EP3646617B1 - Ensemble transducteur acoustique comprenant une unité mems - Google Patents

Ensemble transducteur acoustique comprenant une unité mems Download PDF

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Publication number
EP3646617B1
EP3646617B1 EP18729967.2A EP18729967A EP3646617B1 EP 3646617 B1 EP3646617 B1 EP 3646617B1 EP 18729967 A EP18729967 A EP 18729967A EP 3646617 B1 EP3646617 B1 EP 3646617B1
Authority
EP
European Patent Office
Prior art keywords
unit
sound transducer
transducer arrangement
mems
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18729967.2A
Other languages
German (de)
English (en)
Other versions
EP3646617A1 (fr
Inventor
Ferruccio Bottoni
Andrea Rusconi Clerici Beltrami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USound GmbH
Original Assignee
USound GmbH
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Filing date
Publication date
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Publication of EP3646617A1 publication Critical patent/EP3646617A1/fr
Application granted granted Critical
Publication of EP3646617B1 publication Critical patent/EP3646617B1/fr
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the present invention relates to a sound transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum, with an acoustic unit comprising a vibratable membrane, with a MEMS unit comprising a MEMS structure coupled to the membrane for generating and/or detecting a deflection of the membrane, and with a carrier unit on which the MEMS unit and the acoustic unit are arranged.
  • a sound transducer arrangement with a first MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum.
  • the MEMS sound transducer is arranged on a circuit board. This is disadvantageous because the use of a circuit board as a carrier for the MEMS sound transducer sets limits in terms of stability, modular design of the sound transducer arrangement and performance of the MEMS sound transducer.
  • a chip is arranged on a subsubstrate.
  • WO 2017/055012 A1 discloses a MEMS circuit board module for a sound transducer arrangement for generating and/or detecting sound waves with a circuit board and a multilayer piezoelectric structure.
  • the object of the present invention is therefore to eliminate the disadvantages of the prior art.
  • a sound transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum is proposed.
  • the sound transducer arrangement has an acoustic unit which comprises a vibratable membrane.
  • the sound transducer arrangement has a MEMS unit, which comprises a MEMS structure coupled to the membrane for generating and/or detecting a deflection of the membrane.
  • MEMS stands for microelectromechanical systems.
  • the deflection can be transferred to the vibrating membrane. This can cause air arranged above the membrane to vibrate, so that the sound waves are generated.
  • the sound transducer arrangement can thus be designed as a loudspeaker.
  • the membrane can also be set into vibration by the air arranged above it. These vibrations can be transferred to the MEMS structure, causing it to deflect.
  • the sound transducer arrangement can thus be designed as a microphone.
  • the sound transducer arrangement comprises a carrier unit on which the MEMS unit and the acoustic unit are arranged.
  • the carrier unit comprises a metallic lead frame and a plastic body with which the lead frame is partially fused.
  • the lead frame with the fused plastic body can be used in high
  • the lead frame can be produced inexpensively in large quantities.
  • the lead frame can, for example, be punched out of a sheet of metal relatively easily.
  • the plastic body can then be arranged around the lead frame using an injection molding process.
  • the liquid plastic encloses the lead frame.
  • the lead frame can be completely melted or just in parts.
  • One advantage of this is that almost any structure can be formed on the lead frame.
  • the carrier unit has an opening. This can preferably be arranged in a central region of the carrier unit.
  • the opening is at least partially surrounded by a support region for receiving the MEMS unit.
  • the support region can advantageously be designed as a support frame.
  • the MEMS unit is placed on the support region.
  • the MEMS unit can be placed on the support region in such a way that the MEMS unit covers the opening.
  • the MEMS unit can completely cover the opening.
  • the MEMS unit can, for example, be arranged with an edge region in the support region.
  • the MEMS unit can completely close the opening.
  • the advantage of the opening is that the MEMS structure of the MEMS unit can deflect not only away from the carrier unit, but also into the opening towards the carrier unit. This deflection can take place along an axial direction to the MEMS unit.
  • the MEMS unit can also be arranged parallel to the carrier unit so that the axial direction of the MEMS unit is oriented parallel to an axial direction of the carrier unit.
