EP3988617A4 - Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production methods therefor - Google Patents

Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production methods therefor Download PDF

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Publication number
EP3988617A4
EP3988617A4 EP21820076.4A EP21820076A EP3988617A4 EP 3988617 A4 EP3988617 A4 EP 3988617A4 EP 21820076 A EP21820076 A EP 21820076A EP 3988617 A4 EP3988617 A4 EP 3988617A4
Authority
EP
European Patent Office
Prior art keywords
thermally conductive
conductive silicone
production methods
gel composition
methods therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP21820076.4A
Other languages
German (de)
French (fr)
Other versions
EP3988617A1 (en
EP3988617C0 (en
EP3988617B1 (en
Inventor
Shingo Todo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Polymer Industries Co Ltd
Original Assignee
Fuji Polymer Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Polymer Industries Co Ltd filed Critical Fuji Polymer Industries Co Ltd
Priority claimed from PCT/JP2021/012856 external-priority patent/WO2022049815A1/en
Publication of EP3988617A1 publication Critical patent/EP3988617A1/en
Publication of EP3988617A4 publication Critical patent/EP3988617A4/en
Application granted granted Critical
Publication of EP3988617C0 publication Critical patent/EP3988617C0/en
Publication of EP3988617B1 publication Critical patent/EP3988617B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP21820076.4A 2020-09-03 2021-03-26 Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production methods therefor Active EP3988617B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020147982 2020-09-03
PCT/JP2021/012856 WO2022049815A1 (en) 2020-09-03 2021-03-26 Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production methods therefor

Publications (4)

Publication Number Publication Date
EP3988617A1 EP3988617A1 (en) 2022-04-27
EP3988617A4 true EP3988617A4 (en) 2022-10-26
EP3988617C0 EP3988617C0 (en) 2023-08-30
EP3988617B1 EP3988617B1 (en) 2023-08-30

Family

ID=78028249

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21820076.4A Active EP3988617B1 (en) 2020-09-03 2021-03-26 Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production methods therefor

Country Status (5)

Country Link
US (1) US20220306862A1 (en)
EP (1) EP3988617B1 (en)
JP (1) JP6938808B1 (en)
KR (1) KR20230059675A (en)
CN (1) CN114667319A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN216162757U (en) * 2021-05-25 2022-04-01 三赢科技（深圳）有限公司 Lens module and electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5304588B2 (en) * 2009-10-26 2013-10-02 信越化学工業株式会社 Thermally conductive silicone composition and cured product thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS534588B2 (en) 1973-06-23 1978-02-18
JP2010155870A (en) * 2007-04-20 2010-07-15 Denki Kagaku Kogyo Kk Thermally conductive compound and method for producing the same
JP2020002236A (en) 2018-06-27 2020-01-09 信越化学工業株式会社 Heat-conductive silicone composition, heat-conductive silicone sheet, and method of manufacturing the same
JP7033047B2 (en) 2018-10-26 2022-03-09 信越化学工業株式会社 Thermally conductive silicone composition and its cured product
JP7148965B2 (en) 2018-11-08 2022-10-06 北川工業株式会社 COMPOSITION FOR LOW-DIELECTRIC HEAT CONDUCTIVE MATERIAL AND LOW-DIELECTRIC HEAT CONDUCTIVE MATERIAL

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5304588B2 (en) * 2009-10-26 2013-10-02 信越化学工業株式会社 Thermally conductive silicone composition and cured product thereof

Also Published As

Publication number Publication date
KR20230059675A (en) 2023-05-03
EP3988617A1 (en) 2022-04-27
EP3988617C0 (en) 2023-08-30
JPWO2022049815A1 (en) 2022-03-10
EP3988617B1 (en) 2023-08-30
CN114667319A (en) 2022-06-24
JP6938808B1 (en) 2021-09-22
US20220306862A1 (en) 2022-09-29

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