EP3828844A1 - Dispositif capteur - Google Patents

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Publication number
EP3828844A1
EP3828844A1 EP19212281.0A EP19212281A EP3828844A1 EP 3828844 A1 EP3828844 A1 EP 3828844A1 EP 19212281 A EP19212281 A EP 19212281A EP 3828844 A1 EP3828844 A1 EP 3828844A1
Authority
EP
European Patent Office
Prior art keywords
sensor
board part
sensor device
coil
electronics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19212281.0A
Other languages
German (de)
English (en)
Inventor
Philippe Mosberger
Stefan Wyss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dormakaba Schweiz AG
Original Assignee
Dormakaba Schweiz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dormakaba Schweiz AG filed Critical Dormakaba Schweiz AG
Priority to EP19212281.0A priority Critical patent/EP3828844A1/fr
Publication of EP3828844A1 publication Critical patent/EP3828844A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/02—Mechanical actuation
    • G08B13/08—Mechanical actuation by opening, e.g. of door, of window, of drawer, of shutter, of curtain, of blind
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B45/00—Alarm locks
    • E05B45/06—Electric alarm locks
    • E05B45/08—Electric alarm locks with contact making inside the lock or in the striking plate
    • E05B45/083—Electric alarm locks with contact making inside the lock or in the striking plate with contact making either in the striking plate or by movement of the bolt relative to the striking plate
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B45/00—Alarm locks
    • E05B45/06—Electric alarm locks
    • E05B45/08—Electric alarm locks with contact making inside the lock or in the striking plate
    • E05B45/12—Electric alarm locks with contact making inside the lock or in the striking plate by movement of the bolt
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B47/00—Operating or controlling locks or other fastening devices by electric or magnetic means
    • E05B47/0046—Electric or magnetic means in the striker or on the frame; Operating or controlling the striker plate

Definitions

  • the invention relates to a sensor device for a closure element.
  • the closure element is in particular a door or a window.
  • a previously known sensor device shows WO 2016/149723 A1 , there referred to as a device for detection.
  • the object is thus achieved by a sensor device for a closure element.
  • the closure element is in particular a door or a window.
  • the sensor device comprises a sensor.
  • a sensor axis is defined on the sensor.
  • the sensor in turn comprises at least one coil.
  • a / the coil is described in places below; However, it should always be understood that a plurality of, in particular coaxial, coils are preferably used.
  • the coil preferably has at least one winding which extends around a coil axis; where the coil axis corresponds to the sensor axis.
  • the coil is used to be penetrated by a locking element.
  • the coil is therefore designed to be penetrated by a locking element.
  • the closure element can comprise the locking element.
  • the sensor particularly preferably has a through cutout all around the sensor axis.
  • the through recess is designed to be penetrated by the locking element.
  • the locking element preferably moves parallel to the sensor axis.
  • the coil that is preferably used extends around the through cutout.
  • the sensor device comprises an electrical system.
  • the electrical system is designed in particular for the power supply and / or control of the sensor, in particular the coil (s).
  • the electrical system is preferably connected in an electrically conductive manner to the sensor, in particular the coil (s).
  • “Control of the sensor or the coil” is to be understood as meaning that the electrical system applies a specific signal to the sensor, in particular the coil, and / or is designed to supply a signal generated in the sensor, in particular a signal induced in the coil capture.
  • the electrical system viewed from the direction of the sensor axis, in particular the coil axis, is arranged next to the sensor, in particular next to the coil.
  • the complete electrical system viewed from the direction of the sensor axis, in particular the coil axis, is arranged next to the sensor, in particular next to the coil.
  • the sensor axis, in particular the coil axis does not intersect any part of the electrical system.
  • the electrical system is thus arranged completely across the sensor axis, in particular the coil axis.
  • the sensor device in particular comprising the sensor with coil and the electrical system, is thus preferably arranged essentially in one plane. This results in a very thin construction of the entire sensor device and it is possible to arrange the sensor device in a closure element gap.
  • the closure element is preferably a door or a window.
  • the closure element gap is formed between the door leaf or the window leaf, generally referred to as the closure element leaf, and the surrounding frame.
  • the sensor device presented here is preferably designed to be arranged in this closure element gap.
  • the closure element sheet and the frame in the vicinity of the sensor device are preferably metallic.
  • the sensor device is located on a side of the closure element sheet or the frame facing the closure element gap.
  • the sensor device is arranged in such a way that the sensor axis is aligned with the locking element and the associated opening.
  • the sensor device is particularly preferably arranged on the closure element leaf side (in particular on the door leaf side or on the window leaf side).
  • a mortise lock to be arranged in the door leaf.
  • the door leaf includes the mortise lock.
  • the mortise lock closes with the faceplate.
  • the strike plate is located on the opposite side, either mounted in the frame or as an integral part of the frame.
  • the locking element can extend out of the faceplate. This locking element extends through the closure element gap along the sensor axis into a corresponding opening in the strike plate. This locking element is in particular a bolt or a trap.
  • the window there are corresponding elements that can extend through the closure element gap into a corresponding opening in the frame.
  • the sensor device is located on a side of the faceplate or strike plate facing the closure element gap.