  • the lead frame has frame struts and intermediate frame openings. This allows the amount of metal used for the lead frame to be reduced, so that the sound transducer arrangement is designed to save weight.
  • the frame struts can extend radially outwards from the support area.
  • the frame struts can extend radially outwards.
  • the radial direction can be oriented such that it is perpendicular to the axial direction.
  • the radial direction can also run perpendicular to the axial direction.
  • the frame struts can also be arranged parallel to one another in a first region of the support unit.
  • This first region can, for example, be arranged adjacent to the support region.
  • the first region can also be arranged around the support region.
  • the frame struts In a second region arranged radially further outward from the first region, the frame struts can be at an angle to one another. In this second region, the frame struts can move away from one another in a radial direction outwards.
  • At least some of the frame struts may have a kink.
  • the plastic body can fill at least part of the frame openings between the frame struts.
  • the plastic body can also fill the frame openings completely. This can increase the stability of the carrier unit.
  • the support area is formed by the lead frame. Additionally or alternatively, the support area can also be formed by the plastic body. Instead of the support area, the support frame can also be formed by the lead frame. Additionally or alternatively, the support frame can also be formed by the plastic body. This means that further elements for the support area or for the support frame can be dispensed with.
  • the support region has at least one electrical contact region.
  • the lead frame can also have at least one electrical contact region. With the help of the contact region, for example, electrical energy can be supplied for operating the MEMS unit.
  • audio signals can also be fed to the MEMS unit if the sound transducer arrangement is operated as a loudspeaker, for example.
  • the audio signals can also be fed away from the MEMS unit if the sound transducer arrangement is operated as a microphone, for example.
  • the support region and/or the lead frame may also have a plurality of contact regions so that a plurality of audio signals and/or other signals can be transmitted in parallel to the MEMS unit and/or in parallel away from the MEMS unit.
  • the support area and/or the lead frame has at least two contact areas, these can be electrically insulated from one another by the plastic body. This reduces the risk of a short circuit and the associated damage to the electronics of the sound transducer arrangement.
  • At least one contact area is electrically connected to the lead frame.
  • the contact area can also be connected to at least one frame strut. If the support area, for example the support frame, and/or the lead frame has several contact areas, one contact area can advantageously also be electrically connected to only one associated frame strut.
  • At least two contact areas can be electrically connected to one another. If, for example, a If a reference potential (ground) is to be applied, these can be electrically connected to one another for potential equalization.
  • the cable frame itself can be used as an electrical cable. This means that additional audio cables and/or power cables are no longer required.
  • a connection to an external unit can also be established via the frame strut(s).
  • the external unit can be, for example, a smartphone and/or a playback device.
  • the MEMS unit has at least one connection section for transmitting audio signals and/or electrical energy.
  • the connection section can thus be an interface for supplying the audio signals and/or electrical energy to the MEMS unit.
  • the audio signals can also be discharged from the MEMS unit by means of the connection section when the sound transducer arrangement is operated as a microphone.
  • connection section can be connected to the at least one contact area.
  • connection section can be connected to the contact area by means of a solder connection, for example. Additionally or alternatively, an electrically conductive adhesive connection can also be formed between the connection section and the contact area.
  • connection section of the MEMS unit With the help of the connection section of the MEMS unit, it can be easily arranged on the carrier unit or in the support area, in particular on the support frame.
  • the MEMS unit can, for example, by means of surface mounting in the support area.
  • the connection section can then coincide with the associated contact area.
  • the electrically conductive connection for example the solder connection, can then be made between the connection section and the contact area. This process can of course also be carried out quickly and easily if several connection sections are arranged on the MEMS unit and accordingly several contact areas on the support unit. This eliminates the need for complex and error-prone wiring of the MEMS unit on the support unit.
  • the carrier unit in particular adjacent to the MEMS unit, has an ASIC receptacle in which an ASIC for controlling the sound transducer arrangement can be arranged.
  • the ASIC holder has an electrical connection to the lead frame. This allows the ASIC to be supplied with electrical energy, for example.
  • the ASIC holder can also have an electrical connection to at least one frame strut.
  • the audio signals can be fed to an input of the ASIC via the at least one frame strut. This means that no further data lines are required.
