EP3471434A1 - Appareil auditif possédant un module de microphone présentant de meilleures propriétés d'ultrasons - Google Patents

Appareil auditif possédant un module de microphone présentant de meilleures propriétés d'ultrasons Download PDF

Info

Publication number
EP3471434A1
EP3471434A1 EP18158599.3A EP18158599A EP3471434A1 EP 3471434 A1 EP3471434 A1 EP 3471434A1 EP 18158599 A EP18158599 A EP 18158599A EP 3471434 A1 EP3471434 A1 EP 3471434A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
passage
microphone
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18158599.3A
Other languages
German (de)
English (en)
Inventor
Per Pedersen
Gorm Dannesboe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oticon AS
Original Assignee
Oticon AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oticon AS filed Critical Oticon AS
Priority to EP18158599.3A priority Critical patent/EP3471434A1/fr
Publication of EP3471434A1 publication Critical patent/EP3471434A1/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • H04R1/2846—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/48—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception using constructional means for obtaining a desired frequency response
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers

Definitions

  • the present disclosure refers to a microphone module for use in a hearing aid, a hearing aid, and a method for manufacturing the microphone module for use in a hearing aid.
  • a hearing aid is configured to improve or augment the hearing capability of an individual by receiving acoustic signals from the individuals' surroundings, modifying the acoustic signals electronically and providing audible signals to at least one of the individual's ears.
  • Hearing aids generally have a frequency bandwidth capable of supporting the user with speech information and a comfortable sound. This means a bandwidth of at a least 5 kHz in most situations. For the lightest hearing losses the bandwidth should be up to 8-9 KHz and slightly beyond. The optimum would be to have a bandwidth like the normal hearing up to 15 kHz to 20 kHz. All frequencies above 20 kHz should be attenuated as much as possible in order to reduce unwanted side effects. Frequencies above 20 kHz are called ultrasound. Ultrasound impacts the working of a hearing aid in that it can become demodulated or cause clipping or attenuation of the main signal both in the microphone and in an amplifier.
  • first and second chambers as well as first and second pipes formed in a housing of a hearing aid, wherein the first chamber and the first pipe is fluidly connected to form a first conduit leading from a first acoustic inlet to a first transducer, and the second chamber and the second pipe is fluidly connected to form a second conduit leading from a second acoustic inlet to a second transducer.
  • the first and second conduit each form an acoustic resonator with the respective chamber acting primarily as an acoustic compliance and respective pipe acting primarily as an acoustic mass.
  • a cavity provided into an inlet member for a microphone system which also has the function of performing filtering of ultrasound in an incoming sound signal from the environment, so as to reduce unwanted artefacts or sounds, in the ultrasound range, in the signal reaching the microphone, has been investigated.
  • MEMS microelectromechanical system
  • PCB printed circuit board
  • a microphone module for use in a hearing aid which microphone module comprises a printed circuit board, a MEMS microphone mounted on one surface of the printed circuit board, the MEMS microphone comprising an acoustic inlet facing the one surface of the printed circuit board, wherein an aperture is formed in the printed circuit board, which faces the acoustic inlet of the MEMS microphone, an interconnecting element, which is provided opposing the MEMS microphone on the other surface of the printed circuit board, and a passage extending through the interconnecting element, one end thereof facing the aperture in the printed circuit board (in the following also referred to as "PCB").
  • the passage forms an acoustic channel and is configured to be longer than the length of the aperture in the printed circuit board, and at least a part of the passage has a cross-sectional area which is smaller than the area of the aperture in the printed circuit board.
  • an interconnecting element is provided at the PCB on a surface opposing the surface of the PCB to which the MEMS microphone is connected.
  • a passage forming an acoustic channel is formed within the interconnecting element, wherein the passage connects the inlet of the MEMS microphone through an aperture (i.e. an opening, e.g. a through hole) formed in the PCB with the outside of the microphone module and leads acoustic waves from the outside of the microphone module to the acoustic inlet (also denoted the inlet) of the MEMS microphone.
  • the interconnecting element not only acts an interconnect component, but also as an acoustical damping element which is capable of reducing influences caused by ultra sound.
