EP3461228A1 - Heater and glow plug equipped with same - Google Patents
Heater and glow plug equipped with same Download PDFInfo
- Publication number
- EP3461228A1 EP3461228A1 EP17799141.1A EP17799141A EP3461228A1 EP 3461228 A1 EP3461228 A1 EP 3461228A1 EP 17799141 A EP17799141 A EP 17799141A EP 3461228 A1 EP3461228 A1 EP 3461228A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating resistor
- ceramic body
- fold
- projection
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 82
- 238000010438 heat treatment Methods 0.000 claims abstract description 79
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 229910052581 Si3N4 Inorganic materials 0.000 description 24
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 24
- 239000000463 material Substances 0.000 description 14
- 238000005219 brazing Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910008814 WSi2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- VQCBHWLJZDBHOS-UHFFFAOYSA-N erbium(III) oxide Inorganic materials O=[Er]O[Er]=O VQCBHWLJZDBHOS-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- FIXNOXLJNSSSLJ-UHFFFAOYSA-N ytterbium(III) oxide Inorganic materials O=[Yb]O[Yb]=O FIXNOXLJNSSSLJ-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/148—Silicon, e.g. silicon carbide, magnesium silicide, heating transistors or diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/027—Heaters specially adapted for glow plug igniters
Definitions
- the present disclosure relates to a heater utilized as, for example, a heater for ignition or flame detection in a combustion-type vehicle-mounted heating device, a heater for ignition for various combustion equipment such as an oil fan heater, a heater for a glow plug of a diesel engine, a heater for various sensors such as an oxygen sensor, a heater for heating measuring equipment, and a glow plug equipped with such a heater.
- Patent Document 1 As a heater, there have been known ceramic heaters such as that described in JP 2007-240080 A (hereinafter referred to as Patent Document 1), for example.
- the ceramic heater described in Patent Document 1 includes a base having a rod shape and made of ceramic, and a heating element embedded in this base.
- the heating element includes a pair of electrically conductive portions each having a rod shape and extending in an axis direction, and has a circular shape when the electrically conductive portions are viewed in a cross section perpendicular to the axis direction.
- a heater of an aspect of the present disclosure includes a ceramic body having a rod shape, and a heating resistor provided in an interior of the ceramic body.
- the heating resistor includes a fold-back portion, and a projection having a wire shape and extending across an entirety of an outer periphery of the fold-back portion in a folding-back direction.
- a heater 1 includes a ceramic body 2, a heating resistor 3 embedded in the ceramic body 2, and leads 4 connected to the heating resistor 3 and drawn to a front surface of the ceramic body 2.
- the ceramic body 2 of the heater 1 is formed into a rod shape having a longitudinal direction, for example.
- the heating resistor 3 and the leads 4 are embedded in this ceramic body 2.
- the ceramic body 2 includes ceramic.
- the ceramic includes ceramic having an electrical insulating property such as oxide ceramic, nitride ceramic, or carbide ceramic.
- the ceramic body 2 may include silicon nitride ceramic. This is because silicon nitride, which serves as a primary component of silicon nitride ceramic, is excellent in terms of strength, toughness, electrical insulating property, and thermal resistance.
- the ceramic body 2 including silicon nitride ceramic is obtained by, for example, mixing from 3 to 12 mass% of rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 , or Er 2 O 3 as a sintering aid, from 0.5 to 3 mass% of Al 2 O 3 , and from 1.5 to 5 mass% of SiO 2 in terms of an amount of SiO 2 contained in the sintered body into silicon nitride, which is the primary component, forming the mixture into a predetermined shape, and subsequently subjecting the mixture to hot press firing at a temperature of from 1650 to 1780°C.
- the length of the ceramic body 2 is set to from 20 to 50 mm, for example, and the diameter of the ceramic body 2 is set to from 3 to 5 mm, for example.
- the ceramic body 2 including silicon nitride ceramic when used, MoSiO 2 , WSi 2 , or the like may be mixed and dispersed into the ceramic body 2.
- a coefficient of thermal expansion of the silicon nitride ceramic serving as a base material can be made approximate to a coefficient of thermal expansion of the heating resistor 3, thus enhancing a durability of the heater 1.
- the heating resistor 3 is provided in an interior of the ceramic body 2.
- the heating resistor 3 is provided on a leading end side (first end side) of the ceramic body 2.
- the heating resistor 3 is a member that generates heat by the flow of electrical current therethrough.
