EP3489998A1 - Assemblage d'une bande de micro diodes électroluminescentes sur un panneau arrière - Google Patents

Assemblage d'une bande de micro diodes électroluminescentes sur un panneau arrière Download PDF

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Publication number
EP3489998A1
EP3489998A1 EP18207794.1A EP18207794A EP3489998A1 EP 3489998 A1 EP3489998 A1 EP 3489998A1 EP 18207794 A EP18207794 A EP 18207794A EP 3489998 A1 EP3489998 A1 EP 3489998A1
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EP
European Patent Office
Prior art keywords
leds
strip
backplane
fabrication substrate
μled devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP18207794.1A
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German (de)
English (en)
Inventor
Celine Claire Oyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meta Platforms Technologies LLC
Original Assignee
Facebook Technologies LLC
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Filing date
Publication date
Priority claimed from US15/824,579 external-priority patent/US10989376B2/en
Application filed by Facebook Technologies LLC filed Critical Facebook Technologies LLC
Publication of EP3489998A1 publication Critical patent/EP3489998A1/fr
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate

Definitions

  • This disclosure relates generally to assembling microLEDs ( ⁇ LEDs), and in particular using strips of ⁇ LED devices to fabricate a display device.
  • a HMD such as for a virtual reality (VR) system, typically includes an electronic display that emits light to the eyes of the viewer, and an optical block positioned between the display and the eyes.
  • the optical block includes optical components that receive light emitted from the electronic display, and adjust an orientation of the light such that the electronic display appears at one or more particular focal distances from user.
  • Light emitting devices such as light emitting diodes (LEDs) are used in electronic display panels to emit light for image production.
  • the conventional method of producing ⁇ LED arrays involves picking an individual ⁇ LED device, placing it on a chip, and binding the ⁇ LED device to the chip.
  • Such thin devices require development of a specific micro-assembly flow based on polymer adhesion or stamp which is costly and time-consuming.
  • Embodiments relate to manufacturing a light emitting diode assembly by coupling strips of micro light emitting diodes ( ⁇ LEDs) onto a backplane. Electrical contacts of a first strip of ⁇ LEDs attached with a first fabrication substrate are coupled to first interconnections on a backplane. The fabrication substrate is removed from the first strip of ⁇ LEDs after coupling the electrical contacts. A second strip of ⁇ LEDs is attached with a second fabrication substrate coupled to second interconnections on the backplane. The second fabrication substrate is removed from the second strip of ⁇ LEDs after coupling the second strip of ⁇ LEDs.
  • ⁇ LEDs micro light emitting diodes
  • a third strip of ⁇ LEDs attached with a third fabrication substrate is coupled to third interconnections on the backplane.
  • the third fabrication substrate is removed from the third strip of ⁇ LEDs after coupling the third strip of ⁇ LEDs.
  • Embodiments also relate to assembly flow of light emitting diode assembly using monolithic assembly method.
  • a strip of first ⁇ LED devices attached with a fabrication substrate is coupled with interconnections on a backplane. Electrodes of the strip attached to the interconnections share a first electrical contact that provide a first voltage to the strip of red ⁇ LED devices. The other electrodes not attached to the interconnections share a second electrical contact that provides a second voltage that is higher or lower than the first voltage.
  • Embodiments according to the invention are in particular disclosed in the attached claims directed to a method, and a light emitting diode (LED), wherein any feature mentioned in one claim category, e.g. method, can be claimed in another claim category, e.g. LED, system, computer program product, storage medium, as well.
  • the dependencies or references back in the attached claims are chosen for formal reasons only. However any subject matter resulting from a deliberate reference back to any previous claims (in particular multiple dependencies) can be claimed as well, so that any combination of claims and the features thereof is disclosed and can be claimed regardless of the dependencies chosen in the attached claims.
  • a method of manufacturing a light emitting diode assembly may comprise:
  • a method may comprise:
  • the second fabrication substrate and the third fabrication substrate may be made of sapphire.
  • the second fabrication substrate and the third fabrication substrate may be simultaneously removed using Laser Lift Off (LLO).
  • LLO Laser Lift Off
  • the electrical contacts of the first strips of LEDs may be attached to first interconnections on the backplane and the electric contacts of the second strips of LEDs may be attached to the second interconnections on the backplane through temperature and compress (TC) bonding.