  • the ASIC can also establish a connection to the external unit via the frame strut.
  • At least one first base element is arranged around the support area on a first end face of the support unit.
  • the first base element can be ring-shaped, for example.
  • the first base element can thus run around the support area.
  • the acoustic unit can also be arranged on the first base element. Additionally or alternatively, a first cavity can be formed between the acoustic unit and the carrier unit.
  • the MEMS structure for example, is deflected into the first cavity.
  • At least one second base element is arranged on a second end face opposite the first base element.
  • the second base element can be ring-shaped, for example.
  • a cover element can also be arranged on the second base element so that a second cavity can be formed between the cover element and the carrier unit.
  • the MEMS structure can also deflect into the second cavity.
  • the first and/or the second base element is also formed by the plastic body.
  • the base elements can be easily manufactured using the injection molding process, for example.
  • the base elements can thus be formed in one piece with the plastic body.
  • the carrier unit has at least one compensation opening.
  • the oscillating membrane reduces and enlarges the volume of at least the first cavity.
  • the resulting compression and expansion of the air contained in the first cavity leads to pressure and tension on the membrane.
  • the membrane is thus hindered in its free vibration.
  • a larger volume namely the volume of the first and the second cavity, can be compressed and expanded, so that the pressure and tension on the membrane is weakened.
  • the second Cavity is open so that the pressure and tension on the membrane are further reduced.
  • At least some of the frame struts protrude outwards beyond the first base element. Additionally or alternatively, at least some of the frame struts can also protrude outwards beyond the second base element.
  • the frame struts can advantageously be connected to a housing in the area of their ends.
  • the housing can be, for example, an in-ear earpiece that can be arranged in a user's ear canal as a hearing aid.
  • the housing can also be a housing for a microphone and/or a loudspeaker.
  • the protruding frame struts can thus serve as fastening elements with which the sound transducer arrangement can be arranged in the housing. This means that further fastening elements are not necessary.
  • the ends of at least some of the frame struts are bent in the axial direction towards the side of the first end face.
  • the ends of at least some of the frame struts can be bent in the axial direction towards the side of the second end face.
  • all of the frame struts can be bent towards one end face.
  • one end is bent in the axial direction towards the first end face, for example, and the end adjacent in the circumferential direction is bent in the axial direction towards the second end face. This is followed in the circumferential direction by another end that is bent in the axial direction towards the first end face.
  • the ends can be locked to the housing.
  • the housing can have receptacles into which the ends can be inserted.
  • the ends can be locked to the housing using a locking element in the receptacles and/or on the ends.
  • FIG. 1 shows a schematic sectional view of a sound transducer arrangement 1.
  • the sound transducer arrangement 1 has an acoustic unit 2 which comprises a vibratable membrane 3.
  • the membrane 3 can vibrate in an axial direction X.
  • the membrane 3 can vibrate in both directions of the axial direction X.
  • the membrane 3 can vibrate forwards and backwards. Sound waves can be generated with the help of the membrane 3 when the membrane 3 is driven. Additionally or alternatively, sound waves can also be detected with the help of the membrane 3. If the membrane 3 is exposed to sound waves, it begins to vibrate itself and can pass on the vibrations.
  • the sound transducer arrangement 1 has a MEMS unit 4, which comprises a MEMS structure 5.
  • the MEMS structure 5 is coupled to the membrane 3.
  • the sound transducer arrangement in the present embodiment has a coupling element 18.
  • the MEMS structure 5 can, for example, convert electrical signals, which can include an audio signal, into the deflections.
  • air arranged above the membrane 3 is also set into vibration, so that the sound waves are formed.
  • the sound transducer arrangement 1 can thus be operated as a loudspeaker.
  • the vibrating air causes the membrane 3 to vibrate.
  • the vibrations can be transferred from the membrane 3 to the MEMS structure 5 by means of the coupling element 18.
  • the MEMS structure 5 can use these to form electrical signals that can correspond to an audio signal.
  • the MEMS structure 5 can comprise at least one piezo element (not shown here) which generates the deflections when a voltage is applied. With the help of the piezo element, the deflection can also be converted into a voltage. The voltage can correspond to the audio signal.
