Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
  • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
  • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
  • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
  • F21S41/141—Light emitting diodes [LED]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/58—Optical field-shaping elements
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
  • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
  • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
  • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
  • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
  • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
  • F21S43/14—Light emitting diodes [LED]
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
  • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
  • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
  • F21S43/27—Attachment thereof
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
  • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
  • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
  • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
  • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
  • H01L31/035209—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures
  • H01L31/035227—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures the quantum structure being quantum wires, or nanorods
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
  • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
  • H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
  • H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
  • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
  • H01L2933/0008—Processes
  • H01L2933/0033—Processes relating to semiconductor body packages
  • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

• the invention relates to the field of lighting and / or signaling, especially for motor vehicles. It relates more particularly to light modules in which a light source is associated with an optical part for forming and shaping a light beam.
• the light sources used in these modules are more and more frequently constituted by light-emitting diodes, in particular for advantages of space and autonomy compared to conventional light sources.
• the use of light-emitting diodes in lighting and / or signaling modules has also enabled market players (car manufacturers and designers of lighting and / or signaling devices) to bring a creative touch to the design. of these devices, in particular by the use of an ever larger number of these light emitting diodes to achieve optical effects.
• Light-emitting diodes are in particular used for light modules enabling the realization of adaptive beams, of the matrix type, which require great precision, in particular to avoid an uncontrolled overlap of the zones of the beam corresponding to two neighboring diodes. Indeed, there is now a need, in the automotive field, to be able to illuminate the road ahead in "partial road lighting mode", namely to generate in a beam route one or more dark beaches corresponding to the locations where are present oncoming vehicles or vehicles in front, so as to avoid dazzling other drivers while illuminating the road in its larger area.
• Such a function is called ADB (Adaptive Driving Beam in English) or "selective beam.”
• ADB Adaptive Driving Beam in English
• Selective beam Such an ADB function consists of on the one hand automatically detecting a user of the road likely to be dazzled by a lighting beam emitted in headlight mode by a projector, and on the other hand modify the outline of this light beam so as to create a shadow zone at the location where the user is detected.
• This chain of ribs with several floors is explained in particular by imprecise positioning of the light source on the printed circuit board, in particular due to the floating of the light-emitting diode on the tin until it cools.
• the subject of the invention is a semiconductor light source and a light device comprising such a source and an optical shaping of the light rays emitted by this source.
• the light source forming the subject of the invention comprises a plurality of electroluminescent units of submillimetric dimensions, and it furthermore comprises at least one positioning protrusion configured to participate in the positioning of the light source on an optical part.
• the light source is thus indexed on the optical part, without the intermediary of a support plate to which the light source is attached, so as to achieve precise positioning of the elements relative to each other and in particular a reliable position of the light source in relation to the focus of the optical part.
• the light source comprises a substrate from which extends said plurality of electroluminescent units of submillimeter dimensions, and according to a feature of the invention, it is expected that the at least one positioning protrusion protrudes from the same substrate.
• the electroluminescent units and the positioning protrusion (s) can in particular be formed directly on this substrate. It can be provided that the substrate is based on silicon or silicon carbide. It is understood that the substrate is based on silicon since it comprises mainly silicon, for example at least 50% and in practice about 99%. According to one characteristic of the invention, provision can be made for the at least one positioning protrusion to be higher than the electroluminescent units, which makes it easier to put the male element formed by this protrusion into cooperation with the female element. formed in the optical part brought to come opposite the light source.
• height whether it is that of the positioning protrusions or electroluminescent units, we define the extension dimension of these elements from the substrate, substantially perpendicular to the upper surface thereof, that is to say the surface from which emerge the growths and electroluminescent units.
• the automotive field is applied a technology consisting of producing the light-emitting zone by a plurality of electroluminescent units that are grown on a substrate, to produce a three-dimensional topology that has the advantage of multiplying the surface area.
