EP3894927A2 - Luminaire for irradiating a target - Google Patents
Luminaire for irradiating a targetInfo
- Publication number
- EP3894927A2 EP3894927A2 EP19829424.1A EP19829424A EP3894927A2 EP 3894927 A2 EP3894927 A2 EP 3894927A2 EP 19829424 A EP19829424 A EP 19829424A EP 3894927 A2 EP3894927 A2 EP 3894927A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- lens
- light sources
- lateral
- semiconductor light
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001678 irradiating effect Effects 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 171
- 230000005855 radiation Effects 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 40
- 239000011521 glass Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 239000002966 varnish Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 230000000295 complement effect Effects 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000003570 air Substances 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 claims description 2
- 239000003973 paint Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
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- 239000004020 conductor Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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- 238000003698 laser cutting Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
- B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
- B41F23/0403—Drying webs
- B41F23/0406—Drying webs by radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0966—Cylindrical lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/005—Arrays characterized by the distribution or form of lenses arranged along a single direction only, e.g. lenticular sheets
Definitions
- the invention relates to a lamp for irradiating a target, such as a printed product with printed lacquer, printed ink or the like.
- a target such as a printed product with printed lacquer, printed ink or the like.
- the invention can also
- Printing machine with at least one or more lights for irradiating one
- Printing machines with lights for irradiating printed products with varnish, ink or the like printed thereon, for curing the varnish or drying the ink are known.
- the target for example a paper web, with sufficient intensity so that a rapid
- semiconductor light sources such as LED light sources or semiconductor lasers (VCSEL).
- VCSEL semiconductor lasers
- Semiconductor light sources can have almost Lambertian emission patterns. Therefore, a problem with UV curing is to make a target object or a target surface uniform
- a lighting system for use in the production of coatings, printing inks, adhesives and other curable materials is known from DE 21 2013 000 099 U l.
- the lighting system is equipped with a housing that contains a linear arrangement of light-emitting elements, a window and a front cover.
- the lighting system should include directional optics in the form of a linear Fresnel lens cylindrical lens with one or more grooves.
- DE 21 2013 000 099 U l describes Fresnel cylindrical lenses made of glass through a Blank press process should be made. With conventional methods, Fresnel lenses, in particular with several grooves made of glass, are practically not economically feasible because it is difficult to obtain the fine, sharp edges precisely by means of bright presses.
- the Fresnel cylindrical lens can be made, for example, from optically transparent plastic. Especially at higher temperatures from about 120 ° C such plastic lenses have poor mechanical stability. Furthermore, the optics described provide a relatively long path between the light source and the lens, which impairs the directivity that can be achieved.
- WO 2013/164054 A1 discloses a method for producing an optical module with a polymer optic which is held on a glass carrier plate. Such optics are cheaper to manufacture than the optics described above, with higher precision.
- the glass base plate used provides the structural optics made of a transparent silicone material with high structural stability.
- a disadvantage of this optics is the relatively large distance between the semiconductor light source and the optics due to the
- US 2011/0290179 A1 describes a curing device with numerous UV LEDs, the emitted ultraviolet radiation of which is intended to be focused on a flat printed product which is relatively far away from the UV LEDs by means of a multi-part parabolic mirror and a single cylindrical lens.
- the large distances in the direction of radiation result in poor directivity and an undesirably large installation space.
- WO 2013/164053 A1 describes a luminaire with primary optics for bundling the light emitted by LED light sources, which comprises a plurality of lenses arranged directly on the LEDs and possibly reflectors arranged directly to the side of the LEDs, which form a primary optics.
- a secondary optics is provided which reinforces the bundling of the largest possible exit angle from the LEDs into a target surface.
- the secondary optics can, for example, be designed as described in WO 2013/164053 A1.
- the lamp described in WO 2013/164053 A1 is characterized by very good optical properties. However, it has been shown that the silicone optics open when the semiconductor light sources are particularly powerful
- the lenses are heated on the one hand by heating the LEDs with which the polymer lenses are in direct contact, and on the other hand by the absorbed radiation.
- the transmission silicone is approx. 90 - 92%, ie around 10% of the radiation power is converted into heat in the silicone. It is an object of the invention to provide a lamp for irradiating a target
- the invention relates to a lamp for irradiating a target, such as a printed product with printed varnish or the like.
- a light source is generally referred to as a radiation source.
- the luminaire can be designed to emit predominantly or exclusively light from one or more specific spectral ranges. For example, the light can be on
- IR emitters Be infrared emitters (IR emitters) that emit predominantly or exclusively light with wavelengths in the infrared spectral range, in particular in the range from 780 nm or from 800 nm and / or up to 1600 nm, in particular up to 1300 nm, preferably up to 1000 nm.
- the luminaire be an ultraviolet lamp (UV lamp) that predominantly or exclusively uses light
- a UV semiconductor light source can have a spectral range of at least 380 nm and at most 390 nm.
- the luminaire comprises several semiconductor light sources.
- the semiconductor light sources can be implemented, for example, as infrared light-emitting diodes (IR-LED light sources) and / or as ultraviolet light-emitting diodes (UV-LED light sources).
- the semiconductor light sources can be implemented, for example, as laser diodes (VCSEL; "vertical-cavity surface-emitting laser”; surface emitter).
- At least two first semiconductor light sources form a first light source row oriented in a lateral direction and at least two further semiconductor light sources form a second second light source row oriented in the lateral direction.
- At least two semiconductor light sources can lie on a straight line that corresponds to the lateral direction and form the first light source row.
- the luminaire comprises second semiconductor light sources which lie on a second straight line and which form a second light source row.
- the luminaire can comprise further semiconductor light sources, of which several each lie on one or more further straight lines which form one or more further light source rows.
- the optional straight lines can be parallel, in particular parallel to space aligned with the first straight line and / or arranged in a common light source plane. Any existing straight lines are aligned according to the lateral direction.
- the radiation power density ie, the electrical power consumption of the lamp based on the area covered with the semiconductor light sources surface can / cm at least 50 W cm z, in particular at least 100 W / 2, or even at least 150 W / cm z.
- the radiation power density can be at least 250 W / cm z .
- the at least two semiconductor light sources provide a peak radiation power density in the working plane or target plane of at least 5 W / cm z , in particular at least 10 W / cm z or even at least 15 W / cm z .
