EP3473352A1 - Method for producing a copper profile and copper profile - Google Patents
Method for producing a copper profile and copper profile Download PDFInfo
- Publication number
- EP3473352A1 EP3473352A1 EP18200963.9A EP18200963A EP3473352A1 EP 3473352 A1 EP3473352 A1 EP 3473352A1 EP 18200963 A EP18200963 A EP 18200963A EP 3473352 A1 EP3473352 A1 EP 3473352A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- matrix element
- profile
- wire
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 181
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 158
- 239000010949 copper Substances 0.000 title claims abstract description 158
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000011159 matrix material Substances 0.000 claims abstract description 78
- 239000007788 liquid Substances 0.000 claims abstract description 60
- 238000000034 method Methods 0.000 claims description 43
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000012784 inorganic fiber Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 description 32
- 230000008023 solidification Effects 0.000 description 32
- 230000005499 meniscus Effects 0.000 description 29
- 239000011156 metal matrix composite Substances 0.000 description 27
- 239000000835 fiber Substances 0.000 description 15
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 10
- 229910010271 silicon carbide Inorganic materials 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 238000005266 casting Methods 0.000 description 8
- 239000000155 melt Substances 0.000 description 8
- 238000005491 wire drawing Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000003303 reheating Methods 0.000 description 4
- 238000005496 tempering Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000010310 metallurgical process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000009715 pressure infiltration Methods 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/008—Continuous casting of metals, i.e. casting in indefinite lengths of clad ingots, i.e. the molten metal being cast against a continuous strip forming part of the cast product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
Definitions
- the invention relates to a method for producing a copper profile, in particular a copper wire, from a matrix element, wherein the matrix element has at least one filament. Furthermore, the invention relates to a copper profile.
- MMC metal-matrix-composite
- melt metallurgical process an infiltration of fibers or particles takes place by means of vacuum and / or pressure, stirring of particles into the melt and subsequent further processing by casting and forming processes.
- powder metallurgy processes can be used in which powder mixtures are sintered or a sintering or forging of ropes made of metal and non-metal fibers takes place.
- coating from a gas phase (PVD / CVD), electrolytic deposition or plasma spraying can be used.
- an apparatus for continuously casting a casting rod in which a core wire of, for example, 7.15 mm of metal is moved upwardly by pinch rollers through a hole in the bottom of a crucible such that another molten metal in the crucible attaches to the core wire and in Casting rod is shaped.
- the attachment takes place here with a solidification direction perpendicular to the core wire axis and below the melt level in the crucible.
- only a rod made of a metal / metal composite but germ MMC is produced.
- a method of pressure infiltration of a fiber preform with a matrix material in which a bath of molten metal as the matrix material is disposed within a pressure chamber and the fiber preform is drawn through three different orifices.
- the first exit opening dips into the molten metal bath and thereby directly influences the formation and the surface quality of the precoated fiber preform.
- the US 2003/0029902 A1 discloses a method in which fiber reinforced metal matrix wires are inserted into the mold to reinforce a casting and then the latter is filled with molten metal.
- the WO 96/27456 A1 discloses a method of producing a metal strand in which a metal strip passes through passed the bottom of a container filled with melt and withdrawn after crystallization of the melt above arranged above the container rollers.
- the opening in the bottom is designed as a slot-shaped channel and the belt speed is chosen so that a meniscus with conical radii of curvature in the region of the mouth of the channel at the bottom of the container melts, so that the meniscus of a two-phase area with the Part liquid metal and solid metallic crystals and is located below the liquid level at the run-up channel.
- the object of the invention is to improve the state of the art.
- a copper-matrix composite wire can be produced directly in a single method step by passing the matrix element through the copper melt. Consequently, the conventional process steps such as casting wire rod, up-casting, coarse wire drawing and / or fine wire drawing are eliminated.
- the method according to the invention produces copper profiles and in particular copper wires made of MMC, which have optimized material properties in terms of tensile strength, electrical conductivity and fatigue strength as well as density. It is particularly advantageous that a copper wire is produced free of forming processes, which provides an optimized electrical conductivity.
- An essential idea of the invention is based on the fact that a matrix element is guided through the copper melt by means of an opening in a crucible with copper melt such that the solidification of the copper deposited on the matrix element is uninfluenced by liquid copper in the crucible Crucible takes place and thereby directly the copper profile is formed.
- a copper matrix wire is manufactured directly in a single process step.
- a "copper profile” is in particular an elongate component made of copper and the matrix element.
- a copper profile has in particular over its entire length a same cross-section and / or a same surface quality.
- a copper profile is, in particular, a wire, in particular fine wire, a band and / or a rod of a composite copper matrix element.
- a "copper wire” is understood in particular to be a thin, long and flexible shaped metal and / or copper alloy.
- a copper wire may in particular have a circular cross-section or another cross-sectional shape.
- a copper wire may in particular also be a flat, square and / or profile wire.
- the copper wire has a diameter of 0.1 mm to 30 mm, preferably 0.2 mm to 0.5 mm.
- the copper wire has in particular a matrix element and thus forms of a copper-non-metal composite material.
- a “matrix element” is in particular an elongate element which is free of copper and / or copper alloys or metal.
- the matrix element has in particular at least one filament.
- filament is meant in particular a single fiber of any length.
- a filament has in particular an inorganic or organic substance.
- a filament may be, for example, a textile, glass, carbon and / or ceramic fiber.
- the filament and / or matrix element has a surface property which attracts melt.
- a "copper crucible” also called melting crucible is in particular a one-sided and in particular open container.
- solid copper in a melting furnace can be melted in a copper crucible.
- the copper crucible in particular has liquid copper, through which the matrix element is guided through an opening.
- An "opening" is in particular an unclosed location in the bottom of the copper crucible and thus a passage through the bottom of the copper crucible.
- the opening in particular has an arbitrary cross-section.
- the opening is adapted to the performed matrix element such that liquid copper from the copper crucible can not penetrate through the opening to the outside and / or leak.
- the opening is designed, for example, as a round hole and, in the case of a strip to be produced, as a slot.
- liquid copper in particular copper and / or copper alloy in the liquid state of aggregation, so that the liquid copper is free-flowing.
- solidification of the applied copper on the matrix element free from the liquid copper in the filled copper crucible is understood, in particular, that copper already applied to the matrix element is not or only slightly influenced by the liquid copper in the filled copper crucible during its solidification. Thus, a defined cooling and solidification of the melt takes place at the upper end of the meniscus. This effect leads in particular to a formation of the solidification front above the melt surface and parallel to it. The solidification direction is carried out in particular counter to the direction of movement of the filament.
- the implementation is carried out by a continuous drawing.
- an endless MMC wire and / or an endless copper profile of any length can be produced.
- the copper profile is manufactured continuously with a high, consistent surface quality.
- a specific diameter of the finished copper profile and in particular a very small MMC wire diameter can be produced via a speed during continuous drawing.
- a wire can be produced with an MMC in which its manufactured diameter is essentially freely selectable and in particular can be ⁇ 0.3 mm.
- a quasi-endless wire of any length and at least one filament can be produced.
- an MMC wire is produced by drawing a matrix element directly from a copper melt without further process steps.
- pulling is meant in particular exerting a force in the direction of a power source.
- a tensile stress is applied to the matrix element and / or the filament.
- drawing in particular, the matrix element and / or filament is drawn through the opening and the molten copper of the filled copper crucible.
- pulling is to be understood in particular in the sense of guiding.
- a solidification direction of the applied copper on the matrix element is aligned along or parallel to a longitudinal axis of the matrix element.
- the solidification direction is opposite to the direction of pull, whereby the extent of the solidification front and the thickness of the solidified copper on the matrix element can be influenced by the speed of performing and / or drawing.
- a "solidification direction” is in particular the direction in which the solidification of the applied copper takes place on the matrix element. If, for example, the matrix element is pulled upwards out of the copper crucible with the filled liquid copper into the surrounding atmosphere, the direction of solidification is in particular counter to the direction of pull, i. towards the melt, and vertically aligned. Thus, in particular, a stationary solidification front is established.
