EP3904785A1 - Procédé et chambre d'essai destinés au conditionnement de l'air - Google Patents

Procédé et chambre d'essai destinés au conditionnement de l'air Download PDF

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Publication number
EP3904785A1
EP3904785A1 EP21170171.9A EP21170171A EP3904785A1 EP 3904785 A1 EP3904785 A1 EP 3904785A1 EP 21170171 A EP21170171 A EP 21170171A EP 3904785 A1 EP3904785 A1 EP 3904785A1
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EP
European Patent Office
Prior art keywords
temperature
heat exchanger
refrigerant
pressure side
expansion element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP21170171.9A
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German (de)
English (en)
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EP3904785B1 (fr
Inventor
Johannes Teichmann
Tobias HECKELE
Jürgen Bitzer
Marc Löffler
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Weiss Technik GmbH
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Voetsch Industrietechnik GmbH
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Publication of EP3904785A1 publication Critical patent/EP3904785A1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B7/00—Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B40/00—Subcoolers, desuperheaters or superheaters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04—Refrigeration circuit bypassing means
    • F25B2400/0409—Refrigeration circuit bypassing means for the evaporator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04—Refrigeration circuit bypassing means
    • F25B2400/0411—Refrigeration circuit bypassing means for the expansion valve or capillary tube
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/02—Compressor control
    • F25B2600/026—Compressor control by controlling unloaders
    • F25B2600/0261—Compressor control by controlling unloaders external to the compressor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2501—Bypass valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/193—Pressures of the compressor
    • F25B2700/1931—Discharge pressures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/193—Pressures of the compressor
    • F25B2700/1933—Suction pressures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2116—Temperatures of a condenser
    • F25B2700/21163—Temperatures of a condenser of the refrigerant at the outlet of the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
    • F25B9/008—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant the refrigerant being carbon dioxide

Definitions

  • the invention relates to a method and a test chamber for conditioning air with a temperature-insulated test room for receiving test material, which can be closed and is temperature-insulated from the environment, and a temperature control device for controlling the temperature of the test room, with a cooling device, a cooling circuit, and a zeotropic refrigerant by means of the temperature control device , a heat exchanger arranged in the test room, a compressor, a condenser, a first expansion element and an internal heat exchanger, a temperature in a temperature range of -40 ° C to +180 ° C is formed within the test room, the internal heat exchanger on a high-pressure side of the Cooling circuit is connected in a flow direction upstream of the first expansion element and then the condenser, and on a low-pressure side of the cooling circuit in the flow direction downstream of the heat exchanger and upstream of the compressor, the cooling circuit having a bypass m it has at least one second expansion element, wherein the bypass follows the condenser on the high pressure side in the flow
  • Such methods and test chambers are regularly used to check physical and / or chemical properties of objects, in particular devices. Temperature test cabinets or climatic test cabinets are known, within which temperatures can be set in a range from -70 ° C to + 180 ° C. In the case of climatic test chambers, desired climatic conditions can also be set, to which the device or the test material is then exposed over a defined period of time.
  • Such test chambers are regularly or partially designed as a mobile device which is only connected to a building with the necessary supply lines and includes all the assemblies required for temperature control and air conditioning. A temperature control of a test room accommodating the test material to be tested takes place regularly in a circulating air duct within the test room.
  • the circulating air duct forms an air treatment room in the test room, in which heat exchangers are arranged for heating or cooling the air flowing through the circulating air duct or the test room.
  • a fan sucks in the air in the test room and directs it in the circulating air duct to the respective heat exchangers.
  • the test material can be tempered in this way or also exposed to a defined temperature change. During a test interval, for example, a temperature can repeatedly change between a temperature maximum and a temperature minimum of the test chamber.
  • the refrigerant circulating in the cooling circuit must be such that it can be used in the cooling circuit within the aforementioned temperature difference. Furthermore, due to legal regulations, the refrigerant must not contribute significantly to ozone depletion in the atmosphere or global warming, and it must also be non-flammable. These provisions can be affected in particular by refrigerants or Refrigerant mixtures are met, which have a comparatively high mass fraction of carbon dioxide, these refrigerant mixtures have zeotropic properties due to the different substances mixed with one another, which in turn is undesirable. In the case of a zeotropic refrigerant mixture, a phase transition takes place over a temperature range, the so-called temperature glide.
