EP3398906A4 - Carbon nanotube joining sheet and method for producing carbon nanotube joining sheet - Google Patents
Carbon nanotube joining sheet and method for producing carbon nanotube joining sheet Download PDFInfo
- Publication number
- EP3398906A4 EP3398906A4 EP16881805.2A EP16881805A EP3398906A4 EP 3398906 A4 EP3398906 A4 EP 3398906A4 EP 16881805 A EP16881805 A EP 16881805A EP 3398906 A4 EP3398906 A4 EP 3398906A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- carbon nanotube
- joining sheet
- producing
- producing carbon
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/24—Apparatus or processes for treating or working the shaped or preshaped articles for curing, setting or hardening
- B28B11/243—Setting, e.g. drying, dehydrating or firing ceramic articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/168—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/80—Sintered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/20—Nanotubes characterized by their properties
- C01B2202/24—Thermal properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/27003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the layer preform
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/275—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
- H01L2224/27505—Sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/29166—Titanium [Ti] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29193—Material with a principal constituent of the material being a solid not provided for in groups H01L2224/291 - H01L2224/29191, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Combustion & Propulsion (AREA)
- Inorganic Chemistry (AREA)
- Composite Materials (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Structural Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015256721 | 2015-12-28 | ||
PCT/JP2016/089030 WO2017115831A1 (en) | 2015-12-28 | 2016-12-28 | Carbon nanotube joining sheet and method for producing carbon nanotube joining sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3398906A1 EP3398906A1 (en) | 2018-11-07 |
EP3398906A4 true EP3398906A4 (en) | 2019-10-23 |
Family
ID=59224784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16881805.2A Withdrawn EP3398906A4 (en) | 2015-12-28 | 2016-12-28 | Carbon nanotube joining sheet and method for producing carbon nanotube joining sheet |
Country Status (7)
Country | Link |
---|---|
US (1) | US20190010376A1 (en) |
EP (1) | EP3398906A4 (en) |
JP (1) | JP6714616B2 (en) |
KR (1) | KR20180098560A (en) |
CN (1) | CN108430919B (en) |
TW (1) | TWI725099B (en) |
WO (1) | WO2017115831A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7238586B2 (en) | 2019-05-08 | 2023-03-14 | 富士通株式会社 | Conductive heat-dissipating film, method for manufacturing conductive heat-dissipating film, and method for manufacturing electronic device |
CN110306167B (en) * | 2019-06-06 | 2021-06-04 | 沈阳航空航天大学 | Method for enhancing light alloy adhesive joint interface strength by growing CNT layer in situ |
JP7372092B2 (en) * | 2019-09-18 | 2023-10-31 | 日立造船株式会社 | Manufacturing method of carbon nanotube twisted yarn |
US11581236B2 (en) * | 2020-02-14 | 2023-02-14 | Micron Technology, Inc. | Self-cleaning heatsink for electronic components |
CN214176013U (en) | 2020-12-23 | 2021-09-10 | 迪科特测试科技(苏州)有限公司 | Semiconductor structure |
KR102283073B1 (en) * | 2021-01-08 | 2021-07-28 | 새빛이앤엘 (주) | Hybrid Heat Dissipation Assembly using Elastic Interlayer with CNT Layer and Fabrication Method Thereof |
US11653475B2 (en) * | 2021-02-01 | 2023-05-16 | Microsoft Technology Licensing, Llc | Thermally conductive microtubes for evenly distributing heat flux on a cooling system |
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EP2546871A1 (en) * | 2010-03-12 | 2013-01-16 | Fujitsu Limited | Heat dissipating structure and production method therefor |
US20140015158A1 (en) * | 2012-07-11 | 2014-01-16 | Carbice Nanotechnologies, Inc. | Vertically aligned arrays of carbon nanotubes formed on multilayer substrates |
WO2014203547A1 (en) * | 2013-06-21 | 2014-12-24 | 独立行政法人産業技術総合研究所 | Bonding sheet and process for manufacturing same, and heat dissipating system and production process therefor |