  • the passage has a cross-sectional area which is smaller than the cross-sectional area of the aperture (i.e. area of the opening in the PCB, e.g. a circular area of a through hole), and the length of the passage (i.e. the path from the opening in the PCB opposing the microphone through the interconnect component to the exterior at the opposing end thereof) is longer than the length of the aperture (i.e.
  • the acoustic channel formed by the passage is a large property for the sound path that may add to the sound path significant acoustical resistance and acoustic mass. That is, a longer and narrower passage enables shifting the microphone resonance peak(s) to lower frequencies as well as damping the peak(s).
  • the interconnecting element may be provided centrally with regard to the MEMS microphone on the other surface of the printed circuit board.
  • the passage may be formed by an opening extending through an insert element pressed into the interconnecting element.
  • an insert element through which an opening extends is inserted (e.g. pressed) into the interconnecting element so that the opening connects the inlet of the MEMS microphone through the aperture formed in the PCB with the outside of the microphone module.
  • both an opening in the interconnecting member and the PCB aperture (opening) have preferably a large diameter in order for the dirt to drop out (supported by gravity) rather than falling into the microphone and causing faults.
  • the insert element may be inserted (e.g. pressed) into an opening (e.g. hole) formed through the interconnect element after the solder work and a cleaning process, so as to suppress accumulation of dirt in the microphone module.
  • the insert element may glued onto the interconnect element.
  • the opening may be a round hole formed in the center of the insert element or a polygonal (e.g. rectangular) slit extending through the center of the insert element.
  • a slit may have a high amount of resistance (dampens peaks and high frequencies) and increased inductance (shifts peaks towards lower frequencies).
  • At least a part of the opening extending through the insert element has a diameter in the range of 0.1mm and 0.3mm, and more preferably in the range of 0.1mm and 0.2mm.
  • the microphone module may further comprise an inlet element, wherein a protrusion of the inlet element is accommodated in an opening extending through the center of the interconnecting element with a spacing formed by a gap between the outer circumference of the protrusion and the inner circumference of the opening in the interconnecting element as well as a gap between the top surface of the protrusion and the printed circuit board, wherein the passage is formed by the spacing.
  • the protrusion forces the sound into a tiny gap between the interconnecting element and the inlet element, thereby forming a relatively long path.
  • the aperture may be displaced with respect to the interconnecting element, so as to provide a gap between the interconnecting element and the aperture as part of the passage.
  • the supporting member is formed so as to engage with the interconnecting element on an inner side thereof, and the aperture is displaced with respect to the interconnecting element, so as to provide a gap between the part of the supporting member engaged with the interconnecting element and the aperture as part of the passage.
  • the aperture in the printed circuit board may by a through hole extending through the printed circuit board and having a diameter in the range of 0.2mm to 0.5mm, and/or may have a length of 0.5mm to 1mm.
  • the dimensions of the passage may be set in accordance with preset acoustical damping properties (e.g. a look-up table).
  • the microphone module may further comprise a first mesh which covers the opening of the passage at the side facing the acoustic inlet, and/or a second mesh which covers the opening of the passage at the side facing away from the acoustic inlet.
  • a hearing aid which comprises a casing, at least one microphone module according to previous described aspect, a sound processing means for processing the sound received by the at least one microphone module, and an outputting means for outputting the processed sound.
  • a method for manufacturing a microphone module for a hearing aid comprising mounting a MEMS microphone on one surface of a printed circuit board, wherein an aperture facing the acoustic inlet of the MEMS microphone is formed in the printed circuit board, providing a passage extending through an interconnecting element, installing the interconnecting element at the printed circuit board, such that the interconnecting element centrally opposes the MEMS microphone on the other surface of the printed circuit board and faces the aperture, wherein the passage forms an acoustic channel and is configured to be longer than the length of the aperture in the printed circuit board, and at least a part of the passage has a cross-sectional area which is smaller than the area of the aperture in the printed circuit board.
  • the method may further comprise pressing an insert element into the interconnecting element, wherein the insert element comprises an opening extending through the center thereof, which forms the passage.
