EP3481149B1 - Hochfrequenzerwärmungsvorrichtung - Google Patents

Hochfrequenzerwärmungsvorrichtung Download PDF

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Publication number
EP3481149B1
EP3481149B1 EP17819906.3A EP17819906A EP3481149B1 EP 3481149 B1 EP3481149 B1 EP 3481149B1 EP 17819906 A EP17819906 A EP 17819906A EP 3481149 B1 EP3481149 B1 EP 3481149B1
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EP
European Patent Office
Prior art keywords
frequency
surface wave
wave excitation
frequency power
excitation body
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EP17819906.3A
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English (en)
French (fr)
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EP3481149A4 (de
EP3481149A1 (de
Inventor
Toshiyuki Okajima
Yoshiharu Oomori
Koji Yoshino
Hiroyuki Uno
Hiroyuki Uejima
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of EP3481149A4 publication Critical patent/EP3481149A4/de
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/707—Feed lines using waveguides

Definitions

  • the present invention relates to a high-frequency heating device equipped with a surface wave excitation body having a periodical structure.
  • Such a conventional technique relates to a high-frequency heating device configured to supply high-frequency power to a surface wave excitation body having a periodical structure to heat a heating-target object, such as a food product (e.g., see PTL 1).
  • a high-frequency heating device disclosed in PTL 1 includes a variable impedance unit configured to change, in a temporal manner, impedance of a termination of an interdigital tape wave guide (surface wave guide).
  • the variable impedance unit changes standing wave distribution in a temporal manner to move a portion configured to radiate strong energy. A whole food product is therefore efficiently heated.
  • the high-frequency heating device described above changes impedance of the termination of the interdigital tape wave guide (surface wave guide) to change standing wave distribution in the interdigital tape wave guide (surface wave guide) to change the impedance of the termination in a temporal manner. With changes in standing wave distribution in a temporal manner, a whole food product is therefore heated.
  • the conventional high-frequency heating device cannot change radiation distribution of high-frequency power in a thickness direction of the heating-target object.
  • JP 2015 162273 relates to a high-frequency heating device according to the preamble of claim 1.
  • the present invention provides a high-frequency heating device capable of changing radiation distribution of high-frequency power to a heating-target object to change a heating state of a heating-target part.
  • the high-frequency heating device includes a high-frequency power generation unit configured to generate high-frequency power, a surface wave excitation body configured to propagate the high-frequency power with a surface wave to heat a heating-target object, a high-frequency power supply unit configured to supply the high-frequency power to the surface wave excitation body, and a mounting stand on which the heating-target object is mounted.
  • the high-frequency power generation unit is a variable high-frequency oscillator configured to generate the high-frequency power at a frequency to be set, the frequency being set equal to or lower than exciting frequency of the surface wave excitation body, or being set higher than the exciting frequency, in accordance with a degree, corresponding to a heating state desired by a user, of surface concentration of high-frequency power around the surface of the surface wave excitation body.
  • the magnitude relationship between the frequency of the high-frequency power to be supplied to the surface wave excitation body and the exciting frequency of the surface wave excitation body is set.
  • the heating-target object can therefore be heated in the desired heating state.
  • High-frequency heating device 100 will now be described herein with reference to FIG. 1 .
  • FIG. 1 is a block diagram illustrating a basic configuration of high-frequency heating device 100 according to the present exemplary embodiment.
  • high-frequency heating device 100 includes surface wave excitation body 103, high-frequency power supply unit 110, high-frequency power generation unit 120, and mounting stand 101 used to mount heating-target object 102.
  • High-frequency heating device 100 heats heating-target object 102 mounted on mounting stand 101.
  • a frequency of high-frequency power to be generated by high-frequency power generation unit 120 and an exciting frequency of surface wave excitation body 103 are set to have a predetermined frequency relationship.
  • the predetermined frequency relationship is set to heat heating-target object 102 in a desired heating state.
  • high-frequency heating device 100 illustrated in FIG. 1 although such an example of a configuration is illustrated that includes a single surface wave excitation body, a single high-frequency power supply unit, and a single high-frequency power generation unit, the present invention is not limited to the example.
  • a number of surface wave excitation bodies, a number of high-frequency power supply units, and a number of high-frequency power generation units are not limited to the numbers described above.
  • High-frequency heating device 100 operates as described below.
  • High-frequency power generation unit 120 first generates high-frequency power.
  • the generated high-frequency power is supplied, via high-frequency power supply unit 110, to surface wave excitation body 103.
  • the supplied high-frequency power is propagated or radiated with a surface wave around surface wave excitation body 103. Heating-target object 102 mounted on mounting stand 101 is therefore heated.
  • High-frequency heating device 100 is configured, and operates as described above.
  • High-frequency power generation unit 120 described above includes a high-frequency transmitter configured to output high-frequency power at a frequency (e.g., microwave) and a magnitude appropriate for heating heating-target object 102.
  • a frequency e.g., microwave
  • the high-frequency transmitter includes a magnetron, an inverter power supply circuit, a solid oscillator, and a power amplifier, for example.
  • the magnetron is a kind of oscillation vacuum tube configured to generate a kind of radio wave, i.e., strong, non-coherent microwaves, and is used for purposes with a higher output ranging from several hundred watts to several kilowatts, such as a radar and a microwave oven.
  • a higher voltage of several kilovolts is required.
  • the inverter power supply circuit includes a converter circuit having a rectification function and an inverter circuit having a voltage raising (or lowering) function and an output frequency conversion function.
