Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C99/00—Subject matter not provided for in other groups of this subclass
  • B81C99/0075—Manufacture of substrate-free structures
  • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
  • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
  • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
  • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
  • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B33—ADDITIVE MANUFACTURING TECHNOLOGY
  • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
  • B33Y10/00—Processes of additive manufacturing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B33—ADDITIVE MANUFACTURING TECHNOLOGY
  • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
  • B33Y80/00—Products made by additive manufacturing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C99/00—Subject matter not provided for in other groups of this subclass
  • B81C99/0075—Manufacture of substrate-free structures
  • B81C99/009—Manufacturing the stamps or the moulds
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
  • B01L2200/12—Specific details about manufacturing devices
• • C—CHEMISTRY; METALLURGY
  • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
  • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
  • C12M23/00—Constructional details, e.g. recesses, hinges
  • C12M23/02—Form or structure of the vessel
  • C12M23/16—Microfluidic devices; Capillary tubes

Definitions

• the present invention relates to the field of microfluidic devices and in particular to a method of manufacturing such devices.
• Microfluidic devices are used to replicate systems that manipulate small volumes of fluids, using channels the size of a few micrometers.
• PDMS polydimethylsiloxane
• 3D printing could allow more complex devices to be made in three dimensions, but the resolution of 3D printing is not sufficient to produce the desired microfluidic devices, and the materials used in 3D printing are not compatible with the conditions. use of these devices for biological tests.
• the existing methods of manufacturing these devices are not very efficient in terms of time, and cannot be adapted to production in large quantities.
• the object of the invention is therefore to propose a solution to all or part of these problems.
• the present invention relates to a method of manufacturing a microfluidic device, the method comprising a step of producing a master mold, the master mold comprising a first support and a second support, the second support comprising a substrate. and microstructures, the substrate having a first face and a second face opposite to the first, the step of producing the master mold comprising the following substeps:
• the dimensions of the first support being adjusted to the dimensions of the substrate to contain the substrate;
• the invention comprises one or more of the following characteristics, alone or in combination.
• the microstructures have at least one dimension less than 30 microns.
• the substrate is made of silicon.
• a master mold is produced by combining a 3D printing process for the production of patterns whose dimensions are submillimetric or millimeter and the micro-structuring, preferably by photolithography or micro-etching on a silicon substrate, or by any other equivalent process, for the formation of micrometric or submicrometric patterns.
• the step of printing the first support in three dimensions comprises:
• the second support is partially encapsulated by the first support during the sub-step of continuing the 3-D printing of the first support.
• the second support is better fixed to the first support, the second support no longer being able to move relative to the first support.
• the dimensions of the additional layer of the first support are not constrained by the dimensions of the second support which is encapsulated.
• the silicon substrate is included.
• the silicon substrate is protected and less likely to be broken when inserted into the first support.
• the different parts are aligned with each other by construction, and there is no interconnection problem between the different parts.
• the first support comprises a first part and a second part, the respective dimensions of the first part and of the second part being adjusted to the dimensions of the substrate of the second support so that the substrate of the second support s 'inserted into a recess of the first support, the recess being formed between the first part and the second part of the first support, the step of printing the first support in three dimensions comprises:
• This alternative mode of implementation has the advantage of overcoming certain restrictions in the exposure area of 3D printers.
• the printing of the first support is stopped as soon as a total height, equal to a sum of a thickness of a bottom of the first printed support, added to the thickness of the substrate of the second support, is greater than the height of the first printed medium, of a value equal to or less than a predetermined threshold;
• the insertion of the substrate of the second support in the first support causes the second face of the substrate to rest on the bottom of the first support;
• the step of producing the master mold further comprises the following sub-steps:
• the step of inserting the second support into the first support is made easier, given the adjusted nature of the dimensions of the second support relative to those of the first support.
• the step of adding resin to the surface of the silicon substrate prevents the appearance of bubbles during printing.
• the formation of the microstructures comprises the implementation of one of the techniques from photolithography, wet or dry wafer etching, 2-photon technology, 3D printing with a resolution comparable to that of photolithography.
• the dimensions of the first support are adjusted to the dimensions of the cut substrate, a width and a length of the first support being respectively greater than a width and a length of the substrate cut from the second support, by an equal value. within a specified tolerance.
• the tolerance margin for the width and the length of the first support is less than 0.25% of the width of the first support and less than 0.25% of the length of the first support, respectively.
