EP3957083A1 - Mikromechanischer schallwandler - Google Patents
Mikromechanischer schallwandlerInfo
- Publication number
- EP3957083A1 EP3957083A1 EP20720409.0A EP20720409A EP3957083A1 EP 3957083 A1 EP3957083 A1 EP 3957083A1 EP 20720409 A EP20720409 A EP 20720409A EP 3957083 A1 EP3957083 A1 EP 3957083A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- bending
- axis
- transducer
- along
- transducers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/227—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only using transducers reproducing the same frequency band
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Definitions
- Embodiments according to the invention relate to a micromechanical sound transducer.
- the document DE 10 2017 200 725 A1 discloses a layer structure and a method for producing a sensor that has movable MEMS elements.
- An electrode device that detects the movement of the MEMS elements is arranged below the movable MEMS elements.
- a cavity is formed in the cap substrate and in the bottom substrate, which are connected to one another by openings. Both cavities have different pressures that can be compensated through these openings.
- An electrically conductive wiring layer, which is connected to the MEMS elements, is applied between the bottom substrate and the movable MEMS elements by means of known layer deposition methods.
- this wiring layer has to be coated with an etch stop layer for further process steps in order not to impair its function.
- Document DE 10 2017 200 108 A1 discloses a micromechanical sound transducer arrangement.
- the sound transducers consist of flexural transducers which are elastically suspended on one side and which extend over a cavity and the edge area of which is spaced apart on a front side by a gap. The gap increases when the transducers are bent.
- a sound shielding device is disclosed which is formed by the side walls, the so-called sound blocking walls of the cavity. These walls are arranged in such a way that they at least partially prevent the lateral passage of sound along the gap.
- the sound transducers are piezoelectric and are therefore subject to a pre-curvature, so that the measures disclosed serve to minimize the inaccuracies that result from this pre-curvature.
- the core idea of the present invention is to have recognized that optimal actuator elements can only be sensibly housed in a MEMS BE if their electrical and fluidic function is not influenced by the structure itself. This is made possible by a design of the component described below.
- One exemplary embodiment relates to a micromechanical sound transducer which has a plurality of flexural transducers suspended on one side.
- the bending transducers can be, for. B. electrostatic bending actuators (NED actuators) or piezoelectric actuators.
- the plurality of bending transducers are designed to be deflected in an oscillation plane.
- the bending transducers are arranged next to one another in the oscillation plane along a first axis and extend along a second axis that is transverse to the first axis.
- the bending transducers are alternately hung on opposite sides and interlock.
- the bending transducers are fixed on one side and designed to be freely movable at the opposite end within the plane of oscillation.
- Each bending transducer has a first electrode and a second electrode, which lie opposite one another along the first axis, in order to lead to deflections of the respective bending transducer along the first axis when a voltage is applied. If it is the Biegewandier z.
- B. a piezoelectric actuator at least two piezoelectric layers with opposite polarity can be arranged between the first electrode and the second electrode. If the bending transducers are electrostatic bending actuators, a thin gap can be arranged between the first electrode and the second electrode. Due to the thin electrode gap, high forces of electrostatic fields are generated with the help of the applied voltage and these forces can in turn be transformed into lateral forces through suitable topographies or geometries and lead to a warping of the bending transducers.
- Mutually facing electrodes of adjacent bending transducers are electrically connected to one another by means of a cross connection which crosses the oscillation plane transversely to the first axis (ie crosses).
- mutually facing electrodes of adjacent bending transducers are electrically connected to one another by a cross connection which runs along the oscillation plane and transversely to the first axis.
- the cross-connection can also be referred to as a potential cross-connection and is a current-carrying layer that z.
- B. electrically couples outer electrodes of adjacent bending transducers to one another.
- Electrodes facing a first direction along the first axis are electrically connected to one another and to the electrodes of second bending transducers facing a second direction opposite to the first direction, which are suspended on a second side of the opposite sides, and for the first bending transducers the Electrodes facing the second direction along the first axis are electrically connected to one another and to the electrodes of the second bending transducer facing the first direction.
- the first electrodes of the bending transducers can face the first direction along the first axis and the second electrodes face the second direction along the first axis.
- the first electrode of a bending transducer is connected via the cross connection to a second electrode of a bending transducer adjacent in the first direction and a second electrode of the bending transducer is z. B. electrically connected via a second cross connection to a first electrode of a bending transducer adjacent in the second direction along the first axis.
- z. B. facing outer electrodes of adjacent bending transducers have the same potential.
- the plurality of bending transducers are arranged in a space which is delimited parallel to the plane of oscillation by a first and a second substrate, and subdivide the space along the first direction into cavities which are arranged between adjacent bending transducers.
- the cross connection is z. B. so arranged between two adjacent bending transducers within a cavity, so that this cavity is divided into two partial cavities.
- the cross-connection can thus serve as a cavity partition between adjacent flexural converters.
- the cross connection can be lowered in order to fluidically couple the partial cavities that are separated from one another. So the cross-connection z. B.
- adjacent flexural transducers can be coupled to one another, which leads to an increased force acting on a fluid located in the cavities.
- the bending transducers can thus be arranged at a small distance from one another, which leads to advantageous miniaturization. It is also advantageous that adjacent bending transducers are suspended on opposite sides and interlock, which means that inertia forces can also be compensated for.
- One embodiment creates a micromechanical sound transducer which has a plurality of suspended bending transducers.
- the plurality of bending transducers are designed for deflection in a plane of oscillation and are arranged next to one another in the plane of oscillation along a first axis.
- the plurality of flexure transducers extend along a second axis that is transverse to the first axis.
- the bending transducers can optionally be suspended on one or both sides.
- the bending transducers are electrostatic or piezoelectric or thermomechanical bending transducers.
- the bending transducers are deflected by a signal at a signal connection in such a way that mutually adjacent bending transducers are deflected in opposite directions along the first axis.
- the bending transducer can be operated in a push-pull mode, which can compensate for inertia forces of the bending transducer and in this way, for. B. in principle enables the fluid to be conveyed into and out of the cavities.
- Mutually facing bending transducer sides of the mutually adjacent bending transducers have depressions and projections which are aligned with each other along the second axis so that when the mutually adjacent bending transducers are deflected in opposite directions, projections of a first bending transducer side of the mutually facing bending transducer sides move towards depressions of a second bending transducer side of the mutually facing bending transducer or away from it, and depressions on the first bending transducer side move towards or away from projections on the second bending transducer side of the mutually facing bending transducer sides.
- adjacent flexural transducers exert the same effect on a fluid with opposite deflection that is located in a cavity arranged between the adjacent flexural transducers. It is also advantageous on the depressions and projections that this enables an increase in the packing density of the micromechanical sound transducer.
- the depressions and projections can have a wide variety of shapes, such as. B. rectangular, triangular, square or the projections and depressions can have segments of a circle or ellipse.
- the recesses and projections of the bending transducers can define a contour of the bending transducers. Depending on the shape of the contour of the electrodes, the bending transducer can, for. B.
- One embodiment creates a micromechanical sound transducer which has a plurality of suspended bending transducers.
- the plurality of bending transducers are designed for deflection in a plane of oscillation and are arranged next to one another in the plane of oscillation along a first axis.
- the plurality of flexure transducers extend along a second axis that is transverse to the first axis.
- the bending transducers can optionally be suspended on one or both sides.
