Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/61—Types of temperature control
  • H01M10/615—Heating or keeping warm
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
  • H01M10/623—Portable devices, e.g. mobile telephones, cameras or pacemakers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/63—Control systems
  • H01M10/635—Control systems based on ambient temperature
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/65—Means for temperature control structurally associated with the cells
  • H01M10/655—Solid structures for heat exchange or heat conduction
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/60—Heating or cooling; Temperature control
  • H01M10/65—Means for temperature control structurally associated with the cells
  • H01M10/657—Means for temperature control structurally associated with the cells by electric or electromagnetic means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
  • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
  • H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
  • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
  • H01M50/247—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders specially adapted for portable devices, e.g. mobile phones, computers, hand tools or pacemakers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M2220/00—Batteries for particular applications
  • H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/10—Energy storage using batteries

Definitions

• This application relates to the field of consumer electronic devices, and particularly maintaining and extending the life of batteries that provide power to consumer electronic devices when the device operates in cold conditions.
• Battery performance of current battery technologies is temperature dependent. Cold temperatures can significantly reduce battery run time. For example, battery capacity is known to drop from 860 mAh at 30° C to 550 mAh when the battery is operating at -20°C. This loss in battery capacity adversely impacts user experience when electronic devices are used in cold conditions. While many advancements have been made in the general field of automotive battery technologies to maintain optimal battery temperature and address the adverse effects of cold conditions on battery capacity, improvements are still needed to address the ongoing evolution of consumer electronic device technologies.
• Battery capacity is further limited by the size of the corresponding consumer device, especially consumer devices that are wearable and limited in size to a user’s anatomy.
• Earbuds for example, are designed to fit within an user’s ear. There is little space within the earbud housing to accommodate larger high capacity batteries, along with the other required circuitry and internal components positioned within the housing of the wireless earbuds.
• batteries for earbud assemblies are commonly positioned in a part of the earbud housing that is outside of the ear canal and may not even be positioned next to a user’s ear.
• an electronic device assembly includes an outer housing, a battery, an insulation layer, a printed circuit board and an elongated heat conductor.
• the battery and insulation layer may be disposed within the outer housing.
• the printed circuit board may be positioned adjacent the insulation layer.
• the heat conductor may be directly adjacent the insulation layer and extend between the insulation layer and the printed circuit board.
• the insulation layer may extend between an interior surface of the outer housing and a surface of the elongated heat conductor.
• the electronic device may be an electronic wearable device comprising an earbud assembly.
• the insulation layer can further comprise an aerogel material.
• the elongated heat conductor can extend along a surface of the aerogel material facing away from a closest interior surface of the outer housing.
• the elongated heat conductor may be a thin metal.
• a thermally conductive component can also be positioned adjacent a surface of the battery and a surface of the heat conductor.
• the thermally conductive component may be one of a heat pipe, a heat spreader, and a thermally conductive material extending along the surface of the battery.
• the surface of the battery may be a rear surface, and the thermally conductive component may be a heat spreader that extends along the rear surface of the battery and edge surfaces of the battery.
• a system includes an electronic device and a charging case assembly configured to charge the electronic device therein.
• the charging case further includes a charging case outer housing, a battery disposed within the outer housing, and a magnet adjacent the battery.
• the magnet may be configured to generate an electromagnetic field.
• the electronic device assembly includes an outer housing, a battery, an insulation layer, a printed circuit board and an elongated heat conductor.
• the battery and insulation layer may be disposed within the outer housing.
• the printed circuit board may be positioned adjacent the insulation layer.
• the heat conductor may be directly adjacent the insulation layer and extend between the insulation layer and the printed circuit board.
• the insulation layer may extend between an interior surface of the outer housing and a surface of the elongated heat conductor.
• a method for heating a wearable electronic device coupled to a charging case includes determining, by a processor, whether the wearable device is positioned within a charging case; determining, by a processor, ambient temperature external to the charging case or at a pre-selected location; determining, by a processor, whether the ambient temperature is at or below a pre-selected temperature; and when the electronic device is positioned within the charging case and when the ambient temperature is at or below the pre-selected temperature, initiating, by a processor, inductive heating of the earbud assembly.
• initiating pre-heating of the assembly includes generating an electromagnetic energy field by the charging case.
• the wearable device is an earbud assembly.
• the earbud assembly may further include a heat conductor adjacent an aerogel insulation layer.
• Inductive heating of earbud assembly can further include generating an electromagnetic energy field within the charging case, and absorbing the energy from the electromagnetic energy field by the heat conductor within the earbud assembly.
• the heat conductor may be an elongated metal structure extending along a length of the printed circuit board.
• determining whether the wearable device is positioned within the charging case includes determining whether charging contacts on the wearable device are in contact with charging contacts on the charging case.
• the ambient temperature determined by the one or more processors is the ambient temperature external to the charging case. [0014] In another example of this aspect, the ambient temperature determined by the one or more processors is current ambient temperature at the pre-selected location.
• the pre-selected location is designated by a user.
• the pre-selected location is designated by the one or more processors based on a compilation of data regarding user activities.
• the one or more processors prior to initiating pre-heating, determine user location.
• FIGURES 1A-1B are schematic views depicting a system of wirelessly paired computing devices in accordance with aspects of the disclosure.
• FIGURE 2 is a perspective view of an example electronic device according to aspects of the disclosure.
• FIGURE 3 is a schematic cross-sectional view of an example main body of the earbud assembly shown in FIGURE 2.