- the heating resistor 3 includes linear portions 32 extending in the longitudinal direction of the ceramic body 2, and a fold-back portion 30 connecting the linear portions 32.
- a heating resistor containing carbide, nitride, silicide or the like of W, Mo, Ti or the like as a primary component can be used as the heating resistor 3.
- tungsten carbide is excellent as the material of the heating resistor 3 among the materials described above.
- the heating resistor 3 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 20 mass% or greater.
- WC is an inorganic electrically conductive material, as a primary component
- the content of silicon nitride to be added to WC may be 20 mass% or greater.
- electrically conductive elements that form the heating resistor 3 have large coefficients of thermal expansion compared to the coefficient of thermal expansion of silicon nitride, and thus the heating resistor 3 is usually in a state where a tensile stress is applied to the heating resistor 3.
- the coefficient of thermal expansion of the heating resistor 3 can be brought close to the coefficient of thermal expansion of the ceramic body 2, and thus stress caused by the difference in coefficients of thermal expansion between a time where a temperature of the heater 1 is elevated and a time where a temperature of the heater 1 is lowered can be alleviated.
- the content of silicon nitride contained in the heating resistor 3 when the content of silicon nitride contained in the heating resistor 3 is 40 mass% or less, a variation of a resistance value of the heating resistor 3 can be reduced. Accordingly, the content of silicon nitride contained in the heating resistor 3 may be from 20 to 40 mass%. Preferably, the content of silicon nitride is from 25 to 35 mass%. Further, as an additive to be added into the heating resistor 3 in the same manner as silicon nitride, from 4 to 12 mass% of boron nitride may be added in place of silicon nitride. A total length of the heating resistor 3 can be set to from 3 to 15 mm, and the cross-sectional area may be set to from 0.15 to 0.8 mm 2 .
- the leads 4 are members for electrically connecting the heating resistor 3 and an external power supply.
- the leads 4 are connected to the heating resistor 3 and drawn to the front surface of the ceramic body 2. Specifically, the leads 4 are bonded to both end portions of the heating resistor 3, one lead 4 is connected to a first end of the heating resistor 3 on one end and led from a side surface near a rear end of the ceramic body 2 on the other end, and the other lead 4 is connected to a second end of the heating resistor 3 on one end and led from the rear end portion of the ceramic body 2 on the other end.
- the leads 4 are formed using the same material as that of the heating resistor 3, for example.
- the leads 4 include WC, for example.
- the leads 4 have a greater cross-sectional area than that of the heating resistor 3, a lower content of the formation materials of the ceramic body 2 than that of the heating resistor 3, and thus a low resistance value per unit length.
- the leads 4 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 15 mass% or greater.
- the coefficient of thermal expansion of the leads 4 can be brought close to the coefficient of thermal expansion of the silicon nitride constituting the ceramic body 2.
- the content of silicon nitride when the content of silicon nitride is 40 mass% or less, a resistance value of the leads 4 decreases and becomes stable. Accordingly, the content of silicon nitride may be from 15 to 40 mass%. Further, the content of silicon nitride may be from 20 to 35 mass%.
- the heater 1 of the present embodiment includes the ceramic body 2 having a rod shape, and the heating resistor 3 provided in the interior of the ceramic body 2, with the heating resistor 3 including the fold-back portion 30 and a projection 31 having a wire shape and extending across an entirety of an outer periphery of the fold-back portion 30 in a folding-back direction.
- the projection 31 projects outward and extends along an entirety of the fold-back portion 30 along the fold-back portion 30.
- the heat can be readily dispersed from the projection 31 having a wire shape to the ceramic body 2.
- This makes it possible to reduce the amount of heat momentarily trapped in the heating resistor 3 and thus reduce the thermal stress between the heating resistor 3 and the ceramic body 2.
- the possibility of the occurrence of cracks in the heating resistor 3 can be reduced.
- a long-term reliability of the heater 1 can be improved.
- the projection 31 may be positioned on an outermost periphery of the fold-back portion 30.
- the heat can be more readily dispersed to the outer peripheral side of the ceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in the heating resistor 3.
- the cross-section shape of the fold-back portion 30 is elliptical.
- the fold-back portion 30 folds back on an imaginary plane.
- the cross-section shape of the fold-back portion 30 has a major axis in the direction perpendicular to the imaginary plane on which the fold-back portion 30 folds back.
- the projection 31 is positioned on an extended line of a minor axis of the elliptical shape.
- the projection 31 has a triangular shape in FIG. 2
- the shape is not limited thereto.