  • the inverter power supply circuit is a technique widely used in lighting apparatuses and used for motor controlling.
  • the solid oscillator includes a semiconductor oscillation circuit equipped with a feedback circuit including high-frequency electronic components, such as transistors, capacitors, inductors, and resistors.
  • the solid oscillator is a technique widely used in oscillators for purposes with a low-power output, such as communication devices.
  • Solid oscillators include oscillators having a high-frequency power output of approximately 50 watts, which are used in recent years, as well as include ordinary oscillators having a high-frequency power output ranging from several ten milliwatts to several hundred milliwatts. Such solid oscillators are not therefore appropriate for heating requiring a power output of several hundred watts.
  • the solid oscillator is often used together with a power amplifier including, for example, transistors configured to amplify high-frequency power being output.
  • High-frequency power supply unit 110 corresponds to a power coupling unit configured to supply high-frequency power generated by high-frequency power generation unit 120 to surface wave excitation body 103. A configuration of high-frequency power supply unit 110 will be described later.
  • Surface wave excitation body 103 includes a metallic periodical structure with impedance elements made of metallic plates arranged periodically, and dielectric plates, for example.
  • a stub type surface wave excitation body or an interdigital type surface wave excitation body is used, for example.
  • the stub type surface wave excitation body is formed by disposing, on a metallic flat plate, as illustrated in FIG. 1 , a plurality of metallic flat plates at constant intervals in a vertical direction toward a heating-target object.
  • the interdigital type surface wave excitation body is formed by punching a metallic flat plate in an interdigital shape.
  • the dielectric plate may be an alumina plate or a Bakelite plate.
  • an exciting frequency of surface wave excitation body 103 is determined based on a material used, a physical structural size, and other factors. For example, when the stub type surface wave excitation body is used, by changing heights of a plurality of metallic flat plates arranged on the metallic flat plate, or by changing the intervals of the metallic flat plates, the exciting frequency of surface wave excitation body 103 can be changed. In general, the exciting frequency of surface wave excitation body 103 increases when the heights of the metallic flat plates are lowered, or when the intervals of the metallic flat plates are narrowed. By adjusting the heights or the intervals of the metallic flat plates, surface wave excitation body 103 having a desired exciting frequency can therefore be formed.
  • Surface wave excitation body 103 allows high-frequency power supplied from high-frequency power generation unit 120 via high-frequency power supply unit 110 to concentrate around its surface, and propagates the high-frequency power with a surface wave. Further, surface wave excitation body 103 can radiate the high-frequency power to a space in high-frequency heating device 100, for example. Heating-target object 102 mounted on mounting stand 101 adjacent to surface wave excitation body 103 is therefore heated by the high-frequency power propagated, with a surface wave, from around the surface of surface wave excitation body 103, or the high-frequency power radiated from surface wave excitation body 103.
  • FIG. 2 is a block diagram illustrating an example of the configuration of high-frequency power supply unit 110.
  • high-frequency power supply unit 110 is disposed to introduce high-frequency power to be generated by high-frequency power generation unit 120, via rectangular wave guide 130, to high-frequency power supply unit 110.
  • Rectangular wave guide 130 is a hollow wave guide mainly used to transmit electromagnetic waves, such as microwaves.
  • the hollow wave guide is an ordinary wave guide made from a metallic tube having a rectangular cross section (e.g., rectangle).
  • An electromagnetic wave forms an electromagnetic field in accordance with a shape, a size, a wavelength, or a frequency of rectangular wave guide 130, and propagates inside rectangular wave guide 130.
  • the high-frequency power propagated from high-frequency power generation unit 120 is supplied, via rectangular wave guide 130 and tapered rectangular wave guide 131, to surface wave excitation body 103.
  • Tapered rectangular wave guide 131 is configured to suppress reflection of a microwave being propagated at a joint to reduce a loss.
  • high-frequency power supply unit 110 includes a part of rectangular wave guide 130, tapered rectangular wave guide 131, and a part of surface wave excitation body 103.
  • High-frequency power generated by the high-frequency power generation unit 120 is therefore introduced, via rectangular wave guide 130, to high-frequency power supply unit 110, and then efficiently supplied, via tapered rectangular wave guide 131, to surface wave excitation body 103.
  • high-frequency heating device 100 sets, as desired, a predetermined frequency relationship between the frequency of the high-frequency power to be generated by high-frequency power generation unit 120 and the exciting frequency of surface wave excitation body 103. As will be described later, heating-target object 102 is therefore heated in a desired heating state.
  • High-frequency heating device 100 is configured as described above to heat heating-target object 102, for example.
  • FIGS. 3A and 3B schematically illustrate, when heating-target object 102 is mounted on mounting stand 101, how heating-target object 102 is heated under field intensity distribution of high-frequency power supplied around the surface of surface wave excitation body 103.
  • FIG. 3A illustrates field intensity distribution 141 formed around the surface of surface wave excitation body 103 when a frequency of high-frequency power generated by high-frequency power generation unit 120 and an exciting frequency of surface wave excitation body 103 are set to increase a degree of surface concentration of the high-frequency power.
  • FIG. 3B illustrates field intensity distribution 142 formed around the surface of surface wave excitation body 103 when the frequency of high-frequency power and the exciting frequency are set to lower the degree of surface concentration of the high-frequency power.
  • intensity of electric fields in field intensity distributions 141 and 142 is represented with shading of a color. In this case, the darker the color, the stronger the electric field.