• FIGURE 4 is a schematic cross-sectional view of an example main body of another example earbud assembly.
• FIGURE 5 is a schematic cross-sectional view of an example main body of another example earbud assembly.
• FIGURE 6A is a perspective view of an example electronic device according to aspects of the disclosure.
• FIGURE 6B is a schematic cross-sectional view of an example main body of the watch assembly shown in FIGURE 6A.
• FIGURE 7 is a schematic cross-sectional front view of an example charging case according to aspects of the disclosure.
• FIGURE 8 is a schematic cross-sectional side view of the example charging case shown in FIGURE 7.
• FIGURE 8A is a perspective view of an example earbud assembly positioned with the example charging case.
• FIGURE 9 is an exploded schematic example of heat induction of the example earbud assembly of FIGURES 2-3, when the earbud assembly is positioned within the example charging case.
• FIGURE 10 is a flow chart of an example method according to aspects of the disclosure.
• FIGURE 11 is a flow chart of another example method according to aspects of the disclosure.
• FIGURE 12 is a flow chart of another example method according to aspects of the disclosure. DETAILED DESCRIPTION OVERVIEW
• Improved electronic devices, systems, and methods for maintaining the battery of the electronic device at an optimal temperature are disclosed.
• the optimal temperature of the battery may range between 15°C to 35°C, or any other temperature or temperature range pre-determined by a user.
• devices, systems, and methods to maintain the life of a battery within an electronic device during cold conditions are disclosed.
• wearable consumer electronics include, but are not limited to wireless earbuds, smart watch, smart eyeglasses, smart jewelry, or electronic devices within or formed integrally with clothing and the like,
• One aspect of the disclosure focuses on the structure and components of a wearable electronic device that allow for greater heat retention within the electronic device, as well as heat transfer from the human body to the electronic device during operation in cold conditions.
• a wearable electronic device is an earbud assembly that includes an arrangement of components, including an aerogel insulation layer with a directly adjacent heat conductor that can maintain heat within earbud assembly, as well as transfer heat from a user’s body to the interior of the earbud.
• the earbud assembly can include additional structures or components for enhancing the distribution of heat from a user’s body to the battery and heat conductor, such as a heat pipe, heat spreader, or thermally conductive fill material.
• the earbud assembly can be heated prior to use in cold conditions, to extend battery life.
• a charging case for the electronic device can inductively heat the earbuds so that the battery within the earbuds remains at a good temperature, despite colder ambient temperature.
• maintaining the battery of the electronic device at an optimal temperature can be automated based on machine learning.
• Processors and the like that provide machine learning may be in communication with weather reports in the area from third party applications and the like.
• the machine learning may be more complex and based on a combination of weather reports and a user’s daily habits, in connection with use of the earbud assembly. For example, through machine learning, it may be established that a user listens to music on the user’s earbuds while taking a jog on Monday, Wednesday, and Friday mornings from 7:00-7:30 am. With this stored information, a processor can determine time, date and temperature at any given time, and compare it to stored parameters.
• the processor can initiate pre -heating of the earbud assembly at 6:45 am to ensure that the battery within the earbuds is warmed up by 7:00 am. Conversely, when it is determined that temperatures are high, pre-heating of the earbud assembly is not required. Pre-heating will not be initiated and the battery is allowed to operate at the current and optimal temperature. Indeed, the unnecessary discharge and warming of the battery can shorten the life of the battery. Automated methods for optimizing the temperature of the battery can therefore prolong battery life in addition to, or as an alternative to the disclosed features of the earbud assemblies disclosed herein. EXAMPLE SYSTEMS FOR IMPLEMENTING METHODS OF OPTIMIZING BATTERY TEMPERATURE
• FIGURES 1A and IB include an example system 8 configured to perform methods to optimize the temperature of the battery, including pre-heating an electronic devices or making a determination not to pre-heat an electronic device, as discussed in more detail herein (SEE FIGS. 10-12). It should not be considered as limiting the scope of the disclosure or usefulness of the features described herein.
• system 100 can include computing devices 10, 20, 30, 40, 44, and 46, as well as storage system 50.
• Each computing device 10 can contain one or more processors 12, memory 14 and other components typically present in general purpose computing devices.
• Memory 14 of each of computing devices 10, 20, 30, 40, 44, and 46 can store information accessible by the one or more processors 12, including instructions 16 that can be executed by the one or more processors 12.
• Memory can also include data 18 that can be retrieved, manipulated or stored by the processor.
• the memory can be of any non-transitory type capable of storing information accessible by the processor, such as a hard-drive, memory card, ROM, RAM, DVD, CD-ROM, write-capable, and read-only memories.
• Data 18 may include the current time, temperature and location of a user. Data may further include resulting data from machine learning of a user’s habits. Data 18 can further include exact dates, times, and locations that a user is expected to use an electronic device, and in which it may be required to pre-heat the device in order to optimize battery temperature in cold conditions.
• the instructions 16 can be any set of instructions to be executed directly, such as machine code, or indirectly, such as scripts, by the one or more processors.
• the terms "instructions,” “application,” “steps,” and “programs” can be used interchangeably herein.
• the instructions can be stored in object code format for direct processing by a processor, or in any other computing device language including scripts or collections of independent source code modules that are interpreted on demand or compiled in advance. Functions, methods, and routines of the instructions are explained in more detail below.
