EP3861048A1 - Hardener for epoxy-resin adhesives - Google Patents
Hardener for epoxy-resin adhesivesInfo
- Publication number
- EP3861048A1 EP3861048A1 EP19773880.0A EP19773880A EP3861048A1 EP 3861048 A1 EP3861048 A1 EP 3861048A1 EP 19773880 A EP19773880 A EP 19773880A EP 3861048 A1 EP3861048 A1 EP 3861048A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- amine
- hardener
- bis
- epoxy resin
- propylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 61
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 59
- 239000000853 adhesive Substances 0.000 title claims abstract description 53
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 52
- 239000004848 polyfunctional curative Substances 0.000 title claims abstract description 45
- 150000001412 amines Chemical group 0.000 claims abstract description 88
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- -1 1,2-ethylene, 1,2-propylene Chemical group 0.000 claims description 73
- 239000000203 mixture Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000835 fiber Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 229920000768 polyamine Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- OMKZWUPRGQMQJC-UHFFFAOYSA-N n'-[3-(dimethylamino)propyl]propane-1,3-diamine Chemical compound CN(C)CCCNCCCN OMKZWUPRGQMQJC-UHFFFAOYSA-N 0.000 claims description 6
- ACYBVNYNIZTUIL-UHFFFAOYSA-N n'-benzylethane-1,2-diamine Chemical compound NCCNCC1=CC=CC=C1 ACYBVNYNIZTUIL-UHFFFAOYSA-N 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 229920001281 polyalkylene Polymers 0.000 claims description 5
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 5
- 125000004955 1,4-cyclohexylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:1])C([H])([H])C([H])([H])C1([H])[*:2] 0.000 claims description 4
- AMNPXXIGUOKIPP-UHFFFAOYSA-N [4-(carbamothioylamino)phenyl]thiourea Chemical compound NC(=S)NC1=CC=C(NC(N)=S)C=C1 AMNPXXIGUOKIPP-UHFFFAOYSA-N 0.000 claims description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 4
- 239000002987 primer (paints) Substances 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 3
- 239000013615 primer Substances 0.000 claims description 3
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 abstract description 16
- 239000010959 steel Substances 0.000 abstract description 15
- 230000009477 glass transition Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000007983 Tris buffer Substances 0.000 description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 17
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000004567 concrete Substances 0.000 description 8
- 239000000470 constituent Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 7
- 238000010276 construction Methods 0.000 description 7
- 239000003085 diluting agent Substances 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 6
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 5
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical class NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 5
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 description 4
- RREANTFLPGEWEN-MBLPBCRHSA-N 7-[4-[[(3z)-3-[4-amino-5-[(3,4,5-trimethoxyphenyl)methyl]pyrimidin-2-yl]imino-5-fluoro-2-oxoindol-1-yl]methyl]piperazin-1-yl]-1-cyclopropyl-6-fluoro-4-oxoquinoline-3-carboxylic acid Chemical compound COC1=C(OC)C(OC)=CC(CC=2C(=NC(\N=C/3C4=CC(F)=CC=C4N(CN4CCN(CC4)C=4C(=CC=5C(=O)C(C(O)=O)=CN(C=5C=4)C4CC4)F)C\3=O)=NC=2)N)=C1 RREANTFLPGEWEN-MBLPBCRHSA-N 0.000 description 4
- 102100025991 Betaine-homocysteine S-methyltransferase 1 Human genes 0.000 description 4
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 description 4
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 description 4
- 101000933413 Homo sapiens Betaine-homocysteine S-methyltransferase 1 Proteins 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 241000446313 Lamella Species 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 4
- 230000029936 alkylation Effects 0.000 description 4
- 238000005804 alkylation reaction Methods 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 description 4
- 239000004568 cement Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 238000005932 reductive alkylation reaction Methods 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- IAUKWGFWINVWKS-UHFFFAOYSA-N 1,2-di(propan-2-yl)naphthalene Chemical compound C1=CC=CC2=C(C(C)C)C(C(C)C)=CC=C21 IAUKWGFWINVWKS-UHFFFAOYSA-N 0.000 description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 3
- AVWGFHZLPMLKBL-UHFFFAOYSA-N 2-[(4-methoxyphenoxy)methyl]oxirane Chemical compound C1=CC(OC)=CC=C1OCC1OC1 AVWGFHZLPMLKBL-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- 239000006004 Quartz sand Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000002168 alkylating agent Substances 0.000 description 3
- 229940100198 alkylating agent Drugs 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 229960004889 salicylic acid Drugs 0.000 description 3
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 3
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 2
- KWOIWTRRPFHBSI-UHFFFAOYSA-N 4-[2-[3-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(N)=CC=2)=CC=1C(C)(C)C1=CC=C(N)C=C1 KWOIWTRRPFHBSI-UHFFFAOYSA-N 0.000 description 2
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 2
- HESXPOICBNWMPI-UHFFFAOYSA-N 4-[2-[4-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=C(C(C)(C)C=2C=CC(N)=CC=2)C=CC=1C(C)(C)C1=CC=C(N)C=C1 HESXPOICBNWMPI-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 2
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- AMIMRNSIRUDHCM-UHFFFAOYSA-N Isopropylaldehyde Chemical compound CC(C)C=O AMIMRNSIRUDHCM-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000007868 Raney catalyst Substances 0.000 description 2