  • a spatial direction is defined for this.
  • the spatial direction is specified by a straight line which runs transversely through the sensor axis, in particular the coil axis.
  • the spatial direction extends radially outward from the sensor axis.
  • the electrical system connects to the sensor along this spatial direction. In particular, this spatial direction intersects the electrical system.
  • a third imaginary axis can be defined at the intersection of the spatial direction with the sensor axis. This third imaginary axis is perpendicular to the Sensor axis and perpendicular to the spatial direction. In particular, this third imaginary axis does not intersect the electrical system.
  • the electrical system preferably includes electronics.
  • the electronics include, in particular, a transmitting and receiving unit and / or a processor.
  • the electronics are composed of several electronic components.
  • the electronic components can be located in a potting compound.
  • the electronic components can partially protrude beyond this potting compound.
  • this unit forms the "electronics" from several electronic components.
  • the electronics are designed in particular to control the sensor.
  • the transmitting and / or receiving unit is preferred for wireless close-range communication, e.g. B. Bluetooth Low Energy or NFC.
  • the electrical system comprises at least one energy store.
  • the energy store is in particular a battery or an accumulator. This is particularly preferably a button cell.
  • the energy storage means that a connection to an external energy supply can be dispensed with.
  • the sensor device is easy to install.
  • the entire electrical system is only connected on one side of the sensor.
  • the electronics are located between the energy store (s) and the sensor. Overall, the result is a stringing of the sensor with subsequent electronics and subsequent energy storage device (s) along the spatial direction defined above.
  • the arrangement of the electronics between the sensor and the energy store enables relatively short conduction paths, since the energy store initially energizes the electronics and the electronics then in turn energize the sensor, in particular the coil.
  • the sensor device can thus comprise at least three areas arranged next to one another, a sensor area with the sensor, an electronics area with the electronics and a storage area with the energy store.
  • the electronics are designed in particular to control the sensor.
  • the at least one coil preferably all coils, is controlled.
  • a signal is applied to the coil (s) and / or a signal is picked up at the coil (s).
  • the electronics can be controlled by a higher-level computing unit. Furthermore, the electronics can outsource calculations / evaluations to the higher-level processing unit.
  • the computing unit is located outside the sensor device and is connected, preferably wirelessly, to the electronics for data transmission.
  • WO 2016/149723 A1 describes a sensor and its use.
  • the sensor used according to the present invention can be designed identically or similarly.
  • the control of the coil (s) can be switched off accordingly WO 2016/149723 A1 can also be used for the present invention.
  • the sensor When the sensor device is arranged on the faceplate, the sensor can be used to detect whether the metal strike plate is in the vicinity of the coil and thus the door is closed or not.
  • the coil When the sensor device is arranged on the strike plate, the coil can be used to detect whether the metal faceplate or the metal lock is near the coil and thus the door is closed or not.
  • the electronics measuring device in WO 2016/149723 A1 ) in such a way that it is suitable for measuring the impedance of the coil while an alternating voltage signal or an alternating current signal is applied to it.
  • the sensor can be equipped with only one coil, which results in the smallest possible thickness of the sensor device. According to, in WO 2016/149273 A1 namely described that the impedance of the coil changes when the locking element is retracted or extended and to a lesser extent when the strike plate (by closing the door) comes into the area of the coil. The impedance of the coil can be compared with given values.
  • the reliability of the determination of the state of the locking element and the door leaf can be significantly increased by applying signals of different frequencies to the coil in succession by means of the electrical system.
  • the impedance is then determined at these different frequencies and compared with predetermined values. If z. B. is measured at three frequencies and conclusions are drawn from each measurement about the state of the locking element and possibly the state of the door, a majority decision can be made in the event of different results. On the other hand, it is also often possible that two states deliver very similar measured values at a certain frequency and thus can hardly be differentiated, so that a measurement at different frequencies is indicated for this reason alone.
  • the power consumption is consequently increased compared to a single measurement.
  • the at least two coils are in particular coaxial with one another. It is a transmitting coil and a receiving coil. Alternating current is applied to the transmitter coil. The induced voltage is recorded in the receiving coil. The induced voltage in the receiving coil changes more clearly than the impedance, especially when the door status changes. In this way measurements at different frequencies can be avoided, thereby minimizing power consumption.
  • the reliability can be increased even further if a further receiving coil is provided so that a receiving coil is arranged on both sides of the transmitting coil.
  • the electronics By means of the electronics, the difference between the voltage induced in the two receiving coils is recorded while the transmitting coil is supplied with alternating current.
  • the senor comprises at least three coils or four coils.
  • these at least three coils are arranged one above the other, in particular coaxially, so that a type of transformer results.
  • At least one transmission coil is located, in particular, symmetrically between the reception coils. If an iron core (the locking element) is located exactly symmetrically in this arrangement, exactly the same voltage is induced in the two receiving coils, the differential voltage between the two receiving coils is therefore 0. However, if the iron core shifts in one direction or the other, the arrangement becomes asymmetrical and there is an induced differential voltage at the two receiving coils. It is possible to arrange a transmitter coil between the receiver coils.
  • the two transmitter coils are in particular part of a common circuit.