  • the temperature glide is considered to be a difference between the boiling temperature and the dew point temperature at constant pressure. Since carbon dioxide has a freezing temperature or a freezing point of -56.6 ° C, there is a comparatively large temperature glide in refrigerant mixtures with carbon dioxide as the essential mixing partner to achieve temperatures down to -70 ° C. Since a comparatively rapid temperature change must be formed on the heat exchanger with a test chamber or a corresponding cooling device, it is necessary to adapt an expansion element and a heat exchanger or evaporator of the relevant cooling circuit to the evaporation temperature of the refrigerant. Such cooling devices cannot be operated as a mixed cascade system in which a zeotropic refrigerant is successively evaporated via an expansion element. Mixture cascade systems are only suitable for creating a substantial static low temperature.
  • the known test chambers therefore regularly have an internal heat exchanger, which can be connected to a high pressure side of the cooling circuit in a flow direction upstream of the expansion element and subsequently to the condenser, and to a low pressure side of the cooling circuit in a flow direction upstream of the compressor and then to the heat exchanger.
  • the internal heat exchanger is used to cool or so-called subcooling of the liquefied refrigerant on the high-pressure side.
  • a bypass can be provided which has a second expansion element and forms a re-injection device for refrigerant.
  • refrigerant can then be conducted from the high-pressure side via the second expansion element into the low-pressure side in the flow direction upstream of the internal heat exchanger, so that cooling of the refrigerant on the high-pressure side of the internal heat exchanger is intensified.
  • the second expansion element is set in such a way that refrigerant is continuously metered in via the second expansion element and thus undercooling is ensured during operation of the cooling circuit.
  • Such a test chamber is, for example, from DE 10 2017 216 363 A1 known.
  • the disadvantage here is that due to the comparatively wide temperature range, with multi-stage cooling systems from -70 ° C to +180 ° C and with single-stage cooling systems from -40 ° C to +180 ° C, the cooling capacity required for subcooling varies greatly. Depending on the operating point of the cooling device, fluctuations can occur, so that the undercooling may then not be sufficient. If a larger amount of refrigerant is dosed to the internal heat exchanger via the second expansion element to subcool the refrigerant on the high pressure side, the suction gas temperature in front of the compressor may drop to an unacceptable level.
  • the present invention is therefore based on the object of proposing a method and a test chamber for conditioning air that ensures stable operating behavior.
  • the method according to the invention for conditioning air is carried out with a test chamber with a test room that can be closed and is temperature-insulated from the environment for receiving test material and a temperature control device for controlling the temperature of the test room
  • Test room arranged heat exchanger, a compressor, a condenser, a first expansion element and an internal heat exchanger a temperature in a temperature range of -40 ° C to +180 ° C is formed within the test room, the internal heat exchanger on a high pressure side of the cooling circuit in one flow direction upstream of the first expansion element and downstream of the condenser, and on a low-pressure side of the cooling circuit in the flow direction downstream of the heat exchanger and upstream of the compressor, the cooling circuit having a bypass has at least one second expansion element, the bypass being connected on the high pressure side in the flow direction downstream of the condenser and upstream of the internal heat exchanger, and on the low pressure side downstream of the heat exchanger and upstream of the internal heat exchanger, a control device of the temperature control device with a
  • the cooling device further has the Compressor, which can be a compressor, for example, as well as the condenser for the compressed refrigerant arranged downstream of the compressor in the flow direction of the refrigerant.
  • the compressed refrigerant which after compression is under high pressure and is essentially in gaseous form, condenses in the condenser and is then essentially in a liquid state of aggregation.
  • the liquid refrigerant flows on through the internal heat exchanger and the expansion element, whereby it again becomes gaseous due to expansion as a result of a pressure drop. If it is a zeotropic refrigerant, only part of the refrigerant can possibly evaporate in the heat exchanger and a non-usable part of a wet steam portion of the refrigerant can be shifted into the internal heat exchanger.