• the tolerance margin is determined as a function of the precision of the dimensioning of the microstructures formed on the second support, ie for example a determined tolerance margin of 100 ⁇ m.
• the method further comprises a step of replicating the master mold to produce a first secondary mold from the master mold and to produce a second secondary mold from the first secondary mold.
• the replication step comprises a sub-step of producing a first secondary mold and a sub-step of producing a second secondary mold, the sub-step of producing a first secondary mold comprising a sub-sub-step for positioning the master mold inside a container, and a sub-sub-step for depositing on the master mold, in the container, a first secondary material in the viscous phase .
• the first secondary material is crosslinkable, the first secondary material preferably being a silicone rubber.
• the sub-step of producing a first secondary mold further comprises a sub-sub-step for putting under vacuum an internal volume of the container in which the master mold is positioned, and a sub-sub-step of annealing the first secondary material at ambient temperature for example, for example for 24 hours, before a sub-sub-step for removing the first secondary mold formed by the first secondary material deposited and crosslinked.
• the first secondary material remains flexible in the crosslinked phase, in order to make it easier to remove, without destroying the master mold, the first secondary mold formed by crosslinking the first secondary material.
• the first secondary material is a material compatible with the materials used to produce the master mold.
• the sub-step of producing a second secondary mold comprises a sub-sub-step of depositing a second secondary material, for example in the liquid phase, on the first secondary mold, the second secondary material being crosslinkable and rigid in the solid crosslinked phase.
• the sub-step of producing a second secondary mold comprises a sub-sub-step of removing the second secondary mold formed by the second crosslinked secondary material.
• the second secondary material is a polyurethane resin.
• the sub-step of producing a second secondary mold further comprises a sub-sub-step for removing bubbles in the second secondary material with a syringe cone, and a sub-sub annealing step, for example at room temperature, for example for 2 hours, before the sub-sub-step of removing the second secondary mold.
• the microfluidic device comprises at least one layer, and the method comprises:
• the new replication sub-step uses the characteristics indicated above for the replication step, starting from the master encapsulation mold to arrive at the encapsulation mold.
• the replication step comprises the production of a secondary encapsulation mold and of an encapsulation mold, the production of a secondary encapsulation mold comprising a positioning of the master mold. encapsulation inside a container, and deposition on the mold master encapsulation, in the container, of a first secondary material in viscous phase.
• the first secondary material is crosslinkable, the first secondary material preferably being a silicone rubber.
• the production of the secondary encapsulation mold further comprises evacuating an interior volume of the container in which the master encapsulation mold is positioned, and annealing the first secondary material, to ambient temperature for example, for example for 24 hours, before the removal of the secondary encapsulation mold formed by the first secondary material deposited and crosslinked.
• the first secondary material remains flexible in the crosslinked phase, in order to make it easier to remove, without destroying the master encapsulation mold, from the secondary encapsulation mold formed by crosslinking the first secondary material.
• the first secondary material is a material compatible with the materials used to produce the master encapsulation mold.
• the production of an encapsulation mold comprises the deposition of a second secondary material, for example in liquid phase, on the secondary encapsulation mold, the second secondary material being crosslinkable and rigid in solid crosslinked phase.
• the production of the encapsulation mold comprises removing the encapsulation mold formed by the second crosslinked secondary material.
• the second secondary material is a polyurethane resin.
• the production of the encapsulation mold further comprises the removal of bubbles in the second secondary material with a syringe cone, and annealing, for example at room temperature, for example for 2 hours, before removal from the encapsulation mold.
• the step of producing at least one layer comprises:
• a sub-step of molding the at least one layer by depositing a molding material, between the second secondary mold and the encapsulation mold, the encapsulation mold and the second secondary mold being pressed against each other. 'another so as to ensure surface contact between the top elements of the second secondary mold and a surface of the encapsulation mold,
• the layer is thermoformed, on a first surface of the layer, in contact with the structures and / or microstructures present on the second secondary mold, and on a second surface of the layer, in contact with the structures and / or microstructures present on the encapsulation mold, the encapsulation mold itself having been previously obtained by the replication of a structured and / or microstructured encapsulation master mold.
• the molding material is a PDMS.
• the annealing temperature is about 80 ° C. and the annealing time is about 1 hour.
• the at least one layer comprises at least two layers, the layers of the at least two layers being superimposed and fixed one on the other after having been aligned with respect to one another. the other so as to form a three-dimensional microfluidic device.
