EP3412121A4 - Procédé de fabrication d'une carte de circuit imprimé multicouche souple extrêmement mince, et carte de circuit imprimé multicouche souple - Google Patents

Procédé de fabrication d'une carte de circuit imprimé multicouche souple extrêmement mince, et carte de circuit imprimé multicouche souple Download PDF

Info

Publication number
EP3412121A4
EP3412121A4 EP16889178.6A EP16889178A EP3412121A4 EP 3412121 A4 EP3412121 A4 EP 3412121A4 EP 16889178 A EP16889178 A EP 16889178A EP 3412121 A4 EP3412121 A4 EP 3412121A4
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
multilayer printed
flexible multilayer
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16889178.6A
Other languages
German (de)
English (en)
Other versions
EP3412121A1 (fr
Inventor
Timo Tarvainen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elcoflex Oy
Original Assignee
Elcoflex Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elcoflex Oy filed Critical Elcoflex Oy
Publication of EP3412121A1 publication Critical patent/EP3412121A1/fr
Publication of EP3412121A4 publication Critical patent/EP3412121A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
EP16889178.6A 2016-02-01 2016-02-01 Procédé de fabrication d'une carte de circuit imprimé multicouche souple extrêmement mince, et carte de circuit imprimé multicouche souple Pending EP3412121A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FI2016/050062 WO2017134331A1 (fr) 2016-02-01 2016-02-01 Procédé de fabrication d'une carte de circuit imprimé multicouche souple extrêmement mince, et carte de circuit imprimé multicouche souple

Publications (2)

Publication Number Publication Date
EP3412121A1 EP3412121A1 (fr) 2018-12-12
EP3412121A4 true EP3412121A4 (fr) 2020-01-22

Family

ID=59500606

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16889178.6A Pending EP3412121A4 (fr) 2016-02-01 2016-02-01 Procédé de fabrication d'une carte de circuit imprimé multicouche souple extrêmement mince, et carte de circuit imprimé multicouche souple

Country Status (2)

Country Link
EP (1) EP3412121A4 (fr)
WO (1) WO2017134331A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020056192A1 (en) * 2000-09-27 2002-05-16 Tokihito Suwa Method of producing multilayer printed wiring board and multilayer printed wiring board
US20080250637A1 (en) * 2007-04-13 2008-10-16 Fukui Precision Component (Shenzhen) Co., Ltd. Method for manufacturing multilayer flexible printed circuit board
US20140054079A1 (en) * 2012-08-22 2014-02-27 Zhen Ding Technology Co., Ltd. Multilayer flexible printed circuit board and method for manufacturing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858253B2 (en) 2001-05-31 2005-02-22 3M Innovative Properties Company Method of making dimensionally stable composite article
US7827682B2 (en) 2005-04-21 2010-11-09 Endicott Interconnect Technologies, Inc. Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
US7834274B2 (en) * 2005-12-30 2010-11-16 Industrial Technology Research Institute Multi-layer printed circuit board and method for fabricating the same
KR101489206B1 (ko) * 2013-03-27 2015-02-04 하이쎌(주) 도금층을 포함하는 양면 연성 인쇄회로기판 및 이의 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020056192A1 (en) * 2000-09-27 2002-05-16 Tokihito Suwa Method of producing multilayer printed wiring board and multilayer printed wiring board
US20080250637A1 (en) * 2007-04-13 2008-10-16 Fukui Precision Component (Shenzhen) Co., Ltd. Method for manufacturing multilayer flexible printed circuit board
US20140054079A1 (en) * 2012-08-22 2014-02-27 Zhen Ding Technology Co., Ltd. Multilayer flexible printed circuit board and method for manufacturing same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017134331A1 *

Also Published As

Publication number Publication date
WO2017134331A1 (fr) 2017-08-10
EP3412121A1 (fr) 2018-12-12

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RIC1 Information provided on ipc code assigned before grant

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