• light emission with respect to electroluminescent diodes previously known in the automotive field, namely substantially planar diodes, and this three-dimensional topology is used to ensure optimal positioning of the light source with respect to the room optics in front of which it is arranged. In this way, it is possible to provide at very low cost a very intense light due to the multiplication of the surface and in compliance with the regulations because of the reliable position of the source.
• the at least one positioning protrusion is formed by a plurality of electroluminescent units
• the electroluminescent units are divided into at least one group of emitting units and a group of units forming the at least one positioning protrusion, only the at least one group of emitting units being electrically connected to participate in the emission of emitting units. a light beam;
• the positioning excrescences are arranged outside emission zones formed by a group of electroluminescent units; in particular, a positioning protrusion is positioned in a corner of the light source and, in the case of a plurality of positioning protrusions, the positioning protrusions can be respectively positioned in a corner of the light source which is specific to them;
• the at least one positioning protrusion is formed by a wall extending between electroluminescent units.
• the semiconductor light source comprising a plurality of submillimetric electroluminescent units further comprises a layer of a polymeric material forming an encapsulant covering the source so as to drown at least one electroluminescent unit: such an encapsulant is deposited on the substrate overlying the units, and it is advantageous that the encapsulant extends at least to cover the highest unit.
• the positioning protrusion or protrusions extend according to a characteristic of the invention so as to exceed the layer of polymeric material forming the encapsulant.
• This polymeric material may be based on silicone, it being understood that the polymer material is based on silicone since it comprises mainly silicone, for example at least 50% and in practice about 99%.
• the layer of polymeric material may comprise a phosphor or a plurality of phosphors excited by the light generated by at least one of the plurality of light emitting units.
• This phosphor may be at least partially embedded in the polymer or disposed on the surface of the layer of polymeric material.
• the rays emitted by the electroluminescent units may be of wavelength corresponding to the blue color and may be converted for some of them into rays of wavelength corresponding to the color. yellow, so that the recombination of unconverted blue and yellow forms a white beam at the outlet of the layer of polymeric material.
• the light source may comprise a plurality of positioning protrusions, at least two positioning protrusions being arranged substantially perpendicular to one another; thus forming a keying system, or poke yoke, optimizing the positioning of the light source relative to the optical part.
• Electroluminescent units which may also be considered rods projecting from a support, may be selectively activatable, and at least two groups of electroluminescent rods of the light source may be arranged to be selectively activatable. selectively ignited, it being understood that it means that one or more rods of the light source can be controlled to play on their luminous intensity.
• a separate ignition control system is provided for these rods, it being understood that this means that the rods can be switched on or off distinctively from each other, simultaneously or not.
• a semiconductor light source comprising electroluminescent rods of submillimeter dimensions
• a motor vehicle headlamp allows a simplified implementation of adaptive lighting systems, in which one may wish to form matrix beams, some of which may be off for example to not dazzle another user of the road. This results in an imperative need for a reliable position of the light source and the electroluminescent units with respect to the optical part, in order to achieve a precise cutting of the beams.
• each unit has a generally cylindrical shape, in particular of polygonal section; it can be expected that each unit has the same general shape, including a hexagonal shape;
• the electroluminescent units are each delimited by an end face and by a circumferential wall which extends along a longitudinal axis of the rod defining its height, the light being emitted at least from the circumferential wall; this light could also be emitted by the terminal face;
• Each electroluminescent unit may have an end face which is substantially perpendicular to the circumferential wall, and in different variants, it can be provided that this end face is substantially flat or curved or pointed at its center;
• the electroluminescent units are arranged in two-dimensional matrix, that this matrix is regular, with a constant spacing between two successive electroluminescent units of a given alignment, or that the electroluminescent units are arranged in staggered rows; -
• the height of a light emitting unit is between 1 and 10 micrometers, while the height of a positioning protrusion is between 5 and 20 microns (to be validated by the inventors);
• the largest dimension of the end face is less than 2 micrometers; the distance separating two immediately adjacent electroluminescent units is at least equal to 2 micrometers, and at most equal to 100 micrometers.