- various shapes can be used.
- the shape may be semicircular or semi-elliptical.
- the length (height) of the projection 31 in the direction of projection can be set to from 5 to 30 ⁇ m, for example.
- a tip of the projection 31 when viewed in a cross section perpendicular to an extending direction of the projection 31 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in the ceramic body 2 caused by a contact portion that comes into contact with the projection 31 can be reduced.
- the heating resistor 3 may include the fold-back portion 30 and the linear portions 32 connected to the fold-back portion 30, with the projection 31 extending to the linear portions 32. In this way, heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2. This makes it possible to further reduce the trapping of heat in the heating resistor 3.
- end portions of the projection 31 are positioned on the linear portions 32 and not on the fold-back portion 30. Because the heat tends to become trapped particularly in the fold-back portion 30, the heating resistor 3 including the fold-back portion 30 may be subjected to a large concentration of thermal stress at the end portions of the projection 31 when the end portions of the projection 31 are positioned in the middle of the fold-back portion 30.
- the end portions of the projection 31 By positioning the end portions of the projection 31 on the linear portions 32 as illustrated in FIG. 4 , it is possible to reduce the possibility of concentration of thermal stress in the end portions of the projection 31.
- the heating resistor 3 may further include a second projection 33 having a wire shape and extending across an entirety of an inner periphery of the fold-back portion 30 in the folding-back direction.
- a second projection 33 having a wire shape and extending across an entirety of an inner periphery of the fold-back portion 30 in the folding-back direction.
- heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2.
- the shape may be semicircular or semi-elliptical.
- the length (height) of the second projection 33 in the direction of projection can be set to from 5 to 30 ⁇ m, for example.
- a tip of the projection 33 when viewed in a cross section perpendicular to an extending direction of the projection 33 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in the ceramic body 2 caused by a contact portion that comes into contact with the second projection 33 can be reduced.
- a glow plug 10 includes the heater 1 described above, and a metal tube 5 having a tubular shape and attached so as to cover a rear end side (second end side) of the heater 1.
- the glow plug 10 further includes an electrode fitting 6 disposed on an inner side of the metal tube 5 and attached to the rear end of the heater 1. According to the glow plug 10, because the heater 1 described above is used, durability is improved.
- the metal tube 5 is a member for holding the ceramic body 2.
- the metal tube 5 is a tubular member, and is attached so as to surround the rear end side of the ceramic body 2. That is, the ceramic body 2 having a rod shape is inserted into the inner side of the metal tube 5 having a tubular shape.
- the metal tube 5 is provided to a side surface on the rear end side of the ceramic body 2, and is electrically connected to the exposed portions of the leads 4.
- the metal tube 5 includes, for example, stainless steel or iron (Fe) - nickel (Ni) - cobalt (Co) alloy.
- the metal tube 5 and the ceramic body 2 are bonded by a brazing material.
- the brazing material is provided so as to surround the rear end side of the ceramic body 2, between the metal tube 5 and the ceramic body 2. With the brazing material provided, the metal tube 5 and the leads 4 are electrically connected.
- a silver (Ag) - copper (Cu) brazing material, a silver brazing material, or a copper brazing material containing glass components in an amount from 5 to 20 mass% or the like can be used as the brazing material.
- the glass components have favorable wettability with the ceramic of the ceramic body 2 and a high friction coefficient, making it possible to improve a bonding strength between the brazing material and the ceramic body 2 or a bonding strength between the brazing material and the metal tube 5.
- the electrode fitting 6 is positioned on the inner side of the metal tube 5, and attached to the rear end of the ceramic body 2 so as to be electrically connected to the leads 4.
- the electrode fitting 6 various forms may be used.
- the electrode fitting 6 is configured by connecting a cap portion attached to the rear end of the ceramic body 2 so as to cover the rear end including the leads 4, and a coil-shaped portion electrically connected to an external connecting electrode, by a wire-shaped portion.
- This electrode fitting 6 is kept separated from an inner peripheral surface of the metal tube 5 so as to not cause a short with the metal tube 5.
- the electrode fitting 6 is a metal wire having a coil-shaped portion provided to alleviate stress in the connection with the external power supply.
- the electrode fitting 6 is electrically connected to the leads 4, and electrically connected to the external power supply. Voltage is applied between the metal tube 5 and the electrode fitting 6 by the external power supply, making it possible to allow electrical current to flow to the heating resistor 3 via the metal tube 5 and the electrode fitting 6.
- the electrode fitting 6 includes, for example, nickel or stainless steel.