- 229910000564 Raney nickel Inorganic materials 0.000 description 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 2
- 239000003677 Sheet moulding compound Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 2
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
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- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- DTSDBGVDESRKKD-UHFFFAOYSA-N n'-(2-aminoethyl)propane-1,3-diamine Chemical compound NCCCNCCN DTSDBGVDESRKKD-UHFFFAOYSA-N 0.000 description 1
- IRYWPHGCDAOHJJ-UHFFFAOYSA-N n'-(3-aminopropyl)-2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCNCCCN IRYWPHGCDAOHJJ-UHFFFAOYSA-N 0.000 description 1
- LFEPPILEVCKNJN-UHFFFAOYSA-N n'-(cyclohexylmethyl)ethane-1,2-diamine Chemical compound NCCNCC1CCCCC1 LFEPPILEVCKNJN-UHFFFAOYSA-N 0.000 description 1
- QRNYLVMUJRSIMH-UHFFFAOYSA-N n'-(naphthalen-1-ylmethyl)ethane-1,2-diamine Chemical compound C1=CC=C2C(CNCCN)=CC=CC2=C1 QRNYLVMUJRSIMH-UHFFFAOYSA-N 0.000 description 1
- IZBVZYNGZBUGAZ-UHFFFAOYSA-N n'-[2-(benzylamino)ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCC1=CC=CC=C1 IZBVZYNGZBUGAZ-UHFFFAOYSA-N 0.000 description 1
- YWBQSPXIVTUELU-UHFFFAOYSA-N n'-[2-(benzylamino)ethyl]propane-1,3-diamine Chemical compound NCCCNCCNCC1=CC=CC=C1 YWBQSPXIVTUELU-UHFFFAOYSA-N 0.000 description 1
- XXOQMYGARAONKF-UHFFFAOYSA-N n'-[2-[2-(benzylamino)ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCC1=CC=CC=C1 XXOQMYGARAONKF-UHFFFAOYSA-N 0.000 description 1
- CAOBWNHRKKGJEA-UHFFFAOYSA-N n'-[2-[2-[2-(benzylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCC1=CC=CC=C1 CAOBWNHRKKGJEA-UHFFFAOYSA-N 0.000 description 1
- AZZHHQHXUXFIJP-UHFFFAOYSA-N n,n'-bis(1-aminopentan-3-yl)-2-methylpentane-1,5-diamine Chemical compound NCCC(CC)NCCCC(C)CNC(CC)CCN AZZHHQHXUXFIJP-UHFFFAOYSA-N 0.000 description 1
- BHXZPZYTQZQCHR-UHFFFAOYSA-N n-[[3-(aminomethyl)phenyl]methyl]-2-ethylhexan-1-amine Chemical compound CCCCC(CC)CNCC1=CC=CC(CN)=C1 BHXZPZYTQZQCHR-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000010466 nut oil Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- WTSXICLFTPPDTL-UHFFFAOYSA-N pentane-1,3-diamine Chemical compound CCC(N)CCN WTSXICLFTPPDTL-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 239000011178 precast concrete Substances 0.000 description 1
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical class OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- NMWCVZCSJHJYFW-UHFFFAOYSA-M sodium;3,5-dichloro-2-hydroxybenzenesulfonate Chemical compound [Na+].OC1=C(Cl)C=C(Cl)C=C1S([O-])(=O)=O NMWCVZCSJHJYFW-UHFFFAOYSA-M 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- PFNFFQXMRSDOHW-UHFFFAOYSA-N spermine Chemical compound NCCCNCCCCNCCCN PFNFFQXMRSDOHW-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920000638 styrene acrylonitrile Polymers 0.000 description 1
- 239000011145 styrene acrylonitrile resin Substances 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003566 thiocarboxylic acids Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical class C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/502—Polyalkylene polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Definitions
- the invention relates to the field of hardeners for epoxy resins, epoxy resin adhesives and their use for bonding, in particular steel.
- Epoxy resin adhesives that can be hardened at room temperature are used for many applications, for example for reinforcing buildings using steel lamellas, for construction using prefabricated concrete parts, for fixing components such as railings, parapets or door frames or for repairs such as this Filling edges, holes or joints.
- they For applications in the construction industry, they must be usable under construction site conditions; easy processability and reliable and quick curing at ambient temperatures outdoors are particularly important.
- they should have high strength and adhesive strength on typical building materials such as concrete, steel and plastics.
- the adhesive must not be too brittle for a high adhesive force, since otherwise it can break even at low loads despite good adhesion.
- epoxy resin adhesives from the prior art contain amino-functional adducts of polyamines such as triethylene tetramine or isophorone diamine with aromatic epoxy resins as hardeners.
- polyamines such as triethylene tetramine or isophorone diamine
- aromatic epoxy resins as hardeners.
- Such adducts enable quick curing and high strength.
- the separate production of such adducts is complex and causes high viscosities, which makes processing, loading with fillers and wetting of the substrate surfaces more difficult.
- dilution with solvents is not desirable for environmental reasons. If such amines are used in unadducted form as hardeners, the materials obtained with them are typically rather brittle, which is reflected in reduced strength and adhesive force.
- such amines are susceptible to blushing, ie salt formation with carbon dioxide from the air, especially in cold and damp conditions.
- Alkylated amines as described in EP 2,151, 461, EP 2,943,464, WO 2016/023839, EP 3,138,863 or EP 3,144,335 are significantly less sensitive on blushing. In the prior art, they are mainly used as a hardener for epoxy resin coatings, where a low viscosity and a low tendency to blushing effects are particularly important. If such alkylated amines are used as hardeners for epoxy resin adhesives, they result in inadequate adhesive forces, particularly on steel, and a low glass transition temperature.