  • the transmitter coils can send out a common signal.
  • the two receiving coils can also be part of a common circuit. It is therefore also possible to speak of a transmitting coil with two winding areas and / or a receiving coil with two winding areas.
  • the senor can detect the open and closed door states as well as the retracted and extended locking element states.
  • the electronics at least energize the coil and / or detect the impedance or induced voltage, which can be transmitted.
  • the other evaluations, for example the comparison with stored values can also take place in the electronics or in the higher-level processing unit.
  • a front side and a rear side are defined on the sensor device.
  • a housing of the sensor device partially forms the front side and rear side, provision being made in particular that the housing is at least partially formed by one / more circuit board (s) and / or a cover and / or a holding element.
  • the housing surrounds at least the energy store.
  • the electrical system is preferably at least partially attached to the housing.
  • the rear side forms a mounting surface that is designed to rest on the closure element blade (especially the faceplate) or frame (especially the strike plate).
  • the corresponding surface, in particular on the faceplate or strike plate, for receiving the sensor device is referred to as the "support surface”.
  • the entire rear side is preferably designed as a flat surface and can thus be used as a mounting surface, in particular for gluing onto the support surface.
  • the sensor device preferably at the highest or thickest point, has a height of at most 2.5 mm, preferably at most 2.3 mm, particularly preferably at most 2.1 mm.
  • the lowest possible amount results from what is technically possible.
  • the sensor device can have a height of at least 1.8 mm, preferably at least 1.5 mm, particularly preferably at least 1.2 mm.
  • the board parts can be independent boards or just sections of a larger board.
  • a circuit board with its conductor tracks is referred to as a circuit board.
  • These are preferably hard or stiff blanks.
  • At least one circuit board part can, at least in preferred configurations, also be used as housing components.
  • the sensor device preferably comprises an electronic board part.
  • the electronics are arranged on this electronic board part.
  • the electronics preferably comprise a plurality of electronic components. These electronic components can be located in a potting compound. This potting compound can form a corresponding layer on the electronic circuit board part.
  • An antenna of the transmitting and / or receiving unit can be part of an electronic board part.
  • the sensor device preferably comprises a sensor board part.
  • the sensor board part includes the sensor.
  • the sensor preferably comprises at least one coil. This coil is located on the plate of the sensor board part or inside the sensor board part.
  • the at least one coil can be designed as a conductor track of the sensor board part. All coils of the sensor can be designed as conductor tracks of the sensor board part.
  • the at least one coil can be formed in particular by conductor tracks of the sensor board part, which are formed in the sensor board part or on the plate of the sensor board part.
  • the sensor comprises several coils, the coils are preferably at least partially arranged one above the other within the sensor board part in the direction of the sensor axis. All coils are preferably arranged one above the other as part of the sensor board part in the direction of the coil axis.
  • the sensor device preferably comprises a memory board part.
  • the memory board part is designed at least for contacting the energy store (s). For this purpose, there is in particular an electrical contact directly on the memory board part.
  • the energy store (s) is / are also located directly on the memory board part.
  • the energy storage contact is, in particular, a sheet metal component placed on the storage circuit board, which is correspondingly connected in an electrically conductive manner, in particular materially, to a conductor track on or in the storage circuit board part.
  • the energy store (s) is / are also in direct contact with the energy store contact (s).
  • the electronic board part and the memory board part are formed in one piece and are thus formed by a common circuit board.
  • circuit board parts presented here extend in particular in a plane perpendicular to the sensor axis.
  • a housing part of the housing comprises at least the memory board part.
  • the memory board part forms at least part of the housing of the sensor device.
  • the memory board part can be designed to give the housing component rigidity and / or to protect the sensor device, for example, from external, mechanical influences.
  • the memory board part has an inside and an outside.
  • the top layer or botton layer of the memory board part forms the "outside".
  • the outside of the memory board part can be materially connected to the front or the rear of the sensor device.
  • the memory board part is connected, in particular glued, to an adhesive element, the adhesive element forming the rear side of the sensor device.
  • the memory board part directly forms the front side of the sensor device and / or is materially connected to the front side.
  • the front side can be formed by a layer of lacquer applied to the memory board part or by a film fastened to the memory board part.
  • the at least one energy storage contact and / or the electrical contact for contacting the energy storage is located on the inside of the memory board part.
  • the outside of the memory board part in turn forms at least part of a housing part; in particular at least part of a rear housing part.
  • the electronic circuit board part is materially connected to a front side and / or a rear side of the sensor device.
  • the electronics can be arranged on an inside of the electronics board part.
  • the outside of the electronic board part can be materially connected to the front and / or the rear or form the front or rear.
  • the electronic board part forms part of a housing part of the sensor device.
  • the electronic board part has an outside and an inside.
  • the electronics, in particular the electronic components, are located on the inside of the electronic circuit board part.
  • the outside of the electronic board part forms part of the housing. According to a variant, this outside of the electronic circuit board part forms at least part of a rear housing part of the sensor device.
  • the sensor device is designed without a housing in the electronics area of the sensor device.
  • the front and the rear of the sensor device are cohesively connected.
  • one side of the sensor board part forms part of the front side or is materially connected to the front side.