• instructions 16 when it is confirmed that the parameters necessary for pre-heating or pre warming of the electronic device are satisfied, instructions 16 will initiate the process to begin pre -heating of electronic devices.
• the charging case can be instructed to generate an electromagnetic field.
• battery temperature can be optimized by not initiating pre -heating and unnecessarily causing battery discharge.
• Data 18 may be retrieved, stored or modified by the one or more processors 12 in accordance with the instructions 16.
• the data can be stored in computer registers, in a relational database as a table having many different fields and records, or XML documents.
• the data can also be formatted in any computing device -readable format such as, but not limited to, binary values, ASCII or Unicode.
• the data can comprise any information sufficient to identify the relevant information, such as numbers, descriptive text, proprietary codes, pointers, references to data stored in other memories such as at other network locations, or information that is used by a function to calculate the relevant data.
• the one or more processors 12 can be any conventional processors, such as a commercially available CPU. Alternatively, the processors can be dedicated components such as an application specific integrated circuit ("ASIC") or other hardware-based processor. Although not necessary, one or more of computing devices 10 may include specialized hardware components to perform specific computing processes, such as decoding video, matching video frames with images, distorting videos, encoding distorted videos, etc. faster or more efficiently.
• the processors can be used to evaluate current data against pre-stored data to determine whether parameters for pre -heating of an electronic device have been satisfied. For example, the processors may compare the current time, temperature, and location against a pre-stored time, temperature, and location or range of times, temperatures, and locations. If the current time, temperature, and location match the pre-stored time temperature, and location, the processor can send instructions to the charging case to initiate pre-heating.
• the processors can also be utilized for machine learning. For example, information regarding a user’s daily habits may be compiled in storage system 50. Based on a compilation of the user’s daily habits, a processor can identify patterns in the user’s behavior. For example, based on a compilation of the user’s activities, the processor may determine that a user may use earbuds while jogging on Monday, Wednesday, and Friday mornings from 7:00-7:30 am. This information can then be stored as data points or parameters that the processor can then compare to current data points at any given time. If at a given time the parameters are met, the processor can initiate pre-heating of the electronic device.
• Figure 1 functionally illustrates the processor, memory, and other elements of computing device 10 as being within the same block
• the processor, computer, computing device, or memory can actually comprise multiple processors, computers, computing devices, or memories that may or may not be stored within the same physical housing.
• the memory can be a hard drive or other storage media located in housings different from that of the computing devices 10.
• references to a processor, computer, computing device, or memory will be understood to include references to a collection of processors, computers, computing devices, or memories that may or may not operate in parallel.
• the computing devices 10 may include server computing devices operating as a load-balanced server farm, distributed system, etc.
• some functions described below are indicated as taking place on a single computing device having a single processor, various aspects of the subject matter described herein can be implemented by a plurality of computing devices, for example, communicating information over network 60.
• Each of the computing devices 10 can be at different nodes of a network 60 and capable of directly and indirectly communicating with other nodes of network 60. Although only a few computing devices are depicted in FIGURES 1 A- IB, it should be appreciated that a typical system can include a large number of connected computing devices, with each different computing device being at a different node of the network 60.
• the network 60 and intervening nodes described herein can be interconnected using various protocols and systems, such that the network can be part of the Internet, World Wide Web, specific intranets, wide area networks, or local networks.
• the network can utilize standard communications protocols, such as Ethernet, WiFi and HTTP, protocols that are proprietary to one or more companies, and various combinations of the foregoing.
• each of the computing devices 10 may include web servers capable of communicating with storage system 50 as well as computing devices 20, 30, and 40, 44, and 46 via the network.
• server computing devices 10 may use network 60 to transmit and present information to a user, such as user 210, 23, or 25, on a display, such as displays 22, 32, or 42 of computing devices 20, 30, or 40.
• computing devices 20, 30, and 40, including computing devices 144, 146 may be considered client computing devices and may perform all or some of the features described herein.
• Each of the client computing devices 20, 30, and 40, 44, or 46 may be configured similarly to the server computing devices 10, with one or more processors, memory and instructions as described above.
• Each client computing device 20, 30, 40, 44 or 46 may be a personal computing device intended for use by a user 220, 230, 240, and have all of the components normally used in connection with a personal computing device such as a central processing unit (CPU), memory (e.g., RAM and internal hard drives) storing data and instructions, a display such as displays 22, 32, or 42 (e.g., a monitor having a screen, a touch-screen, a projector, a television, or other device that is operable to display information), and user input device 24 (e.g., a mouse, keyboard, touch-screen, or microphone).
• CPU central processing unit
• memory e.g., RAM and internal hard drives
• a display such as displays 22, 32, or 42
• user input device 24 e.g., a mouse, keyboard, touch-screen, or microphone.
• client computing devices 20, 30, 40, 44, or 46 may each comprise a full- sized personal computing device, they may alternatively comprise mobile computing devices capable of wirelessly exchanging data with a server over a network such as the Internet.
• client computing device 20 may be a mobile phone or a device such as a wireless-enabled PDA, a tablet PC, or a netbook that is capable of obtaining information via the Internet.
• client computing device 30 may be a smart watch.
• the user may input information using a touch screen display 30, a microphone for voice prompts and the like.
• Client computing device 44 may be an earbud assembly and client computing device 46 may be a charging case for use with earbud assembly, in which both the charging case and earbud assembly are in communication with client computing device 20 or client computing device 30.
• storage system 50 can be of any type of computerized storage capable of storing information accessible by the server computing devices 10, such as a hard-drive, memory card, ROM, RAM, DVD, CD-ROM, write-capable, and read-only memories.
