EP3867949A1

EP3867949A1 - Semiconductor component arrangement, method for fabrication thereof and heat dissipation device

Info

Publication number: EP3867949A1
Application number: EP19789603.8A
Authority: EP
Inventors: Detlev Bagung; Christina QUEST-MATT; Thomas Riepl; Daniela Wolf
Original assignee: Vitesco Technologies GmbH
Current assignee: Vitesco Technologies GmbH
Priority date: 2018-10-15
Filing date: 2019-10-08
Publication date: 2021-08-25
Also published as: WO2020078778A1; DE102018217607A1; CN112805828A; CN112805828B; US12046531B2; US20220115290A1; US20240297093A1

Abstract

A semiconductor component arrangement (1) is specified that has at least one semiconductor component (3) having a first electrical connection (21) and at least one further electrical connection (22, 23, 24), a printed circuit board (5) and a prefabricated metal block group. The metal block group has a first metal block (31) that is arranged between the semiconductor component (3) and the printed circuit board (5), that is connected to a first electrical connection (21) of the semiconductor component (3) by means of a solder joint (14) and that is connected to at least one conductor track (8) of the printed circuit board (5) by means of a further solder joint (14). The metal block group has at least one further metal block (32, 33, 34) that is interposed by means of a solder joint (14) between the further electrical connection (22, 23, 24) and the printed circuit board (5). The metal blocks (31, 32, 33, 34) of the prefabricated metal block group are arranged to the side of one another and have their lateral outer surfaces (25) partially or completely encased by an electrically insulating casing (26) that is common to them. Moreover, an electrical circuit, a method for fabricating the semiconductor component arrangement (1) and a heat dissipation device (2) are disclosed.

Description

description

Semiconductor component arrangement, method for their production and

Cooling device

Technical field

The present disclosure relates to a semiconductor component arrangement, a method for its production and a heat dissipation device

State of the art

Semiconductor components, especially power semiconductor components, such as power metal oxide semiconductor field effect transistors (so-called.

Power MOSFETs) are often used as components in housings

Cooling surfaces (so-called "heatslug", "exposed pad") supplied. There are various housing designs, for example designs known under the names TO220, D2PAK or DPAK.

They are often housed in a housing

Power semiconductor components are intended for surface mounting and are also referred to as surface-mounted components (so-called surface-mount device / SMD). Power semiconductor components heat up during operation, so that the heat generated must be dissipated. In the surface mounting (so-called SMD mounting) of a power semiconductor component on a printed circuit board, this generally serves as a heat sink (so-called heatsink). The above Heatslug, which is usually located on a metal plate of the power semiconductor component, is a metallic one on the circuit board for SMD assembly

Attachment area (so-called footprint) assigned, the area of the footprint on the printed circuit board corresponding approximately to the heatslug area of the semiconductor component.

In general, the heat is transferred from the circuit board via thermal holes, ie via metallized holes (also known as thermal vias) and via Thermal grease (thermal interface material) on a device housing

forwarded. Thermal vias can be placed under the heatslug or, for example, in the immediate vicinity in the circuit board. Since thermal vias generally extend perpendicular to the circuit board level, the heat can be dissipated in a short way, for example to a device housing.

Such semiconductor components built into a component housing are also used, for example, in charging devices for electromobility. Very high power losses occur during operation, making the cooling special

Importance.

Since high voltages are generated (for example for an 800 V battery), there are also high demands on the insulation. The requirements regarding insulation and overvoltage protection are specified in various standards, for example in the IEC 60664-1 standard (sometimes also referred to as the "Insuco standard"; Insuco = "Insulation Coordination").

In some applications, the use of thermal vias is not permitted due to electrical insulation regulations. On the other hand,

Standard printed circuit boards (PCBs) only have a small copper layer thickness per layer level (often only 70 micrometers, sometimes up to 105 or 200 micrometers, but only rarely more). Therefore, the

Power loss that the power component emits via its heatslug, using standard circuit board technology and using the

Standard footprint designs can no longer be adequately discharged.

To meet high requirements regarding electrical insulation and

Heat dissipation is known to start from that

Semiconductor component first electrical insulation and then a so-called

Heat spreading by means of an Al / Cu plate and the further heat dissipation takes place. In this regard, the so-called Thermal Clad Isolated Metal Substrate (protected designation IMS) is known from Bergquist-Henkel. There are other techniques which, although they allow good heat dissipation, do not provide sufficient required electrical insulation and which sometimes have other disadvantages, such as tolerances that make soldering difficult.

Overall, especially with regard to the standards mentioned, there is the problem that standard printed circuit boards cannot simultaneously achieve the electrical insulation required on the one hand and the required heat dissipation (i.e. heat dissipation) on the other. This leads to a conflict of objectives in the coordination of isolation.

Summary of the invention

Against this background, the present disclosure is based on the object of advantageously further developing a semiconductor component arrangement or a method for producing a semiconductor component arrangement or a cooling device for a semiconductor component arrangement. In particular, the aim is to be able to overcome at least some or all of the disadvantages mentioned above. In particular, a possibility for

Heat buffering can be created to cushion short-term power peaks associated with an increase in temperature.