• the invention also relates to a light module comprising a light source as previously described and an optical part for shaping the light rays emitted by the light source, in which the light source is positioned relative to the optical piece by cooperation of the light source. at least one positioning protrusion with a corresponding orifice formed in the optical part.
• optical shaping it is meant that at least one of the rays emitted by the light source is deflected by the shaping optics, that is to say that the direction of entry of this at least one light ray in the shaping optics is different from the output direction of the light beam of the shaping optics.
• the shaping optics may include optical projection of the light emitted by the semiconductor light source.
• This projection optics creates a real, and possibly anamorphic, image of a part of the device, for example the source itself or a cache, or an intermediate image of the source, at a distance (finite or infinite) very large. in front of the dimensions of the device (of a ratio of the order of at least 30, preferably ⁇ ) of the device.
• the optical part is a lens arranged on the path of the rays emitted by the light source, forming an optical shaping or projection of these rays, or that it consists of a reflector .
• the optical part may be arranged so that the light source is not located on the lens object focal plane.
• the optical part may have a receiving orifice associated with a positioning protrusion of the source, the positioning projection having a determined male shape that can be housed in the section of the female shape of the receiving orifice.
• the positioning protrusion has a circular or polygonal section, especially when it is formed by existing electroluminescent elements, or more free sections such as crosses or rectangles.
• the sections of the male and female elements are not necessarily complementary, and that for example, the growths may have a circular section while the orifices have a triangular section.
• the optical part can be pressed against this layer of polymeric material.
• the invention also relates to a lighting and / or signaling device comprising a housing for receiving at least one light module as just presented, the housing being advantageously closed by a closure glass.
• the light device comprises a light source which ensures the generation of light rays which form at least one regulatory light beam for a motor vehicle. Regulatory bundle means a beam that respects one of the photometric grids shown in the figures.
• the device can take place in a projector before as well as in a motor vehicle taillight.
• a method of mounting a light module as just described can include a step of grasping the optical part that is placed opposite a light source support, a step of setting position of the support relative to the optical part by cooperation of at least one positioning protrusion of the light source with a receiving orifice of this protrusion arranged on the optical part, and a step of fixing the support on the optical part by the intermediate tabs extending projecting from the optical part to be fixed on this support.
• Fixing the support can be done by pegging or gluing the fastening tabs of the optical part on the support or by screwing.
• at least the positioning step and the step of fixing the support on the optical part are performed under vacuum to avoid the presence of air between the optical part and the layer of polymer material , so that it eliminates a diopter in the path of the light rays coming out of the light source towards the optical part.
• FIG. 2 is a schematic front view of a first embodiment of a light module according to the invention, in which a light source is positioned with respect to an optical part formed by a lens, said optical part being moreover fixed on a support plate of the source;
• FIG. 3 is a schematic front view of a second embodiment of a light module according to the invention, in which a light source is positioned relative to an optical part formed by a reflector, only the light source and the light source. optical part being represented;
• FIG. 4 is a schematic perspective representation of a semiconductor light source according to the invention, in which a row of light-emitting units has been made visible in section, and in which an exemplary embodiment of FIG. a protrusion of positioning; and FIG.
• FIG. 5 is a sectional view of a detail of a particular embodiment of a semiconductor light source according to the invention, in which two electroluminescent units and a positioning protrusion extend outwardly. a substrate, said electroluminescent units being encapsulated in a protective layer while the positioning protrusion exceeds.
• a lighting and / or signaling device of a motor vehicle comprises a light module 1, in particular housed in a housing 2 closed by an ice 3 and which defines an internal volume of reception of this light module.
• the light module comprises at least one light source 4 associated with an optical part 6 arranged in the vicinity of the light source so that at least a portion of the light rays emitted by the light source comes into contact with the optical part.
• the optical part may consist of a shaping optics or projection optics, changing a direction of at least a portion of the light rays emitted by the source.
