EP3449705A2 - Method and device for applying a cover material - Google Patents
Method and device for applying a cover materialInfo
- Publication number
- EP3449705A2 EP3449705A2 EP17723240.2A EP17723240A EP3449705A2 EP 3449705 A2 EP3449705 A2 EP 3449705A2 EP 17723240 A EP17723240 A EP 17723240A EP 3449705 A2 EP3449705 A2 EP 3449705A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier
- coating material
- unit
- coating
- auxiliary material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0385—Displaced conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0551—Exposure mask directly printed on the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
Definitions
- the invention relates to a method for applying a coating material to selected target areas of a surface of a carrier, wherein the surface of the carrier comprises the target areas to be coated and residual material remaining free of coating material, wherein in a first step on the remaining areas in layers a cover of one or more layers of a layer In a second step, the coating material is applied in the form of a directed against the surface of the carrier particle flow on the target areas and the particle flow exposed areas of the cover with at least partially free of coating material remaining side areas, and in a third step the auxiliary material with the aid of a remaining on the coating material-free side portions of the cover removal means remaining the Be Schweizerungsun Material is removed from the surface, according to the preamble of claim 1.
- the invention further relates to a device for applying a coating material to selected target areas of a surface of a carrier, wherein the surface of the carrier comprises the target areas to be coated as well as remaining coating material-free remaining areas, according to the preamble of claim 12.
- Coating material targeted so be applied to selected areas of a carrier on a support to give the wearer special properties.
- An example is the formation of printed conductors on the carrier by means of the application of an electrically conductive coating material.
- a carrier should be specifically thermally or electrically insulating, semiconducting, optical, haptic or chemical
- coating materials having specific properties are applied in layers to target areas of a carrier by means of suitable inks.
- suitable inks are known in particular under the name 3D printing.
- Conductive inks are based on a dispersion of metallic particles, mostly silver or copper particles, in a solvent-retained, UV-curing, plastic matrix. After the volatilization of the solvent, the plastic matrix with the metallic particles remains as a conductor track. In this case, a sintering method is usually applied, whereby the component is thermally stressed.
- this method has the particular disadvantage that the material shrinkage associated with the volatilization of the solvent can lead to an impairment of the properties of the conductor track thus formed.
- about the above-mentioned conductive inks have only limited Adherence to the carrier, which limits their practical Abat ability. This also shows a fundamental problem of these methods, namely that the targeted application of a coating material about 3D printing process demands on the coating material - for example, in terms of its flowability - provides that can sometimes be difficult to reconcile with the required after the order functional properties of the coating material ,
- a particularly expensive process for producing a conductive surface is that of the molded interconnect devices (MID).
- MID molded interconnect devices
- non-conductive, laser-activatable metal compounds are added as an additive to a thermoplastic material and activated after the injection molding process by means of a laser beam.
- the production of injection-molded synthetic material components with applied printed conductors is achieved by metallising sharp contours on the laser-activated conductive partial surfaces in an electroless copper bath.
- this process is complicated and therefore time consuming and costly.
- known methods hardly or only with great time and cost allow the production of defined three-dimensional structures of a coating material on carrier surfaces, such as the production of printed conductors with three-dimensional gradient geometries.
- the applicability of known methods also has great limitations in terms of component geometry.
- the application of sintering with the associated thermal stresses and shrinkage of material can be avoided and the liability of the coating material can be improved on the carrier.
- Claim 1 relates to a method for applying a coating material to selected target areas of a surface of a carrier, wherein the surface of the carrier comprises the target areas to be coated and residual material remaining free of coating material, wherein in a first step on the remaining areas in layers a cover of one or more layers In a second step, the coating material in the form of a directed against the surface of the carrier particle flow on the target areas and the particle flow exposed areas of the cover is applied with at least partially free of coating material remaining side areas, and in a third step of the auxiliary material by means of a remaining on the coating material-free side portions of the cover removal means while retaining the Beschi material is removed from the surface.