- the bending transducers are electrostatic or piezoelectric or thermomechanical bending transducers.
- the bending transducers are deflected by a signal at a signal connection in such a way that mutually adjacent bending transducers are deflected in opposite directions along the first axis.
- the bending transducers are arranged in a space which is delimited parallel to the plane of vibration by a first and a second substrate, and subdivide the space along a first direction of the first axis into cavities which are arranged between adjacent bending transducers.
- a cavity is delimited, for example, by the first substrate, the second substrate and two opposite sides of adjacent bending transducers.
- the bending transducers can each be at a distance from the first substrate and the second substrate, through which adjacent cavities can be fluidically coupled to one another. Due to the fluidic coupling of adjacent cavities, a common force can be exerted by the plurality of bending transducers on a fluid located in the cavities, as a result of which a high sound level can be achieved with the micromechanical sound transducer.
- the plurality of suspended bending transducers can be suspended on one side. At the free end of the bending transducer is z. B. a very small, just as technically possible distance to the surrounding substrate in order not to create an acoustic short circuit.
- the very small spacing is realized in that a substrate facing the free end of the bending transducer is shaped in such a way that the substrate follows a deflection of the bending transducer.
- the substrate can have a circular segment-shaped or an elliptical segment-shaped recess, so that the distance remains very small due to a deflection of the bending transducer and the movement of the bending transducer e.g. B. is not restricted.
- the cavities are widened along the first direction of the first axis alternately by first recesses forming first channels in the first and / or in the second substrate and second recesses forming second channels in the first and / or in the second substrate. Since the first and second recesses in the first and / or located in the second substrate, the cavities are z. B. along a third axis which is aligned perpendicular to the plane of vibration, expanded.
- the volume of the cavities can thus be increased, while at the same time a high packing density can be achieved. Due to the high packing density and the increased volume of the cavities, miniaturized micromechanical sound transducers with a high sound level can be realized. According to one embodiment, adjacent cavities have different channels.
- the two adjacent cavities have the second channels.
- the first and second channels run in opposite directions along the second axis for the fluidic coupling of the space with the surroundings. That means z. B. that the first channels run in one direction, so that the first channels at an opening in one side, on which the bending transducer can be suspended, open to the environment and second channels run in the opposite direction and thus z. B. at an opening on an opposite side, on which bending transducers can also be suspended, opens into the environment.
- the first and second channels thus run parallel to the plurality of bending transducers, for example. Because the first channels and the second channels run in opposite directions, the fluid can flow into the cavities of the micromechanical sound transducer on one side and flow out again on the opposite side in an adjacent cavity.
- 1 shows a schematic representation of a micromechanical sound transducer with cross connections according to an exemplary embodiment of the present invention
- 2 shows a schematic illustration of a micromechanical sound transducer with bending transducers which have depressions and projections, according to an exemplary embodiment of the present invention
- FIG. 3 shows a schematic representation of a micromechanical sound transducer according to an exemplary embodiment of the present invention, in which cavities are expanded by first and second channels;
- FIG. 4a shows a schematic illustration of a micromechanical sound transducer, which has an array of bending transducers, according to an exemplary embodiment of the present invention
- FIG. 4b shows a schematic illustration of a micromechanical sound transducer, which has an array of bending transducers with connecting channels, according to an exemplary embodiment of the present invention
- FIG. 5 shows a schematic representation of a micromechanical sound transducer which has a plurality of flexural transducers which are suspended on both sides, according to an exemplary embodiment of the present invention
- FIG. 6a shows a schematic representation of a micromechanical sound transducer with cross connections that follow the contours of adjacent bending transducers, according to an exemplary embodiment of the present invention
- FIG. 6b shows a schematic illustration of a micromechanical sound transducer which has openings in a first substrate and in a second substrate, according to an exemplary embodiment of the present invention
- FIG. 8 shows a schematic representation of a method for producing a
- Cross connection for a micromechanical sound transducer according to an embodiment of the present invention
- 9 shows a schematic cross section through a micromechanical sound transducer at two points in time, according to an exemplary embodiment of the present invention
- 10a shows a schematic representation of a first interconnection of the plurality
- FIG. 10b shows a schematic illustration of an alternative connection of a plurality of bending transducers of a micromechanical sound transducer, according to an exemplary embodiment of the present invention
- 11a shows a schematic illustration of a micromechanical sound transducer with lateral openings to the environment at a first point in time, according to an exemplary embodiment of the present invention
- 11b shows a schematic illustration of a micromechanical sound transducer with lateral openings at a second point in time, according to an exemplary embodiment of the present invention
- FIG. 12a shows a schematic representation of a bending transducer with three electrodes, according to an exemplary embodiment of the present invention
- FIG. 12b shows a schematic representation of a bending transducer with an alternatively shaped gap, according to an exemplary embodiment of the present invention
- FIG. 12c shows a schematic representation of a bending transducer with two thin electrodes, according to an exemplary embodiment of the present invention
- 12d shows a schematic representation of a bending transducer with an asymmetrical
- FIG. 13a shows a schematic plan view of a bending transducer with two electrodes, according to an exemplary embodiment of the present invention
- FIG. 13b shows a schematic cross section of a bending transducer according to the embodiment of FIG. 13a;
- FIG. 14a shows a schematic representation of an interconnection of a bending transducer with three electrodes, according to an exemplary embodiment! of the present invention.
- 14b shows a schematic illustration of an alternative connection of a bending transducer with three electrodes, according to an exemplary embodiment of the present invention.
- the bending transducers used have a surface centroid fiber that runs along or in a direction of a second axis x.
- the centroidal fiber runs parallel to the second axis only in certain exemplary embodiments.
- the center of gravity fiber represents, for example, an axis of symmetry of the bending transducer or, alternatively, z.
- FIG. 1 shows a micromechanical sound transducer 100, comprising a plurality of bending transducers 3i to 3s suspended on one side.
- the plurality of bending transducers 3 are designed for deflection 110i to 110s in an oscillation plane (x, y).
- the bending transducers 3 are arranged next to one another along a first axis y.
- a first bending transducer 3i is arranged next to a second bending transducer 3 2 .
- the bending transducers 3 are aligned parallel to one another.
- the plurality of bending transducers 3 extends along a second axis x, which is transverse or perpendicular to the first axis y.
- the bending transducers are located alternately on opposite sides. hung and interlock.
- the bending transducers 3i, 33 and 3s are fixed on a first side 120i and the bending transducers 3 2 and 3 4 are fixed on a second side 120 2 opposite the first side 120i.
- the bending transducer 3 2 is arranged, for example, between the bending transducer 3i and the bending transducer 3 3 and at least partially overlaps the bending transducers 3i and 33 in a projection along the first axis y, whereby the bending transducers intermesh.
- the bending transducers 3 overlap in a projection along the first axis y to more than 15 area percent, 35 area percent, 50 area percent, 65 area percent, 70 area percent, 75 area percent, 80 area percent or 85 area percent between the suspension locations of first bending transducers 3i, 3s and 3 5 suspended on the first side 120i of the opposite sides 120i, 120 2 and second bending transducers i and 3 4 suspended on the second side 120 2 of the opposite sides 120i, 120 2 .
- adjacent bending transducers are "superimposed", i.e. one bending transducer is projected onto the adjacent bending transducer (e.g.