- the semiconductor light sources provide a peak radiation power density in the target plane of at least 25 W / cm 2 .
- the luminaire comprises a plurality of, in particular individual, separate lenses for collimating and / or collecting light from the semiconductor light sources, each of the light source rows being associated with one of the lenses, in particular individually.
- the assignment of each individual light source line to its lens is in particular such that the entire light source line is occupied with the lens assigned to it in the lateral direction.
- the lens occupies all semiconductor light sources
- a light source row comprises at least 10, at least 20 or at least 30 semiconductor light sources.
- the lenses are designed for straightening, in particular for collimating and / or collecting, light from the semiconductor light sources.
- a lens can be an at least partially transparent and / or translucent optical element that exerts a directivity effect on penetrating radiation, for example collecting, bundling, collimating and / or focusing.
- collimating light beams are aligned at least approximately parallel to one another.
- focusing light beams are aligned so that they meet at one point.
- the at least one lens or the multiple lenses of the lamp can comprise glass, in particular borosilicate glass or quartz glass, or consist of glass.
- At least one lens of the luminaire can be designed to direct the light from at least several semiconductor light sources, in particular different light source lines, onto a predetermined working level.
- the working level or radiation level can be designed to direct the light from at least several semiconductor light sources, in particular different light source lines, onto a predetermined working level.
- the working level or radiation level can be designed to direct the light from at least several semiconductor light sources, in particular different light source lines, onto a predetermined working level.
- the at least one lens directs the light onto a linear irradiation area in the working plane, the main linear direction of which extends in the lateral direction and which has a limited width in the transverse direction.
- the working plane can be at a predetermined distance in a radiation direction that is oriented transversely, in particular perpendicularly, relative to the lateral direction and a transverse direction, of at most 20 cm, in particular at most 15 cm, preferably at most 10 cm and / or be at least 1 mm, in particular at least 2 mm, preferably at least 5 mm away from the lamp, in particular the outside of a protective window of the lamp between the target and the lenses.
- the lenses can direct the light from the luminaire onto the irradiation surface such that a radiant power density of at least 5 W / cm 2 , in particular at least 10 W / cm z , preferably at least 15 W / cm z is achieved in the irradiation surface.
- the luminaire can be configured such that the radiant power density in the irradiation area is at least 20 W / cm z or even at least 30 W / cm z .
- the radiation power density to be achieved can relate in particular to the maximum peak power that can be achieved in the irradiation area when the lamp is in continuous operation.
- the working plane can be scanned with a measuring device to determine the spatially resolved one
- the Heraeus ® NobleProbe ® measuring device can be used as the measuring device.
- the maximum measured value gives the peak performance.
- the measurement is carried out in direct contact of the measuring head with the protective window of the radiator in the transverse direction centrally over the semiconductor substrates
- the luminaire comprises at least one second light source row, in which at least two further semiconductor light sources are arranged, in particular on a second straight line, which are located
- Lateral direction outermost in the second line of light sources can be along one in
- Transverse direction transverse straight lines extending transversely to the lateral direction.
- next semiconductor light source in the lateral direction of the first light source row and the one in
- the next semiconductor light source of the second light source row in the lateral direction can be arranged along a second transverse straight line which extends parallel to the first transverse straight line.
- the individual semiconductor light sources of different light source lines can form light source rows which extend transversely, preferably orthogonally, to the light source lines and / or in the transverse direction.
- the semiconductor light sources form lateral rows and transverse rows, one can speak of a grid-like alignment of the semiconductor light sources.
- Light source lines can be arranged in the transverse direction at a constant center point distance from one another.
- the light source lines can be in the transverse direction with
- a luminaire can have at least five semiconductor light source rows, in particular at least seven Has light source lines and / or at most 20, in particular at most 12 semiconductor light source lines.
- a semiconductor substrate can have at least five and / or at most twenty light source transverse rows, in particular twelve light source transverse rows.
- a lens extends over a respective light source row, at least in sections, in order to collimate and / or collect the light emitted by the semiconductor light sources of this light source row.
- a first lens can extend over the first light source line
- a second lens can extend over a second light source line
- any further lenses can each extend over a further light source line.
- a luminaire comprises at least one second lens separate from the first lens for collimating and / or collecting light from the at least two further semiconductor light sources.
- exactly one lens can be provided per line of light sources.
- the lenses can each define lens-specific center lines which are arranged in the transverse direction centrally in the radiation direction above the respective light source line.
- the lenses can be arranged at a constant center-to-center distance from one another in the transverse direction.
- the lenses can have different in the transverse direction
- Center point distances can be arranged relative to each other.
- the center-to-center distance of the lenses can correspond to the center-to-center distance of the light source rows behind them in the direction of radiation.
- the center-to-center distance of the lenses can be greater than the center-to-center distance of the light source rows behind them in the direction of radiation.
- the first lens and / or the second lens expands in one
- Transverse direction transverse, in particular perpendicular, to the lateral direction from only one light source line.
- Each lens can be individually assigned to a light source line.
- the width of the first lens, the second lens and / or the further lens in the transverse direction can be greater than the width of a semiconductor light source in the transverse direction.
- the width of a lens in the transverse direction is in particular smaller than the distance in the transverse direction of the two outer rows of three adjacent light sources.
- each lens of the lamp is in
- the at least one lens or the plurality of lenses form the only active optics of the lamp.
- the luminaire can have a window or the like, which is arranged in the direction of radiation relative to the semiconductor light sources behind the lens or lenses, but which is not optically or practically ineffective.
- An optically ineffective Windows or the like have no significant measurable effect on the collection and / or collimation of the light from the semiconductor light sources.
- the distance between the semiconductor light sources and the target-facing outside of the lamp, in particular the outside of the window can be at least 2 mm, in particular at least 4 mm, preferably at least 5 mm and / or at most 20 mm, in particular at most 10 mm or 7 mm, preferably at most 6 mm.
- the distance from the semiconductor light sources to the outside of the window can be 5.3 mm ⁇ 0.2 mm
- the at least one lens is manufactured as a rod lens, the extent of which in the lateral direction is substantially greater than in a transverse direction transverse to the lateral direction or a radiation direction transverse to the lateral direction.
- the length of the rod lens in the lateral direction can be at least 10 mm, in particular at least 25.4 mm or at least 100 mm.