- the invention proposes that in the first step on the selected target areas of the surface of the carrier at least partially a support structure is built up on the support of one or more layers of a carrier material, wherein in the third step, the auxiliary material using the removal means with the whereabouts of the coating material and Carrier material is removed from the surface.
- auxiliary material on the remaining areas and a carrier material at least partially to the target areas.
- the auxiliary material is used to create a cover on the non-coated residual areas, which also serves as a mask referred to as.
- the auxiliary material can therefore be chosen in terms of its properties so that it is optimized with regard to the order and its subsequent removal, but not with regard to the desired properties of the coating to be achieved.
- methods are available that can be optimized in terms of the desired properties of the coating, such as with respect to the liability of the structure produced on the support.
- auxiliary material Different possibilities for the application of an auxiliary material will be explained below.
- the application takes place in the form of a layered structure which has downwardly inclined side regions to the target regions which remain free of auxiliary material.
- a three-dimensional structure of the cover is made of an auxiliary material from the descriptive 3D computer data in an adding manner of a plurality of formed and adherent layers.
- These layers are sometimes referred to as cross-sections, layers of structure, object layers, or simply layers in the relevant 3D printing technology.
- Each layer represents a cross-section of the desired three-dimensional structure of the cover.
- the coating material is applied in the form of a directed against the surface of the carrier particle flow on the target areas and the particle flow exposed areas of the cover with at least partially free of coating material remaining side areas.
- This particle stream contains the coating material and is directed over a large area on the surface of the carrier, so without selective deposition on the target areas.
- the particle stream naturally has a main flow direction, so that the deposition of the coating material takes place primarily on the target areas and the areas of the cover exposed to the particle flow. Due to the sloping side regions of the cover, however, side regions of the cover will remain at least partially free of coating material, namely those which are remote from the particle flow or at least not directly exposed to it.
- One possibility is, for example, to produce the cover with side areas sloping perpendicular to the surface of the carrier and to direct the particle flow perpendicular to the surface of the carrier against the carrier.
- the coating material-free remaining side areas of the cover are utilized in a third step to remove the auxiliary material from the surface while leaving the coating material with the aid of a removal means which remains free of coating material from these side areas.
- the removal agent can use a chemical process, such as in the form of a solvent for the auxiliary material, a physical process, such as in the form of an abrasive laser beam, or a mechanical operation by milling or merely detachment of the cover from the carrier.
- the interconnects can also have three-dimensional courses
- a support structure on the support of one or more layers of a carrier material is constructed, wherein in the third step the auxiliary material is removed from the surface by means of the removal means while leaving the coating material and the carrier material. Since the support structure remains after the removal of the auxiliary material on the surface of the carrier, it allows the Formation of support structures for the subsequently applied coating material and thus the realization of three-dimensional courses of the
- Coating material which can also stand out from the surface of the carrier.
- the inventive method allows the production of surfaces or webs with 10 pm to several centimeters, but usually 10-100 pm width and 10-100 pm distance.
- the carrier be constructed from a plurality of layers of the carrier material, preferably by means of an inkjet method, as will be described in more detail below.
- the layered structure of the carrier allows the production of almost any shape shaped carrier high complexity.
- the carrier itself may have been prepared by subtractive or additive methods.
- a large number of different 3D printing methods are available.
- the application of the carrier material can be done about an ink-jet printing.
- in order to form a layer of the carrier and / or the support structure of the carrier material for example in the form of a UV-curing ink system is applied dropwise and cured by UV irradiation.
- UV-curing ink system is applied dropwise and cured by UV irradiation.
- These ink systems are usually solvent-based acrylates with an electrically insulating character.
- the next layer of the carrier material is applied to the previously formed layer and again cured. This process is repeated until a carrier or a supporting structure has been built up from several layers of the carrier material.
- a first layer of the carrier material is built up on the carrier, and then a first layer of the auxiliary material is applied, this process is repeated in the first step for the construction of multiple layers of carrier material and auxiliary material.
