EP3531011A1 - Module lumineux et station de fabrication - Google Patents

Module lumineux et station de fabrication Download PDF

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Publication number
EP3531011A1
EP3531011A1 EP19156422.8A EP19156422A EP3531011A1 EP 3531011 A1 EP3531011 A1 EP 3531011A1 EP 19156422 A EP19156422 A EP 19156422A EP 3531011 A1 EP3531011 A1 EP 3531011A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
light module
printed circuit
light source
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19156422.8A
Other languages
German (de)
English (en)
Inventor
Michael Schmaderer
Ephraim Singer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP3531011A1 publication Critical patent/EP3531011A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines

Definitions

  • the invention relates to a light module for a lighting device of a motor vehicle and to a manufacturing station for the light module.
  • the DE 20 2014 002 809 U1 discloses an illumination device with a carrier on which a semiconductor light source arrangement is arranged.
  • the heat sink has a heat sink section, which forms a contact surface for the carrier.
  • light modules are equipped with die cast heat sinks to provide sufficient heat dissipation from the heat generating light source devices.
  • a heat-conducting material is applied to the heat sink, and then the printed circuit board is screwed to the heat sink.
  • a light module comprising: a light source device; a circuit board on which the light source device is disposed; and a heat dissipation element, which is positively connected in a connection region between the heat dissipation element and the printed circuit board to the printed circuit board, and which abuts at least in sections on the printed circuit board.
  • the mechanically strong connection between the printed circuit board and the heat dissipating element improves the heat dissipation from the printed circuit board.
  • the increased heat transport also improves the electrical efficiency, since an operating point of the light source component at a reduced temperature is associated with a reduced energy consumption.
  • other components and manufacturing steps can be omitted.
  • the use of thermal grease can be omitted.
  • screw connections between heat dissipation element and circuit board can be omitted.
  • a more favorable light module that is more effective and heat-dissipating is provided.
  • the proposed light module makes it possible further to use a light source device with increased radiation power and thus with increased lighting benefits, which is associated with increased heat dissipation.
  • connection region a clinch connection between the printed circuit board and the heat sink.
  • the clinch connection is advantageous particularly resistant and defies in particular coupled vibrations.
  • the printed circuit board comprises a metal substrate and a conductive pattern, wherein the conductive pattern is separated from the metal substrate by a dielectric.
  • the metal substrate is particularly suitable for making the clinch connection.
  • An advantageous embodiment is characterized in that the heat dissipation element, at least in sections, rests flat against the printed circuit board, in particular on the metal substrate.
  • the flat system ensures a heat input into the heat dissipation element.
  • An advantageous embodiment is characterized in that at least one heat-emitting element, in particular a cooling fin, is connected to the heat-dissipating element.
  • An advantageous embodiment is characterized in that the heat dissipation element is a U-shaped cooling profile.
  • a U-shaped cooling profile is easy and inexpensive to produce and ensures direct heat dissipation from the circuit board to the ambient air.
  • An advantageous embodiment is characterized in that at least one cooling fin protrudes from a secondary side of the printed circuit board.
  • An advantageous embodiment is characterized in that the at least one cooling fin essentially runs perpendicular to an imaginary surface through the circuit board. This can be done an improved heat dissipation.
  • the light source component is a semiconductor light source component, in particular an SMD LED.
  • An advantageous embodiment is characterized in that the light source component is arranged on a primary side of the printed circuit board.
  • An advantageous embodiment is characterized in that a heat dissipation section of the light source component contacts a heat dissipation section of the circuit board. As a result, a heat dissipation capacity is increased.
  • An advantageous embodiment is characterized in that a contact region between the light source component and the printed circuit board and the connecting region are spaced so far apart that the conductive pattern in the region of the contact region is not damaged by the connecting region.
  • An advantageous embodiment is characterized in that an imaginary longitudinal axis of the heat dissipation region and an imaginary axis differ by at least 20 °, in particular by 90 °, by a number of light source components. This allows an increased number of heat dissipation elements are arranged on the circuit board.
  • An advantageous embodiment is characterized in that the light source component is connected between two connection regions of the printed circuit board with the heat dissipation element. This ensures a mechanical contacting of the printed circuit board with the heat dissipation element for improved heat dissipation.
  • An advantageous embodiment is characterized in that a heat conduction path leads from the light source component via a solder joint and the printed circuit board to the heat dissipation element.
  • An advantageous embodiment is characterized in that a different heat conduction path leads from the light source component via a heat pad of the light source component and a heat pad of the printed circuit board to the heat dissipation element.
  • Another aspect of this description relates to a manufacturing station for the light module, wherein the manufacturing station is adapted to perform the following manufacturing steps: arranging the printed circuit board and the heat-dissipating element in a position to be connected to one another; Moving a punch from a first side of the assembly of the circuit board and the heat dissipation member toward a die located on a second side of the assembly, and pressing the punch onto the assembly and pressing the assembly into the die.
  • FIG. 1 shows a perspective view of a light module 106 or a part thereof for a lighting device of a motor vehicle.
  • the light module 106 includes a circuit board 2, a plurality of light source devices 4a to 4h, and a number of heat dissipates elements 6a to 6h.
  • the light source components 4a to 4h are each an SMT semiconductor light source component (SMT: Surface Mounted Technology) and are arranged on a primary side 8 of the printed circuit board 2.
  • the heat-conducting elements 6a to 6h are arranged on a secondary side 10 of the printed circuit board 2.