  • the gaseous refrigerant is then drawn in again by the compressor and compressed. In principle, the process can also be carried out with an azeotropic refrigerant.
  • the temperature control device comprises the control device with the pressure sensor and the temperature sensor, which are connected to the high pressure side.
  • the pressure of the refrigerant on the high pressure side is measured via the pressure sensor.
  • the pressure sensor can therefore be connected at any point in the cooling circuit on the high-pressure side. Since a temperature of the refrigerant in the course of the cooling circuit is regularly different, depending on the section of the cooling circuit, it is provided that the temperature sensor is arranged on the high pressure side in the flow direction downstream of the internal heat exchanger and in front of the first expansion element. Accordingly, a temperature of the refrigerant is then measured immediately in front of the first expansion element.
  • the control device now regulates the second expansion element or a dosage of refrigerant via the bypass from the high pressure side to the low pressure side to the internal heat exchanger as a function of a pressure measured at the pressure sensor and a temperature measured at the temperature sensor.
  • the method can be carried out in a particularly simple manner if a pressure sensor and a temperature sensor are already installed at a corresponding point in the cooling circuit and the temperature control device has a control device. It is then only necessary to modify the control device accordingly in such a way that the second expansion element is controlled by means of the control device as a function of a pressure measured at the pressure sensor and a temperature measured at the temperature sensor.
  • the refrigerant on the high pressure side can be cooled by means of the internal heat exchanger. Since the internal heat exchanger is connected to the high pressure side and the low pressure side of the cooling circuit, the refrigerant on the high pressure side can be cooled by the refrigerant on the low pressure side when it flows through the internal heat exchanger.
  • the internal heat exchanger can be supplied with refrigerant via the second expansion element, with refrigerant being able to be supplied to the compressor from the low-pressure side of the internal heat exchanger.
  • the bypass with the second expansion element is provided, with the bypass and the second expansion element Refrigerant is dosed on the low-pressure side in front of the internal heat exchanger and thus a suction gas temperature can be further reduced.
  • the method can be used particularly well if a refrigerant with a temperature glide of ⁇ 5 K is used as the refrigerant.
  • a zeotropic refrigerant can also be formed by a refrigerant mixture. Depending on the composition of this refrigerant mixture, the refrigerant can have a temperature glide of ⁇ 7 K to ⁇ 15 K. The temperature glide is given here for an evaporation pressure of 1 bar.
  • the refrigerant used can be R469A or a mixture of the refrigerant R469A and the refrigerant R410A or R466A.
  • the refrigerant R469A consists of 35% by weight carbon dioxide, 32.5% by weight difluoromethane and 32.5% by weight pentafluoroethane and has a boiling point of -78.5 ° C and a dew point temperature of -61.5 ° C so that temperatures down to -70 ° C can be achieved in a correspondingly adapted cooling circuit, for example in a multi-stage cooling device.
  • the mixture of the refrigerant R469A and the refrigerant R410A or R466 can advantageously be used in a single-stage cooling device with only one cooling circuit.
  • the mass fraction R449A in the refrigerant mixture can be 30 to 70 mass percent, wherein the mass fraction of the further refrigerant R410A or R466 in the refrigerant mixture can be 30 to 70 mass percent.
  • the mass fraction R449A can advantageously be 50 mass percent and the mass fraction R410A or R466 50 mass percent.
  • This or the refrigerants also meet the requirements of EU Regulation No. 5172014 on refrigerants in the version valid on the priority date. Regarding the naming of refrigerants, reference is made to DIN 8960 in the version last valid on the priority date.
  • the control device regulates the second expansion element according to a reference variable
  • the reference variable can be a boiling point of the refrigerant or temperature of the supercooled refrigerant at the first expansion element.
  • the control device can consequently form a control loop or a controller which compares the reference variable with a controlled variable or influences the second expansion element with a manipulated variable. Since the refrigerant in the cooling circuit is basically known, the boiling temperature of the refrigerant at the measured pressure in the high pressure side is also known, so that the boiling temperature of the refrigerant can advantageously be used as a reference variable.
