EP3599796B1 - Bande lumineuse à del et système d'éclairage - Google Patents

Bande lumineuse à del et système d'éclairage Download PDF

Info

Publication number
EP3599796B1
EP3599796B1 EP19188110.1A EP19188110A EP3599796B1 EP 3599796 B1 EP3599796 B1 EP 3599796B1 EP 19188110 A EP19188110 A EP 19188110A EP 3599796 B1 EP3599796 B1 EP 3599796B1
Authority
EP
European Patent Office
Prior art keywords
led
circuit board
led light
contact surfaces
light strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19188110.1A
Other languages
German (de)
English (en)
Other versions
EP3599796A1 (fr
Inventor
Roland Michal
Franz Witthalm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bilton International GmbH
Original Assignee
Bilton International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102018121451.0A external-priority patent/DE102018121451B3/de
Application filed by Bilton International GmbH filed Critical Bilton International GmbH
Publication of EP3599796A1 publication Critical patent/EP3599796A1/fr
Application granted granted Critical
Publication of EP3599796B1 publication Critical patent/EP3599796B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30Driver circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/70Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light-emitting diode light band (hereinafter “LED light band”) and a lighting system comprising such an LED light band.
  • LED light band a light-emitting diode light band
  • a lighting system comprising such an LED light band.
  • LED light strips usually consist of segments, each typically about 50 mm in length. These segments are connected in parallel to each other and usually operated with a constant DC voltage of 12 V or 24 V. Each of these segments usually has 6 or 7 LEDs.
  • a light-emitting diode current of a segment is kept constant at a predetermined value by means of a current regulator.
  • the light-emitting diode current of a segment is determined by means of an electrical resistor.
  • Such LED light strips are simple and inexpensive to manufacture.
  • a luminous flux of such an LED light strip gradually falls over the length of the LED light strip, since no current regulator is provided according to this variant. In both variants there are significant electrical losses that impair the efficiency of the LED light strips.
  • the US 2018/124889 A1 shows an LED tube lamp in which an LED is arranged on a light strip.
  • the US 2017/328531 A1 shows a circuit board on which several electronic components are connected in series.
  • US 2015/270716 A1 and US 2014/197695 A1 each show a capacitive coupling of a device with several LEDs or with several transmitting electrodes to a power generator.
  • the US 2014/191587 A1 shows a capacitive coupling of a consumer to a transparent layer stack.
  • the US 2011/084624 A1 shows a light source with a large number of LEDs that are capacitively connected to a power supplier.
  • the US 2015/289326 A1 shows a capacitive coupling of an LED which is arranged in a housing.
  • the US 2016/234890 A1 shows a capacitive coupling of an LED module which is embedded between two electrodes.
  • the US 2013/313983 A1 shows a lighting means in which a plurality of LEDs are arranged on a light strip.
  • the object of the present invention is to describe an LED light strip and a lighting system which eliminate or reduce the above-mentioned disadvantages of conventional LED light strips.
  • this comprises a printed circuit board. At least one light-emitting diode, LED, is arranged on a first side of the circuit board. Furthermore, two electrically conductive contact surfaces are arranged for each LED on the first side of the circuit board. Two conductor tracks are arranged on a second side of the circuit board. Two of the electrically conductive contact surfaces are electrically connected to an LED. Of the contact areas that are electrically connected to the same LED, one contact area with one of the two conductor tracks forms a coupling capacitor. The coupling capacitors are set up to generate, based on a high-frequency alternating voltage applied to the conductor tracks, a displacement current in the contact areas for energizing the LED that is electrically connected to the contact areas.
  • light-emitting diodes are understood to mean both light-emitting diode chips and LED components with such a light-emitting diode chip.
  • the light-emitting diodes can be surface-mounted.
  • a light emitting diode chip can be comprise optoelectronic semiconductor bodies or an organic layer sequence.
  • the light-emitting diode chips can be semiconductor chips or OLED chips.
  • the light-emitting diodes preferably emit light in the visible spectral range or in the UV range or in the IR range.
  • LEDs arranged on the first side of the circuit board are supplied with energy independently of one another without contact via the conductor tracks arranged on the second side of the circuit board.
  • Contactless in this context describes the lack of electrical contact between the electrically conductive contact surfaces and the conductor tracks. There is physical contact between the electrically conductive contact surfaces and the conductor tracks via the circuit board.
  • Another advantage is that the individual LEDs are mounted isolated from one another on the circuit board.
  • the LEDs are not electrically connected to one another.
  • the lack of electrical interconnection between the LEDs, as is common with conventional LED light strips, results in a simpler and cost-saving structure of the LED light strip.
  • This also enables the LED light band to be separated between any LED. This is also not possible in conventional light strips due to the interconnection of the LEDs.
  • no plated-through holes through the printed circuit board are required for the LED light band shown here, which likewise simplifies a production process for such a light band and contributes to a reduction in the cost of the light band.
  • the coupling capacitors form a coupling resonant circuit with the inductances of the conductor tracks.