  • the number of heat dissipation elements 6a to 6h corresponds to the number of light source components 4a to 4h.
  • the light source components 4a to 4h are connected to the printed circuit board 2 via respective solder joints.
  • the heat dissipation elements 14 are connected in a form-fitting manner to the printed circuit board 2 via respective connecting regions 12 and 14.
  • the light source member 14d is disposed between the two connection portions 12d and 14d.
  • the printed circuit board 2 is preferably an IMS (Insulated Metallic Substrate) printed circuit board and thus comprises a metal substrate, which is separated from a conductor pattern by a dielectric.
  • IMS Insulated Metallic Substrate
  • the heat dissipation elements 6a to 6h can of course also be designed differently.
  • the resulting and coupled into the circuit board 2 heat energy can be dissipated via an elongated heat dissipation element to another heat dissipation element elsewhere, for example, to save space on the secondary side of the circuit board 2.
  • Each of the heat sinks 6a to 6h comprises two cooling fins.
  • the heat dissipation element 6d comprises cooling fins 7d and 9d. Both cooling fins 7d and 9d are connected to one another in an intermediate region 11d, wherein the intermediate region 11d is provided for contact with the printed circuit board 2 and for connection to the printed circuit board 2.
  • FIG. 2 shows a schematic perspective view of the illumination device for a motor vehicle, which in its entirety by the reference numeral 101 denotes.
  • the lighting device 101 is formed in the illustrated embodiment as a motor vehicle headlight. Of course, the lighting device 101 may also be designed as a light or the like, which is arranged at the rear or laterally on the motor vehicle.
  • the lighting device 101 comprises a housing 102, which is preferably made of plastic. In a light exit direction 103, the headlight housing 102 has a light exit opening, which is closed by a transparent cover 104.
  • the Cover 104 is made of colorless plastic or glass.
  • the light modules 105, 106 are arranged inside the headlight housing 102.
  • the light modules 105, 106 are arranged fixed or relative to the housing 102 movable.
  • the light modules 105, 106 can be designed as reflection modules and / or as projection modules. Of course, more or fewer than the illustrated two light modules 105, 106 may be provided in the headlight housing 102.
  • a control device 107 is arranged in a control unit housing 108.
  • the control device 107 serves to control and / or regulate the light modules 105, 106 or of subcomponents of the light modules 105, 106, such as the light source components of the light modules 105, 106.
  • the control of the light modules 105, 106 or of the subcomponents by the control unit 107 occurs via connecting lines 110, which in FIG. 1 are shown only symbolically by a dashed line. Via the lines 110, the light modules 105, 106 are supplied with electrical energy.
  • FIG. 3 shows a schematic section along an xz plane FIG. 1 an assembly comprising the printed circuit board 2, the heat dissipation member 6d and the light source member 4d.
  • the printed circuit board 2 comprises a layer structure.
  • the layer structure of the printed circuit board 2 comprises at least one metal substrate 16, a dielectric 18 and a conductive pattern 20, which is arranged on the dielectric 18.
  • this structure of the circuit board 2 only by way of example and may include a higher number of layers and different arrangement of layers.
  • connection region 12d the printed circuit board 2 is positively connected to the heat dissipation element 6d.
  • This connection is in particular a clinch connection and fixes the circuit board 2 by a formed undercut in the heat dissipation element 6d and the engagement of the circuit board 2 in the undercut to the heat sink 6d.
  • the connection portion 12d is disposed in the vicinity of the light source member 4d to secure the surface contact of the circuit board 2 to the heat sink member 6d and to ensure coupling of the heat energy from the circuit board 2 into the heat sink member 6d.
  • the light source device 4d comprises a housing section 22 and a light emission section 24, which is essentially responsible for the heat development of the light source device 4d.
  • a heat conduction path 26 leads, in particular, through a solder joint 28, which connects an electrical contact section 30 of the light source component 4d to the conductor pattern 20.
  • a further heat conduction path 28 leads via a further non-electrical contact section 32, which merely serves to dissipate heat from the light source component 4d, the non-electrical contact section 32 being connected to the copper image 20.
  • the pattern 20 and the metal substrate 16 include, for example, copper.
  • the metal substrate 16 in another embodiment, for example, comprises aluminum.
  • the Heat dissipation element 6d is made for example of a metal sheet and preferably also comprises a metal such as aluminum.
  • FIG. 4 shows a schematic flow diagram.
  • a first step 402 the printed circuit board and the heat dissipation element are produced to each other so that in the next step 404, a connection of the printed circuit board with the heat dissipation element can take place.
  • step 404 a punch is lowered from the primary side of the circuit board onto the circuit board.
  • On the opposite side of the circuit board of the arrangement is a die.
  • step 406 following step 404, the punch is pressed onto the assembly and in the direction of the die.
  • the positions of the circuit board and the sauceableitelements be swapped and the punch is pressed from the side of the heat dissipation element in the direction of the circuit board.
  • FIG. 5 shows a schematic section of a manufacturing station for the light module.
  • step 404 is off FIG. 4 shown.
  • the punch 502 is moved in the direction of the die 506 according to an arrow 504, wherein the assembly 510 consisting of the printed circuit board 2 and the heat sink 6d is arranged between the punch 502 and the die 506.
  • the die 506 includes, for example, a surface 512 perpendicular to the direction of the arrow 504, which is recessed within a cylinder 514 opposite the opening of the die, and which is surrounded by an annular recess 516.
  • FIG. 6 shows a schematic section of the manufacturing station for the light module. In particular, the Step 406 off FIG. 4 shown.
  • the punch 502 By pressing in the direction 504, the punch 502 ensures that the arrangement 510 is pressed into the recess of the die 506 and thus forms a positive connection in the sense of the connection region 12d.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP19156422.8A 2018-02-13 2019-02-11 Module lumineux et station de fabrication Withdrawn EP3531011A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202018100769.6U DE202018100769U1 (de) 2018-02-13 2018-02-13 Lichtmodul und Fertigungsstation