• storage system 50 may include a distributed storage system where data is stored on a plurality of different storage devices which may be physically located at the same or different geographic locations.
• Storage system 50 may be connected to the computing devices via the network 60 as shown in Figure 1 and/or may be directly connected to any of the computing devices 10, 20, 30, 40, 44, and 46.
• storage system 50 may store various data compiled for machine learning purposes.
• storage system may store data regarding a user’s daily habits, such as commuting times, commuting distance, and location to work. It may also store additional information regarding user’ s use of computing devices 144, in connection with the user’s daily habits. This information can then be utilized to establish patterns in the user’s daily habits.
• Example electronic devices are disclosed that can aid in retaining and generating heat within an electronic device that is being operated in cold conditions, so that the battery of the electronic device can operate at an optimal temperature.
• One example electronic device includes an example earbud assembly 100, as shown in the perspective view of FIGURE 2.
• Earbud assembly 100 can include a main body 112 with an outer housing 114, and an ear piece 116 coupled to outer housing 114 for insertion into the ear of an user.
• FIGURE 3 a schematic cross-sectional view, the interior portions of main body 112 of earbud assembly 100 are shown.
• Earbud assembly 100 can include a chip assembly 118, a heat conductor 130, an insulation material 140, a battery 150, a heat transfer device or material, such as a heat pipe 160 arranged within main body 112, each of which is discussed more fully below.
• Chip assembly 118 includes a chip subassembly 120 bonded to a printed circuit board 122.
• Chip subassembly 120 includes a substrate 124, a microelectronic element 126 overlying the substrate 124, such as a semiconductor chip or device or the like, and a plurality of other microelectronic devices 128, such as one or more passive devices.
• Substrate 124 may be directly bonded to printed circuit board 122 through conductive material, such as solder ball connections or the like (not shown).
• Substrate 124 may be any component intended to support microelectronic devices thereon, including substrates formed from a dielectric material.
• the printed circuit board 122 may be a conventional circuit board used to support and electrically connect components joined to the printed circuit board. For example, a multilayer printed circuit board with multiple copper layers can be utilized and electrically joined and connected with additional chip assemblies (not shown).
• An overmold 129 may be provided around chip assembly 118, and support battery 150 and heat pipes 160, 162.
• a battery can be provided within earbud assembly 100 to provide power to the assembly.
• battery 150 can be positioned to overlie chip assembly 118, but in other examples, the battery may be positioned in other arrangements within earbud assembly 100, such as underneath chip assembly 118, laterally adjacent chip assembly 118 or other positions within the interior of earbud assembly.
• battery 150 may be a Lithium-ion battery, or any other type of battery suitable for small form factor devices.
• different types of batteries including rechargeable and non -rech rgeable batteries, arid batteries having different capacities may also be utilized within an electronic device, such as earbud 100.
• a heat element or conductor 130 may be provided within main body 112.
• heat conductor 130 is positioned adjacent to the printed circuit board 122.
• Conductor 130 may have a top surface 132, a bottom surface 134, and opposed edge surfaces 136.
• Conductor 130 may extend along a majority of a length of outer housing 114, including a majority of a length between a bottom end 136 and a top end 138 of outer housing 114.
• Opposed endsl36, 138 may be positioned directly adjacent heat pipe 160, as will be discussed in more detail below.
• Heat conductor 130 may be made of a conductive material.
• the heat conductor 130 may be made of a layer of conductive metal, such as copper, gold, or titanium, but in other examples, other metals, alloys, and types of materials can be utilized, such as conductive paste or the like.
• the heat conductor 130 may be a planar sheet extending across housing 114 and underlying chip assembly 118. In other examples, heat conductor 130 may be a coil, or vary in thickness across its length, or take on any form suitable for conducting or emanating heat within outer housing 114.
• Heat element or conductor 130 may be a thin conductive layer.
• the heat conductor may have a thickness of 10 microns to 1mm. In other examples, the thickness of the heat conductor may be less than 10 microns or greater than 1mm.
• a heat conductor 130 may be a thin film conductor/radiator. Such conductors may be flexible, quickly heat, and help to prevent condensation in locations with limited space, characteristics which can make them ideal for use in a smaller wearable consumer device. Other types of thin conductive layers or components may also be utilized. [0054] Use of a thin conductive layer can allow for the heat conductor’s resistivity to the current flow in the chip assembly to be high enough to rapidly radiate thermal energy during heating.
• a heat conductor that may be thicker and require increased amounts of time to heat up and convectively and conductively heat surrounding air within the earbud housing.
• Selection of a highly resistive material, in combination with the material being thin or having a small thickness, can enhance the ability of components within the housing to maintain temperatures or even increase temperatures, as needed.
• copper possesses a resistivity of 1.68E-08 ohm m, making a thin copper layer an optimal heat conductor, but other materials can be utilized.
• Heat conductor 130 may also extend along a majority of the length of earbud assembly
• earbud assembly 100 may extend the entire length of earbud assembly between top and bottom ends 136, 138, or only a portion of the overall length.
• more than one conductor 130 may be used.
• heat conductors may be dispersed throughout earbud assembly 100.
• An insulation material may be provided within earbud assembly 100 to retain heat within main body 112, as well as to minimize the effect of ambient air temperature external to main body 112 on the temperature within main body 112 of earbud assembly 100 and ultimately the temperature of battery 150.
