EP3959745A1 - Installing an electronic assembly - Google Patents

Installing an electronic assembly

Info

Publication number
EP3959745A1
EP3959745A1 EP20735078.6A EP20735078A EP3959745A1 EP 3959745 A1 EP3959745 A1 EP 3959745A1 EP 20735078 A EP20735078 A EP 20735078A EP 3959745 A1 EP3959745 A1 EP 3959745A1
Authority
EP
European Patent Office
Prior art keywords
die
functional elements
substrate
molded parts
joining materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20735078.6A
Other languages
German (de)
French (fr)
Inventor
Matthias Heimann
Bernd Müller
Christian NACHTIGALL-SCHELLENBERG
Jörg Strogies
Klaus Wilke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP3959745A1 publication Critical patent/EP3959745A1/en
Pending legal-status Critical Current

Links

Classifications

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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/84001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector involving a temporary auxiliary member not forming part of the bonding apparatus
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    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/84001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/84005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary substrate
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    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the invention relates to a method for assembling an electronic assembly and an electronic assembly. Such a method is particularly advantageous in the manufacture of power electronic assemblies, e.g. B. in the production of so-called "Power Modules" or constituents thereof.
  • the electronic assembly includes a substrate with a control plane and at least one die.
  • a die is a bare semiconductor and is also referred to as a "bare die” or “naked chip”.
  • the electrical contacting of the die with electrical connections of other components, other conductive structures or with electrical connections of a housing usually takes place in the prior art via wire bonding.
  • wire bond-free technologies are used (e.g. leadframe, foils, ball bonding) known.
  • the object is achieved by a method for assembling an electronic assembly, the assembly having at least one die and a substrate with a control plane.
  • planar molded parts, joining materials and the at least one die are arranged in such a way that:
  • the die is electrically contacted with at least one of the planar molded parts and one of the joining materials
  • Functional elements are formed from the molded parts and / or the die and the Fügema materials, which are designed to support the substrate and to make electrical contact with the control level. It is advantageous if several functional elements are formed, since several functional elements can better support the substrate. If multiple dies are contacted, accordingly more functional elements are provided for contacting the dies and the support function is further improved.
  • Planar molded parts are planar parts made of an electrically conductive material that can be produced cost-effectively.
  • the planar moldings are made without bending processes, can be punched from sheet metal, for example, and can vary in shape and thickness, eg. B. as bulk goods or rolled up as a tape to an automatically populated goods carrier leads.
  • the molded parts are cuboid or plate-shaped.
  • the molded parts can, however, also be disk-shaped or have other flat geometries.
  • a height adjustment of the molded parts can be done in the usual joining process (e.g.
  • the moldings are preferably copper moldings.
  • the dimensions of the molded parts can depend on the maximum current to be conducted.
  • the molded parts are usually between 300 ⁇ m and 2 mm thick and can have other variable dimensions.
  • Solder and / or sintered materials in the form of printable or dispensable pastes or as soldered or sintered molded parts can be used as joining materials.
  • the arrangement of the planar molded parts can be carried out by placement machines on a goods carrier.
  • the functional elements form mechanically stable units during assembly and are designed to support the substrate during the assembly process. It is possible to subject the functional elements to a joining process (e.g. thermal joining) before the substrate is positioned on the functional elements. For the purposes of further assembly, the functional elements can form one or more mechanically stable units, which improves the further manageability of the functional elements. It is also possible to join the functional elements together with the substrate.
  • the functional elements form a support structure which is designed in such a way that a substrate can be positioned thereon for further assembly of the assembly.
  • the support structure can be designed so that it completely supports the substrate.
  • the functional elements thus combine two functions, support and contact, in one element.
  • the invention offers the potential to implement all connection levels for manufacturing the product in one process.
  • the functional elements can be constructed in an electrically and thermally optimized manner thanks to the variable planar molded parts. This is preferably done in batches.
  • the present invention simplifies the contacting of the dies and enables further degrees of freedom in the construction of the assembly.
  • the functional elements When the substrate is positioned on the functional elements and a joining process has been carried out, the functional elements enter into a permanent electrical and mechanical connection with the substrate or its control plane.
  • the functional elements are thus mechanically connected to the substrate, the support function has thus fulfilled its purpose and the function of making electrical contact is now in the foreground.
  • a further embodiment comprises the step of providing a goods carrier, the molded parts, dies and / or joining materials being arranged on the goods carrier.
  • the goods carrier can have one or more cutouts, the molded parts, dies and / or joining materials then being able to be arranged in such a way that at least some of the functional elements are formed in the cutouts.
  • the molded parts can be arranged on the goods carrier directly, that is to say without further inter mediate elements.
  • the main purpose of the product carrier is to transport the assembly and its functional elements through the production process.
  • the recesses can also be designed in such a way that they provide a support function for the functional elements that have not yet been joined.
  • the goods carrier does not remain on the completed assembly. It is possible that a product carrier is already pre-equipped with a first layer of selected molded parts.
  • a goods carrier can be designed like a tray or can be used as part of a conveyor belt system or otherwise, for. B. (partially) autonomous conveyor systems be designed. The use of a goods carrier he advantageously increases the manageability of the present method.
  • an intelligent product carrier concept is made available on the basis of which the Fügepart ner are fully automated, additive, z. B. through intelligent layering and joining. It can be advantageous if the goods carrier is designed such that the functional elements essentially form a plane. Other shapes are conceivable and sensible if flat substrates are not to be used.
  • the functional elements are formed at a distance from one another.
  • the functional elements are arranged at a distance from one another, i. H. arranged so that they can exercise a support function at several points of a substrate positioned thereon. As a result, a uniform distribution of the load with respect to the substrate can be achieved.
  • the functional elements can be arranged so that they can carry the substrate completely dig during the assembly process.
  • the functional elements are also arranged in such a way that electrical contact between the functional elements and the substrate can be realized.
  • the goods carrier has one or more recesses with mutually different dimensions. This can include, for example, a different depth of the recesses, e.g. B. to compensate for differences in height.
  • the goods carrier can have cutouts adapted to certain molded parts. The depth of the recess corresponds to the thickness of the molded parts arranged there and / or with the necessarycardinaus. The depth of the recesses is usually a maximum of 2mm, but can be higher if particularly thick parts are to be processed.
  • Another embodiment includes arranging one or more auxiliary elements.
  • the auxiliary elements can be arranged on egg nem goods carrier and / or below molded parts.
  • the auxiliary elements do not remain permanently in the electronic assembly, but are when the
  • Auxiliary elements have served their purpose - e.g. B. a temporary provision of a mechanical support function or a protective function for a sensitive component - as removed.
  • the auxiliary elements can remain on the goods carrier and can compensate for a greater difference in height than the goods carrier, thereby increasing flexibility.
  • auxiliary elements can only be removed later in the process.
  • the auxiliary elements can in turn have recesses or already be pre-equipped with components.
  • Another embodiment comprises positioning the substrate on the functional elements so that the control plane is electrically contacted with the functional elements.
  • conductive structures of the electrical assembly which were previously divided between the control level of the substrate and the functional elements, are completed by electrically contacting the control level with the functional elements.
  • the guiding structures of the assembly are completed and these can be joined.
  • the substrate can have a structured control plane and can already have further electronic components. This has the great advantage that the functional elements can be built up in great complexity and independently of the substrate and the substrate can only be applied to functional elements afterwards. This allows a high degree of freedom in the design of the electronic assembly's light.
  • at least one of the molded parts used to contact the die is designed as a leadframe.
  • This embodiment is particularly advantageous because it enables a manufacturing process that integrates the connection of lead frames into the assembly process, thus allowing greater scope for design and potentially saving a separate assembly / process step.
  • Combinations with standardized leadframe structures eg in a premolded variant
  • product-specific adaptations are made through subsequent processing (eg laser cuts to remove support structures or unused wiring layers).
  • Leadframe technology offers great advantages for the wiring of dies due to the power cycling stability and the electrical performance (electrical and thermal conductivity, low inductance, etc.). So far, this technology has not been economically viable for small quantities due to the initial effort (tools for punching, forming and molding, etc.). The effort increases with the complexity and the accuracy requirements of the leadframes (different potentials, variable leadframe cross-sections, etc.).