• patterns of one of the at least two layers being aligned with patterns of another of the at least two layers to form nodes distributed in 3 dimensions and microchannels, the microchannels the microchannels putting the nodes in fluid communication.
• the layers are fixed to one another by being brought into contact with an oxygen plasma, for example for one minute.
• the method comprises a first step of computer-aided design of the at least one layer according to a three-dimensional architecture of the microfluidic device, and a second step of computer-aided design of the master mold and of the master encapsulation mold according to the definition of the at least one layer.
• the invention also relates to a master mold for the manufacture of a microfluidic device, the master mold comprising:
• the master mold comprises one or more of the following characteristics, alone or in combination.
• the microstructures have at least one dimension less than 30 microns.
• the substrate is made of silicon.
• the microstructures are formed by photolithography, or by a process having an equivalent resolution.
• the second support is partially encapsulated by the first support.
• the second support is better fixed to the first support, the second support no longer being able to move relative to the first support.
• the dimensions of the additional layer of the first support are not constrained by the dimensions of the second support which is encapsulated.
• the master mold is obtained by implementing the method according to the invention.
• the invention also relates to a flexible secondary mold for the manufacture of a microfluidic device, the flexible secondary mold being a replication of the master mold according to one aspect of the invention in a first crosslinkable material which is flexible after curing.
• the first material is compatible with the material of the master mold, and is deposited in the liquid or gel phase on the master mold, and is flexible after having crosslinked in the solid phase.
• the first material is one of a silicone rubber, a polyurethane, a polydimethylsolixane (PDMS), an adhesive, an elastomer, a flexible foam, a plastiline.
• PDMS polydimethylsolixane
• the invention also relates to a rigid secondary mold for manufacturing a microfluidic device, the rigid secondary mold being a replication of the flexible secondary mold according to one aspect of the invention, in a second crosslinkable material. , which is rigid after cross-linking.
• the second material is compatible with the material of the flexible secondary mold and is deposited in liquid or gel phase on the flexible secondary mold, and is rigid after having crosslinked in solid phase.
• the second material is one of a polyurethane resin, a crosslinkable resin, a hardening gel, a hardening foam, a plastic, a glue.
• the invention also relates to a layer for the manufacture of a microfluidic device, layer being a replication of the rigid secondary mold according to one aspect of the invention, in a third crosslinkable material.
• the third material is compatible with the material of the rigid secondary mold, and is deposited in liquid or gel phase on the rigid secondary mold.
• the third material is one of a polyurethane, a polydimethylsolixane (PDMS), a silicone rubber, an adhesive, an elastomer, a flexible foam, a plastiline.
• the invention also relates to a microfluidic device comprising at least two layers according to one aspect of the invention, the at least two layers being placed and fixed one on the other, patterns of the 'one of the at least two layers being aligned with patterns of another of the at least two layers to form nodes distributed in 3 dimensions and microchannels, the microchannels putting the nodes in fluid communication.
• the master molds which do not require the formation of microstructures that is to say structures whose smallest dimension is less than the resolution of the 3D printer, for example less than 30 ⁇ m, are produced by 3D printing, while those which require the formation of microstructures are produced by the process according to the invention, which combines 3D printing with photolithography or a process of equivalent precision and resolution.
• the second secondary mold and the corresponding encapsulation mold preferably rigid
• the invention allows rapid prototyping because it uses the design and manufacturing advantages of 3D printing.
• the longest time is the manufacture of the master mold and of the second support with its microstructures, ie about 24 hours, and of the impression in the form of the first flexible secondary mold, also about 24 hours.
• the reproduction of the molds, in the form of the second, secondary, rigid molds takes only about 1 hour, and the molding of the layers of the microfluidic device takes only about 2 hours.
• the initial equipment for manufacturing the devices is standard and therefore inexpensive, around € 50k, compared to very high resolution 3D printing equipment, around € 200k.
• the reproduction of molds and the manufacture of the devices are carried out with controlled quantities which make it possible not to have any loss of material, unlike the conventional methods of manufacturing such devices.
• the method according to the invention is therefore more economical.
• the very structure of the different parts of the master molds, as well as the manufacturing method, can be standardized so that the modifications between each type of device have a minor impact in design and manufacturing time.
