
In the present embodiment, each of the second fixing elements 72 disposed on the support plate 16 is adjacent to one of the edge openings 165. Further, two second fixing elements 72 are separated by one or more edge openings 165; as shown in Figures 2 and 3, two second fixing elements 72 are separated by at least two edge openings 165 that correspond to two pins 125 of the second element 12. In the present embodiment, the hook arm 723 of the second fixing element 72 extends from a support plate edge 161 of the support plate 16 and is used to come into contact with the first fixing element 71, wherein an inner angle a2 formed between the inner surface of the hook arm 723 and the support plate 16 corresponds to the above-described first inner angle a1. Further, the first inner angle a1 and the second inner angle a2 are smaller than 120 degrees. In an embodiment, the values of the first inner angle a1 and the second inner angle a2 are the same. In another embodiment, the values of the first inner angle a1 and the second inner angle a2 may be different.
In addition, in order for to install the second element 12 to be installed more securely on the element holder 40 when the second element 12 is mounted on the element holder 40 and the element holder 40 is installed on the heat sink 20, the head portion 711 of the first fixing element 71 further comprises at least one secondary contact region 715a, 715b used to come into contact with one or more pins 125 of the second element 12, as shown in Figures 2 and 3. Preferably, the at least one secondary contact region 715a, 715b is adjacent to the primary contact region 713 and, together with the primary contact region 713, is formed on the a same side of the head portion 711 together with the primary contact region 713.
Further, the head portion 711 of the first fixing element 71 located at an end 401a of the first holder edge 401 comprises only one secondary contact region 715b, and the head portion 711 of the first fixing element 71 located at the other end 401b of the first holder edge 401 comprises only one secondary contact region 715a. The head portion 711 of each of the first fixing element 71 located between the two ends 401a and 401b of the first holder edge 401 comprises two secondary contact regions 715a, 715b.
In an embodiment, the element holder 40 further comprises at least one holder leg 405 disposed at the second holder edge 402; as shown in Figure 3, the element holder 40 comprises four holder legs 405. Preferably, the at least one holder leg 405 and element holder 40 are formed integrally.
Figure 4 is a schematic diagram for the element holder 40 in Figure 2 fixed onto the heat sink 20 and the support plate 16. In the process of assembling the electronic device 10, after the second elements 12 are installed on the element holder 40, the holder legs 405 are used to fit cooperate with an articulating engagement element 93 of the electronic device 10. The engagement element 93 may be located on the bottom plate 51 or on the peripheral wall of the above-described inner chamber. Further, the engaement element 93 comprises one or more holes; in the example shown in Figures 3 and 4, the four holes of the engagement element 93 correspond to the four holder legs 405, respectively; in the above-described assembly process, the holder legs 405 of the element holder 40 that has carried the second elements 12 are respectively placed into one or more holes of the engagement element 93. After the holder legs 405 are placed into the engagement element 93, the element holder 40, using the holder legs 405 as fulcrum, is pushed towards the support plate 16 (namely, the insulating plate 16) and the heat sink 20, then the first fixing element 71 being joined to the second fixing element 72 disposed on the insulating plate 16, as indicated by arrow F1 in Figure 4, allowing respective contact surface 130a of the second elements 12 to come into contact with the insulating gasket 56 affixed to the heat sink 20; in this case, the second elements 12 are fixed against the heat sink 20.
The first fixing element 71, the second fixing element 72, the element holder 40, and the support plate 16 may be made of plastic, respectively.
In an embodiment, the first fixing element 71 and the element holder 40 are formed integrally. In another embodiment, the second fixing element 72 and the support plate 16 are formed integrally. In a preferred embodiment, the first fixing element 71 and the element holder 40 are formed integrally, and the second fixing element 72 and the support plate 16 are also formed integrally.
Further, in a preferred embodiment, the fixing module 200 further comprises an auxiliary fixing device 80 used to enhance the effect of causing fixing the element holder 40 to be pressed against and fixed onto the heat sink 20. In the present embodiment, the auxiliary fixing device 80 comprises a pressing element 81 and a fixing element 82. The pressing element 81 may be made of a slightly elastic material that allows the pressing element 81 to tilt towards the element holder 40, thereby applying a force to press the element holder 40. Further, the pressing element 81 may be a spring. In an embodiment, an inner angle smaller than 35 degrees is formed between the pressing element 81 and the holder body 408 of the element holder 40. In addition, in the present embodiment, the fixing element 82 is formed extending from the pressing element 81 and may fix the fixing element 82 in the electronic device 10 by one or more screws 83, as shown in Figure 2. Preferably, a fourth inner angle a4 greater than 90 degrees is formed between the pressing element 81 and the fixing element 82.
The heat sink 20 of the present invention may be made of one of the following materials: aluminium and aluminium alloy, copper and copper alloy. A coolant in the heat sink 20 may be water, an oil, or a mixture thereof, or a mixture of water and ethylene alcohol; however, the present invention is not limited to a material selected for the heat sink 20 or the coolant.
The electronic device 10 of the present invention may supply higher power and accommodate more internal elements while ensuring that heat generated by these internal elements during operating is absorbed, released, and eliminated effectively. Still further, the fixing module 200 of the present invention allows the second elements 12 to be fixed against the heat sink 20; thus, heat generated by the second elements 12 when operating may be absorbed, eliminated, and released effectively by heat sink 20.
While the present invention has been particularly described above with reference to preferred embodiments, it should be understood that those of ordinary skill in the art can make various improvements and modifications without departing from the principle of the present invention, and that such improvements and modifications also fall into the protection scope of the present invention.