- first bending transducers 3i, 3 3 and 3s have an offset 9 to the second bending transducers 3 2 and 34.
- the bending transducers 3 overlap in a projection along the first axis y to a maximum of 50 area percent, 60 area percent, 70 area percent or 85 area percent between the suspension locations of the first and second bending transducers.
- the bending transducers 3 can have features and functionalities as described in relation to the bending transducers in FIG. 2 or FIG. 5.
- the bending transducers 3 can optionally be designed as shown in FIGS. 12a to 14b. "
- each bending transducer 3 has a first electrode 130i to 130s and a second electrode 132i to 132 5 , which lie opposite one another along the first axis y.
- At least one gap 134i to 134 5 between the first electrode 130i to 130s and the second electrode 132i to 132 s, at least one gap 134i to 134 5 , at least one insulation (or an insulating layer) 12 and / or a third electrode, which can also be referred to as the middle electrode , be arranged.
- the gap 134 between the first electrodes 130 and the second electrodes 132 can be interrupted at some points by an insulating layer 12.
- the first electrodes 130 are connected to the second electrodes 132 in an electrically insulated manner in discrete areas.
- the bending transducers 3 can have a centroid fiber 6 which runs along the second axis x or is parallel to the second axis x and which can also be referred to as the axis of symmetry.
- the bending transducers 3 are designed symmetrically or asymmetrically with respect to the centroid fiber 6. That means z. B. that a contour of the bending transducer 3, which defines a shape of the bending transducer 3, is symmetrical or asymmetrical. In Fig. 1, the bending transducer 3 in this regard, for. B. designed symmetrically.
- a structure of the bending transducers 3 can be designed symmetrically or asymmetrically with respect to the centroid fiber 6.
- the bending transducers 3 in FIG. 1 are constructed asymmetrically, for example, since the first electrodes 130 and the second electrodes 132 have different dimensions along the first axis y and z.
- the gap 134 is arranged offset along the first axis y to the centroid fiber 6.
- Alternative shapes and / or structures are shown and described in the context of FIGS. 2, 5 and FIGS. 12a to 14b.
- the application of voltage 140 leads to deflections 110 of the bending transducers 3 along the first axis y.
- Mutually facing electrodes of adjacent bending transducers are electrically connected to one another by a cross connection 7i to 7.
- the cross connections 7 traverse the plane of oscillation (x, y) transversely to the first axis y.
- the cross connections 7 are formed so that for first bending transducers 3i, 3a and 3s, which are suspended on the first side 120i of the opposite sides 120i, 1202, the electrodes (according to FIG. 1 e.g. the second electrodes 132i, 1323 and 132s), which face a first direction 112 along the first axis y, with each other (e.g.
- Electrodes (according to FIG. 1, for example the first electrodes 130i, 130 3 and 130s) which face the second direction 114 along the first axis y, with one another (according to FIG. 1), for example via a connection 133 the second side 120 2 ) and with the electrodes facing the first direction 112 (e.g.
- the cross connections 7 can also be referred to as potential cross connections.
- the cross connections 7 are, for example, a current-carrying layer.
- the micromechanical sound transducer 100 has a signal connection 142 and a reference connection 144.
- the electrodes (according to FIG. 1, e.g. the second electrodes 132i, 132a and 132 5 ) which face the first direction 112 along the first axis y, the first bending transducers 3i, 33 and 3 5 and the electrodes (according to FIG 1, for example, the first electrodes 130 2 and 130 4) which face the second direction 114 along the first axis y, the second bending transducers 3 2 and 3 4 , are coupled to the signal connection 142, for example.
- the electrodes (shown in FIG. 1, for.
- the first electrode 130i, 130s and 130s which are the second direction face 114 along the first axis y, the first bending converter 3i, 33 and 3 5 and the electrodes (FIG. 1 e.g. the second electrodes 132 2 and 132 4 ) facing the first direction 112 along the first axis y, the second bending transducers 3 2 and 3 are coupled to the reference terminal 144, for example.
- applying the voltage 140 between the signal connection 142 and the reference connection 144 leads to opposite deflections 110 of the first bending transducers 3i, 33 and 3s relative to the second bending transducers 3 2 and 34 along the first axis y.
- Alternative interconnections that can be used here are illustrated and described, for example, with reference to FIGS. 10a, 10b and in FIGS. 13a to 14b.
- the bending transducers 3 are arranged in a space that is delimited parallel to the plane of vibration (x, y) by a first and a second substrate, and divide the space along the first direction 1 12 into cavities 150i to 150 that are between adjacent Bending transducers 3 are arranged.
- a first cavity 150i is arranged between the bending transducers 3i and 3 2 .
- Each cavity 150 is, for example, one or more openings with an environment fluidically coupled. The openings are not shown in FIG. 1, but can have features and functionalities as they are illustrated and described in connection with FIGS. 3, 4, 6b, 11a and / or 11b.
- the cavities 150 along the first axis y are each through one of the interconnections 7 in a first partial cavity 26i to 264 and with a second partial cavity 27i to 27. 4
- the cross connection 7 between the first partial cavities 26 and the second partial cavities 27 forms, for example, a fluidic blockage of between 5 and 95 area percent, between 7 and 93 area percent or between 8 and 90 area percent and restricts the deflection 110 of the bending transducers 3 that lead to the cross connection 7 are adjacent, which prevents the bending transducers from being deflected too much and thus the bending transducers being damaged or the functioning of the sound transducer becoming faulty.
- the cross connections 7 have an extent (height) along the third axis z. Damping of the micromechanical sound transducer can be set by the height of the cross connections 7.
- a higher cross connection 7 generally means stronger (fluidic) damping.
- the height can be structured multiple times within a section (for example the elongated extent of a cavity, for example along the second axis x) in a direction along a third axis z. So described figuratively, for example: lowered zi; lowered z 2 , lowered zi, z 2 , zi etc. (kind of vertical comb).
- Reason not only the summed aperture is exciting but also the individual apertures themselves (opening sizes seen laterally) at a certain location (e.g. free end of the bar with maximum deflection)
- each bending transducer 3 can be arranged in a bending transducer cavity which is formed by a first partial cavity 26 and a second partial cavity 27 adjoining the respective bending transducer.
- the first partial cavity 26 and the second partial cavity 27 are delimited from one another by the bending transducer 3 arranged within the bending transducer cavity.
- the first partial cavity 26 and the second partial cavity 27 can be connected to one another via connections above and below (ie in directions along a third axis z) of the bending transducers 3.
- the bending transducer 3 2 has a bending transducer cavity formed from the first partial cavity 26 2 and the second partial cavity 27 1 .
- the very small spacing is realized in that a substrate facing the free end of the bending transducer is shaped in such a way that the substrate follows a deflection of the bending transducer. This is shown, for example, in FIGS. 6a, 6b and 10a to 11b.
- the first partial cavity 26i to 264 and the second partial cavity 27i to 27 4 are fluidically connected to one another. This is implemented, for example, via one or more openings in the first substrate and / or in the second substrate, via a common opening in the first substrate or in the second substrate, or via a lowered cross connection 7.
- the cross connections 7 are at least partially connected to the first substrate and / or to the second substrate of the micromechanical sound transducer 100. This is z. B. illustrated in Fig. 8.
- the cross connections 7 follow a contour of the bending transducers 3 with maximum deflection.