• FIG. 1 is an illustration of the substeps of the production step of a master mold by 3D printing (Fia, Flb, Fie, Fld, Fie, Flf, Fig),
• FIG. 2 is a representation of the respective dimensions of the first support and of the substrate of the second support (F2a, F2b),
• FIG. 3 is a representation of a first part and a second part of the first support, according to a variant of the step of producing a master mold by 3D printing,
• FIG. 4 is an illustration of the substeps of a variant of the production step of a master mold by 3D printing (F4a, F4b, F4c, F4d, F4e, F4f),
• FIG. 5 is a representation of the respective dimensions of the first support and of the substrate of the second support according to the variant of the production step of a master mold by 3D printing,
• FIG. 6 is an illustration of the substeps of the replication step of a master mold (F6a, F6b, F6c, F6d, F6e).
• FIG. 7 is an illustration of the step of producing a layer of a microfluidic device (F7a, F7b), and of the step of superposing two layers to form the 3D microfluidic device (F7c, F7d).
• FIG. 8 is a schematic representation of the method according to the invention.
• the method according to the invention consists in coupling microstructured substrates with submillimeter or millimeter patterns directly printed and aligned by 3D printing in order to make a master mold, which can then be replicated to create “secondary” molds which will be used to mold the different layers of a final microfluidic device.
• the use of two successive molds allows molding compatibility for the polydimethylsiloxane (PDMS) elastomer, which does not crosslink on the master mold, but only on a secondary mold.
• PDMS polydimethylsiloxane
• a material is said to be crosslinkable if it is capable of crosslinking, i.e. if it is capable of passing from a pasty and viscous state of the material, to a solid state of the material, by polymerization of the material.
• crosslinked phase we will denote the solid state of the material obtained after polymerization.
• molding compatibility is defined here as the property of a material, for example PDMS, which allows the material to crosslink to the contact of another material, that of a mold for example, without the contact between the material and the other material causing a chemical reaction or interference between the two materials. In this sense, it is important that the material of the secondary mold is compatible with PDMS.
• microfluidic device is split into several layers, each of which will be molded by said process. These PDMS layers will then be assembled by self-alignment to form a 3D microfluidic device.
• FIG. 1 comprises various sub-figures Fia , Flb, Fie, Fld, Fle, Flf, and Fig and in Figure 2, which also includes various sub-figures F2a and F2b, as well as in Figure 8.
• the master mold 1, shown in Fig, comprises a first support 2 and a second support 8, the second support 8 comprising a substrate 3 and microstructures 4 formed on one face of the substrate 3.
• the substrate 3 of the second support 8 is, for example, made of silicon.
• the microstructures 4 are formed on the surface of one face of the substrate 3 using for example conventional techniques, for example photolithography on silicon.
• the term “microstructures” is understood to mean structured shapes which have at least one dimension less than 30 ⁇ m.
• the production of the master mold then comprises the following steps:
• 3D printing is done for example with a printing resin, the dimensions of the first support 2 being adjusted to the dimensions of the substrate 3 of the second support 8, to allow the substrate 3 to be contained;
• the printing step 1012 in three dimensions (3D) of the first support 2 comprises:
• the 3D printing of the first support is stopped 1013, as illustrated in FIG. 1-Flc, to allow the insertion 1014 of the second support 8 in the first support 2.
• the stopping of the 3D printing is determined as a function of a height H tot of the edges of the first support. For example, when this height H tot is greater than the sum of a thickness E f of the bottom of the first support 2 and a thickness of the substrate of the second support 8, then the 3D printing of the first support is interrupted, and the second support 8 is inserted inside the first support 2 before continuing 3D printing of the first support 2.
• the height H tot of the edges at the stop of the 3D printing will be sufficient to allow the substrate 3 to be encapsulated.
• the second support 8 is cut lOllbis around the microstructures 4, the dimensions of the first support 2 being adjusted to the dimensions of the cut substrate 3. , to contain the substrate 3 cut.
• a tool holder 5 of the 3D printer 7 is positioned lOllter at a determined position, reproducible after extraction of the tool holder 5 of the 3D printer. 7;
• the tool holder 5 is extracted 1013bis from the 3D printer, as illustrated in FIG. 1-Fld, so as to facilitate the insertion 1014 of the second support 8 in the first support 2;
• Resin can then be added 1014bis on the first face of the substrate of the second support 8, after the insertion step 1014;
• the tool holder 5 can then be repositioned to the position determined on the 3D printer 7, as illustrated in FIG. 1-Flc, before continuing 3D printing 1015, as illustrated in FIG. 1-Flf;
• the dimensions of the first support 2 are adjusted to the dimensions of the cut substrate 3; a width and a length L2 of the first support are respectively greater than a width and a length of the substrate cut from the second support 8, by a value equal to a determined tolerance margin.
