EP3864423A4 - Compensation de défaut d'alignement de référence lors de l'inspection de pièces - Google Patents
Compensation de défaut d'alignement de référence lors de l'inspection de pièces Download PDFInfo
- Publication number
- EP3864423A4 EP3864423A4 EP19871326.5A EP19871326A EP3864423A4 EP 3864423 A4 EP3864423 A4 EP 3864423A4 EP 19871326 A EP19871326 A EP 19871326A EP 3864423 A4 EP3864423 A4 EP 3864423A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- misaligment
- compensating
- parts
- during inspection
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformations in the plane of the image
- G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/136—Segmentation; Edge detection involving thresholding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
- G06T7/75—Determining position or orientation of objects or cameras using feature-based methods involving models
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Quality & Reliability (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Signal Processing (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Evolutionary Computation (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Analysis (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862744746P | 2018-10-12 | 2018-10-12 | |
US16/357,590 US10475179B1 (en) | 2018-10-12 | 2019-03-19 | Compensating for reference misalignment during inspection of parts |
PCT/US2019/055350 WO2020076919A1 (fr) | 2018-10-12 | 2019-10-09 | Compensation de défaut d'alignement de référence lors de l'inspection de pièces |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3864423A1 EP3864423A1 (fr) | 2021-08-18 |
EP3864423A4 true EP3864423A4 (fr) | 2021-12-15 |
Family
ID=68466308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19871326.5A Pending EP3864423A4 (fr) | 2018-10-12 | 2019-10-09 | Compensation de défaut d'alignement de référence lors de l'inspection de pièces |
Country Status (7)
Country | Link |
---|---|
US (1) | US10475179B1 (fr) |
EP (1) | EP3864423A4 (fr) |
JP (1) | JP7479389B2 (fr) |
KR (1) | KR20210104028A (fr) |
CN (1) | CN113454445A (fr) |
SG (1) | SG11202103585TA (fr) |
WO (1) | WO2020076919A1 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10902620B1 (en) * | 2019-04-18 | 2021-01-26 | Applied Materials Israel Ltd. | Registration between an image of an object and a description |
CN113077467B (zh) * | 2021-06-08 | 2021-08-31 | 深圳市华汉伟业科技有限公司 | 一种目标物体的边缘缺陷检测方法及装置、存储介质 |
CN113752260B (zh) * | 2021-09-07 | 2023-12-26 | 京东方科技集团股份有限公司 | 一种取料定位修正方法及装置 |
US20230108539A1 (en) * | 2021-10-06 | 2023-04-06 | Kla Corporation | Design-assisted large field of view metrology |
CN114623781B (zh) * | 2022-04-28 | 2024-05-10 | 农业农村部南京农业机械化研究所 | 基于图像的绿肥等农作物种子外形尺寸测量方法及测量系统 |
CN114646265B (zh) * | 2022-05-24 | 2022-07-22 | 四川英创力电子科技股份有限公司 | 一种精密检测电路板上线路线宽的检测装置及方法 |
CN115049669A (zh) * | 2022-08-16 | 2022-09-13 | 如皋富美龙金属制品有限公司 | 金属缺陷识别方法 |
US20240112326A1 (en) * | 2022-09-30 | 2024-04-04 | Kla Corporation | Inspection of adaptive patterned workpieces with dynamic design and deep learning-based rendering |
CN116305642B (zh) * | 2023-03-09 | 2024-05-10 | 之江实验室 | 永磁同步电机公差敏感度的分析方法及其装置及计算机可读存储介质 |
CN116952826B (zh) * | 2023-09-19 | 2023-12-05 | 江苏乔科科技有限公司 | 一种pcb板抗腐蚀性检测系统 |
CN117420152B (zh) * | 2023-12-19 | 2024-03-19 | 聚时科技(深圳)有限公司 | 视觉检测方法、装置、计算机设备及计算机可读存储介质 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5495535A (en) * | 1992-01-31 | 1996-02-27 | Orbotech Ltd | Method of inspecting articles |