  • the control device can comprise means for data processing, for example a PLC control, a computer or the like, with the control device being able to execute a computer program product or software that carries out the steps required to execute the method.
  • the control device can determine the boiling temperature, the control device being able to calculate the boiling temperature of the refrigerant for the pressure measured at the pressure sensor. Accordingly, it can be provided that the control device calculates the boiling temperature of the refrigerant in question for the respective measured pressure and thus determines the boiling temperature or the control variable of the control itself.
  • the calculation of the boiling temperature can be done particularly easily using a polynomial or a vapor pressure table.
  • the polynomial or the vapor pressure table can then simulate a phase boundary line which corresponds to the boiling temperature or the saturation temperature at a saturation vapor pressure or boiling pressure.
  • the polynomial or the vapor pressure table can be stored in the control device so that a value for the boiling temperature can be derived or calculated by the control device for the measured pressure, which then corresponds to an assumed boiling pressure.
  • the control device can calculate the reference variable by adding the boiling temperature with a safety value of 5 K to 25 K, preferably 7 K to 15 K.
  • the control device can determine the reference variable in such a way that a safety value is added to the boiling temperature so that the reference variable is greater than the boiling temperature. If a range of, for example, 7 K to 15 K is assumed for the safety value, a reference variable range results within which the control device controls the second expansion element. By adding the safety value to the reference variable, it can be avoided that the temperature of the refrigerant at the first expansion element rises above the boiling point, for example as a result of a control jump in the temperature.
  • the control device can subtract the temperature measured at the temperature sensor as a control variable from the boiling temperature, the control device being able to control the second expansion element as a function of the control deviation with a manipulated variable.
  • a system deviation can be determined particularly easily by subtracting the measured temperature from the calculated boiling temperature.
  • the control device can then regulate the second expansion element with a manipulated variable and thus influence a quantity of a refrigerant metered via the second expansion element.
  • the second expansion element can be regulated with the manipulated variable if the measured temperature is higher than the reference variable or the boiling temperature, and no regulation with the manipulated variable takes place if the measured temperature is lower than the reference variable. If there is no control with the manipulated variable, a manipulated variable or output level is then 0%. However, the second expansion element can still be opened so far that the refrigerant flows over the second expansion element and continuous subcooling is ensured. A further opening of the second expansion organ only takes place if the measured temperature is higher than the reference variable. Otherwise the second expansion element is in normal operation. In a departure from this, it can also be provided that the second expansion element is completely closed when the measured temperature is lower than the reference variable.
  • the control device can limit the manipulated variable to a maximum value. This then ensures that the second expansion element is not opened so far that, in the event of a failure of the temperature sensor or the pressure sensor, the second expansion element is opened by the control device to such an extent that the cooling device is damaged.
  • the second expansion element can be controlled particularly advantageously with a PID controller of the control device.
  • the PID controller can be a PID controller in a series structure or a PID controller in a parallel structure.
  • the PID controller is easy to implement and easy to adapt.
  • the PID controller can be implemented particularly easily as part of a digital control with the control device.
  • a temperature in a temperature range from -50 ° C to +180 ° C, preferably from -70 ° C to +180 ° C, particularly preferably from -80 ° C to +180 ° C, within the Test room are trained.
  • the temperature range from - 50 ° C to +180 ° C can still be achieved by a single-stage cooling device with only one cooling circuit.
  • a multi-stage cooling device with at least two or more cooling circuits connected in the manner of a cascade can be used.
  • the temperature control device can also be used to reduce a temperature in a temperature range of ⁇ +60 ° C to +220 ° C within the test room to a temperature of -70 ° C or -80 ° C. That The refrigerant in the heat exchanger is heated up considerably by the comparatively high temperature in the test room, which is why the design of the cooling circuit, at least on one low-pressure side of the cooling circuit, can be technically adapted to a refrigerant heated in this temperature range. A refrigerant heated in this way can otherwise no longer be optimally used on the high-pressure side of the cooling circuit.
  • test interval is understood here to mean a time segment of a complete test period in which the test item is exposed to an essentially constant temperature or climatic condition.