- a “longitudinal axis” is in particular the length of the longest extent of the matrix element.
- a longitudinal axis is therefore in particular the axis extending in the longitudinal direction of the matrix element.
- the longitudinal axis of the matrix element is aligned vertically, so that a free meniscus of copper deposited around the matrix element at and / or above a liquid level of the liquid copper in the filled copper crucible is formed.
- a free meniscus of deposited copper is formed around the matrix element, the free meniscus having a self-stabilizing round cross-section. This reduces or eliminates any reworking steps.
- the formed meniscus causes small particles, such as scale and / or crucible material, to collect on the lower base of the meniscus and sink into the liquid copper in the filled copper crucible, leaving the area of the solidification front free of particles. Consequently, basically a wire surface is formed, which is smooth and free of particles.
- the solidification of the applied copper on the matrix element can be influenced not only by the pulling speed of the matrix element but also by targeted influencing of the meniscus.
- the design of the filled with liquid copper copper crucible such as the liquid level of the liquid copper, the configuration of the opening in the copper crucible bottom, the temperature and viscosity of the liquid copper, the formation and shape of the meniscus, since this is above the liquid level of the liquid copper in the copper crucible and thus largely arranged in the surrounding atmosphere, by further parameters how the ambient temperature, the air pressure and the like, as well as the temperature of the matrix element on the solidification front influences.
- the crucible shape and shape and the type of filament have a stabilizing effect on the meniscus.
- the meniscus in the drawing direction continuously tapers to the thickness of the solidified copper on the matrix element.
- a "meniscus” is understood in particular as a curvature on the surface of a liquid.
- the meniscus forms, in particular, on the liquid surface of the liquid copper in the filled copper crucible due to the passing and / or drawing of the matrix element by the liquid copper and the breakdown of the matrix element by the liquid surface of the liquid copper.
- the formation of the meniscus is particularly due to the interaction between the liquid level and the surface of the matrix element with the copper applied.
- the meniscus has a convex shape at the top of the solidification front and a concave shape below the liquid level.
- the curvature of the meniscus maximally and decreases as it approaches the liquid level.
- a "free meniscus” means that the meniscus itself is not within the liquid copper in the filled copper crucible, but is largely in the surrounding atmosphere.
- the free meniscus is in particular only at its lower base in contact with the liquid level of the liquid copper in the filled copper crucible.
- the “liquid level” is in particular the liquid level of the liquid copper in the filled copper crucible.
- the liquid level also called liquid surface, in particular represents the interface between the liquid copper and the surrounding atmosphere arranged above it.
- the opening is covered by the liquid copper.
- the matrix element is directly and immediately surrounded by liquid copper when introduced into the opening of the copper crucible. Further, the copper melt can not leak out of the copper crucible due to utilization of the surface tension of the molten copper.
- the matrix element has further filaments and / or a filament bundle.
- the proportion of filaments and / or fibers in the MMC profile and / or wire can be increased.
- multifilaments and twisted, twisted, braided and / or differently connected filaments can be used in a filament bundle.
- the tensile strength and fatigue strength can be increased and the density and weight of the manufactured copper profile and / or wire can be reduced.
- the matrix element has an inorganic fiber, in particular a carbon fiber and / or a silicon carbide fiber.
- carbon fiber (also called “carbon fiber”) is an industrially produced fiber of carbonaceous feedstock which is converted by adapted chemical reactions into graphitic carbon.
- a "silicon carbide fiber” is a fiber of a chemical compound of silicon and carbon belonging to the group of carbides.
- a silicon carbide fiber is in particular a ceramic fiber.
- a filament or several filaments have a diameter between 3pm and 30pm, especially between 6pm and 20pm.
- the filament or filaments, and thus the matrix element have a suitable geometry, in particular to produce fine MMC wires with a final maximum wire diameter of ⁇ 300pm.
- the process is carried out under a protective gas atmosphere.
- the air of the surrounding atmosphere and especially the oxygen of the air can be displaced by the protective gas.
- a thickness of the copper profile is set by means of a pulling speed of the matrix element and / or a temperature control, in particular a vertical temperature control.
- the thickness of the copper profile can be selectively adjusted via the drawing speed and / or a temperature control.
- the temperature control is designed to be vertically variable. As a result, both the shape and extent of the meniscus and the solidification range can be influenced.
- a “tempering” is understood in particular to be a regulation of the temperature.
- a tempering may in particular be a cooling and / or heating.
- the tempering can in particular be configured evenly and / or variably over the length of the matrix element with the copper applied.
- a “vertical temperature control” is understood in particular to mean that the temperature control is vertically aligned and thus runs along the longitudinal axis of the matrix element and the solidification direction.
- the temperature control in particular has individual heating elements and / or cooling elements.
- the heating elements and the cooling elements can be actively and / or passively configured. For example, heat radiators based on gas or electrical energy are used as "active heating elements".
- cooling element can be active or passive, for example, as “passive cooling element” cooling fins are used, which are arranged in spatial proximity to the matrix element with the applied copper
- passive cooling element cooling fins are used, which are arranged in spatial proximity to the matrix element with the applied copper
- materials with certain thermal properties, such as heat reflection or heat conduction, can also be used for tempering.
- the object is achieved by a copper profile, in particular a copper wire, wherein the copper profile is produced by means of a method described above.
- a copper profile in particular copper wire, provided, which or which is manufactured in a single manufacturing step by means of the method according to the invention. It is particularly advantageous that a copper profile is produced by the method according to the invention, which has a very uniform copper sheath of constant thickness and constant properties over any length. Above all, this makes the surface of the copper profile and / or wire very smooth and free of particles, such as scale. Therefore, post-processing steps of the finished copper profile and / or wire can be dispensed with. In particular, thin copper wires with a diameter of less than 0.3 mm can be produced in less steps than the prior art.
- a thickness of the copper profile is ⁇ 0.3 mm.
- a crucible 107 has an opening 108 on the bottom side. Through the opening 108, a silicon carbide filament 103 with a diameter of 15 pm is guided vertically upwards by means of a unidirectional unwinding and unwinding unit, not shown.
- the crucible 107 is arranged in a melting furnace, not shown, and has a copper melt 105 in its interior. By means of the unidirectional unwinding and Aufspulhow is pulled in the pulling direction 111 on the silicon carbide filament 103 and this continuously through the opening 108 and the copper melt arranged above 105 moves in the crucible 107.
- the opening 108 has a circular profile with a diameter of 0.2 mm. This ensures that the copper melt 105 does not exit the opening 108 108 vertically through the opening 108.
- the area around the opening 108 has a material with a repellent wetting behavior.
- a meniscus 113 of molten copper is formed, which is continuously applied to the silicon carbide filament 103. Due to the continuous pulling in the pulling direction 111, a solidification front (transition from liquid to solid copper) forms at the transition of the meniscus 113 to the regular cross section of the MMC wire 101. By deliberately guiding the meniscus 113, a self-stabilizing round cross section of the applied copper forms on the silicon carbide filament 103.
- any smaller particles present such as scale, crucible material and the like, collect on a lower base of the meniscus 113 to the copper melt 105, whereby the region of the solidification front remains free of particles.
- a surface of the fabricated MMC wire 101 is achieved, which is very uniform and smooth and free of particles.
- a reheating zone 109 In the drawing direction 111 follows after the formation of the meniscus 113, a reheating zone 109, through which the MMC wire 101 is moved further.
- the reheating zone 109 has individual heating and cooling elements, via which a corresponding temperature profile is impressed on the meniscus and the MMC wire 101. As a result, a defined solidification profile is impressed on the MMC wire 101 and the surface quality is further improved.
- the entire manufacturing process of the MMC wire 101 is carried out under a protective gas atmosphere, so that in particular no oxygen diffuses into the fabricated MMC wire 101.