- the length of the rod lens in the lateral direction can be at most 500 mm, in particular at most 300 mm or at most 150 mm. .
- the length of the rod lens in the lateral direction can be 370 mm ⁇ 5 mm or 255 mm ⁇ 5 mm.
- the length of the rod lens in the lateral direction can be at least 250 mm, in particular at least 350 mm or even at least 1000 mm.
- the length of the rod lens in the lateral direction can be at most 3000 mm, in particular at most 2500 mm or at most 2000 mm.
- the length of the rod lens in the lateral direction can be 1060 mm ⁇ 50 mm or 1700 mm ⁇ 50 mm.
- the width of the rod lens in the transverse direction or the height of the rod lens in the radiation direction can be less than 10 mm, in particular less than 5 mm or less than 2 mm.
- the width of the rod lens can be greater than the height of the rod lens.
- the at least one lens in particular the rod lens, has a constant lens cross section in the lateral direction.
- the lens cross section can be circular, partially circular, preferably semicircular.
- the lens, in particular the rod lens can be shaped as a convex or concave cylindrical lens.
- the lens cross section can be Fresnel lens-shaped.
- the lens can be shaped as a Fresnel lens. It is conceivable that several adjacent lenses have different polyhedral cross sections and together form a composite Fresnel lens.
- the at least one lens comprises at least one
- the lens can be formed as a rod lens with a constant part-circular, preferably semicircular, cross-section.
- a semi-cylindrical rod lens has a convexly curved side and a flat side.
- the lens is at a distance of at most 10 mm, at most as 5 mm, at most 1 mm or at most 0.5 mm and / or at least 0.1 mm, at least 0, in the radiation direction. 2 mm or at least 0.3 mm to the at least two semiconductor light sources.
- the lens can preferably be arranged at a distance of 0 mm or 0.4 mm from the at least two semiconductor light sources.
- the lens can be arranged at a distance of 0.4 mm ⁇ 0.2 mm from the at least two semiconductor light sources.
- the distance extends from a flat section, such as a flat side, of the lens to the semiconductor light sources assigned to it.
- the distance from the lens to the semiconductor light sources of the light source row assigned to it can be constant.
- the respective distance between all semiconductor light sources and the respectively assigned lens is constant.
- a minimum distance based on the respective lens can be described for the semiconductor light source.
- the distance in the case of semiconductor light sources in the form of LED light sources when the LED light sources are embodied as so-called flip chips can be greater than or equal to 0 mm, or when the LED light sources are embodied as so-called vertical chips with bonding wires can be greater than or equal to 0.4 mm , in particular the bond wires are arranged in the greater or equal 0.4 mm high distance between the vertical chip and the lens.
- the lamp comprises at least one lens holder, which comprises at least a first web with at least one first mounting opening and a second web with at least one second mounting opening spaced apart from the first web in the lateral direction, the at least one lens extending at least from the first mounting opening extends in the lateral direction across the light source row to the second bracket opening.
- Lens holder can be in several parts, in particular the webs can be mounted individually on the lamp.
- the lens holder can comprise more than two webs. More than two bars allow the use of particularly long lenses and / or a particularly precise one
- the webs ie the first web and / or the second web and optionally further webs, extend in particular in a transverse direction transversely, preferably perpendicularly, to the lateral direction.
- the webs are oriented relative to the semiconductor light sources of the luminaire in such a way that a web extends in the lateral direction between two immediately adjacent semiconductor light sources of a row in the transverse direction.
- the webs are preferably arranged between adjacent semiconductor light sources of the respective row. In this way, the formation of shadows due to the webs can be minimized.
- the first web and the second web frame a complete line in the lateral direction.
- the lens extends completely over an entire line of light sources, in particular one or more circuit boards.
- the at least one lens extends into the first holding opening and / or the second holding opening.
- the at least one lens can extend through the first and / or the second holding opening. It may be preferred that the lens holder, the
- Lateral stop and / or the adjustment is made from a material with high thermal conductivity greater than the thermal conductivity of non-conductive ceramic and / or plastic material.
- the first web and the second web of the lens holder have a plurality of transversely adjacent first and second openings corresponding to the number of lenses.
- the number of the first mounting opening in the first web can be equal to the number of the second
- Bracket opening in the second web and equal to the number of lenses and / or
- the number of lenses held by a lens holder preferably corresponds to the number of light source lines of the lamp.
- the lamp comprises at least one adjusting means for aligning the lens relative to the at least two
- Semiconductor light sources which is in a form-complementary contact contact with the lens, in particular with a flat portion, preferably a flat side of the lens.
- An embodiment with a plurality of rows of light sources and a plurality of lenses can comprise one, two or more adjustment means.
- the number of adjustment means can correspond to the number of lenses.
- the lens holder comprises at least one adjustment means.
- the lens holder can be formed in one piece with the adjusting means.
- a holder opening can be formed with an adjustment section which is in contact with at least one of the lenses, in particular in a form that is complementary in shape.
- At least one mounting opening is formed at least in sections or completely complementary to the shape of the lens cross section. It is conceivable that at least one lens, in particular a flat side of the lens, is in particularly flat contact with a surface of a semiconductor light source, in particular a flip-chip LED light source, so that the surface of the semiconductor light source realizes the adjusting means.
- the lamp in particular the lens holder, comprises at least one lateral holder which is in contact with the at least one lens by one
- the lateral holder can comprise a first lateral stop and a second lateral stop, in particular at least one of the lateral stops being in touch contact with opposite lateral ends of the at least one lens. It is conceivable that both opposite lateral stops, which are assigned to the same lens, are in touch contact with the opposite ends. It is conceivable that in the lateral direction a free lateral path for tolerating thermal expansions of the material of the lateral holder is provided for at least one of the lateral ends of the lens and at least one lateral stop. The free path can in particular be dimensioned such that the lens is securely held by the lens
- Lens holder is guaranteed. For example, the free distance (if the
- Lateral bracket has room temperature) at least 0.01 mm, in particular at least 0.1 mm and / or at most 2 mm, in particular at most 0.5 mm.
- the length of the lens in the lateral direction is, in particular when the lens and the lateral holder are heated
- Operating temperature preferably less than or equal to the distance between the opposing lateral stops assigned to the lens.
- the lens holder, the lateral holder and / or adjusting means are formed in one piece with one another.
