EP3501242A4 - PLASMA ETCHED CATALYTIC LAMINATE WITH INTERCONNECTION HOLES - Google Patents

PLASMA ETCHED CATALYTIC LAMINATE WITH INTERCONNECTION HOLES Download PDF

Info

Publication number
EP3501242A4
EP3501242A4 EP17842034.5A EP17842034A EP3501242A4 EP 3501242 A4 EP3501242 A4 EP 3501242A4 EP 17842034 A EP17842034 A EP 17842034A EP 3501242 A4 EP3501242 A4 EP 3501242A4
Authority
EP
European Patent Office
Prior art keywords
vias
traces
plasma etched
catalytic laminate
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17842034.5A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3501242A1 (en
Inventor
Kenneth S. Bahl
Konstantine Karavakis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Catlam LLC
Original Assignee
Catlam LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/240,133 external-priority patent/US9706650B1/en
Priority claimed from US15/645,957 external-priority patent/US10849233B2/en
Application filed by Catlam LLC filed Critical Catlam LLC
Publication of EP3501242A1 publication Critical patent/EP3501242A1/en
Publication of EP3501242A4 publication Critical patent/EP3501242A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
EP17842034.5A 2016-08-18 2017-08-16 PLASMA ETCHED CATALYTIC LAMINATE WITH INTERCONNECTION HOLES Pending EP3501242A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/240,133 US9706650B1 (en) 2016-08-18 2016-08-18 Catalytic laminate apparatus and method
US15/645,957 US10849233B2 (en) 2017-07-10 2017-07-10 Process for forming traces on a catalytic laminate
PCT/US2017/047062 WO2018035184A1 (en) 2016-08-18 2017-08-16 Plasma etched catalytic laminate with traces and vias

Publications (2)

Publication Number Publication Date
EP3501242A1 EP3501242A1 (en) 2019-06-26
EP3501242A4 true EP3501242A4 (en) 2020-04-15

Family

ID=61196986

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17842034.5A Pending EP3501242A4 (en) 2016-08-18 2017-08-16 PLASMA ETCHED CATALYTIC LAMINATE WITH INTERCONNECTION HOLES

Country Status (4)

Country Link
EP (1) EP3501242A4 (ko)
KR (2) KR102649271B1 (ko)
CN (2) CN114501781A (ko)
WO (1) WO2018035184A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9922951B1 (en) * 2016-11-12 2018-03-20 Sierra Circuits, Inc. Integrated circuit wafer integration with catalytic laminate or adhesive
US10827624B2 (en) * 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629185A (en) * 1969-10-17 1971-12-21 Kollmorgen Corp Metallization of insulating substrates
US20060191709A1 (en) * 2005-02-25 2006-08-31 Samsung Electro-Mechanics Co., Ltd. Printed circuit board, flip chip ball grid array board and method of fabricating the same
JP2010135719A (ja) * 2008-12-08 2010-06-17 Kinko Denshi Kofun Yugenkoshi 回路板の製造工程及び回路板
US20150334836A1 (en) * 2014-05-19 2015-11-19 Konstantine Karavakis Via in a printed circuit board

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512829A (en) * 1983-04-07 1985-04-23 Satosen Co., Ltd. Process for producing printed circuit boards
US4737446A (en) * 1986-12-30 1988-04-12 E. I. Du Pont De Nemours And Company Method for making multilayer circuits using embedded catalyst receptors
JPH04100294A (ja) * 1990-08-20 1992-04-02 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
US20060068173A1 (en) * 2004-09-30 2006-03-30 Ebara Corporation Methods for forming and patterning of metallic films
KR101904093B1 (ko) * 2011-08-17 2018-10-04 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 무전해 금속화를 위한 안정한 촉매
WO2013136729A1 (ja) * 2012-03-16 2013-09-19 住友ベークライト株式会社 積層板及びプリント配線板の製造方法
US10573610B2 (en) * 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
US9380700B2 (en) * 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
US9706667B2 (en) * 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
US9631279B2 (en) * 2014-05-19 2017-04-25 Sierra Circuits, Inc. Methods for forming embedded traces

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629185A (en) * 1969-10-17 1971-12-21 Kollmorgen Corp Metallization of insulating substrates
US20060191709A1 (en) * 2005-02-25 2006-08-31 Samsung Electro-Mechanics Co., Ltd. Printed circuit board, flip chip ball grid array board and method of fabricating the same
JP2010135719A (ja) * 2008-12-08 2010-06-17 Kinko Denshi Kofun Yugenkoshi 回路板の製造工程及び回路板
US20150334836A1 (en) * 2014-05-19 2015-11-19 Konstantine Karavakis Via in a printed circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018035184A1 *

Also Published As

Publication number Publication date
KR102649271B1 (ko) 2024-03-18
WO2018035184A1 (en) 2018-02-22
EP3501242A1 (en) 2019-06-26
CN109906670A (zh) 2019-06-18
KR20220070580A (ko) 2022-05-31
KR20190049736A (ko) 2019-05-09
CN114501781A (zh) 2022-05-13

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