  • connection frame and the molded parts may be advantageous to arrange the connection frame and the molded parts in such a way that the connection frame, the molded parts and the joining materials form a unit that can be handled during assembly.
  • Manageable means that the unit has at least sufficient mechanical cohesion so that it does not disintegrate again into individual parts during the further process steps.
  • a joining step can be carried out, which forms a unit from the functional elements.
  • parts of the joining materials can be joined (e.g. by sintering or soldering).
  • electrically insulating elements so that they are electrically form isolated support points for the substrate.
  • This offers the advantage that molded parts of different potentials can be isolated and mechanically stabilized at suitable support points via electrically insulating molded parts.
  • the production of electrically conductive connections between differently shaped molded parts of variable thickness is also possible through the use of local wiring supports.
  • the functional elements can thus be relieved and the design leeway increases further.
  • the electrically insulating elements preferably remain in their function as an electrical insulator on the assembly.
  • Another embodiment comprises joining, so that the joining materials enter into connections with the molded parts, the die and / or the control plane.
  • the joining can connect both the molded parts and the die with the joining materials.
  • Solder and sintering processes are conceivable here.
  • a particular advantage of the present method is that the joining methods can now be carried out for all functional elements and the substrate simultaneously and in a single process step. If necessary, however, is also conceivable if, for. B. particularly robust or equipped with high Stromtragfä capability functional elements are required, a multi-part joining process is carried out, several joining processes are combined. For example, first drive a sintering process that creates high-temperature-resistant sintered connections for the die and then a soldering process that bonds the substrate.
  • At least one further electrical component is arranged. This is preferably done in addition to arranging the molded parts, the dies and the joining materials and can be carried out in the same process step. Passive and / or active components can be arranged. It has proven to be particularly advantageous if further components are processed with the molded parts. This can be a current measuring shunt, for example, which measures the current in the direct vicinity of the die. In addition to creating conductive connections and structural Functional elements can be created in the direct vicinity of the die
  • planar molded parts and / or the joining materials are arranged in layers. It has proven to be advantageous to carry out the Anord NEN of the moldings and the joining materials in layers, as such. B. a quality control is already possible in the individual layers of the arrangement and if there are errors or defects in a layer without further measures can be taken.
  • an electronic assembly which has at least one die, a substrate with a guide plane and several functional elements arranged at a distance from one another.
  • the die is electrically connected to at least one of the molded parts and one of the joining materials.
  • the functional elements are at least partially constructed from molded parts and / or the die and joining materials, the functional elements being designed to support the substrate, in particular during production, and to make electrical contact with the control level.
  • the PCB preferably has active components that form a so-called “control unit” and provide the control logic for controlling the dies.
  • FIG. 1 shows a goods carrier with an arranged thereon
  • FIG. 3 shows a further embodiment of a goods carrier
  • FIG 5 shows an electronic assembly
  • FIG. 6 shows a possible further production step.
  • 1 shows a goods carrier 200 in which functional elements 61, 62, 63 according to the invention have been arranged.
  • the functional elements 61, 62, 63 thereby form a support structure 60.
  • the functional elements 61, 62, 63 also form a contact surface 600 of the support structure 60, which in this case is designed as a plane and in the next process steps around a substrate 150 that is not shown here to support.
  • the goods carrier 200 has two recesses 220 and 221, the support element 61 being arranged in the recess 220 and the functional elements 62 and 63 being arranged in the recess 221, which are based on a common base.
  • the support element 61 has molded parts 21, 22 and joining materials 30.
  • the support element 62 has molded parts 23 and part of the molded part 24 as well as joining materials 30.
  • a die 40 for example a semiconductor switch such as an IGBT bare die, is arranged with joining materials 30 on the molded part 24, so that the die 40 forms a support element 63.
  • the top and bottom of the die have been brought to a common plane (the plane of the contact surface 600) by the common base, the molded part 24. A contacting of dies can thus be greatly simplified.
  • the molded parts 21, ..., 24 are arranged directly on the goods carrier 200 and are not applied to a substrate. This type of arrangement enables greater flexibility and considerably more degrees of freedom in the construction of the contact structures that are to be connected to a substrate.
  • FIG. 2 shows an exploded view of the functional elements 61, 62, 63 or the support structure 60, as is known from FIG.
  • the support element 61 is made up of a molded copper part 22, which is inserted into the recess 220, a joining material 30, a further molded copper part 21 and a subsequent further joining material 30 arranged in stacks.
  • the molded part 21 is a very flat copper molded part; in comparison with this, a clearly thicker and wider molded copper part 24 is inserted into a recess 221.
  • the under- Different thicknesses are compensated in the present case by different depths of the recesses 220, 221.
  • the molded copper part 24 serves as the basis for two further functional elements 62, 63, which are consequently electrically connected via the molded copper part 24.
  • the dimensions of the molded parts can be selected based on thermal and performance criteria.
  • the joining materials 30 can also be adapted to their molded parts. So it is conceivable that special bracket materials 30 are used for this, whereas further joining materials 30 are used for the copper molded parts 21,..., 24.
  • FIG. 3 shows a further embodiment of a goods carrier 200, this having no cutouts, but instead using an auxiliary element 228 to compensate for the height between the functional elements 61, 62 and 63, as they are known from FIGS. 1 and 2.
  • the auxiliary element 228 can already have first molded parts or prefabricated functional elements and be made available directly, be it in other words the auxiliary element 228 is already delivered with molded parts and then with further molded parts 21, ..., 24 together on the goods carrier 200, e.g. B. with a placement machine arranged.
  • the auxiliary element 228 is designed as part of the goods carrier 200.
  • the contact surface 600 remains as shown in the previous Figures 1 and 2 evenly.
  • FIG. 4 shows how the support structure 60 interacts with a substrate 150.
  • the substrate 150 has a guide plane 152 which is already structured in this case.
  • a lamination 153 is provided on the upper side of the substrate 150, which is used to connect a heat sink 155 with a heat sink joining material 130 to the substrate 150.
  • the substrate 150 or the guide plane 152 has a contact surface 650 of the guide plane 152.
  • the contact surface 650 of the control plane 152 is designed in such a way that it can be placed on the contact plane 600 of the support structure 60.
  • the functional elements 61, 62, 63 in connection with the control level 152 are designed or designed in such a way that they can realize their support function and the electrical contacting of the die 40.
  • the support function applies to the production process. If a joining process, for example soldering and / or sintering, has been carried out, this support function is for the most part no longer necessary and the functional elements 61, 62, 63 mainly serve their second function of making electrical contact, in particular of the die 40.
  • FIG. 5 shows the completed electronic assembly 10 as it was assembled in FIG.
  • the assembly 10 was removed from the goods carrier 200 and turned over for further processing.
  • the orientation shown in this figure corresponds to the orientation in which electronic assemblies are usually populated.
  • the process according to the invention allows more degrees of freedom by the function onsetti 61, 62, 63 are arranged independently of the substrate 150 and therefore optimally z. B. regarding. Temperature and / or electrical power can be built.
  • the assembly 10 shown in FIG. 5 can be constructed with the following steps and in the following sequence:
  • the die 40 with at least one of the planar molded parts
  • Functional elements 61, 62, 63 are formed from the planar molded parts 21, ..., 24 and / or the die 40 and the joining materials 30, which are designed to support the substrate 150 and to make electrical contact with the control plane 152,
  • the structured control plane 152 of the substrate 150 has contacts 112 for a frame men 12 with pins on.
  • a potting material 14 can be cast in order to enable protection of the electronic assembly 10 and the components arranged thereon.
  • Control electronics PCB in this case designed as a printed circuit board, can then be contacted and is designed, for example, to control power electronics that were produced using the method according to the invention.
  • the invention relates to a method for assembling an electronic assembly 10, having at least one die 40 and a substrate 150 with a control plane 152.
  • a method for assembling an electronic assembly 10 having at least one die 40 and a substrate 150 with a control plane 152.
  • the following step is proposed:
  • the die 40 with at least one of the planar molded parts
  • Functional elements 61, 62, 63 are formed from the planar molded parts 21, ..., 24 and / or the die 40 and the joining materials 30, which are designed to support the substrate 150 and to make electrical contact with the control plane 152.