- the lens holder, the lateral holder and the adjusting means can be formed by a one-piece, multiply bent and perforated sheet metal body.
- the lens holder is formed by a frame body which comprises at least a pair of circular cylindrical holder openings for receiving the at least one lens, and the lateral holder and the adjusting means are formed in one piece by a profile body which is detachably connected to the frame body, in particular pushed on or attached.
- the lateral holder and / or the adjusting means can be detachably attached to the lens holder, in particular without tools and / or without damage.
- the lens holder, the adjusting means and / or the lateral holder are made of metal, such as aluminum or stainless steel.
- the lens holder can be fastened relative to the semiconductor light sources, in particular on the semiconductor substrate.
- the lens holder, the adjusting means and / or the lateral holder can be a plate with a plate thickness of at least 1 mm, at least 5 mm or at least 10 mm. Openings are preferably milled and / or drilled in a plate.
- the lens holder can be manufactured as a plate and the adjusting means and / or the lateral holder, in particular in one piece, as a sheet.
- the lens holder, the adjusting means and / or the lateral holder can be a sheet with a sheet thickness of at most 1 mm, at most 0.5 mm or at most 0.2 mm, in particular about 0.5 mm. Openings in a sheet metal are preferably lasered and / or punched. A sheet can be bent. According to a special embodiment, a single piece of sheet metal can
- the at least one lens or the plurality of lenses, the lens holder, the adjusting means and / or the lateral holder is polymer-free.
- the lens, the lens holder, the adjusting means and / or the lateral holder preferably consist of inorganic materials, for example metal, glass and / or ceramic materials.
- the luminaire is polymer-free in its area irradiated by the ultraviolet light from the illuminants. If the area of the luminaire which is directly and in particular indirectly irradiated by the light from the semiconductor light sources is free of polymer materials, in particular free of organic materials, it is ensured that there is essentially no aging of the material due to the irradiation with ultraviolet light, which extends the life of the luminaire could affect.
- the luminaire comprises a semiconductor substrate on which the
- Semiconductor light sources are arranged. According to a further development, the lens holder is electrically insulated relative to the semiconductor substrate and the semiconductor light sources. Between the
- a non-conductive component can be arranged in the lens holder and the semiconductor substrate.
- the non-conductive component can be air, plastic, ceramic, glass or the like or
- the lens holder can be relative to that
- Washers for example made of ceramic, and / or via non-conductive fastening means, such as non-conductive screws and / or non-conductive threaded sockets.
- air can be provided as the non-conductive component between the semiconductor substrate and the semiconductor light source.
- the non-conductive component or components can be attached to the lens holder and / or to the semiconductor substrate.
- a lens holder made of a conductive material such as metal Expedient to provide at least one non-conductive component, in particular several different non-conductive components, between the current-carrying region of the semiconductor substrate and the lens holder in order to short-circuit between individual current-carrying components
- Components of the semiconductor substrate for example the semiconductor light sources through which
- At least one circuit board such as a chip-on-board module, forms the semiconductor substrate and the at least one lens extends completely over the at least one circuit board in the lateral direction.
- these can be assembled and / or disassembled. For example, in the event of a defect in a circuit board, only this one needs to be replaced. With such an arrangement, an individual lens holder can be assigned to each circuit board.
- a plurality of circuit boards of the semiconductor substrate for example two circuit boards, three circuit boards or a larger number of individual circuit boards, can be assigned a lens holder in which a plurality of lenses are arranged, where the one or more lenses extend completely over the plurality of circuit boards.
- the plurality of lenses can be designed in such a way that each individual lens spans a complete light source row of the circuit board or the circuit boards.
- a semiconductor substrate comprising a plurality of circuit boards can be provided, the circuit boards each comprising a plurality of light source rows.
- the respective number of light source rows of the multiple boards can be the same.
- the light source rows of the plurality of boards can be arranged at least approximately in alignment with one another in the lateral direction.
- the number of the individual light source rows of the circuit boards can correspond to the number of the associated lenses, which extend over several circuit boards.
- a device for drying and / or curing a coating which comprises a lamp according to the invention.
- a flat target such as a two-dimensional web material, for example a printed product, such as a printed paper web, can be provided with a coating to be dried, for example a printed varnish.
- the device can be designed such that the flat substrate within the device is movable relative to the lamp in a conveying direction corresponding to the transverse direction.
- a lamp or a plurality of lamps can be arranged in the device, which at least partially extend transversely to the conveying direction over a width of the flat target, for example the transverse width of a paper web.
- Drying devices can be arranged at a defined distance in the radiation direction relative to the target.
- the device is a printing press, for example a sheet-fed offset printing press, a flexographic printing press or the like.
- the flat substrate can be a printed product.
- a luminaire according to the invention for drying and / or curing a coating in particular in a printing process and / or a painting process, is also to be regarded as the invention.
- the use of the lamp for drying is realized by irradiating an applied coating, such as a varnish, a paint or the like, preferably in a printing press.
- Figure 1 is an exploded view of a first embodiment of an inventive
- Figure 2 shows the lamp of Figure 1 in a perspective view
- Figure 3 shows a second embodiment of a lamp according to the invention in a
- Figure 4 is a cross-sectional view of the lamp of Figure 3;
- FIG. 5 shows a perspective view of a lens holder of the lamp according to FIG. 3;
- Figures 6a, 6b, 6c different views of a rod lens with a constant semicircular
- Figure 7 is a longitudinal sectional view through a schematic representation of a
- Figure 8 is a longitudinal sectional view through a schematic representation of a
- FIG. 10 shows a diagram of the distribution of the radiation intensity in the transverse direction for conventional and inventive lights
- FIG. 11 shows a diagram of the radiation power in an irradiation area as a function of
- FIG. 12 shows a device for drying and / or curing a coating with several lights according to the invention.
- Figure 13 is a perspective view of another embodiment of an inventive
- FIG. 14 shows the lamp according to FIG. 13 in an exploded view
- FIG. 15 shows a perspective view of a lens holder of the lamp according to FIG. 13.
- a luminaire according to the invention for irradiating a target such as a printed product with printed varnish, generally bears the reference number 1.
- the luminaire 1 shown in FIG. 1 has a multiplicity of semiconductor light sources 11, 12, 13 which are arranged in a grid-like manner.