- the cover is constructed using a PolyJet method.
- the inkjet technology is also used, wherein one or more printhead or printheads small droplets of the flowable auxiliary material are delivered, which impinge on the previously created layer and solidify. So the cover is built in layers.
- Possible materials for such an auxiliary material include thermoplastics, soluble polymer systems such as the SUP706, or low adhesion materials to the support such as silicones or fluorinated ink systems.
- a light-curing plastic for example acrylic, epoxy or
- Vinylesterharz is cured by a laser in thin layers. This process takes place in a bath which is filled with the basic monomers of the photosensitive plastic. After each step, the carrier is lowered into the liquid by the amount of layer thickness. The liquid plastic above the carrier is distributed evenly as a result. Thereafter, a laser sweeps over the remaining areas on the new layer that is to be cured. After curing, the process can be repeated so that the cover is built up in layers.
- the particle flow is formed by means of an atmospheric plasma.
- a plasma jet Under an atmospheric plasma jet is a plasma jet with an ambient pressure which is in the order of the atmospheric pressure.
- a working gas usually air, nitrogen or a noble gas, is passed through a channel in which high voltage electrical discharge in the form of a corona discharge and / or arc discharge is generated, which ionizes the working gas and a plasma jet in the channel forms.
- the coating material can be supplied to the plasma jet in order to coat the carrier accordingly, to which the plasma jet mixed with the coating material is directed.
- powdered coating materials in the form of metal compounds or thermoplastics are known, which are supplied to the plasma jet via a powder conveyor usually by means of a carrier gas, melt in the plasma jet and accelerated in the molten or doughy state by the volume expansion of the plasma jet and deposited on the carrier to be coated ,
- the layer thicknesses range from the single-digit micrometer range to the millimeter range.
- Known applications include the production of highly wear-resistant layers based on tungsten carbide.
- liquid coating materials are known which are supplied in liquid form to the plasma jet and are also referred to as "precursors." Such a plasma jet is suitable for providing the particle stream of the invention
- Coating material since the coating material can be targeted in this way on the surface of the carrier and in particular the functional properties of the coating can be made homogeneous and controllable.
- a further advantage of the use of an atmospheric plasma process is that the adhesion of, for example, conductor tracks on the carrier, which consists for example of polymers, is decisively increased and no material shrinkage occurs due to the omission of conventional solvent-containing conductive ink systems Evaporation of the solvent occurs. Due to the good adhesion to different plastics and the low conductor track height, these webs are also flexible and advantageous for the production of flexible electronics.
- the particle stream could also be formed using a sputtering process or an aerosol spray.
- the particle flow could also be formed by means of a Physical Vapor Deposition (PVD).
- PVD Physical Vapor Deposition
- the particle flow has a main flow direction, so that the deposition of the coating material takes place primarily on the target areas and the areas of the cover exposed to the particle flow. Due to the sloping side regions of the cover, however, side regions of the cover will remain at least partially free of coating material, namely those which are remote from the particle flow or at least not directly exposed to it.
- One possibility is, for example, to produce the cover with side areas sloping perpendicular to the surface of the carrier and to direct the particle flow perpendicular to the surface of the carrier against the carrier. If the side areas are not or not exclusively perpendicular to the surface of the carrier, it may be advantageous if the main current direction of the particle flow is not perpendicular to the surface of the carrier. Therefore, it is preferably proposed that the flow direction of the particle flow is variable relative to the surface.
- the coating material is an electrically conductive material.
- the auxiliary material must be removed from the carrier in the third process step.
- the removal agent is a solvent for the auxiliary material, and the auxiliary material is soluble to the removal agent.
- the release of the auxiliary material can be done by means of polar or non-polar removal agent. But also the use of optical methods such as laser, IR or UV radiation, mechanical methods such as removing the masking serving as cover using appropriately matched surface energies of the carrier and the auxiliary material (silicones, acrylates, waxes, etc.) or thermal Methods are conceivable for removing the cover.