  • the high-frequency alternating voltage that is applied to the conductor tracks can, for example, have a frequency corresponding to a resonance frequency of this oscillating coupling circuit or deviate from this resonance frequency.
  • a rectifier circuit is arranged for each LED on the first side of the circuit board.
  • the displacement current generated in the contact surfaces is converted into a direct current for operating the respective LEDs.
  • so-called alternating current LEDs i.e. LEDs connected in anti-parallel, are used as LEDs instead of a rectifier circuit. In this case, one of the anti-parallel connected LEDs is operated with a half-wave of the displacement current.
  • the circuit board is made at least partially from a plastic material.
  • the circuit board forms a dielectric for the coupling capacitors.
  • polyimides or polyimide-containing substances are suitable as the material for the circuit board.
  • a material of the printed circuit board consists at least partially of polyethylene terephthalate, PET.
  • the printed circuit board is elastically deformable.
  • the entire LED light strip is also elastically deformable. This makes possible flexible and versatile use of the LED light strip in a wide variety of application areas.
  • At least one further LED is arranged on the first side of the circuit board.
  • the contact surfaces electrically connected to the at least one LED have a different two-dimensional extent than the contact surfaces electrically connected to the at least one further LED.
  • An extension parallel to a main plane of extent of the printed circuit board is regarded here as the two-dimensional extension of the contact surfaces.
  • An advantage of this embodiment is that the differently dimensioned contact surfaces result in differently dimensioned coupling capacitors composed of the contact surface and the conductor strip.
  • the coupling capacitors of different LEDs therefore have different capacities. This results in different resonance frequencies for the resonant coupling circuits of different LEDs. Depending on a frequency of the applied alternating voltage, certain LEDs can thus be operated with a resonance frequency of their associated resonant circuit, while other LEDs are operated at this frequency outside the resonance frequency of their associated resonant circuits. This enables a selectively controllable lumen output of individual LEDs or individual groups of LEDs on the LED light strip.
  • LEDs or LED groups with different color temperatures are provided with coupling capacitors of different dimensions in the LED light strip described here.
  • the coupling capacitors of LEDs with a higher color temperature are dimensioned larger than the coupling capacitors of LEDs with a lower color temperature.
  • the lighting system comprises an LED light strip as described above. Furthermore, the lighting system comprises a feed device which is set up to apply a high-frequency AC voltage to the two conductor tracks of the LED light strip.
  • the feed device is set up to apply a high-frequency alternating voltage with a frequency in a range from 1 MHz to 10 MHz to the two conductor tracks.
  • alternating voltages with other frequencies can also be used to operate the LED light strip.
  • the feed device comprises a serial resonance converter, in particular a serial resonance converter with a full bridge circuit.
  • a serial resonance converter in particular a serial resonance converter with a full bridge circuit.
  • the LED light strip 1 comprises an elongated flexible strip-shaped printed circuit board 2.
  • the printed circuit board has a width b1 of approximately 10 mm and a height h1 of approximately 100 ⁇ m, a base material of the circuit board made of a polyimide with a Height of 50 ⁇ m.
  • a plurality of LEDs 3 are mounted on a first side A of the circuit board 2.
  • the LEDs 3 are arranged in a row along a main direction of extent of the LED light strip 1.
  • the LEDs 3 can also be mounted on the circuit board 2 in some other way.
  • other shapes of the circuit board 2 than the elongated strip-shaped circuit board 2 shown here are of course also possible.
  • Figure 2 shows a section of the LED light strip 2 according to Figure 1 , in which an LED 3 of the plurality of LEDs 3 according to Figure 1 you can see.
  • the LEDs 3 are, for example, each an LED chip provided with a leadframe-based plastic coating, for example PLCC2 SMD LEDs, PLCC4 SMD LEDs or PLCC6 SMD LEDs, high-power SMD LEDs and / or LED chip arrays in SMD Housings (so-called CAS LEDs) which are mounted on the circuit board 2 using surface (SMD) mounting technology.
  • a leadframe-based plastic coating for example PLCC2 SMD LEDs, PLCC4 SMD LEDs or PLCC6 SMD LEDs, high-power SMD LEDs and / or LED chip arrays in SMD Housings (so-called CAS LEDs) which are mounted on the circuit board 2 using surface (SMD) mounting technology.
  • SMD surface
  • the LEDs 3 are LED chips that are mounted on the circuit board 2 using chip-on-board (COB) technology.
  • COB chip-on-board
  • the LEDs 3 are centered between two side edges of the circuit board 2 on the first side A. the printed circuit board 2 mounted.
  • an electrically conductive contact surface 4 is arranged on the first side A of the circuit board 2 between each LED 3 and one side edge of the circuit board 2.
  • the contact surfaces 4 are rectangular copper islands which extend parallel to a main plane of extent of the printed circuit board 2.
  • the contact surfaces 4 have a height h2 of approximately 36 ⁇ m and a surface area of approximately 32 mm 2 , with a width b2 of approximately 4 mm and a length 12 of approximately 8 mm.
  • the contact surfaces 4 of different LEDs 3 can, however, also have different planar dimensions. This is below with reference to Figure 3 described in more detail.
  • the contact surfaces 4 are produced, for example, by etching a copper-coated printed circuit board.
  • two electrically conductive conductor tracks 5 are arranged on a second side B of the printed circuit board 2 opposite the first side A.
  • the conductor tracks 5 are made of copper and extend parallel to one another along a longitudinal direction of the strip-shaped printed circuit board 2.
