EP3719512A4 - Optisches messverfahren, optische messvorrichtung, optisches messprogramm und aufzeichnungsmedium zur aufzeichnung eines optischen messprogramms - Google Patents

Optisches messverfahren, optische messvorrichtung, optisches messprogramm und aufzeichnungsmedium zur aufzeichnung eines optischen messprogramms Download PDF

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Publication number
EP3719512A4
EP3719512A4 EP18881458.6A EP18881458A EP3719512A4 EP 3719512 A4 EP3719512 A4 EP 3719512A4 EP 18881458 A EP18881458 A EP 18881458A EP 3719512 A4 EP3719512 A4 EP 3719512A4
Authority
EP
European Patent Office
Prior art keywords
optical measurement
program
recording
recording medium
measurement program
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18881458.6A
Other languages
English (en)
French (fr)
Other versions
EP3719512A1 (de
Inventor
Akira Shimase
Kazuhiro Hotta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of EP3719512A1 publication Critical patent/EP3719512A1/de
Publication of EP3719512A4 publication Critical patent/EP3719512A4/de
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Artificial Intelligence (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Optical Recording Or Reproduction (AREA)
EP18881458.6A 2017-11-27 2018-09-05 Optisches messverfahren, optische messvorrichtung, optisches messprogramm und aufzeichnungsmedium zur aufzeichnung eines optischen messprogramms Pending EP3719512A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017226567A JP6898211B2 (ja) 2017-11-27 2017-11-27 光計測方法、光計測装置、光計測プログラム、及び光計測プログラムを記録する記録媒体
PCT/JP2018/032877 WO2019102683A1 (ja) 2017-11-27 2018-09-05 光計測方法、光計測装置、光計測プログラム、及び光計測プログラムを記録する記録媒体

Publications (2)

Publication Number Publication Date
EP3719512A1 EP3719512A1 (de) 2020-10-07
EP3719512A4 true EP3719512A4 (de) 2021-08-25

Family

ID=66631445

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18881458.6A Pending EP3719512A4 (de) 2017-11-27 2018-09-05 Optisches messverfahren, optische messvorrichtung, optisches messprogramm und aufzeichnungsmedium zur aufzeichnung eines optischen messprogramms

Country Status (8)

Country Link
US (1) US11181361B2 (de)
EP (1) EP3719512A4 (de)
JP (1) JP6898211B2 (de)
KR (1) KR102501485B1 (de)
CN (1) CN111512169B (de)
SG (1) SG11202004707XA (de)
TW (1) TWI805625B (de)
WO (1) WO2019102683A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102425048B1 (ko) * 2020-12-24 2022-07-27 큐알티 주식회사 반도체 소자 테스트용 빔 검사 장치, 및 빔 검사 방법
KR102418633B1 (ko) * 2021-12-22 2022-07-07 큐알티 주식회사 반도체 소자의 방사선 평가 방법, 및 반도체 소자의 방사선 평가 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040189335A1 (en) * 2002-09-03 2004-09-30 Romain Desplats Apparatus and method for detecting photon emissions from transistors
EP2439549A2 (de) * 2010-10-07 2012-04-11 Raytheon Company Nicht destruktive Bestimmung der Funktion einer unbekannten Halbleitervorrichtung
US20140067319A1 (en) * 2012-08-29 2014-03-06 Kabushiki Kaisha Toshiba Measuring method, non-transitory computer readable recording medium and measuring apparatus
US20150199583A1 (en) * 2012-07-27 2015-07-16 Hitachi High-Technologies Corporation Matching Process Device, Matching Process Method, and Inspection Device Employing Same
JP2017072542A (ja) * 2015-10-09 2017-04-13 ルネサスエレクトロニクス株式会社 発光解析装置および故障箇所特定方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940545A (en) 1996-07-18 1999-08-17 International Business Machines Corporation Noninvasive optical method for measuring internal switching and other dynamic parameters of CMOS circuits
JP3474722B2 (ja) * 1996-12-03 2003-12-08 松下電器産業株式会社 回路の抽出装置及び抽出方法、シミュレーション情報生成システム及び方法
JP2000091436A (ja) * 1998-09-09 2000-03-31 Matsushita Electric Ind Co Ltd Ｌｓｉ用パターンレイアウト作製方法、ｌｓｉ用パターン形成方法、並びにｌｓｉの製造方法
JP4163829B2 (ja) * 1999-11-09 2008-10-08 松下電器産業株式会社 マスクパターン補正方法及びそれを用いたフォトマスク
JP2002057339A (ja) * 2000-08-10 2002-02-22 Sony Corp 薄膜半導体装置
US7733100B2 (en) 2005-08-26 2010-06-08 Dcg Systems, Inc. System and method for modulation mapping
JP4945403B2 (ja) 2007-11-01 2012-06-06 ルネサスエレクトロニクス株式会社 半導体集積回路の故障箇所推定装置
WO2015098342A1 (ja) 2013-12-26 2015-07-02 浜松ホトニクス株式会社 画像処理方法、画像処理装置、画像処理プログラム、及び画像処理プログラムを記憶した記憶媒体
US9665675B2 (en) * 2013-12-31 2017-05-30 Texas Instruments Incorporated Method to improve transistor matching
US9734568B2 (en) * 2014-02-25 2017-08-15 Kla-Tencor Corporation Automated inline inspection and metrology using shadow-gram images
WO2016156360A1 (en) * 2015-04-03 2016-10-06 Asml Netherlands B.V. Inspection apparatus for measuring properties of a target structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040189335A1 (en) * 2002-09-03 2004-09-30 Romain Desplats Apparatus and method for detecting photon emissions from transistors
EP2439549A2 (de) * 2010-10-07 2012-04-11 Raytheon Company Nicht destruktive Bestimmung der Funktion einer unbekannten Halbleitervorrichtung
US20150199583A1 (en) * 2012-07-27 2015-07-16 Hitachi High-Technologies Corporation Matching Process Device, Matching Process Method, and Inspection Device Employing Same
US20140067319A1 (en) * 2012-08-29 2014-03-06 Kabushiki Kaisha Toshiba Measuring method, non-transitory computer readable recording medium and measuring apparatus
JP2017072542A (ja) * 2015-10-09 2017-04-13 ルネサスエレクトロニクス株式会社 発光解析装置および故障箇所特定方法

Also Published As

Publication number Publication date
CN111512169B (zh) 2023-11-14
SG11202004707XA (en) 2020-06-29
EP3719512A1 (de) 2020-10-07
KR102501485B1 (ko) 2023-02-21
US20200333134A1 (en) 2020-10-22
WO2019102683A1 (ja) 2019-05-31
TW201925759A (zh) 2019-07-01
JP2019095363A (ja) 2019-06-20
TWI805625B (zh) 2023-06-21
JP6898211B2 (ja) 2021-07-07
US11181361B2 (en) 2021-11-23
CN111512169A (zh) 2020-08-07
KR20200090740A (ko) 2020-07-29

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