- the diameter of the finished MMC wire 101 is determined via a pulling speed in the drawing direction 111 and the set temperature profile of the reheating zone 109.
- an MMC wire 101 is continuously manufactured with very high surface qualities and a uniform wire diameter of 130 pm, without the need for further post-treatment steps.
- an inexpensive and fast manufacturing method for manufacturing MMC wire 101 is provided.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Continuous Casting (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zum Herstellen eines Kupferprofils, insbesondere eines Kupferdrahtes, aus einem Matrixelement, wobei das Matrixelement mindestens ein Filament aufweist, mit folgendem Schritt - Durchführen des Matrixelementes durch eine Öffnung eines mit flüssigen Kupfer gefüllten Kupfertiegels derart, dass flüssiges Kupfer auf dem Matrixelement aufgebracht wird und das aufgebrachte Kupfer auf dem Matrixelement frei von dem flüssigen Kupfer im gefüllten Kupfertiegel derart erstarrt, dass direkt das Kupferprofil ausgebildet wird. Des Weiteren betrifft die Erfindung ein Kupferprofil.The invention relates to a method for producing a copper profile, in particular a copper wire, from a matrix element, wherein the matrix element has at least one filament, with the following step Passing the matrix element through an opening of a copper crucible filled with liquid copper in such a way that liquid copper is applied to the matrix element and the deposited copper solidifies on the matrix element free of the liquid copper in the filled copper crucible in such a way that the copper profile is formed directly. Furthermore, the invention relates to a copper profile.
Description
Die Erfindung betrifft ein Verfahren zum Herstellen eines Kupferprofils, insbesondere eines Kupferdrahtes, aus einem Matrixelement, wobei das Matrixelement mindestens ein Filament aufweist. Des Weiteren betrifft die Erfindung ein Kupferprofil.The invention relates to a method for producing a copper profile, in particular a copper wire, from a matrix element, wherein the matrix element has at least one filament. Furthermore, the invention relates to a copper profile.
Zur Herstellung von einem Kupferdraht aus einem Metall-Matrix-Composit (MMC) sind verschiedene Verfahren bekannt. Beim schmelzmetallurgischen Prozess erfolgt eine Infiltration von Fasern oder Partikeln durch Vakuum und/oder Druck, ein Einrühren von Partikeln in die Schmelze und anschließende Weiterverarbeitung durch Gieß- und Umformverfahren. Ebenso können pulvermetallurgische Prozesse verwendet werden, bei denen Pulvermixturen gesintert werden oder ein Sintern oder Schmieden von Tauen aus Metall- und Nichtmetallfasern erfolgt. Auch kann ein Beschichten aus einer Gasphase (PVD/CVD), elektrolytisches Abscheiden oder Plasmaspritzen angewandt werden.Various methods are known for producing a metal-matrix-composite (MMC) copper wire. In the melt metallurgical process, an infiltration of fibers or particles takes place by means of vacuum and / or pressure, stirring of particles into the melt and subsequent further processing by casting and forming processes. Likewise, powder metallurgy processes can be used in which powder mixtures are sintered or a sintering or forging of ropes made of metal and non-metal fibers takes place. Also, coating from a gas phase (PVD / CVD), electrolytic deposition or plasma spraying can be used.
Im Allgemeinen benötigen alle diese Herstellungsverfahren mehrere Verfahrensschritte wie Gieß-Walz-Drahtherstellung, Grobdrahtzug und/oder Feindrahtzug.In general, all of these manufacturing methods require several process steps such as cast-rolled wire production, coarse wire drawing, and / or fine wire drawing.
Zudem reduziert sich die elektrische Leitfähigkeit durch das Verwenden von Legierungen und/oder durch Umformen eines Kupferprofils erheblich. Des Weiteren wird die Verarbeitung von höherfesten Legierungen zu Drähten mit einem Durchmesser < 0,3mmm durch die geringe Umformbarkeit immer aufwändiger.In addition, the electrical conductivity is reduced considerably by the use of alloys and / or by forming a copper profile. Furthermore, the processing of higher-strength alloys to wires with a diameter <0.3mmm by the low formability always consuming.
In der
Aus der
Die
Die
Nachteilig bei den oben genannten Verfahren sowie den allgemein bekannten Verfahren zur Herstellung von Feindrähten mit einem Durchmesser < 0,3mm sind die Vielzahl an notwendigen Verfahrensschritten, insbesondere Gieß-Walzdraht-Herstellung, Up-Casting, Grobdrahtzug, Mitteldrahtzug und Feindrahtzug sowie eine mehrfache Wärmebehandlung.Disadvantages of the abovementioned processes and the generally known processes for the production of fine wires with a diameter <0.3 mm are the large number of necessary process steps, in particular cast-wire production, up-casting, coarse-wire drawing, middle-wire drawing and fine-wire drawing, as well as multiple heat treatment.
Ein einfach durchführbares und kostengünstiges Verfahren zum Herstellen eines Kupferdrahtes aus Metall-Matrix-Composit und somit einem Kupfer-Nichtmetall-Verbundwerkstoff ist aus dem Stand der Technik nicht bekannt.A simple and inexpensive method for producing a metal-matrix-composite copper wire, and thus a copper-nonmetal composite, is not known in the prior art.
Aufgabe der Erfindung ist es, den Stand der Technik zu verbessern.The object of the invention is to improve the state of the art.
Gelöst wird die Aufgabe durch ein Verfahren zum Herstellen eines Kupferprofils, insbesondere eines Kupferdrahtes, aus einem Matrixelement, wobei das Matrixelement mindestens ein Filament aufweist, mit folgendem Schritt:
- Durchführen des Matrixelementes durch eine Öffnung eines mit flüssigem Kupfer gefüllten Kupfertiegels derart, dass flüssiges Kupfer auf dem Matrixelement aufgebracht wird und das aufgebrachte Kupfer auf dem Matrixelement frei von dem flüssigen Kupfer vom gefüllten Kupfertiegel derart erstarrt, dass direkt das Kupferprofil ausgebildet wird.
- Passing the matrix element through an opening of a copper crucible filled with liquid copper such that liquid copper is applied to the matrix element and the deposited copper solidifies on the matrix element free of the liquid copper from the filled copper crucible such that the copper profile is directly formed.
Mit dem erfinderischen Verfahren ist somit ein Kupfer-Matrix-Composit-Draht direkt in einem einzigen Verfahrensschritt durch das Durchführen des Matrixelementes durch die Kupferschmelze herstellbar. Folglich entfallen die herkömmlichen Verfahrensschritte wie beim Gieß-Walzdraht, Up-Casting, Grobdrahtzug und/oder Feindrahtzug.Thus, with the inventive method, a copper-matrix composite wire can be produced directly in a single method step by passing the matrix element through the copper melt. Consequently, the conventional process steps such as casting wire rod, up-casting, coarse wire drawing and / or fine wire drawing are eliminated.
Mithin werden mit dem erfindungsgemäßen Verfahren Kupferprofile und insbesondere Kupferdrähte aus MMC hergestellt, die in Bezug auf Zugfestigkeit, elektrische Leitfähigkeit und Dauerschwingfestigkeit sowie Dichte optimierte Materialeigenschaften aufweisen. Es ist besonders vorteilhaft, dass ein Kupferdraht frei von Umformprozessen hergestellt wird, welcher eine optimierte elektrische Leitfähigkeit bereitstellt.Consequently, the method according to the invention produces copper profiles and in particular copper wires made of MMC, which have optimized material properties in terms of tensile strength, electrical conductivity and fatigue strength as well as density. It is particularly advantageous that a copper wire is produced free of forming processes, which provides an optimized electrical conductivity.