  • the relationship between the frequency of high-frequency power and the exciting frequency of surface wave excitation body 103 is set to increase a degree of surface concentration of the high-frequency power around surface wave excitation body 103. Intensity of an electric field around the surface of surface wave excitation body 103 therefore becomes stronger. A surface and an internal portion, adjacent to surface wave excitation body 103, of heating-target object 102 are therefore locally and strongly heated. The larger a distance from surface wave excitation body 103, the weaker the field intensity. A degree of heating in heating-target object 102 therefore lowers.
  • the relationship between the frequency of high-frequency power and the exciting frequency of surface wave excitation body 103 is set to lower the degree of surface concentration of the high-frequency power around surface wave excitation body 103.
  • the field intensity weakens around the surface of surface wave excitation body 103
  • a degree of lowering in field intensity is smaller even in an area away from surface wave excitation body 103.
  • the surface, adjacent to surface wave excitation body 103, of heating-target object 102 would therefore be less likely to be locally and strongly heated. In other words, whole heating-target object 102 is relatively evenly heated.
  • high-frequency heating device 100 heats heating-target object 102 based on the relationship between the frequency of high-frequency power and the exciting frequency of surface wave excitation body 103.
  • FIGS. 4A to 4C schematically illustrate examples of changes in a degree of surface concentration of high-frequency power (electric field) formed around the surface of surface wave excitation body 103, based on the relationship between frequency fp of high-frequency power to be supplied to surface wave excitation body 103 and exciting frequency fc of surface wave excitation body 103.
  • FIGS. 4A to 4C illustrate, in graphs, changes in field intensity relative to the distance from the surface of surface wave excitation body 103, based on the relationship between frequency fp of high-frequency power to be supplied to surface wave excitation body 103 and exciting frequency fc of surface wave excitation body 103.
  • horizontal axes in FIGS. 4A to 4C illustrate a distance from the surface of the surface wave excitation body, while vertical axes illustrate field intensity.
  • the greater the inclination of the graph the more the concentration of an electric field formed on the surface of surface wave excitation body 103.
  • graph 151 illustrates a degree of field intensity relative to a distance from the surface of surface wave excitation body 103 when frequency fp of high-frequency power to be supplied to surface wave excitation body 103 is approximately equal to exciting frequency fc of surface wave excitation body 103
  • graph 152 illustrates a degree of field intensity when frequency fp of high-frequency power is lower than exciting frequency fc.
  • graph 153 illustrates a degree of field intensity when frequency fp of high-frequency power is higher than exciting frequency fc.
  • graph 151 illustrating the degree of field intensity relative to the distance from the surface of surface wave excitation body 103 has a greatest inclination.
  • an electric field concentrates around the surface of surface wave excitation body 103, as approximate to FIG. 3A .
  • the surface of heating-target object 102 is therefore locally heated.
  • the relationship between frequency fp and exciting frequency fc, described above, is therefore appropriate for intentionally burning the surface of heating-target object 102.
  • graph 152 has a gentle inclination, compared with the inclination of graph 151 in FIG. 4A .
  • a degree of concentration of an electric field on the surface of surface wave excitation body 103 lowers, and the high-frequency power reaches farther from the surface of surface wave excitation body 103.
  • the field intensity around the surface of surface wave excitation body 103 is therefore relatively greater, the field intensity does not suddenly drop even at a position away from the surface of surface wave excitation body 103.
  • the high-frequency power reaches to a position slightly away from the surface of surface wave excitation body 103.
  • the relationship between frequency fp and exciting frequency fc, described above, is therefore appropriate for heating heating-target object 102 without allowing heating-target object 102 to get burned.
  • graph 153 has almost no inclination, achieving flat field intensity distribution.
  • an electric field does not concentrate around the surface of surface wave excitation body 103, but is widely distributed in a whole area.
  • the high-frequency power to be supplied to surface wave excitation body 103 is not propagated with a surface wave to surface wave excitation body 103, but is radiated into a space.
  • the relationship between frequency fp and exciting frequency fc, described above, is therefore appropriate for relatively evenly heating whole heating-target object 102.
  • high-frequency heating device 100 sets the magnitude relationship between frequency fp of high-frequency power to be supplied to surface wave excitation body 103 and exciting frequency fc of surface wave excitation body 103. How high-frequency power is propagated with a surface wave to surface wave excitation body 103 can therefore be changed. Accordingly, field intensity distribution around the surface of surface wave excitation body 103 changes. As a result, heating-target object 102 can be heated in a heating state desired by a user.
  • the relationship between frequency fp and exciting frequency fc is set to allow frequency fp of high-frequency power to be supplied to surface wave excitation body 103 to be equal to or lower than exciting frequency fc of surface wave excitation body 103.
  • the high-frequency power supplied to surface wave excitation body 103 is propagated with a surface wave to surface wave excitation body 103. That is, the high-frequency power is propagated under an operation in a "surface wave mode".
  • heating-target object 102 can be appropriately heated.
  • the relationship between frequency fp and exciting frequency fc is set to allow frequency fp of high-frequency power to be supplied to surface wave excitation body 103 to be higher than exciting frequency fc of surface wave excitation body 103.
  • the high-frequency power supplied to surface wave excitation body 103 is not propagated with a surface wave to surface wave excitation body 103, but is radiated into a space. That is, the high-frequency power is radiated under an operation in a "radiation mode". Whole heating-target object 102 can therefore be relatively evenly heated.
  • high-frequency power generation unit 120 may include a variable frequency high-frequency transmitter configured to generate high-frequency power at a frequency to be set.