US20150228063A1 (en) * | 2012-10-15 | 2015-08-13 | Hitachi High-Technologies Corporation | Pattern Inspecting and Measuring Device and Program |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6427024B1 (en) | 1999-04-02 | 2002-07-30 | Beltronics, Inc. | Apparatus for and method of automatic optical inspection of electronic circuit boards, wafers and the like for defects, using skeletal reference inspection and separately programmable alignment tolerance and detection parameters |
US20020038510A1 (en) * | 2000-10-04 | 2002-04-04 | Orbotech, Ltd | Method for detecting line width defects in electrical circuit inspection |
US7127099B2 (en) | 2001-05-11 | 2006-10-24 | Orbotech Ltd. | Image searching defect detector |
US6829382B2 (en) * | 2001-06-13 | 2004-12-07 | Shih-Jong J. Lee | Structure-guided automatic alignment for image processing |
US7570796B2 (en) * | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US8150140B2 (en) * | 2008-12-22 | 2012-04-03 | Ngr Inc. | System and method for a semiconductor lithographic process control using statistical information in defect identification |
JP5254270B2 (ja) | 2010-04-09 | 2013-08-07 | 株式会社ニューフレアテクノロジー | 検査方法および検査装置 |
US10102619B1 (en) * | 2011-03-28 | 2018-10-16 | Hermes Microvision, Inc. | Inspection method and system |
CN104359403B (zh) * | 2014-11-21 | 2017-03-29 | 天津工业大学 | 基于亚像素边缘算法的平面零件尺寸测量方法 |
MX361397B (es) * | 2014-12-22 | 2018-12-04 | Pirelli | Método y aparato para detectar defectos en neumáticos en un proceso de producción de neumáticos. |
CN106815830B (zh) * | 2016-12-13 | 2020-01-03 | 中国科学院自动化研究所 | 图像的缺陷检测方法 |
CN106600600A (zh) * | 2016-12-26 | 2017-04-26 | 华南理工大学 | 基于特征匹配的晶圆缺陷检测方法 |
CN108447070B (zh) * | 2018-03-15 | 2021-08-10 | 中国科学院沈阳自动化研究所 | 一种基于像素向量不变关系特征的工业零件缺损检测算法 |
-
2019
- 2019-03-19 US US16/357,590 patent/US10475179B1/en active Active
- 2019-10-09 KR KR1020217014321A patent/KR20210104028A/ko unknown
- 2019-10-09 WO PCT/US2019/055350 patent/WO2020076919A1/fr unknown
- 2019-10-09 JP JP2021545361A patent/JP7479389B2/ja active Active
- 2019-10-09 SG SG11202103585TA patent/SG11202103585TA/en unknown
- 2019-10-09 EP EP19871326.5A patent/EP3864423A4/fr active Pending
- 2019-10-09 CN CN201980082521.7A patent/CN113454445A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5495535A (en) * | 1992-01-31 | 1996-02-27 | Orbotech Ltd | Method of inspecting articles |
US20150228063A1 (en) * | 2012-10-15 | 2015-08-13 | Hitachi High-Technologies Corporation | Pattern Inspecting and Measuring Device and Program |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020076919A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP7479389B2 (ja) | 2024-05-08 |
CN113454445A (zh) | 2021-09-28 |
SG11202103585TA (en) | 2021-05-28 |
US10475179B1 (en) | 2019-11-12 |
KR20210104028A (ko) | 2021-08-24 |
EP3864423A1 (fr) | 2021-08-18 |
WO2020076919A1 (fr) | 2020-04-16 |
JP2022508763A (ja) | 2022-01-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20210507 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20211112 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G06T 7/60 20170101ALN20211108BHEP Ipc: G01R 31/311 20060101ALI20211108BHEP Ipc: G06F 30/398 20200101ALI20211108BHEP Ipc: G03F 1/84 20120101ALI20211108BHEP Ipc: G06T 7/00 20170101ALI20211108BHEP Ipc: G01R 31/308 20060101AFI20211108BHEP |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) |