EP3412121A4 - Method for the manufacture of an extremely thin flexible multilayer printed circuit board and a flexible multilayer printed circuit board - Google Patents
Method for the manufacture of an extremely thin flexible multilayer printed circuit board and a flexible multilayer printed circuit board Download PDFInfo
- Publication number
- EP3412121A4 EP3412121A4 EP16889178.6A EP16889178A EP3412121A4 EP 3412121 A4 EP3412121 A4 EP 3412121A4 EP 16889178 A EP16889178 A EP 16889178A EP 3412121 A4 EP3412121 A4 EP 3412121A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- printed circuit
- multilayer printed
- flexible multilayer
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/FI2016/050062 WO2017134331A1 (en) | 2016-02-01 | 2016-02-01 | Method for the manufacture of an extremely thin flexible multilayer printed circuit board and a flexible multilayer printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3412121A1 EP3412121A1 (en) | 2018-12-12 |
EP3412121A4 true EP3412121A4 (en) | 2020-01-22 |
Family
ID=59500606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16889178.6A Pending EP3412121A4 (en) | 2016-02-01 | 2016-02-01 | Method for the manufacture of an extremely thin flexible multilayer printed circuit board and a flexible multilayer printed circuit board |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP3412121A4 (en) |
WO (1) | WO2017134331A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020056192A1 (en) * | 2000-09-27 | 2002-05-16 | Tokihito Suwa | Method of producing multilayer printed wiring board and multilayer printed wiring board |
US20080250637A1 (en) * | 2007-04-13 | 2008-10-16 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for manufacturing multilayer flexible printed circuit board |
US20140054079A1 (en) * | 2012-08-22 | 2014-02-27 | Zhen Ding Technology Co., Ltd. | Multilayer flexible printed circuit board and method for manufacturing same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6858253B2 (en) | 2001-05-31 | 2005-02-22 | 3M Innovative Properties Company | Method of making dimensionally stable composite article |
US7827682B2 (en) | 2005-04-21 | 2010-11-09 | Endicott Interconnect Technologies, Inc. | Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner |
US7834274B2 (en) * | 2005-12-30 | 2010-11-16 | Industrial Technology Research Institute | Multi-layer printed circuit board and method for fabricating the same |
KR101489206B1 (en) * | 2013-03-27 | 2015-02-04 | 하이쎌(주) | Double side flexible printed circuit board having plating layer and method for manufacturing the same |
-
2016
- 2016-02-01 EP EP16889178.6A patent/EP3412121A4/en active Pending
- 2016-02-01 WO PCT/FI2016/050062 patent/WO2017134331A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020056192A1 (en) * | 2000-09-27 | 2002-05-16 | Tokihito Suwa | Method of producing multilayer printed wiring board and multilayer printed wiring board |
US20080250637A1 (en) * | 2007-04-13 | 2008-10-16 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for manufacturing multilayer flexible printed circuit board |
US20140054079A1 (en) * | 2012-08-22 | 2014-02-27 | Zhen Ding Technology Co., Ltd. | Multilayer flexible printed circuit board and method for manufacturing same |
Non-Patent Citations (1)
Title |
---|
See also references of WO2017134331A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2017134331A1 (en) | 2017-08-10 |
EP3412121A1 (en) | 2018-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20180831 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20191220 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 1/11 20060101AFI20191216BHEP Ipc: H05K 3/42 20060101ALI20191216BHEP Ipc: H05K 3/46 20060101ALI20191216BHEP Ipc: B82Y 30/00 20110101ALI20191216BHEP |