  • the conductor tracks 5 each have a height h3 of approximately 36 ⁇ m and a width b3 of slightly less than 5 mm.
  • the conductor tracks 5, like the contact surfaces 4, are also etched out of a copper coating.
  • Each LED 3 has two contact surfaces 4, that is to say each LED 3 is electrically connected to two contact surfaces 4.
  • the contact surfaces 4 and the conductor tracks 5 are arranged on the circuit board 2 in such a way that one of the two contact surfaces 4 connected to the same LED 3 is opposite one of the two conductor tracks 5. In particular, as large a part as possible overlaps one Expansion area of the contact area 4 or the entire expansion area of the contact area 4 with an expansion area of the opposite conductor track 5.
  • Each contact surface 4 forms a coupling capacitor with the conductor track 5 opposite it.
  • the contact surfaces 4 each represent a first electrode
  • the conductor tracks 5 each represent a second electrode
  • the circuit board 2 lying between them represents a dielectric of these coupling capacitors.
  • a displacement current is generated in the contact surfaces 4 by means of capacitive coupling.
  • One of the conductor tracks 5 represents a forward line, the other a ground return line for applying the high-frequency AC voltage.
  • soldering points or other connection points to connect the conductor tracks 5 to a feed device for applying the high-frequency AC voltage connect (not shown here).
  • a rectifier circuit 6 is also mounted on the first side A of the printed circuit board 2 in order to operate the LEDs 3 with a direct current.
  • the rectifier circuits 6 have diodes and capacitors for rectifying and smoothing the displacement currents that are generated in the contact surfaces 4. The rectifier circuits 6 are explained in more detail with reference to FIG Figure 3 described.
  • FIG. 3 shows a circuit diagram of a lighting system 7 according to an embodiment of the invention.
  • the circuit diagram of the lighting system 7 shows a circuit of an LED light strip 1, for example the LED light strip 1 according to FIG Figures 1 and 2 , of which only the interconnection of a single LED 3 is shown here for the sake of simplicity.
  • the circuit diagram also shows the lighting system 7 according to FIG Figure 3 a circuit of a feed device 8 for applying a high-frequency alternating voltage to the conductor tracks 5.
  • inductances 9 represent the self-inductances according to the Figures 1 and 2
  • the capacitors 10 represent the coupling capacitors belonging to an LED 3, each consisting of a contact surface 4 and the opposite conductor 5.
  • the feed device 8 has a serial resonance converter which applies a nearly sinusoidal, high-frequency alternating voltage to the capacitors 10 via the inductances 9 by means of a full bridge circuit.
  • a voltage of +5 V is applied to a first terminal 13 of the feed device 8, and a second terminal 14 of the feed device 8 is connected to a ground potential GND.
  • the feed device 8 also has transistors 15 which are switched in such a way that a predetermined frequency of the high-frequency alternating voltage is generated.
  • the rectifier circuit 6 has two diodes 11 to rectify the displacement currents generated in the contact surfaces 4.
  • the diodes 11 are, for example, combined in one component as a so-called double diode.
  • a double diode with a periodic peak voltage of 100 V, a forward current of 125 mA and a switching time of a maximum of 4 ns can be used.
  • the rectifier circuit also has two filter capacitors 12, which reduce a residual ripple in the rectified voltage.
  • a center between the two filter capacitors 12 forms a reference potential. In this way, the most constant possible voltage for operating the LED 3 is generated.
  • inductive elements such as, for example, coils, can also be used for smoothing.
  • the transistors 15 are switched in such a way that the predetermined frequency of the high-frequency alternating voltage applied to the conductor tracks 5 corresponds to a resonance frequency of the resonant circuit comprising the inductances 9 and the capacitors 10.
  • the transistors 15 are switched in such a way that the predetermined frequency of the high-frequency alternating voltage deviates from the resonance frequency of the resonant circuit. The greater this deviation, the weaker the resonant coupling via the capacitors 10 and the current that flows through the LED 3 is correspondingly weaker. In this way, a lumen output of the LED 3 is reduced. A luminous flux of the LED 3 is thus greater in the first operating mode than in the second operating mode.
  • the resonance frequency of the oscillating circuit is influenced, among other things, by the area of the coupling capacitors. It is thus possible to interconnect two LEDs with differently dimensioned contact surfaces so that the resonance frequencies of the oscillating circuits belonging to the LEDs vary. In this way, high-frequency alternating voltages with different predetermined frequencies can be generated in the feed device 8, which for example correspond to either the resonance frequency of the resonant circuit of one LED or the other LED. One of the two LEDs is operated in the first operating mode, while the other LED is operated in the second operating mode.
  • a predetermined frequency is selected that deviates, for example, by about 10% from the resonance frequency of the resonant circuit of one LED and by about 5% from the resonant frequency of the resonant circuit of the other LED.
  • whole groups of LEDs can be connected to differently dimensioned coupling capacitors, or any number of differently dimensioned coupling capacitors can be connected to corresponding LEDs, so that resonant circuits with any number of different resonance frequencies are available.
  • the LEDs, which are connected to coupling capacitors of different dimensions can have different colors or color temperatures. In this way, the most varied of dimming scenarios and color constellations can be generated with the lighting system 7.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Claims (9)