- a first extension of the cross connections 7 corresponds at most to an extension of the bending transducer 3 along the third axis z, perpendicular to the plane of oscillation.
- the first expansion of the cross connections 7 varies, for. B. along the second axis x.
- FIG. 2 shows a schematic illustration of a micromechanical sound transducer 100, comprising a plurality of suspended bending transducers 3 1 to 3 4 , according to an exemplary embodiment of the present invention.
- the plurality of bending transducers 3 are designed for deflection 110 in an oscillation plane (x, y) and are arranged next to one another in the oscillation plane (x, y) along a first axis y.
- the bending transducers 3 extend along a second axis x, which is transverse to the first axis y.
- the micromechanical sound transducer 100 from FIG. 2 Have features and functionalities of the micromechanical sound transducer 100 from FIG. 1, even if these are not shown in FIG. 2.
- the bending transducers 3 are deflected by a signal at a signal connection 142 in such a way that mutually adjacent bending transducers 3 are deflected in the opposite direction along the first axis y.
- a first bending transducer 3i is deflected in a first direction 112 along the first axis y and a second bending transducer 3 2 in a second direction 114 along the first axis y. This deflection is shown in FIG. 2 by dashed lines 111, 113.
- Mutually facing bending transducer sides of the mutually adjacent bending transducers have depressions 160 and projections 162 which are aligned with one another along the second axis x so that with opposite deflection 110 of the mutually adjacent bending transducers 3 projections 162 of a first bending transducer side of the mutually facing bending transducer sides are located on depressions 160 move towards or away from a second bending transducer side of the mutually facing bending transducer sides, and recesses 160 of the first bending transducer side move towards or away from projections 162 on the second bending transducer side of the mutually facing bending transducer side.
- Fig. 2 with the reference numerals 111 and 113 is shown in dashed lines a moving towards each other of two facing bending transducer sides.
- 3 1 of the adjacent bending transducers 3i, and 3 2 for example, has a first bending transducer side 170 which faces the first direction 112 and the second bending transducer
- the 3 2 has a second bending transducer side 172 which is arranged facing the second direction 114.
- the first bending transducer side 170 is thus arranged facing the second bending transducer side 172.
- the first bending transducer side 170 has, for example, two recesses 160i and 160 2 as well as two projections 162i and 162 2 and the second bending transducer side 172 also has, for example, two recesses 160a and 1604 and two projections 162 3 and 162 4 . If the bending transducers 3i and 3 2 move towards one another, such as For example, shown in FIGS.
- the projections 162 3 , 162 4 of the second bending transducer side 172 move towards the depressions I6O1 and I6O2 of the first bending transducer side 170 and the depressions I6Q3 and 160 4 of the second bending transducer side 172 move towards the projections 162i and 162 2 of the first bending transducer side 170.
- the bending transducers 3 can be on one side as shown in FIG. 2 or on both sides, such as. B. shown in Fig. 5 suspended.
- FIG. 5 like FIG. 2, shows possible deflections of bending transducers 3 with projections 162 and Depressions 160.
- the micromechanical sound transducer 100 shown in FIG. 5 can have features and functionalities as are described with regard to FIG. 2 for the micromechanical sound transducer 100 shown there.
- the bending transducers 3 are shown only schematically.
- the bending transducers can be electrostatic (as described, for example, in FIG. 1), piezoelectric or thermomechanical bending transducers. In contrast to this, the bending transducers 3 in FIG.
- FIG. 5 shows an alternative embodiment of a micromechanical sound transducer 100 to the embodiments in FIGS. 1 and 2 and can have the features and functionalities described in this reference.
- the micromechanical sound transducers 100 from FIGS. 1, 2 and 5 can also have features and functionalities of the micromechanical sound transducer described in FIG. 3 and / or FIG. 4.
- FIG. 3 shows a micromechanical sound transducer 100, comprising a plurality of suspended bending transducers 3i to 3s, according to an exemplary embodiment of the present invention, on the left in a top view and on the right in a cross section along the cutting edge A-A in the top view.
- the plurality of bending transducers 3 are designed for design in a plane of oscillation (x, y) and are arranged next to one another in the plane of oscillation (x, y) along a first axis y.
- the plurality of bending transducers 3 extend along a second axis x which is transverse to the first axis y.
- the bending transducers 3 are deflected by a signal at a signal connection 142 in such a way that mutually adjacent bending transducers are deflected in the opposite direction along the first axis y.
- the bending transducers 3 are arranged in a space that is delimited parallel to the vibration plane by a first 180 and a second 182 substrate, and divide the space along a first direction 112 of the first axis y into cavities 150i to 150, which are arranged between adjacent level transducers 3 are.
- the cavities 150 are alternately formed along the first direction 112 by first recesses 190, 190i, 190 2 forming first recesses in the first substrate 180 and / or in the second substrate 182 and second channels 192, 192i, 192 2 forming second recesses. Expansions in the first substrate 180 and / or in the second substrate 182 expanded. Thus ⁇ with a fluid volume of the micro-mechanical transducer 100 is increased, a high sound pressure level can be achieved whereby with high packing density.
- the first channels 190, 190i, 190, and the second channels 192, 192i, 192 2 extend along the second axis x for fluidic coupling of the space with the surroundings in opposite directions.
- the first channels 190, 190i, 190 2 run out of space in a first direction 116 along the second axis x and the second channels 192, 192i, 192 2 run out of space in a second direction 118 along the second axis x.
- the channels (the first 190, 190i, 190 2 and / or the second 192, 192i, 192 2 channels) begin in the room and run along their direction 1 16 or 118 to the environment.
- adjacent cavities 150 have channels which run in opposite directions along the second axis x.
- first channels 190 from the top view in the section AA are represented by the channels 190i in the first substrate 180 and the channel 190 2 in the second substrate 182 and the second channels 192 in the top view are represented in the section AA by the channel 192i in the first substrate 180 and the channel 192 2 in the second substrate 182.
- first channels 190 are only formed in the first substrate 180 or only in the second substrate 182 and / or the second channels 192 are only formed in the first substrate 180 or only in the second substrate 182.
- the micromechanical sound transducer from FIG. 3 can also have features and functionalities of the micromechanical sound transducers in FIGS. 1 and 2. If the micromechanical sound transducer 100 in FIG. 3 has, for example, cross connections between bending transducers, as described in FIG. 1, then the cross connections, according to an exemplary embodiment, can at least partially cover the channel 190i and / or the channel 190 2 . This is sketched out schematically for a cross connection 7 between the bending transducers 3i and 3 2 . Alternatively, the first channels 190, 190i, 190 2 and the second channels 192, 192i, 192 2 can be arranged offset from the cross connections 7 along the first axis y.
- FIG. 1 This is shown schematically as an optional feature in FIG. 1 with channels 190 and 192.
- a bending transducer assembly such as. B, shown in FIG. 1, FIG. 2 and / or in FIG. 3, bending transducer modules of a micromechanical sound transducer 100, as it is e.g. B. shown in Fig. 4a or Fig. 4b, form.
- the bending transducer modules 3 arranged next to one another along the second axis x can be connected to one another via the first channels 190 and second channels 192.
- FIGS. 4 a and 4b different variants for realizing an array of bending transducers in a micromechanical sound transducer 100 are shown.