According to a first aspect, a semiconductor component arrangement which has at least one semiconductor component and a printed circuit board is specified.

According to a further aspect, a method for producing the

Semiconductor component arrangement specified.

According to a third aspect of the present disclosure, an electrical circuit is specified that has the semiconductor component arrangement.

According to a fourth aspect, a cooling device for a

Semiconductor component arrangement specified. The semiconductor component arrangement has an - in particular first - metal block which is arranged between the semiconductor component and the printed circuit board, which is connected to an - in particular first - electrical connection of the semiconductor component by means of a soldered connection and which is connected to at least one conductor track of the printed circuit board by means of a further one Solder connection is connected. In particular, the metal block is exposed

Mounting surface of the conductor track is soldered. "Exposed" means here

in particular that the mounting surface - in particular for producing the further solder connection - is uncovered by solder mask. After the further soldering connection has been made, the mounting surface is covered in particular in places or completely with solder and covered by the first metal block. In one development, the conductor track is completely or partially formed by an etched copper layer, which is in particular attached to an insulating carrier of the circuit board.

In an expedient embodiment, the metal block has an extension in the direction away from the printed circuit board and towards the semiconductor component which is at least as large as the extension of the semiconductor component in this direction, measured from the first electrical connection in the direction away from the printed circuit board. If the semiconductor component is arranged in a housing, the extent of the semiconductor component is expanded

understood including the housing.

By integrating the metal block in this way, it can advantageously be achieved that - viewed from the direction of the semiconductor component heated during operation - the heat spreading, ie the broadening of the heat flow which favors heat dissipation by means of a wider heat conductor compared to a preceding heat conductor, even before the electrical insulation, which simultaneously creates a thermal barrier. In particular, a first heat spread can be achieved at the connection of the electrical connection to the metal block. A second heat spread can take place at the connection to the conductor track. In addition, there is a within the comparatively thick metal block Particularly good lateral spread of the heat dissipated by the semiconductor component can be achieved.

In this way, the thermal conductivity of the connection between the semiconductor component and the printed circuit board can be improved and the heat dissipation can be improved. In this way, standard-compliant insulation is also made possible, and the conflict of objectives in insulation coordination is advantageously resolved.

According to one embodiment, the semiconductor component arrangement has a metal body which is embedded in the printed circuit board. The metal block is connected to the metal body by means of the further solder connection. In particular, the metal body has the exposed mounting surface.

In a further development, the metal body represents a section of the conductor track, which is formed, in particular, from the etched copper layer.

For example, a surface of the conductor track facing away from a base body of the printed circuit board, including a surface of the metal body facing away from the base body of the printed circuit board, is arranged entirely in a single plane. In a further development, the metal body is prefabricated and subsequently attached to the base body of the printed circuit board.

A first heat spread can also be achieved here at the connection of the electrical connection to the metal block. A second heat spread can take place at the connection to a metal body embedded in the printed circuit board.

By means of the heat spread at the connections between electrical

Connection and metal block and between metal block and conductor track or

As a result, metal bodies can even achieve additive heat spreading. Another advantage is that the metal block and the metal body, if present, also have a heat buffer effect, so that it can also be effective as a heat sink. By increasing the mass of the thermally conductive materials and their spatial expansion improves the spread of heat in the various deeper layers and thus more effectively dissipates heat into a housing or to another heat sink. In addition, brief temperature increases caused by power peaks can be buffered by the increased thermal mass in the line path.

In one embodiment, the semiconductor component has at least one further electrical connection — preferably a plurality of further electrical connections. The semiconductor component arrangement contains at least one metal block group which has the first metal block and at least one further metal block - preferably a plurality of further metal blocks - wherein in particular each further metal block is assigned to one of the further electrical connections. The number of further metal blocks belonging to the metal block group preferably corresponds to the number of further electrical connections. The or each further metal block of the metal block group is by means of a respective solder connection between the or a respective further electrical connection of the semiconductor component and the printed circuit board

interposed. In particular, each of the further metal blocks is soldered to one of the further electrical connections on one side and soldered to a further conductor track of the printed circuit board on an opposite side.

This enables, for example, that each electrical connection can be assigned a metal block for electrically and thermally conductive connection to a printed circuit board.

In one embodiment, the semiconductor component is installed in a housing, the first electrical connection of the semi-conductor element being connected to a first metal plate fastened to the housing. Such metal plates have an exposed surface on the housing and are known as a so-called heatslug. In other words, the semiconductor component has a housing and the first electrical connection is formed by a surface of the first metal plate that is exposed on the housing. The dimensioning of the exposed surface primarily follows the requirements for heat dissipation; as a rule, the free surface is at least one square millimeter.