  • the method may further comprise accommodating a protrusion of an inlet element in an opening extending through the center of the interconnecting element with a spacing formed by a gap between the outer circumference of the protrusion and the inner circumference of the opening in the interconnecting element as well as a gap between the top surface of the protrusion and the printed circuit board, wherein the passage is formed by the spacing.
  • the dimensions of the passage may be set in accordance with preset acoustical damping properties.
  • the interconnecting element forms an acoustical damping element configured to shift a microphone peak to lower frequencies as well as damping the peak.
  • a hearing device may include a hearing aid that is adapted to improve or augment the hearing capability of a user by receiving an acoustic signal from a user's surroundings, generating a corresponding audio signal, possibly modifying the audio signal and providing the possibly modified audio signal as an audible signal to at least one of the user's ears.
  • the "hearing device” may further refer to a device such as an earphone or a headset adapted to receive an audio signal electronically, possibly modifying the audio signal and providing the possibly modified audio signals as an audible signal to at least one of the user's ears.
  • Such audible signals may be provided in the form of an acoustic signal radiated into the user's outer ear, or an acoustic signal transferred as mechanical vibrations to the user's inner ears through bone structure of the user's head and/or through parts of middle ear of the user or electric signals transferred directly or indirectly to cochlear nerve and/or to auditory cortex of the user.
  • the hearing device is adapted to be worn in any known way. This may include i) arranging a unit of the hearing device behind the ear with a tube leading air-borne acoustic signals into the ear canal or with a receiver/ loudspeaker arranged close to or in the ear canal such as in a Behind-the-Ear type hearing aid, and/ or ii) arranging the hearing device entirely or partly in the pinna and/ or in the ear canal of the user such as in an In-the-Ear type hearing aid or In-the-Canal/ Completely-in-Canal type hearing aid, or iii) arranging a unit of the hearing device attached to a fixture implanted into the skull bone such as in Bone Anchored Hearing Aid or Cochlear Implant, or iv) arranging a unit of the hearing device as an entirely or partly implanted unit such as in Bone Anchored Hearing Aid or Cochlear Implant.
  • a “hearing system” refers to a system comprising one or two hearing devices
  • a “binaural hearing system” refers to a system comprising two hearing devices where the devices are adapted to cooperatively provide audible signals to both of the user's ears.
  • the hearing system or binaural hearing system may further include auxiliary device(s) that communicates with at least one hearing device, the auxiliary device affecting the operation of the hearing devices and/or benefitting from the functioning of the hearing devices.
  • a wired or wireless communication link between the at least one hearing device and the auxiliary device is established that allows for exchanging information (e.g. control and status signals, possibly audio signals) between the at least one hearing device and the auxiliary device.
  • Such auxiliary devices may include at least one of remote controls, remote microphones, audio gateway devices, mobile phones, public-address systems, car audio systems or music players or a combination thereof.
  • the audio gateway is adapted to receive a multitude of audio signals such as from an entertainment device like a TV or a music player, a telephone apparatus like a mobile telephone or a computer, a PC.
  • the audio gateway is further adapted to select and/or combine an appropriate one of the received audio signals (or combination of signals) for transmission to the at least one hearing device.
  • the remote control is adapted to control functionality and operation of the at least one hearing devices.
  • the function of the remote control may be implemented in a Smartphone or other electronic device, the Smartphone/electronic device possibly running an application that controls functionality of the at least one hearing device.
  • a hearing device in general, includes i) an input unit such as a microphone for receiving an acoustic signal from a user's surroundings and providing a corresponding input audio signal, and/or ii) a receiving unit for electronically receiving an input audio signal.
  • the hearing device further includes a signal processing unit for processing the input audio signal and an output unit for providing an audible signal to the user in dependence on the processed audio signal.
  • the input unit may include multiple input microphones, e.g. for providing direction-dependent audio signal processing.
  • Such directional microphone system is adapted to enhance a target acoustic source among a multitude of acoustic sources in the user's environment.
  • the directional system is adapted to detect (such as adaptively detect) from which direction a particular part of the microphone signal originates. This may be achieved by using conventionally known methods.