- first channels 190 with second channels 192 converge in partition walls 200i to 200a between the individual bending transducer modules and can there via an opening that transversely through a first and / or second substrate that has a space in which the bending transducers 3 are arranged parallel to the plane of oscillation (x, y) limited on opposite sides, run.
- the cavities can thus fluidically couple the cavities to the environment via the first 190 and / or second 192 channels and the openings connected to them.
- the openings can be arranged across the first and / or second substrate at any desired location of the first 190 and / or second 192 channels.
- the channels 190, 192 can also have the opening transversely through the first and / or second substrate along their entire length.
- the opening runs transversely through the first and / or second substrate perpendicular to the plane of oscillation (x, y).
- the first channels 190 and the second channels 192 run through all the bending transducer modules arranged along the second axis x and open laterally in the surroundings.
- the first channels 190 open on a first side 120i of the micromechanical sound transducer 100 and the second channels 192 open on an opposite side of a second side 120 2 .
- the first channels 190 penetrate, for example, all partition walls 200 t to 200 4 except for an outer wall 200 s
- the second channels 192 penetrate, for example, all partition walls 20 O 2 to 200 5 except for an outer wall 200 i.
- Very effective sound transducers can thus be implemented through a modular structure of the micromechanical sound transducers 100.
- the individual modules by coupling the individual modules with the first channels 190 and / or the second channels 192, high sound levels can be generated, since many bending transducers 3 interact in a small space and thus exert a high force on a fluid in the micromechanical sound transducer. Even if the bending transducers 3 are only suspended on one side in FIGS. 4 a and 4b, the bending transducers 3 can also be suspended on both sides.
- micromechanical sound transducers described herein are, for. B. to an arrangement of actuator elements that z. B. can be referred to as bending transducers, with multiple potentials in MEMS.
- the invention describes a significant further development of sound transducers.
- a key application is use in closed volumes, for example in in-the-ear headphones.
- the basic principle of volume utilization with air chambers is significantly expanded here in the present invention.
- First and second vertical flow directions 1 and 2 (e.g. at a first point in time; the flow direction 1 and 2 can be reversed at a second point in time; at the first point in time, bending transducers experience a first deflection and at the second point in time, bending transducers experience a first deflection e.g. a second deflection that is opposite to the first deflection.)
- Bending transducers 3 have a centroid fiber 6
- First partial cavity 26 formed by the first side of the bending transducer 3 and adjacent potential cross connection 7, as well as the substrate in the area of the clamping and the freely movable end of the bending transducer 3
- Second partial cavity 27 formed by the side opposite the first side of the bending transducer 3 and the potential cross connection 7 adjacent to this side, as well as the substrate in the area of the clamping and the freely movable end of the bending transducer 3
- Fig. 6a shows an embodiment of a side wall (potential cross connection 7) which follows the contour of the bending transducer.
- the cross connection 7, which electrically connects the bending transducers to one another is increased. That means z. B. that the cross connection 7 extends along a third axis z, perpendicular to an oscillation plane (x, y) and does not represent a conductor track, as on a circuit board. Because the cross connection 7 follows the contour of the bending transducers 3, it can be avoided that these touch the cross connections.
- the directions of movement 10 and 11 correspond to directions of a deflection 110 of bending transducers, as is shown in FIGS. 1 and 2.
- 19b floor opening follows the side wall (potential cross connection).
- the opening 19b follows a shape of the actuator (e.g. the bending transducer) •
- the openings in the cover as well as in the base can follow the side wall (potential cross connection) or have an alternative contour
- the lid defines z. B. a limitation of the partial cavities 26, 27 above the bending transducer 3 and the bottom defines z. B. a limitation of the partial cavities 26, 27 below the bending transducer 3.
- the cover defines z. B. a boundary parallel to a plane of vibration (x, y) in a first direction along a third axis z, perpendicular to the plane of vibration (x, y), and the floor defines z. B. a boundary parallel to the plane of oscillation (x, y) in a second direction, opposite to the first direction, along the third axis z.
- the bottom can be referred to as the first substrate and the cover can be referred to as the second substrate.
- 19a is referred to as a cover opening and 19b as a bottom opening, it is clear that, according to an exemplary embodiment, 19a can also represent a bottom opening and 19b can also represent a cover opening.
- a contour of the at least one opening (z. B. the bottom opening 19b) in a first substrate and / or in a second substrate of the first partial cavity 26 and / or the second partial cavity 27 at least partially a shape of a side facing the respective opening of the transducer.
- the one or more openings via which, for each bending transducer 3, the cavities 26 adjacent to the bending transducer sides of the respective bending transducer 3 facing away from one another along a first axis y , 27 are fluidically coupled to the environment, arranged on opposite sides of a space in which the bending transducers are arranged.
- the one or more openings, via which the cavities are fluidically coupled to the surroundings run transversely through the first and / or second substrate.
- the first partial cavity 26 and the second ' partial cavity 27 have z. B. in each case at least one opening 19a, 19b in the first substrate or in the second substrate.
- Neighbors Partial cavities 26, 27 which are only separated from one another by a cross connection 7 can share an opening.
- partial cavities 26, 27 which are separated from one another by a bending transducer have z. B. each have a separate opening.
- the at least one opening 19a, 19b of the first partial cavity 26 and / or the second partial cavity 27 extends along a complete extension, along the second axis, of a bending transducer adjacent to the opening, or extends at least partially along the extension the second axis, the adjacent bending transducer.
- the bending transducers 3 and / or the cross connections 7 are arranged in such a way that the bending transducers 3 do not sweep over the openings 19a, 19b.
- FIGS. 6a and 6b can be included in the exemplary embodiments of FIGS. 1 to 5.
- Fig. 7 shows an abstract representation of a section of a bending transducer system (eg. As a micromechanical transducer) comprising a plurality of flexural transducers 3i to 3 n. Shown is an opposing clamping of adjacent bending transducers, an offset of the bending transducers and a potential cross connection 7 that follows the contour of the transducers.
- a bending transducer system eg. As a micromechanical transducer
- Shown is an opposing clamping of adjacent bending transducers, an offset of the bending transducers and a potential cross connection 7 that follows the contour of the transducers.
- FIG. 8 shows, in a sectional illustration (see FIG. 7), method steps for producing a potential cross connection 7 with an indentation from a silicon piece.
- an unprocessed piece of silicon hatchched
- Below (middle) an area (indentation) that is to be worked out is shown with a dashed line.
- the lowest schematic illustration shows a potential cross connection 7 which is processed in such a way that an electrical path 210, which is located in the silicon, is not damaged and is located below the indentation.
- FIG. 8 shows an etching technique in order to reduce or adjust a height (extension along a third axis z).
- the resulting indentation serves to couple (connect) different cavities with one another.
- two partial cavities are fluidically connected to one another via the lowered cross connection 7.
- a continuous spacer layer 23 is attached below the cross connection 7, for example. ordered, the z. B. the cross connection 7 from a substrate (z. B. from a cover or a base) electrically isolated.
- the handling wafer can be referred to as first substrate 180 and the cover wafer can be referred to as second substrate 182.
- the recesses 13 and 15 are, for. B. to recesses, the first and / or second channels, such as. B. shown and described in Fig. 1 or Fig. 3 to Fig. 4b, can form.
- the bending transducer 3 is not necessarily at this point.
- the bending transducer may, however, z. B. not be deflected further than shown.
- the potential cross connection is at the location of the device wafer 14.