- the object of the present invention is therefore to provide a hardener for epoxy resins which overcomes the disadvantages of the prior art with regard to production, viscosity, blushing, adhesive force and glass transition temperature.
- the hardener according to the invention is based on a certain combination of at least one alkylated amine A1 and at least one amine A2, which is a dimethylaminopolyalkylene amine.
- the hardener according to the invention is easy to produce, low-viscosity and not sensitive to blushing. It enables low-emission epoxy resin adhesives with good processability, a sufficiently long pot life and open time with fast curing, high strength with surprisingly high adhesive forces, especially on steel, and a sufficiently high glass transition temperature.
- the invention relates to a hardener for epoxy resins containing at least one amine A1 of the formula (I) and at least one amine A2 of the formula (II),)
- A represents an alkylene radical with 2 to 10 C atoms which optionally contains nitrogen atoms or cyclic or aromatic components
- Y represents an alkyl, cycloalkyl or aralkyl radical having 1 to 20 carbon atoms, x represents 1 or 2, and
- weight ratio between amine A1 and amine A2 is in the range of 20/1 to 1/2.
- the “primary amino group” refers to an amino group that is attached to a single organic residue and carries two hydrogen atoms
- “secondary amino group” refers to an amino group that is bonded to two organic radicals, which can also be part of a ring, and has a hydrogen atom
- the term “tertiary amino group” refers to an amino group that is attached to three organic radicals, which can also be part of one or more rings in groups of two or three, and does not carry a hydrogen atom.
- the “hydrogen amine” refers to the hydrogen atoms of primary and secondary amino groups.
- amine hydrogen equivalent weight is the mass of an amine or an amine-containing composition which contains one molar equivalent of amine hydrogen.
- Substance names such as polyamine or polyepoxide beginning with “poly” refer to substances that formally contain two or more of the functional groups in their name per molecule.
- a “thinner” is a substance that is soluble in an epoxy resin and lowers its viscosity, which is not chemically incorporated into the epoxy resin polymer during curing.
- the “molecular weight” is the molar mass (in grams per mole) of a molecule.
- the “average molecular weight” is the number average M n of a poly-disperse mixture of oligomeric or polymeric molecules, which is usually determined using gel permeation chromatography (GPC) against polystyrene as the standard.
- GPC gel permeation chromatography
- the “pot life” refers to the processing time of an epoxy resin composition, ie the maximum possible time between the mixing of the components and the application of the mixed composition, in which it is in a sufficiently flowable state and can wet the substrate surfaces.
- the “open time” of an adhesive is the maximum possible time for a positive connection between the application of the adhesive and the joining of the parts to be glued.
- room temperature A temperature of 23 ° C is referred to as "room temperature”.
- A is preferably a divalent radical selected from the group consisting of 1,2-ethylene, 1,2-propylene, 1,3-propylene, 1,4-butylene, 1,3-butylene, 2-methyl-1 , 2-propylene, 1, 3-pentylene, 1, 5-pentylene, 2,2-dimethyl-1, 3-propylene, 1, 6-hexylene, 2-methyl-1, 5-pentylene, 1, 7-heptylene , 1, 8-octylene, 2,5-dimethyl-1, 6-hexylene, 1, 9-nonylene, 2,2 (4), 4-trimethyl-1, 6-hexylene, 1, 10-decylene, 1, 11 -ndene-cylene, 2-butyl-2-ethyl-1, 5-pentylene, 1, 12-dodecylene, 1, 2-cyclohexylene, 1, 3-cyclohexylene, 1, 4-cyclohexylene, (1, 5 , 5-Trimethylcyclohexan-1-yl) methan-1, 3, 4 (2)
- 1,4-cyclohexylene-bis methylene
- 1,3-phenylene-bis methylene
- 1,4-phenylene-bis methylene
- 3-aza-1,5-pentylene 3,6-diaza-1 , 8-octylene, 3,6,9-triaza-1, 11-undecylene, 3-aza-1, 6-hexylene or 3,7-diaza-1, 9-nonylene.
- the radical A is particularly preferably free of nitrogen atoms. Such a hardener is particularly less sensitive to blushing effects.
- A thus stands for a divalent radical selected from the group consisting of 1,2-ethylene, 1,2-propylene, 1,3-propylene, 1,4-butylene, 1,3-butylene, 2-methyl-1, 2-propylene, 1, 3-pentylene, 1, 5-pentylene, 2,2-dimethyl-1, 3-propylene, 1, 6-hexylene, 2-methyl-1, 5-pentylene, 1, 7-heptylene, 1, 8-octylene, 2,5-dimethyl-1, 6-hexylene, 1, 9-nonylene, 2,2 (4), 4-trimethyl-1, 6-hexylene, 1, 10-decylene, 1, 11 -Ndecylene, 2-butyl-2-ethyl-1, 5-pentylene, 1, 12-dodecylene, 1, 2-cyclohexylene, 1, 3-cyclohexylene, 1, 4-cyclohexy
- These amines A1 of the formula (I) are comparatively low-viscosity and enable adhesives with good processability.
- A is particularly preferably 1,2-ethylene or 1,2-propylene. These amines A1 of the formula (I) enable adhesives with a particularly low tendency to yellow.
- A is 1,2-ethylene.
- These amines A1 of the formula (I) are particularly low-viscosity, particularly easy to obtain and enable particularly rapid curing.
- Y is preferably flexyl, 2-ethylhexyl, octyl, nonyl, decyl, undecyl, dodecyl or an optionally substituted 1-phenylethyl-, 2-phenylethyl-,
- Y particularly preferably represents a radical selected from 2-ethylhexyl, 2-phenylethyl, benzyl, 1-naphthylmethyl and cyclohexylmethyl.