- First semiconductor light sources 11 are arranged on a first straight line, which defines a lateral direction L, and form a first light source row 21.
- a plurality of further (second) semiconductor light sources 12 are arranged along a second straight line, which is arranged parallel to the first straight line, and form a second one Light source line 22.
- Further semiconductor light sources 13 are arranged along further straight lines which are parallel to the first straight line and the second straight line, and form further light source lines 23.
- At least one lamp 1 can be part of a device 100 for irradiating a target 3.
- the target 3 can go along a conveying direction F relative to the lamp or lamps 1.
- the luminaires 1 emit light in the radiation direction Z, for example ultraviolet light and / or infrared light.
- the lateral direction L of the lights 1 corresponding to the orientation of the light source rows 21, 22, 23 and / or according to the orientation of the rod lenses 31, 32, 33 corresponds in particular to a transverse direction Q of the target 3 transversely, preferably perpendicularly, to the conveying direction F and the radiation direction Z.
- the light source rows 21, 22, 23 are assigned individual lenses 31, 32, 33 for collimating and / or collecting light from the semiconductor light sources 11, 12, 13.
- an individual lens 31, 32 or 33 is individually assigned to each individual light source row 21, 22 or 23.
- a lens can be assigned to several light source lines. For example, a width BL of a lens in the transverse direction can be dimensioned such that the lens extends over a number of adjacent semiconductor light source lines. Regardless of the width of the lens or lenses, it is clear that the assignment of the
- Light source line to your lens is such that in the lateral direction L the entire light source line in the radiation direction Z is occupied by the lens.
- the light source row 21, 22, 23 can comprise at least 5, at least 10, at least 20, at least 30 or more semiconductor light sources.
- the lamp shown in Figure 1 is a
- the circuit board 71 is covered with a grid of semiconductor light sources 11, 12, 13.
- the circuit board 71 can, for example, at least two, at least three, at least five or (as shown) at least seven
- the board 71 may have at least five, at least eight, at least ten (as shown), at least twelve, sixteen or more rows of light sources transverse. In the luminaire 1 shown in FIG. 1, three boards 71 are arranged next to one another in the lateral direction L and are aligned in the lateral direction L.
- Semiconductor light sources 11, 12, 13 are provided, one in one across the width of the lamp
- Lateral direction L composite semiconductor light source line each with more than 20 form semiconductor light sources 11, 12 and 13 respectively.
- Another of the rod lenses 31, 32, 33 extends completely over each of these light source lines in the lateral direction, as shown in FIG. 2.
- the rod lenses 31, 32 and 33 shown in the lamp 1 according to FIGS. 1 and 2 each have the same shape.
- the cross section of the rod lenses 31, 32 and 33 is along the entire lens Length LL in the lateral direction L constant semicircular.
- a high-purity quartz glass can be used for the material of the lenses 31, 32, 33, which is particularly transparent to ultraviolet light (or infrared light) (transmission of at least 99%).
- Quartz glass material can advantageously have particularly good mechanical and / or thermal stability. In this way, particularly high performances can be achieved in which lenses made of a polymer material, such as a silicone material, would fail. At high UV radiation power densities, a lens can soften and / or overheat on its silicone material. Compared to polymer materials, borosilicate glass shows higher thermal stability and stability against degradation by UV light.
- the lenses 31, 32 and 33 are held in a plate-like frame 51 which realizes a lens holder.
- a protective window 6 (not shown), for example made of glass, in particular a quartz glass or a borosilicate glass, can be arranged on the side of the plate-like lens holder 51 facing away from the semiconductor light sources 11, 12, 13 in the radiation direction Z.
- Lens holder 51 is frame-like and limited in the lateral direction L on the one hand by a first web 52 and on the other hand by a second web 54.
- the first web 52 and the second web 54 extend essentially in the transverse direction T parallel to one another on the longitudinal sides of the lens holder 51 opposite in the lateral direction L L extending crossbar 60 of the lens holder 51 rigidly connected to each other.
- a non-conductive region 59 is provided between the lens holder 51 and the electronics of the circuit boards 70.
- first web 52 and the second web 54 of the lens holder 51 are each
- Bracket opening 53, 55 is provided corresponding to the number of lenses 31, 32 and 33.
- the lenses 31, 32 and 33 each extend from a first mounting opening 51 in the first web 52 in the lateral direction to a second mounting opening 53 in the second web 54.
- the lenses 31, 32 and 33 are preferably dimensioned such that they extend at least in sections extend into the mutually opposite mounting openings 53 and 54.
- the lens holder 51 shown in FIG. 1 is equipped on both sides with a holding and adjusting plate.
- the adjusting plates serve as lateral stops 57, 58 and adjusting means 56 for orienting and securing the lenses 31, 32 and 33 relative to the lens holder 51.
- the holding and adjusting plates 50 have a sheet metal section laterally on the outside, which acts as a lateral stop 57 and 58, respectively by preventing the lenses 31, 32 and 33 from being displaced outward of the bracket opening 53 and 55 relative to the lens holder 51 in the lateral direction.
- the holding and adjusting plates 50 comprise a second plate section which acts as an adjusting means 56 by touching the flat side 35 of the lenses 31, 32 and 33 facing the semiconductor light sources 11, 12 or 13 along a transverse line edge in the radiation direction Z.
- Radiation direction Z front transverse longitudinal edge of the holding and adjusting plate 50 simply determines the orientation of the lenses 31, 32 and 33 in the lens holder 51 relative to the semiconductor light sources 11, 12 and 13.
- the lateral ends 37 and 38 of the lenses 31, 32 and 33 extend into the drilled or milled holder opening 53 and 55 in the webs 52 and 54 of the lens holder 51.
- no lateral end 37 and 38 or only one of the two lateral ends 37 and 38 of the lenses 31, 32 and 33 is in touch contact with the first lateral stop 57 or the second
- the lens holder 51 and the holding and adjusting plates 50 are made of metal, in particular of the same metal material, for example stainless steel or aluminum.
- a distance a of at least 0 mm, in particular at least 0.1 mm, and at most 1 mm is provided between the lenses 31, 32 and 33, in particular their flat section 35, in the beam direction Z.