- a cavity is e.g. B. between the bending transducer 3 and the cross connection (the potential cross connection in the device wafer 14) completely laterally (on opposite sides along a first axis y).
- the cavity can be coupled to the surroundings and / or to adjacent cavities via openings (not shown) in the cross connection and / or in the first substrate 180 and / or in the second substrate 182.
- a side 194 facing a first direction 112 along the first axis y follows the cavity 1501 adjacent to the bending transducer 3 in the first direction of a contour of a second direction 114 facing side 172 of the bending transducer 3 at maximum deflection (see e.g. B. Line 18).
- a side facing the second direction 114 along the first axis y of the cavity 1502 adjacent to the bending transducer 3 in the second direction follows a contour of one of the first Direction 1 12 facing side 170 of the bending transducer 3 at maximum deflection.
- a higher volume can be achieved with an unchanged packing density.
- the channels of adjacent partial cavities run either along the second axis x in opposite directions or in the same direction.
- FIG. 10a shows an interconnection of alternating bending transducers 3.
- openings in the cover and handling wafers 1 and 2, as well as a third potential 32, are not shown.
- the partial cavities are not named.
- a potential cross connection 7 is routed next to the bending transducer 3 as a side wall of the first cavity 26 or the second cavity 27.
- the respective opposite substrate sides 120i and 120 2 have areas of different potentials that are electrically separated from one another by an insulation layer 12.
- the electrical connection of the two opposite substrate sides 120i and 120 2 is made by the potential cross connection.
- the bending transducers 3 are arranged in such a way that adjacent electrodes have the same potential.
- FIG. 10b shows, in a section, two adjacent bending transducers 3 and further details on the interconnection. For the sake of clarity, the inlets and outlets 1 and 2 are not shown. The partial cavities are not named.
- a third electrical potential 32 is in turn electrically separated by an insulation layer 12.
- a sound transducer described herein has the interconnection shown in FIG. 10a and / or in FIG. 10b.
- FIGS. 1 1a and 11b disclose an exemplary embodiment and show a section of a number of adjacent bending transducers 3:
- the openings 33 and 34 perpendicular to the lateral deflection of the bending transducers 3 are arranged alternately. For example, they can be coupled to first and / or second channels (see, for example, FIG. 1 or FIGS. 3 to 4b).
- every potential is e.g. B. assigned an opening.
- 120i and 120 2 are first and second substrate sides.
- 11a shows a first time interval in which two adjacent flexural transducers 3, whose facing electrodes have the same potential 3, move towards one another and thereby generate a voluric current 36 which draws a liquid or a gas from the respective subcavities through the second horizontal opening 34 convey out.
- a volume flow 36 conveys a liquid or a gas through the first opening 33 arranged perpendicular to the lateral deflection into the adjacent partial cavities
- Fig. 11b shows a second time interval immediately following the first time interval in which the bending transducer move in the opposite direction 11, and thus perpendicular to the lateral 36, a volume flow the fluid through the second,
- the opening 34 arranged for deflection is conveyed into the partial cavities and a volume flow 36 is conveyed through the first horizontal opening out of the partial cavities.
- the one or more openings via which, for each bending transducer 3, the cavities adjoining the bending transducer sides of the respective bending transducer 3 facing away from one another along the first axis are fluidic with the environment are coupled, arranged on opposite sides of the room (for example on the first substrate side 120i and / or on the second substrate side 120 2 ).
- the one or more openings of adjacent cavities are arranged on opposite sides of the space.
- the micromechanical sound transducer has at least one lateral opening (33, 34) in the side on which the bending transducer is located for each first cavity (e.g. a cavity formed from two partial cavities 26 and 27 which adjoin a common bending transducer) the respective first cavity is suspended on.
- the openings are arranged in an oscillation plane (x, y) in a device substrate (to which the bending transducers 3 are connected) in an area where the bending transducer 3 is clamped.
- the openings 33 and / or 34 can be arranged on one side of the freely oscillating end of the bending transducer 3.
- Two adjacent partial cavities 26 and 27, which are arranged separated from one another by the cross connection 7, can form a second cavity (also referred to as cavity 150 in the preceding exemplary embodiments), each of which is e.g. B. also have only one side opening.
- the one or more openings, via which the cavities are fluidically coupled to the surroundings, run laterally through a first and / or second substrate (the first and / or second substrate runs, for example, parallel to an oscillation plane (x, y) in a first direction along a third axis z).
- a first and / or second substrate runs, for example, parallel to an oscillation plane (x, y) in a first direction along a third axis z).
- FIGS. 12a to 12d show different embodiments of the bending transducers used herein in the sound transducer according to the invention.
- FIGS. 12a and 12b both show the same symmetrical contour with a different structure.
- the bending transducer 3 in FIG. B three electrodes, a first electrode 130, a second electrode 132 and a middle electrode 135 and the bending transducer 3 in FIG. B. a first electrode 130, a second electrode 132 and an electrically insulating layer 12.
- a gap 134 is formed between the electrodes.
- the middle electrode 135 is arranged between the first electrode 130 and the second electrode 132.
- a first gap 134 is arranged between the first electrode 130 and the middle electrode 135 and a second gap 134 is arranged between the second electrode 132 and the middle electrode 135.
- 12c shows an alternative in which a first electrode 130 and a second electrode 132 are connected to one another in an insulated manner in discrete regions (see 121 to 124).
- FIG. 12d A bending transducer with an asymmetrical contour is shown in FIG. 12d.
- the bending transducer has a first electrode 130, a second electrode 132 and a gap 134 lying therebetween.
- the flexural transducers 3 from FIGS. 12a to 12d have projections 162 and depressions 160, a high packing density can be achieved.
- the bending transducers 3 illustrated in FIGS. 12 a to 12d can be used in the micromechanical sound transducers 100 described above.
- FIGS. 13a to 14b various connection options for the bending transducers in the sound transducer are shown.
- 13a, 13b show a beam clamped on one side as an example of a deformable element (top view 1200 and cross section 1300).
- an electrically conductive bar 1201 for example the first electrode 130 from the preceding description
- an insulating material 303 for example the insulating layer 12 from the above description
- an electrically conductive material 301 for example the second electrode 132 from the above description.
- the isolie ⁇ Rende material 303 can, for example, by a sacrificial layer technology are laterally structured so, so that a thin hollow space 304 between the electrodes 1201 and 301 is formed.
- the cavity has the thickness of the dielectric sacrificial layer and thus defines the plate spacing of the capacitor.
- FIGS. 13a and 13b show a micromechanical component with an electrode 301 and a deformable element 1201, which in the present case is exemplarily designed as a beam or plate clamped on one side, but could also be designed differently, as is also the subject of FIG Figures described below, and an insulating spacer layer 303, wherein the electrode 301 is fixed to the deformable element 1201 via the insulating spacer layer 303, and wherein the insulating spacer layer 303 along a lateral direction 305, which in FIGS. 13a and 13b with the x -Direction coincides, is structured in several spaced apart segments, which are shown hatched in Fig.
- the segments can each have a direction of longitudinal extent that runs transversely to the lateral direction 305.
- the segments are designed in the form of strips. The same naturally also applies to the spaces 304 between them.
- the deformable element 1201 does not necessarily have to be a plate or a beam. It can also be designed as a shell, membrane or rod.