  • the sound transducer arrangement 1 has a carrier unit 6.
  • the acoustic unit 2 and the MEMS unit 4 are arranged on the carrier unit 6.
  • the carrier unit 6 comprises a metallic lead frame 7 and a plastic body 8.
  • the lead frame 7 is partially melted around the plastic body 8. With the help of the lead frame 7 and the plastic body 8, the carrier unit 6 can be made more stable.
  • the metallic lead frame 7 can be made in a simple manner, for example by means of punching.
  • the metallic lead frame 7 can also be made simpler if no high electrical engineering requirements are placed on it.
  • the acoustic unit 2 can also be decoupled from the lead frame 7 against the transmission of unwanted vibrations, if, as in accordance with Figure 1 As shown, the acoustic unit 2 is arranged on the plastic body 8.
  • the carrier unit 6 has an opening 9.
  • the MEMS structure 5 can at least partially cover the opening 9.
  • the opening 9 has the advantage that the MEMS structure 5 can swing freely into the opening 9.
  • the MEMS structure 5 can thus swing freely away from the membrane 3 in the axial direction X.
  • the MEMS structure 5 pulls the membrane 3 with it.
  • the coupling element 18 can also transmit a tensile force between the membrane 3 and the MEMS structure 5. The deflection of the MEMS structure 5 is therefore not hindered by a substrate.
  • the opening 9 is further surrounded by a supporting area 10.
  • the supporting area 10 can be designed as a supporting frame that surrounds the opening 9.
  • the support area 10 can, as in Figure 1 shown, be formed by the lead frame 7.
  • the MEMS unit 4 is arranged in the support region 10.
  • the support region 10 carries the MEMS unit 4.
  • At least one first base element 21a, 21b is arranged on a first end face 19 of the carrier unit 6.
  • the at least one first base element 21a, 21b can be arranged at least partially around the support area 10.
  • two first base elements 21a, 21b are arranged around the support area 10.
  • the acoustic unit 2 is arranged on the at least one first base element 21a, 21b.
  • the acoustic unit 2 can, for example, be glued onto the at least one first base element 21a, 21b.
  • the acoustic unit 2 can, as according to Figure 1 shown, have an acoustic frame 27 on which the membrane 3 is stretched.
  • the acoustic frame 27 is arranged on the at least one first base element 21a, 21b.
  • the acoustic frame 27 can also be designed as a ring, for example.
  • the at least one first base element 21a, 21b can be formed by the lead frame 7. Additionally or alternatively, the at least one first base element 21a, 21b can be formed by the plastic body 8. In the present exemplary embodiment, the at least one first base element 21a, 21b is formed by the plastic body 8.
  • At least one second base element 22a, 22b is arranged on a second end face 20 opposite the first end face 19.
  • the at least one second base element 22a, 22b can be arranged at least partially around the support area 10.
  • two second base elements 22a, 22b are arranged around the support area 10.
  • a cover element (not shown here) can be arranged on the at least one second base element 22a, 22b.
  • the cover element can, for example, be glued onto the at least one second base element 22a, 22b.
  • the at least one second base element 22a, 22b can be formed by the lead frame 7. Additionally or alternatively, the at least one second base element 22a, 22b can be formed by the plastic body 8. In the present exemplary embodiment, the at least one second base element 22a, 22b is formed by the plastic body 8.
  • a first cavity 23 is formed between the acoustic unit 2 and the carrier unit 6. If the cover element is arranged on the at least one second base element 22a, 22b, a second cavity 24 is formed between the carrier unit 6 and the cover element.
  • At least one compensation opening 17 is arranged in the lead frame 7 and/or in the plastic body 8. According to the present embodiment of the Figure 1 Two compensating openings 17a, 17b are arranged. With the help of the at least one compensating opening 17a, 17b, a pressure between the first cavity 23 and the second cavity 24 can be equalized. The pressure is formed when the membrane 3 vibrates and the first cavity 23 shrinks and expands in volume. This hinders the vibration of the membrane 3 and can, for example, distort the recorded audio signal when the sound transducer arrangement 1 is operated as a microphone.