Ein wesentlicher Gedanke der Erfindung beruht darauf, dass ein Matrixelement mittels einer Öffnung in einem Tiegel mit Kupferschmelze derart durch die Kupferschmelze geführt wird, dass das Erstarren des auf dem Matrixelement aufgebrachten Kupfers unbeeinflusst von flüssigem Kupfer im Tiegel erfolgt und dadurch direkt das Kupferprofil ausgebildet wird. Somit wird ein Kupfer-Matrix-Draht direkt in einem einzigen Verfahrensschritt gefertigt.An essential idea of the invention is based on the fact that a matrix element is guided through the copper melt by means of an opening in a crucible with copper melt such that the solidification of the copper deposited on the matrix element is uninfluenced by liquid copper in the crucible Crucible takes place and thereby directly the copper profile is formed. Thus, a copper matrix wire is manufactured directly in a single process step.
Ein "Kupferprofil" ist insbesondere ein längliches Bauteil aus Kupfer und dem Matrixelement. Ein Kupferprofil weist insbesondere über seine gesamte Länge einen gleichen Querschnitt und/oder eine gleiche Oberflächenqualität auf. Bei einem Kupferprofil handelt es sich insbesondere um einen Draht, insbesondere Feindraht, ein Band und/oder einen Stab aus einem Verbundwerkstoff Kupfer-Matrixelement.A "copper profile" is in particular an elongate component made of copper and the matrix element. A copper profile has in particular over its entire length a same cross-section and / or a same surface quality. A copper profile is, in particular, a wire, in particular fine wire, a band and / or a rod of a composite copper matrix element.
Unter einem "Kupferdraht" wird insbesondere ein dünn, lang und biegsam geformtes Metall und/oder Kupferlegierung verstanden. Ein Kupferdraht kann insbesondere einen kreisförmigen Querschnitt oder eine andere Querschnittsform aufweisen. Bei einem Kupferdraht kann es sich insbesondere auch um einen Flach-, Vierkant- und/oder Profildraht handeln. Der Kupferdraht weist insbesondere einen Durchmesser von 0,1mm bis 30mm, bevorzugt 0,2mm bis 0,5mm auf. Der Kupferdraht weist insbesondere ein Matrixelement auf und bildet somit aus einem Kupfer-Nichtmetall-Verbundwerkstoff.A "copper wire" is understood in particular to be a thin, long and flexible shaped metal and / or copper alloy. A copper wire may in particular have a circular cross-section or another cross-sectional shape. A copper wire may in particular also be a flat, square and / or profile wire. In particular, the copper wire has a diameter of 0.1 mm to 30 mm, preferably 0.2 mm to 0.5 mm. The copper wire has in particular a matrix element and thus forms of a copper-non-metal composite material.
Ein "Matrixelement" ist insbesondere ein längliches Element, welches frei von Kupfer und/oder Kupferlegierungen oder Metall ist. Das Matrixelement weist insbesondere mindestens ein Filament auf.A "matrix element" is in particular an elongate element which is free of copper and / or copper alloys or metal. The matrix element has in particular at least one filament.
Unter "Filament" wird insbesondere eine einzelne Faser beliebiger Länge verstanden. Ein Filament weist insbesondere einen anorganischen oder organischen Stoff auf. Bei einem Filament kann es sich beispielsweise um eine Textil-, Glas-, Kohlenstoff- und/oder Keramikfaser handeln. Bevorzugt weist das Filament und/oder Matrixelement eine Oberflächeneigenschaft auf, welche Schmelze anzieht.By "filament" is meant in particular a single fiber of any length. A filament has in particular an inorganic or organic substance. A filament may be, for example, a textile, glass, carbon and / or ceramic fiber. Preferably, the filament and / or matrix element has a surface property which attracts melt.
Ein "Kupfertiegel" auch Schmelztiegel genannt ist insbesondere ein einseitig und insbesondere offener Behälter. In einem Kupfertiegel kann insbesondere festes Kupfer in einem Schmelzeofen geschmolzen werden. Der Kupfertiegel weist insbesondere flüssiges Kupfer auf, durch welches das Matrixelement durch eine Öffnung geführt wird.A "copper crucible" also called melting crucible is in particular a one-sided and in particular open container. In particular, solid copper in a melting furnace can be melted in a copper crucible. The copper crucible in particular has liquid copper, through which the matrix element is guided through an opening.
Eine "Öffnung" ist insbesondere eine nichtverschlossene Stelle im Boden des Kupfertiegels und somit ein Durchlass durch den Boden des Kupfertiegels. Die Öffnung weist insbesondere einen beliebigen Querschnitt auf. Bevorzugt ist die Öffnung an das durchgeführte Matrixelement derart angepasst, dass flüssiges Kupfer aus dem Kupfertiegel nicht durch die Öffnung nach außen dringen und/oder auslaufen kann. Im Falle eines zu fertigenden Drahtes ist die Öffnung beispielsweise als rundes Loch und im Falle eines zu fertigenden Bandes als Langloch ausgeführt.An "opening" is in particular an unclosed location in the bottom of the copper crucible and thus a passage through the bottom of the copper crucible. The opening in particular has an arbitrary cross-section. Preferably, the opening is adapted to the performed matrix element such that liquid copper from the copper crucible can not penetrate through the opening to the outside and / or leak. In the case of a wire to be produced, the opening is designed, for example, as a round hole and, in the case of a strip to be produced, as a slot.
Unter "flüssigem Kupfer" wird insbesondere Kupfer und/oder Kupferlegierung im flüssigen Aggregatzustand verstanden, sodass das flüssige Kupfer fließfähig ist.By "liquid copper" is meant in particular copper and / or copper alloy in the liquid state of aggregation, so that the liquid copper is free-flowing.
Unter "Erstarren des aufgebrachten Kupfers auf dem Matrixelement frei von dem flüssigen Kupfer im gefüllten Kupfertiegel" wird insbesondere verstanden, dass bereits auf dem Matrixelement aufgebrachtes Kupfer bei seinem Erstarren nicht oder nur im geringen Maße von dem flüssigen Kupfer im gefüllten Kupfertiegel beeinflusst wird. Somit erfolgt ein definiertes Abkühlen und Erstarren der Schmelze am oberen Ende des Meniskus. Dieser Effekt führt insbesondere zur einer Ausbildung der Erstarrungsfront über der Schmelzoberfläche und parallel zu dieser. Die Erstarrungsrichtung erfolgt dabei insbesondere entgegen der Bewegungsrichtung des Filaments.By "solidification of the applied copper on the matrix element free from the liquid copper in the filled copper crucible" is understood, in particular, that copper already applied to the matrix element is not or only slightly influenced by the liquid copper in the filled copper crucible during its solidification. Thus, a defined cooling and solidification of the melt takes place at the upper end of the meniscus. This effect leads in particular to a formation of the solidification front above the melt surface and parallel to it. The solidification direction is carried out in particular counter to the direction of movement of the filament.
In einer weiteren Ausgestaltungsform des Verfahrens erfolgt das Durchführen durch ein kontinuierliches Ziehen.In a further embodiment of the method, the implementation is carried out by a continuous drawing.
Dadurch, dass das Matrixelement kontinuierlich durch die Öffnung des mit flüssigen Kupfers gefüllten Kupfertiegels gezogen wird, ist ein endloser MMC-Draht und/oder ein endloses Kupferprofil beliebiger Länge herstellbar. Zudem wird das Kupferprofil kontinuierlich mit einer hohen, gleichbleibenden Oberflächenqualität gefertigt.Characterized in that the matrix element is continuously pulled through the opening of the liquid copper filled copper crucible, an endless MMC wire and / or an endless copper profile of any length can be produced. In addition, the copper profile is manufactured continuously with a high, consistent surface quality.
Es ist besonders vorteilhaft, dass über eine Geschwindigkeit beim kontinuierlichen Ziehen ein spezifischer Durchmesser des gefertigten Kupferprofils und insbesondere ein sehr geringer MMC-Drahtdurchmesser gefertigt werden kann.It is particularly advantageous that a specific diameter of the finished copper profile and in particular a very small MMC wire diameter can be produced via a speed during continuous drawing.