  • the invention also relates to an electronic assembly 10.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a method for installing an electronic assembly (10), having at least one die (40) and a substrate (150) with a conductive surface (152). The aim of the invention is to simplify the electric contacting of the dies during installation. This is achieved by the following step: arranging molded parts (21,..., 24), joining materials (30), and the at least one die (40) such that - the die (40) is electrically contacted by at least one of the molded parts (21,..., 24) and one of the joining materials (30) and - multiple functional elements (61, 62, 63) are formed from the molded parts (21,..., 24) and/or the die (40) and the joining materials (30), said functional elements being designed to support the substrate (150) and electrically contact the conductive surface (152). The invention additionally relates to an electronic assembly (10).

Description

Beschreibung description
Montage einer elektronischen Baugruppe Assembly of an electronic assembly
Die Erfindung betrifft ein Verfahren zur Montage einer elekt ronischen Baugruppe sowie eine elektronische Baugruppe. Ein derartiges Verfahren ist insbesondere bei der Herstellung von leistungselektronischen Baugruppen von Vorteil, z. B. bei der Herstellung von sogenannten „Power Modules" oder Bestandtei len davon. The invention relates to a method for assembling an electronic assembly and an electronic assembly. Such a method is particularly advantageous in the manufacture of power electronic assemblies, e.g. B. in the production of so-called "Power Modules" or constituents thereof.
Die elektronische Baugruppe umfasst dabei ein Substrat mit einer Leitebene und zumindest einen Die. Ein Die ist ein un- gehäuster Halbleiter und wird dabei auch als „bare die" oder „Nacktchip" bezeichnet. Das elektrische Kontaktieren des Dies mit elektrischen Anschlüssen anderer Bauteile, weiteren lei tenden Strukturen oder mit elektrischen Anschlüssen eines Ge häuses erfolgt im Stand der Technik üblicherweise über Draht- Bonden (im Englischen: „wire bonding") . Alternativ sind Wire- Bond-freie Technologien (z. B. Leadframe, Folien, Ball- Bonding) bekannt. The electronic assembly includes a substrate with a control plane and at least one die. A die is a bare semiconductor and is also referred to as a "bare die" or "naked chip". The electrical contacting of the die with electrical connections of other components, other conductive structures or with electrical connections of a housing usually takes place in the prior art via wire bonding. Alternatively, wire bond-free technologies are used (e.g. leadframe, foils, ball bonding) known.
Es ist Aufgabe der Erfindung ein Verfahren zur Montage von elektronischen Baugruppen anzugeben, welches die elektrische Kontaktierung von Dies bei deren Montage vereinfacht. It is the object of the invention to provide a method for assembling electronic assemblies which simplifies the electrical contacting of dies during their assembly.
Die Aufgabe wird dabei durch ein Verfahren zur Montage einer elektronischen Baugruppe gelöst, wobei die Baugruppe zumin dest ein Die und ein Substrat mit einer Leitebene aufweist. Zur Montage werden planare Formteile, Fügematerialien und der zumindest eine Die so angeordnet, dass: The object is achieved by a method for assembling an electronic assembly, the assembly having at least one die and a substrate with a control plane. For assembly, planar molded parts, joining materials and the at least one die are arranged in such a way that:
- der Die mit zumindest einem der planaren Formteile und ei nem der Fügematerialien elektrisch kontaktiert wird, - The die is electrically contacted with at least one of the planar molded parts and one of the joining materials,
- sich aus den Formteilen und/oder dem Die sowie den Fügema terialien Funktionselemente bilden, die zum Stützen des Sub strats und zum elektrischen Kontaktieren der Leitebene ausge bildet werden. Es ist vorteilhaft, wenn sich mehrere Funkti onselemente bilden, da mehrere Funktionselemente das Substrat besser stützen können. Wenn mehrere Dies kontaktiert werden, so werden entsprechend mehr Funktionselemente zum kontaktie ren der Dies vorgesehen und die Stützfunktion verbessert sich weiter . - Functional elements are formed from the molded parts and / or the die and the Fügema materials, which are designed to support the substrate and to make electrical contact with the control level. It is advantageous if several functional elements are formed, since several functional elements can better support the substrate. If multiple dies are contacted, accordingly more functional elements are provided for contacting the dies and the support function is further improved.
Planare Formteile sind kostengünstig herstellbare planare Teile aus einem elektrisch leitenden Material. Die planaren Formteile werden dabei ohne Biegeprozesse hergestellt, können beispielsweise aus Blechen gestanzt werden und können in va riabler Form und Dicke, z. B. als Schüttgut oder aufgerollt als Band einem automatisiert bestückbaren Warenträger zuge führt werden. In der Regel sind die Formteile quader- bzw. plattenförmig. Die Formteile können aber auch scheibenförmig sein oder weitere flache Geometrien aufweisen. Ein Höhenaus gleich der Formteile kann im üblichen Fügeprozess (z. B. Planar molded parts are planar parts made of an electrically conductive material that can be produced cost-effectively. The planar moldings are made without bending processes, can be punched from sheet metal, for example, and can vary in shape and thickness, eg. B. as bulk goods or rolled up as a tape to an automatically populated goods carrier leads. As a rule, the molded parts are cuboid or plate-shaped. The molded parts can, however, also be disk-shaped or have other flat geometries. A height adjustment of the molded parts can be done in the usual joining process (e.g.
durch Löten bzw. Sintern) durch Schichten der hierfür notwen digen Materialien erfolgen. Die Formteile sind dabei vorzugs weise Kupferformteile . Die Dimensionierung der Formteile kann vom zu leitenden maximalen Strom abhängen. Die Formteile sind in der Regel zwischen 300 pm und 2mm dick und können variable weitere Dimensionen aufweisen. by soldering or sintering) by layering the necessary materials. The moldings are preferably copper moldings. The dimensions of the molded parts can depend on the maximum current to be conducted. The molded parts are usually between 300 μm and 2 mm thick and can have other variable dimensions.
Als Fügematerialien können Lot- und/oder Sintermaterialien in Form von druckbaren oder dispensbaren Pasten oder jeweils als Lot- bzw. Sinterformteile zum Einsatz kommen. Das Anordnen der planaren Formteile kann dabei durch Bestückautomaten auf einem Warenträger durchgeführt werden. Solder and / or sintered materials in the form of printable or dispensable pastes or as soldered or sintered molded parts can be used as joining materials. The arrangement of the planar molded parts can be carried out by placement machines on a goods carrier.
Die Funktionselemente bilden während der Montage mechanisch stabile Einheiten und sind zum Stützen des Substrats während des Montageprozesses ausgebildet. Es ist möglich die Funkti onselemente einem Fügeprozess zu unterziehen (z. B. thermi sches Fügen) , bevor das Substrat auf den Funktionselementen positioniert wird. So können die Funktionselemente für die Zwecke der weiteren Montage eine oder mehrere mechanisch in sich stabile Einheiten bilden, was die weitere Handhabbarkeit der Funktionselemente verbessert. Es ist ebenso möglich, die Funktionselemente zusammen mit dem Substrat zu fügen. Die Funktionselemente bilden eine Stützstruktur, die derart ausgestaltet ist, dass ein Substrat für die weitere Montage der Baugruppe darauf positioniert werden kann. Die Stütz struktur kann dabei so ausgestaltet sein, dass sie das Sub strat vollständig trägt. Die Funktionselemente ereinen somit zwei Funktionen, das Stützen und das Kontaktieren, in einem Element. Dadurch bietet die Erfindung das Potential in aus schließlich einem Prozess alle Verbindungsebenen zur Herstel lung des Produktes zu realisieren. Weiterhin können durch die variablen planaren Formteile die Funktionselemente elektrisch und thermisch optimiert aufgebaut werden. Dies wird vorzugs weise stapelweise durchgeführt. Die Vorliegende Erfindung vereinfacht die Kontaktierung der Dies und ermöglicht dabei weitere Freiheitsgrade im Aufbau der Baugruppe. The functional elements form mechanically stable units during assembly and are designed to support the substrate during the assembly process. It is possible to subject the functional elements to a joining process (e.g. thermal joining) before the substrate is positioned on the functional elements. For the purposes of further assembly, the functional elements can form one or more mechanically stable units, which improves the further manageability of the functional elements. It is also possible to join the functional elements together with the substrate. The functional elements form a support structure which is designed in such a way that a substrate can be positioned thereon for further assembly of the assembly. The support structure can be designed so that it completely supports the substrate. The functional elements thus combine two functions, support and contact, in one element. As a result, the invention offers the potential to implement all connection levels for manufacturing the product in one process. Furthermore, the functional elements can be constructed in an electrically and thermally optimized manner thanks to the variable planar molded parts. This is preferably done in batches. The present invention simplifies the contacting of the dies and enables further degrees of freedom in the construction of the assembly.