- the heater 1 can be formed by, for example, injection molding or the like which uses metal molds having shapes of the heating resistor 3, the leads 4, and the ceramic body 2, respectively, of the configuration described above.
- the heater 1 may include the ceramic body 2 having a rod shape, and the heating resistor 3 provided in the interior of the ceramic body 3, with the heating resistor 3 including the fold-back portion 30 and a stepped portion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 in the folding-back direction.
- the stepped portion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 of the heating resistor 3 in the folding-back direction, the heat can be readily dispersed from the stepped portion 34 having a wire shape to the ceramic body 2.
- the stepped portion 34 may be positioned on the outermost periphery of the fold-back portion 30. In this way, the heat can be more readily dispersed to the outer peripheral side of the ceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in the heating resistor 3.
- the heating resistor 3 may further include a second stepped portion 35 having a wire shape and extending across the entirety of the inner periphery of the fold-back portion 30 in the folding-back direction. In this way, heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2, making it possible to further reduce the trapping of the heat in the heating resistor 3.
- the heating resistor 3 may further include a third projection 36 having a wire shape and extending across the inner periphery and the outer periphery. Note that, in FIG. 8 , the focus is on the third projection 36 and thus the projection 31 or the stepped portion 34 is omitted. With the third projection 36 provided, heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2.
- the third projection 36 extends diagonally in the folding-back direction of the fold-back portion 30.
- the heat can be more readily dispersed to the inner peripheral side and the outer peripheral side across a wider range of the ceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in the heating resistor 3 under rapid temperature rise.
- the third projection 36 may extend diagonally in the folding-back direction, or may extend in a direction perpendicular to the folding-back direction.
- the third projection 36 may be provided across the entire periphery of the fold-back portion 30.
- the third projection 36 may be formed into an annular shape and provided across the entire periphery of the fold-back portion 30.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
Abstract
Description
- The present disclosure relates to a heater utilized as, for example, a heater for ignition or flame detection in a combustion-type vehicle-mounted heating device, a heater for ignition for various combustion equipment such as an oil fan heater, a heater for a glow plug of a diesel engine, a heater for various sensors such as an oxygen sensor, a heater for heating measuring equipment, and a glow plug equipped with such a heater.
- As a heater, there have been known ceramic heaters such as that described in
JP 2007-240080 A Patent Document 1 includes a base having a rod shape and made of ceramic, and a heating element embedded in this base. The heating element includes a pair of electrically conductive portions each having a rod shape and extending in an axis direction, and has a circular shape when the electrically conductive portions are viewed in a cross section perpendicular to the axis direction. - A heater of an aspect of the present disclosure includes a ceramic body having a rod shape, and a heating resistor provided in an interior of the ceramic body. The heating resistor includes a fold-back portion, and a projection having a wire shape and extending across an entirety of an outer periphery of the fold-back portion in a folding-back direction.
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FIG. 1 is a vertical cross-sectional view illustrating an example of a heater. -
FIG. 2 is a horizontal cross-sectional view of the heater illustrated inFIG. 1 taken along line A-A'. -
FIG. 3 is a horizontal cross-sectional view illustrating another example of a heater. -
FIG. 4 is a vertical cross-sectional view illustrating another example of a heater. -
FIG. 5 is a vertical cross-sectional view illustrating another example of a heater. -
FIG. 6 is a vertical cross-sectional view illustrating an example of an embodiment of a glow plug. -
FIG. 7 is a horizontal cross-sectional view illustrating another example of a heater. -
FIG. 8 is a schematic view illustrating a front surface of a heating resistor of a heater of another example. - As illustrated in
FIG. 1 , aheater 1 includes aceramic body 2, aheating resistor 3 embedded in theceramic body 2, and leads 4 connected to theheating resistor 3 and drawn to a front surface of theceramic body 2. - The