  • An expansion element is understood to mean at least one expansion valve, throttle element, throttle valve or another suitable constriction of a fluid line.
  • the first expansion element and the second expansion element can each be formed from a throttle element and a solenoid valve, it being possible for refrigerant to be dosed by means of the control device via the respective throttle element and the solenoid valve.
  • the throttle element can be an adjustable valve or a capillary through which refrigerant is then passed by means of the solenoid valve.
  • the solenoid valve can in turn be actuated by means of the control device. The actuation can take place in such a way that the solenoid valve is actuated via a manipulated variable for metering refrigerant.
  • the test chamber according to the invention for conditioning air comprises a temperature-insulated test room for receiving test material, which can be closed off from an environment, and a temperature control device for controlling the temperature of the test room, the temperature control device being a cooling device with a cooling circuit with a refrigerant, a heat exchanger arranged in the test room, a Compressor, a condenser, a first expansion element and an internal one Has heat exchanger, wherein the temperature control device can be used to develop a temperature in a temperature range of -40 ° C to +180 ° C within the test room, the internal heat exchanger on a high-pressure side of the cooling circuit in a flow direction upstream of the first expansion element and then the condenser, and is connected to a low-pressure side of the cooling circuit in the flow direction following the heat exchanger and before the compressor, the cooling circuit having a bypass with at least one second expansion element, the bypass on the high-pressure side in the flow direction following the condenser and before the internal heat exchanger and on the low pressure side
  • the cooling device can be designed with just one cooling circuit. With this embodiment of a test chamber, it is possible to develop low temperatures without major structural system expenditure for several cooling circuits in the test room, for example -40 ° C or down to -50 ° C.
  • the condenser can be designed as a cascade heat exchanger of a further cooling circuit of the cooling device, wherein the further cooling circuit can have a further refrigerant, the cascade heat exchanger, a further compressor, a further condenser, and a further expansion element.
  • the test chamber can then have at least two cooling circuits, wherein the cooling circuit can form a second stage of the cooling device and the further cooling circuit, which is then upstream of the cooling circuit, can form a first stage of the cooling device.
  • the condenser then serves as a cascade heat exchanger or heat exchanger for the cooling circuit. In this embodiment of a test chamber, it is possible to develop particularly low temperatures in the test room, for example -70 ° C.
  • the temperature control device can have a heating device with a heater and a heating / heat exchanger in the test space.
  • the heating device can, for example, be an electrical resistance heater that heats the heating / heat exchanger in such a way that a temperature increase in the test space is made possible via the heating / heat exchanger. If the heat exchanger and the heating-heat exchanger can be specifically controlled by means of the control device for cooling or heating the air circulated in the test room, a temperature in the temperature range specified above can be established by means of the temperature control device within the test room.
  • the heating / heat exchanger can be combined with the heat exchanger of the cooling circuit in such a way that a common heat exchanger body is formed through which the refrigerant can flow and which has heating elements of an electrical resistance heater.
  • the condenser can be designed with air cooling or water cooling or another cooling liquid if the condenser is not designed as a cascade heat exchanger.
  • the condenser can be cooled with any suitable fluid. It is essential that the heat load occurring on the condenser is dissipated via the air cooling or water cooling in such a way that the refrigerant can condense in such a way that it is liquefied.
  • the cooling circuit can have a further bypass with at least one third expansion element, the further bypass on the high pressure side following the compressor in the direction of flow and can be connected upstream of the condenser, and downstream on the low-pressure side to the internal heat exchanger and upstream of the compressor, in such a way that a suction gas temperature and / or a suction gas pressure of the refrigerant can be regulated on the low-pressure side upstream of the compressor, and / or that a pressure difference between the High pressure side and the low pressure side can be compensated.
  • the further bypass can additionally be equipped with an adjustable or controllable valve, for example a solenoid valve.
  • a cross section of the third expansion element can be dimensioned such that an overflow of the refrigerant from the high pressure side to the low pressure side only has an insignificant effect on normal operation of the cooling device.
  • the third expansion element can be actuated by the regulating device, which in turn can be additionally coupled to a further pressure sensor which is arranged in the cooling circuit in a flow direction directly upstream of the compressor.