  1. Bande lumineuse à LED (1), comprenant:
    - une carte de circuit (2), et
    - au moins une diode électroluminescente, LED, (3) disposée d'un premier côté (A) de la carte de circuit (2),
    caractérisée en ce que la bande lumineuse à LED (1) comprend en outre:
    - par LED (3), deux faces de contact (4) électriquement conductrices disposées du premier côté (A) de la carte de circuit (2), et
    - deux pistes conductrices (5) disposées d'un deuxième côté (B) de la carte de circuit (2), sachant que
    - respectivement deux des faces de contact (4) électriquement conductrices sont connectées électriquement à une LED (3) et, des faces de contact (4) qui sont connectées à la même LED (3), respectivement une face de contact (4) forme à chaque fois un condensateur de couplage avec respectivement une des deux pistes conductrices (5), sachant que les condensateurs de couplage sont configurés pour, sur la base d'une tension alternative à haute fréquence appliquée aux pistes conductrices (5), générer dans les faces de contact (4) un courant de décalage destiné à alimenter les LED (3) connectées électriquement aux faces de contact (4).
  2. Bande lumineuse à LED (1) selon la revendication 1, sachant que, par LED (3), un circuit redresseur (6) est disposé du premier côté (A) de la carte de circuit (2), sachant que le circuit redresseur (6) est configuré pour redresser le courant de décalage généré dans les faces de contact (4) et l'appliquer à la LED (3) respective.
  3. Bande lumineuse à LED (1) selon l'une des revendications 1 ou 2, sachant que la carte de circuit (2) est composée au moins en partie d'un matériau synthétique et sachant que la carte de circuit (2) forme un diélectrique des condensateurs de couplage.
  4. Bande lumineuse à LED (1) selon l'une des revendications 1 à 3, sachant que la carte de circuit (2) est déformable élastiquement.
  5. Bande lumineuse à LED (1) selon l'une des revendications 1 à 4, sachant que les faces de contact (4) électriquement conductrices présentent une extension en plan, parallèlement à la carte de circuit (2), de l'ordre de 1 millimètre carré à 100 millimètres carrés.
  6. Bande lumineuse à LED (1) selon l'une des revendications 1 à 5, sachant qu'au moins une LED (3) supplémentaire est disposée du premier côté (A) de la carte de circuit (2) et les faces de contact (4) connectées électriquement à l'au moins une LED (3) présentent une autre extension en plan que les faces de contact (4) connectées électriquement à l'une LED (3) supplémentaire.
  7. Système d'éclairage (7), comprenant une bande lumineuse à LED (1) selon l'une des revendications 1 à 6 et un dispositif d'alimentation (8) qui est configuré pour appliquer la tension alternative à haute fréquence aux deux pistes conductrices (5) de la bande lumineuse à LED (1).
  8. Système d'éclairage (7) selon la revendication 7, sachant que le dispositif d'alimentation (8) est configuré pour appliquer la tension alternative à haute fréquence aux au moins deux pistes conductrices (5) avec une fréquence de l'ordre de 1 mégahertz à 10 mégahertz.
  9. Système d'éclairage (7) selon l'une des revendications 7 ou 8, sachant que le dispositif d'alimentation (8) comprend un convertisseur à résonance série.
EP19188110.1A 2018-07-26 2019-07-24 Bande lumineuse à del et système d'éclairage Active EP3599796B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018118151 2018-07-26
DE102018121451.0A DE102018121451B3 (de) 2018-07-26 2018-09-03 LED-Lichtband und Leuchtsystem