• the light source 4 is a semiconductor source, comprising submillimetric electroluminescent units, that is to say semiconductor sources.
• semiconductor sources comprising submillimetric electroluminescent units, that is to say semiconductor sources.
• three-dimensional conductor as will be explained below, unlike conventional sources in two dimensions, assimilated to substantially flat sources because of their thickness of the order of a few nanometers while a light emitting light source has a height at least equal to one micrometer.
• the light source 4 comprises a plurality of electroluminescent units 8 of submillimetric dimensions, which will be called thereafter electroluminescent rods, and at least one positioning protrusion 9 ⁇
• electroluminescent rods 8 and the positioning protrusions 9 are born on the same substrate 10, or positioning protrusions differing from a light-emitting unit by its height, that is to say the distance at which the free end of these components protruding from the substrate extends. , and / or by its width, that is to say a size according to at least one dimension in the plane of the substrate.
• the positioning protrusion or protrusions are thus configured to participate in the positioning of the light source on the optical part, by cooperation of the male form of the positioning protrusion, distinct from the male shapes of the rods, with the female form of an orifice corresponding formed in the optical part.
• Each electroluminescent rod 8 and each positioning protrusion 9 extend perpendicularly, or substantially perpendicularly, projecting from the substrate 10, here made of silicon, other materials such as silicon carbide that can be used without departing from the context of the invention. 'invention.
• the electroluminescent rods could be made using gallium nitride (GaN), from an alloy of aluminum nitride and gallium nitride (AlGaN), or from an alloy of aluminum, indium and gallium (AllnGaN).
• the substrate 10 has a lower face 12 on which a first electrode 14 and an upper face 16, projecting from which the electroluminescent rods 8 and the positioning protrusion (s) 9 extend, and on which is reported a second electrode 18.
• Different layers of materials are superimposed on the upper face 16, especially after the growth of electroluminescent rods from the substrate here obtained by an ascending approach.
• This layer is etched so as to connect a particular rod between them, the ignition of these rods can then be controlled simultaneously by a control module not shown here. It can be expected that at least two electroluminescent rods or at least two groups of The electroluminescent rods of the semiconductor light source 4 are arranged to be lit separately by means of an ignition control system.
• the submillimetric electroluminescent rods extend from the substrate and comprise, as can be seen in FIG. 4, each a core 19 made of gallium nitride, around which are disposed quantum wells 20 formed by a radial superposition of layers of different materials, here gallium nitride and gallium-indium nitride, and a shell 21 surrounding the quantum wells also made of gallium nitride.
• Each rod extends along a longitudinal axis 22 defining its height, the base 23 of each rod being disposed in a plane 24 of the upper face 16 of the substrate 10.
• the electroluminescent rods 8 of the semiconductor light source advantageously have the same shape. These rods are each delimited by an end face 26 and a circumferential wall 28 which extends along the longitudinal axis. When the electroluminescent rods are doped and polarized, the resulting light at the output of the semiconductor source is emitted mainly from the circumferential wall 28, it being understood that it can be expected that light rays also emerge, at least in small amounts, from the end face 26. As a result, each rod acts as a single light-emitting diode and the density of the electroluminescent rods 8 improves the light output of this semiconductor source .
• This circumferential wall 28 extends along the longitudinal axis 22 from the substrate 10 to the end face 26, the distance from the end face 26 to the upper face 16 of the substrate, from which the electroluminescent rods 8 originate. , defining the height of each stick.
• the height of a light emitting rod 8 is between 1 and 10 micrometers, while it is expected that the largest transverse dimension of the end face, perpendicular to the longitudinal axis 22 of the electroluminescent rod concerned, ie less than 2 micrometers. It will also be possible to define the surface of a rod, in a sectional plane perpendicular to this longitudinal axis 22, in a range of determined values, and in particular between 1.96 and 4 microns square. It is understood that during the formation of rods 8, the height can be changed from one light source to another, so as to increase the luminance of the semiconductor light source when the height is increased.