• the tolerance margin for the width and the length L2 of the first support is typically less than 0.25% of the width of the first support and 0.25% of the length L2 of the first support, respectively.
• the tolerance margin is determined as a function of an accuracy of the dimensioning of the microstructures formed on the second support 8.
• the tolerance margin may be for example 100 ⁇ m.
• the first support comprises a first part A and a second part B, the respective dimensions of the first part A and of the second part B being adjusted to the dimensions of the substrate of the second support so that the substrate of the second support fits into a recess E of the first support, the recess being formed between the first part and the second part of the first support.
• the three-dimensional printing step of the first support comprises: a 3D printing sub-step of the first part A of the first support, and
• This variant has the advantage of overcoming the restriction of the exposure area of 3D printers.
• the dimensioning of the first part A of the first support 2 is conditioned by the dimensions of the second support to be inserted. So, :
• the edges of the first part A are of variable edge dimensions, advantageously identical, sufficiently wide for the second support to be strictly positioned in the center of the square including tolerance margins; these tolerance margins allow the adjusted insertion of the substrate of the second support to align the patterns to be printed in three dimensions, with the lithographed patterns; these tolerance margins also make it possible to take into account the constraints linked to the precision of the dimensions of the substrate.
• the insertion tolerance margin is therefore, in this case, constrained by the precision of the cutting of the silicon support, the precision of which is 50 ⁇ m. This tolerance must be taken into account when designing the dimensioning of the photolithographed patterns, as illustrated in figure 5:
• the embedding E of the substrate of the second support in the second part B of the first support takes place at a depth equivalent to the thickness of the substrate with a tolerance h SUbst r at and a covering I edge of the substrate of the second support.
• the substrate of the second support is cut to the desired dimensions, for example with a disc saw.
• the dimensions of the recess make it possible, for example, to receive the substrate from the second support with an accuracy of at least 50 ⁇ m in the plane of the tool holder, and with a precision of at least 5 ⁇ m in a plane perpendicular to the plane of the holder. tool. If the printer has a surface detection mode, there is no need to have a suitable tool holder as the surface of the silicon holder will be used as a reference.
• the tool holder is positioned in a configuration which allows the tool holder to be aligned with the pattern to be printed. It can for example be pushed to the stop, as shown in Figure 4-F4b.
• the 3D printing of the patterns 9 of the first support are printed with the 3D printer, as illustrated in Figure 4-F4c.
• the second support After having detached the tool holder from the 3D printer, and after having detached the second support from the tool holder, with the 9 3D printed patterns, the second support, with the 9 3D printed patterns, is positioned in the anchor of the first part A of the first support, between the first part A and the second part B of the first support, as illustrated in FIGS. 4-F4d, 4-F4e and 4-F4f.
• the FM male plugs of the second part B of the first support are configured to enter the FF female plugs of the first part A of the first support, to encapsulate the substrate of the second support, as illustrated in Figures 4-F4d, 4-F4e and 4-F4f.
• the substrate of the second support is anchored in the first part A of the first support, while the second part B of the first support serves as a wrapper.
• the second part B instead of the first part A, of the first support, can serve as an encapsulator, while the first part A of the first support is configured to embed the substrate of the second support therein.
• the method according to the invention comprises furthermore, according to a complementary mode of implementation, a step 102 of replicating the master mold 1 to produce a first secondary mold 11 from the master mold 1 and to produce a second secondary mold 12 from the first secondary mold 11.
• This step 102 of replicating the master mold will now be described in detail, with reference to FIGS. F6a, F6b, F6c, F6d, F6e in FIG. 6.
• the sub-step of producing a first secondary mold comprises a sub-sub-step, illustrated in FIG. 6-F6a, for positioning the master mold inside a container 13 , and a sub-sub-step, illustrated in FIG. 6-F6b, of depositing on the master mold, in the container 13, a first secondary material 14 in the viscous phase.
• the first secondary material 14 is a crosslinkable material, preferably a silicone rubber.
• the sub-step of producing a first secondary mold 11 further comprises a sub-sub-step of evacuating an interior volume of the container 13 in which the master mold is positioned, and a sub-sub-step of annealing of the first secondary material 14, at ambient temperature for example, for example for 24 hours, before a sub-sub-step, illustrated in FIG. 6-F6c, of removing the first secondary mold 11 formed by the first secondary material 14 deposited and crosslinked.