  • a suction gas temperature of ⁇ 30 ° C can be set via the additional bypass.
  • the refrigerant can also be dosed in such a way that the operating time of the compressor can be regulated. In principle, it is disadvantageous if the compressor or compressor is switched on and off many times. The service life of the compressor can be extended if it is in operation for longer periods of time.
  • the refrigerant can be led past the expansion element or the condenser via the further bypass in order, for example, to delay an automatic switch-off of the compressor and to extend the operating time of the compressor.
  • the internal heat exchanger can be designed as a subcooling section or a heat exchanger, in particular a plate heat exchanger.
  • the subcooling section can already be formed by two mutually adjacent line sections of the cooling circuit.
  • test chamber results from the description of features in the dependent claims referring back to claim 1.
  • the Fig. 1 shows a schematic representation of a cooling device 10 with a cooling circuit 11 within which a refrigerant can circulate.
  • the refrigerant is a zeotropic refrigerant with a temperature glide of 5 K.
  • the cooling device 10 comprises a further cooling circuit 12, which is connected upstream of the cooling circuit 11.
  • the cooling circuit 11 comprises a heat exchanger 14, a compressor 15, a condenser 16, a first expansion element 17 and an internal heat exchanger 18 arranged in a test space 13 of a test chamber not shown here runs from the compressor 15 to the first expansion element 17 and a low-pressure side 20 which runs from the first expansion element 17 to the compressor 15.
  • the refrigerant In a pipe section 21 from the compressor 15 to the condenser 16, the refrigerant is gaseous and has a comparatively high temperature.
  • the refrigerant compressed by the compressor 15 flows into the cooling circuit 11 via an oil separator 22 to the condenser 16, the gaseous refrigerant being liquefied in the condenser 16.
  • the internal heat exchanger 18 follows the condenser 16 in the cooling circuit 11, the refrigerant accordingly being in the liquid state in a pipe section 23 of the cooling circuit 11 between the condenser 16 and the first expansion element 17.
  • the heat exchanger 14 is cooled by an expansion of the refrigerant downstream of the first expansion element 17, the refrigerant then changing into the gaseous state in a pipe section 24 between the first expansion element 17 and the heat exchanger 14 and via a pipe section 25 from the heat exchanger 14 to the compressor 15 is directed.
  • the internal heat exchanger 18 is connected to the pipe sections 23 and 25 on the high pressure side 19 and the low pressure side 20 of the cooling circuit 11.
  • the refrigerant on the high pressure side 19 flows in the internal heat exchanger 18 past the refrigerant on the low pressure side 20 so closely that there is an exchange of thermal energy in the internal heat exchanger 18.
  • the internal heat exchanger 18 serves here to subcool the refrigerant on the high pressure side 19 by the refrigerant on the low pressure side 20. This subcooling is ensured by a bypass 26 which is formed from a pipe section 27 with a second expansion element 28.
  • the bypass 26 or the pipe section 27 is connected on the high pressure side 19 in the flow direction following the condenser 16 and upstream of the internal heat exchanger 18, and on the low pressure side 20 downstream of the heat exchanger 14 and upstream of the internal heat exchanger 18. In this way, refrigerant can be metered or expanded from the high-pressure side 19 to the low-pressure side 20 via the second expansion element 28 and passed into the internal heat exchanger 18.
  • a pressure sensor 29 for measuring the pressure of the low-pressure side 20 is arranged in the pipe section 25 immediately before the compressor 15, and a pressure sensor 30 for measuring the pressure of the high-pressure side 19 is arranged in the pipe section 21, immediately following the compressor 15.
  • a temperature sensor 31 is arranged in the pipe section 23, following the internal heat exchanger 18 and immediately in front of the first expansion element 17, arranged with which a temperature of the refrigerant is measured.
  • a further bypass 32 with a third expansion element 33 is also connected in the cooling circuit 11.
  • the further bypass 32 runs from the high pressure side 19 in the flow direction following the compressor 15 and before the condenser 16, to the low pressure side 20 following the internal heat exchanger 18 and before the compressor 15.