  • TC temperature and compress
  • the first fabrication substrate may be made of GaAs.
  • Removing the first fabrication substrate may comprise: etching the first fabrication substrate by chemical wet etching.
  • Each of the first and second strips of LEDs may comprise micro LEDs.
  • a light emitting diode (LED) assembly may comprise:
  • the strip of second LEDs may be parallel to the strip of first LEDs.
  • a LED assembly may comprise a strip of third LEDs on the backplane adjacent to the strip of the second LEDs sharing an electrical contact to provide the first voltage across the third LEDs, each of the third LEDs having another electrical contact for providing a fourth voltage higher or lower than the first voltage to each of the third LEDs.
  • the first and second LEDs may be micro LEDs.
  • the strip of the first LEDs and the strip of the second LEDs may emit light of a same color.
  • the LED assembly may comprise more than three strips of LEDs including the strip of first LEDs and the strip of second LEDs.
  • one or more computer-readable non-transitory storage media may embody software that is operable when executed to perform a method or in a LED assembly according to the invention or any of the above mentioned embodiments.
  • a system may comprise: one or more processors; and at least one memory coupled to the processors and comprising instructions executable by the processors, the processors operable when executing the instructions to perform a method or in a LED assembly according to the invention or any of the above mentioned embodiments.
  • a computer program product preferably comprising a computer-readable non-transitory storage media, may be operable when executed on a data processing system to perform a method or in a LED assembly according to the invention or any of the above mentioned embodiments.
  • Embodiments relate to a method to fabricating a display device by assembling strips of ⁇ LED devices onto a backplane instead of individually picking and placing each ⁇ LED device onto the backplane.
  • a strip of first ⁇ LED devices producing one color e.g., red
  • the strip of first ⁇ LED devices is coupled to a set of interconnections on the backplane.
  • the first fabrication substrate is removed from the strip of first ⁇ LED devices.
  • a strip of second ⁇ LED devices producing the same or another color (e.g., red or green) is attached to a second fabrication substrate.
  • the strip of second ⁇ LED devices is coupled to another set of interconnections on the backplane.
  • the process may be repeated for a strip of third ⁇ LED devices producing the same or yet another color (e.g., red, green, or blue).
  • fabrication substrates on the second and third ⁇ LED devices are simultaneously removed by laser based lift-off (LLO) method if the fabrication substrates on the second and third ⁇ LED devices are sapphire.
  • LLO laser based lift-off
  • the fabrication substrate described herein refers to the material on which a strip of ⁇ LED devices is fabricated.
  • the fabrication substrate may be subject to one or more of deposition process, etching process and heating process to form the strip of ⁇ LED devices.
  • the fabrication substrate may also provide structural support to the strip of ⁇ LED devices before the strip of ⁇ LED devices are transferred to a temporary carrier substrate or a backplane.
  • the backplane herein refers to a substrate with interconnections for securing ⁇ LED devices and for providing current to the ⁇ LED devices.
  • ⁇ LED devices are generally placed onto the backplane as their final target substrate.
  • FIG.1A is a plan view of a backplane 100 and its interconnections 110, according to one embodiment.
  • the interconnections 110 may be in the form of bumps and are connected to electrodes of the ⁇ LED devices to provide current to the ⁇ LED devices.
  • the interconnections 110 are connected to conductive lines (not shown) that extend on or in the backplane 100.
  • the interconnections 110 may include interconnections 110A that are connected to p-electrodes and interconnections 110B that are connected to n-electrodes.
  • interconnections 110 are provided as interconnections 110 on the backplane 100 while a conductive line may be connected to a side of the separate line to function as a common negative voltage source (i.e., ground).
  • the interconnections 110 may be made of conductive materials such as copper, copper alloys and silver.
  • the interconnections 110 are formed along straight lines that extend parallel to each other. However, in other embodiments, the interconnections may be formed along curved lines or some random lines.
  • the backplane 100 is a substrate sufficiently rigid to provide support for the ⁇ LED devices.
  • the backplane 100 may be formed of silicon or other materials with conductive lines on or in the backplane 100 to provide current to turn on the ⁇ LED devices.
  • the backplane 100 may also include circuit components (not shown) such as transistors and capacitance to operate the ⁇ LED devices.