  • Figure 2 shows a top view of the metallic lead frame 7 of the carrier unit 6 of the sound transducer arrangement 1.
  • the lead frame 7 is also partially melted by the plastic body 8.
  • the plastic body 8 is shown hatched for better recognition. These are not necessarily sectional views.
  • the carrier unit 6 is round.
  • the lead frame 7 is melted around the plastic body 8 in such a way that the carrier unit 6 is round.
  • the carrier unit 6 can also be angular, for example rectangular, or elliptical.
  • the carrier unit 6 can also have several areas that are formed according to different shapes, for example those mentioned above.
  • the carrier unit 6 has the opening 9.
  • the opening 9 is an opening that leads through the carrier unit 6.
  • the opening 9 is at least partially surrounded by the support area 10.
  • the support region 10 completely surrounds the opening 9.
  • the support region 10 can also be designed as a support frame.
  • the support region 10 can preferably be formed at least partially by the lead frame 7.
  • the support region 10 can additionally or alternatively also be formed by the plastic body 8.
  • the MEMS unit 4 of the sound transducer arrangement 1 is also arranged in the support region 10.
  • the MEMS unit 4 can completely cover the opening 9.
  • the opening 9 can, for example, be designed in such a way that it corresponds to the size of the MEMS unit 4.
  • the MEMS unit 4 can, for example, be arranged with its edge regions in the support region 10.
  • the lead frame 7 has frame struts 11a, 11b and intermediate frame openings 12a, 12b.
  • frame struts 11a, 11b and intermediate frame openings 12a, 12b are provided with a reference symbol.
  • the frame struts 11 extend radially outwards. In the embodiment shown here, the frame struts 11 extend outwards from the opening 9. The frame struts 11 can also extend outwards away from the support area 10.
  • the frame struts 11 have at least one portion that extends radially outwards.
  • the frame struts 11 thus extend outwards in a radial direction.
  • the radial direction is perpendicular to the axial direction X of the carrier unit 6.
  • the axial direction X runs in the present Figure 1 perpendicular into the drawing plane.
  • the frame struts 11 can extend outwards parallel to one another. In the first region 13, the frame struts 11 extend radially outwards in part.
  • the frame struts 11 are at an angle to one another.
  • the frame struts 11 diverge in the second region 14.
  • a bend 15 is arranged in the frame struts 11 between the first region 13 and the second region 14.
  • a bend 15 is arranged in the frame struts 11 between the first region 13 and the second region 14.
  • only one bend of a frame strut 11 is provided with a reference symbol.
  • the frame struts 11 also have free ends 16 that protrude beyond the plastic body 8.
  • the frame struts 11 also have free ends 16 that protrude beyond the plastic body 8.
  • only one free end 16 is provided with a reference number.
  • the free ends 16 can be bent.
  • the bent free ends 16 are in Figure 1 shown. According to the Figure 1 the free ends 16 are bent in the axial direction X towards the second end face 20 of the carrier unit 6. Alternatively, the free ends 16 can also be bent in the axial direction X towards the first end face 19. Alternatively, a part of the free ends 16 can be bent towards the first end face 19 and another part of the free ends 16 can be bent towards the second end face 20.
  • the sound transducer arrangement 1 can, for example, in a housing 28 not shown here (cf. Figure 6 ).
  • the bent free ends 16 can increase the contact area between the frame struts 11 and the housing 28 so that the sound transducer arrangement 1 can be better secured in the housing 28.
  • the carrier unit 6 has at least one compensation opening 17a, 17b.
  • the carrier unit 6 has two compensating openings 17a, 17b. With the help of the at least one compensating opening 17a, 17b, a pressure between the first cavity 23 and the second cavity 24 can be compensated (cf. Figure 1 ).
  • the at least one first base element 21 is shown.
  • a single base element 21 is arranged on the carrier unit 6.
  • the first base element 21 is ring-shaped.
  • the free ends 16 of the frame struts 11 extend radially outward over the base element 21.
  • the at least second base element 22 can also be annular.
  • Figure 3 shows a plan view of a carrier unit 6 with a lead frame 7 and a plastic body 8 in an alternative embodiment.