- the invention further relates to a device for applying a coating material to selected target areas of a surface of a carrier, wherein the surface of the carrier comprises the target areas to be coated and residual material areas remaining free of coating material.
- a printer unit is provided for a flowable and curable carrier material for producing a carrier or a supporting structure on the carrier, a masking unit is provided for the layered construction of a cover of several layers of an auxiliary material on the remaining areas, a coating unit for forming a against the surface of the wearer directed and the
- Particle stream containing coating material as well as a removal unit for the removal of the auxiliary material while retaining the carrier material and the
- Coating material wherein a transport unit for the transport of the carrier from the printer unit to the masking unit, the coating unit and the removal unit is provided.
- the masking unit, the coating unit and the removal unit are used to carry out the above-described method steps of masking using an auxiliary material, the coating with a
- the printer unit serves to produce a carrier and / or to produce supporting structures on the produced or provided carrier.
- the additional printer unit initially allows the production of almost arbitrarily shaped carrier high complexity.
- the support structure allows the realization of three-dimensional gradients of the coating material, which can also stand out from the surface of the carrier. Since the support structure according to the invention remains after the removal of the auxiliary material on the surface of the carrier, namely, it allows the formation of support structures for the subsequently applied coating material.
- the removal unit preferably comprises means for applying a solvent for the auxiliary material.
- the coating unit is preferably a plasma apparatus for generating an atmospheric plasma containing the coating material and for applying the coating material to the support.
- FIG. 1 is a schematic representation of an embodiment of a device according to the invention
- Fig. 2a-d is a schematic representation of
- Fig. 3a-c is a schematic representation of
- a support structure for the realization of three-dimensionally extending surfaces or webs of the coating material.
- the invention will be explained below with reference to the production of printed conductors 14 on a carrier 6 (see FIG. 2), which is also referred to as a substrate in semiconductor technology.
- an electrically conductive coating material 13 is to be applied to predefined target areas of the carrier 6, the target areas and the residual areas remaining free of coating material being in the form of two-dimensional or three-dimensional computer data representing the course of the target and remaining areas. These data are in one
- Data processing unit 1 such as a CAD / CAM system before (Fig. 1).
- a control unit 2 subsequently controls on the basis of the computer data a masking unit 4, an upstream printer unit 3, and a coating unit 5.
- the carrier 6 is mounted on a holder 7 on a transport unit 8, or is produced on the holder 7.
- the transport unit 8 moves the carrier 6 from the printer unit 3 to the masking unit 4 and to the coating unit 5, as well as to a removal unit 15.
- Coating unit 5 and the removal unit 15 move relative to the carrier 6.
- the data processing unit 1 first creates a data set for the production of a carrier 6 and / or a support structure 16 of a carrier material, as well as a data set for the production of a cover 12 of an auxiliary material 9, respectively in an adding manner of a plurality of formed and adherent layers S.
- the application of the carrier material is carried out in the illustrated embodiment via an inkjet printing.
- the carrier material is applied dropwise to the holder 7 or the provided carrier 6, for example in the form of a UV-curing ink system, and cured by means of UV irradiation.
- ink systems are usually solvent-based acrylates with an electrically insulating character.
- the next layer S of the carrier material is applied to the previously formed layer S and again cured. This process is repeated until a carrier 6 or a support structure 16 has been constructed from several layers S of the carrier material.
- Fig. 2a is intended to illustrate that a carrier 6 has been constructed in this way
- Fig. 3a is intended to illustrate that a support structure 16 has been constructed in this way.
- the order of the carrier material via corresponding printheads of the printer unit 3, which are controlled by the control unit 2 based on the data set for the preparation of the carrier 6 or the support structure 16.
- auxiliary material 9 is made on the remaining areas of the carrier 6 by means of an auxiliary material 9.