- Y very particularly preferably represents benzyl.
- the amine A1 of the formula (I) is preferably selected from the group consisting of N-benzyl-1, 2-ethanediamine, N- (1-naphthylmethyl) -1, 2-ethanediamine, N-cyclohexylmethyl-1, 2- ethanediamine, N-benzyl-1, 2-propanediamine, N-benzyl-1, 3-bis (aminomethyl) benzene, N- (2-ethylhexyl) -1, 3-bis (aminomethyl) benzene, N- (2nd -Phenylethyl) - 1, 3-bis (aminomethyl) benzene (constituent of styrenated 1, 3-bis (aminomethyl) - benzene, available as Gaskamine ® 240 from Mitsubishi Gas Chemical), N-benzyldiethylenetriamine, N
- amine A1 of formula (I) is N-benzyl-1, 2-ethanediamine. This enables particularly fast curing and particularly high adhesive forces.
- the amine A1 of the formula (I) is preferably used as part of a reaction mixture from the partial alkylation of at least one amine of the formula A (NFl2) 2 with at least one alkylating agent.
- the alkylation is preferably a reductive alkylation, an aldehyde or ketone and hydrogen being used as the alkylating agent.
- the reductive alkylation is preferably carried out in the presence of a suitable catalyst.
- a suitable catalyst Palladium on carbon (Pd / C), platinum on carbon (Pt / C), Adams catalyst or Raney nickel, in particular palladium on carbon or Raney nickel, are preferred as catalysts.
- the reductive alkylation is preferably carried out in a pressure apparatus at a hydrogen pressure of 5 to 150 bar, in particular 10 to 100 bar. This can be done in a batch process or preferably in a continuous process.
- the reductive alkylation is preferably carried out at a temperature in the range from 40 to 120 ° C., in particular 60 to 100 ° C.
- set diamine is at least partially removed from the reaction mixture, in particular by means of stripping. If desired, the reaction mixture can then be further purified, in particular by at least partially removing the corresponding dialkylated amine from the monoalkylated amine A1 of the formula (I) by distillation.
- X is preferably 1.
- B is preferably 1,3-propylene.
- the amine A2 of the formula (II) is preferably 3- (3- (dimethylamino) propylamino) propylamine.
- the weight ratio between amine A1 and amine A2 is preferably in
- the hardener preferably contains at least one further amine.
- the hardener can preferably contain a combination of two or more of the further amines mentioned below.
- the hardener contains at least one amine A3 of the formula (III),
- the amine A3 is preferably a constituent of a reaction mixture from the partial alkylation of at least one amine of the formula A (NH2) 2 with at least one alkylating agent which also contains the corresponding monoalkylated amine A1.
- Amine A3 is preferably present in an amount such that the weight ratio between amine A1 and amine A3 is in the range from 50/50 to 95/5, preferably 65/35 to 95/5, in particular 70/30 to 90/10.
- Such a mixture of amine A1 and amine A3 is technically easily available and particularly inexpensive.
- the hardener contains, as a further amine, at least one amine A4, which is an aliphatic polyamine with at least two primary amino groups.
- at least one amine A4 enables a particularly high glass transition temperature.
- Suitable as amine A4 are aliphatic, cycloaliphatic or arylaliphatic polyamines, in particular 2,2-dimethyl-1,3-propanediamine, 1,3-pentanediamine (DAMP), 1,5-pentanediamine, 1,5-diamino-2-methylpentane ( MPMD), 2-butyl-2-ethyl-1,5-pentanediamine (C11 -neodiamine), 1,6-hexanediamine, 2,5-dimethyl-1, 6-hexanediamine, 2,2 (4), 4-trimethyl -1, 6-hexanediamine (TMD), 1, 7-heptanediamine, 1, 8-octanediamine, 1, 9-nonanediamine, 1, 10-decanediamine, 1, 11 -ndecanediamine, 1, 12- dodecanediamine, 1, 2- , 1, 3- or 1, 4-diaminocyclohexane, 1, 3-bis (aminomethyl) cyclohexane, 1, 4-bis (a
- the amine A4 is preferably selected from the group consisting of TMD, 1, 2-, 1, 3- or 1, 4-diaminocyclohexane, 1, 3-bis (aminomethyl) cyclohexane, 1, 4-bis (aminomethyl) cyclohexane , Bis (4-aminocyclohexyl) methane, IPDA, 2 (4) -methyl-1, 3-diaminocyclohexane, MXDA, polyalkylene amines, adducts of these or other polyamines with mono- or diepoxides and Mannich bases.
- IPDA or MXDA or their adducts with at least one epoxy resin is preferred.
- the polyalkylene amines in particular TETA, TEPA, PEHA, N4-amine or BHMT, or their adducts with at least one are particularly preferred Epoxy resin.
- a hardener enables particularly high adhesive forces and a particularly high glass transition temperature.
- the hardener can contain a combination of two or more A4 amines.
- the hardener may contain at least one thinner.
- xylene 2-methoxyethanol, dimethoxyethanol, 2-ethoxyethanol, 2-propoxyethanol, 2-isopropoxyethanol, 2-butoxyethanol, 2-phenoxyethanol, 2-benzyloxyethanol, benzyl alcohol, ethylene glycol, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol ether , Ethylene glycol diphenyl ether, diethylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol diethyl ether, diethylene glycol di-n-butyl glycol, propylene glycol, propylene glycol, propylene glycol, ethylene glycol , Diphenylmethane, diisopropylnaphthalene, petroleum fractions such as Solvesso ® grades (from Exxon), alkylphenols such as tert-butylphenol, nonylphenol, dodec
- Thinners with a boiling point of more than 200 ° C. are preferred.