  • the support region 10, which can be designed as a support frame has at least one electrically conductive contact region 25.
  • the contact region 25 is also part of the lead frame 7. For the sake of simplicity, only one contact region 25 is provided with a reference number in this embodiment.
  • two contact areas 25 are interrupted by the plastic body 8.
  • two contact areas 25 are electrically insulated from each other.
  • electrical Signals in particular audio signals, are led to the MEMS unit 4 and/or led away from the MEMS unit 4.
  • the MEMS unit 4 is arranged in the support area 10, at least one edge area of the MEMS unit 4 lies above the contact areas 25.
  • connection sections 26 cf. Figure 5
  • an electrical connection can be made from the MEMS unit 4 via the connection sections 26 to the contact regions 25.
  • the corresponding connection sections 26 are located in the contact regions 25.
  • the MEMS unit 4 can also be arranged in the support region 10 with the aid of a soldered connection and/or an electrically conductive adhesive connection. Additionally or alternatively, the soldered connection and/or the electrically conductive adhesive connection can also connect the MEMS unit 4, in particular the connection sections 26, to the corresponding contact regions 25.
  • the respective contact areas 25 are each electrically conductively connected to a frame strut 11.
  • the electrical signals in particular the audio signals and/or electrical energy, can be guided to the MEMS unit 4 via the frame struts 11 and/or away from the MEMS unit 4. This means that additional lines can be dispensed with.
  • Figure 4 shows a perspective top view of a part of the sound transducer arrangement 1.
  • the top view corresponds to a view of the first end face 19 of the carrier unit 6.
  • the MEMS unit 4, which comprises the MEMS structure 5, is arranged in the support area 10 covered here.
  • the coupling element 18 is arranged on the MEMS structure 5 in order to connect the MEMS structure 5 to the membrane 3 (not shown).
  • the sound transducer arrangement 1 comprises the first base element 21 on the carrier unit 6, which in this embodiment is ring-shaped and runs around the support area 10.
  • the acoustic unit 2 with the membrane can be arranged on the first base element 21.
  • FIG. 5 a perspective rear view of a part of the sound transducer arrangement 1.
  • the view here is of the second end face 20 of the carrier unit 6.
  • the MEMS structure 5 of the MEMS unit 4 can be seen through the opening 9.
  • the MEMS unit 4 has at least one connection section 26 in this embodiment.
  • only a single connection section 26 is again provided with a reference number.
  • an electrical connection to the contact areas 25 of the Figure 3 As a result, electrical signals, in particular audio signals, and/or electrical energy can be conducted to the MEMS unit 4 and/or conducted away from the MEMS unit 4 via the frame struts 11.
  • the carrier unit 6 has the second base element 22.
  • the second base element 22 is ring-shaped here.
  • the second base element 22 also surrounds the opening 9.
  • a cover element can be arranged on the second base element 22.
  • FIG. 6 shows a housing 28 with the sound transducer arrangement 1 arranged therein.
  • the sound transducer arrangement 1 comprises frame struts 11, with only one frame strut 11 being shown.
  • the frame struts 11 comprise the ends 16a, 16b, by means of which the sound transducer arrangement 1 is connected to the housing 28.
  • the ends 16a, 16b are bent so that a contact surface between the ends 16a, 16b and the housing 28 is enlarged.
  • the ends 16 can, for example, be glued, screwed and/or locked to the housing 28.
  • the sound transducer arrangement 1 can thus be arranged more stably in the housing 28.
  • the sound transducer arrangement 1 further defines a resonance chamber 29 in the housing 28, so that part of the resonance chamber 29 forms a rear volume 30.
  • the rear volume 30 is arranged on the side of the second end face 20 of the sound transducer arrangement 1.
  • the rear volume 30 can be easily adjusted in size if, for example, the sound transducer arrangement 1 is arranged further towards a central region of the housing 28.
  • the rear volume 30 is therefore smaller than the Figure 6 shown rear volume 30 is made smaller. This allows the resonance properties of the rear volume 30 to be adjusted.
  • the sound transducer arrangement 1 has a dome element 32.
  • the dome element 32 is arranged on the acoustic frame 27.
  • a front volume 31 is formed between the membrane 3 and the dome element 32.