Publications (2)

Publication Number Publication Date
EP3599796A1 EP3599796A1 (fr) 2020-01-29
EP3599796B1 true EP3599796B1 (fr) 2021-02-24

Family

ID=67438798

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19188110.1A Active EP3599796B1 (fr) 2018-07-26 2019-07-24 Bande lumineuse à del et système d'éclairage

Country Status (1)

Country Link
EP (1) EP3599796B1 (fr)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009153715A2 (fr) * 2008-06-17 2009-12-23 Koninklijke Philips Electronics N.V. Dispositif électroluminescent à courant alternatif
CN103403439B (zh) * 2011-02-04 2016-10-19 皇家飞利浦电子股份有限公司 具有led带的照明单元
JP6118320B2 (ja) * 2011-08-16 2017-04-19 フィリップス ライティング ホールディング ビー ヴィ 容量性電力伝送を用いた配電のための広表面導電層
JP6096191B2 (ja) * 2011-08-16 2017-03-15 フィリップス ライティング ホールディング ビー ヴィ 透過的容量性無線給電システム
US20150270716A1 (en) * 2012-10-02 2015-09-24 Koninklijke Philips N.V. Multi frequency power driver for a wireless power transfer system
EP2907162A1 (fr) * 2012-10-15 2015-08-19 Koninklijke Philips N.V. Boîtier de del à couplages capacitifs
CN105794319B (zh) * 2013-09-24 2018-03-30 飞利浦灯具控股公司 湿法处理的电子系统
US10299333B2 (en) * 2014-09-28 2019-05-21 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
AT516416B1 (de) * 2014-10-21 2019-12-15 Zkw Group Gmbh Leiterplatte mit einer Mehrzahl von an der Leiterplatte in zumindest einer Gruppe angeordneter elektronischer Bauteile