• the first secondary material 14 remains flexible in the crosslinked phase; this makes it easier to remove, without destroying the master mold, the first secondary mold 11 formed by crosslinking the first secondary material 14.
• the first secondary material 14 is a material compatible with the material used to produce the master mold.
• the sub-step of producing a second secondary mold 12 comprises a sub-sub-step, illustrated in FIG. 6-F6d, of depositing a second secondary material 15, for example by liquid phase, on the first secondary mold 11, the second secondary material 15 being crosslinkable, and rigid in the solid crosslinked phase.
• the sub-step of producing a second secondary mold 12 comprises a sub-sub-step, illustrated in FIG. 6- F6e, of removing the second secondary mold 12 formed by the second material secondary crosslinked.
• the second secondary material 15 is a polyurethane resin.
• the sub-step of producing a second secondary mold 12 further comprises a sub-sub-step for removing bubbles in the second secondary material 15 with a syringe cone, and a sub-sub-step annealing sub-step, for example at room temperature, for example for 2 hours, before the sub-sub-step for removing the second secondary mold 12.
• the method according to the invention further comprises, according to a complementary embodiment illustrated by FIG. 7, a step 104 of producing one or more layers 17,18; the layers 17,18 are intended to be superimposed to form a microfluidic circuit 20.
• step 104 of producing one or more layers 17,18 is preceded by a step 103 of producing an encapsulation mold 16, illustrated in FIG. 7-F7a.
• the production step 103 of an encapsulation mold 16 comprises:
• the new replication sub-step 1032 incorporates the characteristics indicated above for the replication step, starting from the master encapsulation mold to arrive at the encapsulation mold 12, 16
• the new replication step comprises the production of a secondary encapsulation mold 11 and of an encapsulation mold 12, 16, the production of a secondary encapsulation mold 11 comprising a positioning of the master encapsulation mold 1 inside a container 13, and the deposition on the master encapsulation mold 1, in the container 13, of a first secondary material 14 in viscous phase.
• the first secondary material 14 is crosslinkable, the first secondary material 14 preferably being a silicone rubber.
• the production of the secondary encapsulation mold 11 further comprises evacuating an interior volume of the container 13 in which the master encapsulation mold 1 is positioned, and annealing the first material secondary 14, at room temperature for example, for example for 24 hours, before removal of the secondary encapsulation mold 11 formed by the first secondary material 14 deposited and crosslinked.
• the first secondary material 14 remains flexible in the crosslinked phase, in order to make it easier to remove, without destroying the master encapsulation mold 1, from the secondary encapsulation mold 11 formed by crosslinking the first. secondary material 14.
• the first secondary material 14 is a material compatible with the materials used to produce the master encapsulation mold 1.
• the production of an encapsulation mold 12, 16 comprises the deposition of a second secondary material 15, for example in liquid phase, on the secondary encapsulation mold 11, the second secondary material 15 being crosslinkable and rigid in the solid crosslinked phase.
• the production of the encapsulation mold 12, 16 comprises removing the encapsulation mold 12, 16 formed by the second crosslinked secondary material 15.
• the second secondary material 15 is a polyurethane resin.
• producing the encapsulation mold 12, 16 further comprises removing bubbles in the second material. secondary 15 with a syringe cone, and annealing, for example at room temperature, for example for 2 hours, before the removal of the encapsulation mold 12, 16.
• the production step 103 of the encapsulation mold 12, 16 is followed by a production step 104 of a first layer 17 of the microfluidic device 20.
• the production step 104 comprises:
• the molding material is a PDMS.
• the annealing temperature is about 80 ° C. and the annealing time is about 1 hour.
• the layers 17,18 are superimposed and fixed one on the other after having been aligned with respect to one another so as to form the microfluidic device in three dimensions.
• patterns of one of the at least two layers being aligned with patterns of another of the at least two layers to form nodes distributed in 3 dimensions and microchannels, the microchannels the microchannels putting the nodes in fluid communication.
• the layers are fixed to one another by being brought into contact with an oxygen plasma, for example for one minute.
• the layers 17, 18 of the microfluidic device 20 are defined during a first computer-aided design step 110, as a function of a three-dimensional architecture of the microfluidic device 20; master mold 1 and master encapsulation mold are defined for each layer 17, 18 during a second step lOlter of computer aided design.