Wenn das Substrat auf den Funktionselementen positioniert und ein Fügeprozess durchlaufen wurde, so gehen die Funktionsele mente eine dauerhafte elektrische und mechanische Verbindung mit dem Substrat bzw. dessen Leitebene ein. Die Funktionsele mente sind damit mit dem Substrat mechanisch verbunden, die Stützfunktion hat damit ihren Zweck erfüllt und die Funktion des elektrischen Kontaktierens steht nun im Vordergrund. When the substrate is positioned on the functional elements and a joining process has been carried out, the functional elements enter into a permanent electrical and mechanical connection with the substrate or its control plane. The functional elements are thus mechanically connected to the substrate, the support function has thus fulfilled its purpose and the function of making electrical contact is now in the foreground.
Eine weitere Ausführungsform umfasst den Schritt des Bereit stellens eines Warenträgers, wobei die Formteile, Dies und/oder Fügematerialien auf dem Warenträger angeordnet wer den. Der Warenträger kann dabei eine oder mehrere Aussparun gen aufweisen, wobei die Formteile, Dies und/oder Fügemateri alien dann so angeordnet werden können, dass sich zumindest ein Teil der Funktionselemente in den Aussparungen bildet.A further embodiment comprises the step of providing a goods carrier, the molded parts, dies and / or joining materials being arranged on the goods carrier. The goods carrier can have one or more cutouts, the molded parts, dies and / or joining materials then being able to be arranged in such a way that at least some of the functional elements are formed in the cutouts.
Die Formteile können dabei direkt, d. h. ohne weitere Zwi schenelemente, auf dem Warenträger angeordnet werden. Der Wa renträger dient dabei in erster Linie dazu, die Baugruppe und ihre Funktionselemente durch den Produktionsprozess zu trans portieren. Die Aussparungen können dabei auch so ausgestaltet sein, dass diese eine Stützfunktion für die Funktionselemen te, die noch nicht gefügt worden sind, bereitstellen . Der Warenträger verbleibt nicht an der fertiggestellten Bau gruppe. Es ist möglich, dass ein Warenträger bereits mit ei ner ersten Schicht an ausgewählten Formteilen vorbestückt ist. Ein Warenträger kann dabei tablettähnlich ausgebildet sein oder kann dabei auch als ein Teil eines Förderbandsys tems oder anderweitigen, z. B. (teil-) autonomen Fördersys tems ausgebildet sein. Die Verwendung eines Warenträgers er höht vorteilhaft die Handhabbarkeit des vorliegenden Verfah rens. In anderen Worten wird ein intelligentes Warenträger konzept zur Verfügung gestellt auf dessen Basis die Fügepart ner vollautomatisiert, additiv aufgebaut werden, z. B. durch intelligentes Schichten und Fügen. Es kann vorteilhaft sein, wenn der Warenträger so ausgestaltet ist, dass die Funktions elemente im Wesentlichen eine Ebene bilden. Andere Formen sind dann denkbar und sinnvoll, wenn keine Flachen Substrate zum Einsatz kommen sollen. The molded parts can be arranged on the goods carrier directly, that is to say without further inter mediate elements. The main purpose of the product carrier is to transport the assembly and its functional elements through the production process. The recesses can also be designed in such a way that they provide a support function for the functional elements that have not yet been joined. The goods carrier does not remain on the completed assembly. It is possible that a product carrier is already pre-equipped with a first layer of selected molded parts. A goods carrier can be designed like a tray or can be used as part of a conveyor belt system or otherwise, for. B. (partially) autonomous conveyor systems be designed. The use of a goods carrier he advantageously increases the manageability of the present method. In other words, an intelligent product carrier concept is made available on the basis of which the Fügepart ner are fully automated, additive, z. B. through intelligent layering and joining. It can be advantageous if the goods carrier is designed such that the functional elements essentially form a plane. Other shapes are conceivable and sensible if flat substrates are not to be used.
In einer weiteren Ausführungsform werden die Funktionselemen te voneinander beabstandet gebildet. Die Funktionselemente sind voneinander beabstandet angeordnet, d. h. so angeordnet, dass sie eine Stützfunktion an mehreren Punkten eines darauf positionierten Substrats ausüben können. Dadurch kann eine gleichmäßige Verteilung der Last bzgl. des Substrats erreicht werden. Die Funktionselemente können so angeordnet werden, dass sie das Substrat während des Montageprozesses vollstän dig tragen können. Die Funktionselemente sind weiterhin so angeordnet, dass das elektrische Kontaktieren der Funktions elemente und des Substrats realisiert werden kann. In a further embodiment, the functional elements are formed at a distance from one another. The functional elements are arranged at a distance from one another, i. H. arranged so that they can exercise a support function at several points of a substrate positioned thereon. As a result, a uniform distribution of the load with respect to the substrate can be achieved. The functional elements can be arranged so that they can carry the substrate completely dig during the assembly process. The functional elements are also arranged in such a way that electrical contact between the functional elements and the substrate can be realized.
In einer weiteren Ausführungsform weist der Warenträger ein oder mehrere Aussparungen mit untereinander verschiedenen Di mensionen auf. Dies kann beispielsweise eine unterschiedli cher Tiefe der Aussparungen beinhalten, z. B., um Höhenunter schiede auszugleichen. Weiterhin kann der Warenträger auf be stimmte Formteile angepasste Aussparungen aufweisen. Die Tie fe der Aussparung korrespondiert mit den Dicken der dort an geordneten Formteile und/oder mit dem notwendigen Höhenaus gleich. Die Tiefe der Aussparungen beträgt in der Regel höchstens 2mm, kann aber darüber liegen, wenn besonders Dicke Teile verarbeitet werden sollen. In a further embodiment, the goods carrier has one or more recesses with mutually different dimensions. This can include, for example, a different depth of the recesses, e.g. B. to compensate for differences in height. Furthermore, the goods carrier can have cutouts adapted to certain molded parts. The depth of the recess corresponds to the thickness of the molded parts arranged there and / or with the necessary Höhenaus. The depth of the recesses is usually a maximum of 2mm, but can be higher if particularly thick parts are to be processed.
Eine weitere Ausführungsform umfasst ein Anordnen von ein o- der mehreren Hilfselementen. Die Hilfselemente können auf ei nem Warenträger und/oder unterhalb von Formteilen angeordnet werden. Die Hilfselemente verbleiben dabei nicht dauerhaft in der elektronischen Baugruppe, sondern werden, wenn die Another embodiment includes arranging one or more auxiliary elements. The auxiliary elements can be arranged on egg nem goods carrier and / or below molded parts. The auxiliary elements do not remain permanently in the electronic assembly, but are when the
Hilfselemente ihren Zweck erfüllt haben - z. B. ein zwischen zeitliches Bereitstellen einer mechanischen Stützfunktion o- der einer Schutzfunktion für ein empfindliches Bauteil - wie der entfernt. So können die Hilfselementen auf dem Warenträ ger verbleiben und können einen größeren Höhenunterschied als der Warenträger ausgleichen und tragen dabei zur Erhöhung der Flexibilität bei. Alternativ oder ergänzend können Hilfsele mente erst später im Prozess entfernt werden. Die Hilfsele mente können selbst wiederum Aussparungen aufweisen oder be reits mit Bauelementen vorbestückt sein. Auxiliary elements have served their purpose - e.g. B. a temporary provision of a mechanical support function or a protective function for a sensitive component - as removed. The auxiliary elements can remain on the goods carrier and can compensate for a greater difference in height than the goods carrier, thereby increasing flexibility. Alternatively or in addition, auxiliary elements can only be removed later in the process. The auxiliary elements can in turn have recesses or already be pre-equipped with components.
