EP3820741A1 - Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende wärmeeinträge pro fläche anpassbare wärmeabschirmvorrichtung - Google Patents
Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende wärmeeinträge pro fläche anpassbare wärmeabschirmvorrichtungInfo
- Publication number
- EP3820741A1 EP3820741A1 EP19720055.3A EP19720055A EP3820741A1 EP 3820741 A1 EP3820741 A1 EP 3820741A1 EP 19720055 A EP19720055 A EP 19720055A EP 3820741 A1 EP3820741 A1 EP 3820741A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- shielding layer
- base plate
- shield device
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R13/00—Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
- B60R13/08—Insulating elements, e.g. for sound insulation
- B60R13/0876—Insulating elements, e.g. for sound insulation for mounting around heat sources, e.g. exhaust pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
Definitions
- Heat shielding device in particular heat shielding device that can be adapted to locally different heat inputs per area
- the invention relates to a heat shielding device, in particular a heat shielding device which can be adapted to locally different heat inputs per surface area according to the preamble of claim 1.
- a generic heat shield is known from DE 20 2011 106 603 Ul. Such heat shields are not thermally uniformly loaded across their surface in practical use, so that areas with higher or higher thermal loads and areas with lower or low thermal loads are present. In order to be able to design such a heat shield permanently, it is necessary to use the entire heat shield after the highest thermal load, e.g. B. with regard to its material thickness and / or its material.
- FIG. 1 Such a heat shield according to the prior art is shown in a highly simplified manner in FIG. 1.
- a heat source 1 is covered by a shielding layer 2 of a heat shielding device 100, so that an area 3 to be shielded experiences less heat input.
- an area 5 which is subjected to high thermal stress requires a certain wall thickness of the shielding layer 2 or requires a material which is subjected to higher thermal stress.
- the object of the invention is to avoid the disadvantages of the prior art and to provide a heat shielding device which can be adapted to local heat input conditions in individual applications.
- the heat shielding device according to the invention should be able to be adapted or adapted to an uneven heat input (viewed over the surface).
- a heat shielding device has at least one flat shielding layer, the heat shielding device being set up and designed to be suitable for shielding heat from a heat source from a component or area to be protected, with the at least one shielding layer on at least one thermally highly stressed area passive cooling module is thermally conductively connected to the shielding layer.
- the passive cooling module comprises a plurality of cooling fins and / or cooling rods and a base plate, the base plate being connectable to the shielding layer.
- a cooling module can be manufactured in a number of ways and is, for. B. side by side nander, tile-like with the shielding layer.
- the base plate is thin-walled, flexible and / or pliable, which ensures that a simple adaptation of the cooling module to a topography of the shielding position is ensured.
- the cooling module with the flexible and / or the flexible base plate is flexible and / or flexible by more than one bending axis and is therefore easily adaptable to a topography of the shielding position.
- the cooling module has fastening devices for fastening the cooling module to the shielding layer in the region of the base plate.
- Figure 1 schematically a cross section through a Ablevor direction according to the prior art
- Figure 2 schematically shows a cross section through an inventive screening device.
- a heat shielding device 100 has at least one shielding layer 2, which can be formed in one or more layers in a known manner.
- the at least one shielding layer is usually made of metallic material educated. However, plastic / ceramics / fiber fabrics or other materials that have proven effective for heat shielding also come into consideration.
- a heat source 1 radiates heat onto the shielding layer 2.
- An area that is closest to the heat source 1 is a thermally highly loaded area 5, since heat from the heat source 1 is entered into the shielding layer 2 with the highest area load.
- the invention provides a passive cooling module 200 which is arranged at least in the area of the highly loaded area 5 on the side of the shielding position 2 facing away from the heat source.
- the cooling module 200 has a base plate 201 and radiation elements (eg cooling fins or cooling rods 202).
- the cooling fins or cooling rods 202 are connected to the base plate 201 in a heat-conducting manner.
- the cooling module can be a cast body or can also be composed of individual parts (base plate 201 and cooling fins / cooling rods 202).
- the base plate 201 of the cooling module 200 is suitably firmly connected to the shielding layer 2, for example by means of screws or rivets 203, so that heat transfer can take place from the shielding layer 2 to the base plate 201.
- the base plate 201 is preferably formed from a flexible / pliable material, e.g. B. in the form of a thin sheet, which, for. B. has a sheet thickness of up to 0.2 mm or 0.3 mm.
- a base plate can, when using cooling fins 202, which extend perpendicular to the plane of the drawing in the view according to FIG. 2, cause flexibility about an axis perpendicular to the plane of the drawing in FIG. 2 and thus (in a one-dimensional manner) to a possible one Topography of shielding position 2 can be adjusted.