ceramic body 2 of theheater 1 is formed into a rod shape having a longitudinal direction, for example. Theheating resistor 3 and theleads 4 are embedded in thisceramic body 2. Here, theceramic body 2 includes ceramic. As a result, it is possible to provide theheater 1 having high reliability under rapid temperature rise. Examples of the ceramic include ceramic having an electrical insulating property such as oxide ceramic, nitride ceramic, or carbide ceramic. Particularly, theceramic body 2 may include silicon nitride ceramic. This is because silicon nitride, which serves as a primary component of silicon nitride ceramic, is excellent in terms of strength, toughness, electrical insulating property, and thermal resistance. Theceramic body 2 including silicon nitride ceramic is obtained by, for example, mixing from 3 to 12 mass% of rare earth element oxide such as Y2O3, Yb2O3, or Er2O3 as a sintering aid, from 0.5 to 3 mass% of Al2O3, and from 1.5 to 5 mass% of SiO2 in terms of an amount of SiO2 contained in the sintered body into silicon nitride, which is the primary component, forming the mixture into a predetermined shape, and subsequently subjecting the mixture to hot press firing at a temperature of from 1650 to 1780°C. The length of theceramic body 2 is set to from 20 to 50 mm, for example, and the diameter of theceramic body 2 is set to from 3 to 5 mm, for example. - Note that, when the
ceramic body 2 including silicon nitride ceramic is used, MoSiO2, WSi2, or the like may be mixed and dispersed into theceramic body 2. In this case, a coefficient of thermal expansion of the silicon nitride ceramic serving as a base material can be made approximate to a coefficient of thermal expansion of theheating resistor 3, thus enhancing a durability of theheater 1. - The
heating resistor 3 is provided in an interior of theceramic body 2. Theheating resistor 3 is provided on a leading end side (first end side) of theceramic body 2. Theheating resistor 3 is a member that generates heat by the flow of electrical current therethrough. Theheating resistor 3 includeslinear portions 32 extending in the longitudinal direction of theceramic body 2, and a fold-back portion 30 connecting thelinear portions 32. As theheating resistor 3, a heating resistor containing carbide, nitride, silicide or the like of W, Mo, Ti or the like as a primary component can be used. When theceramic body 2 includes silicon nitride ceramic, from a viewpoint that a difference in the coefficients of thermal expansion of theheating resistor 3 and theceramic body 2 is small and from a viewpoint that theheating resistor 3 exhibits high thermal resistance, tungsten carbide (WC) is excellent as the material of theheating resistor 3 among the materials described above. - Further, when the
ceramic body 2 includes silicon nitride ceramic, theheating resistor 3 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 20 mass% or greater. For example, in theceramic body 2 including silicon nitride ceramic, electrically conductive elements that form theheating resistor 3 have large coefficients of thermal expansion compared to the coefficient of thermal expansion of silicon nitride, and thus theheating resistor 3 is usually in a state where a tensile stress is applied to theheating resistor 3. In contrast, with the addition of silicon nitride into theheating resistor 3, the coefficient of thermal expansion of theheating resistor 3 can be brought close to the coefficient of thermal expansion of theceramic body 2, and thus stress caused by the difference in coefficients of thermal expansion between a time where a temperature of theheater 1 is elevated and a time where a temperature of theheater 1 is lowered can be alleviated. - Further, when the content of silicon nitride contained in the
heating resistor 3 is 40 mass% or less, a variation of a resistance value of theheating resistor 3 can be reduced. Accordingly, the content of silicon nitride contained in theheating resistor 3 may be from 20 to 40 mass%. Preferably, the content of silicon nitride is from 25 to 35 mass%. Further, as an additive to be added into theheating resistor 3 in the same manner as silicon nitride, from 4 to 12 mass% of boron nitride may be added in place of silicon nitride. A total length of theheating resistor 3 can be set to from 3 to 15 mm, and the cross-sectional area may be set to from 0.15 to 0.8 mm2. - The
leads 4 are members for electrically connecting theheating resistor 3 and an external power supply. Theleads 4 are connected to theheating resistor 3 and drawn to the front surface of theceramic body 2. Specifically, theleads 4 are bonded to both end portions of theheating resistor 3, onelead 4 is connected to a first end of theheating resistor 3 on one end and led from a side surface near a rear end of theceramic body 2 on the other end, and theother lead 4 is connected to a second end of theheating resistor 3 on one end and led from the rear end portion of theceramic body 2 on the other end. - The
leads 4 are formed using the same material as that of theheating resistor 3, for example. Theleads 4 include WC, for example. Theleads 4 have a greater cross-sectional area than that of theheating resistor 3, a lower content of the formation materials of theceramic body 2 than that of theheating resistor 3, and thus a low resistance value per unit length. Further, theleads 4 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 15 mass% or greater. Along with the increase in content of silicon nitride, the coefficient of thermal expansion of theleads 4 can be brought close to the coefficient of thermal expansion of the silicon nitride constituting theceramic body 2. Further, when the content of silicon nitride is 40 mass% or less, a resistance value of theleads 4 decreases and becomes stable. Accordingly, the content of silicon nitride may be from 15 to 40 mass%. Further, the content of silicon nitride may be from 20 to 35 mass%. - Here, the