  • the variable frequency high-frequency oscillator can be achieved by using a variable voltage element (e.g., varactor diode) as an element determining a resonance frequency of a resonant circuit configuring the semiconductor oscillation circuit described above.
  • the variable frequency high-frequency oscillator is generally referred to as a voltage controlled oscillator (VCO). Since a technique of a VCO is already known, its detailed description is omitted. In this case, a controller is provided to the high-frequency oscillator to supply voltage information corresponding to a frequency to the VCO. A frequency of the high-frequency oscillator can therefore be changed.
  • the variable frequency high-frequency oscillator may be a phase locked loop (PLL) oscillator including a reference signal generator and a phase comparator. Since a technique of the PLL oscillator is already known, its detailed description is omitted. In this case, a controller is provided to the PLL oscillator to supply an information signal corresponding to a frequency to the phase comparator. A frequency of the PLL oscillator can therefore be changed.
  • PLL phase locked loop
  • surface wave excitation body 103 may be a variable exciting frequency surface wave excitation body configured to change an exciting frequency.
  • the surface wave excitation body is formed with the stub type surface wave excitation body described above, dielectric bodies are inserted under a mechanical control into gaps between the metallic flat plates arranged at constant intervals on the metallic flat plate.
  • the exciting frequency of the surface wave excitation body can therefore be changed.
  • a dielectric constant of the dielectric body may be changed under electrical control, instead of the mechanical control, to change the exciting frequency of the surface wave excitation body.
  • the exciting frequency of the surface wave excitation body can therefore be relatively greatly changed.
  • the heating state in the thickness direction of the heating-target object can therefore be greatly changed.
  • a range of the heating state can therefore be expanded as desired by a user to variously heat the heating-target object.
  • the microwave oven at least includes a heating chamber, a high-frequency power generation unit, a wave guide, a surface wave excitation body configuring a heating unit, a door, and a door choking groove, for example.
  • the heating chamber is formed into an approximately rectangular parallelepiped shape (including a rectangular parallelepiped shape), and is to be internally mounted with a heating-target object.
  • the high-frequency power generation unit includes a magnetron, for example, to supply high-frequency power to the heating chamber.
  • the high-frequency power generation unit is provided below the housing or beside the housing.
  • the wave guide supplies microwaves generated by the high-frequency power generation unit to the heating chamber.
  • the surface wave excitation body is provided below, behind, or above the heating chamber to propagate high-frequency power to heat a heating-target object.
  • the door is provided on a front of the housing for opening and closing of the heating chamber.
  • the door choking groove is provided around the door to prevent electromagnetic waves, such as microwaves, from leaking.
  • the high-frequency heating device according to the present invention has been described based on the exemplary embodiment, the present invention is not limited to the exemplary embodiment.
  • the high-frequency heating device includes the high-frequency power generation unit configured to generate high-frequency power, the surface wave excitation body configured to propagate the high-frequency power with a surface wave to heat a heating-target object, the high-frequency power supply unit configured to supply the high-frequency power to the surface wave excitation body, and the mounting stand on which the heating-target object is mounted.
  • the high-frequency power generation unit sets a magnitude relationship between a frequency of the high-frequency power to be supplied to the surface wave excitation body and an exciting frequency of the surface wave excitation body to heat the heating-target object.
  • the heating-target object in accordance with a heating state desired by a user, the magnitude relationship between the frequency of the high-frequency power to be supplied to the surface wave excitation body and the exciting frequency of the surface wave excitation body is set. In the thickness direction of the heating-target object, the heating-target object can therefore be heated in the desired heating state.
  • the frequency of the high-frequency power to be supplied to the surface wave excitation body may be set equal to or lower than the exciting frequency of the surface wave excitation body.
  • the high-frequency power supplied to the surface wave excitation body is propagated with a surface wave around the surface of the surface wave excitation body under an operation in the "surface wave mode".
  • a side, adjacent to the surface wave excitation body, of the heating-target object can therefore be locally heated.
  • the frequency of the high-frequency power to be supplied to the surface wave excitation body may be set higher than the exciting frequency of the surface wave excitation body.
  • the high-frequency power supplied to the surface wave excitation body is not propagated with a surface wave around the surface of the surface wave excitation body, but is radiated into a space under an operation in the "radiation mode".
  • the whole heating-target object can therefore be evenly heated.
  • the high-frequency power generation unit may be a variable high-frequency oscillator configured to generate the high-frequency power at a variable frequency.
  • a frequency of high-frequency power to be supplied to the surface wave excitation body can be changed.
  • a frequency of high-frequency power relative to an exciting frequency of the surface wave excitation body can therefore be set as desired.
  • field intensity distribution to be formed on the surface wave excitation body can be adjusted as desired.
  • the heating-target object can therefore be heated in various heating states.
  • a surface wave excitation body may be a variable surface wave excitation body configured to change an exciting frequency.
  • an exciting frequency of the surface wave excitation body can be changed relative to a frequency of high-frequency power to be supplied to the surface wave excitation body.
  • the heating-target object In the thickness direction of a heating-target object, the heating-target object can therefore be heated in various heating states.
  • the present invention is useful for the cooking appliances including the microwave heaters.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)