- the application of the auxiliary material 9 is also made in the embodiment shown via an inkjet printing using the masking unit 4.
- a melt-compatible auxiliary material usually a plastic or wax material, applied in a flowable state by means of at least one controllable over the surface of the carrier 6 nozzle head in the flowable state on the remaining regions of the carrier 6.
- the flowable auxiliary material 9 becomes solid after the application and can serve as the basis for the application of a further layer S of the auxiliary material 9.
- Possible materials for such an auxiliary material 9 are, for example, thermoplastics or materials with low adhesion to the support 6, such as silicones or fluorinated ink systems.
- the auxiliary material 9 is, in particular, a material which is soluble relative to a removal agent 11, for example a ULTEM® 1010 resin. After solidification of a layer S, the next layer S of the auxiliary material 9 is applied to the previously formed layer S and again solidified. This process is repeated until a cover 12 of several layers S of the auxiliary material 9 has been built up on the remaining regions of the carrier 6 (FIG. 2 b, FIG. 3a). The order of the auxiliary material 9 via corresponding nozzles of the masking unit 4, which are controlled by the control unit 2 on the basis of the record for the creation of the cover 12. The thus constructed cover 12 allows, for example, tracks 14 with 10-100 pm width and 10-100 pm distance.
- coating material 13 for example, powdery coating materials 13 in the form of electrically conductive metal compounds or thermoplastics are known, which are supplied to the plasma jet via a powder conveyor usually by means of a carrier gas, melt in the plasma jet and accelerated in the molten or doughy state by the volume expansion of the plasma jet and on the coating carrier 6 are deposited.
- the layer thicknesses in this case move from the single-digit micrometer range up to the millimeter range, but in any case are smaller than the thickness of the cover 12.
- the coating material 13 is applied both in the target and in the remaining regions (FIG. 2c).
- the auxiliary material 9 must be removed from the carrier 6.
- the removal of the auxiliary material 9 takes place by means of a removal means 11, which is applied by a removal unit 15.
- the removal agent 11 is a solvent for the auxiliary material 9
- the auxiliary material 9 is soluble in relation to the removal agent 11.
- the dissolving of the auxiliary material 9 can take place by means of polar or non-polar removal means 11.
- a first layer Sl of a carrier material for the construction of a support structure 16 by means of the printer unit 3 is first constructed on the support 6. Thereafter, a first layer S1 of an auxiliary material is applied for the construction of a cover 12 with the aid of the masking unit 4, after the component has been moved by means of the transport unit 8 from the printer unit 3 to the masking unit 4 (FIG. 3a).
- this process can be repeated by moving the component by means of the transport unit 8 from the masking unit 4 back to the printer unit 3 and applying a second layer S2 of a carrier material for the construction of the support structure 16 by means of the printer unit 3 on the first layer Sl. Subsequently, the component can be moved by means of the transport unit 8 from the printer unit 3 again to the masking unit 4 to apply a second layer S2 of the auxiliary material for the construction of the cover 12 by means of the masking unit 4 (FIG. 3a).
- the component is then moved by means of the transport unit 8 from the masking unit 4 to the coating unit 5, where the carrier 6 is exposed to a particle flow 10 of the coating material 13 (FIG. 3b).
- the main direction of flow of the particle stream 10 is directed perpendicular to the surface of the carrier 6 against the carrier 6, so that the coating material 13 is primarily oriented parallel to the surface of the carrier 6 Surface of the support structure 16 and the cover 12 deposits, but not on the side portions 17 of the cover 12th
- the auxiliary material 9 is finally removed from the carrier 6.
- the component is moved by means of the transport unit 8 from the coating unit 5 to the removal unit 15, where the removal means 11 is applied.
- the removal agent 11 is a solvent for the auxiliary material 9, and for the auxiliary material 9 to be soluble in relation to the removal agent 11.