  • FIG. 1B is a cross-sectional diagram illustrating the backplane 100, the interconnections 110 taken along line A-A' of FIG. 1A , according to one embodiment.
  • the rows of interconnections 110A, 110B extend across the backplane 110 and protrude from the top surface of the backplane 100.
  • FIG.2 illustrates the backplane 100 attached with a strip of red ⁇ LED devices 200, according to one embodiment.
  • the red ⁇ LED devices 200 are fabricated on a fabrication substrate 205, which may be GaAs.
  • a body 210 of red ⁇ LED devices 200 may be fabricated, for example, by growing various layers of material on the fabrication substrate 205 using chemical vapor deposition (CVD).
  • the red ⁇ LED devices 200 also include electrodes 215.
  • each ⁇ LED device 200 includes a p-electrode and a n-electrode, while in other embodiments, each ⁇ LED device may have either of an individual p-electrode but sharing n-electrode through the body of the ⁇ LED device or vice versa.
  • the electrodes 215 of the red ⁇ LED devices 200 are connected to the interconnections 110 of the backplane 100 through, for example, thermocompressive (TC) bonding.
  • TC thermocompressive
  • FIG. 3 illustrates the backplane 100 attached with the strip of red ⁇ LED devices 200 in FIG. 2 and the fabrication substrate 205 removed, according to one embodiment.
  • the fabrication substrate 205 attached with the body 210 of red ⁇ LED devices is unnecessary once the strip of red ⁇ LED 200 is mounted onto the backplane 100 because the backplane 100 provides support for the body 210 of red ⁇ LED devices.
  • the backplane 100 is removed from the strip of red ⁇ LED devices 200 by etching. Hence, portions of the backplane 100 and interconnections 110 not attached with the strip of red ⁇ LED devices 200 are covered with a layer of resist material to prevent an etching medium from negatively impacting properties of these components. After applying a layer of resist material, the backplane 100 attached with the strip of red ⁇ LED devices 200 is treated with the etching medium. The resist material is selected based on factors such as the etching medium used, the temperature of the etching medium, and duration of etching. When the backplane 100 is immersed in a chemical bath of etching medium, the fabrication substrate 200 is selectively removed from the strip of red ⁇ LED devices 200, exposing the body 210 of ⁇ LED devices.
  • FIG. 4 illustrates the backplane 100 attached with an additional strip of green ⁇ LED devices 400 adjacent and parallel to the strip of red ⁇ LED devices 400, according to one embodiment.
  • the green ⁇ LED devices 400 are fabricated on a fabrication substrate 405, which may be a transparent substrate such as sapphire.
  • the body 410 of green ⁇ LED devices 400 may be fabricated, for example, by growing various layers of material on the fabrication substrate 405 using, for example, chemical vapor deposition (CVD).
  • the body 410 may comprise InGaN, with the ratio of Indium adjusted to create a bandgap that is associated with green light. Because there is a high lattice mismatch between Sapphire and InGaN due to their crystal structure, there may be a GaN buffer (not shown in FIG. 4 ) placed between the fabrication substrate 405 and the body 410 to decrease the lattice mismatch.
  • the green ⁇ LED devices 400 also include electrodes 415.
  • each ⁇ LED device 400 includes a p-electrode and a n-electrode, while in other embodiments, each ⁇ LED device may have either of an individual p-electrode but sharing n-electrode through the body of the ⁇ LED device or vice versa.
  • the electrodes 415 of the green ⁇ LED devices 400 are connected to the interconnections 110 of the backplane 100 through, for example, temperature and compression (TC) bonding.
  • TC temperature and compression
  • the strip of green ⁇ LED is attached with a portion of backplane 100 adjacent and parallel to the strip of red ⁇ LED.
  • the electrodes 415 of the green ⁇ LED devices 400 are attached with the body 410, which is attached with the sapphire 405.
  • the electrodes 415 of the green ⁇ LED devices 400 are connected to the interconnections 110 of the backplane 100 through, for example, temperature and compression (TC) bonding.
  • FIG. 5 illustrates the backplane attached with a strip of blue ⁇ LED devices 500 adjacent and parallel to the strips of ⁇ LED devices 200, 400, according to one embodiment.
  • the backplane 100 is attached with the strip of red ⁇ LED devices 200 with the fabrication substrate 205 etched away and the body 210 exposed.