Claims (4)

  1. Hochfrequenzerwärmungsvorrichtung (100), die umfasst:
    eine Hochfrequenzleistungserzeugungseinheit (120), die dazu konfiguriert ist, Hochfrequenzleistung zu erzeugen;
    einen Oberflächenwellen-Anregungskörper (103), der dazu konfiguriert ist, die Hochfrequenzleistung mit einer Oberflächenwelle auszubreiten, um ein Erwärmungszielobjekt (102) zu erwärmen;
    eine Hochfrequenzleistungsversorgungseinheit (110), die dafür konfiguriert ist, die Hochfrequenzleistung an den Oberflächenwellen-Anregungskörper (103) zu liefern; und
    einen Aufstellungsständer (101), auf dem das Erwärmungszielobjekt (102) aufgestellt ist,
    dadurch gekennzeichnet, dass
    die Hochfrequenzleistungserzeugungseinheit (120) ein variabler Hochfrequenzoszillator ist, der dazu konfiguriert ist, die Hochfrequenzleistung bei einer einzustellenden Frequenz (fp) zu erzeugen, wobei die Frequenz (fp) gleich oder niedriger eingestellt ist als die Anregungsfrequenz (fc) des Oberflächenwellen-Anregungskörpers (103), oder höher eingestellt ist als die Anregungsfrequenz (fc), gemäß einem Grad der Oberflächenkonzentration von Hochfrequenzleistung um die Oberfläche des Oberflächenwellen-Anregungskörpers (103) herum, entsprechend des einem von einem Benutzer gewünschten Erwärmungszustands.
  2. Hochfrequenzerwärmungsvorrichtung nach Anspruch 1, wobei der variable Hochfrequenzoszillator mit einer Steuerung versehen ist, die konfiguriert ist, um die Frequenz der dem Oberflächenwellen-Erregungskörper (103) zuzuführenden Hochfrequenzleistung so zu ändern, dass sie gleich oder kleiner ist als die Anregungsfrequenz des Oberflächenwellen-Anregungskörpers (103).
  3. Hochfrequenzerwärmungsvorrichtung nach Anspruch 1, wobei der variable Hochfrequenzoszillator mit einer Steuerung versehen ist, die konfiguriert ist, um die Frequenz der dem Oberflächenwellen-Erregungskörper (103) zuzuführenden Hochfrequenzleistung so zu ändern, dass sie größer ist als die Anregungsfrequenz des Oberflächenwellen-Anregungskörpers (103).
  4. Hochfrequenzerwärmungsvorrichtung nach Anspruch 1, wobei die Hochfrequenzleistungserzeugungseinheit (120) ein variables Spannungselement und/oder ein Phasenregelkreisoszillator ist.
EP17819906.3A 2016-06-30 2017-06-16 Hochfrequenzerwärmungsvorrichtung Active EP3481149B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016129566 2016-06-30
PCT/JP2017/022304 WO2018003546A1 (ja) 2016-06-30 2017-06-16 高周波加熱装置