  • the shape of the front volume 31 can be adapted according to a shape of the dome element 32. If the dome element 32 is curved further away from the membrane 3, for example, the front volume 31 increases. This allows the resonance properties of the front volume 31 to be adapted.
  • the coupling element 32 arranged on the sound transducer arrangement 1 also has a first outlet opening 33.
  • the sound generated by the membrane 3 can exit through the first outlet opening 33. Additionally or alternatively, the sound can also reach the membrane 3 through the first outlet opening 33 when the sound is detected.
  • the housing 28 has a second outlet opening 34.
  • the sound generated by the sound transducer arrangement 1 can exit the housing 28 through the second outlet opening 34.
  • the sound can also enter through the second exit opening when the sound is detected by the sound transducer arrangement 1.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Claims (13)

  1. Ensemble de transducteur acoustique (1) pour générer et/ou détecter des ondes acoustiques dans le spectre des longueurs d'ondes audibles, comprenant une unité acoustique (2) qui comprend un diaphragme (3) pouvant osciller,
    comprenant une unité MEMS (4) qui comprend une structure MEMS (5) couplée au diaphragme (3) pour générer et/ou détecter une déviation du diaphragme (3),
    comprenant un élément de couplage (18) pour coupler la structure MEMS (5) au diaphragme (3), moyennant quoi des déviations de la structure MEMS (5) sont transmises au diaphragme (3) et/ou des déviations du diaphragme (3) sont transmises à la structure MEMS (5), et
    comprenant une unité de support (6) sur laquelle est disposée l'unité acoustique (2),
    l'unité de support (6) comprenant un cadre de lignes (7) métallique et un corps en matière plastique (8) avec lequel le cadre de lignes (7) est partiellement enveloppé,
    l'unité de support (6) présentant un débouché (9) qui est au moins partiellement entouré par une zone de support (10) pour le logement de l'unité MEMS (4),
    caractérisé en ce que
    l'unité MEMS (4) est disposée sur l'unité de support (6),
    l'unité MEMS (4) est posée sur la zone de support (10),
    et
    la structure MEMS (5) de l'unité MEMS (4) ne peut pas seulement dévier à l'écart de l'unité de support (6), mais peut également dévier dans le débouché (9) vers l'unité de support (6).
  2. Ensemble de transducteur acoustique selon la revendication précédente, caractérisé en ce que la zone de support (10) est formée par un cadre de support.
  3. Ensemble de transducteur acoustique selon l'une quelconque des revendications précédentes 1 ou 2, caractérisé en ce que le cadre de lignes (7) présente des entretoises de cadre (11) et des ouvertures de cadre (12) situées entre celles-ci et de préférence le corps en matière plastique (8) remplit au moins une partie des ouvertures de cadre (12) entre les entretoises de cadre (11).
  4. Ensemble de transducteur acoustique selon l'une quelconque des revendications précédentes 2 à 3, caractérisé en ce que la zone de support (10) est formée par le cadre de lignes (7) et/ou le corps en matière plastique (8).
  5. Ensemble de transducteur acoustique selon l'une quelconque des revendications précédentes 2 à 4, caractérisé en ce que le cadre de lignes (7) présente au moins une zone de contact (25) électrique et de préférence au moins une zone de contact (25) est reliée de manière électriquement conductrice au cadre de lignes (7) ou à au moins une entretoise de cadre (11).
  6. Ensemble de transducteur acoustique selon la revendication 5, caractérisé en ce que l'unité MEMS (4) présente au moins une section de raccordement (26) pour la transmission de signaux audio et/ou d'énergie électrique, qui est reliée électriquement à la zone de contact (25) au moyen d'une liaison brasée et/ou d'une liaison adhésive électriquement conductrice.
  7. Ensemble de transducteur acoustique selon l'une quelconque des revendications précédentes, caractérisé en ce que l'unité de support (6) présente un logement ASIC dans lequel un ASIC peut être disposé pour commander l'ensemble de transducteur acoustique (1), le logement ASIC présentant de préférence une liaison électrique avec le cadre de lignes (7) et/ou avec au moins une entretoise de cadre (11), de sorte que les signaux audio et/ou l'énergie électrique peuvent être échangés entre l'ASIC et l'unité MEMS (4) et/ou une unité externe.