  • the sensor board part can additionally or alternatively form part of the rear side or be connected to the rear side in a materially bonded manner.
  • the sensor device comprises a base element.
  • the base element is designed in such a way that the sensor, in particular the coil (s), is spaced apart from the rear side or the support surface on which the sensor device is mounted.
  • the sensor board part preferably rests on a base element.
  • This base element which is preferably used, separates the sensor board part and thus in particular the coil from the rear side or mounting surface, in particular the faceplate or strike plate.
  • the two sides of the sensor board part each form the front side and / or the rear side of the sensor device or are materially connected to the front side and / or the rear part.
  • the sensor board part is connected to the electronic board part via a plug connection.
  • the electronic circuit board part and the sensor circuit board part can be formed at least partially in one piece with one another, in particular to be connected to one another by a flexible circuit board part.
  • the sensor board part can be at least partially formed by a flexible board part.
  • This flexible section then forms the connection between the sensor and the electronics.
  • the sensor board part and the electronic board part can be connected to one another via a soldered connection.
  • the sensor device preferably comprises a holding element.
  • the holding element can in particular form part of the sensor surface, for example also side walls.
  • the holding element is preferably fastened on or to the electronic board part and / or the memory board part at least indirectly in a materially bonded manner.
  • the holding element surrounds the memory board part and / or electronic board part at least partially, in particular completely, as a frame.
  • the base element can be designed as an integral part of the holding element.
  • the base element can be materially connected to the electronic board part and / or the memory board part.
  • the base element can be designed as part of the common circuit board.
  • the cover can be mounted reversibly and detachably on the holding element.
  • the cover is designed to be slidable or slipped over the rest of the housing, in particular the holding element.
  • the base element preferably comprises a base plate.
  • the through recess is formed in this base plate.
  • the locking element can extend through this passage recess in the base plate.
  • a side rail of the base element is preferably formed on both sides of the base plate.
  • the sensor board part is preferably located on the base plate and between the two side rails.
  • the front side of the sensor device that is to say the side facing the closure element gap, is flat.
  • the base element compensates for a height difference between the sensor board part on the one hand and the electronics area and / or the memory area on the other.
  • the base element can compensate for a height difference between the sensor board part on the one hand and an electronics area with the electronics board part and / or a memory area with the memory board part on the other hand.
  • the sensor board part and the electronic board part or memory board part are at different heights.
  • the base element is essentially in the same plane as the electronic board part or memory board part and thus compensates for the difference in height.
  • the electronics board part and / or memory board part face the respective outside of the rear side (mounting surface) of the sensor device.
  • the outer side of the base element is preferably also facing the rear.
  • At least one energy storage receptacle is formed in the holding element.
  • the energy storage receptacle is designed as through cutouts in the holding element.
  • the energy store can be used in the energy storage receptacle.
  • the memory board part preferably closes the energy storage receptacle.
  • the individual energy storage contact is preferably designed as a spring and presses the energy storage against the holding element or against the memory board part.
  • the holding element preferably forms an electronics cutout, also designed as a through cutout.
  • the electronics in particular the potting compound with the electronic components, protrude into this electronics recess.
  • the holding element can serve as a trough for the potting compound.
  • the front side of the holding element is preferably closed by means of the cover.
  • the holding element has a holding element rim on the front side.
  • This retaining element rim surrounds the electrics, in particular the electronics recess and the energy storage receptacles.
  • the cover in particular in an elastic configuration, for example made of silicone, can be slipped onto the retaining element rim. The edges of the cover grip around the retaining element rim in the attached state.
  • the cover in an alternative embodiment, it can be pushed onto the holding element perpendicular to the sensor axis.
  • the cover preferably has a latching tongue.
  • a tongue receptacle is preferably formed in the holding element. In the closed state, the locking tongue engages in the tongue receptacle.
  • the cover can also be pushed onto the holding element.
  • the cover comprises connecting elements which can be guided through recesses in the holding element. By moving the cover, the connecting elements are brought into a form fit with projections of the holding element and are thus fastened.
  • the cover can comprise the at least one energy storage contact.
  • the energy storage contact is in particular resiliently on the energy storage.
  • the cover can be designed to be electrically conductive. The cover can conduct the electrical current from the energy storage contact in the direction of the electronics and / or the sensor.
  • the cover can be fastened to the holding element in such a way that the energy storage contact rests resiliently on the energy storage device.
  • the cover can comprise at least one contact tongue in order to conduct the electrical current from the cover to the memory board part and / or the electronic board part.
  • the contact tongue can rest resiliently against the circuit board part.
  • the rear housing part is not formed by the electronic board part and / or memory board part, but a front board part.
  • the rear housing part comprises the holding element.
  • the holding element can form the side walls.
  • the holding element is preferably designed in one piece with the optional base element.
  • the holding element is closed by the electronic board part and the memory board part.
  • the electronic board part and / or the memory board part are preferably fastened reversibly and detachably to the holding element, in particular the board parts are clipped and / or retracted into the holding element (31).
  • a normal vector of the rear side is defined, and the holding element in the area of the electrical system and in the area of the sensor is designed to be different heights in the direction of the normal vector.