Eine weitere Ausführungsform umfasst ein Positionieren des Substrats auf den Funktionselementen, sodass die Leitebene mit den Funktionselementen elektrisch kontaktiert werden. In anderen Worten werden leitende Strukturen der elektrischen Baugruppe, die bisher noch zwischen der Leitebene des Sub strats und den die Funktionselementen aufgeteilt waren, durch elektrisches Kontaktieren der Leitebene mit den Funktionsele menten vervollständigt. Mit dem Positionieren des Substrats auf den Funktionselementen vervollständigen sich die leiten den Strukturen der Baugruppe und diese können gefügt werden. Das Substrat kann dabei eine strukturierte Leitebene aufwei sen und kann bereits weitere elektronische Bauelemente auf weisen. Hier ergibt sich der große Vorteil, dass die Funkti onselemente in großer Komplexität und unabhängig vom Substrat aufgebaut werden können und das Substrat erst nachträglich auf Funktionselemente aufgebracht werden kann. Dies ermög licht hohe Freiheitsgrade in der Gestaltung der elektroni schen Baugruppe. In einer weiteren Ausführungsform ist zumindest eines der zum Kontaktieren des Dies verwendeten Formteile als Anschlussrah men (im Englischen: Leadframe) ausgebildet. Diese Ausfüh rungsform ist besonders vorteilhaft, da so ein Herstellungs prozess möglich wird, der die Anbindung von Leadframes in den Montageprozess integriert, damit höhere Gestaltungsspielräume ermöglicht und potentiell einen separaten Montage- /Prozessschritt spart. Auch sind Kombinationen mit standardi sierten Leadframestrukturen (z. B. in einer Premolded- Variante) denkbar, bei denen produktspezifische Anpassungen durch nachgelagerte Bearbeitungen (z.B. Laserschnitte zum Entfernen von Stützstrukturen bzw. nicht genutzten Verdrah- tungslayern) erfolgen. Another embodiment comprises positioning the substrate on the functional elements so that the control plane is electrically contacted with the functional elements. In other words, conductive structures of the electrical assembly, which were previously divided between the control level of the substrate and the functional elements, are completed by electrically contacting the control level with the functional elements. When the substrate is positioned on the functional elements, the guiding structures of the assembly are completed and these can be joined. The substrate can have a structured control plane and can already have further electronic components. This has the great advantage that the functional elements can be built up in great complexity and independently of the substrate and the substrate can only be applied to functional elements afterwards. This allows a high degree of freedom in the design of the electronic assembly's light. In a further embodiment, at least one of the molded parts used to contact the die is designed as a leadframe. This embodiment is particularly advantageous because it enables a manufacturing process that integrates the connection of lead frames into the assembly process, thus allowing greater scope for design and potentially saving a separate assembly / process step. Combinations with standardized leadframe structures (eg in a premolded variant) are also conceivable, in which product-specific adaptations are made through subsequent processing (eg laser cuts to remove support structures or unused wiring layers).
Die Leadframe-Technologie bietet für die Verdrahtung von Dies aufgrund der Power Cycling Festigkeit und der elektrischen Performance (elektrische und thermische Leitfähigkeit, nied rige Induktivität etc.) hohe Vorteile. Bisher war diese Tech nologie aufgrund des Initialaufwandes (Werkzeuge für Stanzen, Formen und Molden etc.) für kleine Stückzahlen nicht wirt schaftlich darstellbar. Der Aufwand steigt mit der Komplexi tät und den Genauigkeitsanforderungen der Leadframes (unter schiedliche Potentiale, variable Leadframe-Querschnitte usw . ) . Leadframe technology offers great advantages for the wiring of dies due to the power cycling stability and the electrical performance (electrical and thermal conductivity, low inductance, etc.). So far, this technology has not been economically viable for small quantities due to the initial effort (tools for punching, forming and molding, etc.). The effort increases with the complexity and the accuracy requirements of the leadframes (different potentials, variable leadframe cross-sections, etc.).
Es kann vorteilhaft sein, den Anschlussrahmen und die Form teile so anzuordnen, dass sich aus dem Anschlussrahmen, den Formteilen und den Fügematerialien eine Einheit bildet, die im Rahmen der Montage handhabbar ist. Handhabbar heißt hier, dass die Einheit zumindest einen ausreichenden mechanischen Zusammenhalt aufweist, um während der weiteren Prozessschrit te nicht wieder in Einzelteile zu zerfallen. Dazu kann z. B. ein Fügeschritt durchgeführt werden, der aus den Funktions elementen eine Einheit bildet. Beispielsweise können teile der Fügematerialien gefügt werden (z. B. durch Sintern oder Löten) . It may be advantageous to arrange the connection frame and the molded parts in such a way that the connection frame, the molded parts and the joining materials form a unit that can be handled during assembly. Manageable here means that the unit has at least sufficient mechanical cohesion so that it does not disintegrate again into individual parts during the further process steps. For this purpose z. B. a joining step can be carried out, which forms a unit from the functional elements. For example, parts of the joining materials can be joined (e.g. by sintering or soldering).
Eine weitere Ausführungsform umfasst ein Anordnen von Another embodiment includes arranging
elektrisch isolierenden Elementen, sodass sich elektrisch isolierte Stützstellen für das Substrat ausbilden. Dies bie tet den Vorteil, dass Formteile unterschiedlicher Potentiale über elektrisch isolierende Formteile an geeigneten Stütz stellen isoliert und mechanisch stabilisiert werden können. Auch die Herstellung elektrisch leitender Verbindungen zwi schen unterschiedlich geformten Formteilen variabler Dicke ist durch die Verwendung lokaler Verdrahtungsträger möglich. Die Funktionselemente können so entlastet werden und der Ge staltungsspielraum erhöht sich weiter. Die elektrisch isolie renden Elemente verbleiben vorzugsweise in ihrer Funktion als elektrischer Isolator auf der Baugruppe. electrically insulating elements, so that they are electrically form isolated support points for the substrate. This offers the advantage that molded parts of different potentials can be isolated and mechanically stabilized at suitable support points via electrically insulating molded parts. The production of electrically conductive connections between differently shaped molded parts of variable thickness is also possible through the use of local wiring supports. The functional elements can thus be relieved and the design leeway increases further. The electrically insulating elements preferably remain in their function as an electrical insulator on the assembly.
Eine weitere Ausführungsform umfasst ein Fügen, sodass die Fügematerialien Verbindungen mit den Formteilen, dem Die und/oder der Leitebene eingehen. Das Fügen kann dabei sowohl die Formteile als auch den Die mit den Fügematerialien ver binden. Hierbei sind Lot und Sinterverfahren denkbar. Beson ders vorteilhaft am vorliegenden Verfahren ist dabei, dass die Fügeverfahren nunmehr für alle Funktionselemente und das Substrat gleichzeitig und in einem einzigen Prozessschritt durchgeführt werden können. Falls nötig ist aber ebenso denk bar, wenn z. B. besonders robuste oder mit hoher Stromtragfä higkeit ausgestattete Funktionselemente vonnöten sind, ein mehrteiliges Fügeverfahren durchgeführt wird, mehrere Füge verfahren kombiniert werden. Zum Beispiel erst ein Sinterver fahren, das hochtemperaturbeständige Sinterverbindungen für den Die erzeugt und anschließend ein Lötverfahren, das das Substrat anbindet. Another embodiment comprises joining, so that the joining materials enter into connections with the molded parts, the die and / or the control plane. The joining can connect both the molded parts and the die with the joining materials. Solder and sintering processes are conceivable here. A particular advantage of the present method is that the joining methods can now be carried out for all functional elements and the substrate simultaneously and in a single process step. If necessary, however, is also conceivable if, for. B. particularly robust or equipped with high Stromtragfä capability functional elements are required, a multi-part joining process is carried out, several joining processes are combined. For example, first drive a sintering process that creates high-temperature-resistant sintered connections for the die and then a soldering process that bonds the substrate.