Vor allem wird alleinig durch das Ziehen des Matrixelementes durch den mit flüssigem Kupfer gefüllten Kupfertiegel das Kupferprofil gefertigt. Somit liegt ein sehr kostengünstiges und einstufiges Verfahren zum Fertigen eines Kupferprofils aus MMC-Verbundwerkstoff vor.Above all, only by pulling the matrix element by the filled with liquid copper Copper crucible made of copper profile. Thus, there is a very inexpensive and one-step process for manufacturing a copper profile of MMC composite material.
Folglich kann mit dem erfindungsgemäßen Verfahren insbesondere ein Draht mit einem MMC hergestellt werden, bei dem sein gefertigter Durchmesser im Wesentlichen frei wählbar ist und insbesondere < 0,3mm sein kann. Zudem kann ein quasi endloser Draht mit beliebiger Länge und mindestens einem Filament hergestellt werden.Consequently, with the method according to the invention, in particular a wire can be produced with an MMC in which its manufactured diameter is essentially freely selectable and in particular can be <0.3 mm. In addition, a quasi-endless wire of any length and at least one filament can be produced.
Es ist besonders vorteilhaft, dass ein MMC-Draht durch Ziehen eines Matrixelementes direkt aus einer Kupferschmelze ohne weitere Verfahrensschritte gefertigt wird.It is particularly advantageous that an MMC wire is produced by drawing a matrix element directly from a copper melt without further process steps.
Unter "Ziehen" wird insbesondere ein Ausüben einer Kraft in Richtung einer Kraftquelle verstanden. Beim Ziehen wird insbesondere eine Zugspannung auf das Matrixelement und/oder das Filament aufgebracht. Beim Ziehen wird insbesondere das Matrixelement und/oder Filament durch die Öffnung und das geschmolzene Kupfer des gefüllten Kupfertiegels gezogen. Somit ist Ziehen insbesondere im Sinne von Führen zu verstehen.By "pulling" is meant in particular exerting a force in the direction of a power source. When drawing, in particular, a tensile stress is applied to the matrix element and / or the filament. When drawing, in particular, the matrix element and / or filament is drawn through the opening and the molten copper of the filled copper crucible. Thus, pulling is to be understood in particular in the sense of guiding.
Um ein optimales Erstarren des aufgebrachten Kupfers auf dem Matrixelement zu erreichen, wird eine Erstarrungsrichtung des aufgebrachten Kupfers auf dem Matrixelement längs oder parallel einer Längsachse des Matrixelementes ausgerichtet.In order to achieve optimum solidification of the applied copper on the matrix element, a solidification direction of the applied copper on the matrix element is aligned along or parallel to a longitudinal axis of the matrix element.
Somit erfolgt das Erstarren des aufgebrachten Kupfers entlang der Längsachse des Matrixelementes, sodass ein Erstarrungsprofil entlang des Matrixelementes ausgebildet werden kann.Thus, the solidification of the applied copper along the longitudinal axis of the matrix element, so that a solidification profile along the matrix element can be formed.
Mithin ist die Erstarrungsrichtung entgegengesetzt zur Zugrichtung, wodurch die Ausdehnung der Erstarrungsfront sowie die Dicke des erstarrten Kupfers auf dem Matrixelement durch die Geschwindigkeit des Durchführens und/oder Ziehens beeinflusst werden kann.Thus, the solidification direction is opposite to the direction of pull, whereby the extent of the solidification front and the thickness of the solidified copper on the matrix element can be influenced by the speed of performing and / or drawing.
Es ist besonders vorteilhaft, wenn durch das Durchführen und/oder Ziehen das Matrixelement mit dem aufgebrachten Kupfer oberhalb des Flüssigkeitsspiegels des flüssigen Kupfers aus der Kupferschmelze herausgebracht und das Erstarren außerhalb des flüssigen Kupfers oberhalb des Flüssigkeitsspiegels erfolgt.It is particularly advantageous if brought out by the passage and / or drawing the matrix element with the copper applied above the liquid level of the liquid copper from the molten copper and the solidification takes place outside the liquid copper above the liquid level.
Eine "Erstarrungsrichtung" ist insbesondere die Richtung, in der das Erstarren des aufgebrachten Kupfers auf das Matrixelement erfolgt. Wird beispielsweise das Matrixelement nach oben aus dem Kupfertiegel mit dem gefüllten flüssigen Kupfer hinaus in die umgebende Atmosphäre gezogen, so ist die Erstarrungsrichtung insbesondere entgegen der Zugrichtung, d.h. in Richtung der Schmelze, und vertikal ausgerichtet. Somit etabliert sich insbesondere eine stationäre Erstarrungsfront.A "solidification direction" is in particular the direction in which the solidification of the applied copper takes place on the matrix element. If, for example, the matrix element is pulled upwards out of the copper crucible with the filled liquid copper into the surrounding atmosphere, the direction of solidification is in particular counter to the direction of pull, i. towards the melt, and vertically aligned. Thus, in particular, a stationary solidification front is established.
Folglich ist ein fortlaufender gerichteter Erstarrungsprozess des aufgebrachten Kupfers auf dem Matrixelement realisierbar.Consequently, a continuous directional solidification process of the applied copper on the matrix element is feasible.
Eine "Längsachse" ist insbesondere die Länge der längsten Ausdehnung des Matrixelementes. Eine Längsachse ist somit insbesondere die in der Längsrichtung des Matrixelementes verlaufende Achse.A "longitudinal axis" is in particular the length of the longest extent of the matrix element. A longitudinal axis is therefore in particular the axis extending in the longitudinal direction of the matrix element.
In einer weiteren Gestaltungsform des Verfahrens wird die Längsachse des Matrixelementes vertikal ausgerichtet, sodass sich ein freier Meniskus aus aufgebrachtem Kupfer um das Matrixelement am und/oder oberhalb eines Flüssigkeitsspiegels des flüssigen Kupfers im gefüllten Kupfertiegel ausbildet.In a further embodiment of the method, the longitudinal axis of the matrix element is aligned vertically, so that a free meniscus of copper deposited around the matrix element at and / or above a liquid level of the liquid copper in the filled copper crucible is formed.
Somit wird ein freier Meniskus aus aufgebrachtem Kupfer um das Matrixelement ausgebildet, wobei der freie Meniskus einen selbststabilisierenden runden Querschnitt aufweist. Dadurch werden eventuelle Nachbearbeitungsschritte reduziert oder vermieden.Thus, a free meniscus of deposited copper is formed around the matrix element, the free meniscus having a self-stabilizing round cross-section. This reduces or eliminates any reworking steps.
Zudem führt der ausgebildete Meniskus dazu, dass sich an der unteren Basis des Meniskus kleine Partikel, wie Zunder und/oder Tiegelmaterial, sammeln können und in das flüssige Kupfer im gefüllten Kupfertiegel absinken, sodass der Bereich der Erstarrungsfront frei von Partikeln bleibt. Folglich wird grundsätzlich eine Drahtoberfläche ausgebildet, welche glatt und frei von Partikeln ist.In addition, the formed meniscus causes small particles, such as scale and / or crucible material, to collect on the lower base of the meniscus and sink into the liquid copper in the filled copper crucible, leaving the area of the solidification front free of particles. Consequently, basically a wire surface is formed, which is smooth and free of particles.