In a further development, a second electrical connection of the

Semiconductor device connected to a second metal plate attached to the housing - i.e. in particular formed by an exposed surface of the second metal plate. In addition, a third electrical connection of the

Semiconductor device connected to a third metal plate attached to the housing - i.e. in particular formed by an exposed surface of the third metal plate - and in particular a fourth electrical connection of the semiconductor component with a fourth metal plate attached to the housing - i.e. in particular formed by an exposed surface of the fourth metal plate - be connected.

In an alternative, preferred, development, however, the second electrical connection and any further electrical connections of the semiconductor component protrude from the housing as a pin of the connection concerned.

In one embodiment, the first metal block has a first end face and a second end face facing it is connected on its first end face by means of the soldered connection to a plate surface - this is in particular the exposed surface - of the first metal plate and on its second end face by means of the further soldered connection connected to the conductor track of the circuit board. Accordingly, each of the further metal blocks - in particular the second, third or fourth metal block - can each have a first

End face and a second end face facing opposite, on its first end face by means of the respective further soldered connection with a respective further electrical connection - i.e. in particular with the second or third or fourth electrical connection - the

Be connected semiconductor device and be connected at its second end face to a respective further conductor track of the circuit board by means of a solder connection. Such embodiments are particularly good for

Suitable for SMD mounting. The soldered connection on the first end face and / or the soldered connection on the second end face of the respective metal block can preferably be by means of

Reflow soldering. It is preferred that the conductor track which is connected to a metal block by means of a solder connection is part of an outer layer of the circuit board, or that each conductor track which is connected to a metal block by means of a solder connection is part of an outer layer of the circuit board.

In one embodiment, all of the first end faces of the metal blocks of the metal block group extend - these are in particular the first metal block and the further metal block or the further metal blocks, e.g. the second metal block or the second and third metal block or the second, third and fourth metal block - in a first plane and all second end faces of the metal blocks of the

Metal block group in a second plane, the first plane and the second plane being in particular parallel to one another.

In one embodiment, the metal blocks are of the metal block group

arranged laterally to each other. Side by side means adjacent to each other with respect to an arbitrarily oriented reference plane, the term side by side does not mean fixing to an arrangement in a row, but different arrangements are possible as required. The metal blocks are preferably in a plan view of a main extension plane of the

Printed circuit board staggered.

In a further development, the metal blocks of the metal block group are partially or completely encased on their lateral lateral surfaces by an electrically insulating jacket common to them. The shroud is

especially made of plastic; in other words, the casing is a plastic body with which the metal blocks are, for example, extrusion-coated. In particular, the metal block group is prefabricated. In other words, the metal blocks of the metal block group are fixed in place relative to one another by the sheathing, the fixed fixing preferably being in place before the connection — in particular before the soldering — of the sheathed Metal block group with the circuit board. In this way, the printed circuit board can be particularly easily populated with the encased metal block group and the component. A special simple and / or precise alignment of the

Metal blocks to one another and to the conductor tracks of the printed circuit board or the electrical connections of the component can be achieved in this way.

A simple and therefore inexpensive shaping can be achieved in that the metal block or that a respective metal block has a uniform cross section assigned to it in each plane parallel to the first plane and / or to the second plane. This means that when looking at a single metal block it has a uniform cross-section, but when looking at several metal blocks they can have the same or different cross-sections compared to one another in the planes mentioned. For example, the metal blocks are cuboid and in particular have sides parallel to the first and second planes. With regard to a suitable SMD assembly and / or advantageous heat spreading, the cross section of the first metal block can be larger, at least several times larger, than the cross section of the further metal block or as the cross section of each further metal block.

In one embodiment, the first end face of the first metal block is larger than the plate area of the first metal plate. In particular, the soldered connection between the first metal plate and the first metal block extends in the entire region in which the plate surface overlaps the first end face (16) of the first metal block. Particularly good heat spreading can be achieved in this way. For example, the first metal block protrudes laterally beyond the first metal plate. An edge length of the metal block in the direction in which it protrudes laterally beyond the metal plate is preferably at least 30% larger than that

Edge length of the metal plate in this direction.

In an expedient embodiment, each solder connection has one

Layer of solder. In a further embodiment points to the metal block or on the metal blocks, the respective first end face and the respective second end face have a passivation suitable for a soldering process.

In one embodiment, the first metal block has a first end face and a second end face facing it, is connected at its first end face to a plate surface of the first metal plate by means of the solder connection and at its second end face by means of the further solder connection to the first one embedded in the printed circuit board Connected metal body. In a further development, the second metal block has a first end face and a second end face pointing opposite, is on its first end face by means of a solder connection to the second electrical connection of the

Semiconductor component connected and connected at its second end face to a second metal body embedded in the circuit board. In addition, the third metal block can have a first end face and a second end face pointing opposite thereto, on its first end face by means of a

Solder connection to a third electrical connection of the semiconductor component and be connected at its second end face to a third metal body embedded in the printed circuit board, in particular

it is provided that a fourth metal block has a first end face and a second end face facing opposite, on its first end face by means of a solder connection with a fourth electrical connection of the

Semiconductor component is connected and is connected at its second end face to a fourth metal body embedded in the printed circuit board.