• Insulation material can be positioned within earbud assembly 100 to partially or fully fill one or more voids within main body 112.
• insulation material 140 can be positioned in the portion of earbud assembly 100 that is furthest away from the portion of outer housing 114 seated adjacent to the ear canal and closest to the portion of the housing that will be near ambient temperature. As shown, insulation material 140 completely fills the void between inner surface 137 of outer housing 114 and conductor 130.
• Insulation material 140 can contact bottom surface 134 of conductor 130, interior surface 137 of outer housing 114, and bottom surface 162 of heat pipe 160. Insulation material 140 can also be positioned so that insulation material 140 surrounds conductor 130, such that it extends around an entire length of bottom surface 134 of conductor 130. In other examples, insulation material can partially fill the void between outer housing and conductor 130 and additionally or alternatively fill other spaces within earbud housing. [0057]
• the material comprising insulation material can be selected from various insulating materials. In one example, an aerogel material may be selected. The aerogel material may be porous solid networks with air pockets taking up a majority of space within the material, so as to allow for the aerogel material to be almost weightless.
• An example aerogel may be a silica aerogel derived from silica gel having an extremely low thermal conductivity ranging from 0.03 W/ (mK) in atmospheric pressure down to 0.0004 W/(mK) in a vacuum.
• Other example materials can include iron oxide, chromia, alumina, titania, zirconia, vanadia, carbon, organic polymers, and other materials.
• alternative insulating materials may be implemented within earbud assembly 100.
• aerogel material for insulating material 140 provides for an insulating material that has an extremely low density and extremely low thermal conductivity. This allows for implementation of an insulation material 140 within earbud assembly 100 that is light and will not add significant or noticeable weight to earbud assembly 100. This can enhance user experience by limiting the overall weight of earbud assembly 100 when positioned within the ear canal of a user.
• the low thermal conductivity of aerogel insulating material 140 can further allow for a lightweight insulating material that effectively attenuates heat flow into and out of outer housing 114, and particularly the portion of outer housing that will be closest to the external environment of the outer housing.
• the insulating material 140 inhibits conductive/convective cold air temperatures from passing through earbud assembly 100 and particularly entering outer housing 114 of main body 112. Ambient temperatures can also be retained within outer housing 114.
• the low power output of earbuds does not cause overheating of the earbuds and allows for use of an insulating material that can retain heat within earbud assembly 100, as opposed to requiring a material that dissipates heat.
• aerogel insulation material 140 may be positioned directly adjacent to heat conductor 130, and in some examples may directly contact aerogel insulation material 140.
• Heat conductor 130 can be attached to aerogel insulation layer in numerous ways.
• heat conductor 130 may be adhesively attached to aerogel insulation layer 140 or the metal layer may be directly deposited onto the surface of the aerogel insulation material 140, such as by lamination. Aerogel insulation material 140 and heat conductor 130 may also be positioned in close proximity to the printed circuit board, to help ensure heating of the battery.
• the combination of the aerogel insulating material 140 and conductor 130 allows for heating of the interior of earbud assembly 100.
• the thin heating element adjacent to the aerogel insulating material 140 and bottom surface of printed circuit board 122 allows for direct heating of the air closer to the printed circuit board, which in turn convectively heats existing air enclosed within the outer housing 114.
• the thin conductor 130 provides for finer temperature control of heating. This can allow for heating up the air in small increments when needed, as well as preventing overheating of the outer housing 114 of the earbud assembly 100. Convective heating of battery 150 can therefore occur when the air close to printed circuit board 122 is heated.
• heat and thermal energy from a user’ s body can also be transferred to the electronic device to keep the battery warm and heat up the heat conductor in the aerogel insulating material.
• thermal energy may come from the user’ s inner ear.
• the thermal energy may come from other parts of the user’s body.
• the typical temperature of a user’s inner ear is 37.5° Celsius. Heat from within a user’s inner ear can help to increase the temperature within the interior of earbud assembly 100. Such heat from a user will also cause an increase in temperature of the heat conductor, which will further increase the overall temperature within earbud assembly 100.
• Charging contacts exposed at the outer housing of earbud assembly can provide a source or pathway to the interior of earbud assembly 100 allowing heat to travel from the ear cavity to the battery and insulator.
• a first charging contact 156 and a second charging contact 158 are exposed along outer housing 114 of earbud assembly.
• Contacts 156, 158 may be the same contacts used to join with contacts in a charging case and restore battery life within ear assembly 100.
• charging contacts 156, 158 are conventional contacts comprised of thin metal, such as aluminum.
• additional or alternative conductive connections can be provided to allow for heat to travel into earbud assembly 100.
• the transfer of heat and thermal energy from the user’ s ear can be enhanced with implementation of additional components, such as heat transfer devices or materials, within earbud assembly 100.
• one or more heat pipes can be used within earbud assembly 100 to enhance the heat transfer.
• Heat pipes 160, 162 are respectively connected to charging contacts 156, 158 at their first ends 166, 170. Heat pipes 160,162 are shown extending around battery 150, as well as overlie chip assembly 118. The second ends 172, 174 of heat pipes 160, 162 may be positioned adjacent and contact either or both insulation layer 140 and heat conductor 130.
• Heat pipes 160, 162 rely on evaporation and condensation techniques to transfer heat from first ends 166, 170 of heat pipes 160, 162 to the respective second ends 172, 174.