  • the detection by means of the sensor works all the better, the greater the distance between the coils when using several coils or the greater the distance of a single coil from the rear or mounting surface.
  • the mounting surface rests on the support surface (e.g. faceplate or strike plate).
  • the contact surface is usually made of metal and thus interferes with the measurement result.
  • At least one of the coils is / are arranged offset, in particular at a distance, from the electronic board part and / or from the memory board part.
  • Offset means that the center of the coil is offset from the center of the electronic board part and / or the memory board part, specifically in the direction of the coil axis.
  • the "spacing” means the following: The coil has a side facing the electronic board part and / or the memory board part. The electronic board part and / or the memory board part has a side facing the coil. A distance greater than 0 is provided between these two sides.
  • the electronic board part and / or the memory board part need not be located under the coils in the direction of the coil axis. Rather, the electronic board part and / or the memory board part can also be designed offset transversely to the coil axis.
  • the sensor device it is provided within the scope of the invention to make the sensor device as thin as possible. Accordingly, the thinnest possible electronic board part is used.
  • the distance between the coils or the distance between the individual coil and the mounting surface should, however, be chosen to be at least large enough, despite the desired thin design, that the above-described offset, in particular the spacing, arises.
  • the senor has at least two coils and at least one coil is not offset and at least one coil is offset, in particular at a distance, from the electronic circuit board part.
  • the senor has at least one coil, in particular at least two, preferably at least three, particularly preferably at least four, coils.
  • all of the coils are preferably offset, in particular spaced apart, from the electronic circuit board part.
  • the following is preferably provided:
  • the area in which the coils are located is defined as the coil area.
  • This coil area is in particular an area on the sensor board part.
  • the coil area preferably has a greater height in the direction of the coil axis than the electronic circuit board part.
  • the "height" can also be referred to as the "thickness”.
  • the height of the coil area is particularly preferably at least 110% of the height of the electronic circuit board part.
  • the invention also includes an arrangement.
  • the arrangement comprises the sensor device described here and the closure element.
  • the closure element is in particular a door or a window.
  • the area of the closure element on the frame side is referred to as the strike plate.
  • the area of the closure element on the door leaf or window leaf side is referred to as a faceplate.
  • the arrangement also includes a movable bolt element, in particular a component of a lock in the door leaf or a locking mechanism in the window leaf.
  • a locking element gap is formed between the faceplate and the strike plate.
  • the sensor device is located in the closure element gap on a support surface so that the locking element can penetrate the coil (s).
  • the sensor device is mounted with its rear side (mounting surface) on the support surface, preferably on the faceplate, in particular glued on.
  • the back of the sensor device and the support surface preferably form an adhesive element.
  • at least the outside of the electronic board part and / or the memory board part is in direct contact with the adhesive element.
  • the sensor device is arranged, in particular, in such a way that the locking element protrudes through the coil of the sensor and in particular also through the passage recess when it is retracted and extended.
  • the sensor device is located (when arranged on the faceplate) preferably on the outside of the faceplate and thus facing the strike plate or (if arranged on the strike plate) preferably on the outside of the strike plate and thus faces the faceplate.
  • the sensor device thus protrudes into the closure element gap.
  • FIG. 1 shows an arrangement 2 in a purely schematic representation.
  • the arrangement 2 comprises a sensor device 1 and a closure element 3, here designed as a door. Only a section of the closure element 3 is shown.
  • the locking element 3 comprises a lock 4 in a door leaf.
  • the lock 4 in turn has a faceplate 7.
  • a locking element 5, here designed as a bolt In the lock 4 there is a locking element 5, here designed as a bolt.
  • the locking element 5 can be retracted and extended with a key, for example.
  • the locking element 5 is displaceable along a coil axis 22. This coil axis 22 is part of the sensor device 1 and will be explained in detail.
  • the lock 4 can have a further locking element 6, for example in the form of a latch.
  • the locking element 5 penetrates the sensor device 1.
  • the sensor device 1 can also be designed and arranged such that the further locking element 6 (trap) penetrates the sensor device 1 and is detected by the sensor device 1.
  • the frame of the arrangement 2 lies opposite the door leaf.
  • the strike plate 8 is located in this frame as a separate component or integral area.
  • the strike plate 8 has a latch opening 9 and a bolt opening 10. In this locking opening 10 extends the locking element 5 in the extended state. The further locking element 6 accordingly extends into the latch opening 9.
  • a closure element gap 11 is formed between the faceplate 7 and the strike plate 8.
  • the sensor device 1 is located in this closure element gap 11.
  • the sensor device 1 has a front side 12 and a rear side 13.
  • the front side 12 and rear side 13 are defined, in particular, perpendicular to the coil axis 22.
  • the rear side 13 forms the mounting surface of the sensor device 1 and is fastened, in particular glued, to a support surface on the faceplate 7.
  • the sensor device 1 and thus also the support surface can extend beyond the faceplate 7.
  • the front side 12 faces the closure element gap 11.
  • the sensor device 1 it is also possible to arrange the sensor device 1 accordingly on the other side, namely on the strike plate 8.
  • the Figures 2 to 9 show in different representations the basic structure of the sensor device 1 according to the invention as well as certain special features of the first variant of the sensor device 1.