- the diluent is preferably selected from the group consisting of benzyl alcohol, styrenated phenol, ethoxylated phenol, aromatic hydrocarbon resins containing phenol groups, in particular the Novares ® types LS 500, LX 200, LA 300 or LA 700 (from Rütgers), diisopropylnaphthalene and Cardanol. Phenol group-containing thinners also act as accelerators.
- the hardener may contain at least one accelerator.
- Suitable accelerators are substances which accelerate the reaction between amino groups and epoxy groups, in particular acids or acids Acids hydrolyzable compounds, especially organic carboxylic acids such as acetic acid, benzoic acid, salicylic acid, 2-nitrobenzoic acid, lactic acid, organic sulfonic acids such as methanesulfonic acid, p-toluenesulfonic acid or 4-dodecylbenzenesulfonic acid, sulfonic acid esters, other organic or inorganic acids such as especially phosphoric acid, or mixtures of the above - called acids and acid esters; Nitrates such as in particular calcium nitrate; tertiary amines such as, in particular, 1,4-diazabicyclo [2.2.2] octane, benzyldimethylamine, a-methylbenzyldimethylamine, triethanolamine, dimethylaminopropylamine, imidazoles such as in particular N-methylimidazole, N-viny
- Preferred accelerators are acids, nitrates, tertiary amines or Mannich bases.
- Salicylic acid or calcium nitrate or 2,4,6-tris (dimethylaminomethyl) phenol or a combination thereof is particularly preferred.
- Another object of the invention is an epoxy resin composition comprising
- a hardener component comprising the hardener described above, containing at least one amine A1 of the formula (I) and at least one amine A2 of the formula (II) in the weight ratio between amine A1 and amine A2 in the range from 20/1 to 1/2 .
- a suitable epoxy resin is obtained in a known manner, in particular from the oxidation of olefins or from the reaction of epichlorohydrin with the polyols, polyphenols or amines.
- Suitable epoxy resins are, in particular, aromatic epoxy resins, in particular the glycidyl ethers of:
- Bisphenol-A bisphenol-F or bisphenol-A / F, where A stands for acetone and F for formaldehyde, which served as starting materials for the preparation of these bisphenols.
- positional isomers can also be present, in particular derived of 2,4'- or 2,2'-hydroxyphenylmethane.
- Dihydroxybenzene derivatives such as resorcinol, hydroquinone or pyrocatechol;
- bisphenols or polyphenols such as bis (4-hydroxy-3-methylphenyl) methane, 2,2-bis (4-hydroxy-3-methylphenyl) propane (bisphenol-C), bis (3,5-dimethyl-4- hydroxyphenyl) methane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane, 2,2-bis (4- hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxyphenyl) butane (bisphenol-B), 3,3-bis (4-hydroxyphenyl) pentane, 3,4-bis (4-hydroxyphenyl) ) hexane, 4,4-bis (4-hydroxyphenyl) heptane, 2,4-bis (4-hydroxyphenyl) -2-methylbutane, 2,4-bis (3,5-dimethyl-4-hydroxyphenyl) -2 -methylbutane, 1,1-bis (4-hydroxyphenyl)
- Novolaks which are in particular condensation products of phenol or cresols with formaldehyde or paraformaldehyde or acetaldehyde or crotonaldehyde or isobutyraldehyde or 2-ethylhexanal or benzaldehyde or furfural;
- aromatic amines such as aniline, toluidine, 4-aminophenol, 4,4'-methylenediphenyldiamine, 4,4'-methylenediphenyldi- (N-methyl) amine, 4,4 '- [1,4-phenylene bis ( 1-methylethylidene)] bisaniline (bisaniline-P) or 4,4 '- [1,3-phenylene-bis (1-methylethylidene)] bisaniline (bisaniline-M).
- suitable epoxy resins are aliphatic or cycloaliphatic poly-epoxides, in particular
- Glycidyl ethers of saturated or unsaturated, branched or unbranched, cyclic or open-chain di-, tri- or tetrafunctional C2 to C3o alcohols in particular ethylene glycol, propylene glycol, butylene glycol, hexanediol, octanediol, polypropylene glycols, dimethylolcyclohexane, neopentomethylene glycol, dophenylene glycol , Castor oil, trimethylolpropane, trimethylolethane, pentaerythrol, sorbitol or glycerol, or alkoxylated glycerol or alkoxylated trimethylolpropane;
- N-glycidyl derivative of amides or heterocyclic nitrogen bases such as triglycidyl cyanurate or triglycidyl isocyanurate, or reaction products of epichlorohydrin with flydantoin.
- Epoxy resins from the oxidation of olefins such as in particular vinylcyclohexene, dicyclopentadiene, cyclohexadiene, cyclododecadiene, cyclododecatriene,
- Isoprene 1, 5-flexadiene, butadiene, polybutadiene or divinylbenzene.
- the epoxy resin is preferably a liquid resin or a mixture comprising two or more liquid epoxy resins.
- epoxy liquid resin A technical polyepoxide with a glass transition temperature below 25 ° C is called “epoxy liquid resin”.
- the resin component may also contain proportions of solid epoxy resin.
- the epoxy resin is in particular a liquid resin based on a bisphenol, in particular a bisphenol-A diglycidyl ether and / or bisphenol-F diglycidyl ether, as are commercially available for example from Olin, Huntsman or Momentive.