In one embodiment, the exposed mounting surface of the conductor track, on which the first metal block is soldered, or the first metal body embedded in the circuit board has a larger surface area than the first metal block in relation to the main plane of extent.

For example, the surface of the metal body or the mounting surface is in

Top view of the main extension plane of the printed circuit board by at least 30% larger than the area of the first metal block. This enables a further heat spread and a particularly high total heat spread. According to one embodiment, a pin is a second electrical

Connection and in particular a pin of a third electrical connection and in particular a pin of a fourth electrical connection of the

Semiconductor component is soldered onto respective further conductor tracks of the printed circuit board and / or onto further metal bodies embedded in the printed circuit board or alternatively soldered to further respective conductor tracks of the printed circuit board and / or onto further metal bodies inserted into the printed circuit board by means of push-through assembly. In this embodiment, the arrangement can have, for example, only the first metal block - and no metal block group with further metal blocks.

For soldering onto conductor tracks, the pins can preferably be designed as so-called SMD pins (SMD = surface mount device). Because of the first metal block, it should be noted that the SMD pins are provided with sufficient solder volume to compensate for the resulting height difference

bridge. According to a simple and inexpensive embodiment, there is a layer of solder on a respective metal block on its respective first end face and on its respective second end face in the area of the soldered connection and / or that there is between a respective pin and a conductor track soldered to the pin ( 8) there is a layer of solder in the area of the solder connection.

In one embodiment, the metal block consists of copper and / or the at least one further metal block consists of copper. Copper has both good electrical conductivity and good thermal thermal conductivity and also a heat storage capacity suitable for the invention. Other alloys containing copper in one embodiment are also conceivable for the metal block and / or the at least one further metal block. In view of the heat storage, which is also desirable, it is preferred that the metal block or that a respective metal block perpendicular to its first end face has a thickness which corresponds to a multiple of the thickness of the conductor tracks of the printed circuit board. In another embodiment, the one embedded in the circuit board

Metal body and / or a further metal body embedded in the circuit board - in particular the second and / or third and / or fourth metal body - in a direction perpendicular to the main plane of extension of the circuit board, a thickness which is at least a multiple of the thickness of the conductor track or the respective further Conductor in one to the respective metal body

adjacent area corresponds. In a further embodiment, the metal body and / or the further metal body (s) consist of copper.

In this respect, the or each metal body embedded in the circuit board can serve as a further heat sink (s) in addition to the metal block or the metal blocks and provide heat buffers in order to cushion short-term power peaks of the semiconductor component as the temperature rises.

The invention is particularly advantageous when, as in some preferred embodiments, the semiconductor component is one

Power semiconductor device, in particular by one

Power metal oxide semiconductor field effect transistor (power MOSFET). In particular, it can be a semiconductor component that generates a power loss of 2 watts or more when operated as intended and / or that heats up by at least 10 degrees Celsius when it is operated as intended. In particular, it can be a

Act semiconductor device that is designed for operation at 24 V with a current of at least 1 ampere or at 48 V with a current of 0.5 ampere, for example.

With regard to the circuit board, it is preferred that it is a

Standard circuit board deals. In one embodiment, the circuit board is a printed circuit. In a further training, the

Printed circuit board has two outer copper layers and between them three prepregs with a thickness of at least 0.4 millimeters or the printed circuit board has four copper layers and between two adjacent copper layers each has at least one prepreg, in an expedient embodiment three prepregs, in particular with a thickness of at least 0 , 4 millimeters. The term "three prepregs with a thickness of at least 0.4 millimeters "in particular understood that the three prepregs together have a total thickness of at least 0.4 millimeters." Prepregs "are understood in particular to mean plates which are reinforced with glass fabric (epoxy) resin, for example that under material known as FR-4. In particular, the prepregs are semi-finished textile fiber matrix pre-impregnated with reactive resins

Fierstellung the circuit board, preferably under temperature and / or

Pressurization are cured and are thus hardened in the finished circuit board. Such circuit boards are available as standard circuit boards.

In one embodiment, the circuit board is on its from that

Side facing away from the semiconductor component is connected in a heat-conducting manner, in particular by means of a thermal interface, to a heat sink, it being provided in particular that the heat sink is connected to a coolant circuit. In this way, particularly efficient dissipation of the heat generated by the semiconductor component during operation can be achieved.

By means of one or more of the described features, the total thermal resistance between a heat-generating one

Power semiconductor device and the heat sink using standard circuit boards can be significantly reduced compared to conventional techniques. The circuit board, also known as the substrate, which provides the basic electrical insulation required by the standards, which also creates a thermal barrier and which is located in the heat flow between the

Semiconductor device and the heat sink is located, according to a single or multiple heat spread in a large cross section of heat

flows through, so that a high heat flow can still flow. When

As an alternative or in addition to a liquid-cooled device, a heat sink can also be a device housing. There is extensive freedom of design with regard to the metal block or blocks. The

Arrangement is particularly advantageous for all such electronic modules that have a high power loss and that meet the requirements of Insulation coordination standards are sufficient, and these requirements can advantageously be met according to the present disclosure with a standard printed circuit board.