• Each of heat pipes 160, 162 may be a vacuum-sealed enclosure that houses a wick structure and a working fluid. Heat from first ends 166, 170 evaporates the working fluid within heat pipes 160, 162 to vapor, and absorbs thermal energy in the process. Vapor can travel along respective heat pipes 160, 162 to the opposite second ends 168, 174, which are cold. Vapor will then condense back to liquid onto the wick and release thermal energy in the process. The liquid then returns to the first ends 166, 170 through capillary action along the wick and the cycle repeats.
• heat pipes 160, 162 can be highly effective thermal conductors. It is to be appreciated that heat pipes are one example of a component or that can transfer thermal energy from a user’s body to the electronic device, but other examples not discussed herein may also be utilized.
• Earbud assembly 200 is structurally identical to earbud assembly 100 of FIGURE 3, except that in place of heat pipes 160,162, a thermally conductive heat transfer material is utilized to effect heat transfer from the body and inner ear of a user to battery 250 and insulation material 240, such as aerogel insulation material.
• insulation material 240 such as aerogel insulation material.
• a conductive fill material 244 is shown within a portion of earbud assembly 100.
• Thermally conductive material 244 fills the space around battery 250 and interior surface 270 of housing 214. Heat from the inner ear of a body of a user can warm charging contacts 256, 258 as well as portions of outer housing 214 in contact with a user’s body. Conductive fill material 244 can then distribute heat emanating from the charging contacts 256,258, as well as the heat from portions of the outer housing 214 in contact with a user’s body. Heat will be distributed around battery 250 and conductor 230, and also warm conductor 230. Insulation material 240 can help to retain heat within earbud assembly 200, as well as minimize the effect of colder ambient air external to outer housing 114.
• Conductive fill material can be any known fill materials and can include low density fillers.
• ceramic fillers such as boron nitride fillers, can be utilized to improve thermal conductivity while maintaining electrical insulation.
• FIG. 200-1 Another example electronic device, an example earbud assembly 200-1, is shown in
• Earbud assembly 200-1 may include similar components and component properties as earbud assembly 200, but in a slightly different arrangement.
• An example battery 250-1, chip assembly 218-1, conductor 230-1 and insulation material are shown within outer housing 214-1 of main body 212-1.
• Insulation material may be an aerogel insulation material 240-1.
• insulation material 240-1 may be composed of an aerogel material, such as silica aerogel material.
• a chip assembly 218-1 may be provided in which the surface 219-1 that faces away from printed circuit board 222-1 also faces toward conductor 230- 1. In this arrangement, printed circuit board 222- 1 can be positioned between battery 250-1 and conductor 230-1 and aerogel insulation material 240-1.
• a planar heat spreader 252-1 may be provided within earbud assembly 200-1 and extend across top surface of battery 250-1.
• Heat spreader 252-1 may be connected to contacts 256-1, 258-1, and as in previous examples, can help to further distribute heat from a body of a user to the interior of earbud assembly 200- 1, as well as heat conductor 230-1.
• Heat spreader 252-1 can be provided in various configurations and can also extend in a vertical direction along either or both edges of one or more of battery 250-1, chip assembly 218-1, and heat conductor 230-1.
• Example smart watch assembly 200-2 includes a main watch body 212-2 and a strap 213-2.
• Main body 212-2 further includes an outer housing 214-2 and transparent glass casing 297-2, which directly overlies the watch face 298-2.
• Watch assembly 200-2 includes internal components otherwise similar to earbud assembly 200-2.
• an example battery 250-2, chip assembly 218-2, conductor 230-2 and insulation material are positioned within outer housing 214-2 of main body 212-2.
• Insulation material may be an aerogel insulation material 240- 2.
• insulation material 240-2 may be composed of an aerogel material, such as silica aerogel material.
• a chip assembly 218-2 may be provided in which the surface 219-2 that faces away from printed circuit board 222-2 also faces toward conductor 230-2. In this arrangement, printed circuit board 222-2 will be positioned between battery 250-2 and conductor 230-2 and aerogel insulation material 240- 2.
• a planar heat spreader 252-2 may be provided within watch assembly 200-2 and extend across top surface of battery 250-2. Heat spreader 252-2 may be connected to contacts 256-2, 258-2, and as in previous examples, can help to further distribute heat within the interior of watch assembly 200-2, as well as heat conductor 230-2. Heat spreader 252-2 can be provided in various configurations and can also extend in a vertical direction along either or both edges of battery 250-2, chip assembly 218-2 and heat conductor 230-2.
• example wearable electronic devices disclosed herein can aid in providing optimal operating conditions for a battery, which prolongs the overall life of a battery. Battery life can be improved, for example, when wearable electronic devices are being operated in cold conditions.
• heat can be maintained and generated within the interior of an electronic device, and colder ambient air can be prevented from passing through the interior of the electronic device.
• the examples disclosed herein include an aerogel insulation layer to obstruct and thermally insulate the electronic device from colder ambient air from penetrating the interior of housing of the electronic device, while at the same time retaining heat already within the housing to maintain battery temperature.
• heat and thermal energy generated from a user’s body can reach the heat conductor and cause the heat conductor to heat up.
• the configuration and arrangement of the aerogel insulation layer and conductor relative to the other components within the assembly can help to maintain heat within the interior of the electronic device and prolong battery life. It is to be appreciated that the technology can be implemented within any wearable consumer device and is not limited to the examples disclosed herein.
• a system can determine whether it is necessary to pre-heat or not pre-heat an electronic device.