  • Via the further bypass 32 or the third expansion element 33 a The suction gas temperature and / or a suction gas pressure of the refrigerant on the low-pressure side 20 upstream of the compressor 15 can be regulated and, if necessary, a pressure difference between the high-pressure side 19 and the low-pressure side 20 can be compensated.
  • the further cooling circuit 12 is filled with a further refrigerant and comprises a further compressor 34, a further condenser 35 and a further expansion element 36.
  • the condenser 16 of the cooling circuit 11 is integrated into the further cooling circuit 12 in such a way that a cascade heat exchanger 37 passes through the Capacitor 16 is formed.
  • the test chamber not shown here has a control device with which the cooling device 10 can be controlled.
  • the control device is coupled to the pressure sensor 29, the pressure sensor 30, the temperature sensor 31, the first expansion element 17 and the second expansion element 28.
  • a pressure of the refrigerant is measured by means of the control device via the pressure sensor 30 and a temperature of the refrigerant is measured via the temperature sensor 31, and the second expansion element 28 is controlled with a manipulated variable.
  • the control device determines one Boiling temperature of the refrigerant at the temperature sensor 31 in that the control device calculates the boiling temperature for the pressure measured at the pressure sensor 30. This calculation is carried out using a polynomial or a vapor pressure table.
  • the boiling temperature is a reference variable according to which the control device controls the second expansion element 17.
  • the control device determines a control deviation in that the temperature measured at the temperature sensor 31 is subtracted as a control variable from the boiling temperature, the control device controlling the second expansion element 28 as a function of this control deviation with the manipulated variable.
  • the regulation of the second expansion element 28 only takes place when the measured temperature is higher than the reference variable. If the measured temperature is lower than the reference variable, there is no regulation of the second expansion element 28 with the manipulated variable or the second expansion element 28 is then operated as usual.
  • the cooling circuit 11 and thus the cooling device 10 can thus be operated safely and without major temperature fluctuations.
  • the pressure sensor 30 and the temperature sensor 31 are already present in a cooling circuit, it is only necessary to design or adapt the control device in such a way that a corresponding control of the second expansion element 28 can be carried out. In this way, the operational reliability of the cooling device 10 can be significantly improved with simple means.
  • the Fig. 2 shows a schematic representation of a cooling device 40.
  • the cooling circuit 11 is provided here.
  • the cooling device 40 is therefore one-stage educated.
  • the cooling circuit 11 is operated as described above. With the cooling device 40, it is possible to develop low temperatures in the test room, for example -40.degree. C. to -50.degree. C., without great system expenditure.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Air Conditioning Control Device (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
EP21170171.9A 2020-04-27 2021-04-23 Procédé et chambre d'essai destinés au conditionnement de l'air Active EP3904785B1 (fr)

Applications Claiming Priority (1)

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EP3904785B1 EP3904785B1 (fr) 2022-08-24

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050183432A1 (en) * 2004-02-19 2005-08-25 Cowans Kenneth W. Thermal control system and method
WO2019048250A1 (fr) * 2017-09-08 2019-03-14 Weiss Umwelttechnik Gmbh Fluide frigorigène
DE102018215026A1 (de) * 2018-09-04 2020-03-05 Audi Ag Kälteanlage für ein Fahrzeug mit einem einen zweiflutigen Wärmeübertrager aufweisenden Kältemittelkreislauf sowie Wärmeübertrager und Verfahren zum Betreiben der Kälteanlage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050183432A1 (en) * 2004-02-19 2005-08-25 Cowans Kenneth W. Thermal control system and method
WO2019048250A1 (fr) * 2017-09-08 2019-03-14 Weiss Umwelttechnik Gmbh Fluide frigorigène
DE102017216363A1 (de) 2017-09-08 2019-03-14 Technische Universität Dresden Kältemittel
DE102018215026A1 (de) * 2018-09-04 2020-03-05 Audi Ag Kälteanlage für ein Fahrzeug mit einem einen zweiflutigen Wärmeübertrager aufweisenden Kältemittelkreislauf sowie Wärmeübertrager und Verfahren zum Betreiben der Kälteanlage

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