- the rear sides of the lenses 31, 32 and 33 in the radiation direction Z can be in contact with the LED light sources 11, 12, 13, provided that it is ensured by design that the plate-like lens holder 51 and the holding and adjusting plates 50 are sufficiently far from the conductive components of the semiconductor substrate 70 are removed so that a short circuit can be reliably ruled out.
- the LED light sources are preferably UV and / or IR LED light sources.
- LED light sources can only be contacted on the back and have a flat light-emitting surface 10 (so-called flip-chip LEDs).
- flip-chip LEDs In the luminaire according to the invention, lower-cost vertical chips can be provided in relation to flip-chip LEDs, the contacting of which takes place on the back on the one hand and on the other hand via a bond wire on the light-emitting front side 10.
- the distance between the light-emitting front side 10 of the LED vertical chips and the lenses is chosen to be sufficiently large to provide sufficient space for the bonding wires and, if appropriate, an air gap between the bonding wires and
- rod lenses 31, 32, 33 with a flat section 35 on the rear side in contact with the flat, light-emitting front side bring of flip-chip LEDs or the like, so that the semiconductor light source itself as
- Adjustment means can act.
- FIGS. 3 and 4 A second embodiment of a lamp 1 according to the invention is shown in FIGS. Compared to the luminaire 1, which is illustrated in FIGS. 1 and 2, the luminaire 1 illustrated in FIGS. 3 and 4 essentially differs from one another by the different design
- the luminaire 1 comprises a semiconductor substrate 70 with only one circuit board 71 arranged thereon with a plurality of rows 71 thereon,
- a single lens holder 41 is assigned to a single circuit board 71, which has a number of lenses 31, 32 and 33 corresponding to the number of light source rows 21, 22 and 23 wearing.
- 31, 32, 33 occupies the semiconductor light sources 11 or 12 or 13 of the respective light source row 21 or 22 or 23.
- the lens holder 41 comprises two webs 42 and 44 spaced apart from one another in the lateral direction L. In each of the two webs 42 and 44 of the lens holder 41 there are a number of
- Bracket openings 43 and 45 are provided corresponding to the number of lenses 31, 32, 33 held.
- the lenses have the same cross-sectional shape as described with regard to the lamp 1 according to FIGS. 1 and 2.
- the lenses 31 and 32 and 33 have a flat side 35 facing the semiconductor light sources 11, 12 and 13 and a convexly curved front side 30 facing away from the semiconductor light source 11, 12 and 13 in the radiation direction Z.
- the first mounting opening 53 in the first web 42 and / or the second mounting openings 45 in the second web 44 are dimensionally complementary to the cross-sectional shape of the lenses 31, 32, 33.
- Bracket openings 43 and 45 can be in relation to the cross-sectional dimension of the lenses 31,
- Dimensioning of the holder opening 43 and 44 has the effect that the inside of the holder openings 43, 45 on the back in the radiation direction Z acts as an adjusting means 46 for aligning the lenses 31, 32, 33.
- lens holder 41, adjusting means 46 and lateral holder 47 and 48 are realized in functional union by a lens mounting plate 40.
- the lens mounting plate 40 is limited in the lateral direction L by bent sheet metal sections that Forms lateral stops 47 and 48 in order to prevent a relative movement of the lens in the lateral direction L relative to the lens holder and / or the illuminants.
- the lens support plate 40 can be formed, for example, from a thin plate that is less than 0.5 mm thick, in particular less than 0.2 mm thick.
- the lens support plate 40 can be formed, for example, from sheet metal by bending and punching and / or cutting, for example water jet cutting or laser cutting.
- the holder openings 43 and 45 can be cut or punched into the sheet.
- the webs 42 and 44 with the mounting openings 43 and 45 formed therein can be formed by bending the sheet.
- the lateral stops 47 and 48 can be formed by punching, cutting or (as shown) bending the sheet metal several times.
- the lens mounting plate 40 can be fastened to the circuit board 71 and / or the semiconductor substrate 70 by means of one, two or more non-conductive fastening components 49, for example glued, plugged in or screwed on.
- the webs 42 and 44 are each arranged in the lateral direction L between adjacent transverse rows of semiconductor light sources 11, 12, 13, the distance between the adjacent semiconductor transverse rows being greater than the thickness of the lens mounting plate 40. Between the webs 42 and 44 of the A non-conductive region is provided in the lens support plate 40 and the semiconductor transverse rows, filled with air, another gas or a vacuum.
- the lens mounting plate 40 is mounted in a stationary manner relative to the semiconductor substrate 70 and the semiconductor light sources 11, 12, 13 arranged thereon via non-conductive components such that a short circuit is reliably avoided.
- the rear flat sections 35 of the lenses 31, 32, 33 in the beam direction Z are a distance a of at least 0.1 mm, in particular at least 0.2 mm, and / or at most 1 mm, in particular at most 0.6 mm, preferably at a distance a of 0.4 mm, arranged relative to the semiconductor light source 11, 12, 13.
- the distance a is chosen to be as small as possible in order to efficiently focus the emitted light from the LED light sources 11, 12, 13 onto the irradiation surface, but sufficiently large to short-circuit the
- Figures 6a, 6b and 6c show different views of a rod lens 31/32/33
- the rod lens 31 shown has as a characteristic parameter a lens length LL, a lens width BL and one
- the lens width BL corresponds to twice the lens radius RL.
- the lens width BL is larger than the width of a semiconductor light source, for example the UV LED 11.
- the UV LED 11 or other semiconductor light sources can have dimensions, for example (Length times width) of about 1 x 1 millimeter.
- the semiconductor light sources can have dimensions of 1100 ⁇ 1100 ⁇ 50 mm.
- a tolerance width between the lateral stops and the lenses of less than 2 mm, preferably 1 mm or less, can be provided.
- a cylindrical lens is a lens whose surface corresponds at least partially to the surface of a cylinder.
- the cylindrical lens can have a convex surface.
- the cylindrical lens can have a concave surface (not shown in detail). Basically, the lens length U. should measure at least 10 times the lens width BL; regardless of whether the rod lens is formed with a semi-circular cross-section (as shown) or another cross-section.
- the length of the lenses L L is at least 20 mm, in particular 25.4 mm or more.
- Lens length L L can be at least 100 mm or at least 150 mm. It has proven to be expedient to choose the lens length LL to be less than 1000 mm, in particular less than 300 mm.