- the release of the auxiliary material 9 can also be effected by means of optical methods, such as e.g. Laser, IR or UV radiation, mechanical methods such as e.g. Removing the masking serving as cover 12 using appropriately matched surface energies of the support 6 and the auxiliary material 9 (silicones, acrylates, waxes, etc.) or thermal process can be made.
- the support structure 16 remains on the surface of the support 6 after the removal of the auxiliary material 9, it thus allows the formation of support structures for the subsequently applied coating material 13 and the
- Coating material 13 which can also stand out from the surface of the carrier 6 (Fig. 3c).
- the advantage of the present invention lies in particular in the low production costs compared to conventional methods due to the avoidance of expensive process steps and high material costs. It is also advantageous that higher electrical conductivities of the printed conductors 14 can be achieved, and these can be set according to the material selection, process parameters and the product design.
- the advantage of using an atmospheric plasma process lies in particular in an improvement in the adhesion of the printed conductors 14 on the carrier 6 and by the Prevention of shrinkage, which inevitably occurs in solvent-containing conductive ink system. Due to the high adhesion to different plastics and the low interconnect height, these interconnects 14 are particularly flexible and therefore also suitable for the production of flexible electronics.
- a further advantage is that due to the use of additive manufacturing techniques, the present invention allows the user a flexible design of the tracks 14.
- This printed circuit board 14 can be constructed two- or three-dimensional and thus significantly reduce material and space consumption of the finished products.
- the present invention also allows for the application of electrically conductive traces 14 to complex structures.
- the combination of the printing process with masking, electroconductive material coating and mask removal can be further accomplished in a single device.
- the surfaces of the carrier 6 can be coated with different materials and patterns, which have advantages over previous printed surfaces, such as increased protection against UV radiation and incompatibilities, improved thermal and electrical conductivity or material resistance and optical properties.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA50385/2016A AT518578B1 (en) | 2016-04-29 | 2016-04-29 | Method and device for applying a coating material |
PCT/AT2017/060110 WO2017185119A2 (en) | 2016-04-29 | 2017-04-27 | Method and device for applying a cover material |
Publications (1)
Publication Number | Publication Date |
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EP3449705A2 true EP3449705A2 (en) | 2019-03-06 |
Family
ID=58707257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP17723240.2A Withdrawn EP3449705A2 (en) | 2016-04-29 | 2017-04-27 | Method and device for applying a cover material |
Country Status (3)
Country | Link |
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EP (1) | EP3449705A2 (en) |
AT (1) | AT518578B1 (en) |
WO (1) | WO2017185119A2 (en) |
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DE102021107711A1 (en) | 2021-03-26 | 2022-09-29 | Gottfried Wilhelm Leibniz Universität Hannover, Körperschaft des öffentlichen Rechts | Electrical component and method for its manufacture |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US6080606A (en) * | 1996-03-26 | 2000-06-27 | The Trustees Of Princeton University | Electrophotographic patterning of thin film circuits |
US7261920B2 (en) * | 2002-04-24 | 2007-08-28 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
US20060160373A1 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Processes for planarizing substrates and encapsulating printable electronic features |
US8765226B2 (en) * | 2007-12-13 | 2014-07-01 | Palo Alto Research Center Incorporated | Method for patterning using phase-change material |
US20100260940A1 (en) * | 2009-04-08 | 2010-10-14 | Mccown James Charles | System and method for depositing metallic coatings on substrates using removable masking materials |
US20150201499A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Device, system, and method of three-dimensional printing |
-
2016
- 2016-04-29 AT ATA50385/2016A patent/AT518578B1/en active
-
2017
- 2017-04-27 WO PCT/AT2017/060110 patent/WO2017185119A2/en active Application Filing
- 2017-04-27 EP EP17723240.2A patent/EP3449705A2/en not_active Withdrawn
Also Published As
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WO2017185119A2 (en) | 2017-11-02 |
AT518578A1 (en) | 2017-11-15 |
WO2017185119A3 (en) | 2018-01-18 |
AT518578B1 (en) | 2018-09-15 |
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