EP3421200B1 - Plaque de matière dérivée du bois avec des sphères creuses - Google Patents

Plaque de matière dérivée du bois avec des sphères creuses Download PDF

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Publication number
EP3421200B1
EP3421200B1 EP17179148.6A EP17179148A EP3421200B1 EP 3421200 B1 EP3421200 B1 EP 3421200B1 EP 17179148 A EP17179148 A EP 17179148A EP 3421200 B1 EP3421200 B1 EP 3421200B1
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EP
European Patent Office
Prior art keywords
hollow glass
wood board
composite wood
binder
chips
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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EP17179148.6A
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German (de)
English (en)
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EP3421200A1 (fr
Inventor
Roger Braun
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Swiss Krono Tec AG
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Swiss Krono Tec AG
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Priority to PL17179148T priority Critical patent/PL3421200T3/pl
Priority to EP17179148.6A priority patent/EP3421200B1/fr
Publication of EP3421200A1 publication Critical patent/EP3421200A1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material

Definitions

  • the invention relates to a wood-based panel with hollow spheres and a method for producing such wood-based panels with hollow spheres.
  • plate-shaped materials are required which hardly swell when exposed to moisture and are therefore only subject to a slight change in shape when the moisture rises.
  • these plate-shaped materials should have the lowest possible thermal conductivity so that they bring about the best possible thermal insulation.
  • good mechanical properties are required so that these plate-shaped materials can be used as cladding in the frame construction.
  • gypsum plasterboard has been used for such applications, ie plasterboard covered with a cardboard. These gypsum plasterboards have low swelling and low thermal conductivity. However, they have only limited mechanical properties and a relatively high weight. Such a plasterboard is in the DE-AS 1 276 314 described.
  • the US 2005/0019548 A1 which discloses the preamble of claim 1, describes an OSB board for building and the US 2011/0073253
  • A1 describes an HDF or an MDF board.
  • the object is achieved with a wood-based panel according to claim 1 and a method for producing such a wood-based panel according to claim 11.
  • a wood material board according to the invention consists of lignocellulosic n n chips or fibers, a binder and also em Hollow glass balls.
  • the wood-based panel has lignocellulosic particles, in particular chips or fibers.
  • the chips are larger than the fibers; they are usually flat, with the length and width typically being much larger than the thickness. Typical dimensions range from 5 mm to 200 mm in length, from 0.5 mm to 100 mm in width and from 0.1 to 5 mm in thickness. Chips have a higher bending elasticity than fibers.
  • a fiber usually has approximately the same width and thickness; the length is much greater than the width or thickness. Typical dimensions range from 0.5 to 10 mm in length, the width and thickness are 0.1 mm to 3 mm.
  • a simple version of chipboard can be made in one layer.
  • the chips of a chipboard are typically arranged in different layers, a middle layer with chips that are usually thicker, often longer and wider than the chips of a cover layer that flanks the middle layer and covers it from the outside.
  • a typical structure of a particle board has an inner middle layer and two outer cover layers.
  • a fiberboard can also be made up of a middle and top layer, but it can also be made up of one layer of fibers of the same size over the entire thickness.
  • all wood-based panels made from chips and / or fibers are part of the invention, that is to say chipboard, oriented beach board panels, chipboard with a top layer of fiberboard or with a coating of a fiberboard, low-density fiberboard, e.g. B. fiber insulation boards, medium density fiber boards (MDF boards), high density fiber boards (HDF boards), coated and uncoated chipboard and / or fiber boards.
  • chipboard oriented beach board panels
  • chipboard with a top layer of fiberboard or with a coating of a fiberboard, low-density fiberboard e.g. B. fiber insulation boards, medium density fiber boards (MDF boards), high density fiber boards (HDF boards), coated and uncoated chipboard and / or fiber boards.
  • MDF boards medium density fiber boards
  • HDF boards high density fiber boards
  • the wood-based panel has an organic or an inorganic binder or a mixture of these binders.
  • Typical organic binders are aminoplast, thermoset and / or thermoplastic synthetic resins and mixtures thereof.
  • Typical synthetic resins that can be used as binders in wood-based panels are urea or melamine resin, phenolic resin, usually in combination with formaldehyde, resorcinol resin, epoxy resin, polyvinyl acetate (PVAc), possibly in combination with copolymers, polyurethane, polymeric diphenylmethane diisocyanate (EMDI) or polymeric Diphenylmethane diisocyanate (PMDI).
  • Typical inorganic binders are silanes or silicates, e.g.
  • binders mentioned above can be used individually or in a mixture. Typical combinations in which the binders are mixed before being added to the chips or fibers are urea-formaldehyde, melamine-formaldehyde, phenol-formaldehyde, urea-phenol-formaldehyde, melamine-phenol-formaldehyde, urea-melamine-phenol-formaldehyde or the mixture of a silane with a silicate.