heater 1 of the present embodiment, as illustrated inFIG. 1 , includes theceramic body 2 having a rod shape, and theheating resistor 3 provided in the interior of theceramic body 2, with theheating resistor 3 including the fold-back portion 30 and aprojection 31 having a wire shape and extending across an entirety of an outer periphery of the fold-back portion 30 in a folding-back direction. Theprojection 31 projects outward and extends along an entirety of the fold-back portion 30 along the fold-back portion 30. In this way, with the provision of theprojection 31 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 of theheating resistor 3 in the folding-back direction, the heat can be readily dispersed from theprojection 31 having a wire shape to theceramic body 2. This makes it possible to reduce the amount of heat momentarily trapped in theheating resistor 3 and thus reduce the thermal stress between theheating resistor 3 and theceramic body 2. Thus, the possibility of the occurrence of cracks in theheating resistor 3 can be reduced. As a result, a long-term reliability of theheater 1 can be improved. - Further, as illustrated in
FIG. 2 , theprojection 31 may be positioned on an outermost periphery of the fold-back portion 30. In this way, the heat can be more readily dispersed to the outer peripheral side of theceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in theheating resistor 3. In theheater 1 illustrated inFIG. 2 , the cross-section shape of the fold-back portion 30 is elliptical. The fold-back portion 30 folds back on an imaginary plane. The cross-section shape of the fold-back portion 30 has a major axis in the direction perpendicular to the imaginary plane on which the fold-back portion 30 folds back. Theprojection 31 is positioned on an extended line of a minor axis of the elliptical shape. - While the
projection 31 has a triangular shape inFIG. 2 , the shape is not limited thereto. For theprojection 31, various shapes can be used. For example, the shape may be semicircular or semi-elliptical. The length (height) of theprojection 31 in the direction of projection can be set to from 5 to 30 µm, for example. - Further, as illustrated in
FIG. 3 , a tip of theprojection 31 when viewed in a cross section perpendicular to an extending direction of theprojection 31 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in theceramic body 2 caused by a contact portion that comes into contact with theprojection 31 can be reduced. - Further, as illustrated in
FIG. 4 , theheating resistor 3 may include the fold-back portion 30 and thelinear portions 32 connected to the fold-back portion 30, with theprojection 31 extending to thelinear portions 32. In this way, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2. This makes it possible to further reduce the trapping of heat in theheating resistor 3. - Further, with the
projection 31 continuously formed from the fold-back portion 30 to thelinear portions 32, end portions of theprojection 31 are positioned on thelinear portions 32 and not on the fold-back portion 30. Because the heat tends to become trapped particularly in the fold-back portion 30, theheating resistor 3 including the fold-back portion 30 may be subjected to a large concentration of thermal stress at the end portions of theprojection 31 when the end portions of theprojection 31 are positioned in the middle of the fold-back portion 30. By positioning the end portions of theprojection 31 on thelinear portions 32 as illustrated inFIG. 4 , it is possible to reduce the possibility of concentration of thermal stress in the end portions of theprojection 31. - Further, as illustrated in
FIG. 5 , theheating resistor 3 may further include asecond projection 33 having a wire shape and extending across an entirety of an inner periphery of the fold-back portion 30 in the folding-back direction. In this way, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2. For thesecond projection 33, various shapes can be used. For example, the shape may be semicircular or semi-elliptical. The length (height) of thesecond projection 33 in the direction of projection can be set to from 5 to 30 µm, for example. Further, a tip of theprojection 33 when viewed in a cross section perpendicular to an extending direction of theprojection 33 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in theceramic body 2 caused by a contact portion that comes into contact with thesecond projection 33 can be reduced. - As illustrated in
FIG. 6 , aglow plug 10 includes theheater 1 described above, and ametal tube 5 having a tubular shape and attached so as to cover a rear end side (second end side) of theheater 1. Theglow plug 10 further includes an electrode fitting 6 disposed on an inner side of themetal tube 5 and attached to the rear end of theheater 1. According to theglow plug 10, because theheater 1 described above is used, durability is improved. - The
metal tube 5 is a member for holding theceramic body 2. Themetal tube 5 is a tubular member, and is attached so as to surround the rear end side of theceramic body 2. That is, theceramic body 2 having a rod shape is inserted into the inner side of themetal tube 5 having a tubular shape. Themetal tube 5 is provided to a side surface on the rear end side of theceramic body 2, and is electrically connected to the exposed portions of theleads 4. Themetal tube 5 includes, for example, stainless steel or iron (Fe) - nickel (Ni) - cobalt (Co) alloy. - The