- These liquid resins have a low viscosity for epoxy resins and enable fast curing and high hardness. They can contain parts of bisphenol A solid resin or novolak glycidyl ethers.
- the resin component may contain a reactive diluent.
- Preferred reactive diluents are epoxy group-containing reactive diluents, in particular butanediol diglycidyl ether, hexanediol diglycidyl ether, trimethylol propane or triglycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether, guaiacol glycidyl ether, 4-methoxyphenyl glycidyl ether, 4-methoxyphenyl glycidyl ether, 4-methoxyphenyl glycidyl ether, 4-methoxyphenyl glycidyl ether Dodecylphenylglycidylether, Cardanolglycidylether, Benzylglycidylether, Allylglycidylether, Butylglycidylether, Hexylg
- the epoxy resin composition preferably contains at least one further constituent selected from the group consisting of thinners, accelerators and fillers.
- Suitable accelerators are those already mentioned, in particular salicylic acid, calcium nitrate or 2,4,6-tris (dimethylaminomethyl) phenol or a combination thereof.
- Suitable diluents are those already mentioned, in particular those with a boiling point of more than 200 ° C.
- the diluent is selected from the group consisting alcohol from Benzylal-, styrene istechnische-like compounds, especially the Novares ® grades LS 500, LX 200, LA 300 or LA 700 (from Rutgers), diisopropylnaphthalene and cardanol.
- alcohol from Benzylal-, styrene is convincedm phenol, ethoxylated phenol, phenol group-containing aroma aromatic hydrocarbon resins, especially the Novares ® grades LS 500, LX 200, LA 300 or LA 700 (from Rutgers), diisopropylnaphthalene and cardanol.
- the epoxy resin composition preferably contains only a low content of thinners. It preferably contains less than 10% by weight, particularly preferably less than 5% by weight, in particular less than 1% by weight, of thinner. This enables low-emission or zero-emission epoxy resin products.
- Suitable fillers are, in particular, ground or precipitated calcium carbonate, which is optionally coated with fatty acid, in particular stearates, barite (heavy spar), talc, quartz powder, quartz sand, silicon carbide, iron mica, dolomite, wollastonite, kaolin, mica (potassium aluminum -Silicate), molecular sieve, aluminum oxide, aluminum hydroxide, magnesium hydroxide, silica, cement, gypsum, fly ash, soot, graphite, metal powder such as aluminum, copper, iron, zinc, silver or steel, PVC powder or flute balls.
- fatty acid in particular stearates, barite (heavy spar), talc, quartz powder, quartz sand, silicon carbide, iron mica, dolomite, wollastonite, kaolin, mica (potassium aluminum -Silicate), molecular sieve, aluminum oxide, aluminum hydroxide, magnesium hydroxide, silica, cement, gypsum, fly
- Calcium carbonate, quartz powder and quartz sand are preferred.
- the epoxy resin composition may contain further auxiliaries and additives, in particular the following:
- - reactive diluents in particular the previously mentioned, or epoxidized soybean oil or linseed oil, compounds containing acetoacetate groups, in particular acetoacetylated polyols, butyrolactone, carbonates, aldehydes, isocyanates or silicones containing reactive groups;
- amines in particular monoamines such as in particular benzylamine or furfurylamine or aromatic polyamines such as in particular 4,4'-, 2,4 'and / or 2,2'-diaminodiphenylmethane, 2,4- and / or 2,6-toluenediamine, 3 , 5-dimethyl-thio-2,4- and / or -2,6-toluenediamine, 3,5-diethyl-2,4- and / or -2,6-toluenediamine;
- Polymers in particular polyamides, polysulfides, polyvinyl formal (PVF), polyvinyl butyral (PVB), polyurethanes (PUR), polymers with carboxyl groups, polyamides, butadiene-acrylonitrile copolymers, styrene-acrylonitrile copolymers, butadiene-styrene Copolymers, homo- or copolymers of unsaturated monomers, in particular from the group comprising ethylene, propylene, butylene, Isobutylene, isoprene, vinyl acetate or alkyl (meth) acrylates, in particular chlorosulfonated polyethylenes or fluorine-containing polymers or sulfonamide-modified melamines;
- Fibers in particular glass fibers, carbon fibers, metal fibers, ceramic fibers or plastic fibers such as polyamide fibers or polyethylene fibers;
- Pigments especially titanium dioxide, iron oxides or chromium (III) oxide;
- Flame retardant substances in particular the fillers already mentioned, aluminum hydroxide or magnesium hydroxide, antimony trioxide, antimony pentoxide, boric acid (B (OFI) 3), zinc borate, zinc phosphate, melamine borate, melamine cyanurate, ammonium polyphosphate, melamine phosphate, melamine pyrophosphate, polybromated diphenyl phosphate or diphenyl oxide or Diphenyl cresyl phosphate, resorcinol bis (diphenyl phosphate), resorcinol diphosphate oligomer, tetraphenyl resorcinol diphosphite, ethylenediamine diphosphate, bisphenol A-bis (diphenyl phosphate), tris (chloroethyl) phosphate, tris (chloropropyl) tris (chloropropyl) - tris (chloropropyl) - tris (chloropropyl)
- Additives in particular dispersed paraffin wax, film-forming aids, wetting agents, leveling agents, defoamers, deaerators, stabilizers against oxidation, heat, light or UV radiation or biocides.
- the ratio of the number of groups reactive towards epoxy groups to the number of epoxy groups is preferably in the range from 0.5 to 1.5, in particular 0.7 to 1.2.