  • the backplane 100 is also attached to the strip of green ⁇ LED devices 400, adjacent and parallel to the strip of red ⁇ LED devices 200.
  • the strip of blue ⁇ LED 500 is attached with a portion of backplane 100 adjacent to the strip of red ⁇ LED devices 200 and the strip of green ⁇ LED devices 400.
  • the strip of blue ⁇ LED devices 500 may be manufactured in the same way the strip of green ⁇ LED devices 400 is manufactured.
  • the body 510 may be fabricated, for example, by growing various layers of material on the fabrication substrate 505 using chemical vapor deposition (CVD).
  • the body 510 may comprise InGaN, with the ratio of Indium adjusted to create a bandgap that is associated with blue light.
  • GaN buffer (not shown in FIG. 5 ) placed between the fabrication substrate 505 and the body 510 to decrease the lattice mismatch.
  • the electrodes 515 of the blue ⁇ LED devices 500 are attached to the body 510.
  • the body 410 is attached with the fabrication substrate 505, which can be sapphire.
  • the electrodes 515 of the blue ⁇ LED devices 500 are connected to the interconnections 110 of the backplane 100 through, for example, thermocompression (TC) bonding.
  • TC thermocompression
  • FIG.6 illustrates the backplane 100 attached with strips of red, blue, and green ⁇ LED devices without fabrication substrates, according to one embodiment.
  • the strip of green ⁇ LED devices 400 attached with the fabrication substrate 405 is adjacent and parallel to the strip of blue ⁇ LED devices 500 attached with the fabrication substrate 505.
  • the strips of blue and green ⁇ LED devices 400 and 500 are adjacent and parallel to the strip of red ⁇ LED devices 200 with the fabrication substrate 205 etched away.
  • the fabrication substrate 405 attached with the strip of green ⁇ LED devices 400 and the fabrication substrate 505 attached with the strip of blue ⁇ LED devices 500 are removed using Laser Lift Off (LLO) method.
  • LLO Laser Lift Off
  • a high-power ultraviolet pulsed laser is simultaneously irradiate the strips of green ⁇ LED devices 400 and the strips of blue ⁇ LED devices 500 from the surface closest to the fabrication substrates 405 and 505.
  • the fabrication substrates 405 and 505 may be sapphire which is transparent and do not absorb the light from the laser.
  • the light from the laser passes through the layer of fabrication substrates 405 and 505 but is absorbed by the GaN buffer. Due to the high power, there is thermal decomposition of the GaN buffer, and the interface between the sapphire and the GaN buffer is ablated.
  • the fabrication substrates 405 and 505 are detached from the GaN buffer, the fabrication substrates 405 and 505 are lifted from the bodies 410 and 510, simultaneously. After the fabrication substrates 405 and 505 are removed, an array of ⁇ LED devices 600 remains with the backplane 100 coupled to three strips of ⁇ LED devices of different colors.
  • FIG.7 is a flowchart illustrating the process of manufacturing a ⁇ LED devices array, according to one embodiment.
  • Electric contacts of a first strip of LEDs e.g., red LEDs
  • a first fabrication substrate e.g., GaAs
  • the first fabrication substrate is removed 705 from the first strip of LEDs. Electric contacts of a second strip of LEDs (e.g., green LEDs) are coupled 710 with a second fabrication substrate (e.g., sapphire) to second interconnections on a backplane.
  • a second strip of LEDs e.g., green LEDs
  • a second fabrication substrate e.g., sapphire
  • Electric contacts of a third strip of LEDs are coupled 715 with a third fabrication substrate (e.g., sapphire) to third interconnections on a backplane.
  • the second and third fabrication substrates are removed 720 from the second and third strips of LEDs.
  • the second and third fabrication substrates can be removed simultaneously or sequentially.
  • the first fabrication substrate can also be removed together with the second and third fabrication substrates instead of being removed first.
  • the second fabrication substrate may be removed before the third strip of ⁇ LED devices is coupled to the backplane.
  • the process of coupling a strip of ⁇ LED devices attached with a fabrication substrate and removing the fabrication substrate may be repeated, and there may more than three strips of ⁇ LED devices coupled to the backplane.
  • FIG.8 is a schematic diagram illustrating a display system using an array of ⁇ LED devices 600 to project an image onto a projection screen 810, according to one embodiment.