In one embodiment, the electrical circuit is a circuit of a charger (in particular a so-called onboard charger), a (power) output stage, a motor controller or a circuit of another device for the electrification of motor vehicles. In all applications, the semiconductor component arrangement enables effective heat dissipation of power semiconductor components that generate heat loss.

In a first step of a method for producing a

Semiconductor device arrangement will be the circuit board that

Semiconductor component, which has at least a first electrical connection, and at least one metal block provided. In an advantageous development, the prefabricated, encased metal block group with the first and the at least one further metal block and the casing is provided.

In a further method step, the first electrical contact is made with a first end face of the first metal block by means of a solder connection and, in particular subsequently, a second end face of the first metal block, which lies on the side of the first metal block opposite the first end face, by means of a solder connection with a Conductor of the circuit board or, if a first metal body is embedded in the circuit board, connected by means of the metal body integrated in the circuit board. In the case of providing one

Prefabricated, sheathed metal block group is particularly in a further process step - preferably at the same time with the production of the soldered connection between the conductor track or the metal body and the second end face of the first metal block and / or at the same time with the production of the soldered connection between the first electrical contact and the first end face of the first metal block - the further metal block (32, 33, 34) of the prefabricated, encased metal block group by means of a solder connection (14) between the another electrical connection (22, 23, 24) and the circuit board (5) interposed.

With regard to possible further developments, advantages and effects, reference is made to the rest of the description. In one embodiment, the first electrical connection with a metal plate (so-called heatslug) is one

Component housing of the semiconductor component connected and / or the metal plate is by means of a surface mounting process (so-called.

Surface-mounting technology = SMT) - in particular by means of reflow soldering - applied to the metal block serving as a heat sink and for heat spreading. In a further development, the heat sink is then fixed by means of a further SMT process - in particular by means of reflow soldering - on the circuit board, preferably on a conductor track or on a metal body embedded in the circuit board.

In one embodiment, the heat removal device has a plurality of metal blocks which are arranged laterally to one another and which are encased on their lateral jacket surfaces by an electrically insulating jacket that is common to them. The metal blocks are preferably made of copper. The casing is made in particular of plastic;

in particular, the metal blocks are extrusion-coated with the plastic sheathing. The cooling device with the encased metal blocks is preferably provided for soldering to a printed circuit board. In particular, the

Heat sink the prefabricated metal block group.

In one embodiment, each metal block has one across it

Shell surface extending first end face and a transverse to its

A second end surface extending on the lateral surface, a layer of solder being applied to each first end surface and every second end surface. Possible further training, effects and advantages are discussed in the rest

Description - especially with regard to the metal block group - reference. Brief description of the drawings

Preferred embodiments of the present invention are described below with reference to the accompanying figures. It shows:

Fig. 1 shows schematically a side view of an inventive

Cooling device according to a preferred embodiment;

FIG. 2 shows an end view of the cooling device shown in FIG. 1 in the viewing direction II there;

3 shows an end view of a heat removal device according to the invention in accordance with a second preferred exemplary embodiment;

Fig. 4 in a sectional view of an inventive

Flalbleiter component arrangement according to a first preferred

Embodiment;

Fig. 5 in a sectional view of an inventive

Flalbleiter component arrangement according to a second preferred

Embodiment;

Fig. 6a in a sectional view of an inventive

Flalbleiter component arrangement according to a third preferred

Embodiment and

Fig. 6b is a top view of that shown in Fig. 6a

Pile conductor component arrangement in the direction of view Vlb.

Description of the embodiments

The flat conductor component arrangement 1 shown in FIG. 4 comprises the cooling device 2 shown in FIGS. 1 and 2, so that the description in context. The semiconductor component arrangement 1 comprises a semiconductor component 3 which is installed in a housing 4 and which is therefore not shown in more detail in the figures. The example is a so-called power MOSFET, ie one

Power metal oxide semiconductor field effect transistor. The semiconductor component 3 is connected by means of the heat-dissipation device 2 to a printed circuit board 5, which in the example is three, one electrically and thermally in the illustration

Isolating intermediate layer 6 has summarized so-called prepregs, and two outer copper layers 7. Figure 4 shows schematically that the upper copper layer 7 comprises a plurality of conductor tracks 8 made of copper, which have the same reference numerals for simplification. In connection with FIGS. 1 and 2, it is clear that the copper layer 7 in the present exemplary embodiment comprises at least four conductor tracks 8, of which one conductor track is located on the left in FIG which are the three other conductor tracks 8 on the right side of the gap 9 and in turn from each other by means of another, in the

Cutting plane not visible, stripe-shaped and to the gap 9 transverse gaps are separated from each other. On their from that

Side facing away from the semiconductor component 3, the circuit board 5 is connected by means of a so-called thermal interface 10 to a heat sink 11, through which a coolant (for example water) flows through a coolant circuit, not shown, for heat dissipation.