  • different binders can be used in different layers of a wood-based panel, e.g. B. PMDI in the middle layer and urea, melamine and / or phenolic resins, possibly in combination with formaldehyde in the outer layers.
  • the binder can be used in liquid form. However, it can also be used, at least in part, in powder or dust form, the powder or dust particles having a diameter of 1 ⁇ m to 20 ⁇ m, preferably as small particles from 1 ⁇ m to 5 ⁇ m or as larger particles from 7 ⁇ m to 15 ⁇ m will.
  • Powdery or dusty binder is preferably made from thermoplastic synthetic resins. Are available e.g. B. melamine resin dust or PVAc powder, which is also known as white glue powder. Dust or powdered binder is preferably used in conjunction with liquid binder, powder or dust and liquid either being a combination of different binders or consisting of the same substance, only in a different state of aggregation.
  • the wood-based panel contains hollow glass spheres.
  • the hollow glass balls reduce the weight of the wood-based panel. They reduce swelling and improve fire behavior.
  • a cover layer contains hollow glass spheres.
  • both outer cover layers contain hollow glass spheres. The more hollow glass spheres the wood-based panel contains, the more pronounced is the improved swelling behavior with reduced shape change under the influence of moisture and the lower the weight of the panel.
  • the hollow glass spheres used in the wood-based panel have a weight of 100 kg / m 3 to 600 kg / m 3 .
  • Glass hollow spheres with a weight of 100 kg / m 3 to 450 kg / m 3 are advantageously used, particularly advantageously with a weight of 100 kg / m 3 to 350 kg / m 3 . So that the glass spheres are lighter than the chips or fibers used, which have a humidity of z. B. 12% have a weight of 600 kg / m 3 to 1000 kg / m 3 .
  • Hollow glass spheres can e.g. B. from 3M, which offer such hollow glass spheres as the K Series, S Series and iM Series.
  • the wood-based panel according to the invention advantageously has a weight of 400 kg / m 3 to 500 kg / m 3 .
  • the hollow glass spheres have a diameter of 0.5 ⁇ m to 10 ⁇ m, preferably 1 ⁇ m to 5 ⁇ m. According to an advantageous embodiment, glass spheres of 1 to 3 ⁇ m are used in the cover layer and glass spheres of 5 ⁇ m to 10 ⁇ m in the middle layer.
  • the hollow glass spheres are made of glass or ceramic, preferably borosilicate glass.
  • the surface of the hollow glass spheres is silanized, which improves the binding capacity.
  • the hollow glass spheres are coated with a film made of melamine resin or polyvinyl acetate (PVAc).
  • the hollow glass spheres are preferably mixed with a powdered or dusty melamine resin or PVAc.
  • the desired film or coating is then formed when heated. While silanizing usually occurs before When used in the wood-based panel, the formation of a film or coating with a synthetic resin can take place during the manufacture of the panel.
  • the chips can be mineralized on at least one surface layer.
  • Mineralization is e.g. B. in the DE 10 2010 051 059 A1 described, it describes the sheathing of chips with inorganic or mineral binder.
  • the invention further comprises a method for producing a wood-based panel according to claim 1.
  • the mixture or the top layer mixture is produced by mixing the respective components, chips or fibers or a mixture of chips and fibers, binders and hollow glass spheres.
  • the binder can be added in solid or liquid form or as a foam.
  • the hollow glass spheres spread out as they are far are smaller than the chips and the fibers on the surface of the chips or fibers. The distribution takes place evenly, especially when mixing actively, e.g. B. by circulating or swirling the components.
  • the binder also lies evenly around chips, fibers and hollow glass spheres.
  • the pressing can take place on any press, both on a short-cycle press and on a continuous press, a continuous press being preferred for economic reasons.
  • the pressing conditions can be chosen in a wide range. Typical pressing conditions are e.g. B. print 10 to 50 bar Press factor 1 s / mm to 10 s / mm temperature 120 ° C to 280 ° C
  • the press factor shows how long the pressing time is to be measured per mm plate thickness.
  • a 19 mm chipboard with a 4 s press factor requires a press time of 76 s. It is advantageous to store the wood-based panels according to the invention for some time before use, e.g. B. a few hours or a few days so that the strength of the plates is optimally developed.
  • a first mixture of chips and / or fibers with the powdery binder and a second mixture of hollow glass spheres and binder are produced when using powdered binder.
  • the first and the second mixture are then combined to form a cover layer mixture.
  • Further processing takes place as described above.
  • This procedure ensures that the glass hollow spheres are pressed during the pressing by melting the binder and flowing into a film by a film made of synthetic resin, in particular melamine or PVAc, which binds the glass hollow spheres particularly firmly into the wood-based panel.
  • hollow glass spheres with a silanized surface can be used, the silanization likewise having the effect that the hollow glass spheres are firmer in the Matrix of the wood-based panel to be integrated.
  • the second cover layer from the cover layer mixture ie. i.e., made with hollow glass spheres.
  • the wood-based panel according to the invention can be used for planking wall constructions.
  • the wood-based panel can be plastered immediately or provided with wall insulation.
  • Panel joints can be blunt, i.e. H. can be glued using PU adhesive without processing straight edges. The transition is not visible in the area.