Des Weiteren kann nicht nur über die Ziehgeschwindigkeit des Matrixelementes, sondern auch durch gezielte Beeinflussung des Meniskus das Erstarren des aufgebrachten Kupfers auf dem Matrixelement beeinflusst werden. Neben der Ausgestaltung des mit flüssigen Kupfers gefüllten Kupfertiegels, wie die Flüssigkeitshöhe des flüssigen Kupfers, die Ausgestaltung der Öffnung im Kupfertiegelboden, die Temperatur und Viskosität des flüssigen Kupfers, wird die Ausbildung und Form des Meniskus, da dieser oberhalb des Flüssigkeitsspiegels des flüssigen Kupfers in den Kupfertiegel und somit weitgehend in der umgebenden Atmosphäre angeordnet ist, durch weitere Parameter, wie die Umgebungstemperatur, den Luftdruck und ähnliches, sowie durch die Temperatur des Matrixelementes an der Erstarrungsfront beeinflusst. Insbesondere die Tiegelausgestaltung und -form sowie die Art des Filaments wirken sich stabilisierend auf den Meniskus aus.Furthermore, the solidification of the applied copper on the matrix element can be influenced not only by the pulling speed of the matrix element but also by targeted influencing of the meniscus. In addition to the design of the filled with liquid copper copper crucible, such as the liquid level of the liquid copper, the configuration of the opening in the copper crucible bottom, the temperature and viscosity of the liquid copper, the formation and shape of the meniscus, since this is above the liquid level of the liquid copper in the copper crucible and thus largely arranged in the surrounding atmosphere, by further parameters how the ambient temperature, the air pressure and the like, as well as the temperature of the matrix element on the solidification front influences. In particular, the crucible shape and shape and the type of filament have a stabilizing effect on the meniscus.
Es ist insbesondere Vorteilhaft, dass sich der Meniskus in Ziehrichtung kontinuierlich auf die Dicke des erstarrten Kupfers auf dem Matrixelement verjüngt.It is particularly advantageous that the meniscus in the drawing direction continuously tapers to the thickness of the solidified copper on the matrix element.
Unter einem "Meniskus" wird insbesondere eine Wölbung an der Oberfläche einer Flüssigkeit verstanden. Der Meniskus bildet sich insbesondere an der Flüssigkeitsoberfläche des flüssigen Kupfers im gefüllten Kupfertiegel aufgrund des Durchführens und/oder Ziehens des Matrixelementes durch das flüssige Kupfer und des Durchbrechens des Matrixelementes durch die Flüssigkeitsoberfläche des flüssigen Kupfers aus. Somit geht die Ausbildung des Meniskus insbesondere auch auf die Wechselwirkung zwischen dem Flüssigkeitsspiegel und der Oberfläche des Matrixelementes mit dem aufgebrachten Kupfer zurück. Der Meniskus weist insbesondere oben an der Erstarrungsfront eine konvexe und unten zum Flüssigkeitsspiegel eine konkave Form auf. Insbesondere ist an der Erstarrungsfront die Krümmung des Meniskus maximal und nimmt mit Annäherung an den Flüssigkeitsspiegel ab.A "meniscus" is understood in particular as a curvature on the surface of a liquid. The meniscus forms, in particular, on the liquid surface of the liquid copper in the filled copper crucible due to the passing and / or drawing of the matrix element by the liquid copper and the breakdown of the matrix element by the liquid surface of the liquid copper. Thus, the formation of the meniscus is particularly due to the interaction between the liquid level and the surface of the matrix element with the copper applied. In particular, the meniscus has a convex shape at the top of the solidification front and a concave shape below the liquid level. In particular At the solidification front, the curvature of the meniscus maximally and decreases as it approaches the liquid level.
Ein "freier Meniskus" bedeutet insbesondere, dass der Meniskus selbst sich nicht innerhalb des flüssigen Kupfers im gefüllten Kupfertiegel, sondern weitgehend in der umgebenden Atmosphäre befindet. Der freie Meniskus ist insbesondere nur an seiner unteren Basis im Kontakt zum Flüssigkeitsspiegel des flüssigen Kupfers im gefüllten Kupfertiegel.In particular, a "free meniscus" means that the meniscus itself is not within the liquid copper in the filled copper crucible, but is largely in the surrounding atmosphere. The free meniscus is in particular only at its lower base in contact with the liquid level of the liquid copper in the filled copper crucible.
Der "Flüssigkeitsspiegel" ist insbesondere der Flüssigkeitsstand des flüssigen Kupfers im gefüllten Kupfertiegel. Der Flüssigkeitsspiegel, auch Flüssigkeitsoberfläche genannt, stellt insbesondere die Grenzfläche zwischen dem flüssigen Kupfer und der darüber angeordneten Umgebungsatmosphäre dar.The "liquid level" is in particular the liquid level of the liquid copper in the filled copper crucible. The liquid level, also called liquid surface, in particular represents the interface between the liquid copper and the surrounding atmosphere arranged above it.
Um ein gleichmäßiges Aufbringen des Kupfers auf dem Matrixelement zu realisieren, ist die Öffnung durch das flüssige Kupfer bedeckt.In order to realize a uniform application of the copper on the matrix element, the opening is covered by the liquid copper.
Somit wird das Matrixelement beim Einbringen in die Öffnung des Kupfertiegels direkt und sofort von flüssigem Kupfer umgeben. Des Weiteren kann die Kupferschmelze aufgrund einer Ausnutzung der Oberflächenspannung der Kupferschmelze nicht durch die Öffnung aus dem Kupfertiegel austreten.Thus, the matrix element is directly and immediately surrounded by liquid copper when introduced into the opening of the copper crucible. Further, the copper melt can not leak out of the copper crucible due to utilization of the surface tension of the molten copper.
Neben der Oberflächenspannung wird ein Auslaufen des flüssigen Kupfers aus dem Kupfertiegel auch durch eine geometrische Abstimmung zwischen dem Matrixelement und der Öffnung erreicht.In addition to the surface tension leakage of the liquid copper from the copper crucible is also by a achieved geometric coordination between the matrix element and the opening.
In einer weiteren Gestaltungsform des Verfahrens weist das Matrixelement weitere Filamente und/oder ein Filamentbündel auf.In a further embodiment of the method, the matrix element has further filaments and / or a filament bundle.
Somit kann der Anteil der Filamente und/oder Fasern am MMC-Profil und/oder -Draht erhöht werden. Des Weiteren können insbesondere Multifilamente und vertaute, gedrehte, geflochtene und/oder andersartig verbundene Filamente in einem Filamentbündel verwendet werden. Dadurch kann die Zugfestigkeit und Dauerschwenkfestigkeit erhöht sowie die Dichte und das Gewicht des gefertigten Kupferprofils und/oder Drahtes verringert werden.Thus, the proportion of filaments and / or fibers in the MMC profile and / or wire can be increased. Furthermore, in particular multifilaments and twisted, twisted, braided and / or differently connected filaments can be used in a filament bundle. As a result, the tensile strength and fatigue strength can be increased and the density and weight of the manufactured copper profile and / or wire can be reduced.
Um optimale Eigenschaften des gefertigten Kupferprofils und/oder -drahtes einzustellen, weist das Matrixelement eine anorganische Faser, insbesondere eine Kohlenstofffaser und/oder eine Siliziumcarbidfaser auf.In order to set optimum properties of the manufactured copper profile and / or wire, the matrix element has an inorganic fiber, in particular a carbon fiber and / or a silicon carbide fiber.
Eine "Kohlenstofffaser" (auch "Karbonfaser") ist eine industriell hergestellte Faser aus kohlenstoffhaltigem Ausgangsmaterial, welche durch angepasste chemische Reaktionen in graphitartig angeordneten Kohlenstoff umgewandelt wird.A "carbon fiber" (also called "carbon fiber") is an industrially produced fiber of carbonaceous feedstock which is converted by adapted chemical reactions into graphitic carbon.
Eine "Siliziumcarbidfaser" ist insbesondere eine Faser aus einer zur Gruppe der Carbide gehörenden chemischen Verbindung aus Silizium und Kohlenstoff. Bei einer Siliziumcarbidfaser handelt es sich insbesondere um eine keramische Faser.In particular, a "silicon carbide fiber" is a fiber of a chemical compound of silicon and carbon belonging to the group of carbides. A silicon carbide fiber is in particular a ceramic fiber.