The semiconductor component 3 has a first electrical connection 21, which is covered by the housing 4, a second electrical connection 22, a third electrical connection 23 and a fourth electrical connection 24, the third and fourth connections 23, 24 in FIG second connection 22 are covered.

The heat removal device 2 comprises a comparatively large first metal block 31, a comparatively smaller one in FIG

Sectional view shown second metal block 32 and a third metal block 33 and a fourth metal block 34, the size of the second metal block 32nd correspond and are arranged in the viewing direction of FIG. 4 behind the second metal block 32. The four metal blocks 31, 32, 33 and 34 functionally form a prefabricated metal block group for connecting the semiconductor component 3 to the printed circuit board 5. For this purpose, the first metal block 31 is arranged between the semiconductor components 3 located in the housing 4 and the printed circuit board 5, and the Metal blocks 32, 33 and 34 are arranged between each of the electrical connections 22, 23 and 24 and the printed circuit board 5.

In the example, the first electrical connection 21 is metallically connected to a first metal plate 13 (so-called heatslug) fastened to the housing 4. The metal plate 13 and thereby the first electrical connection 21 is electrically conductively connected to the first metal block 31 by means of a solder connection 14 which has the solder layer 15 cut in FIG. It can be seen from FIG. 1 that the solder layer 15 is applied to a first end face 16 of the first metal block 31. The first end face 16 of the first metal block 31 lies in a common first plane 18 together with a first

End face 16 of the second metal block 32, with a first end face 16 of the third metal block 33 and with a first end face 16 of the fourth

Accordingly, a second end face 17 of the first metal block 31 lies on the opposite side in a second plane 20 together with a second end face 17 of the second metal block 32, with a second end face 17 of the third metal block 33 and with a second end face 17 of the fourth Metal block 34. A solder tin layer 15 is applied to each first end face 16 and on every second end face 17 in the example. The first metal block 31 is connected in an electrically conductive manner to the conductor track 8 of the printed circuit board 5, which is provided on its second end face 17, by solder layer 15. As is clear from the figures, all layers of solder are uniformly designated by 15 for an overview, and all solder connections formed from one layer of solder 15 are uniformly designated by reference numeral 14 for an overview. FIG. 4 shows in the sectional view a plate surface 19 of the first metal plate 13, which was connected to the solder layer 15. As is particularly clear from FIGS. 1 and 2, the metal blocks 31, 32, 33, 34 are arranged laterally to one another. Figure 2 shows their in relation to the

Arrangement next to each other. In the example, the three metal blocks 32, 33, 34 have dimensions which are identical to one another and, with respect to a transverse direction Q of the heat removal device 2, are each the same

Intermediate distances arranged in a row. The metal block 31, which is larger in comparison, is spaced apart therefrom in a longitudinal direction L perpendicular to the transverse direction Q. Figure 1 shows that the lateral lateral surfaces 25 of the metal blocks

31 - 34 are encased in their almost entire height by a common, electrically insulating sheath 26 made of plastic. The metal blocks 31 - 34 together with the casing, which fixes the metal blocks 31 34 to one another in a stationary manner, form the prefabricated metal block group. In the

Equipping the circuit board 5 for the production of the semiconductor component arrangement 1, the metal block group with the coated metal blocks 31-34 is applied as one component to the circuit board and subsequently soldered to the conductor tracks 8 and / or the electrical connections 21-24.

In cross-sectional planes perpendicular to the end face 16, 17, the cross section of the first metal block 31 is in each case larger than the cross section of the others

Metal blocks 32-34. FIG. 4 shows that the first end face 16 of the first metal block 31 and the areal expansion of the solder layer 15 formed thereon are larger than the adjacent plate surface 19 of the metal plate 13, which is fastened to the housing 4 as a so-called heatslug.

It is also clear from FIG. 4 that a pin 22 of the second electrical connection 22, which is angled at its free end parallel to the solder layer 15 applied to the second metal block 32, by means of the

Solder layer 15 on the end face 16 of the second metal block facing it

32 is soldered. In its opposite end face 17, the metal block 32 is soldered by means of the solder layer 15 applied there on the conductor track 8 also shown in FIG. 4 and running to the right of the gap 9. In the exemplary embodiment it is provided that all metal blocks 31, 32, 33, 34 consist of copper.

The embodiment with a second, third and fourth electrical connection 22, 23, 24 in addition to the first electrical connection 21 is selected only as an example. If the semiconductor component 3 is, for example, a MOSFET, it usually has only the first 21 and two further electrical connections 22, 23. Accordingly, in addition to the first metal block 31, the cooling device in this case expediently has only two further metal blocks 32, 33. Embodiments with a larger number of further electrical connections and others

Metal blocks - e.g. five - are also conceivable.

Figure 3 shows a second preferred embodiment of a

Heat removal device 2 according to the invention. To connect two semiconductor components 3 to a printed circuit board 5, two metal block groups, each of which comprises the four metal blocks 31-34 shown in FIGS. 1 and 2, are encased by a common insulating jacket 26.