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
EP3599796A1 (fr) 2020-01-29

Similar Documents

Publication Publication Date Title
EP1264518B1 (fr) Commande de diodes electroluminescentes (led)
DE102011056878B4 (de) Lichtemittierende Vorrichtung
WO2013107894A1 (fr) Dispositif à composants optoélectroniques
DE202010009679U1 (de) Eine LED-Beleuchtungseinrichtung
DE112013000619T5 (de) Integrierter Treiber eines Nullenergiespeichers in einem LED-Chipträger
DE102018107472A1 (de) Beleuchtungsvorrichtung, Fahrzeugscheinwerfer und Fahrzeug
DE102015102081A1 (de) Licht emittierende vorrichtung und verfahren zum betreiben mehrerer licht emittierender anordnungen
DE112016005574T5 (de) Halbleitermodul
DE10315768A1 (de) Mehrlagige Leiterplatte
DE102016103087A1 (de) Modul mit lichtemittierendem Festkörperelement und Beleuchtungsanordnung
DE102015121686A1 (de) Leistungsversorgungsvorrichtung und Beleuchtungsvorrichtung
EP3599796B1 (fr) Bande lumineuse à del et système d'éclairage
EP2580946B1 (fr) Agencement de diode luminescente et élément lumineux comprenant notamment un tel agencement de diode luminescente
DE102018121451B3 (de) LED-Lichtband und Leuchtsystem
DE102017103184B4 (de) Retrofit-Halbleiterlampe mit verbesserten EMI-Eigenschaften
WO2013004547A1 (fr) Module multipuce del haute tension et procédé de réglage d'un module multipuce del
AT414200B (de) Weisse led-lichtquelle
US10559528B2 (en) Semiconductor device including external terminal groups
EP3281289B1 (fr) Convertisseur de puissance pourvu de commutateurs à semi-conducteurs montés en parallèle
DE102014202196B3 (de) Leiterplatte und Schaltungsanordnung
DE102013211457A1 (de) Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
DE102014224564B4 (de) SSL-Baugruppe mit Resonanzwandler und mehreren AC-LED-Ketten sowie Verfahren zum Betreiben einer derartigen SSL-Baugruppe mit Wechselstrom
EP3599797A1 (fr) Système d'éclairage et procédé de fonctionnement d'un système d'éclairage
DE102012217932B4 (de) Optoelektronisches Bauelement mit Schutzschaltung
DE112015007243T5 (de) Festkörperbeleuchtungsanordnung

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502019000859

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H05B0033080000

Ipc: H05B0045000000

17P Request for examination filed

Effective date: 20200728

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: F21Y 115/10 20160101ALI20200821BHEP

Ipc: F21S 4/24 20160101ALI20200821BHEP

Ipc: H05B 45/00 20200101AFI20200821BHEP

Ipc: F21Y 107/70 20160101ALI20200821BHEP

Ipc: F21Y 103/10 20160101ALI20200821BHEP

Ipc: F21V 23/02 20060101ALI20200821BHEP

INTG Intention to grant announced

Effective date: 20200916

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502019000859

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1366118

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210315

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20210224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210624

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210525

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210524

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

REG Reference to a national code

Ref country code: NO

Ref legal event code: T2

Effective date: 20210224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210624

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502019000859

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

26N No opposition filed

Effective date: 20211125

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20210731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IE

Payment date: 20220119

Year of fee payment: 3

Ref country code: DE

Payment date: 20220120

Year of fee payment: 3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210624

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210724

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502019000859

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220724

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20190724

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NO

Payment date: 20230720

Year of fee payment: 5

Ref country code: CH

Payment date: 20230801

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20230724

Year of fee payment: 5

Ref country code: FR

Payment date: 20230720

Year of fee payment: 5

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20230724

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210224

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230724