- FIG. 7 shows a schematic longitudinal sectional view of a luminaire with main focus on the alignment of the light source rows relative to one another; the alignment of the lenses relative to one another and the alignment of the lenses relative to the semiconductor light sources.
- the type of holding of the lenses relative to the semiconductor light sources is not shown in FIG. 7; For example, configurations as in FIGS. 1 and 2 or as in FIGS. 3 and 4 are conceivable. The same applies to FIG. 8. The differences between FIGS. 7 and 8 will be discussed later.
- FIG. 7 shows schematically a semiconductor substrate 70 with five light source rows 21, 22 and 23 arranged thereon.
- Rod lenses 31, 32 and 33 of the same type are arranged in the radiation direction Z in front of the semiconductor light sources 11, 12 and 13, with a single rod lens being assigned to a light source row and completely occupying it.
- a protective window 6 of the lamp is provided in the radiation direction Z in front of the semiconductor light sources 11, 12 and 13 and in front of the rod lenses 31, 32 and 33.
- the protective window 6 is designed such that it has no or almost no optical effect on the beam path of the light emitted by the semiconductor light sources on the target 3.
- the target 3 can be a flat two-dimensional object, such as a paper web or a surface, that can be provided with a coating that can be irradiated with the lamp 1.
- Protective window 6 usually delimits a housing (not shown) of a lamp 1 in the direction of radiation Z in order to protect the optics and / or electronics from soiling and / or damage.
- the working distance z extends between the target 3 and the lamp 1 (more precisely, here, for example, the front surface of the protective window 6 in the radiation direction Z). It can be preferred to arrange lamp 1 and target 3 plane-parallel to each other with the working distance z.
- a target 3 such as a printed paper web, in one
- the distance b between the window front 6 and the LED front 10 can be 5.3 mm.
- the distance b between the outside of the lamp 1, in particular the protective window 6, is at least 4 mm, preferably at least 5 mm and / or at most 10 mm, preferably at most 6 mm.
- the lenses 31, 32 and 33 of the luminaire 1 are designed to collimate and / or collect the light from the semiconductor light sources, in particular the UV LEDs and / or infrared LEDs, in particular in such a way that the light from the semiconductor light sources 11 , 12, 13 is focused in the working plane defined by the target 3 onto a narrow focal line in the transverse direction T.
- a particularly high peak radiation power density Imax of, for example, at least 20 W / cm 2 can be provided in the working plane, which can also be referred to as the target plane.
- center lines for the semiconductor light sources 11/12/13 and the lenses 31/32/33 can be determined become.
- the semiconductor light source lines are arranged in the transverse direction T at a constant, constant distance A from one another.
- the lenses are arranged next to one another in the transverse direction T at a constant, constant distance A L (lens distance).
- the center lines of the lenses are aligned with the center lines of the semiconductor light source lines.
- a mounting distance a is formed in the radiation direction Z between the light-emitting front side 10 and the rear side of the lenses 31/32/33, which is exemplarily designed as a flat side 35.
- the mounting distance a between the light-emitting front side 10 of the semiconductor light source 11/12/13 and the rear side of the optically active lenses 31/32/33 in the radiation direction Z is chosen to be as small as possible.
- the mounting distance a is discussed in more detail above with regard to the different embodiments according to FIGS. 1 and 2 or FIGS. 3 and 4.
- the lens width BL in the transverse direction is larger than the width BH of the semiconductor light source 11, 12, 13 in the transverse direction.
- the lenses are dimensioned such that the lens width BL is smaller than that Distance Az of the light source lines (for example 22) adjacent to the light source line (for example 22) occupied by the lens (for example 21 and 23).
- This neighboring line spacing Az is at least as large as, preferably larger than, the center point spacing AH of two immediately adjacent light source lines (for example 21, 22).
- the center line m may be arranged in a region between two light source lines adjacent in the transverse direction T.
- the protective glass 6 can be, for example, a 3 mm thick, high-purity quartz glass pane.
- the curves designated by reference symbol c in the following diagrams 10 and 11 relate to an arrangement of lenses and semiconductor light sources to one another as in the luminaire 1 according to FIG. 7.
- the curves indicated by reference symbol b in the following FIGS. 10 and 11 relate to an arrangement of lenses and semiconductor light sources as in FIG. 8.
- FIG. 8 shows a lamp 1, which differs from the arrangement according to FIG. 7 essentially by a different relative position of the lenses 31, 32 and 33 relative to the light source lines 21, 22 and 23.
- Such an arrangement can be implemented, for example, in the case of lights which are designed as in FIGS. 1 and 2, FIGS. 3 and 4 or FIGS. 13 and 14 (see below).
- the difference between the arrangements according to FIGS. 7 and 8 is that in the embodiment according to FIG. 8, the center-to-center distance of the lenses A L is greater than the center-to-center distance of the light source lines A H.
- the number of light source lines is chosen to be odd and the light source line 21, which is central in the transverse direction T, has a center line m which is aligned with the center line of the lens 31 assigned to it and occupying it.
- the distance between the semiconductor light source rows A H relative to one another is the same.
- the center point distance of the lenses A L in the transverse direction T is the same size and constant.
- the offset vi corresponds to the transverse center m of the semiconductor substrate 70
- Semiconductor substrate 70 next light source line, the first transverse offset Vi the difference between the lens distance AL and the light wave line distance AH.
- the light wave line 23 closest to the transverse center of the semiconductor substrate 70 is shown in FIG.
- V offset relative to the center line of the lens 33 assigned to it.
- the offset In the example shown in FIG. 8, V2 in the second light source line is therefore twice as large as the offset Vi in the first line 22 which is not in the center.
- the center-point distance AH of the light source lines 21, 22 and 23 is not constant in order to set the offset between different light source lines and the respectively assigned lenses ) to offset the
- Target light lines and lenses are Other variation of arrangement,
- FIGS. 9a and 9b schematically show different lights known from the prior art.
- a plurality of parallel rows of UV LEDs are arranged on a semiconductor substrate and shine onto a target.
- a protective glass is arranged practically without a refractive effect as part of a housing border of the lamp 1, not shown in detail.
- the radiator shown in FIG. 9b according to the prior art differs from the one shown in FIG. 9a in that the semiconductor light source is individually coated with a silicone encapsulation, which forms lenses for the individual UV LEDs.