The second preferred exemplary embodiment of a shown in FIG

The semiconductor component arrangement 1 according to the invention differs from the embodiment in FIG. 4 in that only the first metal block 31 is present. The metal blocks 32-34 and the casing 26 are not present. The metal block 31 is soldered between the metal plate 13 (heatslug) of the housing 4 and a conductor 8 by means of the two solder connections 14, each formed by a layer of solder 15, and thereby in the thermal path between them

Semiconductor component 3 and the circuit board 5 interposed. A pin 22 'of the second electrical connection 22 of the semiconductor component 3 was in the

Compared to the embodiment of FIG. 4, it is extended and is soldered to its free, again angled longitudinal end by means of a solder connection 14 formed by a solder layer 15 on a conductor 8, which is electrically connected by means of the gap 9 from the conductor 8 electrically connected to the first electrical connection 21 is decoupled. As in FIG. 4, there are a pin 23 'of a third electrical connection 23 and a pin 24' of a fourth electrical connection 24 of the semiconductor component is covered by pin 22 ', but, like pin 22', is soldered to other conductor tracks 8 in a corresponding manner.

FIGS. 6a and 6b show a third preferred exemplary embodiment of a semiconductor component arrangement 1 according to the invention, again corresponding or comparable details to the preceding embodiments being identified by the same reference numerals. A first metal body 27 is inserted into the printed circuit board 5, a second metal body 28 is spaced laterally and a third metal body 29 is spaced in the direction of view from FIG. 6a, so that the respective exposed metal surface in the example is flush with an upper side of the printed circuit board 5. A first metal block 31, which, like the metal bodies 27-30, consists of copper, is soldered flat onto the first metal body 27 by means of a solder connection 14 formed from a solder tin layer 15. A semiconductor component 3, which is a power semiconductor component and is accommodated in a housing 4, is in turn soldered onto the opposite surface of the metal body 31 by means of a further solder connection 14 formed by a solder layer 15. A first electrical contact 22 of the semiconductor component 3 is in turn connected to the metal plate 13 which adjoins the solder tin layer 15.

As shown, the thermal cross section of the first metal plate 31 is larger than that of the metal plate 13 (heatslug), and the thermal cross section of the first metal body 27 is larger than the thermal cross section of the first metal block 31. There is thus a multiple, i.e. H. additive heat spread reached.

The first metal body 27 can be formed in the associated cavity of the printed circuit board 5, for example using masks, from a plurality of copper layers applied to one another.

In the example, the semiconductor component 3 also has a second electrical connection 2 and a third electrical connection 23, each of which pins 22 ′, 23 ′ lead out of the housing 4. Pins 22 'and 23' are angled. The pin 22 'runs through the angled section in the second metal body 28 introduced through hole, with the

Hole wall of pin 22 'has been soldered. The pin 23 'is in a corresponding manner through a through hole in the third metal body 29

passed through and soldered to the wall in an electrically conductive manner. In a viewing plane perpendicular to the circuit board 5, the thickness is thus

Metal body 27-29 is considerably larger than the thickness of the conductor tracks 8. The first metal body 27 and / or the second metal body 28 and / or the third metal body 29 can be electrically connected to a respective conductor track 8 of the printed circuit board 5 (not shown in FIG. 6) be connected.

The invention is not restricted to the exemplary embodiments by the description based on these. Rather, the invention encompasses every new feature and every combination of features, which in particular includes every combination of features in the exemplary embodiments and patent claims.

Claims

Claims:

1 . Semiconductor component arrangement (1), at least having one

Semiconductor component (3) which has a first electrical connection (21) and at least one further electrical connection (22, 23, 24), and a printed circuit board (5), characterized in that the

Semiconductor component arrangement (1) contains a prefabricated metal block group, the metal block group having a first metal block (31) which is arranged between the semiconductor component (3) and the printed circuit board (5) and is connected to the first electrical connection (21 ) the semiconductor component (3) is connected by means of a solder connection (14) and is connected to at least one conductor track (8) of the circuit board (5) by means of a further solder connection (14),

wherein the metal block group has at least one further metal block (32, 33, 34) which is interposed between the further electrical connection (22, 23, 24) and the printed circuit board (5) by means of a solder connection (14), and wherein the metal blocks (31, 32, 33, 34) of the prefabricated metal block group are arranged laterally to one another and are partially or completely encased on their lateral jacket surfaces (25) by an electrically insulating jacket (26) which is common to them and is in particular made of plastic .

2. Semiconductor component arrangement (1) according to the preceding claim, wherein a section of the conductor track (8) is formed by a metal body (27) which is embedded in the printed circuit board (5), the first metal block (31) between the semiconductor component ( 3) and the metal body (27) and the first metal block (31) is connected to the first metal body let into the circuit board (5) by means of (27) the further soldered connection (14).