EP2863426A1 (en) * | 2013-07-10 | 2015-04-22 | Huawei Technologies Co., Ltd. | Thermal interface sheet, preparation method therefor and cooling system therefor |
JP2015098418A (en) * | 2013-11-20 | 2015-05-28 | 日立造船株式会社 | Production method of carbon nanotube sheet |
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FR2856939B1 (en) * | 2003-07-03 | 2005-09-30 | Jobin Yvon Sas | GAS HUMIDIFIER |
US20050116336A1 (en) * | 2003-09-16 | 2005-06-02 | Koila, Inc. | Nano-composite materials for thermal management applications |
CN100454526C (en) * | 2005-06-30 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | Thermo-interface material producing method |
JP5364978B2 (en) * | 2007-03-28 | 2013-12-11 | 富士通セミコンダクター株式会社 | Surface-modified carbon nanotube-based material, manufacturing method thereof, electronic member, and electronic device |
CN100569509C (en) * | 2007-06-15 | 2009-12-16 | 清华大学 | A kind of carbon nano pipe array/laminated composite and preparation method thereof |
JP5146371B2 (en) * | 2008-07-11 | 2013-02-20 | 株式会社豊田中央研究所 | Carbon nanocomposite, dispersion and resin composition containing the same, and method for producing carbon nanocomposite |
JP5463674B2 (en) * | 2009-01-28 | 2014-04-09 | 株式会社豊田中央研究所 | Carbon nanocomposite, dispersion and resin composition containing the same, and method for producing carbon nanocomposite |
GB0914816D0 (en) * | 2009-08-25 | 2009-09-30 | Isis Innovation | Method of fabrication of aligned nanotube-containing composites |
JP5293561B2 (en) * | 2009-10-29 | 2013-09-18 | 富士通株式会社 | Thermally conductive sheet and electronic device |
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JP2014094856A (en) * | 2012-11-09 | 2014-05-22 | Hitachi Zosen Corp | Manufacturing method and continuous manufacturing apparatus of a substrate for generating carbon nanotubes |
JP2014227331A (en) * | 2013-05-27 | 2014-12-08 | 日立造船株式会社 | Carbon nanotube sheet and production method for carbon nanotube sheet |
JP2014234339A (en) * | 2013-06-05 | 2014-12-15 | 日立造船株式会社 | Carbon nanotube sheet and method for producing carbon nanotube sheet |
JP2015001180A (en) * | 2013-06-14 | 2015-01-05 | 株式会社東芝 | Axis flow turbine |
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-
2016
- 2016-12-28 US US16/066,519 patent/US20190010376A1/en not_active Abandoned
- 2016-12-28 KR KR1020187018111A patent/KR20180098560A/en active IP Right Grant
- 2016-12-28 CN CN201680074758.7A patent/CN108430919B/en active Active
- 2016-12-28 JP JP2017559229A patent/JP6714616B2/en active Active
- 2016-12-28 EP EP16881805.2A patent/EP3398906A4/en not_active Withdrawn
- 2016-12-28 WO PCT/JP2016/089030 patent/WO2017115831A1/en active Application Filing
- 2016-12-28 TW TW105143733A patent/TWI725099B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2546871A1 (en) * | 2010-03-12 | 2013-01-16 | Fujitsu Limited | Heat dissipating structure and production method therefor |
US20140015158A1 (en) * | 2012-07-11 | 2014-01-16 | Carbice Nanotechnologies, Inc. | Vertically aligned arrays of carbon nanotubes formed on multilayer substrates |
WO2014203547A1 (en) * | 2013-06-21 | 2014-12-24 | 独立行政法人産業技術総合研究所 | Bonding sheet and process for manufacturing same, and heat dissipating system and production process therefor |
US20160104655A1 (en) * | 2013-06-21 | 2016-04-14 | Fujitsu Limited | Bonding sheet and manufacturing method thereof, and heat dissipation mechanism and manufacturing method thereof |
EP2863426A1 (en) * | 2013-07-10 | 2015-04-22 | Huawei Technologies Co., Ltd. | Thermal interface sheet, preparation method therefor and cooling system therefor |
JP2015098418A (en) * | 2013-11-20 | 2015-05-28 | 日立造船株式会社 | Production method of carbon nanotube sheet |
Non-Patent Citations (1)
Title |
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See also references of WO2017115831A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2017115831A1 (en) | 2017-07-06 |
TWI725099B (en) | 2021-04-21 |
KR20180098560A (en) | 2018-09-04 |
CN108430919B (en) | 2022-01-28 |
US20190010376A1 (en) | 2019-01-10 |
CN108430919A (en) | 2018-08-21 |
EP3398906A1 (en) | 2018-11-07 |
JP6714616B2 (en) | 2020-06-24 |
TW201722845A (en) | 2017-07-01 |
JPWO2017115831A1 (en) | 2018-11-29 |
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