In einer weiteren Ausführungsform wird zumindest ein weiteres elektrisches Bauelement angeordnet. Dies geschieht vorzugs weise ergänzend zum Anordnen der Formteile, der Dies und der Fügematerialien und kann im gleichen Prozessschritt durchge führt werden. Dabei können passive und/oder aktive Bauelemen te angeordnet werden. Es hat sich als besonders vorteilhaft erwiesen, wenn weitere Bauteile mit den Formteilen verarbei tet werden. Dies kann beispielsweise ein Strom-Mess-Shunt sein, der den Strom in direkter Nähe zum Die misst. So kann neben dem Herstellen von leitenden Verbindungen und Struktu- ren bereits funktionale Elemente im direkten Umfeld des Dies erstellt werden. In a further embodiment, at least one further electrical component is arranged. This is preferably done in addition to arranging the molded parts, the dies and the joining materials and can be carried out in the same process step. Passive and / or active components can be arranged. It has proven to be particularly advantageous if further components are processed with the molded parts. This can be a current measuring shunt, for example, which measures the current in the direct vicinity of the die. In addition to creating conductive connections and structural Functional elements can be created in the direct vicinity of the die
In einer weiteren Ausführungsform wird das Anordnen der planaren Formteile und/oder der Fügematerialien schichtweise durchgeführt. Es hat sich als vorteilhaft erwiesen das Anord nen der Formteile und der Fügematerialien schichtweise durch zuführen, da so z. B. eine Qualitätskontrolle bereits in den einzelnen Schichten des Anordnens möglich ist und wenn sich in einer Schicht Fehler oder Mängel ergeben noch ohne Weite res Maßnahmen ergriffen werden können. In a further embodiment, the planar molded parts and / or the joining materials are arranged in layers. It has proven to be advantageous to carry out the Anord NEN of the moldings and the joining materials in layers, as such. B. a quality control is already possible in the individual layers of the arrangement and if there are errors or defects in a layer without further measures can be taken.
Die Aufgabe wird weiterhin durch eine elektronische Baugruppe gelöst, die zumindest ein Die, ein Substrat mit einer Leit ebene und mehrere voneinander beabstandet angeordnete Funkti onselemente aufweist. Der Die ist mit zumindest einem der Formteile und einem der Fügematerialien elektrisch kontak tiert. Die Funktionselemente sind zumindest teilweise aus Formteilen und/oder dem Die sowie Fügematerialien ausgebil det, wobei die Funktionselemente zum Stützen des Substrats, insbesondere während der Produktion und zum elektrischen Kon taktieren der Leitebene ausgebildet sind. The object is also achieved by an electronic assembly which has at least one die, a substrate with a guide plane and several functional elements arranged at a distance from one another. The die is electrically connected to at least one of the molded parts and one of the joining materials. The functional elements are at least partially constructed from molded parts and / or the die and joining materials, the functional elements being designed to support the substrate, in particular during production, and to make electrical contact with the control level.
Das PCB weist dabei vorzugsweise aktive Bauelemente auf, die eine sogenannte „Control Unit" bilden und die Steuerlogik zur Ansteuerung der Dies bereitstellen . The PCB preferably has active components that form a so-called "control unit" and provide the control logic for controlling the dies.
Im Folgenden wird die Erfindung anhand der in den Figuren dargestellten Ausführungsbeispiele näher beschrieben und er läutert. Es zeigen: In the following, the invention is described in more detail using the exemplary embodiments shown in the figures, and it is explained. Show it:
FIG 1 einen Warenträger mit einer darauf angeordneten 1 shows a goods carrier with an arranged thereon
Stützstruktur, Support structure,
FIG 2 eine Explosionsansicht einer Stützstruktur, 2 shows an exploded view of a support structure,
FIG 3 eine weitere Ausführungsform eines Warenträgers, 3 shows a further embodiment of a goods carrier,
FIG 4 eine Stützstruktur in Zusammenwirkung mit einem 4 shows a support structure in cooperation with one
Substrat, Substrate,
FIG 5 eine elektronische Baugruppe und FIG 5 shows an electronic assembly and
FIG 6 einen möglichen weiteren Produktionsschritt. FIG 1 zeigt einen Warenträger 200, in dem erfindungsgemäße Funktionselemente 61, 62, 63 angeordnet worden sind. Die Funktionselemente 61, 62, 63 bilden dabei eine Stützstruktur 60. Die Funktionselemente 61, 62, 63 bilden weiterhin eine Kontaktfläche 600 der Stützstruktur 60, die in diesem Fall als eine Ebene ausgebildet ist und um in den nächsten Pro zessschritten ein Substrat 150, das hier nicht gezeigt ist, zu stützen. Der Warenträger 200 weist zwei Aussparungen 220 und 221 auf, wobei in der Aussparung 220 das Stützelement 61 angeordnet ist und in der Aussparung 221 die Funktionselemen te 62 und 63 angeordnet sind, die auf einer gemeinsamen Basis fußen. Das Stützelement 61 weist dabei Formteile 21, 22 und Fügematerialien 30 auf. Das Stützelement 62 weist dabei Form teile 23 und einen Teil des Formteils 24 sowie Fügemateria lien 30 auf. Ein Die 40, z.B. ein Halbleiterschalter wie ein IGBT-Bare-Die, ist mit Fügematerialien 30 auf dem Formteil 24 angeordnet, sodass der Die 40 ein Stützelement 63 bildet. Gleichzeitig ist die Die-Oberseite und die Die-Unterseite durch die gemeinsame Basis, das Formteil 24, auf eine gemein same Ebene (die Ebene der Kontaktfläche 600) gebracht worden. So kann eine Kontaktierung von Dies stark vereinfacht werden. 6 shows a possible further production step. 1 shows a goods carrier 200 in which functional elements 61, 62, 63 according to the invention have been arranged. The functional elements 61, 62, 63 thereby form a support structure 60. The functional elements 61, 62, 63 also form a contact surface 600 of the support structure 60, which in this case is designed as a plane and in the next process steps around a substrate 150 that is not shown here to support. The goods carrier 200 has two recesses 220 and 221, the support element 61 being arranged in the recess 220 and the functional elements 62 and 63 being arranged in the recess 221, which are based on a common base. The support element 61 has molded parts 21, 22 and joining materials 30. The support element 62 has molded parts 23 and part of the molded part 24 as well as joining materials 30. A die 40, for example a semiconductor switch such as an IGBT bare die, is arranged with joining materials 30 on the molded part 24, so that the die 40 forms a support element 63. At the same time, the top and bottom of the die have been brought to a common plane (the plane of the contact surface 600) by the common base, the molded part 24. A contacting of dies can thus be greatly simplified.
Es ist zu beachten, dass die Formteile 21,..., 24 direkt auf dem Warenträger 200 angeordnet werden und nicht auf einem Sub strat aufgebracht werden. Diese Art der Anordnung ermöglicht eine höhere Flexibilität und erheblich mehr Freiheitsgrade im Aufbau der Kontaktstrukturen, die mit einem Substrat verbun den werden sollen. It should be noted that the molded parts 21, ..., 24 are arranged directly on the goods carrier 200 and are not applied to a substrate. This type of arrangement enables greater flexibility and considerably more degrees of freedom in the construction of the contact structures that are to be connected to a substrate.
FIG 2 zeigt eine Explosionsansicht der Funktionselemente 61, 62, 63 bzw. der Stützstruktur 60, wie sie aus FIG 1 bekannt ist. Das Stützelement 61 wird dabei aus einem Kupferformteil 22, das in die Aussparung 220 eingelegt wird, einem Fügemate rial 30, einem weiteren Kupferformteil 21 sowie einem ab schließenden weiteren Fügematerial 30 stapelweise angeordnet. Das Formteil 21 ist dabei ein sehr flaches Kupferformteil , im Vergleich dazu wird in eine Aussparung 221 ein deutlich di ckeres und breiteres Kupferformteil 24 eingelegt. Die unter- schiedlichen Dicken werden vorliegend durch unterschiedliche Tiefen der Aussparungen 220,221 ausgeglichen. Das Kupferform- teil 24 dient als Basis für zwei weitere Funktionselemente 62, 63, die folglich über das Kupferformteil 24 elektrisch verbunden sind. Die Dimensionen der Formteile können dabei anhand von thermischen und Leistungskriterien gewählt werden. Auch die Fügematerialien 30 können auf ihre Formteile ange passt sein. So ist es denkbar, dass für den dabei spezielle Bügelmaterialien 30 zur Anwendung kommen, wohingegen für die Kupferformteile 21,..., 24 weitere Fügematerialien 30 zum Ein satz kommen. FIG. 2 shows an exploded view of the functional elements 61, 62, 63 or the support structure 60, as is known from FIG. The support element 61 is made up of a molded copper part 22, which is inserted into the recess 220, a joining material 30, a further molded copper part 21 and a subsequent further joining material 30 arranged in stacks. The molded part 21 is a very flat copper molded part; in comparison with this, a clearly thicker and wider molded copper part 24 is inserted into a recess 221. The under- Different thicknesses are compensated in the present case by different depths of the recesses 220, 221. The molded copper part 24 serves as the basis for two further functional elements 62, 63, which are consequently electrically connected via the molded copper part 24. The dimensions of the molded parts can be selected based on thermal and performance criteria. The joining materials 30 can also be adapted to their molded parts. So it is conceivable that special bracket materials 30 are used for this, whereas further joining materials 30 are used for the copper molded parts 21,..., 24.