3. Semiconductor component arrangement (1) according to one of the preceding claims, characterized in that a pin (22 ') of a second electrical connection (22) and in particular a pin (23') of a third electrical

Connection (23) and in particular a pin (24 ') of a fourth electrical

Connection (24) of the semiconductor component (3) on conductor tracks (8)

Printed circuit board (5) and / or metal body (27, 28, 29) are soldered on or alternatively are soldered on by means of push-through assembly on conductor tracks (8) of the printed circuit board (5) and / or on metal bodies (27, 28, 29) embedded in the printed circuit board (5).

4. The semiconductor component arrangement (1) according to one of the preceding claims, characterized in that the semiconductor component (3) is installed in a housing (4), the first electrical connection (21) of the

Semi-conductor element (3) with a first attached to the housing (4)

Metal plate (13) is connected.

5. Semiconductor component arrangement (1) according to the preceding claim, characterized in that the first metal block (31) has a first end face (16) and an opposing second end face (17) on its first end face (16) by means of Solder connection (14) is connected to a plate surface (19) of the first metal plate (13) and is connected at its second end face (17) to the conductor track (8) of the circuit board (5) by means of the further solder connection (14).

6. The semiconductor component arrangement (1) according to the preceding claim, characterized in that the one further metal block (32, 33, 34) or each of the further metal blocks (32, 33, 34) has a first end face (16) and one has the opposite end face (17), on its first end face (16) by means of a solder connection (14) to the further electrical connection (22, 23, 24) or one of the further electrical connections (22, 23, 24) of the Semiconductor component (3) is connected and is connected on its second end face (17) to a further conductor track (8) of the printed circuit board (5) by means of a further solder connection (14) and

that all the first end faces (16) of the metal blocks (31, 32, 33, 34) of the

Metal block group extend in a first plane (18) and that all second end faces (17) of the metal blocks (31, 32, 33, 34) of the metal block group extend in a second plane (20), the first plane (18th ) and the second plane (20) are in particular parallel to one another.

7. The semiconductor component arrangement (1) according to one of the preceding claims, characterized in that the first end face (16) of the first metal block (31) is larger than the plate area (19) of the first metal plate (13) and in particular that the soldered connection (14) between the first

Metal plate (13) and the first metal block (31) in the entire area in which the plate surface (19) overlaps the first end face (16) of the first metal block (31).

8. The semiconductor component arrangement (1) according to claim 2 or one of claims 3 to 7 with direct or indirect reference to claim 2, characterized in that the first in the circuit board (5) embedded

Metal body (27) with respect to a main extension plane of the printed circuit board (5) is larger in area compared to the first metal block (31)

Extension.

9. The semiconductor component arrangement (1) according to one of the preceding claims, characterized in that the metal block (31) or that a respective metal block (31, 32, 33, 34) perpendicular to its first end face (16) has a thickness which corresponds to a multiple of the thickness of the conductor tracks (8) of the circuit board (5).

10. The semiconductor component arrangement (1) according to claim 2 or one of claims 3 to 9 with direct or indirect reference back to claim 2, characterized in that the embedded in the circuit board (5) metal body (27) in a to the main plane of extent of the circuit board (5) vertical direction has a thickness which corresponds to at least a multiple of the thickness of the conductor track (8) in an area adjacent to the metal body (27).

1 1. Semiconductor component arrangement (1) according to one of the preceding claims, characterized in that the circuit board (5) on its side facing away from the semiconductor component (3) is connected in a heat-conducting manner, in particular by means of a thermal interface (10), to a heat sink (1 1) is where In particular, it is provided that the heat sink (1 1) is connected to a coolant circuit.

12. A method for producing a semiconductor component arrangement (1) according to one of the preceding claims, comprising the method steps:

Providing the printed circuit board (5), the semiconductor component (3) and the prefabricated, encased metal block group,

- connecting the first electrical contact (21) to a first end face (16) of the first metal block (31) of the prefabricated, encased metal block group by means of a solder connection (14) and, in particular subsequently,

- Connecting a second end face (17) of the first metal block (31) of the prefabricated, encased metal block group, which on the to the first

End face (16) opposite side of the first metal block (31), by means of a solder connection (14) with a conductor track (8) of the circuit board (5) or, if a first metal body (27) is embedded in the circuit board (5), by means of of the metal body integrated in the circuit board (5) and

- Interposing the further metal block (32, 33, 34) of the prefabricated, encased metal block group by means of a solder connection (14) between the further electrical connection (22, 23, 24) and the printed circuit board (5).

13. heat dissipation device (2) for soldering onto a printed circuit board (5) for a semiconductor component arrangement (1), in particular for a

Semiconductor component arrangement (1) according to one of the preceding claims, comprising: a plurality of metal blocks (31, 32, 33, 34), in particular made of copper, which are arranged laterally to one another and on their lateral sides

Shell surfaces (25) of a common, electrically insulating

Sheath (26), which is made in particular of plastic, are sheathed, each metal block (31, 32, 33, 34) having a first end face (16) extending transversely to its outer surface (25) and a first end face (16) transverse to its outer surface ( 25) extending second end face (17) and wherein a solder layer (15) is applied to each first end face (16) and on every second end face (17).