In einer weiteren Gestaltungsform des Verfahrens weist ein Filament oder weisen mehrere Filamente einen Durchmesser zwischen 3pm und 30pm, besonders zwischen 6pm und 20pm, auf.In a further embodiment of the method, a filament or several filaments have a diameter between 3pm and 30pm, especially between 6pm and 20pm.
Folglich weist das Filament oder weisen die Filamente und somit das Matrixelement eine geeignete Geometrie auf, um insbesondere feine MMC-Drähte mit einem finalen maximalen Drahtdurchmesser von ≤ 300pm zu fertigen.Consequently, the filament or filaments, and thus the matrix element, have a suitable geometry, in particular to produce fine MMC wires with a final maximum wire diameter of ≤ 300pm.
Um eine Zunderbildung und/oder ein Verschlacken der flüssigen Kupferschmelze zu verhindern sowie optimale Oberflächeneigenschaften des Kupferprofils und/oder -drahtes zu fertigen, wird das Verfahren unter einer Schutzgasatmosphäre durchgeführt.In order to prevent scale formation and / or slagging of the liquid copper melt and to produce optimum surface properties of the copper profile and / or wire, the process is carried out under a protective gas atmosphere.
Somit kann insbesondere die Luft der umgebenden Atmosphäre und vor allem der Sauerstoff der Luft durch das Schutzgas verdrängt werden.Thus, in particular, the air of the surrounding atmosphere and especially the oxygen of the air can be displaced by the protective gas.
Folglich kann die Qualität des gefertigten Kupferprofils und/oder -drahtes weiter erhöht werden.Consequently, the quality of the finished copper profile and / or wire can be further increased.
In einer weiteren Gestaltungsform des Verfahrens wird eine Dicke des Kupferprofils mittels einer Ziehgeschwindigkeit des Matrixelementes und/oder einer Temperierung, insbesondere einer vertikalen Temperierung, eingestellt.In a further embodiment of the method, a thickness of the copper profile is set by means of a pulling speed of the matrix element and / or a temperature control, in particular a vertical temperature control.
Dadurch wird ein definiertes Abkühlen und Erstarren des aufgebrachten Kupfers auf dem Matrixelement und folglich eine definierte Dicke des Kupferprofils erzielt. Vor allem kann durch die Temperierung ein Erstarrungsprofil in Längsrichtung des Matrixelementes und somit in Ziehrichtung durch die Temperierung unterstützt und/oder gezielt beeinflusst werden.This achieves a defined cooling and solidification of the applied copper on the matrix element and consequently a defined thickness of the copper profile. Above all, by the temperature control, a solidification profile in the longitudinal direction of the matrix element and thus in the drawing direction can be assisted and / or selectively influenced by the temperature control.
Es ist besonders vorteilhaft, dass die Dicke des Kupferprofils über die Ziehgeschwindigkeit und/oder eine Temperaturführung gezielt einstellbar ist.It is particularly advantageous that the thickness of the copper profile can be selectively adjusted via the drawing speed and / or a temperature control.
Um eine sich kontinuierlich ändernde, abgestufte Temperierung entlang der Erstarrungsrichtung und/oder Ziehrichtung zu erzielen, ist es vorteilhaft, wenn die Temperierung vertikal veränderlich ausgestaltet ist. Dadurch kann sowohl die Form und Ausdehnung des Meniskus als auch des Erstarrungsbereiches beeinflusst werden.In order to achieve a continuously changing, graduated temperature control along the solidification direction and / or drawing direction, it is advantageous if the temperature control is designed to be vertically variable. As a result, both the shape and extent of the meniscus and the solidification range can be influenced.
Unter einer "Temperierung" wird insbesondere eine Regelung der Temperatur verstanden. Bei einer Temperierung kann es sich insbesondere um ein Abkühlen und/oder Erwärmen handeln. Die Temperierung kann insbesondere gleichmäßig und/oder veränderlich über die Länge des Matrixelementes mit dem aufgebrachten Kupfer ausgestaltet werden. Unter einer "vertikalen Temperierung" wird insbesondere verstanden, dass die Temperierung vertikal ausgerichtet ist und somit entlang der Längsachse des Matrixelementes und der Erstarrungsrichtung verläuft. Die Temperierung weist insbesondere einzelne Heizelemente und/oder Kühlelemente auf. Die Heizelemente als auch die Kühlelemente können aktiv und/oder passiv ausgestaltet sein. Als "aktive Heizelemente" werden beispielsweise Wärmestrahler auf Basis von Gas oder elektrischer Energie eingesetzt. Eine "passive Temperierung" kann beispielsweise durch Zuleitung von Abwärme erfolgen. Ebenso können die Kühlelemente aktiv oder passiv sein. Als "passives Kühlelement" werden Kühlrippen eingesetzt, welche in räumlicher Nähe zum Matrixelement mit dem aufgebrachten Kupfer angeordnet werden. Als "aktives Kühlelement" kann beispielsweise ein Peltier-Element eingesetzt werden. Auch können zusätzlich Materialien mit bestimmten Wärmeeigenschaften, wie beispielsweise Wärmereflexion oder Wärmeleitung, zur Temperierung eingesetzt werden.A "tempering" is understood in particular to be a regulation of the temperature. A tempering may in particular be a cooling and / or heating. The tempering can in particular be configured evenly and / or variably over the length of the matrix element with the copper applied. A "vertical temperature control" is understood in particular to mean that the temperature control is vertically aligned and thus runs along the longitudinal axis of the matrix element and the solidification direction. The temperature control in particular has individual heating elements and / or cooling elements. The heating elements and the cooling elements can be actively and / or passively configured. For example, heat radiators based on gas or electrical energy are used as "active heating elements". A "passive The "cooling element" can be active or passive, for example, as "passive cooling element" cooling fins are used, which are arranged in spatial proximity to the matrix element with the applied copper In addition, materials with certain thermal properties, such as heat reflection or heat conduction, can also be used for tempering.
In einem weiteren Aspekt wird die Aufgabe gelöst durch ein Kupferprofil, insbesondere einen Kupferdraht, wobei das Kupferprofil mittels eines zuvor beschriebenen Verfahrens hergestellt ist.In a further aspect, the object is achieved by a copper profile, in particular a copper wire, wherein the copper profile is produced by means of a method described above.
Somit wird ein Kupferprofil, insbesondere Kupferdraht, bereitgestellt, welches oder welcher in einem einzigen Herstellungsschritt mittels des erfindungsgemäßen Verfahrens gefertigt wird. Es ist besonders vorteilhaft, dass mit dem erfindungsgemäßen Verfahren ein Kupferprofil hergestellt wird, welches über eine beliebige Länge eine sehr gleichmäßige Kupferumhüllung konstanter Dicke und konstanter Eigenschaften aufweist. Vor allem ist dadurch die Oberfläche des Kupferprofils und/oder -drahtes sehr glatt und frei von Partikeln, wie beispielsweise Zunder. Deshalb kann auf Nachbearbeitungsschritte des gefertigten Kupferprofils und/oder -drahtes verzichtet werden. Insbesondere können dünne Kupferdrähte mit einem Durchmesser kleiner 0,3mm gegenüber dem Stand der Technik in weniger Schritten hergestellt werden.Thus, a copper profile, in particular copper wire, provided, which or which is manufactured in a single manufacturing step by means of the method according to the invention. It is particularly advantageous that a copper profile is produced by the method according to the invention, which has a very uniform copper sheath of constant thickness and constant properties over any length. Above all, this makes the surface of the copper profile and / or wire very smooth and free of particles, such as scale. Therefore, post-processing steps of the finished copper profile and / or wire can be dispensed with. In particular, thin copper wires with a diameter of less than 0.3 mm can be produced in less steps than the prior art.
In einer weiteren Ausführungsform des Kupferprofils ist eine Dicke des Kupferprofils < 0,3mm.In a further embodiment of the copper profile, a thickness of the copper profile is <0.3 mm.