• the height of the rods may also be modified within a single light source, so that one group of rods may have a height, or heights, different from another group of rods, both of which are constituents of the rod.
• semiconductor light source comprising electroluminescent rods of submillimeter dimensions.
• the shape of the electroluminescent rods 8 may also vary from one device to another, in particular on the section of the rods and on the shape of the end face 26.
• FIG. 4 shows electroluminescent rods having a generally cylindrical shape. , and in particular of polygonal section, here more particularly hexagonal. It is understood that it is important that light can be emitted through the circumferential wall, that it has a polygonal or circular shape for example.
• the end face 26 may have a substantially planar shape and perpendicular to the circumferential wall, so that it extends substantially parallel to the upper face 16 of the substrate 10, as shown in FIG. 4, or although it may have a domed or pointed shape at its center, so as to multiply the directions of emission of the light exiting this end face, as shown in FIG.
• the electroluminescent rods 8 are arranged in a two-dimensional matrix, with rods aligned in rows and columns perpendicular to one another. This arrangement could be such that the electroluminescent rods are arranged in staggered rows.
• the invention covers other distributions of the rods, including rod densities which can be variable from one light source to another, and which can be variable in different areas of the same light source.
• FIG. 2 shows the separation distance d1 of two immediately adjacent electroluminescent rods in a first transverse direction and the separation distance d2 of two electroluminescent rods immediately adjacent in a second transverse direction. The separation distances d1 and d2 are measured between two longitudinal axes 22 of adjacent electroluminescent rods.
• the number of electroluminescent rods 8 projecting from the substrate 10 may vary from one device to another, in particular to increase the light density of the light source, but it is appropriate that one or other of the distances of dl, d2 separation must be at least equal to 2 micrometers, so that the light emitted by the circumferential wall 28 of each rod electroluminescent 8 can leave the matrix of rods. Furthermore, it is expected that these separation distances are not greater than 100 micrometers.
• each of the positioning protrusions 9 is distinguished from the electroluminescent units surrounding it by its height and / or by its width.
• FIGS. 2 and 3 show, in particular, larger and higher positioning protrusions than the electroluminescent units 8.
• the positioning protrusions 9 are thus higher than the electroluminescent units in that they extend to a larger area. a large distance from the substrate that the electroluminescent units do, and they are wider in that they are formed, for a given row visible in Figure 2, by a group of three electroluminescent units. It will be understood that this grouping of three units to form a positioning protrusion is described arbitrarily and that the number could be different. It is thus possible, by way of example illustrated in FIG.
• Each positioning protrusion 9 may be formed by a plurality of light emitting units, which may or may not be electrically connected to emit light. It is however of interest that the electroluminescent units forming a positioning protrusion are not light-emitting, so as to prevent radii from being transmitted from a position with respect to the focal surface of the optical part which is different from the rest of the electroluminescent units. . In this case, it is notable that the electroluminescent units are divided into at least one group of emitting units and a group of units forming the at least one positioning protrusion, only the at least one group of emitting units being electrically connected.
• a positioning protrusion may be formed by a wall distinct from the electroluminescent units, and whose height and / or width allows the distinction of shape by in relation to the electroluminescent units so as to ensure, as previously, that the corresponding orifice formed in the optical part can cooperate only with this positioning protrusion.
• a plurality of positioning protrusions 9 extend projecting from the substrate 10, and their arrangement thereon can be variable from one light source to another, since their position allows a cooperation with corresponding holes on the associated optical part.
• the role of these positioning excrescences 9 is to enable the positioning of the light source 4 with respect to the optical part 6 without intermediate element, making sure that this positioning corresponds to a desired theoretical position, which is achieved by the distinctive shape of the positional outgrowth with respect to the electroluminescent units.
• two positioning protrusions it is also possible for two positioning protrusions to be oriented substantially perpendicularly.
