EP3588554A4 - Electronic device, connector, and method for producing electronic device - Google Patents
Electronic device, connector, and method for producing electronic device Download PDFInfo
- Publication number
- EP3588554A4 EP3588554A4 EP17838112.5A EP17838112A EP3588554A4 EP 3588554 A4 EP3588554 A4 EP 3588554A4 EP 17838112 A EP17838112 A EP 17838112A EP 3588554 A4 EP3588554 A4 EP 3588554A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic device
- connector
- producing
- producing electronic
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/006029 WO2018150558A1 (en) | 2017-02-20 | 2017-02-20 | Electronic device, connector, and method for producing electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3588554A1 EP3588554A1 (en) | 2020-01-01 |
EP3588554A4 true EP3588554A4 (en) | 2020-09-02 |
Family
ID=62706293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17838112.5A Pending EP3588554A4 (en) | 2017-02-20 | 2017-02-20 | Electronic device, connector, and method for producing electronic device |
Country Status (6)
Country | Link |
---|---|
US (1) | US11404353B2 (en) |
EP (1) | EP3588554A4 (en) |
JP (1) | JP6349470B1 (en) |
KR (1) | KR102048481B1 (en) |
CN (1) | CN109075146A (en) |
WO (1) | WO2018150558A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10294473A (en) * | 1997-04-17 | 1998-11-04 | Hitachi Ltd | Surface-mount type semiconductor device and manufacture thereof |
US20130241047A1 (en) * | 2011-03-24 | 2013-09-19 | Mitsubishi Electric Corporation | Power semiconductor module and power unit device |
US20150087114A1 (en) * | 2009-10-27 | 2015-03-26 | Yan Xun Xue | Method for packaging a power device with bottom source electrode |
US20160079221A1 (en) * | 2013-07-04 | 2016-03-17 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method and semiconductor device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58119665A (en) * | 1982-01-11 | 1983-07-16 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPS6373946A (en) | 1986-09-18 | 1988-04-04 | 株式会社東芝 | Magnetic resonance imaging apparatus |
JPS6373946U (en) * | 1986-10-31 | 1988-05-17 | ||
US6249041B1 (en) | 1998-06-02 | 2001-06-19 | Siliconix Incorporated | IC chip package with directly connected leads |
KR20000057810A (en) | 1999-01-28 | 2000-09-25 | 가나이 쓰토무 | Semiconductor device |
US6307755B1 (en) | 1999-05-27 | 2001-10-23 | Richard K. Williams | Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die |
JP3740116B2 (en) * | 2002-11-11 | 2006-02-01 | 三菱電機株式会社 | Molded resin encapsulated power semiconductor device and manufacturing method thereof |
JP5267959B2 (en) | 2011-05-30 | 2013-08-21 | 株式会社デンソー | Semiconductor module and driving device using the same |
JP2015012065A (en) | 2013-06-27 | 2015-01-19 | 株式会社デンソー | Method of manufacturing semiconductor device |
WO2016084483A1 (en) * | 2014-11-27 | 2016-06-02 | 新電元工業株式会社 | Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor device |
JP6522402B2 (en) * | 2015-04-16 | 2019-05-29 | ローム株式会社 | Semiconductor device |
US10109617B2 (en) * | 2016-07-21 | 2018-10-23 | Samsung Electronics Co., Ltd. | Solid state drive package |
-
2017
- 2017-02-20 JP JP2017555413A patent/JP6349470B1/en active Active
- 2017-02-20 CN CN201780003204.2A patent/CN109075146A/en active Pending
- 2017-02-20 KR KR1020187008203A patent/KR102048481B1/en active IP Right Grant
- 2017-02-20 EP EP17838112.5A patent/EP3588554A4/en active Pending
- 2017-02-20 US US15/751,845 patent/US11404353B2/en active Active
- 2017-02-20 WO PCT/JP2017/006029 patent/WO2018150558A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10294473A (en) * | 1997-04-17 | 1998-11-04 | Hitachi Ltd | Surface-mount type semiconductor device and manufacture thereof |
US20150087114A1 (en) * | 2009-10-27 | 2015-03-26 | Yan Xun Xue | Method for packaging a power device with bottom source electrode |
US20130241047A1 (en) * | 2011-03-24 | 2013-09-19 | Mitsubishi Electric Corporation | Power semiconductor module and power unit device |
US20160079221A1 (en) * | 2013-07-04 | 2016-03-17 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method and semiconductor device |
Non-Patent Citations (1)
Title |
---|
See also references of WO2018150558A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2018150558A1 (en) | 2018-08-23 |
EP3588554A1 (en) | 2020-01-01 |
JP6349470B1 (en) | 2018-06-27 |
US20200219797A1 (en) | 2020-07-09 |
KR102048481B1 (en) | 2019-11-25 |
JPWO2018150558A1 (en) | 2019-02-21 |
KR20180105629A (en) | 2018-09-28 |
CN109075146A (en) | 2018-12-21 |
US11404353B2 (en) | 2022-08-02 |
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Legal Events
Date | Code | Title | Description |
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STAA | Information on the status of an ep patent application or granted ep patent |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20180215 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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Extension state: BA ME |
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DAV | Request for validation of the european patent (deleted) | ||
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STAA | Information on the status of an ep patent application or granted ep patent |
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R17P | Request for examination filed (corrected) |
Effective date: 20180215 |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20200803 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/495 20060101ALI20200728BHEP Ipc: H01L 21/60 20060101ALI20200728BHEP Ipc: H01L 23/48 20060101AFI20200728BHEP |
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Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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17Q | First examination report despatched |
Effective date: 20220125 |