FIG 3 zeigt eine weitere Aus führungs form eines Warenträger 200, wobei dieser keine Aussparungen aufweist, sondern mit tels eines Hilfselements 228 einen Höhenausgleich zwischen den Funktionselementen 61, 62 und 63, wie sie aus FIG 1 und 2 bekannt sind, vornimmt. Das Hilfselement 228 kann bereits erste Formteile bzw. vorgefertigte Funktionselemente aufwei sen und direkt zur Verfügung gestellt werden, sei es in ande ren Worten das Hilfselement 228 wird bereits mit Formteilen angeliefert und dann mit weiteren Formteilen 21,..., 24 zusammen auf dem Warenträger 200, z. B. mit einem Bestückautomaten, angeordnet. Es ist aber ebenso denkbar, dass das Hilfselement 228 als Teil des Warenträger 200 ausgebildet ist. Die Kon taktfläche 600 bleibt wie in den vorigen FIG 1 und 2 gezeigt Eben . FIG. 3 shows a further embodiment of a goods carrier 200, this having no cutouts, but instead using an auxiliary element 228 to compensate for the height between the functional elements 61, 62 and 63, as they are known from FIGS. 1 and 2. The auxiliary element 228 can already have first molded parts or prefabricated functional elements and be made available directly, be it in other words the auxiliary element 228 is already delivered with molded parts and then with further molded parts 21, ..., 24 together on the goods carrier 200, e.g. B. with a placement machine arranged. However, it is also conceivable that the auxiliary element 228 is designed as part of the goods carrier 200. The contact surface 600 remains as shown in the previous Figures 1 and 2 evenly.
FIG 4 zeigt, wie die Stützstruktur 60 mit einem Substrat 150 zusammenwirkt. Das Substrat 150 weist eine in diesem Fall ei ne bereits strukturierte Leitebene 152 auf. Auf der oberen Seite des Substrats 150 ist eine Kaschierung 153 vorgesehen, die zur Anbindung eines Kühlkörpers 155 mit einem Kühlkörper- Fügematerial 130 an das Substrat 150 dient. Das Substrat 150 bzw. die Leitebene 152 weist eine Kontaktfläche 650 der Leit ebene 152 auf. Die Kontaktfläche 650 der Leitebene 152 ist dabei so ausgestaltet, dass sie auf die Kontaktebene 600 der Stützstruktur 60 aufgelegt werden kann. In anderen Worten werden die Funktionselemente 61, 62, 63 im Zusammenhang mit der Leitebene 152 so ausgestaltet bzw. ausgelegt, dass diese ihre Stützfunktion und die elektrische Kontaktierung des Dies 40 realisieren können. An dieser Stelle ist zu erwähnen, dass die Stützfunktion für den Produktionsprozess gilt. Wenn ein Fügeprozess, z.B. Löten und/oder Sintern, durchlaufen wurde, so ist diese Stützfunktion zum Großteil nicht mehr notwendig und die Funktionselemente 61,62,63 dienen hauptsächlich ihrer zweiten Funktion des elektrischen Kontaktierens , insbesondere des Dies 40. FIG. 4 shows how the support structure 60 interacts with a substrate 150. The substrate 150 has a guide plane 152 which is already structured in this case. A lamination 153 is provided on the upper side of the substrate 150, which is used to connect a heat sink 155 with a heat sink joining material 130 to the substrate 150. The substrate 150 or the guide plane 152 has a contact surface 650 of the guide plane 152. The contact surface 650 of the control plane 152 is designed in such a way that it can be placed on the contact plane 600 of the support structure 60. In other words, the functional elements 61, 62, 63 in connection with the control level 152 are designed or designed in such a way that they can realize their support function and the electrical contacting of the die 40. At this point it should be mentioned that the support function applies to the production process. If a joining process, for example soldering and / or sintering, has been carried out, this support function is for the most part no longer necessary and the functional elements 61, 62, 63 mainly serve their second function of making electrical contact, in particular of the die 40.
FIG 5 zeigt die fertiggestellte elektronische Baugruppe 10, wie sie in FIG 4 montiert wurde. Die Baugruppe 10 wurde dabei vom Warenträger 200 entfernt und zur weiteren Verarbeitung umgedreht. Die in dieser Figur gezeigte Ausrichtung ent spricht dabei der Ausrichtung, in der elektronische Baugrup pen üblicherweise bestückt werden. Das erfindungsgemäße Ver fahren ermöglicht hier mehr Freiheitsgrade, indem die Funkti onselemente 61, 62, 63 unabhängig vom Substrat 150 angeordnet werden und daher optimal z. B. bzgl. Temperatur und/oder elektrischer Leistung aufgebaut werden können. Beispielhaft kann die in FIG 5 gezeigte Baugruppe 10 mit den folgenden Schritten und in der folgenden Reihenfolge aufgebaut werden:FIG. 5 shows the completed electronic assembly 10 as it was assembled in FIG. The assembly 10 was removed from the goods carrier 200 and turned over for further processing. The orientation shown in this figure corresponds to the orientation in which electronic assemblies are usually populated. The process according to the invention allows more degrees of freedom by the functi onselemente 61, 62, 63 are arranged independently of the substrate 150 and therefore optimally z. B. regarding. Temperature and / or electrical power can be built. As an example, the assembly 10 shown in FIG. 5 can be constructed with the following steps and in the following sequence:
- Bereitstellen eines Warenträgers 200, wobei die Formteile 21,..., 24, Dies 40 und/oder Fügematerialien 30 so auf dem Wa renträger 200 angeordnet werden, dass - Provision of a goods carrier 200, the molded parts 21, ..., 24, dies 40 and / or joining materials 30 being arranged on the goods carrier 200 in such a way that
- der Die 40 mit zumindest einem der planaren Formteile the die 40 with at least one of the planar molded parts
21,..., 24 und einem der Fügematerialien 30 elektrisch kontak tiert wird, 21, ..., 24 and one of the joining materials 30 is electrically connected,
- sich Funktionselemente 61, 62, 63 aus den planaren Formtei len 21,..., 24 und/oder dem Die 40 sowie den Fügematerialien 30 bilden, die zum Stützen des Substrats 150 und zum elektri schen Kontaktieren der Leitebene 152 ausgebildet werden, - Functional elements 61, 62, 63 are formed from the planar molded parts 21, ..., 24 and / or the die 40 and the joining materials 30, which are designed to support the substrate 150 and to make electrical contact with the control plane 152,
- Fügen, sodass die Fügematerialien 30 Verbindungen mit den Formteilen 21,..., 24, dem Die 40 und/oder der Leitebene 152 eingehen und schließlich - Joining, so that the joining materials 30 enter into connections with the molded parts 21, ..., 24, the die 40 and / or the control plane 152 and finally
- Wenden der Baugruppe 10 für die weitere Verarbeitung. - Turning the assembly 10 for further processing.
FIG 6 zeigt einen möglichen weiteren Produktionsschritt der elektrischen Baugruppe 10 aus FIG 5. Die strukturierte Leit ebene 152 des Substrats 150 weist Kontakte 112 für einen Rah- men 12 mit Pins auf. Wenn der Rahmen 12 mit Pins mit der elektrischen Baugruppe 10 verbunden ist kann ein Vergussmate rial 14 eingegossen werden, um einen Schutz der elektroni schen Baugruppe 10 und der darauf angeordneten Bauelemente zu ermöglichen. Eine Steuerelektronik PCB, in diesem Fall als Printed Circuit Board ausgeführt, kann anschließend kontak tiert werden und ist beispielsweise zur Ansteuerung einer Leistungselektronik ausgebildet, die mit dem erfindungsgemä ßen Verfahren hergestellt wurde. 6 shows a possible further production step of the electrical assembly 10 from FIG. 5. The structured control plane 152 of the substrate 150 has contacts 112 for a frame men 12 with pins on. When the frame 12 is connected to the electrical assembly 10 with pins, a potting material 14 can be cast in order to enable protection of the electronic assembly 10 and the components arranged thereon. Control electronics PCB, in this case designed as a printed circuit board, can then be contacted and is designed, for example, to control power electronics that were produced using the method according to the invention.