- the deformable element 1201 can be suspended and clamped in such a way that, by applying the electrical voltage U along a lateral direction perpendicular to the lateral direction 305, here the y-direction, remains uncurved.
- the following exemplary embodiments will also show that the deformable element can be suspended and clamped in such a way that, when the electrical voltage U is applied between the electrode and the deformable element, it curves in the same direction along a lateral direction perpendicular to the lateral direction 305 along the lateral direction 305.
- the result is a bowl-shaped or helmet-shaped curvature in which, for example, the direction 305 corresponds to the radial direction and the aforementioned common direction of the curvature points along the thickness of the insulating layer 303 from the electrode 301 to the deformable element 1201.
- the micromechanical component can be in a substrate, such as, for. B. a wafer or a chip, so formed that the electrode 301 in a substrate thickness direction, i. H. the z-direction, above or below the deformable element 1201, so that the curvature of the deformable element 1201 is curved out of a substrate plane that corresponds, for example, to the rest position of the deformable element 1201, namely in the direction of curvature shown in in the case of Figs. 13a and 13b faces in the opposite direction of z.
- the micromechanical component can, for example, also be formed in a substrate in such a way that the electrode 301 is fixed to the side of the deformable element, so that the deformable element is bent within the present substrate plane by the deformable element .
- the amount of deflection of the beam or the plate or the deformable element 1201 can be actively varied by changing the electrical voltage.
- FIGS. 14a and 14b The structure of a component based on a bending machine and operated as an actuator is shown again in FIGS. 14a and 14b using a beam clamped on one side.
- An insulating spacer layer 12 and an electrically conductive material 151 (e.g. the first electrode 130 from the description above) and 154 (e.g. the second electrode 132 from the description above) are attached to both sides of an electrically conductive beam 135.
- the insulating spacer layer 12 can for example be structured laterally by a sacrificial layer technology so that a thin cavity 1304 and 1404 (e.g.
- the gap 134 from the preceding description is between the electrodes 135 and 151 or between forming the electrodes 135 and 154 in each of the segments 169 into which the ausschba ⁇ re element x is segmented along the longitudinal direction, and remain at the segment boundaries ⁇ iso-regulating spacer 12th
- the cavity has the thickness of the dielectric sacrificial layer and thus defines the plate spacing of the capacitor. If an electrical voltage is now applied between electrodes 135 and 151 or between electrodes 135 and 154, the forces in the y direction of the electrostatic field result in a lateral expansion on the surface of the beam in the x direction. As a result of the surface expansion, the beam 135 is deflected. If regular lateral geometries are used, the surface expansion is approximately constant and a spherical deformation profile is established.
- the electrical interconnection takes place in such a way that an electrical direct voltage UB is applied to the outer electrodes 151 and 154 and an alternating signal voltage Us, such as e.g. B. an audio signal is applied.
- An electrical bias voltage is applied to the outer electrodes 151 and 154.
- the amplitude of the alternating signal voltage Us is equal to or preferably less than the electrical bias voltage UB.
- the highest electrical potential in the system is economically sensible to choose and can be in accordance with applicable guidelines and standards.
- Due to the electrical bias of the external electrodes the curvature of the bar follows the signal alternating voltage Us.
- a positive half-wave of the alternating signal voltage Us leads to a curvature of the bar 135 in the negative y-direction.
- a negative half-wave leads to a curvature of the bar 135 in the positive y-direction.
- Variants of the electrical contacting are shown in FIGS. 14a and 14b.
- FIG. 14a shows the respective outer electrodes applied with an electrical direct voltage, but in comparison to the representation in FIG. 14b with an opposite electrical potential.
- an electrical bias can be applied to the inner electrode (s).
- the signal voltage is then z. B. applied to the outer electrodes.
- outer (s) or inner (s) electrode (s) instead of an electrically applied bias voltage to the outer (s) or inner (s) electrode (s), permanent polarization of the outer or inner electrode (s) as an electret, such as silicon dioxide, is possible.
- an electrically applied bias voltage to the outer (s) or inner (s) electrode (s)
- permanent polarization of the outer or inner electrode (s) as an electret such as silicon dioxide
- voltage sources shown in the previous figures current sources can be used.
- the topography of the electrodes can be structured.
- ge ⁇ shaped electrodes conceivable, for example dome-shaped.
- Comb-shaped electrodes are conceivable in order to further enlarge the capacitor area and thus the electrostatic energy that can be deposited.
- the element to be warped e.g. the bending transducer 3 can be clamped on one or both sides.
- a micromechanical sound transducer can have a signal connection Us, a first reference connection UB and a second reference connection UB.
- the middle electrode 135 is coupled to the signal terminal.
- the electrode 151 which faces a first direction 112 along a first axis y, is coupled to the first reference terminal, and the electrode 154, which faces a second direction 114 along the first axis y, is connected to the second reference terminal.
- the interconnection of the two outer electrodes of adjacent bending transducers can take place in accordance with the interconnection of the electrodes described in FIG. 1.
- Applying a first voltage between the signal connection and the first reference connection and a second voltage between the signal connection and the second reference connection leads, for example, to B. to opposite deflections of adjacent bending transducers along the first axis y.
- the first electrode and the middle electrode form a first capacitor and the second electrode and the middle electrode form a second capacitor in order to form a capacitor on each of the opposite bending transducer sides along the first axis y.
- the capacitors of each bending transducer are deflected in opposite directions when voltage is applied, along the first axis, depending on the voltage applied.
- Bending transducer is a known microelectromechanical bending transducer (sound and ultrasound) and segmented along its longitudinal direction
- the topography of the electrodes of the bending transducers can be roof-like or dome-shaped, they can intermesh in a comb-like manner o in a first embodiment the bending transducer is clamped on one side o in a further embodiment the bending transducer is clamped on both sides
- Bending transducers are always clamped opposite each other and work in push-pull. They are preferably of the same length
- Each cavity encloses a micromechanical bending transducer
- a cavity consists of the 1st and 2nd partial cavity
- o 1st partial cavity is limited by 1st side wall (potential cross connection) and the side surface of the bending transducer which is opposite to 1st side wall (potential cross connection).
- the 2nd partial cavity is limited by the 2nd side wall (potential cross connection) and the side surface of the bending transducer which is opposite the 2nd side wall (potential cross connection)
- the 1st and 2nd partial cavities are connected to each other in the area of the bottom and the lid (above and below the bending transducer) o
- the 1st and 2nd partial cavities are connected to one another in the area of the free end of the bending transducer
- the cavities have openings (inlet and outlet) vertically in the base and / or in the cover
- Openings in the base and / or in the cover are in one embodiment such that two adjacent partial cavities are connected to one another by an opening each.
- the partial cavities are separated from one another in the vertical direction by the side wall (potential cross-connection), o openings extend along the entire length of the bending transducer, o openings are partially extending along the entire length of the bending transducer
- the contour of the openings follows the contour of the cavity
- the contour of the openings is independent of the contour of the cavity
- the cavities have openings laterally in the area of the clamping of the bending transducer clamped on both sides or in the area of the clamping and the free end of the bending transducer clamped on one side
- Openings are arranged perpendicular to the lateral direction of movement o Openings have a preferably rectangular or a different cross-section
- the openings extend in the third direction over the entire height of the bending transducer or are smaller
- the openings extend in the second direction over the width of the 1st or 2nd partial cavity or are smaller and are closed in the clamping area. On the side of the free end of the bending transducer clamped in on one side, the openings are separated from one another.