metal tube 5 and theceramic body 2 are bonded by a brazing material. The brazing material is provided so as to surround the rear end side of theceramic body 2, between themetal tube 5 and theceramic body 2. With the brazing material provided, themetal tube 5 and theleads 4 are electrically connected. - As the brazing material, a silver (Ag) - copper (Cu) brazing material, a silver brazing material, or a copper brazing material containing glass components in an amount from 5 to 20 mass% or the like can be used. The glass components have favorable wettability with the ceramic of the
ceramic body 2 and a high friction coefficient, making it possible to improve a bonding strength between the brazing material and theceramic body 2 or a bonding strength between the brazing material and themetal tube 5. - The electrode fitting 6 is positioned on the inner side of the
metal tube 5, and attached to the rear end of theceramic body 2 so as to be electrically connected to theleads 4. As the electrode fitting 6, various forms may be used. In the example illustrated in FIG. 9, the electrode fitting 6 is configured by connecting a cap portion attached to the rear end of theceramic body 2 so as to cover the rear end including theleads 4, and a coil-shaped portion electrically connected to an external connecting electrode, by a wire-shaped portion. This electrode fitting 6 is kept separated from an inner peripheral surface of themetal tube 5 so as to not cause a short with themetal tube 5. - The electrode fitting 6 is a metal wire having a coil-shaped portion provided to alleviate stress in the connection with the external power supply. The electrode fitting 6 is electrically connected to the
leads 4, and electrically connected to the external power supply. Voltage is applied between themetal tube 5 and the electrode fitting 6 by the external power supply, making it possible to allow electrical current to flow to theheating resistor 3 via themetal tube 5 and the electrode fitting 6. The electrode fitting 6 includes, for example, nickel or stainless steel. Theheater 1 can be formed by, for example, injection molding or the like which uses metal molds having shapes of theheating resistor 3, theleads 4, and theceramic body 2, respectively, of the configuration described above. - Further, as illustrated in
FIG. 7 , theheater 1 may include theceramic body 2 having a rod shape, and theheating resistor 3 provided in the interior of theceramic body 3, with theheating resistor 3 including the fold-back portion 30 and a steppedportion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 in the folding-back direction. In this way, with the provision of the steppedportion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 of theheating resistor 3 in the folding-back direction, the heat can be readily dispersed from the steppedportion 34 having a wire shape to theceramic body 2. This makes it possible to reduce the amount of heat momentarily trapped in theheating resistor 3 and thus reduce the thermal stress between theheating resistor 3 and theceramic body 2. Thus, the possibility of the generation of cracks in theheating resistor 3 can be reduced. As a result, the long-term reliability of theheater 1 can be improved. - Further, as illustrated in
FIG. 7 , the steppedportion 34 may be positioned on the outermost periphery of the fold-back portion 30. In this way, the heat can be more readily dispersed to the outer peripheral side of theceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in theheating resistor 3. - Further, the
heating resistor 3 may further include a second steppedportion 35 having a wire shape and extending across the entirety of the inner periphery of the fold-back portion 30 in the folding-back direction. In this way, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2, making it possible to further reduce the trapping of the heat in theheating resistor 3. - Further, as illustrated in
FIG. 8 , theheating resistor 3 may further include athird projection 36 having a wire shape and extending across the inner periphery and the outer periphery. Note that, inFIG. 8 , the focus is on thethird projection 36 and thus theprojection 31 or the steppedportion 34 is omitted. With thethird projection 36 provided, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2. - In
FIG. 8 , thethird projection 36 extends diagonally in the folding-back direction of the fold-back portion 30. In this way, the heat can be more readily dispersed to the inner peripheral side and the outer peripheral side across a wider range of theceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in theheating resistor 3 under rapid temperature rise. Note that thethird projection 36 may extend diagonally in the folding-back direction, or may extend in a direction perpendicular to the folding-back direction. When extended in a direction perpendicular to the folding-back direction, thethird projection 36 may be provided across the entire periphery of the fold-back portion 30. In other words, thethird projection 36 may be formed into an annular shape and provided across the entire periphery of the fold-back portion 30. -
- 1 Heater
- 2 Ceramic body
- 3 Heating resistor
- 30 Fold-back portion
- 31 Projection
- 32 Linear portion
- 33 Second projection
- 34 Stepped portion
- 35 Second stepped portion
- 36 Third projection
- 4 Lead
- 5 Metal tube
- 6 Electrode fitting
- 10 Glow plug
Claims (10)
- A heater comprising:a ceramic body having a rod shape; anda heating resistor provided in an interior of the ceramic body,whereinthe heating resistor comprises a fold-back portion and a projection having a wire shape and extending across an entirety of an outer periphery of the fold-back portion in a folding-back direction.