  • the sensor device 1 comprises a sensor 20.
  • the sensor 20 in turn has at least one coil 21, which is only shown here purely schematically.
  • the coil 21 defines the coil axis 22.
  • the at least one coil 21 is designed as a conductor track on the sensor board part 24 of the sensor device 1.
  • the coil 21 is a conductor track in the sensor circuit board part 24 or on the plate of the sensor circuit board part 24.
  • Several coils 21 are designed as several conductor tracks arranged one above the other in the direction of the coil axis 22. This is in Figure 8 shown.
  • the middle coil 21 is designed as a transmission coil.
  • the other two coils 21 are designed as receiving coils.
  • the sensor board part 24 lies on a base element 23.
  • the base element 23 is formed in particular from electrically non-conductive material, in particular plastic.
  • Both the base element 23 and the coil 21 and the sensor board part 24 have a through cutout 25.
  • the coil axis 22 extends through this through recess 25.
  • the sensor device 1 is arranged in the arrangement 2 in particular in such a way that the locking element 5 can extend through this passage recess 25 along the coil axis 22.
  • the sensor device 1 includes an electrical system 40.
  • This electrical system 40 is closed with a cover 30.
  • Figures 2 and 3rd show this lid 30. In Figure 4 the cover 30 is hidden.
  • the sensor device 1 comprises a holding element 31, in particular made of plastic.
  • the holding element 31 and the base element 23 form a one-piece component.
  • Figure 5 shows the holding element 31 in isolation.
  • Figure 6 the cover 30 and the holding element 31 are hidden.
  • the electrical system 40 comprises electronics 41 and two energy stores 45.
  • the energy stores 45 are designed here as button batteries.
  • the electronics 41 are composed of a plurality of electronic components 43 which are arranged on an electronic circuit board part 42.
  • the electronic components 43 are located in a potting compound 44.
  • the electronic board part 42 is designed in one piece with a memory board part 46.
  • a dashed, imaginary boundary between electronic board part 42 and memory board part 46 is drawn.
  • Electrical contacts for a first pole of the energy stores 45 are formed on the memory board part 46 (not shown).
  • the memory board part 46 there are energy storage contacts 47 for the two energy stores 45 for making electrical contact with the second pole of the energy stores 45.
  • energy storage contacts 47 for the two energy stores 45 for making electrical contact with the second pole of the energy stores 45.
  • two energy storage receptacles 32 are formed in the holding element 31.
  • the two energy storage receptacles 32 are through cutouts in the holding element 31.
  • the two energy storage receptacles 45 can be inserted into these energy storage receptacles 32 and can be contacted by the energy storage contacts 47.
  • the holding element forms an electronics cutout 33, also designed as a through cutout, surrounded by side walls 39.
  • the electronics 41 in particular the potting compound 44 with the electronic components 43, protrude into this electronics cutout 33.
  • the electrically conductive connection between electronic circuit board part 42 and sensor circuit board part 24 takes place here via a plug connection 27.
  • This plug connection 27 also extends into the electronics recess 33 of the holding element 31.
  • Figure 2 shows, the entire electrical system 40 is arranged on one side of the sensor 20.
  • Figure 2 shows a spatial direction 26, which is defined perpendicular to the coil axis 22 and intersects the coil axis 22.
  • the electronics 41 and the energy stores 45 are arranged along this spatial direction 26.
  • the electronics 41 are located between the energy stores 45 and the sensor 20.
  • FIG. 7 shows in detail the area between sensor 20 and electrical system 40.
  • the cover 30 is hidden. It can be clearly seen here that the holding element 31 has a holding element rim 36 on the front side 12. This retaining element rim 36 surrounds the electrical system 40, in particular the electronics recess 33 and the energy storage receptacles 32.
  • the cover 30, in particular in an elastic manner, can be attached to the retaining element rim 36 Design, for example made of silicone, are attached. In the attached state, the edges of the cover 30 encompass the retaining element rim 36.
  • the cover 30 and the sensor board part 34 thus form the outside and thus also the housing of the sensor device 1 on the front side 12.
  • the rear side 13, thus the mounting surface and the rear housing of the sensor device 1, is provided with an in Figure 15 illustrated adhesive element 50 formed.
  • the adhesive element 50 is also in the variant of Figures 2 to 9 available.
  • the base element 23 and the outside of the electronic board part 42 and memory board part 46 are connected to the adhesive element 50 in a materially bonded manner.
  • the electronic board part 42, the memory board part 46 and the adhesive element 50 together form a rear housing part.
  • the cover 30 forms a front housing part.
  • Figure 8 shows the same representation as Figure 7 , but without retaining element 31.
  • the two Figures 7 and 8th illustrate the offset between electronics board part 42 and coil (s) 21.
  • three coils 21 are shown as an example.
  • all of the coils (21) are not only offset, but are even at a distance 49 from the electronic circuit board part 42.
  • the electronic circuit board part 42 is shown hypothetically extended to below the sensor circuit board part 24, although the base element 23 is correctly located under the sensor circuit board part 24.
  • Figure 8 also shows a coil area 28 in which the three coils 21 are located.
  • This coil area 28 is in particular part of the sensor board part 24.