- the bottom and the cover can have recesses for the purpose of increasing the cross-section. O Arrangement of the recesses
- the cavity is formed in such a way that the electrical path in the handling wafer is guided under the cavity.
- the cover and handling wafer have recesses arranged along the bending transducer over the entire length of the cavity
- the height of the side wall corresponds to the height of the bending transducer or is less
- the distance between the unconnected side wall (potential cross-connection) areas varies along the first direction
- the distance is from 100 nm to 10 mm, preferably between 1 mhh and 1 mm and particularly preferably between 25 mih and 150 mhi
- the distance is from 100 nm to 10 mm, preferably between 1 mhh and 1 mm and particularly preferably between 25 mhi and 150 mm
- the side wall (potential cross-connection) is designed in such a way that it enables all bending transducers to be electrically controlled via grouping individual contacts, for example on the edge of the component
- the height of the side wall results from the height of the bending transducer.
- the selection of the height of the side wall (potential cross connection) also serves to set the attenuation. (The potential cross-connection cannot be painted over, as it always represents, for example, the edge of the cavity.)
- Cavities are offset from one another in a first direction by the value of at least a quarter segmentation of the bending transducer
- a first volume is formed in two adjacent partial cavities, so that the fluid is conveyed in the direction of these partial cavities.
- the volume of the partial cavity that lies opposite the bending transducer is compressed and the fluid located therein is thus conveyed out of this partial cavity.
- a first volume in the first partial cavity is increased in order to convey fluid into the first partial cavity.
- the second volume of the second partial cavity which is opposite the bending transducer, is reduced and the fluid located therein is thus conveyed out of this partial cavity.
- a second volume in the second partial cavity is increased and fluid is thus conveyed into this partial cavity.
- the first volume of the first partial cavity which is opposite the bending transducer, is reduced and the fluid located therein is thus conveyed out of this partial cavity.
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Abstract
Description
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019205735.7A DE102019205735B3 (de) | 2019-04-18 | 2019-04-18 | Mikromechanischer Schallwandler |
| PCT/EP2020/060791 WO2020212540A1 (de) | 2019-04-18 | 2020-04-16 | Mikromechanischer schallwandler |
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| EP3957083A1 true EP3957083A1 (de) | 2022-02-23 |
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| US (1) | US11750982B2 (de) |
| EP (1) | EP3957083A1 (de) |
| CN (1) | CN113728659B (de) |
| DE (1) | DE102019205735B3 (de) |
| TW (1) | TWI727745B (de) |
| WO (1) | WO2020212540A1 (de) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11554953B2 (en) * | 2020-12-03 | 2023-01-17 | Knowles Electronics, Llc | MEMS device with electrodes and a dielectric |
| DE102023209193A1 (de) * | 2023-09-21 | 2025-03-27 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mems-Element mit Volumenbereichen unterschiedlicher Dichte |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5598050A (en) * | 1995-02-17 | 1997-01-28 | Materials Systems Inc. | Acoustic actuator and flextensional cover plate there for |
| JPH1094093A (ja) * | 1996-09-17 | 1998-04-10 | Nec Corp | 圧電発音体 |
| JP2006237792A (ja) * | 2005-02-23 | 2006-09-07 | Matsushita Electric Ind Co Ltd | 圧電型音響変換装置 |
| EP1907133A4 (de) * | 2005-06-17 | 2012-05-09 | Kolo Technologies Inc | Mikro-elektro-mechanischer wandler mit isolierverlängerung |
| DE102008012825B4 (de) * | 2007-04-02 | 2011-08-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Mikromechanisches Bauelement mit verkippten Elektroden |
| US10170685B2 (en) * | 2008-06-30 | 2019-01-01 | The Regents Of The University Of Michigan | Piezoelectric MEMS microphone |
| JP5257277B2 (ja) * | 2009-07-03 | 2013-08-07 | 日本電気株式会社 | 音響トランスデューサ |
| WO2012095185A1 (de) * | 2011-01-14 | 2012-07-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanisches bauelement |
| DE102014217798A1 (de) * | 2014-09-05 | 2016-03-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanische piezoelektrische Aktuatoren zur Realisierung hoher Kräfte und Auslenkungen |
| DE102014225934B4 (de) | 2014-12-15 | 2017-08-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrostatisch auslenkbares mikromechanisches Bauelement und Verfahren zu seiner Herstellung |
| DE102015206774B4 (de) * | 2015-04-15 | 2018-10-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanische Vorrichtung mit einem aktiv biegbaren Element |
| US9540226B2 (en) * | 2015-05-20 | 2017-01-10 | Infineon Technologies Ag | System and method for a MEMS transducer |
| US9796580B2 (en) * | 2015-06-12 | 2017-10-24 | Invensense, Inc. | CMOS-MEMS-CMOS platform |
| DE102015210919A1 (de) * | 2015-06-15 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben |
| US9621996B2 (en) * | 2015-07-07 | 2017-04-11 | Robert Bosch Gmbh | Micromechanical sound transducer system and a corresponding manufacturing method |
| DE102015226233A1 (de) * | 2015-12-21 | 2017-01-19 | Johnson Matthey Piezo Products Gmbh | Biegewandler sowie Verfahren zu dessen Herstellung sowie zu dessen Betrieb |
| ITUA20163572A1 (it) * | 2016-05-18 | 2017-11-18 | Columbia S R L | Metodo biotecnologico per la produzione di acrilammide e relativo nuovo ceppo batterico |
| DE102017200111B3 (de) * | 2017-01-05 | 2018-03-15 | Robert Bosch Gmbh | Mikromechanische Schallwandleranordnung und entsprechendes Herstellungsverfahren |
| DE102017200108A1 (de) * | 2017-01-05 | 2018-07-05 | Robert Bosch Gmbh | Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren |
| DE102017200725A1 (de) * | 2017-01-18 | 2018-07-19 | Robert Bosch Gmbh | Mikromechanischer Sensor |
| DE102017206766A1 (de) * | 2017-04-21 | 2018-10-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-wandler zum interagieren mit einem volumenstrom eines fluids und verfahren zum herstellen desselben |
| EP3867191B1 (de) | 2018-10-16 | 2024-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Biegewandler als aktor, biegewandler als sensor, biegewandlersystem |
-
2019
- 2019-04-18 DE DE102019205735.7A patent/DE102019205735B3/de active Active
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2020
- 2020-04-16 WO PCT/EP2020/060791 patent/WO2020212540A1/de not_active Ceased
- 2020-04-16 TW TW109112859A patent/TWI727745B/zh not_active IP Right Cessation
- 2020-04-16 EP EP20720409.0A patent/EP3957083A1/de not_active Withdrawn
- 2020-04-16 CN CN202080029632.4A patent/CN113728659B/zh active Active
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2021
- 2021-10-15 US US17/502,971 patent/US11750982B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113728659B (zh) | 2023-08-18 |
| US20220046360A1 (en) | 2022-02-10 |
| TWI727745B (zh) | 2021-05-11 |
| DE102019205735B3 (de) | 2020-08-13 |
| CN113728659A (zh) | 2021-11-30 |
| US11750982B2 (en) | 2023-09-05 |
| WO2020212540A1 (de) | 2020-10-22 |
| TW202102429A (zh) | 2021-01-16 |
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