• the system may include an electronic device, as well as a charging case that is configured to pre-heat the electronic device prior to use of the device in cold conditions.
• an earbud assembly 100 can be pre -heated prior to a user operating and using earbud assembly 100.
• FIGURE 7 a cross-section of an example charging case 310 in the closed position according to aspects of the disclosure is illustrated and FIGURE 8 is a cross-sectional side view of charging case 310.
• charging case 310 includes an elongated main body 374 and lid 376 that are connected to one another.
• a lower interior housing 378 may be seated within a cavity 380 of the main body 374 of charging case 310.
• An upper interior housing 382 is seated within a cavity of lid 376.
• the top surface 384 of lid 376 is shown directly adjacent top surfaces 385 of the interior housing 382 of the main body 374 when the lid 376 is closed.
• Interior housing 382 further includes recesses 386 and 388 that can be used to receive and hold an electronic device or accessory, such as wireless earbuds (not shown) or the like, within charging case 310.
• Main body 374 and lid 376 is shown as having a rounded profile, but in other examples, main body 374 and lid 376 can take on a variety of different shapes and sizes.
• the shape of the case can be further modified to accept, store, charge, and warm batteries of different types of electronic devices, such as eyeglasses, watches, jewelry, necklaces, pendants, clothing, and the like.
• Charging case may include an induction heating system.
• the induction heating system includes a magnet 390, a wire 391 wrapped around magnet 390, and additional electrical circuitry 392, including traces 393 electrically connecting circuitry 392, battery 350 and magnet 390.
• Electrical circuitry 392 is schematically shown in FIGURE 7, and magnet 390 may be positioned within the interior housing 378 of main body 374, which, as will be discussed herein, can be used to inductively heat devices within charging case 310.
• magnet 390 may be housed within magnet housing 392 to retain magnet 390 at a fixed position within the interior of charging case 310.
• magnet 390 may positioned at an angle relative to a vertical axis V-V that extends through a length of charging case 310.
• magnet 390 can be positioned at other angles relative to vertical axis V-V or align with or extend along an axis parallel to vertical axis V-V.
• Magnet 390 may be secured between recesses 386, 388.
• System magnet 390 may be shaped like a house with a rectangular lower portion and a sloped and triangular-shaped upper portion. This is in part due to the shape of the space created between the recesses 386, 388 (FIGURE 7). But, in other examples, the shape and size of the magnet may differ. Due to its location and size, although not required, magnet 390 can serve a dual purpose and further secure any electronic devices that may be positioned within the respective recesses 386, 388. For example, ear bud assemblies 100, 102 (FIGURE 8 A) may be secured by magnet 390 within the charging case 310. In other examples, one or more separate magnets may be positioned within charging case 310 and dedicated to heat induction.
• a wire coil 391 may be wrapped around magnet 390.
• wire coil 391 extends around the lower rectangular portion of magnet 390, but in other examples, coil 391 can additionally or alternatively wrap around the upper portion of magnet.
• Wire coil 391 can alternatively be positioned at another location within charging case 310, and conductively connect with magnet 390.
• a first earbud assembly 100 can be positioned within recess
• second earbud assembly 102 is a mirror image of first earbud assembly 100 and is otherwise identical to first earbud assembly 100, but in other examples, a different earbud or device can be provided within charging case 310.
• first earbud assembly 100 reference will be primarily made to the first earbud assembly 100, but it is to be appreciated that the discussion is equally applicable to the second earbud assembly 102.
• first and second earbud assemblies 100, 102 When positioned within charging case 310, first and second earbud assemblies 100, 102 can be pre-heated prior to a user inserting the earbud assemblies 100 into the ear, as well as charged for consumer use.
• FIGURE 9 illustrates an exploded view of earbud assembly 100 and charging case 310 in the closed position for ease of illustrating an example heating process.
• Contacts 156,158 on earbud assembly 100 can contact and be positioned adjacent contacts (not shown) on charging case 310.
• Contacts on charging case 315 can be structurally similar or different from contacts on earbud assembly 100.
• circuit board 392 of charging case 300 can initiate a charge from battery 350 within charging case 310 to produce an alternating electrical current (AC) that travels through traces 393 that electrically connect circuit board 392 and along wire coils 391 surrounding magnet 390. Electromagnetic energy field M will then be generated for the purpose of pre-heating the earbud assembly.
• AC alternating electrical current
• Heat conductor 130 in earbud assembly 100 can function as an antenna by virtue of its inherent properties. Heat conductor 130 can absorb electromagnetic energy from the electromagnetic energy field M, which causes heat conductor 130 to increase in temperature and heat up. This, in turn, increases the overall temperature within earbud assembly 100 and battery 150, including increasing the temperature of the chip assembly and battery 150.
• This structure provides the ability for battery 150, which is housed within earbud assembly 100, to be primed for use in a colder atmosphere using only the battery from charging case 310. This enables a user to warm earbud assembly 100 without draining the earbud assembly battery 150 of the earbud assembly 100. Furthermore, only minimal energy from charging case battery 350 is required.
• a user can manually initiate a heating command.
• the charging case may include a button 399 that a user may press to initiate pre-heating of earbud assemblies 100, 102.
• a user may also remotely initiate pre -heating using a computing device, such as a mobile phone, a computer, or the like. Pre-heating can be initiated on demand by a user, or by other “alarms” set up by the user, including synchronizing the electronic devices with the user’ s calendar or a specific event on the calendar.
• Ensuring that the battery is at an optimal temperature while in use can be automated based on machine learning.