  • Fig. 1 shows a wood-based panel, here a particle board 1 with two outer cover layers 2, which together have a share in the total thickness of 36% (18% per cover layer), and an inner middle layer 3, which has a share of 54% in the total thickness of the Takes chipboard 1.
  • the cover layer 2 is composed of chips 4 made of wood and hollow glass balls 6 and the binder, not shown here. Hollow glass balls from 3M with a density of 350 kg / m 3 were used . The diameter of 50% of the hollow glass spheres was a maximum of 4 ⁇ m, the maximum size was 8 ⁇ m.
  • the middle layer 3 is composed of chips 5 (89% by weight) and the binder (11% by weight), also not shown.
  • the proportion of hollow glass spheres 6 is 15% by weight based on the total weight of the top layer 2.
  • the proportion of the binder is 28% by weight and the proportion of the chips 4 is 57% by weight based on the total weight of the top layer 2.
  • the chips 4 of the cover layer 2 have dimensions of an average of 10 mm to 20 mm in length, 1 mm to 2 mm in thickness and 3 mm to 8 mm in width.
  • the chips 5 of the middle layer 3 have a length of 25 mm to 35 mm, a width of 5 to 10 mm and a thickness of 1.5 mm to 3 mm.
  • the smaller chips 4 of the cover layer are packed more densely, so that the cover layer has a greater density than the middle layer.
  • the introduction of the hollow glass spheres 6 into the cover layer 2 thus deliberately reduces the area of greatest density of the chipboard according to the invention. At the same time, the fact that the hollow glass spheres 6 occupy the surface of the chips 4 significantly reduces the change in shape due to the influence of moisture.
  • the chipboard 1 with a thickness of 19 mm was produced in a continuous press by first a first mixture of chips 3 for the cover layer 2 and powdered binder, here z. B. melamine dust, and a second mixture of hollow glass balls and powdered binder, for example melamine dust, was produced. The first and second mixtures were mixed to form a top layer mixture.
  • a first outer cover layer was first scattered, then the inner middle layer and then a second outer cover layer, each in the layer thickness specified above.
  • the press cake thus produced was transferred to the continuous press and pressed into a chipboard under the pressing conditions specified above.
  • the inventive one Chipboard has a significantly reduced weight of 500 kg / m 3 .
  • the weight of the particle board according to the invention can be from 450 kg / m 3 to 550 kg / m 3 .
  • a conventional chipboard that is, an identical chipboard without hollow glass spheres, has a weight of 645 kg / m 3 to 660 kg / m 3 .
  • a further weight saving can be achieved if more hollow glass spheres are used.
  • the chipboard according to the invention has an edge swelling that is 5% less than that of conventional chipboard (measured according to EN 13329).
  • the mechanical properties of the chipboard 1 according to the invention correspond to type P5 according to EN 312.
  • the thermal conductivity of the chipboard according to the invention is 0.10 W / mK or less.
  • the chipboard 1 according to the invention can be used for planking wall structures.
  • the chipboard can be plastered immediately or provided with wall insulation.
  • Fig. 2 shows a single chip 4 on which numerous hollow glass spheres 5 adhere after mixing. If the chips are previously mixed separately with a powdered binder in a first mixture and the hollow glass spheres are mixed separately with a powdered binder in a second mixture, a comparable picture is obtained after mixing the first and the second mixture to form a cover layer mixture. The particles of the binder and the hollow glass spheres, which are also surrounded by the binder, are deposited on the surface of the chip.
  • mineralized chips ie chips encased in an inorganic binder
  • the mineralization can take place as e.g. B. in the DE 10 2010 051059 A1 indicated, the content of which is made the subject of this application.
  • Fig. 3 shows a wood-based panel, here a fiberboard 10, which is made of wood fibers 11, binders and hollow glass balls 12.
  • This fiberboard 10 is produced by mixing the fibers with binder and hollow glass spheres, using silanized hollow glass spheres, that is to say hollow glass spheres, the surface of which is provided with a coating of silanes.
  • the proportion of hollow glass spheres is 50% by weight
  • the plate has a density of 450 kg / m 3 .
  • Table 1 shows the production of 19 mm thick, three-layer chipboard with two outer cover layers and one inner middle layer. Wood chips are used for the top layer (DS), which are provided with urea-formaldehyde binder (UF) and which are mixed with hollow glass spheres and with another binder. K15 glass balls from 3M are used as hollow glass balls. Wacker uses 5010 N as a binder.
  • DS top layer
  • UF urea-formaldehyde binder
  • K15 glass balls from 3M are used as hollow glass balls.
  • Wacker uses 5010 N as a binder.
  • the proportion of wood chips is reduced from 76.6% by weight in test 2 to 55.6% by weight in tests 2 and 7 to 47.1% by weight in tests 5 and 9. This reduces the weight of the chipboard from 1.828 kg to 1.800 kg to 1.700 kg for the respective test board.
  • the thermal conductivity is 0.11 W / mK compared to an average thermal conductivity for plasterboard from 0.23 W / mK to 0.28 W / mK and an average thermal conductivity of 0.19 W / mK for a comparable three-layer chipboard without hollow glass spheres.
  • the edge swelling drops from approx. 10% in test 2 to approx.
  • hollow glass spheres results in a significant reduction in the weight of the wood-based panel and a significant reduction in thermal conductivity and edge swelling.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Claims (13)