  • the coil area 28 extends from the upper end of the uppermost coil 21 to the lowermost end of the lowermost coil 21.
  • the coil area 28 has a first height 29 parallel to the coil axis 22.
  • the electronic board part 42 extends parallel to the coil axis 22 over a second height 48. This second height 48 is preferably smaller than the first height 29.
  • Figure 9 illustrates the in Figure 2 marked section A: A.
  • the exact structure of the base element 23 can be clearly seen in this illustration.
  • the base element 23 accordingly comprises the base plate 34 for receiving the Sensor board part 24.
  • two side rails 35 of base element 23 are arranged for positively locking sensor board part 34.
  • Figure 10 shows a variant of the sensor device 1.
  • the basic structure of the sensor device 1 is here as in FIG Figures 2 to 9 described. Only the cover 30 and its connection to the holding element 31 is configured differently here.
  • the lid according to Figure 10 is pushed onto the holding element 31 perpendicular to the coil axis 22 against the spatial direction 26.
  • the cover 30 has a latching tongue 37.
  • a tongue receptacle 38 is formed in the holding element 31. In the closed state, the latching tongue 37 engages in the tongue receptacle 38.
  • the Figures 11 to 14 show a variant of the sensor device 1 in which the rear side 13 is not formed by the outer sides of the electronic board part 42 and memory board part 46, but the front side 12 is formed by these elements. Accordingly, the two circuit board parts 42, 46 also function here as a cover and in this respect form part of the housing. The two board parts 42, 46 are part of the front housing part.
  • Figures 11 and 12th show the closed sensor device 1.
  • the sensor board part 24 is configured here as in the previous variants, but not shown for the sake of clarity.
  • Figure 13 shows an exploded view.
  • Figure 14 shows only the inside of the electronic board part 42 and memory board part 46, also here in a one-piece configuration.
  • the holding element 31 forms the outside of the holding element 31 together with the adhesive element 50 (not shown) a rear housing part.
  • the holding element 31 is formed in one piece with the base element 32.
  • the holding element 31 is closed by the electronic board part 42 and the memory board part 46.
  • the outer side of these board parts 42, 46 thus forms a front housing part of the Sensor device.
  • the front housing part can optionally and not shown comprise a layer of lacquer or a film.
  • the two energy stores 45 are inserted into the holding element 31 here. How in particular Figure 14 shows, there are corresponding energy storage contacts 47 on the memory board part 46. These energy storage contacts 47 can contact the energy storage 45 directly or indirectly in the assembled state of the sensor device 1. For indirect contacting, there are also energy storage contacts 47 in the holding element 31, which establish the electrically conductive contact between the memory board part 46 and the energy storage 45.
  • Figure 15 shows a fourth embodiment of a sensor device 1 according to the invention in an exploded view.
  • Figure 16 shows the fourth embodiment in a side view.
  • Figure 17 shows the view Figure 16 , wherein the cover 30, a film 51 and the holding element 31 have been removed.
  • the sensor device 1 comprises an adhesive element 50 which, as in the first exemplary embodiment, forms the rear side 13 of the sensor device 1.
  • a circuit board is integrally and integrally connected to the adhesive element 50.
  • the circuit board 60 comprises the memory board part 46 and the electronic board part 42.
  • the memory board part 46 and the electronic board part 42 are thus formed in one piece and of the same material.
  • the circuit board 60 is glued to the adhesive element 50.
  • the base element 23 is formed in one piece and of the same material with the electronics board part 42 and the memory board part 46.
  • the circuit board 60 is thus formed from the base element 23, the electronic circuit board part 42 and the memory circuit board part 42.
  • the board 60 is designed to be of the same height over the entire length L.
  • the base element 23, the The electronic board part 42 and the memory board part 42 are designed to be consistently high in the direction of the coil axis 22.
  • the sensor board part 24 is arranged on the base element 23.
  • the sensor board part 24 is materially connected to the base plate 23, in particular soldered on.
  • the sensor board part 24 contains the coils 21, at least one or two transmission coil (s) 21 being arranged between two receiving coils 21 within the sensor board part 24.
  • the receiving and transmitting coils 21 are designed with the same or parallel coil axes 22.
  • the coils 21 are electrically and cohesively connected to the base element 23, in particular soldered on.
  • the coils 21 are connected to the electrical system 40, d. h of the electronics 41 and the energy storage 45 connected.
  • the base element 23 places the coils 21 apart from the rear side 13 of the sensor device 1.
  • the base element 23 is designed as part of the circuit board 60. The base element 23 thus displaces the coils 21 from the electronics board part 42 and the memory board part 46 in the direction of the sensor axis 22.
  • the sensor device 1 is flat on the front side 12 (see FIG. Fig. 16 ). Not only are the coils 21 spaced from the rear side 13 by means of the base element 23. Rather, the base element 23 also essentially compensates for a difference in height between the sensor board part 24 and an electronics area 61. Here, the sensor board part 24 has essentially the same height as the potting compound 44 with the electronics 41. The base element 23 also essentially compensates for a difference in height between the sensor board part 24 and a storage area 62. The energy stores 45 have essentially the same height as the sensor board part 24.