Zusammenfassend betrifft die Erfindung ein Verfahren zur Mon tage einer elektronischen Baugruppe 10, aufweisend zumindest ein Die 40 und ein Substrat 150 mit einer Leitebene 152. Um die elektrische Kontaktierung von Dies bei deren Montage zu vereinfachen wird folgender Schritt vorgeschlagen: In summary, the invention relates to a method for assembling an electronic assembly 10, having at least one die 40 and a substrate 150 with a control plane 152. In order to simplify the electrical contacting of dies during their assembly, the following step is proposed:
Anordnen von planaren Formteilen 21,..., 24, Fügematerialien 30 und dem zumindest einen Die 40, sodass Arranging planar molded parts 21, ..., 24, joining materials 30 and the at least one die 40 so that
- der Die 40 mit zumindest einem der planaren Formteile the die 40 with at least one of the planar molded parts
21,..., 24 und einem der Fügematerialien 30 elektrisch kontak- tiert wird, und 21, ..., 24 and one of the joining materials 30 is electrically contacted, and
- sich Funktionselemente 61, 62, 63 aus den planaren Formtei len 21,..., 24 und/oder dem Die 40 sowie den Fügematerialien 30 bilden, die zum Stützen des Substrats 150 und zum elektri schen Kontaktieren der Leitebene 152 ausgebildet werden. Die Erfindung betrifft weiterhin eine elektronische Baugruppe 10. - Functional elements 61, 62, 63 are formed from the planar molded parts 21, ..., 24 and / or the die 40 and the joining materials 30, which are designed to support the substrate 150 and to make electrical contact with the control plane 152. The invention also relates to an electronic assembly 10.
Bezugs zeichenliste Reference character list
10 elektronische Baugruppe10 electronic assembly
12 Rahmen mit Pins 12 frames with pins
14 Vergussmaterial 14 potting material
PCB Steuerelektronik PCB control electronics
21, 22, 23, 24 planare Formteile 21, 22, 23, 24 planar moldings
26 isolierende Formteile 26 insulating molded parts
30 Fügematerialien 30 joining materials
40 Die 40 The
60 Stützstruktur 60 support structure
61, 62, 63 Funktionselernente 61, 62, 63 functional members
150 Substrat 150 substrate
152 Leitebene 152 Management level
200 Warenträger 200 product carriers
220, 221 Aussparungen 220, 221 recesses
228 Hilfselement 228 auxiliary element
600 Kontaktfläche 600 contact area
650 Kontaktfläche der Leitebene 650 contact surface of the control level

Claims

Patentansprüche Claims
1. Verfahren zur Montage einer elektronischen Baugruppe (10) aufweisend zumindest ein Die (40) und ein Substrat (150) mit einer Leitebene (152), umfassend die Schritte: A method for assembling an electronic assembly (10) having at least one die (40) and a substrate (150) with a control plane (152), comprising the steps:
Bereitstellen eines Warenträgers (200), der ein oder mehrere Aussparungen (220, 221) mit untereinander verschiedenen Di mensionen aufweist, Providing a goods carrier (200) which has one or more recesses (220, 221) with mutually different dimensions,
Anordnen der planaren Formteile (21,...,24), Fügematerialien (30) und dem zumindest einen Die (40) auf dem Warenträger (200) , sodass Arranging the planar molded parts (21, ..., 24), joining materials (30) and the at least one die (40) on the goods carrier (200) so that
- der Die (40) mit zumindest einem der planaren Formteile (21,..., 24) und einem der Fügematerialien (30) elektrisch kon taktiert wird, und - The die (40) with at least one of the planar molded parts (21, ..., 24) and one of the joining materials (30) is electrically con tacted, and
- sich Funktionselemente (61, 62, 63) aus den planaren Form teilen (21,..., 24) und/oder dem Die (40) sowie den Fügemateria lien (30) bilden, die zum Stützen des Substrats (150) und zum elektrischen Kontaktieren der Leitebene (152) ausgebildet werden . - Functional elements (61, 62, 63) from the planar shape share (21, ..., 24) and / or the die (40) and the joining materials (30) that are used to support the substrate (150) and be designed for electrical contacting of the control plane (152).
2. Verfahren nach Anspruch 1, wobei die Funktionselemente (61, 62, 63) voneinander beabstandet gebildet werden. 2. The method according to claim 1, wherein the functional elements (61, 62, 63) are formed at a distance from one another.
3. Verfahren nach einem der vorhergehenden Ansprüche, um fassend den Schritt: Bereitstellen von ein oder mehreren Hilfselementen (228), insbesondere auf einem Warenträger (200) . 3. The method according to any one of the preceding claims, including the step: providing one or more auxiliary elements (228), in particular on a goods carrier (200).
4. Verfahren nach einem der vorhergehenden Ansprüche, um fassend den Schritt: Positionieren des Substrats (150) auf den Funktionselementen (61, 62, 63), sodass die Leitebene (152) mit den Funktionselementen (61, 62, 63) elektrisch kon taktiert wird. 4. The method according to any one of the preceding claims, comprising the step: positioning the substrate (150) on the functional elements (61, 62, 63) so that the control plane (152) with the functional elements (61, 62, 63) contacts electrically becomes.
5. Verfahren nach einem der vorhergehenden Ansprüche, wobei zumindest eines der zum Kontaktieren des Dies (40) verwende ten Formteile (21,..., 24) als ein Anschlussrahmen ausgebildet ist . 5. The method according to any one of the preceding claims, wherein at least one of the mold parts (21, ..., 24) used for contacting the die (40) is designed as a connection frame.
6. Verfahren nach einem der vorhergehenden Ansprüche, um fassend den Schritt: Anordnen von elektrisch isolierenden Elementen, sodass sich elektrisch isolierte Stützstellen für das Substrat (150) ausbilden. 6. The method according to any one of the preceding claims, comprising the step of: arranging electrically insulating elements, so that electrically isolated support points for the substrate (150) are formed.
7. Verfahren nach einem der vorhergehenden Ansprüche, fer ner umfassend den Schritt: Fügen, sodass die Fügematerialien (30) Verbindungen mit den Formteilen (21,...,24), dem Die (40) und/oder der Leitebene (152) eingehen. 7. The method according to any one of the preceding claims, further comprising the step: joining, so that the joining materials (30) have connections with the molded parts (21, ..., 24), the die (40) and / or the control plane (152) enter.
8. Verfahren nach einem der vorhergehenden Ansprüche, wobei zumindest ein elektrisches Bauelement angeordnet wird. 8. The method according to any one of the preceding claims, wherein at least one electrical component is arranged.
9. Verfahren nach einem der vorhergehenden Ansprüche, wobei das Anordnen der planaren Formteile (21,..., 24) und/oder der9. The method according to any one of the preceding claims, wherein the arranging of the planar molded parts (21, ..., 24) and / or the
Fügematerialien (24) schichtweise durchgeführt wird. Joining materials (24) is carried out in layers.
10. Elektronische Baugruppe (10) aufweisend zumindest ein Die (40), ein Substrat (150) mit einer Leitebene (152) und Funktionselemente (61, 62, 63), 10. Electronic assembly (10) having at least one die (40), a substrate (150) with a control plane (152) and functional elements (61, 62, 63),
wobei der Die (40) mit zumindest einem der Formteile wherein the die (40) with at least one of the mold parts
(21,..., 24) und einem der Fügematerialien (30) elektrisch kon taktiert ist, wobei die Funktionselemente (61, 62, 63) aus Formteilen (21,..., 24) und/oder dem Die (40) sowie Fügemateria- lien ( 30 ) ausgebildet sind, und zum Stützen des Substrats(21, ..., 24) and one of the joining materials (30) is electrically connected, the functional elements (61, 62, 63) made of molded parts (21, ..., 24) and / or the die (40) and joining materials (30) are formed, and for supporting the substrate
(150) und zum elektrischen Kontaktieren der Leitebene (152) ausgebildet sind. (150) and for making electrical contact with the control plane (152).
EP20735078.6A 2019-07-30 2020-06-15 Installing an electronic assembly Pending EP3959745A1 (en)

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