  1. Plaque de matière dérivée du bois constituée de copeaux (4) ou de fibres lignocellulosiques, de sphères creuses en verre (6) et d'un liant, la plaque de matière dérivée du bois présentant au moins une couche intermédiaire (3) située à l'intérieur et deux couches de revêtement (2) situées à l'extérieur, caractérisée en ce que des sphères creuses en verre (6) sont contenues uniquement dans une couche de revêtement (2) ou uniquement dans les deux couches de revêtement situées à l'extérieur de la plaque de matière dérivée du bois (1).
  2. Plaque de matière dérivée du bois selon la revendication 1, caractérisée en ce que les sphères creuses en verre (6) présentent un diamètre de 0,5 µm à 10 µm, en particulier de 1 µm à 5 µm.
  3. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 ou 2, caractérisée en ce que le pourcentage des sphères creuses en verre (6) par rapport au poids total de la plaque de matière dérivée du bois (1) est comprise entre 5% en poids et 70% en poids.
  4. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 à 3, caractérisée en ce que le pourcentage des sphères creuses en verre (6) par rapport au poids total d'au moins une couche de revêtement (2) est comprise entre 5% en poids et 70% en poids.
  5. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 à 4, caractérisée en ce que les sphères creuses en verre (6) sont fabriquées en verre de borosilicate.
  6. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 à 5, caractérisée en ce que les sphères creuses en verre (6) présentent une surface supérieure silanisée ou une surface supérieure au moins partiellement pourvue d'un film de résine mélamine ou d'acétate de polyvinyle.
  7. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 à 6, caractérisée en ce que des résines synthétiques aminoplastes ou thermoplastique ou un mélange de ces résines synthétiques est/sont utilisée(s) comme liant.
  8. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 à 7, caractérisée en ce qu'au moins une quantité partielle du liant est utilisée sous forme de poudre ou de poussière.
  9. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 à 8, caractérisée en ce que les copeaux (4) ou fibres sont au moins partiellement minéralisés.
  10. Plaque de matière dérivée du bois selon l'une au moins des revendications 1 à 9, caractérisée en ce que le poids de la plaque de matière dérivée du bois (1) est compris entre 400 kg/m3 et 500 kg/m3.
  11. Procédé de fabrication d'une plaque de matière dérivée du bois constituée de copeaux (4) ou de fibres lignocellulosiques, de sphères creuses en verre (6) et d'un liant, avec les étapes suivantes
    - fabrication d'un mélange de couche de revêtement présentant des copeaux de couche de revêtement (4) ou des fibres avec du liant et des sphères creuses en verre (6),
    - fabrication d'un gâteau de fibres par dépôt d'une couche de revêtement (2), d'une couche intermédiaire (3), présentant des copeaux ou des fibres pour la couche intermédiaire et du liant, la couche intermédiaire ne présentant pas de sphères creuses en verre, et d'une deuxième couche de revêtement (2), dans lequel le mélange de couche de revêtement est utilisé pour la fabrication d'une couche de revêtement (2) ou pour la fabrication des deux couches de revêtement (2), et
    - pressage du gâteau de fibres.
  12. Procédé selon la revendication 11, caractérisé en ce qu'un premier mélange de copeaux (4) ou de fibres et de liant sous forme de poussière est préparé, en ce qu'un deuxième mélange de sphères creuses en verre (6) et de liant sous forme de poussière est préparé, et en ce que le premier mélange et le deuxième mélange sont mélangés pour former un mélange.
  13. Procédé selon l'une au moins des revendications 11 ou 12, caractérisé en ce que les sphères creuses en verre (6) sont silanisées avant le mélange avec le liant sous forme de poussière, ou en ce que la surface supérieure des sphères creuses en verre (6) est pourvue au moins partiellement d'un film de résine de mélamine ou d'acétate de polyvinyle.
EP17179148.6A 2017-06-30 2017-06-30 Plaque de matière dérivée du bois avec des sphères creuses Active EP3421200B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL17179148T PL3421200T3 (pl) 2017-06-30 2017-06-30 Płyta drewnopochodna z pustymi kulkami
EP17179148.6A EP3421200B1 (fr) 2017-06-30 2017-06-30 Plaque de matière dérivée du bois avec des sphères creuses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP17179148.6A EP3421200B1 (fr) 2017-06-30 2017-06-30 Plaque de matière dérivée du bois avec des sphères creuses