  • the signal processing unit may include amplifier that is adapted to apply a frequency dependent gain to the input audio signal.
  • the signal processing unit may further be adapted to provide other relevant functionality such as compression, noise reduction, etc.
  • the output unit may include an output transducer such as a loudspeaker/ receiver for providing an air-borne acoustic signal transcutaneously or percutaneously to the skull bone or a vibrator for providing a structure-borne or liquid-borne acoustic signal.
  • the output unit may include one or more output electrodes for providing the electric signals such as in a Cochlear Implant.
  • a microphone has a frequency response that is naturally flat in most of the frequency range for hearing impaired. At higher frequencies a microphone has a peak where the microphone resonates and thus has increased sensitivity in the region of the resonance frequency. This may I induce saturation in the front end of the hearing aid and/or will enter the sound path where the resonation may become audible for the hearing impaired.
  • Fig. 1 shows a comparison of sound pressure level diagrams regarding a MEMS microphone in an example with no filter and with filter.
  • the top end diagram illustrates an output of a MEMS microphone according to the prior art, where no "snout"-construction creating a filter is present in the inlet structure
  • the bottom diagram illustrates a measurement where a "snout construction” creating a filtering effect is provided.
  • the ultrasounds frequencies are "dampened” and shifted.
  • 1 st peak amplitudes are shifted to lower frequency with reduced peak amplitude, show reduced amplitude and reduced level in certain frequency ranges.
  • Fig. 2 is a graph showing the behavior of an electret microphone.
  • the behavior shown for the electret microphone is what is intended to achieve with a MEMS microphone instead.
  • the bottom diagram of Fig. 1 illustrates that a microphone module comprising a snout/inlet construction according to the present disclosure is getting close to having a behavior of the MEMS microphone which corresponds to the electret microphone.
  • these demands may be solved by having a damping element in the PCB formed by providing a plurality of holes (e.g. 7 holes) each of approx. 60-70 ⁇ m diameter.
  • the rest of the acoustic channel (inlet, snout) are of such large dimensions that they are considered not to be the determining parameters.
  • the microphone module comprises a PCB (Printed Circuit Board) 10 being supported by a supporting member 16, such as the housing of the hearing aid or an inlet member 19 provided in the hearing aid, wherein a MEMS (microelectromechanical system) microphone 12 with an acoustic inlet 13 provided on a side of the MEMS facing the PCB 10 is mounted on the PCB 10 (e.g. by soldering).
  • a plurality of holes 21 are formed through the PCB 10, thereby forming an acoustic path with a damping characteristics.
  • an interconnecting element i.e. a snout which functions as an acoustical damping element.
  • a microphone module with an interconnecting element which is provided opposing the MEMS microphone on the other surface of the printed circuit board and comprises a passage extending through the interconnecting element, one end thereof facing the aperture in the printed circuit board, wherein the passage forms an acoustic channel and is configured to be longer than the length of the aperture in the printed circuit board, and at least a part of the passage has a cross-sectional area which is smaller than the area of the aperture in the printed circuit board, an interconnecting element having acoustical damping properties are provided for.
  • the snout hole i.e the hole or passage in the interconnecting element
  • the added length of the hole - compared to the PCB holes - is relevant to adjust and/or modify in view of limiting the ultrasound contribution to the MEMS microphone. Accordingly, it has been realized that a longer and narrower hole of the passage of the interconnecting element shifts the microphone peak(s) to lower frequencies as well as dampening the peak(s).
  • the microphone module comprises a PCB (printed circuit board) 10 being supported by a supporting member 16, such as supported in a part of the housing of the hearing aid or an inlet member 19 provided in the hearing aid, wherein a MEMS (microelectromechanical system) microphone 12 with an acoustic inlet 13 (i.e. an sound inlet) at the side of the microphone 12 facing the PCB 10 is mounted on the PCB 10 (e.g. by soldering).
  • An aperture (opening, such as a through hole) 11 is formed in the PCB at a position centrally opposing the acoustic inlet 13 of the MEMS microphone 12.
  • An interconnecting element 14 also referred to as a snout element
  • a passage 15 is extending through the snout element 14 from the aperture 11 to the exterior on the opposite side of the snout 14, thereby forming an acoustic channel.