• two receiving orifices formed in the optical part are oriented substantially perpendicularly, so that the light source can be mounted in only one direction.
• FIG. 4 illustrates in particular an embodiment in which the positioning protrusion 9 is arranged in a corner of the light source 4, without being surrounded by the emitting electroluminescent units 8.
• Each positioning protrusion 9 comprises a lateral face 30 and an upper face 32, forming the free end of the positioning protrusion opposite the substrate 10.
• the lateral face 30 of a positioning protrusion 9 may allow the absorption or reflection of the light rays emitted by the electroluminescent rods directly in the vicinity of this positioning protrusion.
• the positioning protrusions may be formed by resin or metal, and may or may not have on the side face a coating that is either reflective, diffusing, or absorbent .
• the positioning protrusion 9 may have a section of substantially circular or polygonal shape, especially when it is formed by electroluminescent units, or it may have sections in the form of crosses or rectangles. In each of these cases, the upper face 32 is substantially parallel to the upper face 16 of the substrate 10.
• the electroluminescent units are obtained by growth from the substrate, and the positioning excrescence (s) are obtained in the same way. It may be advantageous to carry out these two operations successively, in particular to be able to grow positioning protrusions at a height different from that of the electroluminescent units.
• the light source 4 may further comprise, as illustrated in particular in Figure 3, a layer 34 of a polymeric material forming an encapsulant wherein electroluminescent rods 8 and positioning protrusions 9 are at least partially embedded.
• the layer 34 has a thickness such that the electroluminescent rods 8 are embedded in the polymeric material while the positioning protrusions 9 are only partially embedded, their free end protruding of the layer 34 ⁇
• the polymeric material which may in particular be silicone-based, makes it possible to protect the electroluminescent rods 8 without hindering the scattering of the light rays, and the positioning protrusions are disengaged at their end to facilitate their formation. indexing function with the optical part.
• wavelength conversion means and for example phosphors, able to absorb at least a portion of the rays emitted by one of the rods and to converting at least a portion of said absorbed excitation light into an emission light having a wavelength different from that of the excitation light. It can be provided without distinction whether the wavelength conversion means are embedded in the mass of the polymer material, or that they are arranged on the surface of the layer of this polymeric material.
• the light source may further comprise a coating 36 of light reflecting material which is disposed between the electroluminescent rods 8 to deflect the rays initially oriented towards the substrate towards the end face 26 of the electroluminescent rods 8.
• the upper face 16 of the substrate 10 may comprise a reflecting means which reflects the light rays, initially oriented towards the upper face 16, towards the output face of the light source. This recovers rays that otherwise would be lost.
• This coating 36 is disposed between the electroluminescent rods 8 on the transparent conductive oxide layer 29.
• optical part 6 which forms with the light source a light module according to the invention.
• the optical part 6 has a proximal face 38 disposed opposite the light source 4, and this proximal face comprises at least one receiving orifice 40 of a It is understood that the optical part comprises a number of receiving holes 40 equal to the number of positioning protuberances 9 so as to cooperate, during the assembly of one and the other, a receiving orifice and a positioning protrusion.
• the receiving orifices have dimensions slightly greater than those of the positioning protuberances so as to allow insertion of the positioning protrusions in these receiving orifices. Sufficient depth of these receiving holes is provided to prevent the release of the positioning protrusion from its corresponding receiving orifice before the optical part is fixed to the support of the light source.
• the positioning protrusions 9 When placing the light source in relation to the optical part, the positioning protrusions 9 are brought against the optical part, so that the stop of the protrusions in the receiving orifices ensures the correct position of the electroluminescent units relative to the optical part. to the focal surface of the optical part.
• the upper face 32 of the positioning protrusions is brought into abutment against the bottom wall 41 of the corresponding receiving orifice.
• edges delimiting the receiving orifices 40 may be configured to define a shape similar to that defined by the corresponding positioning protrusions, it being understood that the shapes should be complementary without having to be similar, since they allow the housing of the positioning protrusion in the receiving orifice.