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EP3481149A1 EP3481149A1 (de) 2019-05-08
EP3481149A4 EP3481149A4 (de) 2019-07-17
EP3481149B1 true EP3481149B1 (de) 2023-05-10

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CN111066375B (zh) * 2018-04-06 2022-03-04 松下知识产权经营株式会社 高频加热装置
JP2022162186A (ja) * 2021-04-12 2022-10-24 パナソニックＩｐマネジメント株式会社 高周波加熱装置

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JPS61240589A (ja) 1985-04-18 1986-10-25 松下電器産業株式会社 高周波加熱装置
JPH06260276A (ja) * 1993-03-04 1994-09-16 Matsushita Electric Ind Co Ltd 高周波加熱装置
JPH1167442A (ja) * 1997-08-22 1999-03-09 Matsushita Electric Ind Co Ltd 高周波加熱装置
JP3690094B2 (ja) * 1997-12-03 2005-08-31 松下電器産業株式会社 高周波加熱装置
JP2003294241A (ja) * 2002-04-01 2003-10-15 Matsushita Electric Ind Co Ltd 加熱調理器
US20110168695A1 (en) * 2009-06-01 2011-07-14 Toshiyuki Okajima Radio-frequency heating apparatus and radio-frequency heating method
US8796593B2 (en) * 2009-09-29 2014-08-05 Panasonic Corporation Radio-frequency heating apparatus and radio-frequency heating method
WO2011070721A1 (ja) * 2009-12-09 2011-06-16 パナソニック株式会社 高周波加熱装置及び高周波加熱方法
JP2015162272A (ja) * 2014-02-26 2015-09-07 パナソニック株式会社 マイクロ波処理装置
JP6248697B2 (ja) * 2014-02-26 2017-12-20 パナソニック株式会社 マイクロ波処理装置
JP2015220189A (ja) * 2014-05-21 2015-12-07 パナソニックＩｐマネジメント株式会社 高周波加熱装置

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CN109315029B (zh) 2021-12-07
EP3481149A4 (de) 2019-07-17
EP3481149A1 (de) 2019-05-08
JP6956326B2 (ja) 2021-11-02
JPWO2018003546A1 (ja) 2019-04-25
CN109315029A (zh) 2019-02-05
WO2018003546A1 (ja) 2018-01-04

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