Claims

A fixing module (200) for fixing an element (12) onto a heat sink (20) of an electronic device (10) , said fixing module (200) being characterised by comprising:

- an element holder (40) for installing said element (12) thereon;

- a first fixing element (71) disposed on said element holder (40) ; and

- a second fixing element (72) disposed on a support plate (16) that is adjacent to said heat sink (20) , wherein said second fixing element (72) is complementary to and cooperating with said first fixing element (71) to attach said element holder (40) to said support plate (16) , so that said element (12) is fixed against said heat sink (20) .
Fixing module (200) according to Claim 1, characterised in that said first fixing element (71) comprises:

- a head portion (711) for coming into contact with said second fixing element (72) ; and

- a neck portion (712) that extends from said element holder (40) and is connected to said head portion (711) ,

wherein a first inner angle (a1) corresponding to a second inner angle (a2) formed in said second fixing element (72) is formed between said head portion (711) and said neck portion (712) .
Fixing module (200) according to Claim 2, characterised in that said second fixing element (72) comprises a hook arm (723) extending from a support plate edge (161) of said support plate (16) and being used to come into contact with said first fixing element (71) , wherein said second inner angle (a2) formed between said support plate (16) and said hook arm (723) corresponds to said first inner angle (a1) .
Fixing module (200) according to Claim 3, characterised in that said first inner angle (a1) and said second inner angle (a2) are both smaller than or equal to 120 degrees.
Fixing module (200) according to Claim 3, characterised in that said head portion (711) comprises a primary contact region (713) for coming into contact with an inner surface of said hook arm (723) when said element (12) is installed on said element holder (40) and said element holder (40) is installed on said heat sink (20) , wherein said second inner angle (a2) is formed between said inner surface of said hook arm (723) and said support plate (16) .
Fixing module (200) according to Claim 5, characterised in that said head portion (711) comprises at least one secondary contact region (715a, 715b) for coming into contact with at least one pin (125) of said element (12) , so that said element (12) can be installed more securely on said element holder (40) .
Fixing module (200) according to Claim 5, characterised in that said at least one secondary contact region (715a, 715b) is adjacent to said primary contact region (713) and is formed on a same side of said head portion (711) with said primary contact region (713) .
Fixing module (200) according to Claim 6, characterised in that said support plate (16) comprises at least one edge opening (165) disposed on said support plate edge (161) ; wherein, when said element (12) is installed on said element holder (40) and said element holder (40) is installed on said heat sink (20) , said at least one edge opening (165) is used to be passed through by said at least one pin (125) of said element (12) .
Fixing module (200) according to Claim 8, characterised in that said second fixing element (72) is adjacent to said at least one edge opening (165) .
Fixing module (200) according to Claim 8, characterised in that said at least one edge opening (165) is an opening in the form of a hole or a notch used to assist in calibrating the position of said at least one pin (125) of said element (12) when said element (12) is fixed against said heat sink (20) .
Fixing module (200) according to Claim 1, characterised in that said element holder (40) comprises:

- a first holder edge (401) for disposing said first fixing element (71) thereon;

- a second holder edge (402) opposite to said first holder edge (401) ; and

- at least one holder leg (405) disposed on said second holder edge (402) and used to cooperate with an engagement element (93) in said electronic device (10) when said element (12) is fixed against said heat sink (20) .
Fixing module (200) according to Claim 1, characterised in that the fixing module (200) further comprises an auxiliary fixing device (80) used to fix said element holder (40) against said heat sink (20) .
Fixing module (200) according to Claim 12, characterised in that said auxiliary fixing device (80) comprises a pressing element (81) allowed to be tilted towards said element holder (40) , thus applying a force to press said element holder (40) , said pressing element (81) comprising a spring.
Fixing module (200) according to Claim 13, characterised in that said auxiliary fixing device (80) further comprises a fixing element (82) extending from said pressing element (81) and fixed in said electronic device (10) .
Fixing module (200) according to Claim 14, characterised in that said fixing element (82) is fixed in said electronic device (10) by means of at least one screw (83) .
Fixing module (200) according to Claim 1, characterised in that said support plate (16) is an insulating plate made of insulating material.
Fixing module (200) according to Claim 1, characterised in that:

- said first fixing element (71) and said element holder (40) are formed integrally, and/or

- said second fixing element (72) and said support plate (16) are formed integrally.
Electronic device (10) , characterised in that it comprises:

- a housing (50) comprising at least one inner chamber for accommodating a first element (32) , particularly a magnetic element, a peripheral wall of the inner chamber forming a heat sink (20) ;

- an insulating plate (16) made of insulating material and covering said inner chamber; and

- the fixing module (200) according to any one of Claims 1 to 17, for fixing a second element (12) against said heat sink (20) ,

wherein said element holder (40) is used to accommodate said second element (12) ; said second fixing element (72) being disposed on said insulating plate (16) and, when said second element (12) being fixed against said heat sink (20) , cooperating with said first fixing element (71) for fixing said element holder (40) .
Electronic device (10) according to Claim 18, characterised in that said electronic device (10) further comprises an electronic plate (18) located above said insulating plate (16) .
Electronic device (10) according to Claim 18, characterised in that said insulating plate (16) comprises at least one edge opening (165) formed on a support plate edge (161) of said insulating plate (16) and used to, when said second element (12) is fixed against said heat sink (20) , be passed through by said at least one pin (125) of said second element (12) , wherein said at least one pin (125) of said second element (12) is connected to said electronic plate (18) .
Electronic device (10) according to Claim 18, characterised in that said insulating plate (16) comprises at least one through hole (167) through which at least one pin of said first element (32) may pass for connection to said electronic plate (18) .
Electronic device (10) according to Claim 19, characterised in that, when said electronic plate (18) is located above said insulating plate (16) , the pins (325, 125) of said first and second elements (32, 12) are inserted into the corresponding pin holes disposed in said electronic plate (18) to be electrically connected to said electronic plate (18) , respectively.
Electronic device (10) according to Claim 18, characterised in that said element holder (40) comprises:

- a first holder edge (401) for disposing said first fixing element (71) thereon;

- a second holder edge (402) opposite to said first holder edge (401) ; and

- at least one holder leg (405) disposed on said second holder edge (402) and used to cooperate with an engagement element (93) in said electronic device (10) , so as to fix said element (12) against said heat sink (20) .
Electronic device (10) according to Claim 23, characterised in that said engagement element (93) comprises at least one hole located in said peripheral wall of said inner chamber or located in a bottom plate (51) of said housing (50) , said peripheral wall of said inner chamber extending from said bottom plate (51) .
Assembly method for assembling the electronic device (10) according to Claim 23, characterised in that the assembly method comprises at least the following steps:

a) installing said second element (12) on said element holder (40) of said fixing module (200) ;

b) placing said at least one holder leg (405) disposed at said second holder edge (402) into said engagement element (93) of said electronic device (10) ; and

c) joining said first fixing element (71) to said second fixing element (72) disposed on said insulating plate (16) , so that a contact surface (130a) of said second element (12) comes into contact with an insulating gasket (56) affixed to said enclosing wall of said inner chamber.