EP3740340A4 - Verfahren zum aushärten einer lötpaste auf einem thermisch zerbrechlichen substrat - Google Patents
Verfahren zum aushärten einer lötpaste auf einem thermisch zerbrechlichen substrat Download PDFInfo
- Publication number
- EP3740340A4 EP3740340A4 EP18901662.9A EP18901662A EP3740340A4 EP 3740340 A4 EP3740340 A4 EP 3740340A4 EP 18901662 A EP18901662 A EP 18901662A EP 3740340 A4 EP3740340 A4 EP 3740340A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- solder paste
- fragile substrate
- thermally fragile
- curing solder
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
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PCT/US2018/014501 WO2019143358A1 (en) | 2018-01-19 | 2018-01-19 | Method for curing solder paste on a thermally fragile substrate |
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EP3740340A1 EP3740340A1 (de) | 2020-11-25 |
EP3740340A4 true EP3740340A4 (de) | 2021-12-15 |
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EP18901662.9A Pending EP3740340A4 (de) | 2018-01-19 | 2018-01-19 | Verfahren zum aushärten einer lötpaste auf einem thermisch zerbrechlichen substrat |
Country Status (6)
Country | Link |
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EP (1) | EP3740340A4 (de) |
JP (1) | JP7118463B2 (de) |
KR (1) | KR102405231B1 (de) |
CN (1) | CN111902237B (de) |
CA (1) | CA3088725A1 (de) |
WO (1) | WO2019143358A1 (de) |
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CN116110805B (zh) * | 2023-04-13 | 2023-07-11 | 深圳宏芯宇电子股份有限公司 | 芯片键合方法、结构及存储器 |
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US20110300676A1 (en) * | 2010-06-02 | 2011-12-08 | Schroder Kurt A | Method for Providing Lateral Thermal Processing of Thin Films on Low-Temperature Substrates |
US20150221602A1 (en) * | 2012-08-21 | 2015-08-06 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Flip-Chip Hybridisation Of Two Microelectronic Components Using A UV Anneal |
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US5088189A (en) * | 1990-08-31 | 1992-02-18 | Federated Fry Metals | Electronic manufacturing process |
JPH11243224A (ja) * | 1997-12-26 | 1999-09-07 | Canon Inc | 光起電力素子モジュール及びその製造方法並びに非接触処理方法 |
US8945686B2 (en) * | 2007-05-24 | 2015-02-03 | Ncc | Method for reducing thin films on low temperature substrates |
KR101453878B1 (ko) * | 2008-08-07 | 2014-10-23 | 삼성디스플레이 주식회사 | 평판 표시장치의 제조방법 |
KR101530528B1 (ko) * | 2010-11-08 | 2015-06-22 | 파나소닉 주식회사 | 땜납 전사기재의 제조방법, 땜납 프리코트 방법 및 땜납 전사기재 |
JP2013098338A (ja) | 2011-10-31 | 2013-05-20 | Nisshinbo Mechatronics Inc | 電子部品の製造装置、電子部品の製造方法、およびled照明の製造方法 |
US9214346B2 (en) * | 2012-04-18 | 2015-12-15 | Applied Materials, Inc. | Apparatus and method to reduce particles in advanced anneal process |
JP6032637B2 (ja) | 2012-07-05 | 2016-11-30 | パナソニックIpマネジメント株式会社 | 部品実装基板の製造システム及び製造方法 |
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WO2016103800A1 (ja) | 2014-12-24 | 2016-06-30 | ソニー株式会社 | 部品除去装置、基板、部品除去方法、部品リペア装置および部品実装基板 |
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WO2017187769A1 (ja) * | 2016-04-26 | 2017-11-02 | Jsr株式会社 | 基材の処理方法および半導体装置の製造方法 |
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2018
- 2018-01-19 CA CA3088725A patent/CA3088725A1/en active Pending
- 2018-01-19 EP EP18901662.9A patent/EP3740340A4/de active Pending
- 2018-01-19 JP JP2020560860A patent/JP7118463B2/ja active Active
- 2018-01-19 WO PCT/US2018/014501 patent/WO2019143358A1/en unknown
- 2018-01-19 KR KR1020207023356A patent/KR102405231B1/ko active IP Right Grant
- 2018-01-19 CN CN201880086970.4A patent/CN111902237B/zh active Active
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Also Published As
Publication number | Publication date |
---|---|
KR102405231B1 (ko) | 2022-06-03 |
CA3088725A1 (en) | 2019-07-25 |
CN111902237A (zh) | 2020-11-06 |
KR20200108340A (ko) | 2020-09-17 |
EP3740340A1 (de) | 2020-11-25 |
CN111902237B (zh) | 2022-04-26 |
JP2021516451A (ja) | 2021-07-01 |
JP7118463B2 (ja) | 2022-08-16 |
WO2019143358A1 (en) | 2019-07-25 |
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