- the primary and secondary amino groups present in the epoxy resin composition and any other groups which are reactive towards epoxy groups react with the epoxy groups by opening them (Addition reaction). As a result of this reaction mainly, the composition polymerizes and thereby hardens.
- the resin and hardener components of the epoxy resin composition are stored in separate containers. Further constituents of the epoxy resin composition can be present as a constituent of the resin or hardener component, further constituents reactive towards epoxy groups preferably being a constituent of the hardener component. It is also possible for other components to be present as separate components.
- a suitable container for storing the resin or hardener component is in particular a barrel, a hobbock, a bag, a bucket, a can, a cartridge or a tube.
- the components can be stored, which means that they can be stored for several months to a year or longer before they are used, without changing their respective properties to an extent relevant to their use.
- the components are mixed with one another shortly before or during the application.
- the mixing ratio between the resin component and the hardener component is preferably chosen such that the groups of the hardener component which are reactive towards epoxy groups are in a suitable ratio to the epoxy groups of the resin component, as described above. In parts by weight, the mixing ratio between the resin component and the hardener component is usually in the range from 1:10 to 10: 1.
- the components are mixed using a suitable method; it can be carried out continuously or in batches. If mixing does not take place immediately before application, care must be taken to ensure that there is not too much time between the mixing of the components and the application and that the application takes place within the pot life.
- Mixing takes place in particular at ambient temperature, which is typically in the range from about 5 to 40 ° C., preferably at about 10 to 35 ° C. With the mixing of the two components, the hardening by chemical reaction begins, as previously described. Curing typically takes place at a temperature in the range from 0 to 150 ° C. It is preferably carried out at ambient temperature and typically extends from a few days to weeks. The duration depends, among other things, on the temperature, the reactivity of the constituents and their stoichiometry, and the presence of accelerators.
- the epoxy resin composition is applied to at least one substrate, the following being particularly suitable:
- Metals or alloys such as aluminum, iron, steel, copper, other non-ferrous metals, including surface-coated metals or alloys such as galvanized or chrome-plated metals
- plastics such as hard and soft PVC, polycarbonate, polystyrene, polyester, polyamide, PMMA, ABS, SAN, epoxy resins, phenolic resins, PUR, POM, TPO,
- PE PE, PP, EPM or EPDM, each untreated or surface-treated, for example by means of plasma, corona or flame;
- CFRP carbon fiber reinforced plastics
- GTK glass fiber reinforced plastics
- SMC sheet molding compounds
- - Insulating foams in particular made of EPS, XPS, PUR, PIR, rock wool, glass wool or foamed glass (foam glass);
- - coated or lacquered substrates in particular lacquered tiles, coated concrete, powder-coated metals or alloys or lacquered sheets; - Coatings, paints or varnishes, in particular coated floors, which are covered with another layer of floor covering.
- the substrates can be pretreated before application, in particular by physical and / or chemical cleaning processes or by applying an activator or a primer.
- a cured composition is obtained from the curing of the epoxy resin composition described.
- the epoxy resin composition described is preferably used as an adhesive, sealant, casting compound, casting resin, coating, primer or as a matrix for fiber composite materials (composites) such as, in particular, CFRP or GFRP.
- coating also includes primers, paints, varnishes and seals.
- the epoxy resin composition described is particularly preferably used as an adhesive. After mixing the components, it typically has a pasty consistency with pseudoplastic properties. During application, the mixed adhesive is applied to at least one of the substrates to be bonded within the pot life and the substrates are bonded within the open time of the adhesive.
- the mixed adhesive is applied or applied in particular by means of a brush, roller, spatula, squeegee, trowel, or from a tube, cartridge or metering device.
- the adhesive is particularly suitable for use in the construction industry, in particular for the reinforcement of buildings by means of steel lamellas or lamellas made of carbon fiber reinforced composite plastics (CFRP), for constructions that contain glued precast concrete parts, especially bridges or concrete towers
- CFRP carbon fiber reinforced composite plastics
- CFRP carbon fiber reinforced composite plastics
- Such an epoxy resin adhesive is also suitable for filling cavities such as cracks, crevices or boreholes, the adhesive being filled or injected into the cavity and filling it after curing and connecting the flanks of the cavity with one another in a force-locking manner or glued.
- Another object of the invention is a method for gluing comprising the steps
- a “reinforcing bar”, a threaded rod or a bolt is referred to as “anchor”.
- anchor Such is particularly glued or anchored in a wall, wall, ceiling or in a foundation in such a way that a part of it is non-positively bonded and a part of it protrudes and can be structurally loaded.
- An article is obtained from the application and curing of the epoxy resin composition described or from the process for gluing.
- This article can be a structure or a part thereof, in particular a building or civil engineering structure, a bridge, a roof, a stairwell, a balcony, or it can be an industrial good or a consumer good, in particular a pier, an offshore Platform or a rotor blade of a wind power plant, or a means of transport such as, in particular, an automobile, a truck, a rail vehicle, a ship, an aircraft or a helicopter, or an attachment part thereof.
- Another object of the invention is therefore an article obtained from the described use or the described method for gluing.
- the epoxy resin composition described is characterized by advantageous properties. It is also easy to process without thinner, has a long pot life and open time with fast curing and hardens to a material of high strength, low brittleness, high adhesive forces and a sufficiently high glass transition temperature. Articles glued to it can withstand heavy mechanical and weather-related loads.
- AHEW stands for the amine hydrogen equivalent weight.
