EP3950981A4 - Copper material and heat-dissipating member - Google Patents

Copper material and heat-dissipating member Download PDF

Info

Publication number
EP3950981A4
EP3950981A4 EP20783133.0A EP20783133A EP3950981A4 EP 3950981 A4 EP3950981 A4 EP 3950981A4 EP 20783133 A EP20783133 A EP 20783133A EP 3950981 A4 EP3950981 A4 EP 3950981A4
Authority
EP
European Patent Office
Prior art keywords
heat
copper material
dissipating member
dissipating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20783133.0A
Other languages
German (de)
French (fr)
Other versions
EP3950981A1 (en
Inventor
Kosei Fukuoka
Yuki Ito
Hiroyuki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of EP3950981A1 publication Critical patent/EP3950981A1/en
Publication of EP3950981A4 publication Critical patent/EP3950981A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP20783133.0A 2019-03-29 2020-03-09 Copper material and heat-dissipating member Pending EP3950981A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019068349 2019-03-29
PCT/JP2020/010018 WO2020203071A1 (en) 2019-03-29 2020-03-09 Copper material and heat-dissipating member

Publications (2)

Publication Number Publication Date
EP3950981A1 EP3950981A1 (en) 2022-02-09
EP3950981A4 true EP3950981A4 (en) 2023-04-26

Family

ID=72668260

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20783133.0A Pending EP3950981A4 (en) 2019-03-29 2020-03-09 Copper material and heat-dissipating member

Country Status (5)

Country Link
EP (1) EP3950981A4 (en)
JP (1) JP7248104B2 (en)
CN (1) CN113631742A (en)
TW (1) TWI842854B (en)
WO (1) WO2020203071A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7491960B2 (en) * 2021-04-19 2024-05-28 株式会社Kmct Corrosion-resistant copper alloys, copper alloy tubes and heat exchangers
MY207403A (en) * 2021-04-19 2025-02-26 Kmct Corp Corrosion-resistant copper alloy, copper alloy tube and heat exchanger
CN117242197A (en) * 2021-04-19 2023-12-15 株式会社Kmct Corrosion-resistant copper alloys, copper alloy tubes and heat exchangers
WO2024024909A1 (en) 2022-07-29 2024-02-01 三菱マテリアル株式会社 Pure copper material, insulating substrate, and electronic device
EP4467675A4 (en) 2022-07-29 2025-12-24 Mitsubishi Materials Corp PURE COPPER MATERIAL, INSULATING SUBSTRATE AND ELECTRONIC DEVICE

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080223728A1 (en) * 2004-01-29 2008-09-18 Nippon Mining & Metals Co., Ltd. Ultrahigh-Purity Copper and Process for Producing the Same
EP3243916A1 (en) * 2015-01-07 2017-11-15 Mitsubishi Materials Corporation Superconducting wire and superconducting coil
EP3441486A1 (en) * 2016-04-06 2019-02-13 Mitsubishi Materials Corporation Superconducting wire and superconducting coil

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062058A (en) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The Crystal grain growth suppressing oxygen free copper
JP3856581B2 (en) * 1999-01-18 2006-12-13 日鉱金属株式会社 Rolled copper foil for flexible printed circuit board and method for producing the same
JP6202718B2 (en) * 2013-03-26 2017-09-27 三菱マテリアル株式会社 Heat dissipation board
JP5866411B2 (en) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 Copper alloy sheet and method for producing copper alloy sheet
JP6668899B2 (en) * 2016-04-06 2020-03-18 三菱マテリアル株式会社 Superconducting stabilizer, superconducting wire and superconducting coil
JP6939367B2 (en) 2017-10-04 2021-09-22 株式会社リコー Information processing system, information processing device, information processing method and information processing program

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080223728A1 (en) * 2004-01-29 2008-09-18 Nippon Mining & Metals Co., Ltd. Ultrahigh-Purity Copper and Process for Producing the Same
EP3243916A1 (en) * 2015-01-07 2017-11-15 Mitsubishi Materials Corporation Superconducting wire and superconducting coil
EP3441486A1 (en) * 2016-04-06 2019-02-13 Mitsubishi Materials Corporation Superconducting wire and superconducting coil

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020203071A1 *

Also Published As

Publication number Publication date
TW202104604A (en) 2021-02-01
JP7248104B2 (en) 2023-03-29
CN113631742A (en) 2021-11-09
JPWO2020203071A1 (en) 2020-10-08
TWI842854B (en) 2024-05-21
EP3950981A1 (en) 2022-02-09
WO2020203071A1 (en) 2020-10-08

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20230324

RIC1 Information provided on ipc code assigned before grant

Ipc: C22F 1/08 20060101ALI20230320BHEP

Ipc: C22F 1/00 20060101ALI20230320BHEP

Ipc: C22C 9/00 20060101AFI20230320BHEP