  • the system may include, among other components, the array of ⁇ LED devices 600, a controller 800, a microelectromechanical system (MEMS) mirror 805, and a projection screen 801.
  • MEMS microelectromechanical system
  • the array of ⁇ LED devices 600 may have strips of red, green, and blue ⁇ LED devices, as described above with reference to FIG. 6 .
  • the array of ⁇ LED devices 600 may have additional strips of ⁇ LED devices that emit light of a different color (e.g., yellow).
  • Each strip of ⁇ LED devices may have, for example, 1028 ⁇ LED devices such that there are 1028x3 ⁇ LED devices in total in the array of ⁇ LED devices 600.
  • the controller 800 generates signals 815 to control the array of ⁇ LED devices 600.
  • the controller 800 may receive an input from an external host computer system, a mobile device or computing system, or any other hardware platform capable of providing image content.
  • the input data controls in part the signals 815 that determine the voltage supplied to conductive lines that extend on or in the backplane 100 of the array of ⁇ LED devices 600.
  • the controller also generates signals 820 to control the MEMS mirror 805 so that the light 825 from the array of ⁇ LED devices 600 is reflected by the mirror 805.
  • the MEMS mirror 805 is adjusted so that the reflected light 830 is projected onto the projection screen 810.
  • the controller 800 changes the activation and brightness of the array of ⁇ LED devices 600 while controlling the MEMS mirror 805 so that images are formed on the projection screen 810 in a raster fashion.
  • the array of ⁇ LED devices 600, mirror 805, and projection screen 810 are in a near-eye device (NED).
  • NED near-eye device
  • Embodiments of the invention may include or be implemented in conjunction with an artificial reality system.
  • Artificial reality is a form of reality that has been adjusted in some manner before presentation to a user, which may include, e.g., a virtual reality (VR), an augmented reality (AR), a mixed reality (MR), a hybrid reality, or some combination and/or derivatives thereof.
  • Artificial reality content may include completely generated content or generated content combined with captured (e.g., real-world) content.
  • the artificial reality content may include video, audio, haptic feedback, or some combination thereof, and any of which may be presented in a single channel or in multiple channels (such as stereo video that produces a three-dimensional effect to the viewer). Additionally, in some embodiments, artificial reality may also be associated with applications, products, accessories, services, or some combination thereof, that are used to, e.g., create content in an artificial reality and/or are otherwise used in (e.g., perform activities in) an artificial reality.
  • the artificial reality system that provides the artificial reality content may be implemented on various platforms, including a head-mounted display (HMD) connected to a host computer system, a standalone HMD, a mobile device or computing system, or any other hardware platform capable of providing artificial reality content to one or more viewers.
  • HMD head-mounted display
EP18207794.1A 2017-11-28 2018-11-22 Assemblage d'une bande de micro diodes électroluminescentes sur un panneau arrière Ceased EP3489998A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/824,579 US10989376B2 (en) 2017-11-28 2017-11-28 Assembling of strip of micro light emitting diodes onto backplane
PCT/US2018/057396 WO2019108325A1 (fr) 2017-11-28 2018-10-24 Assemblage d'une bande de diodes électroluminescentes sur un fond de panier

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EP3489998A1 true EP3489998A1 (fr) 2019-05-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115376422A (zh) * 2022-08-16 2022-11-22 深圳市易天自动化设备股份有限公司 Miniled光学显示面板高精度贴合机及其贴合方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150054008A1 (en) * 2013-08-20 2015-02-26 Lg Electronics Inc. Display device using semiconductor light emitting device
CN107017319A (zh) * 2017-05-23 2017-08-04 深圳市华星光电技术有限公司 彩色微发光二极管阵列基板的制作方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150054008A1 (en) * 2013-08-20 2015-02-26 Lg Electronics Inc. Display device using semiconductor light emitting device
CN107017319A (zh) * 2017-05-23 2017-08-04 深圳市华星光电技术有限公司 彩色微发光二极管阵列基板的制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115376422A (zh) * 2022-08-16 2022-11-22 深圳市易天自动化设备股份有限公司 Miniled光学显示面板高精度贴合机及其贴合方法
CN115376422B (zh) * 2022-08-16 2024-02-02 深圳市易天自动化设备股份有限公司 Miniled光学显示面板贴合机及其贴合方法

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