• the optical part 6 is pressed against the layer 34 of polymeric material.
• the mounting method is implemented so as to prevent air from being present in the junction area between the optical piece and the layer of polymeric material. It is notable that in the case of the presence of a layer of polymeric material embedding the electroluminescent units, the positioning protuberances protrude from this layer of polymeric material so that the polymeric material does not interfere in the housing of the protrusion positioning in its corresponding receiving port.
• the optical part is configured to deflect the rays emitted by the light source disposed at the object focus of the optical part, so as to participate in the formation of a regulatory beam, that is to say which respects the photometric grid of such or such lighting beam, and for example a dipped beam, a high beam, a daytime running light.
• the optical part may consist of both a lens 42 (in particular visible in FIG. 2) and a reflector 44 (particularly visible in FIG. 3).
• the proximal face 38 in which the reception orifices 40 are formed is the entry face of the light rays emitted by electroluminescent units. These orifices are sufficiently spaced from the ray entry zone so that the positioning protrusions which are housed therein do not disturb the path of the rays emitted by the light source in the lens.
• the lens 42 furthermore comprises fastening tabs 46 extending substantially perpendicularly from the proximal face so as to pass through a support plate 48 on which the light source 4 is fixed. These attachment tabs are then glued to the plate of FIG. support, or as illustrated in Figure 2, riveted on the end face of the support plate opposite the lens.
• the optical part may consist of a reflector 44 whose reflecting face 45 is arranged facing the light source, this reflector may include a deflecting wall 50, not necessarily reflecting on which is positioned the light source .
• the proximal face 38 of the optical part, in which is formed or the receiving orifices 40 of the or positioning protrusions, in this case is the face of the deflection wall facing away from the reflecting face.
• light rays emitted by an electroluminescent unit placed on a focus object of this reflector have been illustrated so that the rays reflected by the reflector 44 pass through an image focal point, advantageously merged with the focus object of a lens. disposed downstream of the ray path.
• fixing lugs are provided to fix the position of the optical part relative to a support on which is secured the light source.
• the support is then placed in position relative to the optical part by cooperation of at least one positioning protrusion of the light source with a receiving orifice of this protrusion which is arranged on the optical part.
• This allows the correct positioning of the light source relative to the focal surface of the optical part, while facilitating the next step of fixing the support on the optical part by means of tabs projecting from the optical part to be fixed on this support.
• the present invention applies to both a front projector and a rear light of a motor vehicle.
• the above description clearly explains how the invention makes it possible to achieve the objectives it has set itself and in particular to propose a light source that participates, within a light module and a lighting device and / or signaling, obtaining, by application of positioning protrusion (s) stretched from a carrier also carrying electroluminescent elements, a better management of the position of the light emitting means relative to the focal surface of the associated optical part. It is thus possible to ensure a reliable position of the light source with respect to this focal surface, whether this desired position is centered on the focal surface or offset with respect to the latter.
• a light-emitting light source in the form of rods, forming a three-dimensional light source, makes it possible to dispense with printed circuit boards, the electrical wiring being directly formed on the substrate from which the light-emitting units pushes. It is then possible to make an assembly by decreasing the chains of ribs.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• General Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Optics & Photonics (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
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• Electromagnetism (AREA)
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• 2016
  • 2016-07-05 FR FR1656446A patent/FR3053760B1/fr not_active Expired - Fee Related
• 2017
  • 2017-07-04 US US16/315,531 patent/US10693047B2/en active Active
  • 2017-07-04 EP EP17734349.8A patent/EP3482121A1/de not_active Withdrawn
  • 2017-07-04 CN CN201780041976.5A patent/CN109477623A/zh active Pending
  • 2017-07-04 WO PCT/EP2017/066640 patent/WO2018007387A1/fr unknown
  • 2017-07-04 KR KR1020197003550A patent/KR20190025715A/ko unknown

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