  • the passage is configured to be longer than the length of the aperture 11 in the PCB 10 (the length of the opening extending through the PCB 10), and at least a part of the passage 15 has a cross-sectional area which is smaller than the cross-sectional area of the aperture 11 in the PCB.
  • a longer and narrower hole configured as a passage shifts the microphone peak(s) to lower frequencies as well as dampening the peak(s).
  • the second embodiment basically differs from the first embodiment in that an insert element is inserted (e.g. pressed) into the snout element (e.g. in an opening, such as a through hole, formed therein), and the passage constituting an acoustic channel is formed in the insert element.
  • the microphone module comprises a PCB (Printed Circuit Board) 10 being supported by a supporting member 16, such as the housing of the hearing aid or an inlet member 19 provided in the hearing aid, wherein a MEMS (microelectromechanical system) microphone 12 with a acoustic inlet 13 at the side of the MEMS microphone facing the PCB 10 is mounted on the PCB 10 (e.g. by soldering).
  • An aperture (opening, such as a through hole) 11 is formed in the PCB at a position centrally opposing the acoustic inlet 13 of the MEMS microphone 12.
  • An interconnecting element 14 is provided abutting at the PCB 10 on the opposing side of the MEMS microphone 12.
  • An insert element 17 is inserted (e.g. pressed) into the snout element 14.
  • the insert element may have the same length as the snout element, or may be longer or shorter.
  • An opening, which forms the passage 15, is extending through the insert element 17 from the aperture 11 to the exterior on the opposite side of the snout 14 is formed, thereby defining an acoustic channel.
  • the passage is configured to be longer than the length of the aperture 11 in the PCB 10 (the length of the opening extending through the PCB 10), and at least a part of the passage 15 has a cross-sectional area which is smaller than the area of the aperture 11 in the PCB.
  • the opening in the insert element may be a round hole formed in the center thereof.
  • the hole in the insert element can also be realized differently than a round hole, e.g. a polygonal slit (i.e. an opening with a polygonal (e.g. rectangular cross-section) extending through the center of the insert element.
  • at least a part of the opening extending through the insert element has a diameter in the range of 0.1mm and 0.3mm, preferably in the range of 0.1mm to 0.2mm.
  • a slit will have a high amount of resistance (damps peaks and high frequencies) and increased inductance (shifts peaks towards lower frequencies).
  • FIG. 6 an example of an insert element according to the second embodiment is shown.
  • the opening has minimum diameter of 0.2 mm and length of 0.6 mm.
  • the "cone shape" which is made in the PCB as is indicated in Fig. 6 may be beneficial in practice, since the through hole may be made in this way.
  • the hole can be mechanically scaled to other dimensions and give the same intended acoustical damping, by adjusting height and diameter.
  • PCB aperture (hole) dimension length and diameter; cross-sectional area
  • the realization of the snout hole is made by means of an insert, which is pressed into the snout. Due to the flux and solder issues, both the snout hole and the PCB hole need to be having a "large" diameter in order for the dirt to drop out (supported by gravity) rather than falling into the microphone and cause the same fault as caused this change in the beginning.
  • a protrusion of an inlet element (e.g. an inlet member 19 to be placed within the hearing aid) is accommodated in an opening extending through the center of the interconnecting element (snout element) with a spacing formed by a gap between the outer circumference of the protrusion and the inner circumference of the opening in the interconnecting element as well as a gap between the top surface of the protrusion and the PCB, wherein the passage is formed by the spacing.
  • the microphone module comprises a PCB (Printed Circuit Board) 10 being supported by a supporting member 16, such as the housing of the hearing aid or an inlet member 19 provided in the hearing aid, wherein a MEMS (microelectromechanical system) microphone 12 with a acoustic inlet 13 at the side facing the PCB 10 is mounted on the PCB 10 (e.g. by soldering).
  • An aperture (opening, such as a through hole) 11 is formed in the PCT at a position centrally opposing the acoustic inlet 13 of the MEMS microphone 12.
  • An interconnecting element 14 is provided abutting at the PCB 10 on the opposing side of the MEMS microphone 12.
  • a protrusion 18 of the inlet element 17 is accommodated in the opening extending through the snout element 14 with a spacing 15 formed by a gap between the outer circumference of the protrusion and the inner circumference of the opening in the interconnecting element as well as a gap between the top surface of the protrusion and the PCB, wherein the passage is formed by the spacing 15.
  • an inlet element with male extrusion is accommodated into the snout.
  • the idea is that rather than a through hole in the center of the insert element, it is possible to make a part that forces the sound into a tiny gap between the snout and insert element. Same principle like a slit, with an extra-long path. This yields higher resistance and inductance as previously explained.