• the invention relates to a master mold 1, obtained by the method according to the invention and comprising:
• the second support comprising a substrate 3 and microstructures 4, the substrate 3 having a first face and a second face opposite to the first, the microstructures being formed on the first face of the substrate 3, the dimensions of the first support2 being adjusted to the dimensions of the substrate 3 to contain the substrate 3, the microstructures 4 being aligned with printed patterns of the first support 2.
• the microstructures have at least one dimension less than 30 microns.
• the substrate is made of silicon.
• the microstructures are formed by photolithography, or by a process having an equivalent resolution.
• the master mold is obtained by implementing the method according to the invention.
• the invention also relates to a flexible secondary mold 11 for manufacturing a microfluidic device 20, the flexible secondary mold 11 being a replication of the master mold 1 in a first crosslinkable material which is flexible after having crosslinked.
• the first crosslinkable material which is flexible after having crosslinked is one of a silicone rubber, a polyurethane, an elastomer, a flexible foam, a plastiline.
• the invention also relates to a rigid secondary mold 12 for manufacturing a microfluidic device 20, the rigid secondary mold 12 being a replication of the flexible secondary mold 11 according to one aspect of the invention, in a second crosslinkable material, which is rigid after having crosslinked.
• the second crosslinkable material which is rigid after having crosslinked is one of a polyurethane resin, a crosslinkable resin, a hardening gel, a hardening foam, a plastic, a glue.
• the invention also relates to a layer 17, 18 for the manufacture of a microfluidic device 20, said layer 17, 18 being a replication of the rigid secondary mold 11, in a third crosslinkable material.
• the third crosslinkable material is one from among a polydimethylsolixane (PDMS), a silicone, an adhesive, an elastomer, a flexible foam, a plastiline.
• PDMS polydimethylsolixane
• the invention also relates to a microfluidic device 20 comprising at least two layers 17, 18 according to one aspect of the invention, the at least two layers 17,18 being placed and fixed one on the other, patterns of one of the at least two layers being aligned with patterns of another of the at least two layers to form nodes distributed in 3 dimensions and microchannels, the microchannels putting the nodes in fluid communication.
• the master molds which do not require the formation of microstructures, that is to say of structures whose smallest dimension is less than the resolution of the 3D printer, for example less than 30 ⁇ m, are produced by 3D printing, while those which require the formation of microstructures are produced by the method according to the invention, which combines 3D printing with photolithography or a method of precision and equivalent resolution.
• the second secondary mold and the corresponding encapsulation mold preferably rigid, can be rapidly reproduced, in large quantities and with the same level of detail as the master mold and the master encapsulation mold, from respectively the first secondary mold and secondary encapsulation mold, flexible of preferences.
• the invention allows rapid prototyping, since it uses the design and manufacturing advantages of 3D printing.
• the longest time is the manufacture of the master mold and of the second support with its microstructures, ie around 24 hours, and of the impression in the form of the first flexible secondary mold, also around 24 hours.
• the reproduction of the molds, in the form of the second, secondary, rigid molds takes only about 1 hour, and the molding of the layers of the microfluidic device takes only about 2 hours.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Chemical & Material Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Health & Medical Sciences (AREA)
• Materials Engineering (AREA)
• Analytical Chemistry (AREA)
• General Health & Medical Sciences (AREA)
• Hematology (AREA)
• Clinical Laboratory Science (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Dispersion Chemistry (AREA)
• Micromachines (AREA)
• Shaping Of Tube Ends By Bending Or Straightening (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=67107691

Family Applications (1)

Country Status (7)

Families Citing this family (1)

Family Cites Families (8)

• 2019
  • 2019-01-29 FR FR1900801A patent/FR3092103B1/fr active Active
• 2020
  • 2020-01-23 WO PCT/FR2020/050097 patent/WO2020157412A1/fr unknown
  • 2020-01-23 JP JP2021542574A patent/JP2022518774A/ja active Pending
  • 2020-01-23 CN CN202080026012.5A patent/CN113646252A/zh active Pending
  • 2020-01-23 EP EP20705241.6A patent/EP3917872A1/de not_active Withdrawn
  • 2020-01-23 KR KR1020217027529A patent/KR20210124301A/ko unknown
  • 2020-01-23 US US17/426,991 patent/US20220111381A1/en active Pending

Also Published As

Similar Documents

Legal Events