Publications (2)

Publication Number Publication Date
EP3421200A1 EP3421200A1 (fr) 2019-01-02
EP3421200B1 true EP3421200B1 (fr) 2020-06-03

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EP17179148.6A Active EP3421200B1 (fr) 2017-06-30 2017-06-30 Plaque de matière dérivée du bois avec des sphères creuses

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PL (1) PL3421200T3 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3736095A3 (fr) * 2019-04-18 2021-01-27 Swiss Krono TEC AG Matière sous forme de plaque et son procédé de fabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2762328A1 (fr) * 2013-01-30 2014-08-06 Flooring Technologies Ltd. Procédé de fabrication d'un panneau en bois décoré revêtu de chaque côté
EP2942207A1 (fr) * 2014-05-09 2015-11-11 Flooring Technologies Ltd. Procédé de fabrication de plaques en bois décorées et panneau de sol fabriqué à partir de celles-ci

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1276314B (de) 1963-03-11 1968-08-29 United States Gypsum Co Rechteckige Gipskartonplatte
US7217458B2 (en) * 2003-07-16 2007-05-15 Huber Engineered Woods Llc Strength-enhanced, lightweight lignocellulosic composite board materials and methods of their manufacture
CA2727231A1 (fr) * 2008-06-08 2010-01-21 Robert N. Clausi Processus de production d'un hdf, d'un mdf et d'un panneau de particules de bois elastiques
DE102010051059B4 (de) 2010-11-11 2014-07-17 Robert Kuhnhenn Zuschlagstoff aus Holzspänen, Verwendung dieses Zuschlagstoffes und Verfahren zu seiner Herstellung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2762328A1 (fr) * 2013-01-30 2014-08-06 Flooring Technologies Ltd. Procédé de fabrication d'un panneau en bois décoré revêtu de chaque côté
EP2942207A1 (fr) * 2014-05-09 2015-11-11 Flooring Technologies Ltd. Procédé de fabrication de plaques en bois décorées et panneau de sol fabriqué à partir de celles-ci

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PL3421200T3 (pl) 2020-09-21
EP3421200A1 (fr) 2019-01-02

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