  • Fig. 8 schematically shows a microphone module according to a fourth embodiment.
  • the microphone module differs from the first embodiment in that the aperture 11 is displaced with respect to the interconnecting element (snout) 14, so as to provide a gap 22 between the snout element 14 and the aperture 11 as part of the passage 15.
  • the 'gap 22' functioning as the ultrasound filter is displaced in relation to the inlet 13 to the microphone.
  • a tiny gap 22 is created through which sound may enter.
  • the ultrasound filtering occurs through this "tiny" gap 22 in combination with the snout having the passage therein.
  • Fig. 9 schematically shows a microphone module according to a fourth embodiment.
  • the microphone module differs from the first embodiment in that the supporting member 16 is formed so as to engage with the interconnecting element (snout) 14 on an inner side thereof, e.g. by clicking, snapping, etc. into the snout 14. Further, the aperture 11 is displaced with respect to the snout 14, so as to provide a gap 22 between the part of the supporting member 16 engaged with the snout 14 and the aperture 11 as part of the passage 15.
  • a first mesh 20a which covers the opening of the passage 15 at the side facing the acoustic inlet 13, and/or a second mesh 20b which covers the opening of the passage 15 at the side facing away from the acoustic inlet 13 may be provided.
  • Such mesh 20a, 20b may also aid in dampening ultrasound, but also ensures that dust, moist or other dirt is prohibited from entering the inlet 13 to the microphone 12.
  • the aperture in the printed circuit board may by a through hole having a diameter in the range of 0.2mm to 0.7mm, and/or may have a length of 0.5mm to 1mm.
  • the dimensions of the passage may be set in accordance with preset acoustical damping properties (e.g. a look-up table).
  • a method for manufacturing a microphone module for a hearing aid as is illustrated in Fig. 11 .
  • Step S71 a MEMS microphone is mounted (e.g. soldered) on one surface of a PCB, wherein an aperture (opening) facing the acoustic inlet of the MEMS microphone is formed in the PCB.
  • step S72 a passage extending through an interconnecting element is provided.
  • the interconnecting element is installed at the PCB, such that the interconnecting element (snout element) opposes the MEMS microphone on the other surface of the PCB and faces the aperture, wherein the passage forms an acoustic channel and is configured to be longer than the length of the aperture in the printed circuit board, and at least a part of the passage has a cross-sectional area which is smaller than the area of the aperture in the PCB.
  • the method may further comprise pressing an insert element into the interconnecting element, wherein the insert element comprises an opening extending through the center thereof, which forms the passage.
  • the method may further comprise accommodating a protrusion of an inlet element in an opening extending through the center of the interconnecting element with a spacing formed by a gap between the outer circumference of the protrusion and the inner circumference of the opening in the interconnecting element as well as a gap between the top surface of the protrusion and the printed circuit board, wherein the passage is formed by the spacing.
  • a hearing aid which comprises a casing 80, at least one microphone module 81, a sound processing means 82 for processing the sound received by the at least one microphone module 81, and an outputting means 83 for outputting the processed sound.
  • the interconnecting element forms an acoustical damping element configured to shift a microphone peak to lower frequencies as well as damping the peak.
  • connection or “coupled” as used herein may include wirelessly connected or coupled.
  • the term “and/or” includes any and all combinations of one or more of the associated listed items. The steps of any disclosed method is not limited to the exact order stated herein, unless expressly stated otherwise.
  • a microphone module for use in a hearing aid comprises a PCB, a MEMS microphone mounted on one surface of the PCB, having an acoustic inlet facing the one surface of the PCB, an opening formed in the PCB, which faces the acoustic inlet of the MEMS microphone, a snout element, which is provided opposing the MEMS microphone on the other surface of the PCB, and a passage extending through the snout element, one end thereof facing the opening in the PCB.
  • the passage forms an acoustic channel and is configured to be longer than the length of the opening in the printed circuit board, and at least a part of the passage has a cross-sectional area which is smaller than the opening area in the PCB.
EP18158599.3A 2018-02-26 2018-02-26 Appareil auditif possédant un module de microphone présentant de meilleures propriétés d'ultrasons Withdrawn EP3471434A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18158599.3A EP3471434A1 (fr) 2018-02-26 2018-02-26 Appareil auditif possédant un module de microphone présentant de meilleures propriétés d'ultrasons