Somit ist in einem einzigen Verfahrensschritt ein Kupferprofil und/oder Kupferdraht aus MMC mit einem Durchmesser von ≤ 0,3mm gefertigt. Folglich werden Feindrähte gefertigt, welche durch andere Herstellungsverfahren, beispielsweise einem Tauverfahren, nicht mit diesen kleinen Drahtdurchmessern und hohen Oberflächenqualität fertigbar sind.Thus, in a single process step, a copper profile and / or copper wire made of MMC with a diameter of ≤ 0.3 mm. Consequently, fine wires are produced which can not be manufactured by other manufacturing methods, for example a thawing method, with these small wire diameters and high surface quality.
Im Weiteren wird die Erfindung anhand eines Ausführungsbeispiels näher erläutert. Es zeigt die einzige
- Figur 1
- eine stark schematische Schnittdarstellung eines Kupfertiegels, bei dem ein Siliziumcarbid-Filament gezogen wird, sodass ein MMC-Draht hergestellt ist.
- FIG. 1
- a highly schematic sectional view of a copper crucible, in which a silicon carbide filament is pulled so that an MMC wire is made.
Ein Schmelztiegel 107 weist bodenseitig eine Öffnung 108 auf. Durch die Öffnung 108 wird ein Siliziumcarbid-Filament 103 mit einem Durchmesser von 15pm vertikal nach oben mittels einer nicht gezeigten unidirektionalen Ab- und Aufspuleinheit geführt. Der Schmelztiegel 107 ist in einem nicht gezeigten Schmelzeofen angeordnet und weist in seinem Inneren eine Kupferschmelze 105 auf. Mittels der unidirektionalen Ab- und Aufspuleinheit wird in Ziehrichtung 111 an dem Siliziumcarbid-Filament 103 gezogen und dieses kontinuierlich durch die Öffnung 108 und die darüber angeordnete Kupferschmelze 105 im Schmelztiegel 107 bewegt.A
Zur Fertigung eines MMC-Drahtes 101 weist die Öffnung 108 ein kreisrundes Profil mit einem Durchmesser von 0,2mm auf. Dies gewährleistet, dass die Kupferschmelze 105 über die Öffnung 108 nicht vertikal nach unten durch die Öffnung 108 austritt. Zudem weist der Bereich um die Öffnung 108 ein Material mit einem abweisenden Benetzungsverhalten auf.To produce a
Beim Austritt des Siliziumcarbid-Filamentes 103 an einer Flüssigkeitsoberfläche der Kupferschmelze 105 in die umgebende Atmosphäre bildet sich ein Meniskus 113 aus schmelzflüssigem Kupfer aus, welches kontinuierlich auf das Siliziumcarbid-Filament 103 aufgebracht wird. Durch das kontinuierliche Ziehen in Ziehrichtung 111 bildet sich eine Erstarrungsfront (Übergang flüssiges zu festes Kupfer) am Übergang des Meniskus 113 zum regulären Querschnitt des MMC-Drahtes 101 aus. Durch ein gezieltes Führen des Meniskus 113 bildet sich ein selbststabilisierender runder Querschnitt des aufgebrachten Kupfers auf dem Siliziumcarbid-Filament 103 aus.Upon discharging the
Durch das gezielte Führen des Meniskus 113 sammeln sich eventuell vorhandene kleinere Partikel, wie Zunder, Tiegelmaterial und ähnliches, an einer unteren Basis des Meniskus 113 zur Kupferschmelze 105, wodurch der Bereich der Erstarrungsfront frei von Partikeln bleibt. Mithin wird eine Oberfläche des gefertigten MMC-Drahtes 101 erzielt, welche sehr gleichmäßig und glatt sowie frei von Partikeln ist.By deliberately guiding the
In Ziehrichtung 111 folgt nach dem Ausbilden des Meniskus 113 eine Nachwärmzone 109, durch welche der MMC-Draht 101 weiter gezogen wird. Die Nachwärmzone 109 weist einzelne Heiz- und Kühlelemente auf, über welche ein entsprechendes Temperaturprofil dem Meniskus und den MMC-Draht 101 aufgeprägt wird. Dadurch wird dem MMC-Draht 101 ein definiertes Erstarrungsprofil aufgeprägt und die Oberflächenqualität weiter verbessert.In the
Der gesamte Herstellungsprozess des MMC-Drahtes 101 erfolgt unter einer Schutzgasatmosphäre, sodass insbesondere kein Sauerstoff in den gefertigten MMC-Draht 101 hineindiffundiert.The entire manufacturing process of the
Über eine Ziehgeschwindigkeit in Ziehrichtung 111 und das eingestellte Temperierungsprofil der Nachwärmzone 109 wird der Durchmesser des gefertigten MMC-Drahtes 101 festgelegt.The diameter of the
Somit wird in einem einzigen Verfahrensschritt ein MMC-Draht 101 kontinuierlich mit sehr hohen Oberflächenqualitäten und einem gleichmäßigen Drahtdurchmesser von 130pm gefertigt, ohne dass anschließend weitere Nachbehandlungsschritte notwendig sind. Folglich wird ein kostengünstiges und schnelles Fertigungsverfahren zum Fertigen von MMC-Draht 101 bereitgestellt.Thus, in a single process step, an
- 101 MMC-Draht (Metall-Matrix-Composit-Draht)101 MMC wire (metal matrix composite wire)
- 103 Siliziumcarbid-Filament103 silicon carbide filament
- 105 Kupferschmelze105 molten copper
- 107 Schmelztiegel107 crucible
- 108 Öffnung108 opening
- 109 Nachwärmzone109 reheating zone
- 111 Ziehrichtung111 pulling direction
- 113 Meniskus113 meniscus
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DE102017124144.2A DE102017124144A1 (en) | 2017-10-17 | 2017-10-17 | Method for producing a copper profile and copper profile |
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DE3638249C2 (en) | 1985-11-12 | 1992-04-09 | Fujikura Ltd., Tokio/Tokyo, Jp | |
WO1996027456A1 (en) | 1995-03-03 | 1996-09-12 | Mccrink Edward J | Stainless steel shafts, assemblies and methods of making same |
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DE10140965A1 (en) * | 2000-08-29 | 2002-03-28 | Yazaki Corp | Pressure impregnation device for producing fiber-reinforced composite wire, has intermediate orifice having concave-shaped end corresponding to convex-shaped end of entrance side orifice |
US20030029902A1 (en) | 2001-07-02 | 2003-02-13 | Northeastern University | Reinforced structural elements incorporating fiber-reinforced metal matrix composite wires and methods of producing the same |
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DE19509691C1 (en) * | 1995-03-08 | 1996-05-09 | Mannesmann Ag | Inverted continuous casting process for thin strip mfr. |
US6344270B1 (en) * | 2000-07-14 | 2002-02-05 | 3M Innovative Properties Company | Metal matrix composite wires, cables, and method |
-
2017
- 2017-10-17 DE DE102017124144.2A patent/DE102017124144A1/en not_active Withdrawn
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Patent Citations (6)
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DE3638249C2 (en) | 1985-11-12 | 1992-04-09 | Fujikura Ltd., Tokio/Tokyo, Jp | |
WO1996027456A1 (en) | 1995-03-03 | 1996-09-12 | Mccrink Edward J | Stainless steel shafts, assemblies and methods of making same |
US5736194A (en) | 1996-11-05 | 1998-04-07 | Federal-Hoffman, Inc. | Method and apparatus for masking |
US5736199A (en) * | 1996-12-05 | 1998-04-07 | Northeastern University | Gating system for continuous pressure infiltration processes |
DE10140965A1 (en) * | 2000-08-29 | 2002-03-28 | Yazaki Corp | Pressure impregnation device for producing fiber-reinforced composite wire, has intermediate orifice having concave-shaped end corresponding to convex-shaped end of entrance side orifice |
US20030029902A1 (en) | 2001-07-02 | 2003-02-13 | Northeastern University | Reinforced structural elements incorporating fiber-reinforced metal matrix composite wires and methods of producing the same |
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