- a cooling module can be created with a flexible, bendable and pliable base plate 201 in the manner of a "cooling hedgehog" which weles about an axis 300 (see FIG. 2) and about an axis perpendicular or at an angle to Drawing level in Figure 2 is adaptable to a topography of the shielding layer 2.
- a base plate 201 can, for example, also be formed from a highly heat-conductive plastic material, for example provided with metal.
- fabric materials that are good heat conductors for example a metal-wool plate or a wire mesh, wire mesh, in which the cooling fins / cooling rods 202 are anchored in a heat-conducting manner.
- cooling module (200) it is clarified that a single cooling fin 202 or a single cooling rod 202 can already be a cooling module in the sense of the invention.
- the base plate 201 is not an integral part of a cooling module 200th
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018116682.6A DE102018116682A1 (de) | 2018-07-10 | 2018-07-10 | Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende Wärmeeinträge pro Fläche anpassbare Wärmeabschirmvorrichtung |
PCT/EP2019/058825 WO2020011412A1 (de) | 2018-07-10 | 2019-04-08 | Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende wärmeeinträge pro fläche anpassbare wärmeabschirmvorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3820741A1 true EP3820741A1 (de) | 2021-05-19 |
Family
ID=66323811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19720055.3A Withdrawn EP3820741A1 (de) | 2018-07-10 | 2019-04-08 | Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende wärmeeinträge pro fläche anpassbare wärmeabschirmvorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210262742A1 (de) |
EP (1) | EP3820741A1 (de) |
CN (1) | CN112638716A (de) |
DE (1) | DE102018116682A1 (de) |
WO (1) | WO2020011412A1 (de) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4035177C2 (de) * | 1990-11-06 | 1996-04-11 | Helmut W Diedrichs | Abschirmung von abgasführenden Teilen an einem Kraftfahrzeug |
JP3273505B2 (ja) * | 1999-08-18 | 2002-04-08 | 古河電気工業株式会社 | 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法 |
US7254034B2 (en) * | 2004-12-15 | 2007-08-07 | Lucent Technologies Inc. | Thermal management for shielded circuit packs |
DE102005006577A1 (de) * | 2005-02-11 | 2006-08-24 | Elringklinger Ag | Strukturbauteil, insbesondere Abschirmteil |
JP2009016715A (ja) * | 2007-07-09 | 2009-01-22 | Tatsuta System Electronics Kk | シールド及び放熱性を有する高周波モジュール及びその製造方法 |
EP2090499A1 (de) * | 2008-01-25 | 2009-08-19 | GM Global Technology Operations, Inc. | Motorabdeckung mit Kühlrippen |
DE202009011843U1 (de) * | 2009-09-01 | 2010-01-07 | Reinz-Dichtungs-Gmbh | Hitzeschild |
US20120061135A1 (en) * | 2010-09-14 | 2012-03-15 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies having emi shielding properties |
DE202011106603U1 (de) | 2011-09-26 | 2012-10-18 | Reinz-Dichtungs-Gmbh | Hitzeschild mit reduzierter Lagenausdehnung |
CN105472940B (zh) * | 2014-08-20 | 2018-08-17 | 南京中兴新软件有限责任公司 | 终端散热装置及移动终端 |
US10292253B2 (en) * | 2014-10-17 | 2019-05-14 | Huawei Technologies Co., Ltd. | Heat-dissipation and shielding structure and communications product |
DE102014221225A1 (de) * | 2014-10-20 | 2016-04-21 | Siemens Aktiengesellschaft | Hitzeschildelement und Verfahren zu seiner Herstellung |
US10410948B2 (en) * | 2015-01-30 | 2019-09-10 | Netgear, Inc. | Integrated heat sink and electromagnetic interference (EMI) shield assembly |
-
2018
- 2018-07-10 DE DE102018116682.6A patent/DE102018116682A1/de active Pending
-
2019
- 2019-04-08 US US17/254,180 patent/US20210262742A1/en not_active Abandoned
- 2019-04-08 WO PCT/EP2019/058825 patent/WO2020011412A1/de unknown
- 2019-04-08 EP EP19720055.3A patent/EP3820741A1/de not_active Withdrawn
- 2019-04-08 CN CN201980042333.1A patent/CN112638716A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20210262742A1 (en) | 2021-08-26 |
CN112638716A (zh) | 2021-04-09 |
WO2020011412A1 (de) | 2020-01-16 |
DE102018116682A1 (de) | 2020-01-16 |
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