- NK standard climate
- the viscosity was measured on a thermostatted Rheotec RC30 cone-plate viscometer (cone diameter 50 mm, cone angle 1 °, cone tip-plate distance 0.05 mm, shear rate 10 s -1 ).
- the amine number was determined by titration (with 0.1 N FICI04 in acetic acid against crystal violet).
- Sikadur ® -30 component A, quartz-filled resin components of a structural epoxy resin adhesive, containing bisphenol A diglycidyl ether and 1,4-butanediol diglycidyl ether, EEW approx. 700 g / eq (from Sika)
- DMAPAPA 3- (3- (dimethylamino) propylamino) propylamine, AHEW 53 g / Eq (DMAPAPA, from Arkema).
- B-EDA is an amine A1 of the formula (I).
- DMAPAPA is an amine A2 of formula (II).
- the hydrogenated solution was then concentrated on a rotary evaporator at 65 ° C., unreacted 1, 2-ethylenediamine, water and isopropanol being removed.
- the so The reaction mixture obtained was a clear, slightly yellowish liquid with an amine number of 678 mg KOH / g. 50 g of this were distilled under vacuum at 80 ° C., 31.3 g of distillate being collected at a steam temperature of 60 to 65 ° C. and 0.06 mbar.
- the ingredients of the flärter component indicated in Tables 1 to 2 were mixed in the stated amounts (in parts by weight) using a centrifugal mixer (SpeedMixer TM DAC 150, FlackTek Inc.) and stored with the exclusion of moisture.
- a centrifugal mixer SpeedMixer TM DAC 150, FlackTek Inc.
- Sikadur ® -30 component A (from Sika) was used as the Flarz component in the amount given in Tables 1 to 2 (in parts by weight).
- the pot life was determined in the standard climate by using a spatula to mix the adhesive every 5 minutes. was moved until the adhesive had thickened so much that it could no longer be processed.
- the mechanical properties were determined by applying and curing the mixed adhesive in a silicone mold into dumbbell-shaped bars with a thickness of 10 mm, a length of 150 mm, a web length of 80 mm and a web width of 10 mm .
- the tensile bars were released from the mold after 7 days of curing and the tensile strength and elongation at break were measured in accordance with EN ISO 527 at a tensile speed of 1 mm / min.
- the condition of the surface was assessed on the dumbbell-shaped bars to determine the mechanical properties on the side exposed to the curing of the air.
- a non-sticky surface was referred to as “smooth” and a sticky surface was referred to as “sticky”.
- a sticky surface is a sign of blushing.
- the compressive strength was determined by applying the mixed adhesive in a silicone mold to cuboids measuring 12.7 x 12.7 x 25.4 mm in a standard atmosphere and curing them in the standard climate. After 7 days, several such cuboids were removed from the mold and compressed to destruction at a test speed of 1.3 mm / min in accordance with ASTM D695, the value for the compressive strength being read at the maximum force in each case.
- Table 1 Composition and properties of Examples 1 to 6.
- Table 2 Composition and properties of Examples 7 to 11.
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Abstract
Description
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US2739981A (en) * | 1952-08-26 | 1956-03-27 | American Home Prod | Diamines and salts thereof |
DD135623B1 (en) * | 1977-12-23 | 1980-08-06 | Hoerhold Hans Heinrich | Process for the production of optical adhesives based on epoxy resin polyaddition products |
EP1170317B1 (en) | 2000-07-03 | 2004-08-04 | Vantico GmbH & Co. KG | Curable compositions on the basis of glycidyl compounds, amine curing agents and low viscosity curing accelerators |
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EP2752437A1 (en) * | 2013-01-08 | 2014-07-09 | Sika Technology AG | Hardener for low emission epoxy resin products |
WO2016023839A1 (en) | 2014-08-13 | 2016-02-18 | Sika Technology Ag | Amine for low-emission epoxy resin compositions |
EP3138863A1 (en) | 2015-09-01 | 2017-03-08 | Sika Technology AG | Low-emission epoxy resin composition |
EP3144335A1 (en) | 2015-09-17 | 2017-03-22 | Sika Technology AG | Amine for low-emission epoxy resin compositions |
US10759946B2 (en) | 2016-02-15 | 2020-09-01 | Sika Technology Ag | Low-emission liquid film for sealing buildings |
EP3420016A1 (en) | 2016-02-22 | 2019-01-02 | Evonik Degussa GmbH | Benzylated mannich base curing agents, compositions, and methods |
EP3336120A1 (en) * | 2016-12-14 | 2018-06-20 | Sika Technology AG | Epoxy resin adhesive with a high compressive strength |
JP2022501454A (en) | 2018-10-01 | 2022-01-06 | シーカ テクノロジー アクチェンゲゼルシャフト | Hardener for epoxy resin |
-
2019
- 2019-09-30 US US17/277,209 patent/US20220033568A1/en active Pending
- 2019-09-30 CN CN201980064692.7A patent/CN112789309B/en active Active
- 2019-09-30 JP JP2021515593A patent/JP7558931B2/en active Active
- 2019-09-30 WO PCT/EP2019/076494 patent/WO2020070084A1/en unknown
- 2019-09-30 EP EP19773880.0A patent/EP3861048A1/en active Pending
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CN112789309A (en) | 2021-05-11 |
JP7558931B2 (en) | 2024-10-01 |
US20220033568A1 (en) | 2022-02-03 |
CN112789309B (en) | 2024-01-09 |
WO2020070084A1 (en) | 2020-04-09 |
JP2022501481A (en) | 2022-01-06 |
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