EP4026176A4 - Module thermoélectrique - Google Patents

Module thermoélectrique Download PDF

Info

Publication number
EP4026176A4
EP4026176A4 EP20860493.4A EP20860493A EP4026176A4 EP 4026176 A4 EP4026176 A4 EP 4026176A4 EP 20860493 A EP20860493 A EP 20860493A EP 4026176 A4 EP4026176 A4 EP 4026176A4
Authority
EP
European Patent Office
Prior art keywords
thermoelectric module
thermoelectric
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20860493.4A
Other languages
German (de)
English (en)
Other versions
EP4026176A1 (fr
Inventor
Jong Hyun Kim
Young Sam Yoo
Se Woon Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020190109664A external-priority patent/KR20210028494A/ko
Priority claimed from KR1020190109663A external-priority patent/KR20210028493A/ko
Priority claimed from KR1020190109662A external-priority patent/KR20210028492A/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP4026176A1 publication Critical patent/EP4026176A1/fr
Publication of EP4026176A4 publication Critical patent/EP4026176A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
EP20860493.4A 2019-09-04 2020-09-03 Module thermoélectrique Pending EP4026176A4 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020190109664A KR20210028494A (ko) 2019-09-04 2019-09-04 열전모듈
KR1020190109663A KR20210028493A (ko) 2019-09-04 2019-09-04 열전모듈
KR1020190109662A KR20210028492A (ko) 2019-09-04 2019-09-04 열전모듈
PCT/KR2020/011826 WO2021045516A1 (fr) 2019-09-04 2020-09-03 Module thermoélectrique

Publications (2)

Publication Number Publication Date
EP4026176A1 EP4026176A1 (fr) 2022-07-13
EP4026176A4 true EP4026176A4 (fr) 2023-09-13

Family

ID=74852968

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20860493.4A Pending EP4026176A4 (fr) 2019-09-04 2020-09-03 Module thermoélectrique

Country Status (6)

Country Link
US (1) US11974503B2 (fr)
EP (1) EP4026176A4 (fr)
JP (1) JP2022547108A (fr)
CN (1) CN114365298A (fr)
TW (1) TW202119657A (fr)
WO (1) WO2021045516A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983003924A1 (fr) * 1982-05-05 1983-11-10 Burroughs Corporation Dissipateur thermique omnidirectionnel induisant de faibles contraintes
US6176304B1 (en) * 1998-11-24 2001-01-23 Hon Hai Precision Ind. Co., Ltd. Heat sink
JP2007093106A (ja) * 2005-09-28 2007-04-12 Kyocera Corp 熱交換装置
EP2426748A1 (fr) * 2010-09-07 2012-03-07 Kabushiki Kaisha Toyota Jidoshokki Unité de semi-conducteur
WO2013002423A1 (fr) * 2011-06-30 2013-01-03 Kabushiki Kaisha Toyota Jidoshokki Modules de conversion thermoélectrique

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846248A (ja) 1994-07-29 1996-02-16 Seiko Instr Inc 熱電素子及びその製造方法
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US6385976B1 (en) 2000-09-08 2002-05-14 Ferrotec (Usa) Corporation Thermoelectric module with integrated heat exchanger and method of use
US7838760B2 (en) 2002-11-25 2010-11-23 Nextreme Thermal Solutions, Inc. Trans-thermoelectric device
US7299639B2 (en) * 2004-06-22 2007-11-27 Intel Corporation Thermoelectric module
US7855396B2 (en) 2006-02-20 2010-12-21 Industrial Technology Research Institute Light emitting diode package structure
KR102170479B1 (ko) 2014-02-14 2020-10-28 엘지이노텍 주식회사 열전환장치
KR101820424B1 (ko) * 2014-05-13 2018-01-19 엘지이노텍 주식회사 열전환장치
CN105609625A (zh) * 2016-03-11 2016-05-25 厦门理工学院 采用银浆粘结的热电发电器件
KR20180029746A (ko) 2016-09-13 2018-03-21 엘지이노텍 주식회사 열전모듈
EP3526822B1 (fr) * 2016-10-14 2020-03-18 Magna Seating Inc. Dissipateur thermique en ruban de graphite flexible pour dispositif thermoélectrique
KR20190038103A (ko) 2017-09-29 2019-04-08 엘지이노텍 주식회사 열전소자

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983003924A1 (fr) * 1982-05-05 1983-11-10 Burroughs Corporation Dissipateur thermique omnidirectionnel induisant de faibles contraintes
US6176304B1 (en) * 1998-11-24 2001-01-23 Hon Hai Precision Ind. Co., Ltd. Heat sink
JP2007093106A (ja) * 2005-09-28 2007-04-12 Kyocera Corp 熱交換装置
EP2426748A1 (fr) * 2010-09-07 2012-03-07 Kabushiki Kaisha Toyota Jidoshokki Unité de semi-conducteur
WO2013002423A1 (fr) * 2011-06-30 2013-01-03 Kabushiki Kaisha Toyota Jidoshokki Modules de conversion thermoélectrique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021045516A1 *

Also Published As

Publication number Publication date
EP4026176A1 (fr) 2022-07-13
CN114365298A (zh) 2022-04-15
US11974503B2 (en) 2024-04-30
US20220320409A1 (en) 2022-10-06
WO2021045516A1 (fr) 2021-03-11
JP2022547108A (ja) 2022-11-10
TW202119657A (zh) 2021-05-16

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