  8. Ensemble de transducteur acoustique selon l'une quelconque des revendications précédentes, caractérisé en ce qu'au moins un premier élément de base (21) est disposé autour de la zone de support (10) sur une première face frontale (19) de l'unité de support (6), l'unité acoustique (2) étant disposée sur le premier élément de base (21), et/ou en ce qu'une première cavité (23) est formée entre l'unité acoustique (2) et l'unité de support (6).
  9. Ensemble de transducteur acoustique selon la revendication précédente, caractérisé en ce qu'au moins un deuxième élément de base (22) est disposé autour de la zone de support (10) sur une deuxième face frontale (20) opposée au premier élément de base (21).
  10. Ensemble de transducteur acoustique selon l'une quelconque des revendications précédentes 8 à 9, caractérisé en ce que le premier et/ou le deuxième élément de base (21, 22) est formé par le corps en matière plastique (8).
  11. Ensemble de transducteur acoustique selon la revendication 8, caractérisé en ce que l'unité de support (6) comprend au moins un débouché de compensation (17) au moyen duquel une pression entre la première et la deuxième cavité (23, 24) peut être compensée.
  12. Ensemble de transducteur acoustique selon la revendication 3, caractérisé en ce qu'au moins une partie des entretoises de cadre (11) font saillie radialement vers l'extérieur au-delà du premier et/ou du deuxième élément de base (21, 22).
  13. Ensemble de transducteur acoustique selon la revendication 9, lorsqu'elle dépend des revendications 3 et 8, caractérisé en ce que les extrémités (16) d'au moins une partie des entretoises de cadre (11) sont courbées dans la direction axiale (X) sur le côté de la première et/ou de la deuxième face frontale (19, 20).
EP18729967.2A 2017-06-26 2018-06-08 Ensemble transducteur acoustique comprenant une unité mems Active EP3646617B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017114142.1A DE102017114142A1 (de) 2017-06-26 2017-06-26 Schallwandleranordnung mit einer MEMS-Einheit
PCT/EP2018/065172 WO2019001930A1 (fr) 2017-06-26 2018-06-08 Ensemble transducteur acoustique comprenant une unité mems

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EP3646617B1 true EP3646617B1 (fr) 2024-04-17

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CN (1) CN110915236B (fr)
AU (1) AU2018292941A1 (fr)
CA (1) CA3068339A1 (fr)
DE (1) DE102017114142A1 (fr)
SG (1) SG11201912970YA (fr)
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CN111885467B (zh) * 2020-07-09 2021-09-21 诺思(天津)微系统有限责任公司 Mems压电扬声器

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US8493748B2 (en) * 2007-06-27 2013-07-23 Stats Chippac Ltd. Packaging system with hollow package and method for the same
DE102011004577B4 (de) * 2011-02-23 2023-07-27 Robert Bosch Gmbh Bauelementträger, Verfahren zur Herstellung eines solchen Bauelementträgers sowie Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger
DE102011084393A1 (de) * 2011-10-13 2013-04-18 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US9986354B2 (en) * 2013-06-26 2018-05-29 Infineon Technologies Ag Pre-mold for a microphone assembly and method of producing the same
CN104427456B (zh) * 2013-08-20 2017-12-05 无锡华润上华科技有限公司 一种减少微机电系统麦克风制作过程中产生的粘黏的方法
DE102015107560A1 (de) 2015-05-13 2016-11-17 USound GmbH Schallwandleranordnung mit MEMS-Schallwandler
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CA3068339A1 (fr) 2019-01-03
KR20200023414A (ko) 2020-03-04
AU2018292941A1 (en) 2020-02-13
TW201904859A (zh) 2019-02-01
CN110915236A (zh) 2020-03-24
US20210067853A1 (en) 2021-03-04
EP3646617A1 (fr) 2020-05-06
WO2019001930A1 (fr) 2019-01-03
US11128942B2 (en) 2021-09-21
SG11201912970YA (en) 2020-01-30
DE102017114142A1 (de) 2018-12-27

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