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP18158599.3A EP3471434A1 (fr) 2018-02-26 2018-02-26 Appareil auditif possédant un module de microphone présentant de meilleures propriétés d'ultrasons

Publications (1)

Publication Number Publication Date
EP3471434A1 true EP3471434A1 (fr) 2019-04-17

Family

ID=61283076

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18158599.3A Withdrawn EP3471434A1 (fr) 2018-02-26 2018-02-26 Appareil auditif possédant un module de microphone présentant de meilleures propriétés d'ultrasons

Country Status (1)

Country Link
EP (1) EP3471434A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113542961A (zh) * 2021-07-15 2021-10-22 成都纤声科技有限公司 耳机、电子设备和入耳检测方法
WO2021218307A1 (fr) * 2020-04-29 2021-11-04 维沃移动通信有限公司 Dispositif électronique
RU211347U1 (ru) * 2021-11-16 2022-06-01 Открытое акционерное общество "ИСТОК-АУДИО ИНТЕРНЭШНЛ" Корпус слухового аппарата
CN115515061A (zh) * 2022-11-22 2022-12-23 山东新港电子科技有限公司 一种基于半导体键合工艺实现的超声抑制型硅麦克风

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120177237A1 (en) * 2011-01-10 2012-07-12 Shukla Ashutosh Y Audio port configuration for compact electronic devices
US20130051580A1 (en) * 2011-08-22 2013-02-28 Thomas E. Miller Receiver Acoustic Low Pass Filter
WO2014035571A1 (fr) * 2012-08-30 2014-03-06 Apple Inc. Microphone ayant un maillage acoustique pour protéger vis-à-vis d'un choc acoustique soudain
US20150237431A1 (en) * 2014-02-18 2015-08-20 Apple Inc. Microphone Port With Foreign Material Ingress Protection
US20160234587A1 (en) * 2015-02-05 2016-08-11 Turtle Beach Corporation Ultrasonic filter for microphone

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120177237A1 (en) * 2011-01-10 2012-07-12 Shukla Ashutosh Y Audio port configuration for compact electronic devices
US20130051580A1 (en) * 2011-08-22 2013-02-28 Thomas E. Miller Receiver Acoustic Low Pass Filter
WO2014035571A1 (fr) * 2012-08-30 2014-03-06 Apple Inc. Microphone ayant un maillage acoustique pour protéger vis-à-vis d'un choc acoustique soudain
US20150237431A1 (en) * 2014-02-18 2015-08-20 Apple Inc. Microphone Port With Foreign Material Ingress Protection
US20160234587A1 (en) * 2015-02-05 2016-08-11 Turtle Beach Corporation Ultrasonic filter for microphone

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021218307A1 (fr) * 2020-04-29 2021-11-04 维沃移动通信有限公司 Dispositif électronique
CN113542961A (zh) * 2021-07-15 2021-10-22 成都纤声科技有限公司 耳机、电子设备和入耳检测方法
RU211347U1 (ru) * 2021-11-16 2022-06-01 Открытое акционерное общество "ИСТОК-АУДИО ИНТЕРНЭШНЛ" Корпус слухового аппарата
CN115515061A (zh) * 2022-11-22 2022-12-23 山东新港电子科技有限公司 一种基于半导体键合工艺实现的超声抑制型硅麦克风

Similar Documents

Publication Publication Date Title
US11044565B2 (en) Hearing device with a microphone structure
EP1895811B1 (fr) Plusieurs haut-parleurs avec un tube sonore
EP3637789B1 (fr) Appareil auditif à chambres connectées acoustiquement et son procédé de fonctionnement
EP2405674B1 (fr) Aide auditive avec réduction de l'occlusion
US9106999B2 (en) Noise reducing earphone
US9571941B2 (en) Dynamic driver in hearing instrument
EP2023664A1 (fr) Suppression sonore active dans des dispositifs d'écoute
US10375491B2 (en) Hearing device with a barrier element
EP3471434A1 (fr) Appareil auditif possédant un module de microphone présentant de meilleures propriétés d'ultrasons
WO2007115304A2 (fr) Système transducteur pour moniteur et procédé de fabrication
EP3937508A1 (fr) Écouteur, dispositif auditif et système pour annulation d'occlusion active
EP3952332A1 (fr) Dispositif d'aide auditive pour la réduction d'occlusion et ses composants
EP2733956A2 (fr) Procédés pour récepteur à large bande et module pour dispositif d'aide auditive
JP7375758B2 (ja) 音響出力装置
KR20220140767A (ko) 음향 필터를 사용한 사운드 변환을 위한 장치
WO2024088747A1 (fr) Dispositif d'enregistrement sonore électronique, en particulier instrument auditif
DK180620B1 (en) IN-EAR HEADPHONE DEVICE WITH ACTIVE NOISE REDUCTION
EP3570565B1 (fr) Solution de filtre de cire destinée à un écouteur de prothèse auditive
EP4044623A1 (fr) Dispositif auditif comprenant un évent et une soupape acoustique
EP4231662A1 (fr) Dispositif d'aide auditive avec contrôle actif du bruit

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

17P Request for examination filed

Effective date: 20191017

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20191018