• processors can communicate with regional weather reports to determine weather conditions and predict when earbud assemblies are expected to be worn by a user in cold temperatures. Determining whether to warm the earbuds, so as to aid the battery in operating an optimal temperature, can be simple, such as a processor determining: that earbuds are present within the charging case; and that the temperature at a pre-selected location (such as current location or another remote location) is at or below a pre-selected temperature. When the temperature is at or below a pre-selected temperature, which indicates that the temperature is likely to shorten battery life, pre-heating of the earbud assembly can be initiated.
• an electromagnetic field is generated by and within the earbud charging case for the purpose of pre-heating an electronic device, such as the earbud assembly.
• the heat conductor within the electronic device may absorb the electromagnetic field, as previously discussed herein, to generate heat within the electronic device.
• the processor can determine that it is unnecessary to pre-heat the earbud assembly and generate an electromagnetic field. This can further help to prolong battery life by preventing unnecessary discharge of the battery.
• the timing in which the electromagnetic field is generated to pre-heat the electronic device can additionally or alternatively be synchronized with other system or component operations.
• the generation of the electromagnetic field may be delayed until another operation first occurs or so that the electromagnetic field simultaneously occurs with another operation.
• heating can be synchronized to commence with charging and other power delivery operations to conserve power in the battery.
• pre-heating may also be initiated at only certain times of the day or days of the week. Additionally or alternatively, pre -heating can be initiated based on other parameters related to the user, such as expected location of the user, calendar entries, travel departures and arrivals identified on third party applications for the user or a guest of the user, and any other number of parameters.
• a processor can compile information based on a user’s GPS location and the history of the user’ s daily activities to predict when a user may require preheating and to initiate pre heating at those times.
• a user may travel from home to a particular city for work on a train on Monday - Friday mornings. The user may then walk 1 mile to the office and will be using wireless earbuds during the walk. Machine learning will determine that only Mondays - Fridays are to be considered.
• the GPS location will determine when the user is about to arrive in the city, and the weather application determines the temperature outside at the selected location and whether it will be cold. Using this information, the charging case can make a determination of when to preheat the earbuds to get them warm just in time for the user to use them during the cold walk to the office.
• earbud assembly structure disclosed herein.
• other types of earbud assemblies and charging case assemblies that do not include all of the features disclosed herein, or only one or more features disclosed herein can be used in connection with the disclosed methods of pre -heating earbud assembly prior to use.
• the concepts can be accomplished in any consumer electronic device or charging case or charging station, including, for example, open charging stations.
• a flow chart provides an example method 1000 for maintaining optimal battery temperature in an electronic device, such as earbud assembly 100.
• operating an electronic device at an optimal battery temperature can be achieved by determining whether it is necessary to pre-heat the electronic device in a cold condition or whether to allow the battery to operate at current conditions.
• Optimizing battery temperature in this example can mean improving the battery temperature at which the battery will operate to prolong the life of the battery.
• sensors on charging case 310 can determine whether an electronic device, such as earbud assembly, are positioned within the charging case. If no, at block 1003, pre-heating is not initiated. If yes, at block 1004, the one or more processors determines the ambient temperature external to the charging case at a pre-selected location. The pre-selected location may be the current location or another location designated by the user or designated by the processor based on learned habits of the user. At block 1006, a processor determines whether ambient temperature is at or below a pre-selected temperature at the pre-selected location. If no, at block 1003, pre-heating is not initiated because it is not cold enough to require pre-heating and pre -heating is not initiated.
• pre-heating of earbud assembly 100 is initiated. For example, this can include generating an electromagnetic field within charging case 310 to begin inductive heating of an electronic device, such as earbud assembly 100, as disclosed herein.
• the electronic device, such as earbud assembly 100 may instead be directly heated without the charging case.
• Block 1007 further requires, determining, by a processor, whether the current date and/or time falls within a pre-selected time or range of times. For example, a user may only require pre-heating of an electronic device during an early morning run between 7 : 00-7 : 30 am, which the user only takes on Monday, Wednesday, and Friday.
• the processor can either determine this schedule over time through machine learning of the user’s habit, or the user can provide this information ahead of time. Based on the day of the week and the time, the processor can make a determination to initiate pre -heating at block 1008.
• pre-heating of the electronic device can be initiated by either the user or processor at 6:50am, or 10 minutes before the user’s run to ensure that the electronic device and battery within the electronic device are warmed up prior to the run.
• a processor determines whether an electronic device is positioned within the charging case. If yes, at block 2004, a processor determines whether current date and or time falls within a pre-selected date or range of times. If yes, at block 2006, the processor determines whether a user is headed to a pre-determined location.
• the processor determines what time the user is expected to arrive at the pre-selected location at block 2008, and whether the temperature at the pre-selected location is at or below a pre-determined temperature at block 2010. If the temperature at the pre-selected location is at or below a predetermine temperature, this means that the ambient temperature is “cold” and one that would cause degradation of the battery life. In such example, at block 2012, the processor will initiate pre-heating of the electronic device prior to the expected time of arrival, such as, for example, 10-15 minutes prior to arrival. If the answer to any of the foregoing questions is “no,” pre-heating of the electronic device will not occur at block 2003.

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• 2020
  • 2020-07-30 EP EP20757736.2A patent/EP3973591A1/de not_active Withdrawn
  • 2020-07-30 WO PCT/US2020/044243 patent/WO2022025897A1/en unknown
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