Publications (1)

Publication Number Publication Date
EP3531011A1 true EP3531011A1 (fr) 2019-08-28

Family

ID=65493808

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19156422.8A Withdrawn EP3531011A1 (fr) 2018-02-13 2019-02-11 Module lumineux et station de fabrication

Country Status (2)

Country Link
EP (1) EP3531011A1 (fr)
DE (1) DE202018100769U1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022113815A1 (de) 2022-06-01 2023-12-07 Marelli Automotive Lighting Reutlingen (Germany) GmbH Lichtquellenmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3663642A1 (fr) * 2018-12-04 2020-06-10 ZKW Group GmbH Corps de refroidissement pour un module d'éclairage de véhicule automobile

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007034123A1 (de) * 2007-07-21 2009-01-22 Automotive Lighting Reutlingen Gmbh Leuchtmodul für einen Xenonlicht- oder Halbleiterlichtquellenscheinwerfer
EP2031299A1 (fr) * 2007-08-31 2009-03-04 Siemens AG Österreich Dispositif destiné à l'agencement de lampes DEL
DE202014002809U1 (de) 2014-03-31 2014-04-11 Osram Gmbh Beleuchtungseinrichtung
US20160009216A1 (en) * 2014-07-09 2016-01-14 Samsung Electronics Co., Ltd. Light source module and lighting device including the same
DE102016002821A1 (de) * 2016-03-05 2017-09-07 Wabco Gmbh Schaltkreis einer elektronischen Steuereinheit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007034123A1 (de) * 2007-07-21 2009-01-22 Automotive Lighting Reutlingen Gmbh Leuchtmodul für einen Xenonlicht- oder Halbleiterlichtquellenscheinwerfer
EP2031299A1 (fr) * 2007-08-31 2009-03-04 Siemens AG Österreich Dispositif destiné à l'agencement de lampes DEL
DE202014002809U1 (de) 2014-03-31 2014-04-11 Osram Gmbh Beleuchtungseinrichtung
US20160009216A1 (en) * 2014-07-09 2016-01-14 Samsung Electronics Co., Ltd. Light source module and lighting device including the same
DE102016002821A1 (de) * 2016-03-05 2017-09-07 Wabco Gmbh Schaltkreis einer elektronischen Steuereinheit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022113815A1 (de) 2022-06-01 2023-12-07 Marelli Automotive Lighting Reutlingen (Germany) GmbH Lichtquellenmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs

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Publication number Publication date
DE202018100769U1 (de) 2019-05-14

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