- The heater according to claim 1, wherein the projection is positioned on an outermost periphery of the fold-back portion.
- The heater according to claim 1 or 2, wherein a tip of the projection when viewed in a cross section perpendicular to an extending direction of the projection has a smooth curved shape.
- The heater according to any one of claims 1 to 3, wherein
the heating resistor comprises the hold-back portion and a linear portion connected to the fold-back portion, and
the projection extends to the linear portions. - The heater according to any one of claims 1 to 4, wherein the heating resistor further comprises a second projection having a wire shape and extending across an entirety of an inner periphery of the fold-back portion in the folding-back direction.
- A heater comprising:a ceramic body having a rod shape; anda heating resistor provided in an interior of the ceramic body,whereinthe heating resistor comprises a fold-back portion and a stepped portion having a wire shape and extending across an entirety of an outer periphery of the fold-back portion in a folding-back direction.
- The heater according to claim 6, wherein the stepped portion is positioned on an outermost periphery of the fold-back portion.
- The heater according to claim 6 or 7, wherein the heating resistor further comprises a second stepped portion having a wire shape and extending across an entirety of an inner periphery of the fold-back portion in the folding-back direction.
- The heater according to any one of claims 1 to 8, wherein the heating resistor further comprises a third projection having a wire shape and extending across an inner periphery and an outer periphery.
- A glow plug comprising:the heater according to any one of claims 1 to 9 including the heating resistor positioned on a first end side of the ceramic body; anda metal tube attached covering a second end side of the ceramic body.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016098489 | 2016-05-17 | ||
PCT/JP2017/016347 WO2017199711A1 (en) | 2016-05-17 | 2017-04-25 | Heater and glow plug equipped with same |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3461228A1 true EP3461228A1 (en) | 2019-03-27 |
EP3461228A4 EP3461228A4 (en) | 2020-01-01 |
EP3461228B1 EP3461228B1 (en) | 2020-12-30 |
Family
ID=60325023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17799141.1A Active EP3461228B1 (en) | 2016-05-17 | 2017-04-25 | Heater and glow plug equipped with same |
Country Status (3)
Country | Link |
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EP (1) | EP3461228B1 (en) |
JP (1) | JP6725653B2 (en) |
WO (1) | WO2017199711A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8530802B2 (en) * | 2007-03-29 | 2013-09-10 | Kyocera Corporation | Ceramic heater and mold |
JP5279447B2 (en) * | 2008-10-28 | 2013-09-04 | 京セラ株式会社 | Ceramic heater |
WO2011065366A1 (en) * | 2009-11-27 | 2011-06-03 | 京セラ株式会社 | Ceramic heater |
JP2014219107A (en) * | 2011-09-07 | 2014-11-20 | ボッシュ株式会社 | Ceramic heater type glow plug |
JP5795029B2 (en) * | 2013-07-09 | 2015-10-14 | 日本特殊陶業株式会社 | Ceramic heater, glow plug, ceramic heater manufacturing method, and glow plug manufacturing method |
JP6165601B2 (en) * | 2013-11-27 | 2017-07-19 | 日本特殊陶業株式会社 | Ceramic heater and glow plug |
JP6144609B2 (en) * | 2013-11-27 | 2017-06-07 | 日本特殊陶業株式会社 | Ceramic heater and glow plug |
CN107211492B (en) * | 2014-12-25 | 2020-09-04 | 京瓷株式会社 | Heater and glow plug provided with same |
-
2017
- 2017-04-25 EP EP17799141.1A patent/EP3461228B1/en active Active
- 2017-04-25 JP JP2018518188A patent/JP6725653B2/en active Active
- 2017-04-25 WO PCT/JP2017/016347 patent/WO2017199711A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3461228B1 (en) | 2020-12-30 |
EP3461228A4 (en) | 2020-01-01 |
WO2017199711A1 (en) | 2017-11-23 |
JPWO2017199711A1 (en) | 2019-03-07 |
JP6725653B2 (en) | 2020-07-22 |
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