  • a light barrier 52 is arranged within the sensor board part 24. By means of the light barrier 52, the position of the locking element 5 in addition to the sensors 20 designed as coils 21 can be detected. It is also conceivable, however, to configure the fourth exemplary embodiment without a light barrier 52 and to detect the operating states only by means of the sensor 20.
  • the holding element 31 is fastened on the adhesive element 50.
  • the holding element 31 is designed as a plastic frame.
  • the holding element 31 forms the electronics recess 33 as a through opening which serves as a trough for the potting compound 44.
  • the electronics recess 33 also frames the sensor 20.
  • the holding element 31 forms the energy storage receptacle 32 as a through opening.
  • the energy stores 45 are arranged within the energy store receptacle 32.
  • first electrical energy storage contacts (not shown) are formed in each case for a first pole of the energy storage 45.
  • Electrical line elements lead in or on the memory board part 46 to the electronics.
  • Second energy storage contacts 47 are connected to the second pole of energy storage 45.
  • the second energy storage contacts 47 are designed as elastic tongues of a cover 30.
  • the cover 30 is electrically conductive, in particular metallic.
  • the cover 30 comprises contact tongues 54, so that the electrical current can flow from the second pole of the energy store 45 via the energy storage contacts 47 to the contact tongues 54.
  • the contact tongues 54 are resiliently and electrically contacting against a contact field 55 of the memory board part 46. Electrical conduction elements lead from the contact field in or on the memory board part 46 to the electronics.
  • the adhesive element 50, the circuit board 60 and the holding element 31 together form a rear housing part.
  • the energy storage contacts 47 and the contact tongues 54 are designed to be resilient and rest under mechanical tension on the energy storage 45 or on the contact field 55 ensures the flow of current.
  • the second energy storage contacts 47 press the energy storage 45 against the first energy storage contacts for the first pole, so that the flow of current is also ensured here.
  • the cover 30 is materially connected to a non-conductive film 51, in particular with adhesive tape.
  • the film 51 forms part of the front side 12 of the sensor device 1.
  • the film 51 and the cover 30 together form a front-side housing part.
  • the front side 12 is formed by the potting compound 44 and the sensor board part 24.
  • the transmitting and / or receiving unit 63 and the sensor 20 are materially connected to the front side 12 and the rear side 13.
  • the sensor device 1 is designed without a housing, ie. H. Front and rear sides 12, 13 are materially connected to one another.
  • the cover 30 is attached to the holding element 31 in a reversibly releasable manner, in particular in a form-fitting manner.
  • the cover 30 comprises connecting elements 56, which can be guided through recesses 59 in the holding element 31. Thereafter, by moving the cover 30, the connecting elements 56 are brought into a form fit with projections 58 of the holding element 31 and thus fastened.
  • the connecting elements 56 and the projections 58 are designed in such a way that the energy storage contacts 47 and the contact tongues 54 are mechanically tensioned when the cover is closed.
  • the cover 30 can have projections which press the energy storage device 45 against the memory board part.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
EP19212281.0A 2019-11-28 2019-11-28 Dispositif capteur Withdrawn EP3828844A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP19212281.0A EP3828844A1 (fr) 2019-11-28 2019-11-28 Dispositif capteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19212281.0A EP3828844A1 (fr) 2019-11-28 2019-11-28 Dispositif capteur

Publications (1)

Publication Number Publication Date
EP3828844A1 true EP3828844A1 (fr) 2021-06-02

Family

ID=68732751

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19212281.0A Withdrawn EP3828844A1 (fr) 2019-11-28 2019-11-28 Dispositif capteur

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Country Link
EP (1) EP3828844A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500054C1 (de) * 1995-01-03 1996-07-18 Rgw Rechtsrheinische Gas Und W Einrichtung zum Überwachen des Schließzustandes einer Tür oder dergleichen
WO2003042959A1 (fr) * 2001-11-09 2003-05-22 Savi Technology, Inc. Procede et appareil permettant de garantir la securite d'un conteneur par un sceau
WO2016149273A1 (fr) 2015-03-18 2016-09-22 The Johns Hopkins University Utilisation d'arn hélicase à boîte dead ddx3 comme cible thérapeutique dans le cancer colorectal et procédés de traitement de celui-ci
WO2016149723A1 (fr) 2015-03-23 2016-09-29 Kaba Gmbh Serrure ou ferrure de fenêtre ou de porte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500054C1 (de) * 1995-01-03 1996-07-18 Rgw Rechtsrheinische Gas Und W Einrichtung zum Überwachen des Schließzustandes einer Tür oder dergleichen
WO2003042959A1 (fr) * 2001-11-09 2003-05-22 Savi Technology, Inc. Procede et appareil permettant de garantir la securite d'un conteneur par un sceau
WO2016149273A1 (fr) 2015-03-18 2016-09-22 The Johns Hopkins University Utilisation d'arn hélicase à boîte dead ddx3 comme cible thérapeutique dans le cancer colorectal et procédés de traitement de celui-ci
WO2016149723A1 (fr) 2015-03-23 2016-09-29 Kaba Gmbh Serrure ou ferrure de fenêtre ou de porte

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