- Each individual UV LED is covered by a partially spherical encapsulation lens body.
- FIGS. 10 and 11 are the curves which relate to luminaires according to the prior art for the embodiment according to FIG. 9a with reference symbol a and for luminaires according to FIG. 9b with reference symbol b.
- FIG. 10 shows the course of the radiation surface density I in W / cm z in
- the semiconductor substrate has a total width of about 30 mm; d. H. 15 mm each on both sides of the center line m in the transverse direction.
- the semiconductor substrate In the longitudinal direction L, the semiconductor substrate has a width of approximately 25 mm.
- the course of the radiation power density curves a, b, c and d essentially corresponds to a Gaussian distribution around the center line m of all four cases.
- the widest scatter corresponding to the widest curve and the lowest peak intensity Imax of the curve at a working distance of 20 mm shows the luminaire according to FIG. 9a without an optical element between the semiconductor light source and the target.
- the version according to FIG. 9b has a slightly increased peak intensity in comparison to the versions without optics according to FIG. 9a and shows a narrower width of the bell, which corresponds to a stronger focus.
- curves c and d show significantly better results. It was expected that the optics-free luminaire would show the highest performance values thanks to the elimination of absorption by optical elements. Curves c and d of the lights according to the invention show considerably higher peak performances.
- the curve c of an optical arrangement according to FIG. 7 without an offset between the lenses and the light source lines has a peak power of almost 12 W / cm 2 .
- the curve b for an optical arrangement as shown in FIG. 8 shows a peak power of approximately 13 W / cm 2 , which is almost twice as high as the peak power of the conventional embodiment according to FIG. 9a without an optical element.
- the measurement values on which the diagram is based are listed in the table below
- Tab. 1 Power I depending on the transverse distance to the substrate center line m
- luminaires 1 according to the invention consistently have radiation power densities in the range above around 7 W / cm z .
- the luminaires according to the invention thus allow a continuously and consistently significantly higher radiation power density in the range of ⁇ 10 mm around the center line m than that Peak power ki of a conventional version (a) as well as continuously above the peak power K of a conventional luminaire with semiconductor potting optics (b).
- FIG. 11 shows the peak radiation power for the different luminaires according to FIGS. 7, 8, 9a and 9b in W / cm 2 depending on the working distance z between the luminaire 1 and the target plane. Measured values for working distances z in the space between 5 mm and 90 mm are shown. The maximum for the working distance z is 20 mm
- the lights according to the invention according to the arrangements, as shown in Figures 7 and 8, cause significantly higher peak intensities than conventional spotlights for working distances between 5 mm and 50 mm.
- the peak intensity for the radiation surface power in the arrangement according to FIG. 8 is better than with conventional radiators. It has been shown that the peak power intensity at a working distance z between 50 mm and 90 mm in the luminaire according to the invention is at least as large as in a conventional luminaire.
- FIG. 12 schematically shows a device which comprises four lamps 1 according to the invention for irradiating a target 3 guided in the working plane parallel to the lamp in the conveying direction 11 in accordance with the transverse direction T.
- FIGS. 13 and 14 show a further embodiment of a lamp 1 according to the invention.
- the luminaire 1 shown in FIGS. 13 and 14 differs essentially in the different design of the lens holder 81, adjusting means 86 and lateral holder 87 (identical opposite lateral holder not illustrated).
- a lens holder 81 is shown separately in FIG. 15.
- the lens holder 81 comprises, as separate parts from one another, a first web 82 and a second web 84.
- a first web 82 and a second web 84 In the webs 82/84 there are a number of holding openings 83/85 in each case
- the holding openings 83, 85 are
- the webs 82 and 84 are realized by sheets 80 with bent mounting sections. Further stop plates 80 'without holding openings serve as a lateral stop 87 (opposite lateral stop not shown).
- the mounting sections of the sheets 80, 80 ' can be connected to a mounting plate of the lamp 1, for example by means of screws.
- the semiconductor substrate 70 can be provided on the mounting plate, the electrically conductive components being separated from the mounting plate by a non-conductive ceramic layer 59, for example an AIN plate.
- the sheets 80 can be arranged in the lateral direction L between adjacent boards 71, so that in the lateral direction an air gap and / or a non-conductive one
- Ceramic plate section between the sheet 80 and electrically conductive components of the semiconductor substrate 70 is provided.
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- General Health & Medical Sciences (AREA)
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- Mechanical Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
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Abstract
Description
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102018221729.7A DE102018221729A1 (en) | 2018-12-14 | 2018-12-14 | LIGHT FOR IRRADIATING A TARGET |
PCT/EP2019/084394 WO2020120460A2 (en) | 2018-12-14 | 2019-12-10 | Luminaire for irradiating a target |
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EP3894927A2 true EP3894927A2 (en) | 2021-10-20 |
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EP19829424.1A Pending EP3894927A2 (en) | 2018-12-14 | 2019-12-10 | Luminaire for irradiating a target |
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US (1) | US20220252764A1 (en) |
EP (1) | EP3894927A2 (en) |
JP (1) | JP7367024B2 (en) |
CN (1) | CN113196128A (en) |
DE (1) | DE102018221729A1 (en) |
WO (1) | WO2020120460A2 (en) |
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US4941072A (en) * | 1988-04-08 | 1990-07-10 | Sanyo Electric Co., Ltd. | Linear light source |
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-
2018
- 2018-12-14 DE DE102018221729.7A patent/DE102018221729A1/en active Pending
-
2019
- 2019-12-10 WO PCT/EP2019/084394 patent/WO2020120460A2/en unknown
- 2019-12-10 EP EP19829424.1A patent/EP3894927A2/en active Pending
- 2019-12-10 JP JP2021532243A patent/JP7367024B2/en active Active
- 2019-12-10 CN CN201980082481.6A patent/CN113196128A/en active Pending
- 2019-12-10 US US17/413,252 patent/US20220252764A1/en active Pending
Also Published As
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US20220252764A1 (en) | 2022-08-11 |
WO2020120460A3 (en) | 2020-08-13 |
WO2020120460A2 (en) | 2020-06-18 |
CN113196128A (en) | 2021-07-30 |
JP2022512138A (en) | 2022-02-02 |
DE102018221729A1 (en) | 2020-06-18 |
JP7367024B2 (en) | 2023-10-23 |
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